Immersion cooling system

Abstract

The present disclosure provides an immersion cooling system. The structure includes a case, a port, a first dielectric liquid, a workpiece, and a condensing unit. The case has a space and a cover, wherein the cover is detachably arranged on the case to selectively close or open the space. The port is connected to the space of the case. The first dielectric liquid is contained in the space and forms a liquid surface, wherein the liquid surface of the first dielectric liquid and the port are arranged adjacent to each other. The workpiece is immersed in the first dielectric liquid. The condensing unit is arranged in the space of the case and above the liquid surface of the first dielectric liquid. When the immersion cooling system performs a cooling operation, the port is closed, the first dielectric liquid is sealed in the space, and the heat generated by the workpiece is dissipated through the first dielectric liquid and the condensing unit.

Description

Technical Field

[0001] This disclosure relates to a cooling system, and more particularly to an immersion cooling system that prevents the loss of volatile dielectric liquids during system maintenance and ensures the stability of cooling performance. Background Technology

[0002] An immersion cooling system is a cooling system that achieves heat dissipation by immersing electronic devices in a thermally conductive dielectric liquid or refrigerant. The thermally conductive dielectric liquid is in direct contact with the heat-generating electronic components, and heat is then removed from the system through a heat exchanger. Therefore, the thermally conductive dielectric liquid suitable for immersion cooling systems must have excellent insulating properties to ensure safe contact between the liquid and the energized heat-generating electronic components.

[0003] On the other hand, the dielectric liquid used in immersion cooling systems involves phase changes and is highly volatile. Therefore, during maintenance procedures involving opening the lid of an immersion cooling system, the dielectric liquid in the open space will significantly leak out due to evaporation. Since immersion cooling systems use expensive dielectric liquids, significant leakage can affect the overall cooling performance of the system and further increase costs.

[0004] In view of this, it is necessary to provide an immersion cooling system to prevent the loss of volatile dielectric liquid during system maintenance and to ensure the stability of cooling performance, so as to solve the shortcomings of the existing technology. Summary of the Invention

[0005] The purpose of this disclosure is to provide an immersion cooling system to prevent the loss of dielectric liquid during system maintenance or loading / unloading of workpieces.

[0006] To achieve the aforementioned objectives, this disclosure provides an immersion cooling system, including a housing, a first dielectric liquid, and a port. The housing has a space. The first dielectric liquid is contained in the space and forms a liquid surface. The port communicates with the space above the liquid surface and is adjacent to the liquid surface. The port is closed during cooling operations of the immersion cooling system, sealing the first dielectric liquid within the space, and the port is connected to the liquid surface of the first dielectric liquid.

[0007] To achieve the aforementioned objectives, this disclosure further provides an immersion cooling system, including a housing, a first dielectric liquid, a second dielectric liquid, and a connecting element. The housing has a space. The first dielectric liquid is contained in the space. The second dielectric liquid covers the liquid surface of the first dielectric liquid. The connecting element is contained in the space. The connecting element is used to ensure that a portion of the liquid surface of the first dielectric liquid is either not covered by the second dielectric liquid or is covered by the second dielectric liquid.

[0008] To achieve the aforementioned objectives, this disclosure further provides an immersion cooling system, including a housing, a first dielectric liquid, a second dielectric liquid, and a connecting element. The housing has a space. The first dielectric liquid is contained in the space. The second dielectric liquid is located above and in contact with the first dielectric liquid. The connecting element is contained in the space. The connecting element is used to expose or not expose a portion of the first dielectric liquid to the space not filled by the first and second dielectric liquids. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of the structure of the immersion cooling system according to the first preferred embodiment of the present disclosure.

[0010] Figure 2 This is a schematic diagram of the immersion cooling system of the first preferred embodiment of the present disclosure introducing a second dielectric liquid into the chamber space.

[0011] Figure 3 This is a schematic diagram of an immersion cooling system according to a second preferred embodiment of the present disclosure, in which the first dielectric liquid is not exposed to the space not filled by the first dielectric liquid and the second dielectric liquid, and is covered by the second dielectric liquid.

[0012] Figure 4 This is a schematic diagram of an immersion cooling system according to a second preferred embodiment of the present disclosure, in which a portion of the first dielectric liquid is exposed in a space not filled by the first dielectric liquid and the second dielectric liquid, and is not covered by the second dielectric liquid.

[0013] Explanation of reference numerals in the attached figures:

[0014] 1.1a: Immersion Cooling System

[0015] 10: Box

[0016] 11: Space

[0017] 13: Condensation Unit

[0018] 14: Work Objects

[0019] 20: First dielectric liquid

[0020] 21: Liquid surface

[0021] 30: Opening

[0022] 40: Second dielectric liquid

[0023] 41: Liquid surface

[0024] 50: Liquid storage tank

[0025] 51: Control device

[0026] 52: Pump

[0027] 60: Connected objects

[0028] 61: Valve

[0029] 62: Connecting port Detailed Implementation

[0030] Some typical embodiments embodying the features and advantages of this disclosure will be described in detail in the following description. It should be understood that this disclosure can be varied in different implementations without departing from the scope of this disclosure, and the descriptions and drawings therein are for illustrative purposes only and not for limiting the scope of this disclosure.

[0031] Figure 1 This is a schematic diagram of the structure of the immersion cooling system according to the first preferred embodiment of the present disclosure. Figure 2This is a schematic diagram of an immersion cooling system according to a first preferred embodiment of the present disclosure, in which a second dielectric fluid is introduced into a tank space. In this embodiment, the immersion cooling system 1 is used, for example, for cooling a servo, but is not limited thereto. In this embodiment, the immersion cooling system 1 includes a tank 10, a first dielectric fluid 20, and a through opening 30. The tank 10 has a space 11. The first dielectric fluid 20 is contained in the space 11 and forms a liquid surface 21. The through opening 30 is spatially connected to the space 11 of the tank 10 above the liquid surface 21 of the first dielectric fluid 20 and is adjacent to the liquid surface 21. The through opening 30 is closed when the cooling system 1 is performing cooling operations, sealing the first dielectric fluid 20 within the space 11, and the through opening 30 is flush with the liquid surface 21 of the first dielectric fluid 20, for example. Therefore, the immersion cooling system 1 can effectively control the height of the liquid surface 21 of the first dielectric liquid 20, maintaining the stability of the overall cooling performance. In this embodiment, the housing 10 also includes a top cover 12, which is detachably mounted on the housing 10 to open the space 11 for maintenance or initial installation of the immersion cooling system 1. The port 30 adjacent to the liquid surface 21 preferably means that the bottom edge of the port 30 is slightly higher than, lower than, or flush with the liquid surface 21. When the port 30 is lower than the liquid surface 21, the second dielectric liquid can be introduced or exported using a partially closed / open or fully closed / open method. Furthermore, the port 30 can not only introduce or export the second dielectric liquid, but also the first dielectric liquid; that is, the port 30 can first export a portion of the first dielectric liquid out of the space 11, then export the second dielectric liquid out of the space 11, and finally guide the first dielectric liquid back into the space 11.

[0032] In this embodiment, the first dielectric liquid 20 is a thermally conductive dielectric liquid, such as 3M fluorinated electronic liquid (3MFluorinert Electronic Liquids), with a density ρ1 = 1.68 g / cm3 to 1.86 g / cm3, a vapor pressure P1 = 0.29 kPa to 35 kPa, is volatile, has a thermal conductivity of 0.057 W / mK to 0.066 W / mK, and a dielectric constant of 1.8 to 1.9 (@1 kHz). The immersion cooling system 1 also includes a condensation unit 13 and a working object 14. The working object 14 is, for example, a heat-generating electronic component in an electronic device, immersed in the first dielectric liquid 20. The working object 14 is in direct contact with the first dielectric liquid 20, and the heat generated by the working object 14 is dissipated through the first dielectric liquid 20. The first dielectric liquid 20 may evaporate and dissipate into the space 11 by absorbing the heat generated by the working object 14. In this embodiment, the condensation unit 13 is disposed within the space 11 of the housing 10 and is located above the liquid surface 21 of the first dielectric liquid 20. When the first dielectric liquid 20 evaporates and dissipates into the sealed space 11 due to absorbing the heat energy of the workpiece 14, the condensation unit 13 can condense the vaporized first dielectric liquid 20 and drip it onto the liquid surface 21 of the first dielectric liquid 20, maintaining the stability of the overall cooling performance.

[0033] In this embodiment, when the first dielectric liquid 20 is contained in the space 11, the space 11 of the housing 10 remains sealed to achieve the cooling operation. Additionally, the port 30 is also closed during the cooling operation of the immersion cooling system 1 to ensure the sealing of the space 11. After the first dielectric liquid 20 performs the cooling operation, its temperature rises and its volatility increases. Since the port 30 is connected to the liquid surface 21 of the first dielectric liquid 20, a second dielectric liquid 40 can be introduced into the space 11 of the housing 10 through the port 30. When the second dielectric liquid 40 enters the space 11, it covers the liquid surface 21 of the first dielectric liquid 20. The liquid surface 41 of the second dielectric liquid 40 is also connected to the port 30, for example. In this embodiment, the second dielectric liquid 40 is, for example, silicone oil with a density ρ2 = 0.93 g / cm3 and a vapor pressure P2 = 0.13 kPa. It should be noted that the first dielectric liquid 20 and the second dielectric liquid 40 are immiscible. Furthermore, the density ρ2 of the second dielectric liquid 40 is less than the density ρ1 of the first dielectric liquid 20, and the vapor pressure P2 of the second dielectric liquid 40 is less than the vapor pressure P1 of the first dielectric liquid 20. In this embodiment, the liquid surface 21 of the first dielectric liquid 20 and the liquid surface 41 of the second dielectric liquid 40 can, for example, be a low level height and a high level height controlled by the port 30, respectively. In one embodiment, the height difference between the liquid surface 21 of the first dielectric liquid 20 and the liquid surface 41 of the second dielectric liquid 40 can be controlled, for example, by the diameter of the port 30. Of course, this disclosure is not limited thereto. In this embodiment, the housing 10 of the immersion cooling system 1 also includes a top cover 12, detachably mounted on the housing 10, selectively closing or opening the space 11. If the immersion cooling system 1 is filled with a second dielectric liquid 40 to cover the first dielectric liquid 20 before the system is turned on, the evaporation and loss of the first dielectric liquid 20 can be effectively prevented, ensuring the stability of the overall cooling performance.

[0034] In this embodiment, taking advantage of the immiscibility of the first dielectric liquid 20 and the second dielectric liquid 40, the fact that the density ρ2 of the second dielectric liquid 40 is less than the density ρ1 of the first dielectric liquid 20, and the fact that the vapor pressure P2 of the second dielectric liquid 40 is less than the vapor pressure P1 of the first dielectric liquid 20, the evaporation and loss of the first dielectric liquid 20 can still be effectively prevented when the top cover 12 of the immersion cooling system 1 is opened and the second dielectric liquid 40 covers the first dielectric liquid 20.

[0035] On the other hand, the first dielectric liquid 20, serving as a heat dissipation medium for the workpiece 14, experiences a temperature increase as it absorbs heat generated by the workpiece 14. In this embodiment, by covering the liquid surface 21 of the first dielectric liquid 20 with the second dielectric liquid 40, even when the first dielectric liquid 20 is at a high temperature, it cannot evaporate or leak through the second dielectric liquid 40. Therefore, if the operator wishes to maintain or replace the workpiece 14 immersed in the first dielectric liquid 20, the operator can directly remove or place the workpiece 14 through the second dielectric liquid 40 without waiting for the first dielectric liquid 20 to cool down. This effectively reduces the operation time for repairing or replacing the workpiece 14, while ensuring that the first dielectric liquid 20 does not evaporate or leak during operation. After the maintenance or replacement work is completed, the top cover 12 is closed, sealing the space 11 of the housing 10. The second dielectric liquid 40 is then drawn off from the liquid surface 21 of the first dielectric liquid 20, so that the liquid surface 21 of the first dielectric liquid 20 is not covered in the sealed space 11 of the housing 10, thereby effectively dissipating the heat generated by the workpiece 14. Figure 1 As shown. In other words, by selectively covering the liquid surface 21 of the first dielectric liquid 20 with the second dielectric liquid 40, the maintenance or replacement of the workpiece 14 in the first dielectric liquid 20 can be simplified, the operation time shortened, and the operation efficiency improved. In other embodiments, the initial installation of the workpiece 14 can also be achieved by immersing it in the first dielectric liquid 20 with the second dielectric liquid 40, which will not be described in detail here.

[0036] In this embodiment, the immersion cooling system 1 further includes a storage tank 50, a control device 51, and a pump 52. The storage tank 50 is connected to the space 11 of the housing 10 through a port 30 and is used to store the second dielectric liquid 40. The control device 51 and the pump 52 are disposed between the port 30 and the storage tank 50. The control device 51 is used to connect or disconnect the storage tank 50 from the space. When the immersion cooling system 1 is performing cooling operations, the control device 51 closes the external connection of the port 30, keeping the space of the housing 10 closed. When the immersion cooling system 1 stops cooling operations and it is time to replace or repair the workpiece 14, the control device 51 opens the connection between the storage tank 50, the port 30, and the space 11 of the housing 10, and the pump 52 transfers the second dielectric liquid 40 stored in the storage tank 50 to the space 11 of the housing 10 through the port 30. Based on the characteristics that the first dielectric liquid 20 and the second dielectric liquid 40 are immiscible, the density ρ2 of the second dielectric liquid 40 is less than the density ρ1 of the first dielectric liquid 20, and the vapor pressure P2 of the second dielectric liquid 40 is less than the vapor pressure P1 of the first dielectric liquid 20, after the second dielectric liquid 40 is introduced into the space 11 of the housing 10, the second dielectric liquid 40 will cover the liquid surface 21 of the first dielectric liquid 20 to prevent the first dielectric liquid 20 from evaporating and leaking. Through the control of the control device 51 and the delivery of the pump 52, the height of the liquid surface 41 of the second dielectric liquid 40 can be adjusted according to actual application requirements, and this disclosure is not limited thereto. Furthermore, after the second dielectric liquid 40 covers the liquid surface 21 of the first dielectric liquid 20, the control device 51 can close the connection between the port 30 and the storage tank 50, and the pump 52 can stop operation. Of course, this disclosure is not limited thereto.

[0037] Furthermore, based on the aforementioned immersion cooling system 1, this disclosure also provides an operation method for an immersion cooling system. First, the operation method of this disclosure provides a housing 10 and an opening 30, connected to each other. In an embodiment, the housing 10 has a space 11 and a top cover 12, and the opening 30 communicates with the space 11 of the housing 10. The top cover 12 is detachably disposed on the top of the housing 10, thereby allowing the space 11 to be selectively closed or opened. Additionally, the space 11 of the housing 10 also includes a condensation unit 13, the horizontal height of which is greater than the horizontal height of the opening 30. Next, a first dielectric liquid 20 is placed into the space 11, for example, through the opening 30, forming a liquid surface 21, for example, flush with the horizontal height of the opening 30. In other words, in this embodiment, the opening 30 is spatially relative to the liquid surface 21 of the first dielectric liquid 20, and the liquid surface 21 of the first dielectric liquid 20 is adjacent to the opening 30. It should be noted that during the introduction of the first dielectric liquid 20, the first dielectric liquid 20 has not yet begun cooling operations, its initial temperature is low, and it is not easily evaporated. At this time, the top cover 12 of the housing 10 is opened, exposing the first dielectric liquid 20 in the space 11, allowing the operator to immerse the workpiece 14 in the first dielectric liquid 20. After the initial placement of the workpiece 14 is completed, the top cover 12 closes the space 11 of the housing 10, allowing the heat generated by the workpiece 14 to dissipate through the first dielectric liquid 20. Furthermore, the opening 30 is closed during the cooling operation of the immersion cooling system 1, sealing the first dielectric liquid 20 within the space 11.

[0038] Of course, to ensure that the first dielectric liquid 20 does not evaporate or leak during the initial placement of the workpiece 14, before the top cover 12 opens the space 11, the control device 51 can first open the connection of the port 30, and the pump 52 can introduce the second dielectric liquid 40 in the storage tank 50 into the space 11 of the housing 10 through the port 30 until the second dielectric liquid 40 covers the liquid surface 21 of the first dielectric liquid 20, then the control device 51 and the pump 52 are turned off. Afterwards, the top cover 12 opens the space 11 of the housing 10, exposing the liquid surface 41 of the second dielectric liquid 40 in the space 11. Since the second dielectric liquid 40 covers the first dielectric liquid 20, the evaporation and leakage of the first dielectric liquid 20 can be prevented. At this time, the initial placement of the workpiece 14 can be carried out. The operator can immerse the workpiece 14 in the first dielectric liquid 20. After the initial placement of the workpiece 14 is completed, the top cover 12 closes the space 11 of the housing 10. Subsequently, the control device 51 opens the connection of the port 30, and the pump 52 draws the second dielectric liquid 40 from the liquid surface 21 of the first dielectric liquid 20 through the port 30 and returns it to the storage tank 50. After the second dielectric liquid 40 is drawn off, the control device 51 can close the connection between the port 30 and the storage tank 50, and the pump 52 stops operating, so that the liquid surface 21 of the first dielectric liquid 20 is not covered in the sealed space 11 of the housing 10, so as to effectively dissipate the heat generated by the working object 14. In one embodiment, the control device 51 and the port 30 are detachably connected to each other. After the initial placement operation is completed, the control device 51 is detached from the port 30, and the port 30 closes the space 11 of the housing 10. This disclosure is not limited thereto.

[0039] It is worth noting that when the workpiece 14 is immersed in the first dielectric liquid 20, the first dielectric liquid 20 can serve as a heat dissipation medium for the workpiece 14, providing cooling for the immersed workpiece 14 in conjunction with the condensation unit 13 within the sealed space 11. During the cooling operation, the temperature of the first dielectric liquid 20, which is in direct contact with the workpiece 14, will gradually increase. If the sealed space 11 is opened at this time, a large amount of the first dielectric liquid 20 will be lost.

[0040] Therefore, when performing maintenance or replacement work on the workpiece 14 using the immersion cooling system 1 of this disclosure, the control device 51 can first open the connection of the port 30, and the pump 52 can then introduce the second dielectric liquid 40 from the storage tank 50 into the space 11 of the housing 10 through the port 30 until the second dielectric liquid 40 covers the liquid surface 21 of the first dielectric liquid 20. Afterwards, the control device 51 and the pump 52 are then turned off. Subsequently, the top cover 12 opens the space 11 of the housing 10, exposing the liquid surface 41 of the second dielectric liquid 40 within the space 11. Since the second dielectric liquid 40 covers the first dielectric liquid 20, the evaporation and loss of the first dielectric liquid 20 can be prevented. At this point, maintenance or replacement work on the workpiece 14 can be performed.

[0041] Furthermore, during repair or replacement work, the second dielectric liquid 40 covers the liquid surface 21 of the first dielectric liquid 20, preventing the first dielectric liquid 20 from evaporating and leaking even at high temperatures. The operator can directly remove the workpiece 14 immersed in the first dielectric liquid 20 through the second dielectric liquid 40 for repair or replacement, and after the repair or replacement is completed, immerse the workpiece 14 back into the first dielectric liquid 20 through the second dielectric liquid 40, allowing direct contact between the workpiece 14 and the first dielectric liquid 20. Based on the characteristics that the first dielectric liquid 20 and the second dielectric liquid 40 are immiscible, the density ρ2 of the second dielectric liquid 40 is less than the density ρ1 of the first dielectric liquid, and the vapor pressure P2 of the second dielectric liquid 40 is less than the vapor pressure P1 of the first dielectric liquid 20, when the working object 14 is immersed in the first dielectric liquid 20 through the second dielectric liquid 40, the second dielectric liquid 40 maintains coverage of the first dielectric liquid 20, ensuring that the first dielectric liquid 20 does not evaporate or leak.

[0042] In this embodiment, after the repair or replacement of the workpiece 14 is completed, the top cover 12 seals the space 11 of the housing 10. Then, the control device 51 opens the connection of the port 30, and the pump 52 draws the second dielectric liquid 40 from the liquid surface 21 of the first dielectric liquid 20 through the port 30 and stores it back into the storage tank 50. After the second dielectric liquid 40 is drawn off, the control device 51 closes the connection between the port 30 and the storage tank 50, the pump 52 stops operating, and the liquid surface 21 of the first dielectric liquid 20 is not covered in the sealed space 11 of the housing 10. The first dielectric liquid 20, in conjunction with the condensation unit 13, can effectively dissipate the heat generated by the workpiece 14 within the sealed space 11. In other words, the immersion cooling system 1 disclosed herein selectively covers the liquid surface 21 of the first dielectric liquid 20 with the second dielectric liquid 40, which can ensure that the first dielectric liquid 20 does not evaporate or leak during the initial placement of the workpiece 14, and can also simplify the maintenance or replacement of the workpiece 14 in the first dielectric liquid 20, shorten the operation time, and improve the operating efficiency.

[0043] Figure 3 This is a schematic diagram of an immersion cooling system according to a second preferred embodiment of the present disclosure, in which the first dielectric liquid is not exposed to the space not filled by the first dielectric liquid and the second dielectric liquid, and is covered by the second dielectric liquid. Figure 4 This is a schematic diagram of an immersion cooling system according to a second preferred embodiment of the present disclosure, in which a portion of the first dielectric liquid is exposed in a space not filled by the first and second dielectric liquids, and is not covered by the second dielectric liquid. In this embodiment, the immersion cooling system 1a and Figures 1 to 2 The immersion cooling system 1a shown is similar to the one described above, and the same component designations represent the same components, structures, and functions, which will not be described again here. In this embodiment, the immersion cooling system 1a includes a housing 10, a first dielectric liquid 20, a second dielectric liquid 40, and a connecting object 60. The housing 10 has a space 11. The first dielectric liquid 20 is contained in the space 11. The second dielectric liquid 40 covers the liquid surface 21 of the first dielectric liquid 20. The connecting object 60 is contained in the space 11. The connecting object 60 can be controlled, for example, by a control device (not shown), to move relative to the liquid surface 21 of the first dielectric liquid 20 and to open or close the communication function. In this embodiment, the connecting object 60 is immersed in the second dielectric liquid 20, such that the liquid surface 21 of the first dielectric liquid 20 is covered by the second dielectric liquid 40, that is, the connecting object 60 is like... Figure 3 As shown. In another embodiment, the connecting object 60 extends upward through the liquid surface 41 of the second dielectric liquid 40, so that a portion of the liquid surface 21 of the first dielectric liquid 20 is not covered by the second dielectric liquid 40, as shown. Figure 4 As shown.

[0044] In this embodiment, utilizing the characteristics that the first dielectric liquid 20 and the second dielectric liquid 40 are immiscible, the density ρ2 of the second dielectric liquid 40 is less than the density ρ1 of the first dielectric liquid 20, and the vapor pressure P2 of the second dielectric liquid 40 is less than the vapor pressure P1 of the first dielectric liquid 20, when the connecting object 60 of the immersion cooling system 1a is immersed in the first dielectric liquid 20, the first dielectric liquid 20 is not exposed to the space 11 not filled by the first dielectric liquid 20 and the second dielectric liquid 40. Thus, the second dielectric liquid 40 completely covers the liquid surface 21 of the first dielectric liquid 20, which can effectively prevent the first dielectric liquid 20 from evaporating and leaking. At this point, if the operator wishes to maintain or replace the workpiece 14 immersed in the first dielectric liquid 20, the operator can directly remove or place the workpiece 14 through the second dielectric liquid 40 without waiting for the first dielectric liquid 20 to cool down. This effectively reduces the operation time for repairing or replacing the workpiece 14, while ensuring that the first dielectric liquid 20 does not evaporate or leak during operation. In other embodiments, the initial installation of the workpiece 14 can also be achieved by immersing it in the first dielectric liquid 20 through the second dielectric liquid 40, which will not be described further here.

[0045] On the other hand, the first dielectric liquid 20, serving as a heat dissipation medium for the working object 14, will increase in temperature as it absorbs the heat generated by the working object 14. In this embodiment, the connecting object 60 includes, for example, a valve 61. By utilizing the portion of the connecting object 60 extending upward through the liquid surface 41 of the second dielectric liquid 40, the valve is exposed to the space 11 not filled by the first dielectric liquid 20 and the second dielectric liquid 40, such as... Figure 4As shown. When valve 61 opens the communication port 62, a portion of the first dielectric liquid 20 is exposed through the communication port 62 to the space 11 not filled by the first dielectric liquid 20 and the second dielectric liquid 40. Since the liquid surface 21 of the first dielectric liquid 20 is not covered by the second dielectric liquid 40, the first dielectric liquid 20 can effectively dissipate the heat generated by the working object 14. In other words, by selectively covering or not covering the liquid surface 21 of the first dielectric liquid 20 with the second dielectric liquid 40 through the communication port 60, the maintenance or replacement of the working object 14 in the first dielectric liquid 20 can be simplified, the operation time shortened, and the operating efficiency improved. When the immersion cooling system 1a of this disclosure is to be used for maintenance or replacement of the workpiece 14 again, the connecting object 60 can be immersed in the first dielectric liquid 20 again by closing the connection function of the connecting port 62 through the valve 61, or it can be immersed in the first dielectric liquid 20 and then the connection function of the connecting port 62 can be closed through the valve 61. In other embodiments, the manner and sequence of opening the connecting port 62 of the connecting object 60 can be adjusted according to the actual application requirements. Of course, the manner in which the connecting object 60 exposes or does not expose part of the first dielectric liquid 20 to the space 11 not filled by the first dielectric liquid 20 and the second dielectric liquid 40 can also be adjusted according to the actual application requirements. This disclosure is not limited thereto, and will not be elaborated here.

[0046] In summary, this disclosure provides an immersion cooling system to prevent the loss of dielectric liquid during system maintenance or loading / unloading of workpieces. By connecting the port to the surface of the first dielectric liquid, the immersion cooling system can further directly and quickly load a second dielectric liquid through the port, thereby improving the operational efficiency of the first dielectric liquid in the immersion cooling system. The first and second dielectric liquids are immiscible, the density of the second dielectric liquid is lower than that of the first dielectric liquid, and the vapor pressure of the second dielectric liquid is lower than that of the first dielectric liquid. Therefore, by loading the second dielectric liquid to cover the first dielectric liquid before the system is turned on, the evaporation and loss of the first dielectric liquid can be prevented, ensuring the stability of the overall cooling efficiency. When cooling is performed in the enclosed space of the system, the second dielectric liquid can be transferred from the surface of the first dielectric liquid to a storage tank for temporary storage, allowing the first dielectric liquid to effectively dissipate the heat generated by the workpiece immersed within it. Furthermore, taking advantage of the immiscibility of the first and second dielectric liquids, the lower density and vapor pressure of the second dielectric liquid compared to the first, the second dielectric liquid can selectively cover the surface of the first dielectric liquid via a port, or selectively expose a portion of the first dielectric liquid's surface to spaces not filled by either the first or second dielectric fluids via a connecting element. Therefore, when installing, repairing, or replacing parts in the open space of the cooling system, the second dielectric liquid, for example, can be introduced from a reservoir to cover the surface of the first dielectric liquid, preventing the first dielectric liquid from evaporating. When cooling is performed in a closed system space, at least a portion of the first dielectric liquid's surface is not covered by the second dielectric liquid, allowing the first dielectric liquid to effectively dissipate heat generated by the workpiece immersed within it. Furthermore, by using a port or connecting object, the surface of the first dielectric liquid can be selectively covered by the second dielectric liquid, ensuring that the heat generated by the workpiece immersed in the first dielectric liquid can be effectively dissipated when the first dielectric liquid is used for cooling in the closed space of the system. It also ensures that the first dielectric liquid does not evaporate or leak during the initial placement of the workpiece. It can also simplify the maintenance or replacement of the workpiece in the first dielectric liquid, shorten the operation time, and improve the operation efficiency.

[0047] This disclosure is open to various modifications by those skilled in the art, but all such modifications shall not depart from the protection sought by the appended claims.

Claims

1. An immersion cooling system, comprising: A box-shaped container with a space; A first dielectric liquid is contained in the space; A second dielectric liquid is located above and in contact with the first dielectric liquid; as well as A connecting object is disposed in the space, the connecting object being used to expose or not expose a portion of the first dielectric liquid to the space not filled by the first dielectric liquid and the second dielectric liquid, wherein the connecting object is immersable in the first dielectric liquid such that a portion of the liquid surface of the first dielectric liquid is covered by the second dielectric liquid, and is partially able to extend upward through a liquid surface of the second dielectric liquid such that a portion of the liquid surface of the first dielectric liquid is not covered by the second dielectric liquid.

2. The immersion cooling system of claim 1, wherein the first dielectric liquid and the second dielectric liquid are immiscible.

3. The immersion cooling system of claim 1, wherein the density of the second dielectric liquid is less than the density of the first dielectric liquid.

4. The immersion cooling system of claim 1, wherein the vapor pressure of the second dielectric liquid is less than the vapor pressure of the first dielectric liquid.

5. The immersion cooling system as claimed in claim 1 further includes a condensation unit disposed in the space above the liquid surface.

6. The immersion cooling system of claim 1 further includes a working object immersed in the first dielectric liquid.

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