An electrostatic atomization device

Abstract

The present invention proposes an electrostatic atomization device, which includes an emitting electrode, a semiconductor cooling plate and a relative electrode which are arranged close to each other in sequence; the cold end of the cooling plate in the semiconductor cooling plate contacts the emitting electrode, and the hot end of the cooling plate contacts the relative electrode; the characteristics are: the emitting electrode has an emitting electrode main part in contact with the cold end of the cooling plate, and an emitting electrode end extending to the outside of the semiconductor cooling plate, the relative electrode has a relative electrode main part in contact with the hot end of the cooling plate, and a relative electrode end extending to the outside of the semiconductor cooling plate, the relative electrode end is arranged opposite to the emitting electrode end, and a condensed water collecting part is arranged on the relative electrode end near the emitting electrode end. The present invention can generate charged water particles in the air, thereby achieving the technical purpose of generating an atomization effect in the air and carrying fine water in the air, and has the characteristics of compact and reasonable layout, stable and reliable operation effect and safe use.

Description

Technical Field

[0001] The present invention relates to an electrostatic atomization device, in particular to an electrostatic atomization device which generates charged water particles in the air to achieve the effect of atomizing and micronizing water. Background Art

[0002] At present, water ion air purification products on the market usually produce charged water particles by ionizing condensed water in the air. Charged water particles can also be called water ions, thereby achieving the effect of atomization and micronization of water. Due to the characteristics of small particle size and high activity, such charged water particles are gradually applied to air purifiers, hair dryers, air conditioners, beauty devices and other products. For example, the nano water ion air purification device disclosed in the Chinese patent application number 201620403170.9 purifies the outside air through the air purification device to obtain clean air. The clean air is then ejected from the air outlet with a large number of nano water ions containing reducing substances produced by the nano water ion generating device. While purifying the outside air, it also contains nano water ions containing reducing substances. The nano water ion generator in the device mainly includes an electrode, a water absorbing member, a cooler and a heat sink. The electrode is used for corona discharge, and the cooler is used to cool the electrode so that condensed water condenses on the electrode surface. The condensed water is then absorbed by the water absorbing member. After applying voltage to the electrode, the electrode excites a large number of negatively charged nano water ions. In addition, the reducing substances constituting the electrode are dissolved in or dispersed in the condensed water on the electrode surface in the form of tiny particles, thereby producing nano water ions containing reducing substances. The structure of the nano water ion generator is also disclosed in the Chinese patent with application number 201610524010.4. The nano water ion generator of this type of structure absorbs the excess water condensed on the electrode through the water absorbing member, but because the water absorbing member is arranged on the cold side of the cooler, after the water absorbing member is saturated with water, the temperature of the adsorbed condensed water is low and it is difficult to evaporate quickly. Once the device has been running for a long time or under climatic conditions with high air humidity, such as the return of south wind in the south, a lot of condensed water will condense on the electrodes, causing the water absorbent to be oversaturated. The condensed water that the water absorbent cannot absorb will overflow, which will seriously affect the long-term safe operation of other components in the device, and is not conducive to the safety of use and reliability of operation. Therefore, improvements are necessary. Summary of the invention

[0003] The purpose of the present invention is to propose an electrostatic atomization device, which can produce charged water particles in the air, thereby achieving the technical purpose of producing an atomization effect in the air and carrying micronized water in the air. It is very safe and reliable even if it is operated for a long time or in a relatively humid environment, and has the characteristics of compact and reasonable layout, stable and reliable operation effect and safe use.

[0004] The purpose of the present invention can be achieved through the following technical solutions:

[0005] An electrostatic atomization device, comprising an emitting electrode, a semiconductor refrigeration plate and a relative electrode which are arranged in sequence and close to each other; the two ends of the semiconductor refrigeration plate respectively have a refrigeration plate cold end and a refrigeration plate hot end, the refrigeration plate cold end contacts the emitting electrode, and the refrigeration plate hot end contacts the relative electrode; it is characterized in that: the emitting electrode has an emitting electrode main part which contacts the refrigeration plate cold end, and an emitting electrode end part which extends to the outside of the semiconductor refrigeration plate, the relative electrode has a relative electrode main part which contacts the refrigeration plate hot end, and a relative electrode end part which extends to the outside of the semiconductor refrigeration plate, the relative electrode end part is arranged opposite to the emitting electrode end part, and a condensation water collecting part is provided on the relative electrode end part near the emitting electrode end part.

[0006] According to an optimized solution, the present invention further comprises a heat-insulating component, which is a sheet-like structure made of a heat-insulating material and is arranged on the emitting electrode and contacts the main part of the emitting electrode at one end away from the semiconductor cooling sheet (2).

[0007] Optimization solution: In the present invention, the end of the emitter electrode end of the emitter electrode has a discharge tip, and the end of the discharge tip gradually narrows and becomes pointed.

[0008] Furthermore, the end of the opposing electrode end of the opposing electrode has a vertical end piece portion extending to the emitting electrode, and the vertical end piece portion has an opposing electrode through hole located near the discharge tip of the emitting electrode.

[0009] Furthermore, the discharge tips of the emitting electrode include a plurality of evenly distributed ones, and the relative electrode through-holes of the relative electrode also include a plurality of evenly distributed ones, and the discharge tips and the relative electrode through-holes are arranged in one-to-one correspondence.

[0010] Furthermore, the condensed water collecting member is formed into a strip-shaped water accumulation groove structure and is arranged close to the relative electrode perforation.

[0011] Optimization scheme, in the present invention, the emitting electrode main part of the emitting electrode is a sheet-like structure, which is spread on the cold end of the refrigeration plate, and the relative electrode main part of the relative electrode is a sheet-like structure, which is spread on the hot end of the refrigeration plate.

[0012] According to an optimized solution, the present invention further comprises a heat sink, which is arranged near the relative electrode and in contact with the relative electrode.

[0013] An optimized solution of the present invention also includes a shell, which is formed by connecting an upper shell and a lower shell and has an accommodating inner cavity. The emitting electrode, semiconductor cooling plate, relative electrode and heat sink are all arranged in the accommodating inner cavity of the shell, and the end of the relative electrode and the end of the emitting electrode respectively pass through the shell, and the wiring terminal of the relative electrode, the wiring terminal of the emitting electrode and the wiring terminal of the semiconductor cooling plate respectively pass through the shell, and the shell has heat dissipation ports on both sides corresponding to the heat sink.

[0014] The present invention has the following outstanding substantive features and remarkable progress:

[0015] 1. The present invention forms an ionization zone between the end of the relatively arranged emitting electrode and the end of the relative electrode, and designs a condensed water collector on the relative electrode. The relative electrode contacts the hot end of the semiconductor refrigeration plate to increase the temperature of the relative electrode, and uses the high temperature of the hot end of the refrigeration plate to promote the evaporation of the condensed water collected in the condensed water collector. First, it avoids the overflow of excessive condensed water collected on the condensed water collector, and solves the technical problem of excessive condensed water overflowing and affecting the long-term safe operation of other components in the prior art; second, the evaporated water vapor will be replenished into the ionization zone to be ionized, and finally form charged water particles, which avoids the waste of condensed water and increases the concentration of charged water particles.

[0016] 2. The main part of the emitting electrode of the emitting electrode in the present invention is in close contact with the thermal insulation component, which reduces the loss of coldness of the emitting electrode, ensures that the end of the emitting electrode has a larger temperature difference with the air near it at a lower temperature, thereby forming more condensed water, and ensuring that more charged water particles are produced by ionization in the ionization zone.

[0017] 3. In the present invention, the emitting electrode improves the ionization effect by gradually narrowing and sharpening the discharge tip, and further increases the corresponding area between the end of the emitting electrode and the end of the relative electrode by arranging the discharge tip and the relative electrode through-hole of the relative electrode in a one-to-one correspondence, thereby expanding the area of ​​the ionization zone and effectively ensuring the ionization effect.

[0018] 4. The condensed water collection element in the present invention adopts a long strip of water accumulation groove structure, which has the characteristics of simple structure and not easy to age; and the main part of the emitting electrode and the main part of the relative electrode both adopt a horizontally arranged sheet structure, which effectively increases the contact area with the semiconductor refrigeration sheet and ensures the heat conduction effect.

[0019] 5. The present invention can be used alone to generate charged water particles, or it can be used in conjunction with air purification products to ionize the air purified by the air purification products to form charged water particles. It has the characteristics of compact structure, reasonable layout and strong applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the present invention.

[0021] Figure 2 It is a schematic diagram of the split state of the present invention.

[0022] Figure 3 It is a schematic diagram of a partial cross-sectional view of the present invention.

[0023] Figure 4 It is a schematic diagram of the assembly state of the emitting electrode, the semiconductor cooling plate and the relative electrode in the present invention.

[0024] Figure 5 It is a schematic diagram of the use state of the present invention. DETAILED DESCRIPTION

[0025] The present invention will be further described below in conjunction with the accompanying drawings.

[0026] Example

[0027] refer to Figures 1 to 4 An electrostatic atomization device includes a housing 6, wherein the housing 6 is formed by connecting an upper housing 61 and a lower housing 62, and has an accommodating inner cavity. A heat preservation member 4, an emitting electrode 1, a semiconductor cooling sheet 2, an opposite electrode 3 and a heat sink 5 are arranged in the housing 6 in sequence.

[0028] The two ends of the semiconductor refrigeration plate 2 respectively have a refrigeration plate cold end 21 and a refrigeration plate hot end 22 . The refrigeration plate cold end 21 is in contact with the emitting electrode 1 , and the refrigeration plate hot end 22 is in contact with the relative electrode 3 .

[0029] The emitter electrode 1 comprises an emitter electrode main part 11 in contact with the cold end 21 of the refrigeration plate, and an emitter electrode end part extending to the outside of the semiconductor refrigeration plate 2. The emitter electrode main part 11 is a sheet-like structure, which is laid on the cold end 21 of the refrigeration plate; the end of the emitter electrode end part has two discharge tips 12 arranged horizontally and evenly distributed, and the end of the discharge tip 12 gradually narrows and becomes pointed.

[0030] The relative electrode 3 has a relative electrode main part 31 in contact with the hot end 22 of the refrigeration plate, and a relative electrode end part extending to the outside of the semiconductor refrigeration plate 2. The relative electrode main part 31 is a sheet-like structure, which is laid on the hot end 22 of the refrigeration plate; the relative electrode end part is arranged opposite to the emitting electrode end part, and the end of the relative electrode end part has a vertical end piece 32 extending to the emitting electrode 1, and the vertical end piece 32 has two evenly distributed relative electrode through holes 33 near the discharge tip 12 of the emitting electrode 1. The discharge tip 12 and the relative electrode through holes 33 are arranged one by one, and the top surface of the relative electrode end has a long strip structure and a water accumulation groove 30 arranged near the relative electrode through hole 33. The water accumulation groove 30 serves as a condensed water collection part, and the excess condensed water on the discharge tip 12 of the emitting electrode 1 falls into the water accumulation groove 30 under the action of gravity. Of course, the water absorbing member in the prior art can also be used to replace the water accumulation groove 30 as the condensation water collecting member, which can also play the role of receiving and collecting excess condensation water on the discharge tip 12 of the emitting electrode 1. The key point is that the condensation water collecting member can transfer heat to the hot end 22 of the semiconductor refrigeration plate 2 through the relative electrode 3, and the high temperature of the hot end 22 of the refrigeration plate can be used to promote the evaporation of water on the condensation water collecting member.

[0031] The heat preservation member 4 is a sheet structure made of heat preservation material such as foam material, which is arranged on the emitter electrode 1 and contacts the emitter electrode main part 11 at one end away from the semiconductor cooling sheet (2). The heat sink 5 is arranged near the opposite electrode 3 and contacts the opposite electrode 3.

[0032] like Figure 5 As shown, the shell 6 has wiring holes corresponding to the emitting electrode 1, the semiconductor cooling plate 2, and the relative electrode 3. The end of the relative electrode and the end of the emitting electrode pass through the shell 6 through the wiring holes near them, respectively, so that the discharge tip 12 of the emitting electrode 1 and the relative electrode through hole 33 of the relative electrode 3 are exposed outside the shell 6. In addition, the wiring terminal of the relative electrode 3 and the wiring terminal of the emitting electrode 1 pass through the shell 6 through the wiring holes near them, respectively, and are connected to the high-voltage power supply 7 through the line; and the wiring terminal of the semiconductor cooling plate 2 passes through the shell 6 through the wiring holes near them, so as to be connected to the power supply (not shown in the figure) through the line. The shell 6 has heat dissipation ports 60 on both sides of the corresponding heat sink 5, so as to facilitate the heat on the heat sink 5 to be discharged from the heat dissipation ports 60, and the fan 8 can also form a forced airflow from the heat dissipation ports 60 of the shell 6 to improve the heat dissipation effect.

Claims

1. An electrostatic atomization device, comprising an emitting electrode (1), a semiconductor refrigeration sheet (2) and a counter electrode (3) arranged in sequence and close to each other; the two ends of the semiconductor refrigeration sheet (2) respectively have a refrigeration sheet cold end (21) and a refrigeration sheet hot end (22), the refrigeration sheet cold end (21) is in contact with the emitting electrode (1), and the refrigeration sheet hot end (22) is in contact with the counter electrode (3); characterized in that: The emitting electrode (1) comprises an emitting electrode main portion (11) in contact with the cold end (21) of the cooling plate, and an emitting electrode end portion extending to the outside of the semiconductor cooling plate (2); the relative electrode (3) comprises a relative electrode main portion (31) in contact with the hot end (22) of the cooling plate, and an relative electrode end portion extending to the outside of the semiconductor cooling plate (2); the relative electrode end portion is arranged opposite to the emitting electrode end portion, and a condensed water collecting member is provided on the relative electrode end portion near the emitting electrode end portion.

2. An electrostatic atomization device according to claim 1, characterized in that: It also includes a heat-insulating component (4), which is made of a heat-insulating material and is arranged on the emitting electrode main part (11) of the emitting electrode (1).

3. An electrostatic atomization device according to claim 1, characterized in that: The end of the emitter electrode end of the emitter electrode (1) has a discharge tip (12), and the end of the discharge tip (12) gradually narrows and becomes pointed.

4. An electrostatic atomization device according to claim 3, characterized in that: The end of the opposite electrode end of the opposite electrode (3) has a vertical end piece (32) extending to the emitting electrode (1), and the vertical end piece (32) has an opposite electrode through hole (33) located near the discharge tip (12) of the emitting electrode (1).

5. An electrostatic atomization device according to claim 4, characterized in that: The discharge tip (12) of the emitting electrode (1) comprises a plurality of evenly distributed ones, and the relative electrode through-holes (33) of the relative electrode (3) also comprise a plurality of evenly distributed ones, and the discharge tip (12) and the relative electrode through-holes (33) are arranged in one-to-one correspondence.

6. An electrostatic atomization device according to claim 5, characterized in that: The condensed water collecting member is in the form of a long strip-shaped water accumulation groove (30) structure and is arranged close to the relative electrode through-hole (33).

7. An electrostatic atomization device according to any one of claims 1 to 6, characterized in that: The emitting electrode main part (11) of the emitting electrode (1) is in a sheet-like structure and is laid on the cold end (21) of the refrigeration plate, and the relative electrode main part (31) of the relative electrode (3) is in a sheet-like structure and is laid on the hot end (22) of the refrigeration plate.

8. An electrostatic atomization device according to any one of claims 1 to 6, characterized in that: It also includes a heat sink (5), which is arranged near the relative electrode (3) and in contact with the relative electrode (3).

9. An electrostatic atomization device according to claim 8, characterized in that: The invention also comprises an outer shell (6), wherein the outer shell (6) is formed by connecting an upper shell (61) and a lower shell (62), and has an accommodating inner cavity therein; the emitting electrode (1), the semiconductor cooling plate (2), the relative electrode (3) and the heat sink (5) are all arranged in the accommodating inner cavity of the outer shell (6); the end of the relative electrode and the end of the emitting electrode respectively pass through the outer shell (6); the connection terminal of the relative electrode (3), the connection terminal of the emitting electrode (1) and the connection terminal of the semiconductor cooling plate (2) respectively pass through the outer shell (6); and the outer shell (6) has heat dissipation ports (60) on both sides corresponding to the heat sink (5).

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