A liquid cooling system for a data center and a cabinet for a data center

Abstract

The embodiment of the present invention provides a liquid cooling system for a data center and a cabinet of a data center, wherein the liquid cooling system comprises: a plate heat exchange component, a spray heat exchange component, a plurality of cold plate components, and a cold supply component; the cold supply component is respectively connected to the plate heat exchange component and the spray heat exchange component; the cold supply component is used to provide cooling liquid to the plate heat exchange component and the spray heat exchange component, and cool down the cooling liquid returned by the plate heat exchange component and the spray heat exchange component; the plate heat exchange component is also connected to the input end of the cold plate component; the plate heat exchange component is used to provide the cooling liquid output from the cold supply component to the plurality of cold plate components; the plurality of cold plate components are connected to the chip component, and are used to absorb the heat released during the operation of the chip component; the output ends of the plurality of cold plate components are connected to the spray heat exchange component, and the spray heat exchange component is also connected to the plate heat exchange component; the spray heat exchange component is used to cool down the cooling liquid output by the plurality of cold plate components and transport it to the plate heat exchange component.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation in a data center, and in particular to a liquid cooling system for a data center and a cabinet for the data center. Background Art

[0002] As informatization becomes more and more mature, the related data center industry is also rising rapidly; and as the business continues to increase, the energy consumption of data centers is also growing rapidly.

[0003] For data centers, energy consumption mainly includes two parts: one part is generated by the operation of IT (Internet Technology) equipment such as server motherboards and CPUs (Central Processing Units), and the other part is generated by the cooling system used to dissipate heat for IT equipment such as server motherboards and CPUs.

[0004] At present, the cooling system of data centers mainly adopts air cooling; that is, using air as the refrigerant, the heat emitted by IT equipment such as server motherboards and CPUs is transferred to the radiator module; and then fans or air conditioners are used to blow away the heat.

[0005] However, there are many problems with air cooling, such as complex heat conduction process, large total thermal resistance, low heat transfer efficiency, and large temperature difference between high and low temperature heat sources during the heat transfer process. As the energy consumption density of data centers continues to increase, air cooling can no longer meet the heat dissipation needs of servers and other equipment.

[0006] In order to reduce the energy consumption of the heat dissipation system and improve the efficiency of the heat dissipation system, liquid cooling technology came into being; with the advantages of low energy consumption, high heat dissipation efficiency and low noise, it gradually showed its role as an alternative to air cooling technology.

[0007] The liquid cooling technologies used in existing data centers mainly include immersion liquid cooling and cold plate liquid cooling; both immersion liquid cooling and cold plate liquid cooling directly transport cooling water to the cabinets where IT equipment is deployed for cooling. Specifically, immersion liquid cooling immerses the entire IT equipment in cooling water, and cold plate liquid cooling inputs cooling water into a plate heat exchange module, which then exchanges heat with multiple cold plate heat dissipation modules. Each cold plate heat dissipation module is fixed to a chip component of an IT device to dissipate heat for the IT equipment.

[0008] However, in cold plate liquid cooling, after the plate heat exchange module exchanges heat with multiple cold plate heat dissipation modules, the temperature of the coolant input back to the cooling tower is relatively high, and the cooling tower lowers the temperature of the coolant again, which may generate a lot of energy consumption. In immersion liquid cooling, the entire IT equipment needs to be immersed in the coolant; in this method, the IT equipment is more expensive and prone to leakage. Summary of the invention

[0009] In view of the above problems, a liquid cooling system for a data center and a cabinet for a data center are proposed to overcome the above problems or at least partially solve the above problems, including:

[0010] A liquid cooling system for a data center, comprising: a plate heat exchange component, a spray heat exchange component, a plurality of cold plate components, and a cooling component;

[0011] The cooling component is connected to the plate heat exchange component and the spray heat exchange component respectively; the cooling component is used to provide cooling liquid to the plate heat exchange component and the spray heat exchange component, and to cool down the cooling liquid returned by the plate heat exchange component and the spray heat exchange component;

[0012] The plate heat exchange assembly is also connected to the input ends of the plurality of cold plate assemblies; the plate heat exchange assembly is used to provide the plurality of cold plate assemblies with the cooling liquid output from the cooling supply assembly;

[0013] The multiple cold plate assemblies are connected to the chip assembly of the IT Internet technology equipment, and the multiple cold plate assemblies are used to absorb the heat released during the operation of the chip assembly;

[0014] The output ends of the multiple cold plate assemblies are connected to the spray heat exchange assembly, and the spray heat exchange assembly is also connected to the plate heat exchange assembly; the spray heat exchange assembly is used to cool the coolant output by the multiple cold plate assemblies and transport it to the plate heat exchange assembly.

[0015] Optionally, the spray heat exchange component includes a shell, and a spray component, a heat exchange tube group, and a bracket located inside the shell;

[0016] The spray assembly is located at the top of the shell, the heat exchange tube group is located at the bottom of the spray assembly, one end of the bracket is connected to the shell, and the other end of the bracket is connected to the heat exchange tube group; the bracket is used to fix the heat exchange tube group inside the shell;

[0017] The liquid inlet end of the heat exchange tube group is connected to the output ends of the multiple cold plate assemblies, and the liquid outlet end of the heat exchange tube group is connected to the plate heat exchange assembly;

[0018] The spray assembly is connected to the cooling assembly, and the spray assembly is used to spray coolant to the heat exchange tube group to reduce the temperature of the coolant in the heat exchange tube group;

[0019] A liquid drain pipe is arranged at the lower part of the shell, and the liquid drain pipe is connected with the cooling assembly.

[0020] Optionally, the heat exchange tube group includes a plurality of groups of heat exchange tubes connected in sequence, and the plurality of groups of heat exchange tubes are arranged side by side in the shell;

[0021] Any heat exchange tube includes a serpentine tube and a heat exchange fin group sleeved outside the serpentine tube.

[0022] Optionally, the serpentine tube includes a straight tube portion and a curved tube portion, the heat exchange fin group is arranged obliquely on the straight tube portion of the serpentine tube, and the other end of the bracket is connected to the curved tube portion of the serpentine tube;

[0023] The inclination directions of the heat exchange fin groups of adjacent heat exchange tubes are opposite.

[0024] Optionally, the spray assembly includes a spray main pipe and a plurality of spray branches respectively connected to the spray main pipe; the spray main pipe is connected to the cooling assembly;

[0025] The plurality of spray branch pipes are arranged in parallel and at intervals, and a plurality of spray heads are arranged at intervals on the spray branch pipes.

[0026] Optionally, the secondary side input end of the spray heat exchange component is connected to the output ends of the multiple cold plate components, and the secondary side output end of the spray heat exchange component is connected to the secondary side input end of the plate heat exchange component;

[0027] The secondary side output end of the plate heat exchange assembly is provided with a seventh control valve, and the secondary side input end of the plate heat exchange assembly is provided with an eighth control valve; a fifth control valve is connected in parallel between the secondary side input end of the plate heat exchange assembly and the secondary side output end of the plate heat exchange assembly, and the fifth control valve is between the input end of the eighth control valve and the output end of the seventh control valve;

[0028] A tenth control valve is provided at the secondary side input end of the spray heat exchange component, and a ninth control valve is provided at the secondary side output end of the spray heat exchange component; a sixth control valve is connected in parallel between the secondary side input end of the spray heat exchange component and the secondary side output end of the spray heat exchange component, and the sixth control valve is between the tenth control valve input end and the ninth control valve output end.

[0029] Optionally, the cooling assembly includes a first cooling tower, a second cooling tower, a first chiller, and a second chiller;

[0030] The first cooling tower is connected to the primary side of the first chiller, and the secondary side of the first chiller is connected to the primary side of the plate heat exchange assembly; a second control valve is connected in parallel between the primary side output end of the first chiller and the secondary side input end of the first chiller, and a first control valve is connected in parallel between the primary side input end of the first chiller and the secondary side output end of the first chiller;

[0031] The second cooling tower is connected to the primary side of the second chiller, and the secondary side of the second chiller is connected to the primary side of the spray heat exchange component; a fourth control valve is connected in parallel between the primary side output end of the second chiller and the secondary side input end of the second chiller, and a third control valve is connected in parallel between the primary side input end of the second chiller and the secondary side output end of the second chiller.

[0032] Optionally, the plurality of cold plate assemblies and the chip assemblies are alternately stacked;

[0033] Any cold plate assembly includes a first cold plate, a heat sink, and a second cold plate stacked in sequence;

[0034] A first flow channel is provided on one side of the first cold plate close to the heat sink, a second flow channel is provided on one side of the second cold plate close to the heat sink, a liquid inlet and a liquid outlet are provided on the heat sink, the liquid inlet is connected to the inlet of the first flow channel and the inlet of the second flow channel at the same time, and the liquid outlet is connected to the outlet of the first flow channel and the outlet of the second flow channel at the same time;

[0035] The liquid inlet pipe port is connected to the plate heat exchange component, and the liquid outlet pipe port is connected to the spray heat exchange component.

[0036] Optionally, a first guide groove is provided on a side of the first cold plate away from the heat sink, and a second guide groove is provided on a side of the second cold plate away from the heat sink; the first guide groove fits with a first guide strip on the chip assembly, and the second guide groove fits with a second guide strip on the chip assembly;

[0037] An eleventh control valve is provided at the position where the plate heat exchange component is connected to the liquid inlet pipe port, and a twelfth control valve is provided at the position where the spray heat exchange component is connected to the liquid outlet pipe port.

[0038] The embodiment of the present invention further provides a cabinet for a data center, characterized in that it includes: a chip assembly, and a cold plate assembly in the above liquid cooling system

[0039] The embodiments of the present invention have the following advantages:

[0040] A liquid cooling system for a data center provided by an embodiment of the present invention includes: a plate heat exchange component, a spray heat exchange component, a plurality of cold plate components, and a cooling supply component; the cooling supply component is connected to the plate heat exchange component and the spray heat exchange component, respectively; the cooling supply component is used to provide cooling liquid to the plate heat exchange component and the spray heat exchange component, and to cool down the cooling liquid returned from the plate heat exchange component and the spray heat exchange component; the plate heat exchange component is also connected to the input end of the plurality of cold plate components; the plate heat exchange component is used to provide the cooling liquid output from the cooling supply component to the plurality of cold plate components; the plurality of cold plate components are connected to the chip components of IT Internet technology equipment, and the plurality of cold plate components are used to absorb the heat released during the operation of the chip components; the output ends of the plurality of cold plate components are connected to the spray heat exchange component, and the spray heat exchange component is also connected to the plate heat exchange component; the spray heat exchange component is used to cool down the cooling liquid output from the plurality of cold plate components and transport it to the plate heat exchange component. Through the embodiments of the present invention, the coolant output by multiple cold plate assemblies is cooled step by step. Compared with the plate heat exchange assembly working alone, the heat exchange time and heat exchange contact area of ​​the coolant can be increased, thereby improving the heat exchange efficiency, thereby reducing the energy consumption of the data center and achieving the effect of energy saving and emission reduction; and the plate heat exchange assembly and the spray heat exchange assembly can also work alone according to the cooling conditions, which can not only save energy and reduce emissions, but also when the respective cooling systems need maintenance, the other cooling system can operate alternately without affecting the normal operation of the server.

[0041] In addition, the chip assemblies and the cold plate assemblies are alternately stacked, and one cold plate assembly can cool the chip assemblies on both sides. Both sides of the chip assembly can be cooled, which increases the heat dissipation area of ​​the chip assembly, has a good heat dissipation effect, and plays a role in reducing energy consumption. When one cold plate assembly is repaired, other cold plate assemblies can cool the chip assembly without affecting the normal operation of the chip assembly. In addition, the chip assembly and the cold plate assembly are plug-in, which is convenient for connection and disassembly.

[0042] The heat exchange fin group of the spray heat exchange component is arranged obliquely on the serpentine tube, and the heat exchange fin group sleeved on the adjacent straight tube part of the serpentine tube is inclined in the opposite direction. During spraying, the contact time between the liquid and the heat exchange fin can be prolonged, and the heat exchange is sufficient and the heat exchange effect is good; the filter plate prevents debris on the heat exchange tube group from entering the water storage space, so that the circulating water remains clean. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solution of the present invention, the accompanying drawings required for use in the description of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0044] Figure 1is a structural schematic diagram of a liquid cooling system for a data center according to an embodiment of the present invention;

[0045] Figure 2 is a structural schematic diagram of a spray heat exchange component according to an embodiment of the present invention;

[0046] Figure 3 is a schematic structural diagram of a cross section of a spray heat exchange component according to an embodiment of the present invention;

[0047] Figure 4 is a structural schematic diagram of another liquid cooling system according to an embodiment of the present invention;

[0048] Figure 5 is an exploded view of a cold plate assembly according to an embodiment of the present invention;

[0049] Figure 6 is a structural schematic diagram of a first cold plate according to an embodiment of the present invention;

[0050] Figure 7 is a structural schematic diagram of a first cover plate according to an embodiment of the present invention;

[0051] Figure 8 is a structural schematic diagram of a heat dissipation block according to an embodiment of the present invention;

[0052] Fig. 9 is a schematic structural diagram of a chip assembly according to an embodiment of the present invention;

[0053] Fig.10 The present invention is a schematic structural diagram of a chip assembly and a cold plate assembly connected in accordance with an embodiment of the present invention.

[0054] Description of reference numerals:

[0055] 1. Cabinet;

[0056] 2. Cold plate assembly; 21. First cold plate; 211. First guide groove; 212. First flow channel; 213. First inlet; 214. First outlet; 22. First cover plate; 221. First connecting hole; 222. Second connecting hole; 223. Second fixed baffle plate; 23. Heat sink; 231. First nozzle; 232. Heat sink assembly; 233. Liquid inlet; 234. Second nozzle; 235. Liquid outlet; 236. Third nozzle; 237. Fourth nozzle; 24. Second cover plate; 241. First fixed baffle plate; 242. Third connecting hole; 243. Fourth connecting hole; 25. Second cold plate; 251. Second flow channel; 252. Second inlet; 253. Second outlet; 254. Second guide groove;

[0057] 3. chip assembly; 31. first guide bar; 32. second guide bar;

[0058] 4. The first cooling tower; 4a. The first circulating pump; 4b. The first water inlet valve;

[0059] 5. Second cooling tower; 5a. Second water inlet valve; 5b. Second circulation pump;

[0060] 6. First chiller; 6a. First control valve; 6b. Second control valve;

[0061] 7. Second chiller; 7a. Third control valve; 7b. Fourth control valve;

[0062] 8. Plate heat exchange assembly; 8a. Third circulation pump; 8b. Fifth control valve; 8c. Seventh control valve; 8d. Eighth control valve;

[0063] 9, spray heat exchange assembly; 9a, fourth circulation pump; 9b, sixth control valve; 9c, ninth control valve; 9d, tenth control valve; 91, top plate; 92, shell; 93, spray assembly; 931, spray main pipe; 932, spray branch pipe; 933, nozzle; 94, heat exchange tube group; 941, liquid inlet end; 942, liquid outlet end; 943, heat exchange tube; 9431, heat exchange fin group; 9432, serpentine tube; 944, liquid inlet connecting pipe; 945, liquid outlet connecting pipe; 95, bracket; 96, filter plate; 97, drain pipe;

[0064] 10. Refrigeration components. DETAILED DESCRIPTION

[0065] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0066] In actual applications, if only cold plate liquid cooling is used to reduce the temperature of chip components of IT equipment in data centers, the temperature of the coolant transported back to the cooling tower by the plate heat exchange module is relatively high, which may cause the cooling tower to consume a lot of energy when reducing the temperature of the coolant. If immersion liquid cooling is also used to increase the contact between the coolant and the chip components, thereby reducing the increase in the temperature of the coolant, the higher the requirements for IT equipment production, the higher the investment in other aspects may be.

[0067] Based on this, the embodiment of the present invention adds a spray heat exchange component on the basis of a liquid cooling system with cold plate liquid cooling, so as to pre-lower the temperature of the coolant transported back to the cooling tower by the plate heat exchange module by spraying, thereby reducing the temperature of the coolant transported back to the cooling tower by the plate heat exchange module, thereby reducing the energy consumption generated by the cooling tower when reducing the temperature of the coolant. Since the cooling efficiency of the spray heat reduction method is higher, compared with the existing technology of directly reducing the temperature of the coolant through the cooling tower, the liquid cooling system provided by the embodiment of the present invention can achieve cooling of the data center with less energy consumption.

[0068] Figure 1 FIG. 1 shows a schematic structural diagram of a liquid cooling system for a data center according to an embodiment of the present invention; Figure 1 As shown, the liquid cooling system provided by the embodiment of the present invention includes: a plate heat exchange component 8, a spray heat exchange component 9, a plurality of cold plate components 2, and a cooling component 10;

[0069] The cooling component 10 is connected to the plate heat exchange component 8 and the spray heat exchange component 9 respectively; the cooling component 10 is used to provide cooling liquid to the plate heat exchange component 8 and the spray heat exchange component 9, and to cool down the cooling liquid returned from the plate heat exchange component 8 and the spray heat exchange component 9; the plate heat exchange component 8 is also connected to the input end of multiple cold plate components 2; the plate heat exchange component 8 is used to provide the cooling liquid output from the cooling component 10 to the multiple cold plate components 2; the multiple cold plate components 2 are connected to the chip components 3 of the IT Internet technology equipment, and the multiple cold plate components 2 are used to absorb the heat released during the operation of the chip components 3; the output ends of the multiple cold plate components 2 are connected to the spray heat exchange component 9, and the spray heat exchange component 9 is also connected to the plate heat exchange component 8; the spray heat exchange component 9 is used to cool down the cooling liquid output by the multiple cold plate components 2 and transport it to the plate heat exchange component 8.

[0070] In actual applications, the cooling component 10 can be used to provide coolant in a low-temperature state to the plate heat exchange component 8 and the spray heat exchange component 9, and can also be used to cool the coolant in a high-temperature state transported back from the plate heat exchange component 8 and the spray heat exchange component 9, and then output the cooled coolant to the plate heat exchange component 8 and the spray heat exchange component 9.

[0071] The plate heat exchange component 8 can be connected to the input ends of multiple cold plate components 2 so as to deliver the cooling liquid in a low-temperature state delivered by the cooling component 10 to the multiple cold plate components 2; the multiple cold plate components 2 can be connected to the chip components 3 of the IT equipment in the cabinet, for example: the multiple cold plate components 2 can be close to the chip components 3, so that the cooling liquid in the cold plate components 2 can absorb the heat released by the chip components 3 during operation, thereby achieving the purpose of lowering the temperature of the chip components 3.

[0072] When the coolant flows out of the cold plate assembly 2 , it may have changed from a low temperature state to a high temperature state; in order to avoid waste of resources, the coolant may also flow back to the cooling assembly 10 to be changed to a low temperature state again in the cooling assembly 10 .

[0073] If the cooling liquid in a high-temperature state is cooled directly by the cooling component 10, a large amount of energy consumption may be generated. In order to reduce the energy consumption of the liquid cooling system, the embodiment of the present invention deploys a spray heat exchange component 9 between the output end of the cold plate component 2 and the plate heat exchange component 8 to pre-cool the cooling liquid in a high-temperature state for the first time by spraying heat exchange. The heat exchange efficiency is improved by increasing the heat exchange time and heat exchange contact area of ​​the coolant, thereby reducing the energy consumption of the liquid cooling system and achieving the effect of energy saving and emission reduction.

[0074] Specifically, the output ends of multiple cold plate assemblies 2 can be connected to the spray heat exchange assembly 9 respectively, so that the coolant in a high-temperature state can be transported to the spray heat exchange assembly 9 for the first cooling; then, the spray heat exchange assembly 9 can transport the coolant after the first cooling to the plate heat exchange assembly 8, so that it can be transported back to the cooling assembly 10 by the plate heat exchange assembly 8 for the second cooling.

[0075] like Figure 2 , showing a schematic structural diagram of a spray heat exchange component 9 according to an embodiment of the present invention; Figure 3 , shows a schematic diagram of the cross-section structure of a spray heat exchange component 9 of an embodiment of the present invention. The spray heat exchange component 9 may include a shell 92, and a spray component 93, a heat exchange tube group 94, and a bracket 95 located inside the shell 92; the spray component 93 is located at the top of the shell 92, the heat exchange tube group 94 is located at the bottom of the spray component 93, one end of the bracket 95 is connected to the shell 92, and the other end of the bracket 95 is connected to the heat exchange tube group 94; the bracket 95 is used to fix the heat exchange tube group 94 inside the shell 92; the liquid inlet end 941 of the heat exchange tube group 94 is connected to the output end of a plurality of cold plate components 2, and the liquid outlet end 942 of the heat exchange tube group 94 is connected to the plate heat exchange component 8; the spray component 93 is connected to the cooling component 10, and the spray component 93 is used to spray coolant to the heat exchange tube group 94 to reduce the temperature of the coolant in the heat exchange tube group 94; a drain pipe 97 is provided at the bottom of the shell 92, and the drain pipe 97 is connected to the cooling component 10.

[0076] Specifically, the interior of the shell 92 may be a cavity; a spray assembly 93 , a heat exchange tube group 94 , and a bracket 95 may be disposed in the cavity; a top plate 91 is disposed on the top of the shell 92 , and the top plate 91 is fixedly connected to the shell 92 .

[0077] The spray assembly 93 can be connected to the cooling assembly 10 to spray the low-temperature coolant provided by the cooling assembly 10 onto the heat exchange tube group 94 located at the bottom of the spray assembly 93 to cool the high-temperature coolant in the heat exchange tube group 94.

[0078] As an example, the spray assembly 93 may include a spray main pipe 931 and a plurality of spray branch pipes 932 respectively connected to the spray main pipe 931; the spray main pipe 931 is connected to the cooling assembly 10; the plurality of spray branch pipes 932 are arranged in parallel and spaced apart, and a plurality of spray heads 933 are arranged on the spray branch pipes 932 at intervals.

[0079] In order to improve the efficiency of spraying coolant of the spray assembly 93, a plurality of spray branch pipes 932 may be arranged in parallel and at intervals, and a plurality of nozzles 933 may be arranged at intervals on each spray straight pipe, so that the coolant can be sprayed from the plurality of nozzles 933 into the lower heat exchange tube group 94, thereby cooling the coolant in the heat exchange tube group 94.

[0080] After being cooled, the coolant in the heat exchange tube group 94 can be transported to the plate heat exchange component 8 through the liquid outlet 942 of the heat exchange tube group 94, and then transported to the cooling component 10 through the plate heat exchange component 8 for further cooling.

[0081] As an example, the heat exchange tube group 94 may include multiple groups of heat exchange tubes connected in sequence, and the multiple groups of heat exchange tubes are arranged side by side in the shell 92; any heat exchange tube includes a serpentine tube 9432 and a heat exchange fin group 9431 sleeved outside the serpentine tube 9432.

[0082] In order to improve the cooling efficiency of the spray heat exchange component 9, the heat exchange tube may include a serpentine tube 9432 and a heat exchange fin group 9431 sleeved outside the serpentine tube 9432; by increasing the surface area of ​​the heat exchange tube, the contact area between the coolant in the heat exchange tube and the coolant sprayed from the spray component 93 is increased, thereby improving the cooling efficiency of the spray heat exchange component 9.

[0083] In actual application, the serpentine tube 9432 includes a straight tube portion and a curved tube portion, the heat exchange fin group 9431 is tiltedly arranged on the straight tube portion of the serpentine tube 9432, and the other end of the bracket 95 is connected to the curved tube portion of the serpentine tube 9432; the tilt directions of the heat exchange fin groups 9431 of adjacent heat exchange tubes are opposite.

[0084] Specifically, the heat exchange fin group 9431 can be arranged obliquely on the straight tube portion of the serpentine tube 9432 to further increase the contact area between the coolant in the heat exchange tube and the coolant sprayed from the spray assembly 93. In addition, the contact time between the sprayed coolant and the heat exchange fin group 9431 can be increased by setting the inclination direction of the heat exchange fin groups 9431 of adjacent heat exchange tubes to opposite directions, thereby improving the cooling efficiency of the spray heat exchange assembly 9.

[0085] The sprayed coolant can flow back to the cooling assembly 10 through the drain pipe 97 provided at the lower part of the shell 92 so as to be recycled by the spray heat exchange assembly 9 .

[0086] Of course, in order to ensure the cleanliness of the coolant in the cooling component 10, a filter plate 96 can be set in the shell 92, and the filter plate 96 can be set between the heat exchange tube group 94 and the drain pipe 97; a water storage space can be formed at the lower part of the filter plate 96, and the sprayed coolant absorbs the heat of the heat exchange tube group 94 and flows into the water storage space, and is discharged to the cooling component 10 through the drain pipe 97.

[0087] like Figure 4 , shows a schematic diagram of the structure of another liquid cooling system according to an embodiment of the present invention; wherein, the secondary side input end of the spray heat exchange component 9 can be connected to the output ends of multiple cold plate components 2, and the secondary side output end of the spray heat exchange component 9 is connected to the secondary side input end of the plate heat exchange component 8; the secondary side output end of the plate heat exchange component 8 is provided with a seventh control valve 8c, and the secondary side input end of the plate heat exchange component 8 is provided with an eighth control valve 8d; the secondary side input end of the plate heat exchange component 8 and the secondary side output end of the plate heat exchange component 8 A fifth control valve 8b is connected in parallel between the spray heat exchange component 9 and the spray heat exchange component 9, and the fifth control valve 8b is between the input end of the eighth control valve 8d and the output end of the seventh control valve 8c; a tenth control valve 9d is provided at the secondary side input end of the spray heat exchange component 9, and a ninth control valve 9c is provided at the secondary side output end of the spray heat exchange component 9; a sixth control valve 9b is connected in parallel between the secondary side input end of the spray heat exchange component 9 and the secondary side output end of the spray heat exchange component 9, and the sixth control valve 9b is between the input end of the tenth control valve 9d and the output end of the ninth control valve 9c.

[0088] In actual applications, if the liquid cooling system needs to be repaired, it may be necessary to stop the operation of the liquid cooling system; in turn, the data center may be unable to provide services normally; based on this, the embodiment of the present invention can configure the plate heat exchange component 8 and the spray heat exchange component 9 to be components that can work independently.

[0089] Specifically, the secondary side input end of the spray heat exchange component 9 (i.e., the end located on the secondary side of the spray heat exchange component 9 and used for inputting into the spray heat exchange component 9, the explanation of subsequent related contents is similar and will not be repeated here) can be set to be connected to the output ends of multiple cold plate components 2, and the secondary side output end of the spray heat exchange component 9 is connected to the secondary side input end of the plate heat exchange component 8.

[0090] Then, a seventh control valve 8c can be set at the secondary side output end of the plate heat exchange component 8, and an eighth control valve 8d can be set at the secondary side input end of the plate heat exchange component 8; and a fifth control valve 8b can be set in parallel between the secondary side input end of the plate heat exchange component 8 and the secondary side output end of the plate heat exchange component 8, and the fifth control valve 8b can be between the input end of the eighth control valve 8d and the output end of the seventh control valve 8c.

[0091] At the same time, a tenth control valve 9d can be set at the secondary side input end of the spray heat exchange component 9, and a ninth control valve 9c can be set at the secondary side output end of the spray heat exchange component 9; and a sixth control valve 9b can be set in parallel between the secondary side input end of the spray heat exchange component 9 and the secondary side output end of the spray heat exchange component 9, and the sixth control valve 9b can be between the tenth control valve 9d input end and the ninth control valve 9c output end.

[0092] By controlling the opening and closing states of the seventh control valve 8c, the eighth control valve 8d, the fifth control valve 8b, the ninth control valve 9c, the tenth control valve 9d and the sixth control valve 9b, it is possible to operate only the plate heat exchange component 8, only the spray heat exchange component 9, or both the plate heat exchange component 8 and the spray heat exchange component 9 at the same time.

[0093] For example: when the plate heat exchange component 8 needs maintenance and cleaning, the fifth control valve 8b, the ninth control valve 9c and the tenth control valve 9d can be opened, and the sixth control valve 9b, the seventh control valve 8c and the eighth control valve 8d can be closed; thereby, the spray heat exchange component 9 is activated to cool the chip component 3.

[0094] When the spray heat exchange component 9 needs maintenance and cleaning, the sixth control valve 9b, the seventh control valve 8c and the eighth control valve 8d can be opened, and the fifth control valve 8b, the ninth control valve 9c and the tenth control valve 9d can be closed; thereby, the plate heat exchange component 8 is activated to cool the chip component 3.

[0095] In one embodiment of the present invention, the cooling component 10 may include a first cooling tower 4, a second cooling tower 5, a first chiller 6 and a second chiller 7; the first cooling tower 4 is connected to the primary side of the first chiller 6, and the secondary side of the first chiller 6 is connected to the primary side of the plate heat exchange component 8; a second control valve 6b is connected in parallel between the primary side output end of the first chiller 6 and the secondary side input end of the first chiller 6, and a first control valve 6a is connected in parallel between the primary side input end of the first chiller 6 and the secondary side output end of the first chiller 6; the second cooling tower 5 is connected to the primary side of the second chiller 7, and the secondary side of the second chiller 7 is connected to the primary side of the spray heat exchange component 9; a fourth control valve 7b is connected in parallel between the primary side output end of the second chiller 7 and the secondary side input end of the second chiller 7, and a third control valve 7a is connected in parallel between the primary side input end of the second chiller 7 and the secondary side output end of the second chiller 7.

[0096] In actual applications, the cooling component 10 can be composed of a cooling tower and a water cooling unit; since the liquid cooling system in the embodiment of the present invention includes a plate heat exchange component 8 and a spray heat exchange component 9, corresponding cooling towers and water cooling units can be set for the plate heat exchange component 8 and the spray heat exchange component 9 respectively.

[0097] Specifically, a first cooling tower 4 and a first chiller 6 may be provided for the plate heat exchange assembly 8 , and a second cooling tower 5 and a second chiller 7 may be provided for the spray heat exchange assembly 9 .

[0098] The first cooling tower 4 can be connected to the primary side of the first chiller 6, and the secondary side of the first chiller 6 can be connected to the primary side of the plate heat exchange component 8; thus, the coolant output from the first cooling tower 4 can be cooled again in the first chiller 6 and then transported to the plate heat exchange component 8.

[0099] The second cooling tower 5 can be connected to the primary side of the second chiller 7, and the secondary side of the second chiller 7 can be connected to the primary side of the spray heat exchange component 9, so that the coolant output from the second cooling tower 5 can be cooled again in the second chiller 7 and then transported to the spray heat exchange component 9.

[0100] As an example, in order to further reduce the energy consumption of the liquid cooling system, a second control valve 6b can be set in parallel between the primary side output end of the first chiller 6 and the secondary side input end of the first chiller 6, and a first control valve 6a can be set in parallel between the primary side input end of the first chiller 6 and the secondary side output end of the first chiller 6; and / or; a fourth control valve 7b can be set in parallel between the primary side output end of the second chiller 7 and the secondary side input end of the second chiller 7, and a third control valve 7a can be set in parallel between the primary side input end of the second chiller 7 and the secondary side output end of the second chiller 7.

[0101] By controlling the opening and closing states of the first control valve 6a, the second control valve 6b, the third control valve 7a and the fourth control valve 7b, the opening and closing of the first chiller 6 and the second chiller 7 can be selectively controlled.

[0102] For example: when the ambient temperature is high, the first control valve 6a, the second control valve 6b, the third control valve 7a and the fourth control valve 7b can be closed to ensure the cooling effect; when the ambient temperature is moderate, the third control valve 7a and the fourth control valve 7b can be opened to disable the second chiller 7; when the ambient temperature is low, the first control valve 6a, the second control valve 6b, the third control valve 7a and the fourth control valve 7b can be opened to disable the first chiller 6 and the second chiller 7; thus, the operating status of the components of the cooling assembly 10 can be selectively controlled according to actual conditions, thereby reducing unnecessary energy waste.

[0103] In practical applications, if only one cold plate assembly 2 is fixed on each chip assembly 3, the chip assembly 3 may only be able to dissipate heat through one side, which may result in a large amount of energy consumption required for heat dissipation. In order to improve the heat dissipation efficiency, in one embodiment of the present invention, multiple cold plate assemblies 2 can be alternately stacked with the chip assembly 3; any cold plate assembly 2 includes a first cold plate 21, a heat dissipation block 23, and a second cold plate 25 stacked in sequence; a first flow channel 212 is provided on the side of the first cold plate 21 close to the heat dissipation block 23, a second flow channel 251 is provided on the side of the second cold plate 25 close to the heat dissipation block 23, and a liquid inlet 233 and a liquid outlet 235 are provided on the heat dissipation block 23, the liquid inlet 233 is connected to the inlet of the first flow channel 212 and the second flow channel 251 at the same time, and the liquid outlet 235 is connected to the outlet of the first flow channel 212 and the second flow channel 251 at the same time; the liquid inlet 233 is connected to the plate heat exchange assembly 8, and the liquid outlet 235 is connected to the spray heat exchange assembly 9.

[0104] like Figure 5 , shows an exploded view of a cold plate assembly 2 according to an embodiment of the present invention; Figure 6 , shows a schematic structural diagram of a first cold plate 21 according to an embodiment of the present invention; Figure 7 , shows a schematic structural diagram of a first cover plate 22 according to an embodiment of the present invention; Figure 8 , shows a schematic structural diagram of a heat sink 23 according to an embodiment of the present invention; Fig. 9 , showing a schematic structural diagram of a chip assembly 3 according to an embodiment of the present invention; Fig.10 , shows a schematic structural diagram of the connection between a chip assembly 3 and a cold plate assembly 2 according to an embodiment of the present invention.

[0105] In an embodiment of the present invention, in order to improve the heat dissipation efficiency of the cold plate assembly 2, the cold plate assembly 2 can be designed to dissipate heat on both sides; specifically, the cold plate assembly 2 may include a first cold plate 21, a heat dissipation block 23, and a second cold plate 25 stacked in sequence; a first flow channel 212 is provided on a side of the first cold plate 21 close to the heat dissipation block 23, a second flow channel 251 is provided on a side of the second cold plate 25 close to the heat dissipation block 23, and a liquid inlet pipe port 233 and a liquid outlet pipe port 235 are provided on the heat dissipation block 23, the liquid inlet pipe port 233 is connected to the inlets of the first flow channel 212 and the second flow channel 251 at the same time, and the liquid outlet pipe port 235 is connected to the outlets of the first flow channel 212 and the second flow channel 251 at the same time; the liquid inlet pipe port 233 is connected to the plate heat exchange assembly 8, and the liquid outlet pipe port 235 is connected to the spray heat exchange assembly 9.

[0106] The plate heat exchange assembly 8 delivers the low-temperature coolant to the first flow channel 212 and the second flow channel 251 through the liquid inlet 233, so that the first cold plate 21 and the second cold plate 25 of the cold plate assembly 2 have the ability to dissipate heat. The first flow channel 212 and the second flow channel can be a serpentine groove structure.

[0107] Furthermore, when deploying the cold plate assembly 2 and the chip assembly 3, they are stacked alternately in sequence so that a cold plate assembly 2 is provided on both sides of each chip assembly 3; each chip assembly 3 can dissipate heat through the cold plates in contact with each other, thereby improving the heat dissipation efficiency of the chip assembly 3; and even if the cold plate assembly 2 on one side of the chip assembly 3 needs maintenance, it can also be cooled through the cold plate assembly 2 on the other side.

[0108] As an example, a first guide groove 211 is provided on the side of the first cold plate 21 away from the heat sink 23, and a second guide groove 254 is provided on the side of the second cold plate 25 away from the heat sink 23; the first guide groove 211 is matched with the first guide bar 31 on the chip assembly 3, and the second guide groove 254 is matched with the second guide bar 32 on the chip assembly 3; an eleventh control valve is provided at the position where the plate heat exchange assembly 8 is connected to the liquid inlet pipe port 233, and a twelfth control valve is provided at the position where the spray heat exchange assembly 9 is connected to the liquid outlet pipe port 235.

[0109] The first guide groove 211 is matched with the first guide bar 31 on the chip assembly 3, and the second guide groove 254 is matched with the second guide bar 32 on the chip assembly 3; thus, the cold plate assembly 2 and the chip assembly 3 can be neatly stacked and are not easily displaced.

[0110] In one example, the eleventh control valve and the twelfth control valve may be closed when the cold plate assembly 2 is pulled out, and opened when the cold plate assembly 2 is inserted, so as to prevent the coolant from flowing out.

[0111] As another example, a first cover plate 22 may be further disposed between the first cold plate 21 and the heat dissipation block 23 , and a second cover plate 24 may be further disposed between the second cold plate 25 and the heat dissipation block 23 .

[0112] The first cold plate 21 and the first cover plate 22 may be fixedly connected (for example, by screws), and the second cover plate 24 and the second cold plate 25 may also be fixedly connected.

[0113] A first fixed baffle 241 may be provided on the upper side of the second cover plate 24. The first fixed baffle 241 may include four side plates connected end to end. The four side plates of the first fixed baffle 241 may form a groove for installing the heat dissipation block 23. The lower part of the heat dissipation block 23 is embedded in the groove formed by the first fixed baffle 241 and is fixedly connected to the first fixed baffle 241.

[0114] A second fixed baffle 223 may be provided on the lower side of the first cover plate 22. The second fixed baffle 223 has the same structure as the first fixed baffle 241. The upper portion of the heat dissipation block 23 is embedded in the groove formed by the second fixed baffle 223 and is fixedly connected to the second fixed baffle 223. The first cover plate 22 and the second cover plate 24 are symmetrically arranged on both sides of the heat dissipation block 23.

[0115] The first cover plate 22 is provided with a first connection hole 221 and a second connection hole 222, and the second cover plate 24 is provided with a third connection hole 242 and a fourth connection hole 243; the liquid inlet pipe opening 233 and the liquid outlet pipe opening 235 provided on the heat sink 23 are arranged on both sides of the heat sink group 232, the heat sink 23 is provided with a first pipe opening 231 and a second pipe opening 234 on the upper side, and the heat sink 23 is provided with a third pipe opening 236 and a fourth pipe opening 237 on the lower side. The first pipe opening 231 passes through the first connection hole 2 21 respectively connects the liquid inlet pipe port 233 and the first inlet 213, the second pipe port 234 passes through the second connecting hole 222 to respectively connect the liquid outlet pipe port 235 and the first outlet 214, the third pipe port 236 passes through the third connecting hole 242 to respectively connect the liquid inlet pipe port 233 and the second inlet 252, and the fourth pipe port 237 passes through the fourth connecting hole 243243 to respectively connect the liquid outlet pipe port 235 and the second outlet 253; the first cover plate 22 and the second cover plate 24 both play the role of connection and sealing.

[0116] In one example, the liquid inlet 233 can be connected to the secondary side output end of the plate heat exchange component 8 through the seventh control valve 8c, or connected to the secondary side output end of the spray heat exchange component 9 through the fifth control valve 8b and the ninth control valve 9c.

[0117] The liquid outlet 235 can be connected to the secondary side input end of the plate heat exchange component 8 through the sixth control valve 9b and the eighth control valve 8d, or connected to the secondary side input end of the spray heat exchange component 9 through the tenth control valve 9d.

[0118] In one embodiment of the present invention, the spray assembly 93 can be connected to the secondary side output end of the second chiller 7 or the water outlet end of the second cooling tower 5; the liquid inlet end 941 of the heat exchange tube group 94 can pass through the shell 92 and be connected to the liquid outlet pipe port 235 on the cold plate assembly 2 through the tenth control valve 9d, and the liquid outlet end 942 of the heat exchange tube group 94 can pass through the shell 92 and be connected to the secondary side input end of the plate heat exchange assembly 8 through the eighth control valve 8d or be connected to the liquid inlet pipe port 233 on the cold plate assembly 2 through the fifth control valve 8b.

[0119] The upper parts of the multiple groups of heat exchange tubes 943 are connected through the liquid inlet connecting pipe 944, and the lower parts of the multiple groups of heat exchange tubes 943 are connected through the liquid outlet connecting pipe 945. The liquid inlet connecting pipe 944 is connected to the liquid inlet end 941, and the liquid outlet connecting pipe 945 is connected to the liquid outlet end 942.

[0120] In one embodiment of the present invention, a third circulation pump 8a is provided at the primary side output end of the plate heat exchange component 8, a fourth circulation pump 9a is provided at the primary side output end of the spray heat exchange component 9, a first circulation pump 4a is provided at the return water end of the first cooling tower 4, and a second circulation pump 5b is provided at the return water end of the second cooling tower 5. The movement of the coolant in the liquid cooling system is driven by the first circulation pump 4a, the second circulation pump 5b, the third circulation pump 8a and the fourth circulation pump 9a.

[0121] In another embodiment of the present invention, a first water inlet valve 4b is provided at the water outlet of the first cooling tower 4, and a second water inlet valve 5a is provided at the water outlet of the second cooling tower 5. The first water inlet valve 4b and the second water inlet valve 5a are used to replenish coolant to the cooling towers.

[0122] In order to further illustrate the present invention, the above embodiments are described below:

[0123] 1. When the outside temperature is very high, such as in summer, or when the load of each chip component in the server is at a peak, the first control valve 6a and the second control valve 6b are closed, the third control valve 7a and the fourth control valve 7b are closed, the fifth control valve 8b and the sixth control valve 9b are closed, the seventh control valve 8c, the eighth control valve 8d, the ninth control valve 9c and the tenth control valve 9d are opened, the first cooling tower 4, the second cooling tower 5, the first chiller 6, the second chiller 7, the plate heat exchange component 8, and the spray heat exchange component 9 are in operation, the primary side of the plate heat exchange component 8 is connected to the secondary side of the first chiller 6, the spray main pipe 931 is connected to the secondary side output end of the second chiller 7, the drain pipe 97 is connected to the secondary side input end of the second chiller 7, the liquid outlet 235 of the cold plate component 2 is connected to the liquid inlet 941 of the spray heat exchange component 9 through the tenth control valve 9d, and the liquid inlet 233 of the cold plate component 2 is connected to the secondary side output end of the plate heat exchange component 8 through the seventh control valve 8c.

[0124] Since the spray heat exchange component 9 is connected in series with the plate heat exchange component 8, the spray heat exchange component 9 can preliminarily cool the high-temperature medium output by the cold plate component 2, and then input it into the plate heat exchange component 8 for further cooling. Compared with the prior art in which heat is directly exchanged with multiple cold plates through a plate heat exchange module, the energy consumption of the chiller is greatly reduced, achieving an energy-saving effect.

[0125] 2. When the external temperature is moderate, such as in spring and autumn, or when the load of each chip component in the server is moderate, the second chiller 7 is closed, the third control valve 7a and the fourth control valve 7b are opened, the first control valve 6a and the second control valve 6b are closed, the fifth control valve 8b and the sixth control valve 9b are closed, the seventh control valve 8c, the eighth control valve 8d, the ninth control valve 9c and the tenth control valve 9d are opened, the first cooling tower 4, the second cooling tower 5, the first chiller 6, the plate heat exchange component 8, and the spray heat exchange component 9 are in operation, the primary side of the plate heat exchange component 8 is connected to the secondary side of the first chiller 6, the spray main pipe 931 is connected to the water outlet end of the second cooling tower 5, the drain pipe 97 is connected to the return water end of the second cooling tower, the liquid outlet pipe 235 of the cold plate component 2 is connected to the liquid inlet end 941 of the spray heat exchange component 9 through the tenth control valve 9d, and the liquid inlet pipe 233 of the cold plate component 2 is connected to the secondary side output end of the plate heat exchange component 8 through the seventh control valve 8c.

[0126] At this time, the second cooling tower 5 directly provides cooling water to the spray heat exchange component 9, which can preliminarily cool the high-temperature medium output by the cold plate component 2, and then input it into the plate heat exchange component 8 for further cooling. The second chiller 7 is shut down according to the temperature or load conditions to reduce energy consumption and achieve energy-saving effects.

[0127] 2. When the external temperature is low, such as in winter, or when the load of each chip component in the server is low, turn off the first chiller 6 and the second chiller 7; open the first control valve 6a, the second control valve 6b, the third control valve 7a, and the fourth control valve 7b, close the fifth control valve 8b and the sixth control valve 9b, and open the seventh control valve 8c, the eighth control valve 8d, the ninth control valve 9c and the tenth control valve 9d. The first cooling tower 4, the second cooling tower 5, the plate heat exchange component 8, and the spray heat exchange component 9 are in operation. The primary side of the plate heat exchange component 8 is connected to the first cooling tower 4, the spray main pipe 931 is connected to the water outlet end of the second cooling tower 5, the drain pipe 97 is connected to the return water end of the second cooling tower, the liquid outlet pipe 235 of the cold plate component 2 is connected to the liquid inlet end 941 of the spray heat exchange component 9 through the tenth control valve 9d, and the liquid inlet pipe 233 of the cold plate component 2 is connected to the secondary side output end of the plate heat exchange component 8 through the seventh control valve 8c.

[0128] At this time, the second cooling tower 5 directly provides cooling water to the spray heat exchange component 9, and the first cooling tower 4 directly cools the plate heat exchange component 8. The spray heat exchange component 9 can preliminarily cool the high-temperature medium output by the cold plate component 2, and then input it into the plate heat exchange component 8 for further cooling. The first chiller 6 and the second chiller 7 are shut down according to the temperature or load conditions to further reduce energy consumption and achieve energy-saving effects.

[0129] 4. When the cooling pipeline on one side of the plate heat exchange assembly 8, the first chiller 6, and the first cooling tower 4 needs to be repaired and cleaned, the fifth control valve 8b is opened, the seventh control valve 8c, the eighth control valve 8d, and the sixth control valve 9b are closed, the third control valve 7a and the fourth control valve 7b are closed, the ninth control valve 9c and the tenth control valve 9d are opened, the spray main pipe 931 is connected to the secondary side output end of the second chiller 7, the drain pipe 97 is connected to the secondary side input end of the second chiller 7, the liquid outlet pipe 235 of the cold plate assembly 2 is connected to the liquid inlet end 941 of the spray heat exchange assembly 9 through the tenth control valve 9d, and the liquid inlet pipe 233 of the cold plate assembly 2 is connected to the liquid outlet end 942 of the spray heat exchange assembly 9 through the fifth control valve 8b and the ninth control valve 9c;

[0130] 5. When the cooling pipeline on one side of the spray heat exchange component 9, the second chiller 7, and the second cooling tower 5 needs to be repaired and cleaned, the fifth control valve 8b is closed, the seventh control valve 8c, the eighth control valve 8d, and the sixth control valve 9b are opened, the ninth control valve 9c and the tenth control valve 9d are closed, the first control valve 6a and the second control valve 6b are opened, the primary side of the plate heat exchange component 8 is connected to the secondary side of the first chiller 6, the liquid inlet pipe port 233 of the cold plate component 2 is connected to the secondary side output end of the plate heat exchange component 8 through the seventh control valve 8c, and the liquid outlet pipe port 235 of the cold plate component 2 is connected to the secondary side input end of the plate heat exchange component 8 through the sixth control valve 9b and the eighth control valve 8d.

[0131] A liquid cooling system for a data center provided by an embodiment of the present invention includes: a plate heat exchange component, a spray heat exchange component, a plurality of cold plate components, and a cooling supply component; the cooling supply component is connected to the plate heat exchange component and the spray heat exchange component, respectively; the cooling supply component is used to provide cooling liquid to the plate heat exchange component and the spray heat exchange component, and to cool down the cooling liquid returned from the plate heat exchange component and the spray heat exchange component; the plate heat exchange component is also connected to the input end of the plurality of cold plate components; the plate heat exchange component is used to provide the cooling liquid output from the cooling supply component to the plurality of cold plate components; the plurality of cold plate components are connected to the chip components of IT Internet technology equipment, and the plurality of cold plate components are used to absorb the heat released during the operation of the chip components; the output ends of the plurality of cold plate components are connected to the spray heat exchange component, and the spray heat exchange component is also connected to the plate heat exchange component; the spray heat exchange component is used to cool down the cooling liquid output from the plurality of cold plate components and transport it to the plate heat exchange component. Through the embodiments of the present invention, the coolant output by multiple cold plate assemblies is cooled step by step. Compared with the plate heat exchange assembly working alone, the heat exchange time and heat exchange contact area of ​​the coolant can be increased, thereby improving the heat exchange efficiency, thereby reducing the energy consumption of the data center and achieving the effect of energy saving and emission reduction; and the plate heat exchange assembly and the spray heat exchange assembly can also work alone according to the cooling conditions, which can not only save energy and reduce emissions, but also when the respective cooling systems need maintenance, the other cooling system can operate alternately without affecting the normal operation of the server.

[0132] In addition, the chip assemblies and the cold plate assemblies are alternately stacked, and one cold plate assembly can cool the chip assemblies on both sides. Both sides of the chip assembly can be cooled, which increases the heat dissipation area of ​​the chip assembly, has a good heat dissipation effect, and plays a role in reducing energy consumption. When one cold plate assembly is repaired, other cold plate assemblies can cool the chip assembly without affecting the normal operation of the chip assembly. In addition, the chip assembly and the cold plate assembly are plug-in, which is convenient for connection and disassembly.

[0133] The heat exchange fin group of the spray heat exchange component is arranged obliquely on the serpentine tube, and the heat exchange fin group sleeved on the adjacent straight tube part of the serpentine tube is inclined in the opposite direction. During spraying, the contact time between the liquid and the heat exchange fin can be prolonged, and the heat exchange is sufficient and the heat exchange effect is good; the filter plate prevents debris on the heat exchange tube group from entering the water storage space, so that the circulating water remains clean.

[0134] In one embodiment of the present invention, a cabinet of a data center is also provided, in which chip components of IT equipment and cold plate components in the above-mentioned liquid cooling system can be deployed.

[0135] Among them, the liquid cooling system also includes: a plate heat exchange component, a spray heat exchange component, and multiple cold plate components.

[0136] The cooling component is connected to the plate heat exchange component and the spray heat exchange component respectively; the cooling component is used to provide cooling liquid to the plate heat exchange component and the spray heat exchange component, and to cool down the cooling liquid returned from the plate heat exchange component and the spray heat exchange component;

[0137] The plate heat exchange assembly is also connected to the input ends of the plurality of cold plate assemblies; the plate heat exchange assembly is used to provide the plurality of cold plate assemblies with the cooling liquid output from the cooling supply assembly;

[0138] A plurality of cold plate assemblies are connected to chip assemblies of IT Internet technology equipment, and the plurality of cold plate assemblies are used to absorb heat released during operation of the chip assemblies;

[0139] The output ends of the multiple cold plate assemblies are connected to the spray heat exchange assembly, and the spray heat exchange assembly is also connected to the plate heat exchange assembly; the spray heat exchange assembly is used to cool the coolant output by the multiple cold plate assemblies and transport it to the plate heat exchange assembly.

[0140] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0141] The liquid cooling system for a data center and a cabinet for a data center provided by the present invention are introduced in detail above. Specific examples are used herein to illustrate the principle and implementation mode of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation mode and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A liquid cooling system for a data center, characterized in that: include: Plate heat exchange components, spray heat exchange components, multiple cold plate components, cooling components; The cooling component is connected to the plate heat exchange component and the spray heat exchange component respectively; the cooling component is used to provide cooling liquid to the plate heat exchange component and the spray heat exchange component, and to cool down the cooling liquid returned by the plate heat exchange component and the spray heat exchange component; The plate heat exchange assembly is also connected to the input ends of the plurality of cold plate assemblies; the plate heat exchange assembly is used to provide the plurality of cold plate assemblies with the cooling liquid output from the cooling supply assembly; The multiple cold plate assemblies are connected to the chip assembly of the IT Internet technology equipment, and the multiple cold plate assemblies are used to absorb the heat released during the operation of the chip assembly; The output ends of the multiple cold plate assemblies are connected to the spray heat exchange assembly, and the spray heat exchange assembly is also connected to the plate heat exchange assembly; the spray heat exchange assembly is used to cool down the coolant output by the multiple cold plate assemblies and transport it to the plate heat exchange assembly; The secondary side input end of the spray heat exchange component is connected to the output ends of the multiple cold plate components, and the secondary side output end of the spray heat exchange component is connected to the secondary side input end of the plate heat exchange component; The secondary side output end of the plate heat exchange assembly is provided with a seventh control valve, and the secondary side input end of the plate heat exchange assembly is provided with an eighth control valve; a fifth control valve is connected in parallel between the secondary side input end of the plate heat exchange assembly and the secondary side output end of the plate heat exchange assembly, and the fifth control valve is between the input end of the eighth control valve and the output end of the seventh control valve; The secondary side input end of the spray heat exchange component is provided with a tenth control valve, and the secondary side output end of the spray heat exchange component is provided with a ninth control valve; a sixth control valve is connected in parallel between the secondary side input end of the spray heat exchange component and the secondary side output end of the spray heat exchange component, and the sixth control valve is between the tenth control valve input end and the ninth control valve output end; When the fifth control valve, the ninth control valve and the tenth control valve are opened and the sixth control valve, the seventh control valve and the eighth control valve are closed, the spray heat exchange component is activated to cool the chip component; When the sixth control valve, the seventh control valve and the eighth control valve are opened, and the fifth control valve, the ninth control valve and the tenth control valve are closed, the plate heat exchange component is activated to cool the chip component.

2. The system according to claim 1, characterized in that The spray heat exchange component includes a shell, and a spray component, a heat exchange tube group, and a bracket located inside the shell; The spray assembly is located at the top of the shell, the heat exchange tube group is located at the bottom of the spray assembly, one end of the bracket is connected to the shell, and the other end of the bracket is connected to the heat exchange tube group; the bracket is used to fix the heat exchange tube group inside the shell; The liquid inlet end of the heat exchange tube group is connected to the output ends of the multiple cold plate assemblies, and the liquid outlet end of the heat exchange tube group is connected to the plate heat exchange assembly; The spray assembly is connected to the cooling assembly, and the spray assembly is used to spray coolant to the heat exchange tube group to reduce the temperature of the coolant in the heat exchange tube group; A liquid drain pipe is arranged at the lower part of the shell, and the liquid drain pipe is connected with the cooling assembly.

3. The system according to claim 2, characterized in that The heat exchange tube group includes a plurality of groups of heat exchange tubes connected in sequence, and the plurality of groups of heat exchange tubes are arranged side by side in the shell; Any heat exchange tube includes a serpentine tube and a heat exchange fin group sleeved outside the serpentine tube.

4. The system according to claim 3, characterized in that The serpentine tube includes a straight tube portion and a curved tube portion, the heat exchange fin group is obliquely arranged on the straight tube portion of the serpentine tube, and the other end of the bracket is connected to the curved tube portion of the serpentine tube; The inclination directions of the heat exchange fin groups of adjacent heat exchange tubes are opposite.

5. The system according to any one of claims 2 to 4, characterized in that: The spray assembly includes a spray main pipe and a plurality of spray branches respectively connected to the spray main pipe; the spray main pipe is connected to the cooling assembly; The multiple spray branch pipes are arranged in parallel and at intervals, and multiple spray heads are arranged at intervals on the spray branch pipes.

6. The system according to claim 1, characterized in that The cooling assembly includes a first cooling tower, a second cooling tower, a first chiller and a second chiller; The first cooling tower is connected to the primary side of the first chiller, and the secondary side of the first chiller is connected to the primary side of the plate heat exchange assembly; a second control valve is connected in parallel between the primary side output end of the first chiller and the secondary side input end of the first chiller, and a first control valve is connected in parallel between the primary side input end of the first chiller and the secondary side output end of the first chiller; The second cooling tower is connected to the primary side of the second chiller, and the secondary side of the second chiller is connected to the primary side of the spray heat exchange component; a fourth control valve is connected in parallel between the primary side output end of the second chiller and the secondary side input end of the second chiller, and a third control valve is connected in parallel between the primary side input end of the second chiller and the secondary side output end of the second chiller.

7. The system according to claim 1, characterized in that The plurality of cold plate assemblies and the chip assemblies are alternately stacked; Any cold plate assembly includes a first cold plate, a heat sink, and a second cold plate stacked in sequence; A first flow channel is provided on one side of the first cold plate close to the heat sink, a second flow channel is provided on one side of the second cold plate close to the heat sink, a liquid inlet and a liquid outlet are provided on the heat sink, the liquid inlet is connected to the inlet of the first flow channel and the inlet of the second flow channel at the same time, and the liquid outlet is connected to the outlet of the first flow channel and the outlet of the second flow channel at the same time; The liquid inlet pipe port is connected to the plate heat exchange component, and the liquid outlet pipe port is connected to the spray heat exchange component.

8. The system according to claim 7, characterized in that A first guide groove is provided on a side of the first cold plate away from the heat sink, and a second guide groove is provided on a side of the second cold plate away from the heat sink; the first guide groove fits with a first guide strip on the chip assembly, and the second guide groove fits with a second guide strip on the chip assembly; An eleventh control valve is provided at the position where the plate heat exchange component is connected to the liquid inlet pipe port, and a twelfth control valve is provided at the position where the spray heat exchange component is connected to the liquid outlet pipe port.

9. A cabinet for a data center, characterized in that: include: A chip assembly, and a cold plate assembly in a liquid cooling system as claimed in any one of claims 1 to 8.

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