A display panel, a manufacturing method thereof, and a display device

Abstract

The present invention discloses a display panel, a manufacturing method thereof, and a display device. The display panel includes: a substrate; a first planarization layer located on one side of the substrate; at least one second planarization layer located on a surface of the first planarization layer away from the substrate, and a positive projection of an opening region of at least some pixels on the substrate falls within a positive projection of the second planarization layer on the substrate; a raised structure located between opening regions of two adjacent pixels in the first planarization layer, the raised structure at least partially surrounds at least some of the opening regions and is substantially parallel to a contour of the corresponding opening region; and an electrode layer, the electrode layer is located on a side of the second planarization layer away from the first planarization layer, and a positive projection of the electrode layer on the substrate is located within a positive projection of the second planarization layer on the substrate.

Description

Technical Field

[0001] The present invention relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] In an electroluminescent display panel, an electrode layer is easily affected by the manufacturing processes of other related film layers, resulting in unevenness of the electrode layer, thereby causing optical defects in the electroluminescent display panel. Summary of the Invention

[0003] Embodiments of the present invention provide a display panel, a manufacturing method thereof, and a display device, so as to solve the problem of optical defects existing in the prior art.

[0004] In a first aspect, to solve the above technical problem, an embodiment of the present invention provides a display panel, including:

[0005] A substrate;

[0006] A first planarization layer, located on one side of the substrate;

[0007] At least one second planarization layer, located on a surface of the first planarization layer away from the substrate, and a positive projection of an opening region of at least some pixels on the substrate falls within a positive projection of the second planarization layer on the substrate;

[0008] A raised structure, located between opening regions of two adjacent pixels in the first planarization layer, the raised structure at least partially surrounds at least some of the opening regions, and is substantially parallel to a contour of the corresponding opening region;

[0009] An electrode layer, the electrode layer is located on a side of the second planarization layer away from the first planarization layer, and a positive projection of the electrode layer on the substrate is located within a positive projection of the second planarization layer on the substrate.

[0010] In a possible implementation, an area of the second planarization layer is less than or equal to an area of the first planarization layer.

[0011] In a possible implementation, the display panel further includes:

[0012] A blocking structure, located on a side of the raised structure away from the substrate, and a top of the raised structure is indented relative to the blocking structure.

[0013] In a possible implementation, a material of the blocking structure is an inorganic material.

[0014] In a possible implementation, a top surface of the second planarization layer farthest from the substrate is lower than a top surface of the blocking structure.

[0015] In a possible implementation, the height difference between the top surface of the second flat layer farthest from the substrate and the top surface of the blocking structure is greater than 0.3 um.

[0016] In a possible implementation, the thickness range of the blocking structure is 0.1 - 0.3 um.

[0017] In a possible implementation, there is a first spacing between the protruding structure and the at least one second flat layer.

[0018] In a possible implementation, the value range of the first spacing is 4 - 6 um.

[0019] In a possible implementation, the display panel further includes:

[0020] A light-emitting layer, located on the side of the electrode layer away from the substrate, and the light-emitting layer is blocked by the protruding structure and is distributed in the opening areas corresponding to different pixels.

[0021] In a possible implementation, the cross-sectional shape of the protruding structure is trapezoidal.

[0022] In a possible implementation, the thickness ranges of the protruding structure, the first flat layer, and the second flat layer are all 1.5 - 2.5 um.

[0023] In a possible implementation, the total thickness range of the at least one second flat layer is 0.4 - 0.5 um.

[0024] In a possible implementation, the display panel has a display area and a non-display area surrounding the display area;

[0025] The part of the electrode layer located in the non-display area has a plurality of openings for discharging moisture in the second flat layer.

[0026] In a second aspect, an embodiment of the present invention provides a method for manufacturing a display panel, including:

[0027] Providing a substrate;

[0028] Forming a raw flat layer on one side of the substrate;

[0029] Patterning the raw flat layer to form a first flat layer and a protruding structure between the opening areas of two adjacent pixels in the first flat layer; wherein, the protruding structure at least partially surrounds at least part of the opening area and is substantially parallel to the contour of the corresponding opening area;

[0030] Form at least one flat layer with fluidity in an opening area corresponding to a surface of the first flat layer away from the substrate;

[0031] After the at least one flat layer with fluidity levels, cure the leveled flat layer to obtain at least one cured flat layer, and the orthographic projection of the opening areas of at least some pixels on the substrate falls within the orthographic projection of the second flat layer on the substrate;

[0032] Form an electrode layer on a surface of the at least one second flat layer away from the first flat layer, and the orthographic projection of the electrode layer on the substrate is located within the orthographic projection of the second flat layer on the substrate.

[0033] A possible implementation manner, after forming the first flat layer and the raised structure between the opening areas of two adjacent pixels in the first flat layer, further includes:

[0034] Form an amorphous silicon layer on a side of the raised structure away from the substrate;

[0035] Etch the amorphous silicon layer at an etching rate less than a speed threshold to obtain a blocking structure on a side of the raised structure away from the first flat layer; wherein, the raised structure indents relative to the blocking structure;

[0036] Or, etch the amorphous silicon layer with an etching gas having a concentration less than a concentration threshold to obtain the blocking structure.

[0037] A possible implementation manner, forming at least one flat layer with fluidity in an opening area corresponding to a surface of the first flat layer away from the substrate, includes:

[0038] After obtaining the blocking structure, form at least one of the flat layers with fluidity in an opening area corresponding to a surface of the first flat layer away from the substrate.

[0039] A possible implementation manner, forming at least one flat layer with fluidity in an opening area corresponding to a surface of the first flat layer away from the substrate, and curing the leveled flat layer to obtain at least one second flat layer, includes:

[0040] After forming the raised structure, form the first layer of the flat layer with fluidity in an opening area corresponding to a surface of the first flat layer away from the substrate, and cure the first layer of the flat layer with fluidity to obtain the first layer of the second flat layer;

[0041] After obtaining the blocking structure, on the surface of the second flat layer of the first layer away from the substrate, a second flat layer with fluidity is formed, and the second flat layer with fluidity is cured to obtain a second second flat layer.

[0042] In a third aspect, an embodiment of the present invention provides a display device, including the display panel as described in the third aspect. Description of the Drawings

[0043] Figure 1 It is a schematic structural diagram of a display panel in the related art;

[0044] Figure 2 Shown is provided by an embodiment of the present invention Figure 1 The corresponding schematic diagram of the display panel surface;

[0045] Figure 3 Another schematic structural diagram of a display panel in the related art;

[0046] Figure 4 It is Figure 3 The corresponding partial physical diagram;

[0047] Figure 5 Another schematic structural diagram of a display panel in the related art;

[0048] Figure 6 It is Figure 5 The corresponding partial physical diagram;

[0049] Figure 7 It is the display effect diagram of the display panel in the related art;

[0050] Figure 8 It is a schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0051] Figure 9 It is a top view of the pixels corresponding to the opening area in an array substrate provided by an embodiment of the present invention;

[0052] Figure 10 It is another top view of the pixels corresponding to the opening area in an array substrate provided by an embodiment of the present invention;

[0053] Figure 11 It is another schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0054] Figure 12 It is provided by an embodiment of the present invention Figure 11 The corresponding partial physical diagram;

[0055] Figure 13 It is another schematic structural diagram of a display panel provided by an embodiment of the present invention;

[0056] Figure 14 For the embodiments of the present invention Figure 13 The corresponding partial physical diagram;

[0057] Figure 15 Schematic structural diagram of another display panel provided by the embodiments of the present invention;

[0058] Figure 16 Schematic structural diagram of another display panel provided by the embodiments of the present invention;

[0059] Figure 17 Schematic structural diagram of another display panel provided by the embodiments of the present invention;

[0060] Figure 18 Display effect diagram of a display panel provided by the embodiments of the present invention;

[0061] Figure 19 Top view of the electrode layer in the non-display area of the display panel provided by the embodiments of the present invention;

[0062] Figure 20 Flow chart of the manufacturing method of the display panel provided by the embodiments of the present invention. Detailed implementation manners

[0063] The embodiments of the present invention provide a display panel, a manufacturing method thereof, and a display device, so as to solve the problem of optical defects in the prior art.

[0064] To make the above objects, features, and advantages of the present invention more obvious and understandable, the present invention will be further described below with reference to the accompanying drawings and embodiments. However, the exemplary embodiments can be implemented in various forms and should not be construed as limited to the embodiments described herein; on the contrary, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings represent the same or similar structures, so the repeated description thereof will be omitted. The words expressing positions and directions in the present invention are all described by taking the drawings as examples, but can be changed according to needs, and all the changes made are included in the protection scope of the present invention. The drawings of the present invention are only used to illustrate the relative positional relationship and do not represent the true proportion.

[0065] It should be noted that specific details are set forth in the following description to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below. The subsequent description of the specification is a preferred embodiment for implementing the present application, but the description is for the purpose of explaining the general principles of the present application and is not intended to limit the scope of the present application. The protection scope of the present application shall be defined by the appended claims.

[0066] Please refer to Figure 1 which is a schematic structural diagram of a display panel in the related art.

[0067] In Figure 1 the display panel includes a driving circuit layer 10, a planar layer 20 laminated on the driving circuit layer 10, spacer columns 30 and an anode 40 on the side of the planar layer 20 away from the driving circuit layer 10. During the formation of the spacer columns 30, since an etching process is required, the surface of the planar layer 20 is often not flat, which results in the surface of the anode 40 formed on the surface of the spacer columns 30 being uneven after the formation of the spacer columns 30, thereby causing optical defects in the display panel including the above display panel, such as Figure 2 shown in the schematic diagram of the surface of the display panel provided by the embodiment of the present invention. Figure 1 As can be seen from Figure 2 the surface of the display panel is uneven, resulting in optical defects.

[0068] It should be understood that the film layer structure of the driving circuit layer is not limited to Figure 1 the structure shown, and it will change with the driving circuit provided therein.

[0069] Please refer to Figure 3 and Figure 4 , Figure 3 which is a schematic structural diagram of another display panel in the related art. Figure 4 is Figure 3 the corresponding partial physical diagram. In Figure 3 and Figure 4Part of the structure in the driving circuit layer 10 is shown. The driving circuit layer 10 includes the film layer where the first gate 11 is located, the first organic layer 12 on one side of the film layer where the first gate 11 is located, the film layer where the second gate 13 is located on the side of the first organic layer 12 away from the first gate 11, the second organic layer 14 covering the first gate 11 and the second gate 13, and the film layer where the source-drain electrode 15 is located on the side of the second organic layer 14 away from the second gate 13; a planarization layer 20 is provided on the side of the film layer where the source-drain electrode 15 is located away from the second gate 13. The planarization layer 20 is an inorganic layer, and an anode 40 is provided on the side of the planarization layer 20 away from the source-drain electrode 15. Since there is a stacked structure as described above below the source-drain electrode 15, and the above-mentioned first organic layer 13, second organic layer 14, and planarization layer 20 are all organic layers, and the organic layer has fluidity, the first gate 11, second gate 13, and source-drain electrode 15 bulge, resulting in a thinner thickness of the organic layer at the corresponding positions than at other positions, and sometimes even 0. This will cause the source-drain electrode 15 and the anode 40 to possibly short-circuit. Even if there is no short circuit at the time of leaving the factory, problems such as aging and burning will occur over time.

[0070] Please refer to Figure 5 Figure 5 Schematic diagram of the structure of another display panel in the related art Figure 6 is Figure 5 corresponding partial physical diagram. In Figure 5 the driving circuit layer 10 includes a plurality of source-drain electrodes 15 (the remaining related film layers of the thin-film transistor are not shown). When forming the planarization layer 20 on the side of the plurality of source-drain electrodes 15 away from the substrate (not shown), since there is a gap between two adjacent source-drain electrodes 15, a concave portion as shown in Figure 5 appears at the corresponding position of the planarization layer 20. This causes the anode 40 to also be concave at the corresponding position of the above concave portion when forming the anode 40 on the side of the planarization layer 20 away from the substrate, resulting in unevenness of the anode 40, and further making the display panel including the above display panel prone to optical defects. Please refer to Figure 7 is the display effect diagram of the display panel in the related art. It can be seen from the figure that due to the low flatness of the planarization layer 20, there are many lines in the display of the display panel, resulting in optical defects.

[0071] To solve the above problems, the embodiments of the present invention provide a display panel, a manufacturing method thereof, and a display device. Specific descriptions will be given below with reference to the accompanying drawings.

[0072] Please refer to Figure 8 and Figure 9 , Figure 8 is a schematic diagram of the structure of a display panel provided by an embodiment of the present invention. Figure 9A top view of the pixels corresponding to the opening area in the array substrate provided by the embodiment of the present invention. The display panel includes:

[0073] A substrate 1;

[0074] A first planarization layer 2, located on one side of the substrate 1; there is also a driving circuit layer 10 between the substrate 1 and the first planarization layer 2, and the film layers in the driving circuit layer 10 vary with the structural form of the driving circuit, and are not specifically limited.

[0075] In some embodiments, the thickness of the first planarization layer 2 can be set in the range of 2.2 to 3 um.

[0076] By setting the thickness of the first planarization layer 2 in the range of 2.2 to 3 um, the first planarization layer 2 can have a relatively large thickness, so that even if there is a stacked structure under the source and drain electrodes in the display panel, or there is a gap between adjacent source and drain electrodes, the first planarization layer 2 can still have good flatness.

[0077] At least one second planarization layer 3, located on the surface of the first planarization layer 2 away from the substrate 1, and the orthographic projection of the opening area K of at least some pixels on the substrate 1 falls within the orthographic projection of the second planarization layer 3 on the substrate 1; as Figure 8 shown, the orthographic projection of the opening area K of the pixel on the substrate 1 completely coincides with the orthographic projection of the second planarization layer 3 on the substrate 1, or as Figure 9 shown, the orthographic projection of the opening area K of the pixel on the substrate 1 is located within the orthographic projection of the second planarization layer 3 on the substrate 1.

[0078] In some embodiments, the material used for the second planarization layer 3 is an organic material. By setting the material used for the second planarization layer 3 as an organic material, when fabricating the second planarization layer, the fluidity of the organic material can be used to level the low-lying positions on the previous film layer, thereby improving the flatness of the corresponding film layer.

[0079] In some embodiments, the first planarization layer 2 can use the same organic material as the second planarization layer 3. In other embodiments, the second planarization layer 3 and the first planarization layer 2 can use different organic materials, for example, the first planarization layer 2 can use an organic material that is more resistant to etching than the second planarization layer 3.

[0080] A raised structure 4a, located between the opening areas K of two adjacent pixels in the first planarization layer 2, the raised structure 4a at least partially surrounds at least part of the opening area K, and is substantially parallel to the contour of the corresponding opening area K (as Figure 9 shown). The area of the second planarization layer 3 is less than or equal to the area of the first planarization layer 2. The above-mentioned first planarization layer.

[0081] The electrode layer 5 is located on the side of the second flat layer 3 away from the first flat layer 2, and the orthographic projection of the electrode layer 5 on the substrate 1 is located within the orthographic projection of the second flat layer 3 on the substrate 1. As Figure 9 shown, the patterned shape corresponding to the pixel in the electrode layer 5 can be similar to the patterned shape of the second flat layer, or as Figure 10 shown to be different (i.e., the second flat layer 3 is provided as a whole layer), Figure 10 which is a top view of the pixel corresponding to the opening area in another array substrate provided by an embodiment of the present invention.

[0082] As Figure 8 shown, for the case where the surface of the first flat layer 2 becomes uneven during the process of forming the raised structure 4a by etching on the surface of the first flat layer 2; or as Figure 11 shown, Figure 11 which is a schematic structural diagram of another display panel provided by an embodiment of the present invention. For the case where the first flat layer 2 becomes uneven due to the gap between adjacent source-drain electrodes 15 in the display panel, by providing at least one second flat layer 3 on the surface of the first flat layer 2 away from the substrate 1, and the orthographic projection of at least part of the opening area of the pixel on the substrate 1 falls within the orthographic projection of the second flat layer 3 on the substrate 1, the flatness of the film layer carrying the electrode layer 5 can be improved by using the second flat layer 3, and the distance between the electrode layer 5 and the underlying metal film layer (such as the film layer where the source-drain electrodes are located) can be increased. Furthermore, forming the electrode layer 5 on the surface of the second flat layer 3 away from the first flat layer 2 has a high flatness, preventing short circuits or aging burns between the electrode layer 5 and the underlying metal layer, thereby improving the problem of optical defects. The physical effect diagram corresponding to the Figure 11 shown scheme is as Figure 12 shown, Figure 12 which is a partial physical diagram provided by an embodiment of the present invention corresponding to Figure 11 .

[0083] As Figure 13 shown, Figure 13 which is a schematic structural diagram of another display panel provided by an embodiment of the present invention. For Figure 5 shown, in the driving circuit layer 10, there is a stacked structure under the source-drain electrode 15, causing the source-drain electrode 15 to tilt, resulting in the situation where the flat layer 20 (equivalent to the first flat layer 2 in the embodiment of the present invention) on the source-drain electrode 15 covers the source-drain electrode 15 with a relatively thin thickness in some areas. By forming at least one second flat layer 3 on the side of the first flat layer 2 away from the substrate 1, the distance between the source-drain electrode 15 (metal layer) and the electrode layer 5 in Figure 5 the driving circuit layer 10 can be increased, keeping it within the range of a safe distance, thereby effectively preventing short circuits between the electrode layer 5 and the underlying metal layer and preventing the problem of aging burns. The physical effect diagram corresponding to the Figure 13 shown scheme is asFigure 14 As shown Figure 14 This is the partial physical diagram provided by the embodiment of the present invention Figure 13 corresponding to it

[0084] In the embodiment provided by the present invention, by providing at least one second flat layer 3 on the surface of the first flat layer 2 away from the substrate 1, and the orthographic projection of the opening area of at least part of the pixels on the substrate 1 falls within the orthographic projection of the second flat layer 3 on the substrate 1, the flatness of the film layer of the carrier electrode layer 5 can be improved by using the second flat layer 3, and the distance between the electrode layer 5 and the underlying metal film layer (such as the film layer where the source and drain electrodes are located) can be increased. Furthermore, the electrode layer 5 formed on the surface of the second flat layer 3 away from the first flat layer 2 has a high flatness, preventing short circuits or aging burns between the electrode layer 5 and the underlying metal layer, thereby improving the problem of optical defects

[0085] Please refer to Figure 15 This is the structural schematic diagram of another display panel provided by the embodiment of the present invention. The display panel further includes

[0086] Blocking structure 4b, the blocking structure 4b is located on the side of the convex structure 4a away from the substrate 1, and the top of the convex structure 4a is indented relative to the blocking structure 4b. The material used for the blocking structure 4b can be an inorganic material, such as amorphous silicon. The convex structure 4a and the blocking structure 4b can form an isolation column 4

[0087] In some embodiments, the top surface of the second flat layer 3 farthest from the substrate 1 is lower than the top surface of the blocking structure 4b

[0088] Such as Figure 15 As shown, the height difference Δh between the top surface of the second flat layer 2 farthest from the substrate 1 and the top surface of the blocking structure 4b is greater than 0.3um. The thickness h1 range of the blocking structure 4b is 0.1 - 0.3um

[0089] By setting the top surface of the second flat layer 3 farthest from the first flat layer 2 to be lower than the top surface of the blocking structure 4b, it is convenient to block the light-emitting layers 6 of different pixels

[0090] The thickness h2 ranges of the convex structure 4a, the first flat layer 2, and the second flat layer 3 are all 1.5 - 2.5um

[0091] In some embodiments, the edge of the top surface of the convex structure 4a is indented relative to the edge of the blocking structure 4b by at least 0.2um

[0092] Please refer to Figure 16 This is the structural schematic diagram of another display panel provided by the embodiment of the present invention. The display panel further includes

[0093] The light-emitting layer 6 is located on the side of the electrode layer 5 away from the substrate 1, and the light-emitting layer 6 is blocked by the convex structure 4a and is distributed in the opening regions K corresponding to different pixels. The above-mentioned convex structure 4a and the corresponding blocking structure 4b can form an isolation column 4. Due to different processes for forming the light-emitting layer 6, the composition of the isolation column 4 is also different. For example, when using an evaporation process to form the light-emitting layer, the isolation column 4 can only include the convex structure 4a. When using a sputtering process to form the light-emitting layer 6, the isolation column 4 needs to be composed of the convex structure 4a and the blocking structure 4b.

[0094] In the embodiment provided by the present invention, by setting the top of the convex structure 4a to be indented relative to the blocking structure 4b, the light-emitting layer can be disconnected at the position where the top surface edge of the convex structure 4a is indented relative to the blocking structure 4b, thereby blocking the light-emitting layers of adjacent pixels and preventing color mixing.

[0095] Such as Figure 15 The cross-sectional shape of the convex structure 4a shown is trapezoidal.

[0096] By setting the convex structure 4a to be trapezoidal, it is easy to make the top surface edge of the convex structure 4a indented relative to the blocking structure 4b.

[0097] Please refer to Figure 15 Assume Figure 15 After the convex structure 4a is formed in, a layer of amorphous silicon layer is deposited on the side of the convex structure 4a away from the substrate 1, and the amorphous silicon layer is etched to form the blocking structure 4b. If the thickness range of the above amorphous silicon layer is set to 0.1 - 0.3 um, then when etching the amorphous silicon layer, due to its small thickness, the etching of the first flat layer 2 is small. If it is small enough not to affect the thickness of the first flat layer 2, the second flat layer 3 can be directly formed without forming the second flat layer 3; if the etching still affects the thickness of the first flat layer 2, the influence is relatively reduced. Then, after forming the isolation column 4, the thickness of the second flat layer 3 formed on the surface of the first flat layer 2 can be set thinner, thereby saving materials and improving production efficiency.

[0098] If Figure 15In the second flat layer 3, after the convex structure 4a is formed, a second flat layer 3 is formed on the side of the first flat layer 2 away from the substrate 1. Then, an amorphous silicon layer with a thickness of 0.1 - 0.3 um is deposited on the side of the second flat layer 3 away from the driving circuit layer 1. The amorphous silicon layer is etched to form the blocking structure 4b. Since the thickness of the amorphous silicon layer is relatively thin, the influence of etching on the flatness of the second flat layer 3 can be reduced. If the influence is small enough to be negligible, there is no need to deposit another second flat layer 3. If the influence on the flatness of the second flat layer 3 cannot be ignored, another second flat layer 3 can be deposited after the blocking structure 4b of the isolation column 4 is formed. Since the flatness of the first deposited second flat layer 3 is less affected by the etching for forming the blocking structure 4b, the thickness of the second flat layer 3 deposited again can be set smaller.

[0099] By setting the thickness of the blocking structure 4b to 0.1 - 0.3 um, the blocking structure 4b can have a relatively small thickness, so that the etching of the flat layer formed before the formation of the blocking structure 4b can be reduced when the blocking structure 4b is formed.

[0100] Please refer to Figure 17 which is a schematic structural diagram of another display panel provided by an embodiment of the present invention.

[0101] As Figure 15 or Figure 17 shown, the top surface of the second flat layer 3, which is the farthest from the substrate 1 in the display panel, is lower than the top surface of the blocking structure 4b.

[0102] As Figure 15 shown in, a second flat layer 3 is provided between the first flat layer 2 and the electrode layer 5 in the display panel. This second flat layer 3 is the second flat layer 3 that is the farthest from the first flat layer 2. Therefore, Figure 15 the top surface of the second flat layer 3 shown is set to be lower than the top surface of the blocking structure 4b.

[0103] As Figure 17 shown in, two second flat layers 3 are provided between the first flat layer 2 and the electrode layer 5 in the display panel. The top surface of the second flat layer 3 that is the farthest from the first flat layer 2 is set to be lower than the top surface of the blocking structure 4b.

[0104] Please continue to refer to Figure 17 , there is a first distance d' between the isolation column 4 and at least one second flat layer 3, and the value range of the first distance d' is 4 - 6 um.

[0105] By setting the first distance d' between the isolation column 4 and at least one second flat layer 3, a step difference can be formed in the isolation column to block the light-emitting layer material deposited thereon subsequently and prevent color mixing.

[0106] Please refer toFigure 18 A display effect diagram of a display panel provided by an embodiment of the present invention, Figure 17 The display panel in the embodiment uses the display panel provided by the present invention. Figure 18 It can be seen that the display panel does not show Figure 7 The texture shown, Figure 7 The optical defects in the image have been greatly improved.

[0107] See also Figure 19 A top view of an electrode layer in a non-display area of a display panel is provided for an embodiment of the present invention.

[0108] The display panel has a display area ( Figure 19 The electrode layer 5 has a plurality of openings K' in the portion located in the non-display area, and the openings K' are used to discharge the water vapor in the second planar layer 3. Figure 19 As shown, the orthographic projection of the opening K' on the base substrate may be a square, a rectangle, or a circle, and the specific shape is not limited here.

[0109] By providing a plurality of openings K' in the portion of the electrode layer 5 located in the non-display area, water vapor intruding into the second planar layer 3 can be discharged through the openings K', thereby preventing water vapor from intruding into the display area and causing display defects.

[0110] Based on the same inventive concept, an embodiment of the present invention provides a method for manufacturing a display panel. The structure of the display panel manufactured by the manufacturing method is as described above, and the repeated parts will not be repeated. Please refer to Figure 20 The preparation method comprises:

[0111] Step S1: providing a substrate;

[0112] Step S2: forming an original flat layer on one side of the substrate;

[0113] Step S3: patterning the original flat layer to form a first flat layer and a convex structure located between the opening areas of two adjacent pixels in the first flat layer; wherein the convex structure at least partially surrounds at least a portion of the opening area and is substantially parallel to the contour of the corresponding opening area;

[0114] Step S4: forming at least one flat layer with fluidity in the opening area corresponding to the surface of the first flat layer on one side away from the substrate;

[0115] Step S5: after at least one layer of fluid flat layer is leveled, the leveled flat layer is cured to obtain at least one second flat layer, and the orthographic projection of the opening area of at least part of the pixels on the base substrate falls within the orthographic projection of the second flat layer on the base substrate;

[0116] Step S6: Form an electrode layer on the surface of at least one second flat layer away from the first flat layer, and the orthographic projection of the electrode layer on the substrate is located within the orthographic projection of the second flat layer on the substrate.

[0117] A possible implementation manner, after forming the first flat layer and the raised structure located between the opening regions of two adjacent pixels in the first flat layer, further includes:

[0118] On the side of the raised structure away from the substrate, form an amorphous silicon layer; etch the amorphous silicon layer at an etching rate less than the velocity threshold to obtain a blocking structure located on the side of the raised structure away from the first flat layer; wherein, the raised structure is indented relative to the blocking structure;

[0119] Or, etch the amorphous silicon layer with an etching gas having a concentration less than the concentration threshold to obtain the blocking structure.

[0120] By etching the amorphous silicon layer with an etching gas having a concentration less than the concentration threshold, the etching of the film layer that has been formed before forming the blocking structure can be reduced, and the flatness of the corresponding film layer can be improved.

[0121] For example, if the blocking structure is formed immediately after forming the raised structure, the etching of the second flat layer can be reduced, and the flatness of the second flat layer can be improved; for another example, after forming the raised structure, deposit the first layer of the second flat layer on the side of the first flat layer away from the substrate, then deposit the amorphous silicon layer on the side of the first layer of the second flat layer away from the substrate, and etch the amorphous silicon layer with an etching gas having a concentration less than the concentration threshold to obtain the blocking structure, which can reduce the etching of the first layer of the second flat layer and improve the flatness of the second flat layer.

[0122] In some embodiments, forming at least one flat layer with fluidity in the opening region corresponding to the surface of the first flat layer away from the substrate includes:

[0123] After obtaining the blocking structure, form at least one flat layer with fluidity in the opening region corresponding to the surface of the first flat layer away from the substrate.

[0124] In other embodiments, forming at least one flat layer with fluidity in the opening region corresponding to the surface of the first flat layer away from the substrate, and curing the leveled flat layer to obtain at least one second flat layer, includes:

[0125] After forming the raised structure, form the first layer of the flat layer with fluidity in the opening region corresponding to the surface of the first flat layer away from the substrate, and cure the first layer of the flat layer with fluidity to obtain the first layer of the second flat layer;

[0126] After obtaining the blocking structure, on the surface of the second flat layer of the first layer away from the substrate, a second flat layer with fluidity is formed, and the second flat layer with fluidity is cured to obtain a second flat layer of the second layer.

[0127] Based on the same inventive concept, an embodiment of the present invention provides a display device, including the display panel as described above.

[0128] The display device may be a liquid crystal display, a liquid crystal display screen, a liquid crystal television, an OLED display, an OLED display screen, an OLED television, or other display devices, or may also be a mobile device such as a mobile phone, a tablet computer, or a notebook.

[0129] Although the preferred embodiments of the present invention have been described, those skilled in the art can make additional changes and modifications to these embodiments once they learn the basic creative concept. Therefore, the appended claims are intended to be construed to include the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0130] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these modifications and variations.

Claims

1. A display panel, characterized in that, Comprising: A substrate; A first flat layer located on one side of the substrate; At least one second flat layer located on the surface of the first flat layer away from the substrate, and the orthographic projection of the opening regions of at least some of the pixels on the substrate falls within the orthographic projection of the second flat layer on the substrate; A raised structure located between the opening regions of two adjacent pixels in the first flat layer, the raised structure at least partially surrounding at least some of the opening regions and being substantially parallel to the contour of the corresponding opening region; wherein, the raised structure is provided on the same layer and made of the same material as the first flat layer; An electrode layer located on the side of the second flat layer away from the first flat layer, and the orthographic projection of the electrode layer on the substrate is located within the orthographic projection of the second flat layer on the substrate.

2. The display panel according to claim 1, wherein The area of the second flat layer is less than or equal to the area of the first flat layer.

3. The display panel according to claim 1, characterized in that, The material used for the second flat layer is an organic material.

4. The display panel according to claim 1, wherein Further comprising: A blocking structure located on the side of the raised structure away from the substrate, with the top of the raised structure indented relative to the blocking structure.

5. The display panel according to claim 4, characterized in that The material used for the blocking structure is an inorganic material.

6. The display panel according to claim 4, wherein The top surface of the second flat layer furthest from the substrate is lower than the top surface of the blocking structure.

7. The display panel according to claim 6, wherein The height difference between the top surface of the second flat layer furthest from the substrate and the top surface of the blocking structure is greater than 0.3 um.

8. The display panel according to claim 4, wherein The thickness range of the blocking structure is 0.1 - 0.3 um.

9. The display panel according to claim 1, characterized in that, There is a first spacing between the raised structure and the at least one second flat layer.

10. The display panel according to claim 9, wherein The value range of the first spacing is 4 - 6 um.

11. The display panel according to any one of claims 1-10, characterized in that, Further comprising: A light-emitting layer located on the side of the electrode layer away from the substrate, and the light-emitting layer is blocked by the raised structure and distributed in the opening regions corresponding to different pixels.

12. The display panel according to any one of claims 1-10, characterized in that, The cross-sectional shape of the raised structure is trapezoidal.

13. The display panel according to any one of claims 1-10, characterized in that, The thickness ranges of the raised structure, the first flat layer, and the second flat layer are all 1.5 - 2.5 um.

14. The display panel according to any one of claims 1-10, characterized in that, The display panel has a display area and a non-display area surrounding the display area; The portion of the electrode layer located in the non-display area has a plurality of openings for discharging moisture in the second flat layer.

15. A method for manufacturing a display panel, characterized in that, Comprising: Providing a substrate; Forming a raw flat layer on one side of the substrate; Patterning the raw flat layer to form a first flat layer and a raised structure located between the opening regions of two adjacent pixels in the first flat layer; wherein, the raised structure at least partially surrounds at least some of the opening regions and is substantially parallel to the contour of the corresponding opening region; Forming at least one flat layer with fluidity in the opening regions on the surface of the first flat layer away from the substrate; After the at least one flat layer with fluidity levels, curing the leveled flat layer to obtain at least one second flat layer, and the orthographic projection of the opening regions of at least some of the pixels on the substrate falls within the orthographic projection of the second flat layer on the substrate. An electrode layer is formed on a surface of the at least one second flat layer away from the first flat layer, and a positive projection of the electrode layer on the substrate is located within a positive projection of the second flat layer on the substrate.

16. The manufacturing method according to claim 15, wherein After forming the first flat layer and the convex structure located between the opening regions of two adjacent pixels in the first flat layer, the method further includes: forming an amorphous silicon layer on a side of the convex structure away from the substrate; etching the amorphous silicon layer at an etching rate less than a speed threshold to obtain a blocking structure located on a side of the convex structure away from the first flat layer; wherein the convex structure is indented relative to the blocking structure; alternatively, etching the amorphous silicon layer with an etching gas having a concentration less than a concentration threshold to obtain the blocking structure.

17. The manufacturing method according to claim 16, characterized in that, Forming at least one flat layer with fluidity in an opening region corresponding to a surface of the first flat layer away from the substrate includes: After obtaining the blocking structure, forming at least one flat layer with fluidity in an opening region corresponding to a surface of the first flat layer away from the substrate.

18. The manufacturing method according to claim 16, characterized in that, Forming at least one flat layer with fluidity in an opening region corresponding to a surface of the first flat layer away from the substrate, and curing the leveled flat layer to obtain at least one second flat layer, includes: After forming the convex structure, forming a first flat layer with fluidity in an opening region corresponding to a surface of the first flat layer away from the substrate, and curing the first flat layer with fluidity to obtain a first second flat layer; After obtaining the blocking structure, forming a second flat layer with fluidity on a surface of the first second flat layer away from the substrate, and curing the second flat layer with fluidity to obtain a second second flat layer.

19. A display device, characterized in that, including the display panel according to any one of claims 1-14.

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