Display device

Abstract

A display device of one embodiment includes a substrate, a plurality of display elements over the substrate, a first electrode, a second electrode facing the first electrode, and an organic layer that emits light in accordance with a voltage between the first electrode and the second electrode, a partition wall between adjacent display elements, a metal layer along the partition wall, and an inorganic layer formed of an inorganic material covering the display elements, the partition wall, and the metal layer. The partition wall includes a first portion and a second portion positioned below the first portion and having a smaller width than the first portion. The metal layer covers a first region of a side surface of the second portion, and the inorganic layer covers a second region of the side surface between the first region and the first portion.

Description

[0001] Related Reference of Associated Application

[0002] This application is based on Japanese Patent Application No. 2021-093677 filed on June 3, 2021, the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] Embodiments of the present application relate to a display device. BACKGROUND

[0004] In recent years, a display device using an organic light emitting diode (OLED) as a display element has been practically used. The display element has a first electrode, a second electrode, and an organic layer disposed between the electrodes. The organic layer includes a light emitting layer that emits light according to a voltage between the first electrode and the second electrode.

[0005] Generally, the organic layer has low water resistance. If water reaches the organic layer for some reason, it can be a factor that causes a decrease in luminance of the display element at the time of light emission, or the like, resulting in a decrease in display quality. SUMMARY

[0006] According to an embodiment, a display device includes a substrate, a plurality of display elements disposed above the substrate, each of the display elements including a first electrode, a second electrode facing the first electrode, and an organic layer that emits light according to a voltage between the first electrode and the second electrode, a barrier between adjacent ones of the display elements, a metal layer along the barrier, and an inorganic layer formed of an inorganic material covering the display elements, the barrier, and the metal layer. The barrier has a first portion and a second portion below the first portion and having a smaller width than the first portion. The metal layer covers a first region of a side surface of the second portion, and the inorganic layer covers a second region of the side surface between the first region and the first portion.

[0007] According to this configuration, a display device that can improve display quality can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 FIG. 1 is a diagram illustrating an example of a configuration of a display device according to an embodiment.

[0009] Figure 2 FIG. 2 is a diagram illustrating an example of a layout of a sub-pixel according to an embodiment.

[0010] Figure 3 FIG. 3 is a diagram illustrating a cross-sectional view of a display device along a III-III line of FIG. 1. Figure 2

[0011] Figure 4 ​is a cross-sectional view showing an example of a layer structure of an organic layer that can be applied to an embodiment.

[0012] Figure 5 is an enlarged schematic cross-sectional view of the vicinity of the partition wall in Figure 3 .

[0013] Figure 6 is a schematic plan view showing an example of the shape of a metal layer of an embodiment.

[0014] Figure 7 is a schematic cross-sectional view of the display device along the VII-VII line in Figure 6 .

[0015] Figure 8 is a view showing a manufacturing process for obtaining a partition wall and a metal layer of an embodiment.

[0016] Figure 9 is a view showing a manufacturing process after Figure 8 .

[0017] Figure 10 is a view showing a manufacturing process after Figure 9 .

[0018] Figure 11 is a view showing a manufacturing process for obtaining a connection portion of an embodiment.

[0019] Figure 12 is a view showing a manufacturing process after Figure 11 .

[0020] Figure 13 is a cross-sectional view for explaining an effect of an embodiment. DETAILED DESCRIPTION

[0021] Hereinafter, an embodiment will be described with reference to the drawings.

[0022] The present application is merely an example, and it is needless to say that, for those skilled in the art, what can be easily conceived with appropriate modifications while maintaining the gist of the application is of course included in the scope of the present application. Further, the drawings are shown schematically in terms of the width, thickness, shape, and the like of each portion in order to make the explanation more clear, but are merely an example and do not limit the explanation of the present application. Further, in the present specification and each drawing, the same reference numerals are attached to constitutional elements that have the same or similar functions as those described with respect to the described drawing, and the repeated detailed explanation is appropriately omitted.

[0023] Further, in the drawings, X-axis, Y-axis, and Z-axis orthogonal to one another are shown as needed for easy understanding. The direction along the X-axis is referred to as a first direction, the direction along the Y-axis is referred to as a second direction, and the direction along the Z-axis is referred to as a third direction. The plane defined by the X-axis and the Y-axis is referred to as an X-Y plane, and the plane defined by the X-axis and the Z-axis is referred to as an X-Z plane. The observation of the X-Y plane is referred to as plan view.

[0024] The display device of the present embodiment is an organic electroluminescent display device provided with an organic light emitting diode (OLED) as a display element, and can be mounted on a television, a personal computer, a car-mounted device, a tablet terminal, a smartphone, a portable telephone terminal, or the like.

[0025] Figure 1 is a view showing a configuration example of the display device DSP of the present embodiment. The display device DSP has a display region DA in which an image is displayed, and a surrounding region SA surrounding the display region DA, on an insulating substrate 10. The substrate 10 can be glass or a resin film having flexibility.

[0026] In the present embodiment, the shape of the substrate 10 in plan view is rectangular. However, the shape of the substrate 10 in plan view is not limited to a rectangle, and can be a square, a circle, or another shape such as an ellipse.

[0027] The display region DA is provided with a plurality of pixels PX arranged in a matrix shape along the first direction X and the second direction Y. The pixel PX is provided with a plurality of sub-pixels SP. In one example, the pixel PX is provided with a red sub-pixel SP1, a green sub-pixel SP2, and a blue sub-pixel SP3. In addition to the three colors of sub-pixels described above, the pixel PX can be provided with four or more sub-pixels including a white sub-pixel or another color.

[0028] The sub-pixel SP is provided with a pixel circuit 1 and a display element 20 driven by the pixel circuit 1. The pixel circuit 1 is provided with a pixel switch 2, a drive transistor 3, and a capacitor 4. The pixel switch 2 and the drive transistor 3 are, for example, switching elements constituted by thin film transistors.

[0029] In the pixel switch 2, the gate electrode is connected to a scan line GL. One of the source electrode and the drain electrode of the pixel switch 2 is connected to a signal line SL, and the other is connected to the gate electrode of the drive transistor 3 and the capacitor 4. In the drive transistor 3, one of the source electrode and the drain electrode is connected to a power supply line PL and the capacitor 4, and the other is connected to the anode of the display element 20. The display element 20 is an organic light emitting diode (OLED) as a light emitting element. The cathode of the display element 20 is connected to a supply line FL to which a common voltage is applied. The configuration of the pixel circuit 1 is not limited to the example shown in the drawing.

[0030] Figure 2 is a drawing showing an example of the layout of sub-pixels SP (SP1, SP2, SP3). Here, four pixels PX are focused on. In each of the pixels PX, the sub-pixels SP1, SP2, SP3 are arranged in this order in the first direction X. That is, in the display region DA, columns of a plurality of sub-pixels SP1 arranged in the second direction Y, columns of a plurality of sub-pixels SP2 arranged in the second direction Y, and columns of a plurality of sub-pixels SP3 arranged in the second direction Y are alternately arranged in the first direction X.

[0031] A rib 14 is arranged at the boundary of the sub-pixels SP1, SP2, SP3. In the example of Figure 2 , the rib 14 is in a lattice shape, and has a portion between sub-pixels SP adjacent in the first direction X and a portion between sub-pixels SP adjacent in the second direction Y. The rib 14 forms an opening OP in each of the sub-pixels SP1, SP2, SP3.

[0032] A plurality of partition walls PT is arranged on the rib 14. In the example of Figure 2 , the plurality of partition walls PT includes a plurality of partition walls PT1 parallel to the second direction Y and a plurality of partition walls PT2 parallel to the first direction X. That is, the plurality of partition walls PT is arranged in a lattice shape.

[0033] The partition walls PT1 are respectively between the sub-pixels SP1, SP2 adjacent in the first direction X, between the sub-pixels SP2, SP3 adjacent in the first direction X, and between the sub-pixels SP1, SP3 adjacent in the first direction X. That is, the partition walls PT1 are at the boundaries of sub-pixels SP of different colors.

[0034] The partition walls PT2 are respectively between two sub-pixels SP1 adjacent in the second direction Y, between two sub-pixels SP2 adjacent in the second direction Y, and between two sub-pixels SP3 adjacent in the second direction Y. That is, the partition walls PT2 are at the boundaries of sub-pixels SP of the same color. In addition, since no color mixture occurs in the sub-pixels SP of the same color, the partition walls PT2 can also be omitted.

[0035] Figure 3 is a schematic cross-sectional view of the display device DSP along the III-III line of Figure 2 . In Figure 3 , mainly the cross-sectional configuration of the sub-pixel SP2 is shown, but the sub-pixels SP1, SP3 also have the same cross-sectional configuration. In addition, as elements arranged in the sub-pixel SP2, the drive transistor 3 and the display element 20 are shown, and the illustration of other elements is omitted.

[0036] The display device DSP has, in addition to the substrate 10, the ribs 14, and the partition wall PT1 described above, the insulating layers 11, 12, 13, the first inorganic layer IL1, the second inorganic layer IL2, the resin layer RL, and the metal layer ML.

[0037] The insulating layers 11, 12, 13 are stacked in the third direction Z over the substrate 10. The insulating layers 11, 12 are formed of, for example, an inorganic material. The insulating layer 13 is formed of, for example, an organic material.

[0038] The drive transistor 3 has the semiconductor layer 30, and the electrodes 31, 32, 33. The electrode 31 corresponds to a gate electrode. One of the electrodes 32, 33 corresponds to a source electrode, and the other corresponds to a drain electrode. The semiconductor layer 30 is provided between the substrate 10 and the insulating layer 11. The electrode 31 is provided between the insulating layers 11, 12. The electrodes 32, 33 are provided between the insulating layers 12, 13, and contact the semiconductor layer 30 through contact holes that penetrate the insulating layers 11, 12.

[0039] The display element 20 has the first electrode E1, the second electrode E2, and the organic layer OR provided between the first electrode E1 and the second electrode E2. The first electrode E1 is an electrode provided per sub-pixel SP, and is sometimes referred to as a pixel electrode, a lower electrode, or an anode. The second electrode E2 is sometimes referred to as a common electrode, an upper electrode, or a cathode.

[0040] The rib 14 is provided over the insulating layer 13. The rib 14 can be formed of an organic material. The first electrode E1 is provided over the insulating layer 13, and overlaps with the opening OP. The peripheral portion of the first electrode E1 is covered with the rib 14. The first electrode E1 is electrically connected to the electrode 33 through a contact hole that penetrates the insulating layer 13. The first electrode E1 is formed of a metal material. However, the first electrode E1 can be formed of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), or can be a laminate of a transparent conductive material and a metal material.

[0041] The organic layer OR contacts the first electrode E1 through the opening OP. A part of the organic layer OR is positioned over the rib 14. The second electrode E2 covers the organic layer OR. The second electrode E2 is formed of, for example, a metal material. However, the second electrode E2 can be formed of a transparent conductive material such as ITO or IZO.

[0042] The partition wall PT1 is provided over the rib 14. Figure 2 The partition wall PT2 shown in the drawing is also provided over the rib 14. The partition walls PT1, PT2 are formed of an inorganic material in this embodiment.

[0043] The metal layer ML is provided near the root of the partition wall PT1. In this embodiment, the metal layer ML is provided in the opening OP. Figure 3In the example of FIG. 14, two metal layers ML are provided above the rib 14, and the partition wall PT1 is positioned between the metal layers ML. A metal layer ML is also provided near the root of the partition wall PT2. The metal layer ML is formed of, for example, aluminum.

[0044] The first inorganic layer IL1 covers the second electrode E2, the partition walls PT1, PT2, and the metal layer ML. The resin layer RL covers the first inorganic layer IL1. The resin layer RL is formed of, for example, an organic material (resin). The resin layer RL is thicker than the insulating layers 11, 12, 13, the rib 14, the first inorganic layer IL1, the second inorganic layer IL2, the metal layer ML, and the partition walls PT1, PT2, and thus flattens the concavo-convexities generated by the rib 14, the partition walls PT1, PT2. The second inorganic layer IL2 covers the resin layer RL. The first inorganic layer IL1, the second inorganic layer IL2, and the resin layer RL function as a sealing layer that protects the organic layer OR from moisture and the like.

[0045] The partition walls PT1, PT2, the first inorganic layer IL1, and the second inorganic layer IL2 are formed of, for example, an inorganic material such as silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiONx). The partition walls PT1, PT2, and the first inorganic layer IL1 are preferably formed of the same inorganic material from the viewpoint of adhesion between the two. Alternatively, for example, the partition walls PT1, PT2, and the first inorganic layer IL1 can be formed of inorganic materials of the same system other than silicon. In these cases, the adhesion of the partition walls PT1, PT2, and the first inorganic layer IL1 can be improved. The second inorganic layer IL2 can be formed of the same inorganic material as the partition walls PT1, PT2, and the first inorganic layer IL1 or an inorganic material of the same system as the partition walls PT1, PT2, and the first inorganic layer IL1.

[0046] Figure 4 is a cross-sectional view showing an example of a layer structure that can be applied to the organic layer OR. For example, the organic layer OR includes, in order from the first electrode E1 toward the second electrode E2, the first functional layer F1, the light-emitting layer EL, and the second functional layer F2.

[0047] In a case where the potential of the first electrode E1 is relatively higher than the potential of the second electrode E2, the first electrode E1 corresponds to the anode, and the second electrode E2 corresponds to the cathode. Alternatively, in a case where the potential of the second electrode E2 is relatively higher than the potential of the first electrode E1, the second electrode E2 corresponds to the anode, and the first electrode E1 corresponds to the cathode.

[0048] As an example, in a case where the first electrode E1 corresponds to an anode, the first functional layer F1 includes at least one of a hole injection layer, a hole transport layer, and an electron blocking layer, and the second functional layer F2 includes at least one of an electron transport layer, an electron injection layer, and a hole blocking layer.

[0049] If a potential difference is formed between the first electrode E1 and the second electrode E2, the light-emitting layer EL emits light. In this embodiment, a case is assumed in which the light-emitting layers EL included in the organic layers OR of the subpixels SP1, SP2, SP3 all emit light of the same color (e.g., white). In this case, for example, color filters corresponding to the colors of the subpixels SP1, SP2, SP3 can be arranged above the resin layer RL. Further, layers including quantum dots that are excited by light emitted from the light-emitting layers EL to generate light of colors corresponding to the subpixels SP1, SP2, SP3 can be arranged in the subpixels SP1, SP2, SP3. In addition, the light-emitting layers EL of the subpixels SP1, SP2, SP3 can each emit a color corresponding to the subpixel SP1, SP2, SP3.

[0050] Figure 5 is a schematic cross-sectional view of the vicinity of the partition wall PT1 between the subpixels SP1, SP2 in Figure 3 . The partition wall PT1 has a first portion P1 and a second portion P2 having a smaller width than the first portion P1. The second portion P2 is located below the first portion P1. The first portion P1 and the second portion P2 are formed integrally. In Figure 5 , the second portion P2 is in contact with the upper surface 14a of the rib 14.

[0051] In Figure 5 , a pair of side surfaces SF1 of the first portion P1 are inclined such that a distance between the side surfaces SF1 increases from an upper end to a lower end of the first portion P1. That is, the width of the first portion P1 is not constant in the third direction Z. As another example, the pair of side surfaces SF1 can be parallel to the third direction Z. Further, the pair of side surfaces SF1 can be inclined such that a distance between the side surfaces SF1 decreases from the upper end to the lower end of the first portion P1.

[0052] In Figure 5 , a pair of side surfaces SF2 of the second portion P2 are inclined such that a distance between the side surfaces SF2 decreases from an upper end to a lower end of the second portion P2. That is, the width of the second portion P2 is not constant in the third direction Z. As another example, the pair of side surfaces SF2 can be parallel to the third direction Z. Further, the pair of side surfaces SF2 can be inclined such that a distance between the side surfaces SF2 increases from the upper end to the lower end of the second portion P2.

[0053] The first part P1 has a pair of lower surfaces BF connecting the side surface SF1 and the side surface SF2. These lower surfaces BF are opposite to the upper surface 14a of the rib 14. The shape of the partition wall PT1 of the first part P1 and the second part P2 having this shape can be described, for example, as an overhang shape.

[0054] A metal layer ML covers a portion of the side surface SF2. In other words, the side surface SF2 has a first region A1 covered by the metal layer ML and a second region A2 not covered by the metal layer ML. The second region A2 is located between the first region A1 and the first portion P1. Figure 5 In the example, the first region A1 is larger than the second region A2.

[0055] exist Figure 5 In this example, the width of the metal layer ML in the first direction X is smaller than its width (height) in the third direction Z. Furthermore, the width of the metal layer ML in the first direction X is smaller than the width of the lower surface BF in the first direction X. The metal layer ML is generally located below the first portion P1. The lower end of the metal layer ML contacts the upper surface 14a. The upper end of the metal layer ML is located higher than the second electrode E2 on the rib 14. Additionally, the shape of the metal layer ML is not limited to the shape illustrated here.

[0056] The upper surface UF of the partition PT1 (first part P1) is covered by an organic layer ORa. Furthermore, the organic layer ORa is covered by a conductive layer E2a. Figure 5 In the example, the organic layer ORa also covers the side SF1.

[0057] The organic layer ORa is formed of the same material as the organic layer OR. The conductive layer E2a is formed of the same material as the second electrode E2. The organic layer ORa is separate from the organic layer OR disposed on sub-pixels SP1 and SP2. The conductive layer E2a is separate from the second electrode E2 disposed on sub-pixels SP1 and SP2.

[0058] The organic layer OR and the second electrode E2 are formed, for example, on the entire surface of the display area DA by vacuum evaporation. At this time, the organic layer ORa and the conductive layer E2a are formed by attaching material from the evaporation source to the upper surface UF and side surface SF1 of the partition PT1. On the other hand, it is difficult to attach material from the evaporation source to the lower surface BF and side surface SF2. Therefore, the organic layer OR and the organic layer ORa are disconnected, and the second electrode E2 and the conductive layer E2a are disconnected.

[0059] The organic layer OR has a first end ED1 located on the upper surface 14a of the rib 14. The second electrode E2 has a second end ED2 located on the upper surface 14a. The first end ED1 is covered by the second electrode E2. The second end ED2 is in contact with the metal layer ML.

[0060] The first inorganic layer IL1 continuously covers the second electrode E2 of the sub-pixels SP1, SP2, the metal layer ML formed in the pair of side surfaces SF2, the second region A2 of the pair of side surfaces SF2 respectively, the pair of bottom surfaces BF, and the conductive layer E2a. That is, the first inorganic layer IL1 contacts the second portion P2 in the second region A2.

[0061] In addition, the configuration around the boundary of the sub-pixels SP1, SP2 is shown in Figure 5 , but the same configuration can be applied to the vicinity of the boundary of the sub-pixels SP2, SP3, the vicinity of the boundary of the sub-pixels SP1, SP3. For Figure 2 The partition wall PT2 shown in Figure 5 The configuration shown in

[0062] Figure 6 is a schematic plan view showing an example of the shape of the metal layer ML. In Figure 6 , the outline of the first portion P1 of the partition wall PT1, PT2 is shown by a broken line. The metal layer ML has a first linear portion LN1 extending in the second direction Y along the partition wall PT1, and a second linear portion LN2 extending in the first direction X along the partition wall PT2. Figure 3 and Figure 5 The metal layer ML shown in

[0063] In Figure 6 , the two first linear portions LN1 and the two second linear portions LN2 close to the opening OP of the sub-pixel SP1 are connected to a rectangular shape. That is, the metal layer ML surrounds the opening OP, the display element 20.

[0064] The metal layer ML has a connection portion CP at the intersection of the partition walls PT1, PT2 (the intersection of the ribs 14). The connection portion CP connects the plurality of first linear portions LN1 and the plurality of second linear portions LN2. Thus, the plurality of first linear portions LN1 and the plurality of second linear portions LN2 surrounding the sub-pixel SP adjacent to each other are connected.

[0065] The metal layer ML thus configured can be used as Figure 2 the supply line FL shown in Figure 5 In this case, the metal layer ML is connected to, for example, a wiring to which the common voltage is applied in the peripheral region SA. As shown in , in the present embodiment, since the second electrode E2 contacts the metal layer ML, the common voltage is applied to the second electrode E2 through the metal layer ML.

[0066] Figure 7 is a cross-sectional view of the display device DSP along the VII-VII line in Figure 6 The layers below the ribs 14 and the layers above the first inorganic layer IL1 are omitted in this figure.

[0067] The connection portion CP is located between the upper surface 14a of the rib 14 and the second portion P2 of the partition wall PT1. The connection portion CP is integrally formed with the first line portion LN1 disposed to the pair of side faces SF2 of the second portion P2, respectively. In the cross section of Figure 7 The connection portion CP is also connected with the second line portion LN2 in the different cross section.

[0068] Here, an example of a manufacturing method of the display device DSP will be described.

[0069] Figures 8 to 12 is a view showing the manufacturing process for obtaining the partition wall PT and the metal layer ML. In Figure 8 The first layer L1 covering the ribs 14 and the first electrode E1, and the second layer L2 covering the first layer L1 are formed.

[0070] The first layer L1 is formed of the same metal material as the metal layer ML. The second layer L2 is formed of a metal material having a lower resistance to wet etching (a higher etching rate) than the first layer L1. As an example, the first layer L1 can be formed of aluminum, and the second layer L2 can be formed of a molybdenum-tungsten alloy.

[0071] Grooves GR are provided in the first layer L1 and the second layer L2 above the ribs 14. The grooves GR are in a lattice shape as the partition walls PT1, PT2 shown in Figure 2 in plan view. The grooves GR are through to the upper surface 14a of the ribs 14 in the cross section of Figure 8

[0072] After the first layer L1 and the second layer L2 are formed, an inorganic layer that becomes the basis of the partition walls PT1, PT2 is formed on the second layer L2. The inorganic layer fills the grooves GR. By patterning the inorganic layer, the partition wall PT1 is obtained as shown in Figure 9 The first portion P1 corresponds to the portion of the patterned inorganic layer that is outside the grooves GR. The second portion P2 corresponds to the portion of the patterned inorganic layer that is inside the grooves GR. The partition wall PT2 is also formed by the patterning.

[0073] After the partition walls PT1, PT2 are formed, wet etching for removing the first layer L1 and the second layer L2 is performed. Since the second layer L2 has a lower resistance to the wet etching, it is removed integrally, and the side faces SF2 of the second portion P2 that are in contact with the second layer L2 in the grooves GR are exposed. ​

[0074] On the other hand, the first layer L1 is not completely removed, as shown, and a portion in contact with the side surface SF2 remains. This remaining portion corresponds to the first line portion LN1 of the metal layer ML. In the vicinity of the partition wall PT2 as well, the second line portion LN2 of the metal layer ML is formed by the wet etching. Figure 10

[0075] In addition, in a position where the connecting portion CP of the metal layer ML is provided, as shown, Figure 11 a groove GR is formed in a manner not penetrating the first layer L1. If the partition walls PT1, PT2 are formed to the groove GR, the first layer L1 is interposed between the second portion P2 and the upper surface 14a of the rib 14. If the wet etching is performed to the first layer L1 and the second layer L2, as shown, Figure 12 the connecting portion CP is formed below the second portion P2.

[0076] Next, an example of an effect achieved by the present embodiment will be described.

[0077] Figure 13 is an enlarged schematic cross-sectional view of the vicinity of the partition wall PT1. After the second electrode E2 is formed, the first inorganic layer IL1 is formed, for example, by evaporation by a chemical vapor deposition (CVD) method or the like. When the first inorganic layer IL1 is formed by evaporation, in the vicinity of an angle formed by two faces having a large angle, the inorganic layer grows from one of the faces and also grows from the other face. If these inorganic layers approach each other, the inflow of gas to the portion therebetween is inhibited, and a crack-like void (gap), a joint is sometimes formed. Since the resin layer RL has difficulty in entering the void, it is possible that the atmosphere remains in the void.

[0078] In the example of Figure 13 , a void V is formed in the vicinity of the angle of the side surface SF2 and the bottom surface BF. There is also a case where a joint is formed in the vicinity of the angle of the side surface SF2 and the bottom surface BF instead of the void V. In the case where such a void V or joint is formed, it is possible that the moisture cannot be sufficiently inhibited from entering the display element 20.

[0079] That is, assuming that the metal layer ML is formed in the entire side surface SF2, the moisture that enters the inside of the first inorganic layer IL1 through the void V or the joint can reach the display element 20 by being transmitted at the boundary of the metal layer ML and the side surface SF2, or at the boundary of the metal layer ML and the first inorganic layer IL1. If the moisture reaches the display element 20, particularly, the organic layer OR, it can become one factor of display failure such as a decrease in brightness (generation of a dark spot) of the display element 20.

[0080] ​On the other hand, in the present embodiment, the first region Al in the side surface SF2 is covered with the metal layer ML, and the second region A2 above the first region Al is covered with the first inorganic layer ILl. If configured in this way, the first inorganic layer ILl is in contact with the side surface SF2 between the gap V and the metal layer ML and the joint, and can block the path of moisture penetration to the metal layer ML and the display element 20. As a result, the display quality of the display device DSP can be improved.

[0081] Further, since the first inorganic layer ILl and the partition wall PTl are formed of an inorganic material, the first inorganic layer ILl exhibits good adhesion with the side surface SF2. Thus, moisture penetration to the metal layer ML and the display element 20 can be more appropriately suppressed. In addition, in the case where the metal layer ML is used as the power supply line FL for supplying power to the second electrode E2, the metal layer ML can be used as the power supply line FL for supplying power to the second electrode E2 without forming another power supply line FL. Figure 13 The cross-sectional configuration including the partition wall PTl and the first linear portion LNl is shown in FIG. 6, but the same effect can be obtained in the cross-sectional configuration including the partition wall PT2 and the second linear portion LN2.

[0082] As described above, in the case where the metal layer ML is used as the power supply line FL for supplying power to the second electrode E2, another power supply line FL need not be formed. In this case, as long as the metal layer ML surrounds the display element 20 in the shape shown in FIG. 6, power can be efficiently supplied from the periphery of the second electrode E2. Figure 6

[0083] Further, the configuration in which the metal layer ML is in contact with the second electrode E2 is shown in FIG. 6, but in the case where the metal layer ML is not used as the power supply line FL, the second electrode E2 can be separated from the metal layer ML. Figure 5 Figure 7 Further, the configuration in which the metal layer ML is in contact with the second electrode E2 is shown in FIG. 6, but in the case where the metal layer ML is not used as the power supply line FL, the second electrode E2 can be separated from the metal layer ML.

[0084] All display devices that can be appropriately designed and changed by those skilled in the art based on the display device described as an embodiment of the present application also fall within the scope of the present application as long as they include the gist of the present application.

[0085] Within the scope of the idea of the present application, various modifications that can be appropriately thought of by those skilled in the art should also be understood to fall within the scope of the present application. For example, in the above-described embodiment, a manner in which an additional component is added, a component is deleted, or a design change is made, or a manner in which a process is added, omitted, or a condition is changed, by those skilled in the art should also be understood to fall within the scope of the present application as long as the gist of the present application is possessed.

[0086] Further, as for other effects brought about by the above-described embodiments, effects that are clear from the description of the present specification or effects that can be appropriately thought of by those skilled in the art are of course understood to be effects brought about by the present application.​​

Claims

1. A display device comprising: a substrate; a plurality of display elements disposed above the substrate, each of the display elements comprising a first electrode, a second electrode facing the first electrode, and an organic layer that emits light in response to a voltage between the first electrode and the second electrode; a partition wall formed of an inorganic material and located between adjacent ones of the display elements; a rib located between adjacent ones of the display elements; a metal layer along the partition wall; and an inorganic layer formed of an inorganic material and covering the display elements, the partition wall, and the metal layer, wherein the partition wall comprises: a first portion; and a second portion located below the first portion and having a width smaller than a width of the first portion, wherein the metal layer covers a first region of a side surface of the second portion, wherein the inorganic layer covers a second region of the side surface, wherein the second region is located between the first region and the first portion, wherein the partition wall is configured in a lattice shape, and wherein a portion of the metal layer is located between the second portion and the rib at an intersection of the partition wall.

2. The display device according to claim 1, wherein the second electrode is in contact with the metal layer.

3. The display device according to claim 1, wherein the partition wall and the metal layer are disposed above the rib.

4. The display device according to claim 1, wherein the metal layer surrounds the display element.

5. The display device according to claim 1, wherein the first portion has a pair of first side surfaces, and wherein the pair of first side surfaces are inclined such that a distance between the first side surfaces increases from an upper end to a lower end of the first portion.

6. The display device according to claim 5, wherein the second portion has a pair of second side surfaces, and wherein the pair of second side surfaces are inclined such that a distance between the second side surfaces decreases from an upper end to a lower end of the second portion.

7. The display device according to claim 6, wherein the partition wall and the metal layer are disposed above the rib, wherein the first portion has a pair of lower surfaces connecting the pair of first side surfaces and the pair of second side surfaces, respectively, and wherein the pair of lower surfaces face upper surfaces of the rib.

8. The display device according to claim 7, wherein the inorganic layer covers the pair of lower surfaces.

9. The display device according to claim 7, wherein the metal layer is in contact with the upper surfaces of the rib.

10. The display device according to claim 7, wherein an upper end of the metal layer is located higher than the second electrode on the rib.

11. The display device according to claim 7, wherein an end portion of the organic layer is located on the upper surfaces of the rib and is covered by the second electrode.

12. The display device according to claim 7, wherein a width of the metal layer is smaller than a width of the lower surfaces.

13. The display device according to claim 12, wherein the width of the metal layer is smaller than a height of the metal layer.

14. The display device according to claim 1, wherein the first region is larger than the second region.

15. The display device according to claim 1, further comprising a conductive layer disposed above the first portion.

16. The display device according to claim 15, ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Further, an organic layer is provided between the conductive layer and the first portion.

17. The display device according to claim 15, The inorganic layer covers the conductive layer.

18. A display device comprising: a substrate; a plurality of display elements provided over the substrate, each of the display elements including a first electrode, a second electrode facing the first electrode, and an organic layer that emits light in accordance with a voltage between the first electrode and the second electrode; a barrier wall formed of an inorganic material and positioned between adjacent ones of the display elements; a metal layer along the barrier wall; and an inorganic layer formed of an inorganic material and covering the display elements, the barrier wall, and the metal layer, the barrier wall has: a first portion; a second portion positioned below the first portion and having a width smaller than a width of the first portion, the metal layer covers a first region of a side surface of the second portion, the inorganic layer covers a second region of the side surface, the second region is positioned between the first region and the first portion, the first portion has a pair of first side surfaces, the metal layer has a pair of linear portions in contact with the pair of first side surfaces, respectively, and a connection portion connecting the pair of linear portions, the connection portion is positioned below the second portion. ​ ​

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