Electronic device

Abstract

The present application discloses an electronic device. The disclosed electronic device includes a device housing, a microphone, and a damping member, wherein: the device housing has an inner cavity and a sound pickup hole communicating with the inner cavity, the microphone and the damping member are both located in the inner cavity, and the damping member is connected to the device housing; the damping member includes a microphone mounting portion and a first housing connection portion, the microphone mounting portion is connected to the first housing connection portion, the first housing connection portion is connected to the device housing, the microphone is mounted on the microphone mounting portion, and the whole formed by the microphone and the microphone mounting portion is opposite to the sound pickup hole and is suspended. The above technical solution can solve the problem in the background art that the vibration of the device housing has an adverse effect on the sound pickup of the microphone.

Description

Technical Field

[0001] This application belongs to the technical field of electronic device design, and particularly relates to an electronic device. Background Art

[0002] With the progress and development of technology, it has become a common phenomenon for people to use electronic devices for video calls, voice calls, and online meetings. When people use the above functions of electronic devices, the microphones in the electronic devices are required. However, in order to implement other functions of the electronic devices, there will inevitably be components that generate vibrations in the electronic devices, such as speakers, motors, etc. The components that generate vibrations will transmit the vibrations to the device housing of the electronic device. Since there is a connection relationship between the microphone and the device housing, the vibration of the device housing will have an adverse effect on the sound pickup of the microphone. Summary of the Invention

[0003] The purpose of the embodiments of this application is to disclose an electronic device, which can solve the problem that the vibration of the device housing has an adverse effect on the sound pickup of the microphone in the background art.

[0004] To solve the above technical problems, this application is implemented as follows:

[0005] In a first aspect, this application discloses an electronic device, which includes a device housing, a microphone, and a vibration damping member, where:

[0006] The device housing has an inner cavity and a sound pickup hole communicating with the inner cavity. The microphone and the vibration damping member are both located in the inner cavity, and the vibration damping member is connected to the device housing;

[0007] The vibration damping member includes a microphone mounting portion and a first housing connection portion. The microphone mounting portion is connected to the first housing connection portion, the first housing connection portion is connected to the device housing, the microphone is mounted on the microphone mounting portion, and the whole formed by the microphone and the microphone mounting portion is opposite to the sound pickup hole and is suspended.

[0008] In a second aspect, this application also discloses another electronic device, which includes:

[0009] A device housing, the device housing having a sound pickup hole;

[0010] A microphone;

[0011] A vibration damping member, the vibration damping member including a microphone mounting portion having a through hole and a first housing connection portion connected to the microphone mounting portion. The through hole is used to accommodate the microphone, and the top end of the microphone mounting portion has an inwardly concave first wire passing channel;

[0012] Fixing bracket, the fixing bracket includes a shock absorber connecting portion, a second housing connecting portion, and a cantilever connecting the shock absorber connecting portion and the second housing connecting portion respectively. The shock absorber connecting portion is provided with a second insertion space for accommodating the microphone mounting portion. The second insertion space is defined as: when the fixing bracket is inserted and connected to the shock absorber, there is a first gap between the outer surface of the microphone mounting portion and the inner surface of the second insertion space. The bottom end of the fixing bracket has a second wire passing channel, and the wire connected to the microphone passes through the first wire passing channel and the second wire passing channel to the outside of the fixing bracket;

[0013] The first housing connecting portion is connected to the shock absorber connecting portion, and the second housing connecting portion is connected to the device housing, so that the microphone is opposite to the sound pickup hole, and the microphone is suspended relative to the device housing.

[0014] The technical solution adopted in this application can achieve the following beneficial effects:

[0015] The electronic device disclosed in the embodiment of this application improves the structure of the electronic device in the related art. By providing a shock absorber, and the shock absorber includes a microphone mounting portion and a first housing connecting portion connected to the microphone mounting portion. The microphone mounting portion is connected to the device housing through the first housing connecting portion, and the microphone is arranged in the microphone mounting portion, so that the overall structure formed by the microphone and the microphone mounting portion can be suspended relative to the sound pickup hole, which is beneficial to extending the path of vibration transmission from the device housing to the microphone, and at the same time is also beneficial to reducing the path of vibration transmission from the device housing to the microphone, thereby being able to alleviate the influence of the vibration on the device housing when the microphone picks up sound. Description of the Drawings

[0016] Figure 1 and Figure 2 are the three-dimensional structure schematic diagrams of the electronic device disclosed in the embodiment of this application from different perspectives;

[0017] Figure 3 is the exploded structure schematic diagram of the electronic device disclosed in the embodiment of this application;

[0018] Figure 4 is the cross-sectional view of the electronic device disclosed in the embodiment of this application;

[0019] Figure 5 and Figure 6 is the cross-sectional view of a part of the structure of the electronic device disclosed in the embodiment of this application;

[0020] Figure 7 is the three-dimensional structure schematic diagram of the fixing bracket of the electronic device disclosed in the embodiment of this application;

[0021] Figures 8 to 10 Schematic perspective views of the shock absorber of the electronic device disclosed in the embodiments of the present application from different perspectives;

[0022] Figure 11 is a cross-sectional view of the shock absorber of the electronic device disclosed in the embodiments of the present application.

[0023] Explanation of reference numerals:

[0024] 100 - device housing, 110 - inner cavity, 120 - sound pickup hole, 130 - connecting protrusion, 131 - threaded hole;

[0025] 200 - microphone;

[0026] 300 - shock absorber, 310 - microphone mounting part, 311 - first wire passing channel, 312 - first positioning surface, 313 - second positioning surface, 320 - first housing connecting part, 321 - mating protrusion, 322 - plugging protrusion, 322a - plugging protrusion main body, 322b - sub - plugging protrusion, 330 - through hole;

[0027] 400 - fixing bracket, 410 - shock absorber connecting part, 410a - cover body, 410b - rib, 411 - first plugging space, 412 - second plugging space, 413 - second wire passing channel, 420 - second housing connecting part, 430 - cantilever;

[0028] 500 - sound - permeable membrane;

[0029] 600 - threaded connector. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0031] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order different from those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or multiple. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally represents an "or" relationship between the associated objects before and after.

[0032] The electronic device disclosed in the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings through specific embodiments and their application scenarios.

[0033] As Figures 1 to 11 shown, an electronic device is disclosed in the embodiments of the present application. The disclosed electronic device includes a device housing 100, a microphone 200, and a damping member 300.

[0034] Among them, the device housing 100 is a basic installation component of the electronic device, the microphone 200 is a functional component in the electronic device, which is used to pick up sound, and the damping member 300 can be a soft component, which can absorb and weaken vibrations to a certain extent.

[0035] The device housing 100 has an inner cavity 110 and a sound pickup hole 120 communicating with the inner cavity 110. Both the microphone 200 and the damping member 300 are located in the inner cavity 110. The damping member 300 is connected to the device housing 100. The damping member 300 includes a microphone mounting portion 310 and a first housing connection portion 320. The microphone mounting portion 310 is connected to the first housing connection portion 320, and the first housing connection portion 320 is connected to the device housing 100. The microphone 200 is mounted on the microphone mounting portion 310. The whole formed by the microphone 200 and the microphone mounting portion 310 is opposite to the sound pickup hole 120 and is suspended.

[0036] In the present application, the device housing 100 can play a protective role for the damping member 300 and the microphone 200 provided in the inner cavity 110. The device housing 100 plays a supporting role for the microphone mounting portion 310 through the first housing connection portion 320, so that the overall structure formed by the microphone 200 and the microphone mounting portion 310 can be suspended relative to the sound pickup hole 120. In this setting method, the suspended microphone 200 and the microphone mounting portion 310 can avoid contacting the device housing 100, so that the vibration on the device housing 100 needs to be transmitted to the microphone mounting portion 310 through the first housing connection portion 320, and then transmitted from the microphone mounting portion 310 to the microphone 200. That is to say, the present application extends the path of the vibration on the device housing 100 transmitted to the microphone 200 (the vibration will gradually weaken as the path extends), and at the same time, it also reduces the path of the vibration on the device housing 100 transmitted to the microphone 200, so as to relieve the influence of the vibration on the device housing 100 on the sound pickup of the microphone 200.

[0037] The electronic device disclosed in the embodiments of the present application improves the structure of the electronic device in the related art. By providing a shock absorber 300, the shock absorber 300 includes a microphone mounting portion 310 and a first housing connection portion 320 connected to the microphone mounting portion 310. The microphone mounting portion 310 is connected to the device housing 100 through the first housing connection portion 320, and the microphone 200 is disposed on the microphone mounting portion 310, so that the overall structure formed by the microphone 200 and the microphone mounting portion 310 can be suspended relative to the sound pickup hole 120. This is beneficial to extending the path of vibration transmission from the device housing 100 to the microphone 200, and at the same time, it is also beneficial to reducing the path of vibration transmission from the device housing 100 to the microphone 200, thereby alleviating the influence of the vibration on the device housing 100 on the sound pickup of the microphone 200.

[0038] In the electronic device disclosed in the embodiments of the present application, the overall structure formed by the microphone 200 and the microphone mounting portion 310 faces the sound pickup hole 120, which is beneficial to shortening the sound propagation path from the sound in the sound pickup hole 120 to the microphone 200, thereby facilitating the microphone 200 to pick up sound. To prevent foreign objects from entering the sound pickup hole 120 and causing an adverse effect on the microphone 200, the electronic device disclosed in the present application may include a sound-permeable membrane 500, and the sound-permeable membrane 500 is disposed on the sound pickup hole 120.

[0039] To avoid a large step difference between the sound-permeable membrane 500 and the outer wall of the device housing 100, the sound-permeable membrane 500 and the outer wall of the device housing 100 may be coplanar. The sound-permeable membrane 500 only needs to be able to transmit sound, and the present application does not specifically limit the material of the sound-permeable membrane 500.

[0040] In the electronic device disclosed in the embodiments of the present application, the electronic device may further include a fixing bracket 400. The fixing bracket 400 is located in the inner cavity 110 and is connected to the device housing 100. The first housing connection portion 320 is positioned within the positioning space formed by the fixing bracket 400 and the device housing 100. In this case, since the first housing connection portion 320 can be positioned and installed within the positioning space, the first housing connection portion 320 does not need a large area or a tight connection with the device housing 100. Thus, in the electronic device, the shock absorber 300 can be installed through the fixing bracket 400, which is beneficial to alleviating the situation where vibration is transmitted from the device housing 100 to the first housing connection portion 320. At the same time, the shock absorber 300 can also be stably installed through the fixing bracket 400.

[0041] To further reduce the phenomenon that vibrations on the device housing 100 are transmitted to the microphone 200 through the fixing bracket 400, in an alternative technical solution, the microphone 200 and the fixing bracket 400 can be spaced apart, so that the vibrations on the fixing bracket 400 cannot be directly transmitted to the microphone 200, thereby alleviating the situation where vibrations on the device housing 100 are transmitted to the fixing bracket 400 and then transmitted to the microphone 200 through the fixing bracket 400. In another alternative technical solution, the microphone mounting portion 310 and the fixing bracket 400 can be directly spaced apart. In this setting method, since the vibrations on the fixing bracket 400 cannot be directly transmitted to the microphone mounting portion 310, that is, the vibrations on the fixing bracket 400 cannot be transmitted to the microphone 200 through the microphone mounting portion 310, and thus the vibration energy on the device housing 100 is gradually weakened through the fixing bracket 400, the microphone mounting portion 310, and the gap between the microphone mounting portion 310 and the fixing bracket 400, which is used to further alleviate the adverse effects of vibrations on the device housing 100 on the microphone 200 through the fixing bracket 400. Specifically, the gap between the microphone mounting portion 310 and the fixing bracket 400 can be greater than or equal to 0.5 mm to ensure that the gap can effectively weaken the transmission of vibrations.

[0042] In the electronic device disclosed in the embodiments of the present application, in the first housing connection portion 320 and the device housing 100, one of them can include a mating protrusion 321, and the other can have a flat surface. The mating protrusion 321 contacts the flat surface, and other regions of the surface of the first housing connection portion 320 facing the flat surface except the mating protrusion 321 are spaced apart from the flat surface, or other regions of the surface of the device housing 100 facing the flat surface except the mating protrusion 321 are spaced apart from the flat surface. In this case, the first housing connection portion 320 and the device housing 100 are connected only through the mating protrusion 321, that is to say, the first housing connection portion 320 and the device housing 100 are in point-plane contact, thereby reducing the vibrations transmitted from the device housing 100 to the first housing connection portion 320.

[0043] In the electronic device disclosed in the embodiments of the application, the fixing bracket 400 can include a shock absorber connection portion 410. The shock absorber connection portion 410 includes a cover body 410a. The cover body 410a is connected to the device housing 100. The cover body 410a covers the shock absorber 300 and the microphone 200, and the cover body 410a and the device housing 100 form a positioning space. In this case, the cover body 410a can protect the covered shock absorber 300 and microphone 200, thereby preventing components in the external environment from easily damaging the shock absorber 300 and the microphone 200.

[0044] To facilitate the assembly between the fixing bracket 400 and the damping member 300, in the electronic device disclosed in the embodiment of the present application, in the damping member 300 and the fixing bracket 400, one of them may be provided with a first insertion space 411, and the other may be provided with an insertion protrusion 322. The damping member 300 is connected to the fixing bracket 400 through the insertion fit between the first insertion space 411 and the insertion protrusion 322. In this case, when the insertion protrusion 322 and the first insertion space 411 achieve an insertion fit, at the same time, a positioning fit can be achieved between the insertion protrusion 322 and the first insertion space 411, which is beneficial to the damping member 300 and the fixing bracket 400 to achieve positioning assembly more easily through the insertion protrusion 322 and the first insertion space 411.

[0045] To realize the connection between the insertion protrusion 322 and the first insertion space 411, optionally, the insertion protrusion 322 and the first insertion space 411 can be fixedly connected by means of dotting. In another alternative technical solution, the insertion protrusion 322 may further include an insertion protrusion main body 322a and a plurality of sub-insertion protrusions 322b. The plurality of sub-insertion protrusions 322b are arranged at intervals on the surface of the insertion protrusion main body 322a. When the insertion protrusion 322 and the first insertion space 411 achieve an insertion fit, the plurality of sub-insertion protrusions 322b are in pressing fit with the inner wall of the first insertion space 411. That is to say, the insertion protrusion main body 322a can achieve a fixed connection through the interference amount between the sub-insertion protrusions 322b and the inner wall of the first insertion space 411.

[0046] In a further technical solution, the fixing bracket 400 may include a damping member connection portion 410. The damping member connection portion 410 may include a cover body 410a and a rib 410b provided on the cover body 410a. The cover body 410a and the rib 410b enclose the first insertion space 411, and the rib 410b encloses the second insertion space 412. The microphone mounting portion 310 is inserted into the second insertion space 412. In this case, while the rib 410b can assist the cover body 410a to enclose the first insertion space 411, the rib 410b itself can also enclose the second insertion space 412, so that the insertion fit between the microphone mounting portion 310 and the second insertion space 412 can be beneficial to improve the convenience of the assembly between the microphone mounting portion 310 and the fixing bracket 400.

[0047] In the electronic device disclosed in the embodiments of the present application, the fixing bracket 400 may include a shock absorber connecting portion 410, a second housing connecting portion 420, and a cantilever 430. The shock absorber connecting portion 410 is connected to the shock absorber 300. The shock absorber connecting portion 410 is connected to the second housing connecting portion 420 through the cantilever 430. The second housing connecting portion 420 is connected to the device housing 100. The cantilever 430 is disposed at an interval from the inner wall of the device housing 100. In this case, there is a third gap between the cantilever 430 and the inner wall of the device housing 100, so as to prevent the device housing 100 from directly transmitting vibration to the shock absorber connecting portion 410 through the cantilever 430. Furthermore, the cantilever 430 disposed at an interval from the inner wall of the device housing 100 can relieve the vibration transmitted from the second housing connecting portion 420 to the shock absorber connecting portion 410.

[0048] To enable the inner wall of the device housing 100 to be disposed at an interval from the cantilever 430, optionally, the device housing 100 may include a connecting protrusion 130. The second housing connecting portion 420 is connected to the device housing 100 through the connecting protrusion 130. At the same time, to make the connection between the second housing connecting portion 420 and the connecting protrusion 130 relatively stable, the electronic device may further include a threaded connector 600. The second housing connecting portion 420 may be provided with a connecting through hole, and the connecting protrusion 130 may be provided with a threaded hole 131, so that the threaded connector 600 can pass through the connecting through hole and be in threaded cooperation with the threaded hole 131, thereby realizing the fixed connection between the second housing connecting portion 420 and the connecting protrusion 130. Of course, the connection manner between the second housing connecting portion 420 and the connecting protrusion 130 is diverse, and the connection can also be realized by means of clamping, welding, etc. The present application does not make any restrictions.

[0049] To reduce the transmission of vibration by the cantilever 430, in an alternative technical solution, the cantilever 430 may be a bent arm. Since the length of the bent arm is relatively long, the bent arm can consume the energy of vibration during the transmission process to relieve the vibration transmitted to the microphone 200 through the cantilever 430. Of course, when the support strength of the cantilever 430 is satisfied, the cantilever 430 may also be set to a structure with a relatively long length and / or a relatively small thickness to increase the energy consumed by the vibration during the transmission process.

[0050] In a further technical solution, the number of the cantilevers 430 can be two, and they are respectively connected to opposite sides of the vibration damping member connecting portion 410. Thus, the two cantilevers 430 can relatively stably realize the connection between the vibration damping member connecting portion 410 and the second housing connecting portion 420, and further realize the stable connection between the vibration damping member connecting portion 410 and the device housing 100. Moreover, since the cantilevers 430 connect the device housing 100 and the vibration damping member connecting portion 410, the cantilevers 430 can transfer the vibration on the device housing 100 to the vibration damping member connecting portion 410, and further cause the vibration to be transferred to the vibration damping member 300, which will also affect the sound pickup effect of the microphone 200 to a certain extent. Therefore, the number of the cantilevers 430 should not be too large. In this case, the two cantilevers 430 in the present application can avoid the vibration transferred from the device housing 100 to the vibration damping member connecting portion 410 caused by too many cantilevers 430 while realizing the stable connection between the device housing 100 and the vibration damping member connecting portion 410.

[0051] To reduce the contact area between the vibration damping member connecting portion 410 and the device housing 100, in an alternative technical solution, the vibration damping member connecting portion 410 and the inner wall of the device housing 100 can be arranged at intervals. In this case, there is a fourth gap between the vibration damping member connecting portion 410 and the inner wall of the device housing 100, so that the vibration on the device housing 100 cannot be directly transferred to the vibration damping member connecting portion 410. That is to say, the vibration on the device housing 100 needs to be transferred to the vibration damping member connecting portion 410 through the second housing connecting portion 420 and the cantilever 430, which is beneficial to further alleviate the transfer of the vibration on the device housing 100.

[0052] In the electronic device disclosed in the embodiment of the present application, the vibration damping member 300 can be provided with a first wire passing channel 311. The electronic device further includes an electric wire, one end of which is electrically connected to the microphone 200, and the other end of which passes through the first wire passing channel 311. In this case, the vibration damping member 300 is provided with the first wire passing channel 311 for specifically arranging the electric wire, so that the electric wire can be conveniently arranged, and the noise generated when the electric wire is wound can be avoided from having an adverse effect on the sound pickup effect of the microphone 200. Since the electric wire has a certain thickness, to avoid the electric wire being exposed outside the first wire passing channel 311 and coming into contact with other components, resulting in the tremor of the electric wire, which will have an adverse effect on the sound pickup of the microphone 200. In a further technical solution, the inner wall of the first wire passing channel 311 can extend in a direction away from the bottom surface of the first wire passing channel 311 to increase the space of the first wire passing channel 311, which is beneficial to arranging all the electric wires passing through the first wire passing channel 311 in the first wire passing channel 311, and further avoiding the electric wire from being exposed outside the first wire passing channel 311.

[0053] Optionally, when the electronic device further includes a fixing bracket 400, the fixing bracket 400 may be provided with a second wire passing channel 413. The first wire passing channel 311 and the second wire passing channel 413 may be communicated, and the wire passes through the first wire passing channel 311 and the second wire passing channel 413. In the above case, the laying path of the wire is relatively clear, which is beneficial to further avoid the wire winding. Moreover, to reduce the wire routing path, the first wire passing channel 311 and the second wire passing channel 413 may be arranged adjacent to each other to further avoid the adverse effect of the noise generated by the wire winding on the sound pickup effect of the microphone 200.

[0054] In the electronic device disclosed in the embodiment of the present application, the microphone mounting portion 310 may be a cylindrical structural member. The cylindrical structural member has a first positioning surface 312 facing its first port and a second positioning surface 313 opposite to the first positioning surface 312. The microphone 200 is mounted within the cylindrical structural member, and both ends of the microphone 200 are respectively in positioning cooperation with the first positioning surface 312 and the second positioning surface 313. In this case, since the first positioning surface 312 and the second positioning surface 313 can respectively achieve positioning cooperation with both ends of the microphone 200, the microphone 200 can be relatively stably mounted on the cylindrical structural member, which is beneficial to improving the mounting stability of the microphone 200.

[0055] To balance the positioning and assembly of the cylindrical structural member to the microphone 200, the area of the first opening surrounded by the first positioning surface 312 may be larger than the area of the second opening surrounded by the second positioning surface 313, so as to facilitate the installation of the microphone 200 into the cylindrical structural member from the first opening.

[0056] In the present application, the damping member 300 may be a silicone member or a foam member. The damping member 300 may also be manufactured using other materials. The present application does not limit the specific materials used for the damping member 300.

[0057] The embodiment of the present application also discloses another electronic device. The disclosed electronic device includes: a device housing 100 that can be used as a basic mounting component of the electronic device, a microphone 200 that can be used as a functional component of the electronic device, that is, can pick up sound, and a damping member 300 that can absorb and weaken vibration to a certain extent. The device housing 100 has a sound pickup hole 120, and the sound pickup hole 120 can realize the transmission of sound. The damping member 300 includes a microphone mounting portion 310 having a through hole 330 and a first housing connection portion 320 connected to the microphone mounting portion 310. The through hole 330 is used to accommodate the microphone 200, and the top end of the microphone mounting portion 310 has a concave first wire passing channel 311.

[0058] The electronic device includes a fixing bracket 400. The fixing bracket 400 includes a shock absorber connecting portion 410, a second housing connecting portion 420, and a cantilever 430 connecting the shock absorber connecting portion 410 and the second housing connecting portion 420 respectively, so that the shock absorber connecting portion 410 can be connected to the second housing connecting portion 420 through the cantilever 430. The shock absorber connecting portion 410 is provided with a second insertion space 412 for accommodating the microphone mounting portion 310. At the same time, the second insertion space 412 can play a protective role for the microphone mounting portion 310 on which the microphone 200 is mounted. In this application, the second insertion space 412 is defined as: when the fixing bracket 400 is inserted and connected to the shock absorber 300, there is a first gap between the outer surface of the microphone mounting portion 310 and the inner surface of the second insertion space 412, so as to avoid contact between the microphone mounting portion 310 and the second insertion space 412, and to avoid the vibration on the shock absorber connecting portion 410 being transmitted to the microphone 200 through the microphone mounting portion 310. The insertion connection between the fixing bracket 400 and the shock absorber 300 described above in this application can be the insertion fit between the first housing connecting portion 320 and the first insertion space 411 described later.

[0059] The bottom end of the fixing bracket 400 has a second wire passing channel 413. The wire connected to the microphone 200 passes through the first wire passing channel 311 and the second wire passing channel 413 to the outside of the fixing bracket 400, so that the first wire passing channel 311 and the second wire passing channel 413 can regularize the routing path of the wire, so that the wire has a clear routing path in the electronic device, so as to avoid the wire being placed in a messy manner from being entangled and generating noise, and further having an adverse impact on the sound pickup effect of the microphone 200.

[0060] The first housing connecting portion 320 is connected to the shock absorber connecting portion 410, and the second housing connecting portion 420 is connected to the device housing 100, so that the relative position relationship between the device housing 100 and the second housing connecting portion 420 is relatively stable, so that the shock absorber connecting portion 410 connected to the second housing connecting portion 420 through the cantilever 430 has a relatively stable relative position with the device housing 100. At the same time, the position relationship between the first housing connecting portion 320 and the device housing 100 is also relatively stable. The second insertion space 412 of the shock absorber connecting portion 410 is inserted and matched with the microphone mounting portion 310, and the microphone 200 is arranged in the through hole 330 of the microphone mounting portion 310, so that the microphone 200 is suspended relative to the device housing 100.

[0061] That is to say, the suspension setting between the microphone 200 and the device housing 100 can prevent the vibration on the device housing 100 from being directly transmitted to the microphone 200. The vibration on the device housing 100 needs to pass through the fixing bracket 400 and the vibration damping member 300 in sequence and can finally be transmitted to the microphone 200, so that the path for the vibration on the device housing 100 to be transmitted to the microphone 200 is increased (the vibration will gradually weaken as the path increases), and thus the influence of the vibration on the device housing 100 on the microphone 200 when picking up sound can be alleviated. The way that the microphone 200 is disposed opposite to the sound pickup hole 120 is conducive to the external sound being transmitted to the microphone 200 through the sound pickup hole 120 more quickly, so that the microphone 200 can pick up the sound.

[0062] The electronic device disclosed in the embodiment of the present application improves the structure of the electronic device in the related art. By disposing the microphone 200 in the through hole 330 of the microphone mounting portion 310, a first gap is formed between the outer surface of the microphone mounting portion 310 and the inner surface of the second insertion space 412 that is in plug-in fit therewith, so as to prevent the vibration on the vibration damping member connecting portion 410 from being directly transmitted to the microphone 200 through the microphone mounting portion 310. The first housing connecting portion 320 is connected to the vibration damping member connecting portion 410, and the second housing connecting portion 420 is connected to the device housing 100, so that the vibration on the device housing 100 needs to pass through the fixing bracket 400 and the vibration damping member 300 in sequence before being transmitted to the microphone 200, thereby extending the vibration transmission path for the vibration on the device housing 100 to be transmitted to the microphone 200, and alleviating the influence of the vibration on the device housing 100 on the microphone 200 when picking up sound.

[0063] It should be noted that in the electronic device disclosed in the embodiment of the present application, the microphone 200 being suspended relative to the device housing 100 means that the microphone 200 is not in direct contact with the device housing 100, so as to reduce the vibration on the device housing 100 from being transmitted to the microphone 200.

[0064] In the electronic device disclosed in the embodiment of the present application, the main function of the vibration damping member 300 is to absorb and weaken the vibration to a certain extent. Of course, the vibration damping member 300 can also play a protective role for the microphone 200. The material of the vibration damping member 300 can be silicone. The microphone 200 is disposed inside the through hole 330 so that when the device housing 100 vibrates, the microphone 200 is not easily interfered by the vibration due to the vibration damping effect of the vibration damping member 300. In the present application, the material of the vibration damping member 300 can also be foam, etc. The present application does not limit the specific type of the material used for the vibration damping member 300.

[0065] In the electronic device disclosed in the embodiment of the present application, the device housing 100 may further include connection protrusions 130 provided on both sides of the sound pickup hole 120. There is a second gap between the bottom end of the fixing frame 400 and the device housing 100, so that the fixing frame 400 is spaced apart from the device housing 100. In this case, the provision of the connection protrusions 130 can space the bottom end of the fixing frame 400 from the device housing 100, which is conducive to reducing the contact area between the fixing frame 400 and the device housing 100, and thus is conducive to further alleviating the adverse effect of the vibration on the device housing 100 on the sound picked up by the microphone 200. To make the connection between the second housing connection portion 420 and the connection protrusion 130 relatively stable, the connection protrusion 130 may be provided with a threaded hole 131, so that the second housing connection portion 420 and the connection protrusion 130 are locked through the threaded fit of the threaded connection member 600 and the threaded hole 131.

[0066] In the electronic device disclosed in the embodiment of the present application, when the device housing 100 vibrates, the vibration passes through the vibration damping member 300, so that the vibration damping member 300 can absorb part of the vibration. At the same time, the vibration can sequentially pass through the vibration damping member 300, the connection protrusion 130, the second housing connection portion 420, the cantilever 430 and the vibration damping member connection portion 410, so that the vibration formed on the microphone 200 is weakened.

[0067] In the electronic device disclosed in the embodiment of the present application, first housing connection portions 320 are provided on both radial sides of the microphone mounting portion 310. Among them, the vibration damping member connection portion 410 further includes a first insertion space 411 for accommodating the first housing connection portions 320, so that the first housing connection portions 320 can be inserted and matched with the vibration damping member connection portion 410 through the first insertion space 411. Specifically, the fixing frame 400 may include a plurality of ribs 410b, and the plurality of ribs 410b enclose the first insertion space 411. At the same time, the plurality of ribs 410b enclose a second insertion space 412, so that the first housing connection portions 320 can be stably installed in the first insertion space 411 through the interference amount with the plurality of ribs 410b, to ensure the stable connection between the first housing connection portions 320 and the first insertion space 411.

[0068] The electronic device disclosed in the embodiment of the present application may be a mobile phone, a personal digital assistant, a game console, an e-reader, etc. The present application does not specifically limit the type of the electronic device.

[0069] It should be noted that in this text, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising such element.

[0070] The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative rather than restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them fall within the protection scope of the present application.

Claims

1. An electronic device, characterized in that, It includes a device housing (100), a microphone (200), a shock absorber (300) and a fixing bracket (400), where: The device housing (100) has an inner cavity (110) and a sound pickup hole (120) communicating with the inner cavity (110). Both the microphone (200) and the shock absorber (300) are located in the inner cavity (110), and the shock absorber (300) is connected to the device housing (100). The shock absorber (300) includes a microphone mounting part (310) and a first housing connection part (320). The microphone mounting part (310) is connected to the first housing connection part (320), the first housing connection part (320) is connected to the device housing (100), the microphone (200) is mounted on the microphone mounting part (310), and the whole formed by the microphone (200) and the microphone mounting part (310) is opposite to the sound pickup hole (120) and is suspended. The fixing bracket (400) includes a shock absorber connection part (410), a second housing connection part (420) and a cantilever (430). The shock absorber connection part (410) is connected to the first housing connection part (320), the shock absorber connection part (410) is connected to the second housing connection part (420) through the cantilever (430), the second housing connection part (420) is connected to the device housing (100), and the cantilever (430) is spaced from the inner wall of the device housing (100).

2. The electronic device according to claim 1, characterized in that, The fixing bracket (400) is located in the inner cavity (110), and the fixing bracket (400) is connected to the device housing (100), and the first housing connection part (320) is positioned in the positioning space formed by the fixing bracket (400) and the device housing (100).

3. The electronic device according to claim 2, characterized in that, Among the microphone (200) and the microphone mounting part (310), at least the microphone (200) is spaced from the fixing bracket (400).

4. The electronic device according to claim 2, wherein Among the first housing connection part (320) and the device housing (100), one includes a mating protrusion (321), and the other has a flat surface. The mating protrusion (321) contacts the flat surface, and other regions of the surface of the first housing connection part (320) facing the flat surface except the mating protrusion (321) are spaced from the flat surface; or, other regions of the surface of the device housing (100) facing the flat surface except the mating protrusion (321) are spaced from the flat surface.

5. The electronic device according to claim 2, characterized in that, The fixing bracket (400) includes a shock absorber connection part (410), and the shock absorber connection part (410) includes a cover body (410a). The cover body (410a) is connected to the device housing (100), the cover body (410a) covers the shock absorber (300) and the microphone (200), and the cover body (410a) and the device housing (100) form the positioning space.

6. The electronic device according to claim 2, wherein In the damping member (300) and the fixing bracket (400), one is provided with a first insertion space (411), and the other is provided with an insertion protrusion (322). The damping member (300) is connected to the fixing bracket (400) through the insertion fit between the first insertion space (411) and the insertion protrusion (322).

7. The electronic device according to claim 6, characterized in that The fixing bracket (400) includes a damping member connection portion (410). The damping member connection portion (410) includes a cover body (410a) and a rib (410b) provided on the cover body (410a). The cover body (410a) and the rib (410b) enclose the first insertion space (411), and the rib (410b) encloses a second insertion space (412). The microphone mounting portion (310) is inserted into the second insertion space (412).

8. The electronic device according to claim 1, wherein There are two cantilevers (430), which are respectively connected to opposite sides of the damping member connection portion (410).

9. The electronic device according to claim 1, wherein The damping member connection portion (410) is spaced apart from the inner wall of the device housing (100).

10. The electronic device according to claim 2, wherein The damping member (300) is provided with a first wire passing channel (311), and the fixing bracket (400) is provided with a second wire passing channel (413). The first wire passing channel (311) is communicated with the second wire passing channel (413). The electronic device further includes a wire, and the wire passes through the first wire passing channel (311) and the second wire passing channel (413) and is electrically connected to the microphone (200).

11. The electronic device according to claim 1, characterized in that, The microphone mounting portion (310) is a cylindrical structural member. The cylindrical structural member has a first positioning surface (312) facing its first port and a second positioning surface (313) opposite to the first positioning surface (312). The microphone (200) is mounted inside the cylindrical structural member, and both ends of the microphone (200) are in positioning cooperation with the first positioning surface (312) and the second positioning surface (313) respectively.

12. An electronic device, characterized in that, Including: A device housing (100) having a sound pickup hole (120); A microphone (200); A damping member (300) including a microphone mounting portion (310) having a through hole (330) and a first housing connection portion (320) connected to the microphone mounting portion (310). The through hole (330) is used to accommodate the microphone (200), and the top end of the microphone mounting portion (310) has a concave first wire passing channel (311). A fixing bracket (400), the fixing bracket (400) includes a shock absorber connecting portion (410), a second housing connecting portion (420), and a cantilever (430) connecting the shock absorber connecting portion (410) and the second housing connecting portion (420) respectively. The shock absorber connecting portion (410) is provided with a second insertion space (412) for accommodating the microphone mounting portion (310). The second insertion space (412) is defined as: when the fixing bracket (400) is inserted and connected with the shock absorber (300), there is a first gap between the outer surface of the microphone mounting portion (310) and the inner surface of the second insertion space (412). The bottom end of the fixing bracket (400) has a second wire passing channel (413), and the wire connected to the microphone (200) passes through the first wire passing channel (311) and the second wire passing channel (413) to the outside of the fixing bracket (400). The first housing connecting portion (320) is connected to the shock absorber connecting portion (410), and the second housing connecting portion (420) is connected to the device housing (100), so that the microphone (200) is opposite to the sound pickup hole (120), and the microphone (200) is suspended relative to the device housing (100).

13. The electronic device according to claim 12, wherein The microphone (200) being suspended relative to the device housing (100) means that the microphone (200) does not directly contact the device housing (100).

14. The electronic device according to claim 13, wherein The material of the shock absorber (300) is silica gel, and the microphone (200) is arranged inside the through hole (330), so that when the device housing (100) vibrates, the microphone (200) is not easily disturbed by vibration due to the shock absorption of the shock absorber (300).

15. The electronic device according to claim 12, wherein The device housing (100) further includes connecting protrusions (130) arranged on both sides of the sound pickup hole (120). The second housing connecting portion (420) is locked with the connecting protrusions (130) via a threaded connector (600). There is a second gap between the bottom end of the fixing bracket (400) and the device housing (100), so that the fixing bracket (400) is spaced relative to the device housing (100).

16. The electronic device according to claim 15, wherein When the device housing (100) vibrates, the vibration passes through the shock absorber (300), and at the same time, the vibration sequentially passes through the connecting protrusions (130), the second housing connecting portion (420), the cantilever (430), and the shock absorber connecting portion (410), so that the vibration acting on the microphone (200) is weakened.

17. The electronic device according to claim 15, wherein The first housing connecting portion (320) is provided on both radial sides of the microphone mounting portion (310), and the shock absorber connecting portion (410) further includes a first insertion space (411) for accommodating the first housing connecting portion (320).

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