A wiring method for the lead wire of a circular induction synchronizer

Abstract

The present invention discloses a wiring method for the lead wire of a circular inductosyn, which includes a metal substrate. The wiring terminal pin is fixedly sealed in the wiring terminal pin mounting hole on the synchro substrate through epoxy resin. A circular inductosyn lead wire is welded to the bottom end of the wiring terminal pin; after a detection wire is welded to the top end of the wiring terminal socket, it is sleeved on the top end of the wiring terminal pin to achieve signal transmission; a circular hole, a pin limiting hole and a convex step are provided on the fixing bracket for limiting when fixedly sealing the wiring terminal pin and blocking the epoxy resin. By designing a new wiring method, the wiring terminal pin is fixedly sealed on the metal substrate through epoxy resin, which can achieve good insulation effect. The wiring terminal socket is sleeved on the top end of the wiring terminal pin to achieve quick plugging and unplugging, avoiding repeated welding of the lead wire during the detection and installation of the synchro, which affects the insulation performance and appearance quality of the circular inductosyn.

Description

Technical Field

[0001] The present invention relates to the technical field of circular inductosyn manufacturing, and particularly to a wiring method for the lead-out wire of a circular inductosyn. Background Art

[0002] Based on the electromagnetic coupling principle, a circular inductosyn is a measuring element that converts the relative displacement between two planar windings into an electrical signal. It mainly consists of a rotor assembly and a stator assembly, and can achieve the function of angle measurement. The circular inductosyn has a wide range of applications and can be used under spaceborne and weightless conditions. It is particularly widely used in national defense and civilian departments such as gyro platforms, servo turntables, gun control, radar antenna positioning and tracking, tracking systems of astronomical telescopes, and machine manufacturing.

[0003] For the lead-out wire of the existing circular inductosyn, it is either directly led out or made into a terminal post by using a rivet in cooperation with bakelite on a metal substrate and installed on the metal substrate, and then the wire core of the wire is wound into a solder ball on the terminal post using a soldering iron. For the existing wiring method of making a terminal post by using bakelite and a rivet for the circular inductosyn, due to the moisture-absorbing property of bakelite, after welding, the insulation between the lead-out wire and the metal substrate is often lower than 100 MΩ, bringing disadvantages such as poor insulation performance, cumbersome operation, and poor reliability, which will have a certain impact on the detection accuracy of the circular inductosyn; at the same time, during detection, the test wire needs to be welded to the terminal post, and after detection, the test wire needs to be disassembled, and then the solder ball needs to be remelted. The repeated welding will have a certain impact on the installation reliability of the terminal post and the production cycle. Summary of the Invention

[0004] The purpose of the present invention is to provide a wiring method for the lead-out wire of a circular inductosyn.

[0005] The purpose of the present invention is achieved as follows:

[0006] A wiring method for the lead-out wire of a circular inductosyn, characterized in that the specific steps are as follows:

[0007] A. First, make a disc-shaped sealing bracket. There is a sealing bracket round hole penetrating up and down at each of the left and right edges of the sealing bracket, and four pin limiting holes penetrating up and down are provided in the middle of the sealing bracket;

[0008] B. On the metal substrate, there are terminal pin mounting holes, a sealing bracket mounting groove, and metal substrate screw holes; pass two screws through the sealing bracket round holes and screw them into the metal substrate screw holes to install the sealing bracket on the upper surface of the metal substrate, and the lower surface of the sealing bracket is closely attached to the upper surface of the metal substrate;

[0009] C. Weld the lead-out wire of the circular inductosyn to the bottom end of the terminal pin;

[0010] D. Insert the terminal pin vertically downward through the pin limiting hole on the potting bracket, so that the terminal pin is inserted into the pin mounting hole on the metal substrate corresponding to the pin limiting hole up and down.

[0011] E. Pour epoxy resin from the bottom of the metal substrate where the potting bracket is not installed. The epoxy resin flows into the pin mounting hole through the gap and cures at room temperature to fix the terminal pin on the metal substrate.

[0012] F. After potting is completed, remove the screws on the potting bracket and take out the potting bracket upward along the terminal pin.

[0013] G. Weld the detection wire to the top end of the terminal socket. The terminal socket is sleeved on the top end of the terminal pin to achieve signal transmission. When the circular inductosyn is installed or detected, the terminal socket can be quickly and repeatedly plugged and unplugged to achieve the quick conversion of the connection or disconnection between the lead-out wire of the circular inductosyn and the detection device.

[0014] A release agent is coated on the bottom of the potting bracket.

[0015] An outward convex step is provided in the middle of the bottom of the potting bracket, and an inward concave terminal pin mounting groove is provided in the middle of the upper surface of the metal substrate. The convex step in the middle of the bottom of the potting bracket can be tightly embedded into the terminal pin mounting groove in the middle of the upper surface of the metal substrate, and the epoxy resin is blocked in the terminal pin mounting groove.

[0016] The centers of the pin limiting hole and the pin mounting hole are on the same vertical line, and the inner diameter of the pin limiting hole is smaller than the inner diameter of the pin mounting hole, so that the pin limiting hole can center the terminal pin in the pin mounting hole.

[0017] Due to the adoption of the above technical solutions, the beneficial effects of the present invention are as follows:

[0018] 1. A metal substrate, a terminal pin, a terminal socket and a potting bracket are provided. By welding the lead-out wire of the circular inductosyn to the bottom end of the terminal pin, then potting the terminal pin in the pin mounting hole of the metal substrate, welding the detection wire to the top end of the terminal socket, and sleeving the terminal socket on the top end of the terminal pin, quick plugging and unplugging can be achieved, as well as the quick connection or disconnection between the circular inductosyn and the detection device, reducing frequent welding operations, improving the detection efficiency, shortening the overall manufacturing cycle of the circular inductosyn, and avoiding quality problems caused by repeated welding of the lead-out wire during the detection and installation of the circular inductosyn, which affect the insulation performance and appearance quality of the circular inductosyn.

[0019] 2. The potting bracket is installed on the metal substrate through screws, which can accurately position the terminal pin during potting and simultaneously block the epoxy resin to prevent it from overflowing.

[0020] 3. The pin of the terminal and the metal substrate are insulated by encapsulated epoxy resin. The insulation of the epoxy resin can reach more than 200 MΩ, achieving a good insulation effect. It can be used in the environment of -60°C to 120°C, improving the environmental adaptability of the circular inductosyn. The good insulation of the lead wire provides a reliable guarantee for the accuracy detection of the synchro. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the encapsulation structure of the pin of the terminal of the circular inductosyn;

[0022] Figure 2 It is a schematic cross-sectional view of the encapsulation structure of the pin of the terminal of the circular inductosyn;

[0023] Figure 3 It is a schematic diagram of the structure of the encapsulation bracket;

[0024] Figure 4 It is a schematic diagram of the finished product of the circular inductosyn;

[0025] In the figure: 1. Metal substrate; 2. Terminal pin; 3. Epoxy resin; 4. Encapsulation bracket; 5. Lead wire of the circular inductosyn; 6. Installation screw of the encapsulation bracket; 7. Terminal socket; 8. Detection wire; 9. Circular hole of the encapsulation bracket; 10. Convex step of the encapsulation bracket; 11. Pin limiting hole of the encapsulation bracket; 12. Pin installation hole of the metal substrate; 13. Installation groove of the bracket; 14. Screw hole of the metal substrate. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] The present invention will be further described in detail below with reference to the embodiments and the accompanying drawings.

[0027] A wiring method for the lead wire of a circular inductosyn specifically includes the following steps:

[0028] A. First, make a disc-shaped encapsulation bracket 4. There is a circular hole 9 of the encapsulation bracket that penetrates up and down on each of the left and right edges of the encapsulation bracket 4. There is an outward convex step 10 in the middle of the bottom of the encapsulation bracket 4. There are four pin limiting holes 11 that penetrate up and down in the middle of the encapsulation bracket 4;

[0029] B. There are terminal pin mounting holes 12, potting bracket mounting grooves 13, and metal substrate screw holes 14 on the metal substrate 1; a release agent is coated on the bottom of the potting bracket 4. Two screws 6 pass through the round holes 9 of the potting bracket and are screwed into the metal substrate screw holes 14 to mount the potting bracket 4 on the upper surface of the metal substrate 1. There is a concave bracket mounting groove 13 in the middle of the upper surface of the metal substrate 1. The convex step 10 in the middle of the bottom of the potting bracket 4 can be tightly embedded into the bracket mounting groove 13 in the middle of the upper surface of the metal substrate 1, and the lower surface of the potting bracket 4 is closely attached to the upper surface of the metal substrate 1;

[0030] C. Weld the lead wire 7 of the circular inductosyn to the bottom end of the terminal pin 2;

[0031] D. Pass the terminal pin 2 upward through the pin limiting hole 11 on the potting bracket 4, so that the terminal pin 2 is inserted into the pin mounting hole 12 on the metal substrate 1 corresponding to the pin limiting hole 11 up and down. The centers of the pin limiting hole 11 and the pin mounting hole 12 are on the same vertical line, and the inner diameter of the pin limiting hole 11 is smaller than the inner diameter of the pin mounting hole 12, so that the pin limiting hole 11 can center the terminal pin 2 in the pin mounting hole 12;

[0032] D. Pour the epoxy resin 3 from the bottom of the metal substrate 1 where the potting bracket 4 is not installed. The epoxy resin 3 flows into the pin mounting hole 12 from the gap and cures at room temperature to fix the terminal pin 2 on the metal substrate 1. The potting bracket 4 blocks the epoxy resin 3 in the bracket mounting groove 13;

[0033] E. After potting is completed, remove the screws 6 on the potting bracket 4 and take out the potting bracket 4 upward along the terminal pin 2;

[0034] F. Weld the detection wire 8 to the top end of the terminal socket 7. The terminal socket 7 is sleeved on the top end of the terminal pin 2 to achieve signal transmission; when the circular inductosyn is installed or detected, the terminal socket 7 can be quickly and repeatedly inserted and removed on the terminal pin 2 to achieve a quick conversion of the connection or disconnection between the lead wire 5 of the circular inductosyn and the detection device.

[0035] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and the concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A wiring method for the lead wire of a circular inductosyn, characterized in that: The specific steps are as follows: A. First, make a disc-shaped potting bracket. There is a potting bracket round hole penetrating up and down at each of the left and right edges of the potting bracket, and there are four pin limiting holes penetrating up and down in the middle of the potting bracket; B. On the metal substrate, there are terminal pin mounting holes, potting bracket mounting grooves, and metal substrate screw holes; Pass two screws through the potting bracket round holes and screw them into the metal substrate screw holes to install the potting bracket on the upper surface of the metal substrate, and the lower surface of the potting bracket is closely attached to the upper surface of the metal substrate; C. Weld the circular inductosyn lead wire to the bottom end of the terminal pin; D. Pass the terminal pin from top to bottom through the pin limiting hole on the potting bracket, so that the terminal pin is inserted into the pin mounting hole on the metal substrate corresponding to the pin limiting hole up and down; E. Pour epoxy resin from the bottom of the metal substrate where the potting bracket is not installed. The epoxy resin flows into the pin mounting hole from the gap and cures at room temperature to fix the terminal pin on the metal substrate; F. After potting is completed, remove the screws on the potting bracket and take out the potting bracket upward along the terminal pin; G. Weld the detection wire to the top end of the terminal socket. The terminal socket is sleeved on the top end of the terminal pin to achieve signal transmission; When the circular inductosyn is installed or detected, the terminal socket can be quickly and repeatedly inserted and removed to achieve a quick conversion of the connection or disconnection between the circular inductosyn lead wire and the detection device.

2. The wiring method of the lead wire of the circular induction synchronizer according to claim 1, characterized in that: A release agent is coated on the bottom of the potting bracket.

3. The wiring method of the lead wire of the circular induction synchro according to claim 1, characterized in that: There is an outward convex step in the middle of the bottom of the potting bracket, and there is an inward concave terminal pin mounting groove in the middle of the upper surface of the metal substrate. The convex step in the middle of the bottom of the potting bracket can be closely embedded into the terminal pin mounting groove in the middle of the upper surface of the metal substrate, and the epoxy resin is blocked in the terminal pin mounting groove.

4. The wiring method of the lead wire of the circular induction synchro according to claim 1, characterized in that: The centers of the pin limiting hole and the pin mounting hole are on the same vertical line, and the inner diameter of the pin limiting hole is smaller than the inner diameter of the pin mounting hole, so that the pin limiting hole can center the terminal pin in the pin mounting hole.

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