Server and electronic device

Abstract

The application relates to a server and an electronic device, and relates to the technical field of computers. The application is used to solve the problem that the internal memory module of a server is difficult to expand, thereby limiting the processing performance of the server. The server comprises a mainboard, a CPU and an expansion memory module. The mainboard comprises an expansion memory connector. The CPU is located on the mainboard and is coupled with the expansion memory connector. The expansion memory module is located on one side of the mainboard and is arranged in a spaced mode with the mainboard; the expansion memory module is coupled with the expansion memory connector.

Description

Technical Field

[0001] This disclosure relates to the field of computer technology, and more particularly to a server and electronic device. Background Technology

[0002] A server is a type of computer that provides various services to client computers on a network. Under the control of the operating system, a server provides connected external devices (such as hard drives and printers) to be shared by client sites on the network, and can also provide network users with services such as centralized computing, information dissemination, and data management.

[0003] A server comprises a motherboard, memory modules, a central processing unit (CPU), a power supply module, peripheral card modules (such as network cards and sound cards), and hard drive modules. Among these, the performance of the memory modules has a significant impact on the server's performance. Their function is to temporarily store data processed by the CPU, as well as data exchanged between the CPU and the hard drive modules, between the CPU and external storage, and between the CPU and the network—at least one of these. As long as the server is running, the CPU loads the data it needs to process into the memory modules, performs calculations, and then writes the results back to the memory modules. Therefore, the capacity of the memory modules determines the server's processing performance. Currently, due to the limited space available for arranging multiple modules within a server, memory modules are difficult to expand, thus limiting the server's processing performance. Summary of the Invention

[0004] This application provides a server and electronic device for increasing the amount of internal memory in a server and improving its processing performance.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] In a first aspect, a server is provided. The server includes a motherboard, a CPU, and an expansion memory module. The motherboard includes an expansion memory connector. The CPU is located on the motherboard and coupled to the expansion memory connector. The expansion memory module is located on one side of the motherboard and spaced apart from it; the expansion memory module is coupled to the expansion memory connector.

[0007] The server provided in this embodiment of the present disclosure, by setting the expansion memory module on one side of the motherboard and spaced apart from the motherboard, ensures that the expansion memory module is not limited by the space on the motherboard surface. Based on the memory module being provided on the motherboard, it is convenient to expand the amount of memory that works with the CPU, thereby improving the server's operating performance.

[0008] In addition, the space on one side of the motherboard in a server is larger than the space on the motherboard itself. Even if there are no memory modules on the motherboard, more expansion memory modules can be installed on one side of the motherboard, which makes it easier to expand the amount of memory that works with the CPU and improve the server's operating performance.

[0009] In some embodiments, the extended memory module includes multiple extended memory units. The multiple extended memory units are configured independently of each other, and each extended memory unit is coupled to one or more extended memory connectors.

[0010] Multiple independently configured extended memory units mean that there are no wiring connections between them, thus preventing direct signal exchange. Each independently configured extended memory unit can perform its memory function independently without affecting the others. In the event of a failure in one extended memory unit, the normal operation of other extended memory units is not affected, thereby improving the reliability of the extended memory module.

[0011] In some embodiments, each extended memory unit includes a circuit board; multiple circuit boards belonging to different extended memory units are spaced apart from each other.

[0012] Understandably, an extended memory module comprises multiple circuit boards spaced apart from each other. Each extended memory unit includes a circuit board and functional devices mounted on the circuit board to perform the memory function. The spacing between the multiple extended memory units can be understood as meaning that the circuit boards of different extended memory units are not shared.

[0013] Because the dimensions of different functional modules in a server are not uniform in the direction perpendicular to the motherboard, the space on the motherboard side of the server has a complex dimension in this direction, making it difficult to accommodate a large expansion memory module as a whole. In this embodiment, the expansion memory module includes multiple independent expansion memory units on multiple circuit boards, which facilitates the flexibility of the layout of the expansion memory units on the motherboard side of the server, thereby increasing the number of expansion memory units that can be arranged in the server, increasing the amount of memory that can cooperate with the CPU, and improving the server's operating performance.

[0014] In some embodiments, each extended memory unit includes a circuit board; multiple circuit boards belonging to different extended memory units are interconnected to form an integral structure.

[0015] Each extended memory unit includes a circuit board and functional devices disposed on the circuit board to realize the memory function. In this embodiment, multiple circuit boards of different extended memory units are close to each other and merged to form a single circuit board.

[0016] From another perspective, this can be understood as multiple extended memory units sharing a single circuit board. Different extended memory units occupy different areas of the circuit board, allowing each area to perform its own memory function. By sharing a single circuit board, multiple extended memory units can be centrally arranged within the server, facilitating maintenance and replacement of the extended memory modules.

[0017] In some embodiments, the server includes a first cable supporting a cache coherence bus. An extended memory unit includes a first high-speed connector and memory media. The first high-speed connector is coupled to the extended memory connector via the first cable; the memory media is coupled to the first high-speed connector.

[0018] The first high-speed connector utilizes a cache coherence bus and is coupled to the CPU via an extended memory connector. It can utilize channels other than those configured in the CPU to communicate with the memory modules, effectively increasing the number of communication channels between the CPU and memory, thereby increasing the amount of memory communicating with the CPU.

[0019] In some embodiments, the extended memory unit further includes an extended memory controller. The extended memory controller is connected in series between the first high-speed connector and the memory media. Multiple memory media, including one or more types of memory media, are coupled to one extended memory controller.

[0020] Because the extended memory controller is connected in series between the first high-speed connector and the memory medium, the CPU has no restrictions on the type of memory medium in the extended memory module. Therefore, multiple memory media coupled to the same extended memory controller can be of different types, thereby increasing the diversity of memory media in the server.

[0021] In some embodiments, the motherboard further includes a second high-speed connector. The second high-speed connector supports at least one communication protocol, including the communication protocol supported by the first high-speed connector. The second high-speed connector is multiplexed as an expansion memory connector.

[0022] The second high-speed connector is a connector already installed on the motherboard and can support one or more communication protocols. When the second high-speed connector supports multiple communication protocols, switching the communication protocol it operates on allows it to perform different functions. Specifically, the second high-speed connector supports at least one communication protocol, including the one supported by the first high-speed connector. Therefore, by switching the communication protocol of the second high-speed connector to the one supported by the first high-speed connector, signal interaction between the two connectors can be achieved.

[0023] This avoids the need for additional modifications to the motherboard circuitry and the cost of adding dedicated expansion memory connectors, while also optimizing server compatibility.

[0024] In some embodiments, the server further includes a second cable supporting the System Management Bus (SMBus) and a Baseboard Management Controller (BMC). The BMC is coupled to a first high-speed connector via the second cable.

[0025] The BMC, the second cable supporting SMBus, and the out-of-band port of the first high-speed connector together constitute a dedicated management network independent of the data network (which includes the communication channel between the CPU and the data port of the first high-speed connector). This enables out-of-band management of the extended memory module, including but not limited to intelligent power distribution, load measurement, temperature monitoring, error monitoring, log querying, device management, and remote control.

[0026] In some embodiments, at least one of the first cable and the second cable is a flexible cable.

[0027] The first cable is a flexible cable, which can bypass the obstruction of other structures between the expansion memory connector and the expansion memory module in the server, making it easier to achieve coupling between the first high-speed connector and the expansion memory connector, and also making it easier to adapt to changes in the position of the expansion memory module relative to the motherboard.

[0028] The second cable is a flexible cable, which can bypass the obstruction of other structures between the BMC and the expansion memory module in the server, making it easier to achieve coupling between the first high-speed connector and the BMC, and also making it easier to adapt to changes in the position of the expansion memory module relative to the motherboard.

[0029] In some embodiments, the first cable and the second cable may be the same cable. Understandably, the first cable and the second cable are integrated into a single physical cable.

[0030] In some embodiments, the length of the flexible cable is less than or equal to 150 cm.

[0031] This facilitates the arrangement of flexible cables in the server, increasing the flexibility of flexible cable arrangement in the server.

[0032] In some embodiments, the server further includes a power cable, the extended memory unit further includes a first power connector, and the motherboard further includes a second power connector. The second power connector is coupled to the first power connector via the power cable. The first power connector and / or the second power connector include at least one of a 2x3 power connector, a 2x4 power connector, and a 2x6 power connector.

[0033] The power connector can be at least one of the following: a 2x3 power connector, a 2x4 power connector, or a 2x6 power connector conforming to the PCIe CEM standard. The first and second power connectors can be of the same type, for example, both being 2x3 power connectors; or both being 2x4 power connectors. Alternatively, the first and second power connectors can be of different types, for example, the first power connector being a 2x3 power connector and the second being a 2x6 power connector. One 2x6 power connector couples to two 2x3 power connectors.

[0034] In this way, the server can select the appropriate power cable and power connector from a variety of power connection cables and power connectors according to the actual situation, thereby improving the flexibility of server assembly.

[0035] In some embodiments, the server further includes a housing and a bracket. The housing forms a receiving cavity, within which the motherboard is located. The bracket is connected to the housing; the bracket is located on one side of the motherboard and spaced apart from it, and an expansion memory module is mounted on the bracket.

[0036] The bracket can be fixedly connected to the base plate of the casing. For example, the bracket is fixed to the base plate with screws, and at the same time, the bracket builds a floating platform on one side of the motherboard, providing support and being spaced apart from the motherboard. The expansion memory module is fixedly connected to the floating platform, thereby enabling the expansion memory module to be placed on one side of the motherboard and spaced apart from the motherboard.

[0037] The bracket can also be fixedly connected to two frames opposite to the housing. For example, the bracket includes two connecting parts and a suspension part located between the two connecting parts. The two connecting parts are fixedly connected to the two frames opposite to the housing by screws, and the suspension part is fixedly connected to the expansion memory module, thereby enabling the expansion memory module to be placed on one side of the motherboard and spaced apart from the motherboard.

[0038] The bracket and housing work together to allow the expansion memory module to be placed on one side of the motherboard and spaced apart from it, without affecting the installation of other functional modules on the motherboard.

[0039] In some embodiments, the extended memory module and the CPU are located on the same side of the motherboard. The orthographic projection of the extended memory module on the motherboard at least partially overlaps with the orthographic projection of the CPU on the motherboard.

[0040] The projection of the extended memory module onto the motherboard at least partially overlaps with the projection of the CPU onto the motherboard. This allows the extended memory module to be positioned close to the CPU, thereby shortening the signal transmission distance during signal interaction between the extended memory module and the CPU and improving signal transmission integrity. Furthermore, the space on the side of the server furthest from the CPU is currently unobstructed, facilitating the installation of the extended memory module.

[0041] In some embodiments, the server further includes a memory module. The memory module is located on the motherboard and spaced apart from the CPU. The orthographic projection of the extended memory module on the motherboard at least partially overlaps with the orthographic projection of the memory module on the motherboard.

[0042] The memory module can be located on the same side of the motherboard as the expansion memory module and coupled to the CPU. The orthographic projection of the expansion memory module on the motherboard at least partially overlaps with the orthographic projection of the memory module on the motherboard, allowing for the clustering of memory modules that work with the CPU, facilitating the maintenance and replacement of all memory within the server. Furthermore, the space on the side of the server away from the motherboard is currently unobstructed, making it easy to install the expansion memory module.

[0043] In some embodiments, the expansion memory connector and the expansion memory module are located on the same side of the motherboard. The orthographic projection of the expansion memory connector on the motherboard does not coincide with the orthographic projection of the expansion memory module on the motherboard.

[0044] The projection of the expansion memory connector onto the motherboard does not coincide with the projection of the expansion memory module onto the motherboard. Understandably, the expansion memory module will not obstruct the expansion memory connector on the motherboard. This facilitates the assembly of cables and the expansion memory connector after the expansion memory module is secured.

[0045] In some embodiments, the server further includes an input / output module and a heat dissipation module. The input / output module is coupled to the motherboard; the heat dissipation module is coupled to the motherboard. An extended memory module is located between the input / output module and the heat dissipation module.

[0046] Input / output modules include various interfaces, resulting in a relatively large size of the input / output module in the direction perpendicular to the motherboard. Similarly, cooling modules can be fan modules, and the large size of the fan results in a relatively large size of the cooling module in the direction perpendicular to the motherboard.

[0047] In this embodiment, the extended memory module is located between the input / output module and the heat dissipation module, which can avoid the setting of the input / output module and the heat dissipation module, reduce the size of the server in the direction perpendicular to the motherboard, and facilitate server miniaturization.

[0048] In some embodiments, the height range of the input / output module and the height range of the extended memory module, in a direction perpendicular to the motherboard, at least partially overlap.

[0049] Understandably, the height range of the input / output modules perpendicular to the motherboard overlaps with that of the expansion memory modules. This optimizes the internal space layout of the server, making the server's size perpendicular to the motherboard smaller than the sum of the heights of the input / output modules and the expansion memory modules perpendicular to the motherboard, thus facilitating server miniaturization.

[0050] In some embodiments, the height range of the heat dissipation module and the height range of the extended memory module, in the direction perpendicular to the motherboard, at least partially overlap.

[0051] Understandably, the height range of the heat dissipation module perpendicular to the motherboard overlaps with that of the expansion memory module perpendicular to the motherboard. This optimizes the internal space layout of the server, making the server's size perpendicular to the motherboard smaller than the sum of the heights of the input / output module and the expansion memory module perpendicular to the motherboard, thus facilitating server miniaturization.

[0052] Secondly, an electronic device is provided. This electronic device includes a power supply and a server. The server is coupled to the power supply; wherein the server is the server as described in any of the above embodiments.

[0053] The technical effects of the second aspect are the same as those of the first aspect, and will not be repeated here. Attached Figure Description

[0054] Figure 1 This is a schematic diagram showing the arrangement of the CPU and memory modules in a motherboard according to some embodiments;

[0055] Figure 2 This is a three-dimensional structural diagram of a server provided according to some embodiments;

[0056] Figure 3 This is a top view of a motherboard in a server according to some embodiments;

[0057] Figure 4 For along Figure 3 A cross-sectional view formed by line A-A' in the middle;

[0058] Figure 5 This is a top view of a motherboard in a server according to some embodiments;

[0059] Figure 6This is a schematic diagram of the structure between the CPU, memory module, and extended memory module in a server according to some embodiments;

[0060] Figure 7 This is a schematic diagram of the structure of an extended memory module in a server according to some embodiments;

[0061] Figure 8 This is a schematic diagram of the structure of a server according to some embodiments;

[0062] Figure 9 This is a schematic diagram of the structure of a server according to some embodiments. Detailed Implementation

[0063] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0064] The technical solutions in some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application are within the scope of protection of this application.

[0065] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0066] In describing some embodiments, the terms "connected," "linked," and their derivative expressions may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components are in direct or indirect physical contact with each other. For example, "A and B are connected" can mean that A and B are connected directly, or it can mean that A and B are connected through other components. In addition, the term "coupled" can refer to an electrical connection that enables signal transmission.

[0067] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0068] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0069] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0070] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0071] This application provides a server. The server can be a server device from a network provider or a content provider.

[0072] Based on their form factor, servers can be rack-mounted servers, blade servers, or tower servers; no specific limitation is made here. For ease of explanation later, this article will use rack-mounted servers as an example.

[0073] Rack servers can be installed in server racks. Rack servers typically come in various form factors, such as 1U, 2U, 3U, 4U, 5U, 6U, and 8U standard rack servers. The rack has mounting spaces to accommodate different form factors, and it also has screw holes for securing the rack server. Screws pass through these holes to fix the server to the rack, thus defining the installation location for each rack server.

[0074] The server provided in this application embodiment may include a casing, a motherboard disposed within the casing, and multiple functional modules. These functional modules may include a CPU, a heat dissipation module, an input / output (I / O) module, a power supply module, a memory module, a hard disk module, etc. Each functional module can be electrically connected to the motherboard or via cables to perform its respective function, thereby enabling the server to function as a whole. The performance of the memory module has a significant impact on the server. Its function is to temporarily store at least one of the following: data processed by the CPU, data exchanged between the CPU and the hard disk module, data exchanged between the CPU and external storage, and data exchanged between the CPU and the network. As long as the server is running, the CPU will load the data to be processed into the memory module for storage, read data from the memory module for processing, and then write the processing results back into the memory module. Therefore, the capacity of the memory module determines the server's processing performance.

[0075] Currently, all servers on the market have standardized dimensions, which limits the area available for multiple modules within the server and makes it difficult to expand memory modules, thus restricting the server's operating capacity. Figure 1 The diagram illustrates the structure of the CPU and memory slots on the motherboard in some embodiments. For example, as shown... Figure 1 As shown, the server can be a 2U standard rack server. The motherboard 01 has two CPUs (CPU0 and CPU1) 02 arranged in alignment. Based on a feasibility assessment of the motherboard 01, each CPU 02 provides 8 physical channels, and each physical channel supports 2 memory slots 03. Therefore, the motherboard 01 can only support a maximum of 32 memory slots 03, making it difficult to further expand the server's memory.

[0076] Figure 2 A three-dimensional structural diagram of some functional modules in a server according to some embodiments is shown; Figure 3 This is a top view of a motherboard in a server according to some embodiments; Figure 4 It shows along Figure 3 A cross-sectional view formed by line A-A' in the middle; Figure 5 This is a top view of a motherboard in a server according to some embodiments. For example... Figures 2 to 5 As shown, the server 1000 provided in this embodiment may include a housing 100, and a motherboard 200, a CPU 300 and an extended memory module 400 located within the housing 100.

[0077] The outer casing 100 can be made of plastic or metal. The interior of the outer casing 100 has a space to accommodate multiple functional modules such as the motherboard 200, CPU 300, and expansion memory module 400. The outer casing 100 defines the installation position of each functional module inside the server 1000, while protecting the functional modules within the space from external damage.

[0078] In some examples, server 1000 can be a rectangular server, and housing 100 can be a rectangular housing. Housing 100 may include a bottom cover and a top cover disposed opposite each other, and a frame 110 connecting the bottom cover and the top cover respectively. The bottom cover, top cover, and frame 110 may enclose a closed or open receiving space. In addition, housing 100 may have multiple positioning holes, which can be used to fix each functional module within the receiving space of housing 100 and define the installation position of the functional module.

[0079] The motherboard 200 is one of the most critical components of the server 1000. The motherboard 200 has positioning holes, which, along with the positioning holes on the bottom cover of the casing, allow the motherboard 200 to be securely mounted to the bottom cover.

[0080] The motherboard 200 can provide a variety of slots, and the motherboard 200 is equipped with circuit traces that couple the slots. After the functional modules are inserted into the slots, the multiple functional modules that cooperate with the slots can use the circuit traces in the motherboard 200 to achieve coupling between the functional modules and realize signal interaction between the functional modules.

[0081] For example, the motherboard 200 has a CPU socket and a memory slot. The pins of the CPU 300 are inserted into the CPU socket and mounted on the motherboard 200, while the pins of the memory module are inserted into the memory slot and mounted on the motherboard 200. The CPU 300 and the memory module can be spaced apart from each other and coupled through internal circuit traces of the motherboard 200 to achieve signal interaction between the CPU 300 and the memory module. Of course, in other embodiments, the motherboard 200 may not have a CPU socket, and the CPU 300 may be directly mounted on the surface of the motherboard 200.

[0082] In some examples, the motherboard 200 may also have other slots, such as a southbridge chip slot, a graphics processing unit (GPU) slot, a hard drive slot, an integrated sound card slot, and an integrated network card slot. The CPU 300 can also use the motherboard 200 to exchange signals with functional modules such as the southbridge chip, GPU, hard drive module, integrated sound card, and integrated network card.

[0083] In other examples, the motherboard 200 may also integrate expansion slots such as a Peripheral Component Interconnect Express (PCIE) slot. PCIE is a point-to-point dual-channel high-bandwidth peripheral interconnect, where each connected device has its own dedicated channel bandwidth and does not share the bus bandwidth. PCIE has the advantage of high data transfer rates, which can improve the signal interaction efficiency of two functional modules coupled through PCIE, thereby improving the efficiency of data interaction within the server.

[0084] The CPU300 is the processing core of the Server 1000. The CPU300 can include at least an arithmetic logic unit (ALU), a register unit, and a control unit. The ALU is primarily responsible for performing logical operations, such as shift operations and other logical operations. It can also perform fixed-point or floating-point arithmetic operations, address calculations, and translations, making it a multi-functional processing unit. The register unit is used to temporarily store instructions, data, and addresses. The control unit analyzes instructions and issues corresponding control signals.

[0085] The extended memory module 400 is coupled to the CPU 300 and has the same function as a conventional memory module. Understandably, the extended memory module 400 can temporarily store at least one of the following: data processed by the CPU 300, data exchanged between the CPU and the hard disk module, data exchanged between the CPU and external storage, and data exchanged between the CPU and the network. When the server is running, the CPU 300 can load the data requiring computation into the extended memory module 400 for storage, read data from the extended memory module 400 for computation, and then write the computation result back to the extended memory module 400.

[0086] like Figure 4 As shown, the extended memory module 400 is installed on one side of the motherboard 200 and spaced apart from it. The extended memory module 400 can be located on the same side of the motherboard 200 as the CPU 300. In essence, the extended memory module 400 is located in the space above the motherboard 200, but does not contact it. Exemplarily, the space above the extended memory module 400 can cover areas on the motherboard 200 where functional modules are already installed, areas on the motherboard 200 where no functional modules are installed, and areas outside the motherboard 200. Therefore, the space on one side of the motherboard 200 is larger than the expandable space on the motherboard 200.

[0087] In this way, the installation of the extended memory module 400 is not limited by the space on the surface of the motherboard 200, making it easy to expand the amount of memory that interacts with the CPU 300.

[0088] In some examples, the server includes an expansion memory module 400 located on one side of the motherboard 200, but does not include the memory module installed on the motherboard 200. Therefore, the space originally reserved for the memory module in the motherboard 200 can be used to expand other functional modules, reducing the expansion pressure on other functional modules on the motherboard. For example, adding a CPU 300 to the reserved space originally for the memory module can increase the number of CPUs 300 in the server, thereby increasing the server's computing power.

[0089] In other examples, such as Figure 3 As shown, the server can include both an expansion memory module 400 located on one side of the motherboard 200 and a memory module 500 installed on the motherboard 200. The memory module 500 and the expansion memory module 400 are arranged in a layered manner. The CPU 300 can retrieve a portion of the data to be processed and store it in the expansion memory module 400. The CPU 300 reads data from the expansion memory module 400, performs calculations, and then writes the calculation results back to the expansion memory module 400. The CPU 300 can also retrieve another portion of the data to be processed and store it in the memory module 500. The CPU 300 reads data from the memory module 500, performs calculations, and then writes the calculation results back to the memory module 500. This increases the amount of memory that can be used with the CPU 300, thereby improving the server's processing performance.

[0090] In addition, an expansion memory module is set on one side of the motherboard, which effectively utilizes the previously unused space inside the server. It can increase the amount of memory in the server that works with the CPU300 without increasing the overall size of the server, thereby improving the server's memory density.

[0091] like Figure 9 As shown, in some embodiments, the server may further include a heat sink. The heat sink may include a main heat sink 310 and a secondary heat sink 320. The main heat sink 310 is disposed around the CPU 300 to dissipate heat from the CPU 300. The secondary heat sink 320 is connected to the main heat sink 310 via heat pipes to enhance the heat dissipation capacity of the CPU 300. The number of secondary heat sinks 320 may be one or more, and is not limited here.

[0092] In some examples, where the server does not include the expansion memory module 400, the main heatsink 310 is located on the side of the CPU 300 furthest from the motherboard 200 and has a larger size in the direction perpendicular to the motherboard 200 to ensure that the CPU's cooling requirements are met. However, if the server includes the expansion memory module 400, the size of the main heatsink 310 in the direction perpendicular to the motherboard 200 can be reduced, and a separate heatsink 320 connected to the main heatsink 310 can be added to maintain roughly the same cooling performance to continue meeting the CPU's cooling requirements.

[0093] Of course, other methods can be used to reduce the size of the main heatsink 310 in the direction perpendicular to the motherboard 200. This is just an example and should not be regarded as a limitation on the solution.

[0094] In other examples, the projection of the extended memory module 400 onto the motherboard may not coincide with the projection of the CPU 300 onto the motherboard. Understandably, the extended memory module 400 is positioned to avoid the space directly above the CPU 300, thus avoiding modifications to the main heatsink and improving the ease of expansion of the extended memory module 400 within the server.

[0095] like Figure 2 and Figure 3 As shown, in some embodiments, the motherboard 200 may further include an expansion memory connector 210. The expansion memory connector 210 is coupled to the expansion memory module 400 and also to the CPU 300. This achieves coupling between the expansion memory module 400 and the CPU 300, enabling them to cooperate and perform data processing and data storage functions.

[0096] The extended memory module 400 may include one or more extended memory units. In some examples, the extended memory units may be independently configured on one side of the motherboard 200. This independent configuration means that there is no wiring coupling between the multiple extended memory units, thus preventing direct signal interaction between them. Multiple independently configured extended memory units can each perform memory functions independently without affecting each other. In the event of a failure in one extended memory unit, the normal operation of other extended memory units is not affected, thereby improving the reliability of the extended memory module.

[0097] like Figure 3 As shown, in some embodiments, each extended memory unit 401 includes a circuit board; multiple circuit boards belonging to different extended memory units 401 are spaced apart from each other.

[0098] Understandably, an extended memory module comprises multiple independent circuit boards arranged at intervals between each other. Each extended memory unit includes a circuit board and functional devices mounted on the circuit board to perform the memory function. The multiple extended memory units are arranged at intervals between each other, which can be understood as different extended memory units not sharing the same circuit board.

[0099] Because the dimensions of different functional modules in a server are not uniform in the direction perpendicular to the motherboard, the space on the motherboard side of the server has a complex dimension in this direction, making it difficult to accommodate a large expansion memory module as a whole. In this embodiment, the expansion memory module includes multiple independent expansion memory units on multiple circuit boards, which facilitates the flexibility of the layout of the expansion memory units on the motherboard side of the server, thereby increasing the number of expansion memory units that can be arranged in the server, increasing the amount of memory that can cooperate with the CPU, and improving the server's operating performance.

[0100] like Figure 5 As shown, in some embodiments, each extended memory unit 401 includes a circuit board 402; multiple circuit boards 402 belonging to different extended memory units 401 are interconnected to form an integral structure.

[0101] Each extended memory unit 401 includes a circuit board 402 and functional devices disposed on the circuit board to realize the function of memory. In this embodiment, multiple circuit boards 402 of different extended memory units 401 are close to each other and merged to form a single circuit board.

[0102] From another perspective, this can be understood as multiple extended memory units 401 sharing a single circuit board. Different extended memory units occupy different areas of the circuit board, allowing each area to perform its own memory function. By sharing the same circuit board, multiple extended memory units can be centrally arranged within the server, facilitating maintenance and replacement of the extended memory modules.

[0103] The number of expansion memory connectors 210 can be equal to the number of expansion memory cells. For example, multiple expansion memory cells are coupled one-to-one with multiple expansion memory connectors 210. The number of expansion memory connectors 210 can also be unequal to the number of expansion memory cells. For example, one expansion memory cell can be coupled to multiple expansion memory connectors 210; or, multiple expansion memory cells can be coupled to one expansion memory connector 210.

[0104] In some examples, the expansion memory connector 210 can be an additional connector added to the existing motherboard 200 for coupling with the expansion memory module 400. That is, the expansion memory connector 210 exists only when the server includes the expansion memory module 400, and the motherboard 200 also has newly added circuit traces for coupling the expansion memory connector 210 with the CPU 300. This allows the CPU 300 and the expansion memory module 400 to exchange signals and cooperate to complete data processing and data storage functions without occupying the original connectors on the motherboard 200.

[0105] In other examples, the extended memory unit may include a first high-speed connector mounted on a circuit board. The extended memory connector 210 may also be a second high-speed connector already present on the motherboard 200. The second high-speed connector already present on the motherboard 200 is a connector adapted to the extended memory module 400. Adaptation of the second high-speed connector to the extended memory module 400 means that the second high-speed connector supports at least one communication protocol, including the communication protocols supported by the first high-speed connector. For example, the second high-speed connector supports multiple communication protocols: PCIe, Compute Express Link (CXL), and the first high-speed connector supports the CXL communication protocol.

[0106] The coupling between the second high-speed connector and the CPU 300 supports multiple communication protocols (e.g., PCIe, CXL). The CPU 300 can automatically negotiate the communication protocol with the expansion memory module 400 through the second high-speed connector, enabling the CPU, the second high-speed connector, and the first high-speed connector to support the same communication protocol (e.g., CXL). Thus, the second high-speed connector functions as the expansion memory connector 210. Utilizing the existing circuit traces on the motherboard 200 that are coupled to both the expansion memory connector 210 and the CPU 300, the CPU 300 and the expansion memory module 400 can exchange signals and cooperate to complete computational functions.

[0107] In some embodiments, the expansion memory connector 210 is coupled to the expansion memory module 400 via a flexible cable bundle 700. The flexible cable bundle 700 may include two end interfaces coupled to the expansion memory connector 210 and the expansion memory module 400, and a flexible connecting cable bundle connecting the two end interfaces.

[0108] For example, the flexible cable bundle 700 may include high-speed cables and connectors supporting the PCIE standard, such as mini cool edge input / output (MCIO) cables and connectors, slimline cables and connectors, Union Bus Connector (UBC) cables and connectors, Union Bus Connector Double Density UBCDD cables and connectors, Slim Serial Attached Small Computer System Interface (SlimSAS) cables and connectors, Mini Serial Attached Small Computer System Interface High Density (MiniSAS HD) cables and connectors, etc., without limitation.

[0109] In some examples, the connectors at both ends of the flexible cable harness 700 are the same. For example, the connectors connecting the flexible cable harness 700 to the expansion memory module 400 and to the expansion memory connector 210 are both MCIO connectors. In other examples, the connectors at one end of the flexible cable harness 700 are different from those at the other end. For example, the connector connecting the flexible cable harness 700 to the expansion memory module 400 is an MCIO connector, while the connector connecting the flexible cable harness 700 to the expansion memory connector 210 is a UBC connector.

[0110] In some examples, the number of connectors at both ends of the flexible cable harness 700 is equal. For example, the flexible cable harness 700 has one connector connecting to the expansion memory module 400 and one connector connecting to the expansion memory connector 210. In other examples, the number of connectors at one end of the flexible cable harness 700 is not equal to the number of connectors at the other end. For example, the flexible cable harness 700 has one connector connecting to the expansion memory module 400, but multiple connectors connecting to the expansion memory connector 210, with each multiple connector connecting to multiple expansion memory connectors 210.

[0111] In some embodiments, the extension length of the flexible cable bundle 700 can be less than or equal to 150cm, such as 150cm, 140cm, 130cm, 120cm, 110cm, 100cm, 98cm, 95cm, 90cm, 85cm, 80cm, 75cm, 60cm, 50cm, 40cm, 30cm, 20cm, or 10cm. The flexible cable bundle 700 can be flexibly arranged inside the server, achieving coupling between the expansion memory connector 210 and the expansion memory module 400 without affecting the original module layout.

[0112] The flexible cable bundle 700 serves a data transmission function. By limiting the flexible cable bundle 700 to a range of less than or equal to 150cm, the distance of data transmission within the flexible cable bundle 700 can be shortened, thereby improving the integrity of signals transmitted through the flexible cable bundle 700.

[0113] In some embodiments, the extended memory units in the extended memory module 400 may include circuit boards. Where multiple extended memory units can be configured independently, the circuit boards of the multiple extended memory units are configured independently; where multiple extended memory units are centrally located, the circuit boards of the multiple extended memory units may share the same circuit board.

[0114] The extended memory unit may also include a first high-speed connector 410 and a memory medium (also known as a memory module) 420 mounted on a circuit board. The memory medium may be mounted on the circuit board in two ways: either the circuit board has memory slots on it, with the pins of the memory medium inserted into the slots; or the memory medium chips (memory chips) may be directly soldered onto the circuit board.

[0115] The first high-speed connector 410 can be a high-speed connector that supports the PCIE standard, such as MCIO connector, Slimline connector, UBC connector, UBCDD connector, SlimSAS connector, MiniSAS HD connector, etc.

[0116] The first high-speed connector 410 can support suitable communication protocols such as Compute Express Link (CXL), OpenCAPI, Generation Z, NVLINK, and CCIX, without limitation.

[0117] The memory medium 420 can be storage class memory (SCM), persistent memory (PMEM), or dual-inline memory modules (DIMMs) such as DDR5 and DDR4.

[0118] Taking the first high-speed connector 410 as an example, which supports the CXL communication protocol, the flexible cable bundle 700 may include a first cable supporting the Cache Coherence Bus (CXL). For example, if the first high-speed connector 410 and the flexible cable bundle 700 support the CXL 2.0 standard, their transmission rate reaches 32GT / s; or if they support the CXL 3.0 standard, their transmission rate reaches 64GT / s. The first high-speed connector 410 is coupled to the expansion memory connector 210 on the motherboard 200 via the first cable in the flexible cable bundle 700.

[0119] The first high-speed connector 410 utilizes a cache coherence bus and is coupled to the CPU 300 via the extended memory connector 210. It can utilize channels other than those in the CPU 300 configured to communicate with the memory module 500. This is equivalent to increasing the bandwidth between the CPU 300 and the memory by increasing the number of communication channels between the CPU 300 and the memory, and also makes it easier to increase the number of memory modules that communicate with the CPU 300.

[0120] In some embodiments, a first high-speed connector 410 in the extended memory unit is configured to be coupled to at least one memory medium 420. For example, a first high-speed connector 410 is coupled to one memory medium 420; another example is that a first high-speed connector 410 is coupled to two memory media 420; yet another example is that a first high-speed connector 410 is coupled to four memory media 420.

[0121] It should be noted that the first high-speed connector 410 is coupled to the memory medium 420, which can be either a direct coupling or an indirect coupling; no limitation is made here.

[0122] In some embodiments, the first high-speed connector 410 may include at least one of x16 port mode, x8 port mode, x4 port mode, x2 port mode, and x1 port mode. For example, both ends of the first cable are x8 port mode connectors, and the first high-speed connector 410 and the expansion memory connector 210 are both x8 port mode connectors. Alternatively, both ends of the first cable are x16 port mode connectors, and both the first high-speed connector 410 and the expansion memory connector 210 are both x16 port mode connectors. For example, one end of the first cable has one x16 port mode connector, and the other end has two x8 port mode connectors. For instance, the first high-speed connector 410 can be an x16 port mode connector, the expansion memory connector 210 can be an x8 port mode connector, and one x16 port mode first high-speed connector 410 can simultaneously couple two x8 port mode expansion memory connectors 210. For example, the first high-speed connector 410 can be an x8 port mode connector, and the expansion memory connector 210 can be an x16 port mode connector. Two x8 port mode first high-speed connectors 410 are coupled to one x16 port mode expansion memory connector 210 at the same time.

[0123] In this way, the server can select the appropriate port mode from multiple port modes to configure the first high-speed connector 410 and the extended memory connector 210 according to the actual situation, thereby improving the flexibility of server assembly.

[0124] In some embodiments, the extended memory unit in the extended memory module 400 may further include an extended memory controller 430. The extended memory controller 430 is connected in series between the first high-speed connector 410 and the memory medium 420. Understandably, the first high-speed connector 410 is coupled to the extended memory controller 430, and the extended memory controller 430 is further coupled to the memory medium 420.

[0125] Because the extended memory controller 430 is connected in series between the first high-speed connector 410 and the memory medium 420, the CPU 300 has no restrictions on the type of memory medium 420 in the extended memory module 400. Therefore, multiple memory media 420 coupled to the same extended memory controller 430 can be of different types. In addition, different extended memory controllers 430 can also be coupled to memory media of different types.

[0126] In the absence of an expansion memory controller 430 in the expansion memory module 400, a unified communication protocol is needed within the communication network comprised of the CPU 300, the expansion memory connector, the first high-speed connector, and the storage medium. This allows for signal interaction between the CPU 300 and the memory medium in the expansion memory module 400, enabling them to cooperate in performing computational functions. However, if the expansion memory module 400 includes an expansion memory controller 430, such as... Figure 6 As shown, the extended memory controller 430 functions to convert communication protocols, allowing the communication protocol between the memory medium and the extended memory controller to be different from the communication protocol within the communication network composed of the CPU 300, the extended memory connector, the first high-speed connector, and the extended memory controller. The extended memory controller 430 can convert the communication protocol of the data provided by the memory medium 420 into a communication protocol that can communicate with the CPU 300. Therefore, the extended memory module 400 can include multiple types of memory media with different communication protocols. For example, the multiple storage media in the extended memory module 400 can include both DDR5 and SCM.

[0127] In some embodiments, in the extended memory module 400, the number of first high-speed connectors 410 is equal to the number of extended memory controllers 430. For example, multiple first high-speed connectors 410 in the extended memory module 400 are coupled to multiple extended memory controllers 430 in a one-to-one correspondence.

[0128] In other embodiments, the number of first high-speed connectors 410 in the extended memory module 400 is not equal to the number of extended memory controllers 430. For example, one extended memory controller 430 in the extended memory module 400 may be coupled to multiple first high-speed connectors 410 simultaneously. Yet another example is that one first high-speed connector 410 in the extended memory module 400 may be coupled to multiple extended memory controllers 430 simultaneously.

[0129] In some embodiments, in the extended memory module 400, the number of memory media 420 is greater than or equal to the number of extended memory controllers 430. For example, one extended memory controller 430 is coupled to only one memory media 420. Alternatively, one extended memory controller 430 may be coupled to multiple memory media 420, in which case the memory capacity of the extended memory module 400 can be further increased, thereby improving the server's processing performance.

[0130] Combination Figure 3 and Figure 7As shown, in some embodiments, the extended memory module 400 in the server may include four extended memory units. Each extended memory unit may include two first high-speed connectors 410, two extended memory controllers 430, and four memory media 420. Inside the extended memory unit, one first high-speed connector 410 is coupled to one extended memory controller 430, which is simultaneously coupled to two memory media 420; another first high-speed connector 410 is coupled to another extended memory controller 430, which is simultaneously coupled to two more memory media 420. Outside the extended memory unit, the first high-speed connector 410 inside the extended memory unit is coupled to the extended memory connector 210 on the motherboard 200 via a first cable in the flexible cable bundle 700.

[0131] like Figure 7 As shown, the extended memory unit in the extended memory module 400 may also include a first power connector 440, and the motherboard 200 may also include a second power connector (not shown). The flexible cable bundle 700 may also include a power connection line, and the first power connector 440 is coupled to the second power connector through the power connection line.

[0132] The power connector can be at least one of the following: a 2x3 power connector, a 2x4 power connector, or a 2x6 power connector conforming to the PCIE CEM standard. The first and second power connectors can be of the same type, for example, both being 2x3 power connectors; or both being 2x4 power connectors. Alternatively, the first and second power connectors can be of different types, for example, the first power connector being a 2x6 power connector and the second being a 2x3 power connector. One 2x6 power connector couples to two 2x3 power connectors.

[0133] In this way, the server can select the appropriate power cable and power connector from a variety of connection modes and ports according to the actual situation, improving the flexibility of server assembly.

[0134] In some embodiments, the flexible cable bundle 700 may further include a second cable supporting a System Management Bus (SMBus). The server may also include a Baseboard Management Controller (BMC). The BMC is coupled to a first high-speed connector 410 in the extended memory module 400 via the second cable.

[0135] It should be noted that the BMC has different names in different computing devices. For example, some companies call it BMC, others call it iLO (Integrated Lights-out), and still others call it iDRAC (Integrated Dell Remote Access Controller). Regardless of whether it is called BMC, iLO, or iDRAC, it can be understood as the BMC in this embodiment of the invention. The BMC, the second cable supporting SMBus, and the out-of-band port of the first high-speed connector 410 together constitute a dedicated management network independent of the data network (the data network includes the communication channel between the CPU 300 and the data port of the first high-speed connector 410), realizing out-of-band management of the extended memory module 400. Out-of-band management may include, but is not limited to, intelligent power distribution, load measurement, temperature monitoring, error monitoring, log query, device management, and remote control.

[0136] For example, while the extended memory module 400 is running, the BMC can obtain the operating data of the extended memory module 400 from the first high-speed connector 410 through a second cable supporting the SMBus bus, so as to monitor the extended memory module 400.

[0137] In some embodiments, such as Figure 2 As shown, the server may also include a bracket 600. The bracket 600 can be fixedly connected to the housing 100. The bracket 600 is located on one side of the motherboard 200 and the expansion memory module 400 is mounted on the bracket 600, thereby enabling the expansion memory module 400 to be suspended above the motherboard 200.

[0138] The bracket 600 can be fixedly connected to the base plate of the housing 100. For example, one end of the bracket 600 is fixedly connected to the base plate with screws, while the other end of the bracket 600 has a support bracket on one side of the motherboard, which is spaced relative to the motherboard. The expansion memory module 400 is fixedly connected to the bracket.

[0139] The bracket 600 can also be fixedly connected to the two frames 110 opposite to the housing 100. For example, the bracket 600 may include two connecting parts 610 and a suspension part 620 located between the two connecting parts 610. The two connecting parts 610 are fixedly connected to the two frames 110 opposite to the housing by screws, and the suspension part 620 is fixedly connected to the expansion memory module 400.

[0140] In some examples, such as Figure 2As shown, the suspension part 620 can be located on the side of the connecting part 610 closer to the motherboard 200. In this case, the distance between the suspension part 620 and the motherboard 200 is small. The expansion memory module 400 can be located on the side of the suspension part 620 away from the motherboard 200. In essence, the suspension part 620 is located between the motherboard 200 and the expansion memory module 400. Thus, the bracket is fixed to the housing, and after removing the top cover, the expansion memory in the expansion memory module 400 can be replaced and maintained.

[0141] In other examples, the suspension part 620 can be flush with the edge of the frame 110 away from the motherboard 200. In this case, the distance between the suspension part 620 and the motherboard 200 is relatively large, and the expansion memory module 400 can be located on the side of the suspension part 620 closer to the motherboard 200. In essence, the expansion memory module 400 is located between the motherboard 200 and the suspension part 620. This allows for the replacement and maintenance of the expansion memory in the expansion memory module 400 after the bracket is removed from the housing.

[0142] In some embodiments, such as Figure 3 As shown, the extended memory module 400 and the CPU 300 are located on the same side of the motherboard 200, and the orthographic projection of the extended memory module 400 on the motherboard 200 at least partially overlaps with the orthographic projection of the CPU 300 on the motherboard 200. Understandably, the extended memory module 400 is located on the side of the CPU 300 away from the motherboard 200, and at least partially covers the CPU 300.

[0143] In some examples, the orthographic projection of the extended memory module 400 onto the motherboard 200 coincides with the orthographic projection of the CPU 300 onto the motherboard 200. Understandably, the extended memory module 400 completely covers the CPU 300 setup. In other examples, the orthographic projection of the extended memory module 400 onto the motherboard 200 partially coincides with the orthographic projection of the CPU 300 onto the motherboard 200. Understandably, the extended memory module 400 partially covers the CPU 300 setup.

[0144] The projection of the extended memory module 400 onto the motherboard 200 at least partially overlaps with the projection of the CPU 300 onto the motherboard 200. This allows the extended memory module 400 to be positioned close to the CPU 300, thereby shortening the signal transmission distance during signal interaction between the extended memory module 400 and the CPU 300 and improving signal transmission integrity. Furthermore, since there are currently no obstructions in the space on the side of the server away from the CPU, the placement of the extended memory module 400, which at least partially covers the CPU 300, facilitates its installation.

[0145] In some embodiments, the extended memory module 400 and the memory module 500 are located on the same side of the motherboard 200, and the orthographic projection of the extended memory module 400 on the motherboard 200 at least partially overlaps with the orthographic projection of the memory module 500 on the motherboard 200. It can be understood that the extended memory module 400 is located on the side of the memory module 500 away from the motherboard 200, and at least partially covers the memory module 500.

[0146] In some examples, the orthographic projection of the extended memory module 400 onto the motherboard 200 coincides with the orthographic projection of the memory module 500 onto the motherboard 200. Understandably, the extended memory module 400 completely covers the memory module 500 setup. In other examples, the orthographic projection of the extended memory module 400 onto the motherboard 200 partially coincides with the orthographic projection of the memory module 500 onto the motherboard 200. Understandably, the extended memory module 400 partially covers the memory module 500 setup.

[0147] The projection of the extended memory module 400 onto the motherboard 200 at least partially overlaps with the projection of the memory module 500 onto the motherboard 200. This allows for the clustering of memory modules that work with the CPU 300, facilitating maintenance and replacement of all memory within the server. Furthermore, since there are currently no obstructions in the space on the side of the server away from the motherboard, the arrangement of the extended memory module 400 at least partially covering the memory module 500 facilitates the installation of the extended memory module 400.

[0148] When the extended memory module 400, CPU 300, and memory module 500 are all located on the same side of the motherboard 200, the following four arrangements are possible: 1. The orthogonal projection of the extended memory module 400 on the motherboard 200 coincides with the orthogonal projection of the CPU 300 and the memory module 500 on the motherboard 200; 2. The orthogonal projection of the extended memory module 400 on the motherboard 200 coincides with the orthogonal projection of the CPU 300 on the motherboard 200. The projection of the extended memory module 400 onto the motherboard 200 coincides with the projection of the CPU 300 onto the motherboard 200 and the projection of the memory module 500 onto the motherboard 200.

[0149] In some embodiments, such as Figure 3As shown, the expansion memory connector 210 and the expansion memory module 400 are located on the same side of the motherboard 200, which can facilitate the shortening of the length of the flexible cable bundle 700 that couples the expansion memory connector 210 and the expansion memory module 400 respectively, thereby shortening the signal transmission distance between the CPU 300 and the expansion memory module 400 and improving the integrity of signal transmission.

[0150] In some embodiments, such as Figure 3 As shown, the orthographic projection of the expansion memory connector 210 on the motherboard 200 does not coincide with the orthographic projection of the expansion memory module 400 on the motherboard 200. Understandably, the expansion memory module 400 will not obstruct the expansion memory connector 210 on the motherboard 200. This facilitates the assembly of the flexible cable bundle 700 with the expansion memory connector 210 after the expansion memory module 400 is fixed in place.

[0151] In some other embodiments, the orthographic projection of the expansion memory connector 210 on the motherboard 200 may overlap with the orthographic projection of the expansion memory module 400 on the motherboard 200. This is not a limitation.

[0152] In some examples, multiple expansion memory connectors 210 may be located on the same side of the expansion memory module 400. In other examples, such as Figure 3 As shown, multiple expansion memory connectors 210 can also be located on both sides of the expansion memory module 400.

[0153] In some embodiments, such as Figure 8 As shown, the server may also include an input / output module 800. The input / output module 800 is coupled to the motherboard 200. The input / output module 800 may include various interfaces, such as hard drive interfaces, network card interfaces, Universal Serial Bus (USB) interfaces, power interfaces, High Definition Multimedia Interface (HDMI) interfaces, GPU interfaces, Video Graphics Array (VGA) interfaces, etc., which are not limited here.

[0154] Multiple interfaces in the input / output module 800 can be clustered and distributed on one side of the motherboard 200, and all are coupled to the I / O control chip or CPU 300 of the motherboard 200, thereby realizing signal interaction between external devices and multiple functional modules inside the server.

[0155] Because the input / output module 800 has a large number of interfaces, its size is larger than that of the CPU 300 in the direction perpendicular to the motherboard 200.

[0156] In some embodiments, such as Figure 8 As shown, the server may also include a heat dissipation module 900, which is coupled to the motherboard 200 to obtain operating voltage. The heat dissipation module 900 can utilize air cooling principles to dissipate heat from the inside of the server; understandably, the heat dissipation module 900 can be a fan module. The fan module can include multiple fans, which can be arranged close to each other or distributed. The close-to-each-fans can be arranged side-by-side or stacked; this is not limited here.

[0157] Because of the larger fan size, the size of the cooling module 900 in the server is larger than the size of the CPU 300 in the direction perpendicular to the motherboard 200.

[0158] Since the input / output module 800 and the heat dissipation module 900 are relatively large in the direction perpendicular to the motherboard 200, the expansion memory module 400 is placed away from the input / output module 800 and the heat dissipation module 900. This reduces the size of the server in the direction perpendicular to the motherboard 200, making it easier to miniaturize the server.

[0159] In some embodiments, such as Figure 2 and Figure 8 As shown, the input / output module 800 and the heat dissipation module 900 are respectively located at opposite ends of the motherboard 200. The extended memory module 400 is located between the input / output module 800 and the heat dissipation module 900. In some examples, functional modules such as the CPU 300 and the memory module 500 may also be located between the input / output module 800 and the heat dissipation module 900.

[0160] In some examples, the height range of the input / output module 800 and the height range of the expansion memory module 400 at least partially overlap in the direction perpendicular to the motherboard 200. Understandably, the input / output module 800 and the expansion memory module 400 intersect in height. This allows for optimization of the internal space layout of the server.

[0161] like Figure 9 As shown, the height range of the input / output module 800 in the direction perpendicular to the motherboard 200 is d1, and the height range of the extended memory module 400 in the direction perpendicular to the motherboard 200 is d2. There is an overlapping height interval d3 between d1 and d2; where 0 < d3 ≤ d2. The extended memory module 400 optimizes the internal spatial layout of the server in the direction perpendicular to the motherboard 200 by having a height interval d3 that overlaps with the input / output module 800 in the direction perpendicular to the motherboard 200.

[0162] In some examples, the height range of the heatsink module 900 and the height range of the expansion memory module 400 at least partially overlap in the direction perpendicular to the motherboard 200. Understandably, the heatsink module 900 and the expansion memory module 400 intersect in height. This allows for optimization of the internal space layout of the server.

[0163] like Figure 9 As shown, the height range of the heat dissipation module 900 in the direction perpendicular to the motherboard 200 is d4, and the height range of the extended memory module 400 in the direction perpendicular to the motherboard 200 is d2. There is an overlapping height interval d5 between d4 and d2; where 0 < d5 ≤ d2. By having a height interval d5 that overlaps with the heat dissipation module 900 in the direction perpendicular to the motherboard 200, the extended memory module 400 optimizes the spatial layout inside the server in the direction perpendicular to the motherboard 200.

[0164] In other embodiments, when the server 1000 is larger in the direction perpendicular to the motherboard 200, the height range of the input / output module 800 or the height range of the heat dissipation module 900 in the direction perpendicular to the motherboard 200 may not overlap with the height range of the extended memory module 400.

[0165] In summary, the server provided in this embodiment of the present disclosure, by setting the extended memory module 400 on one side of the motherboard 200 and spaced apart from the motherboard 200, ensures that the extended memory module 400 is not limited by the space on the surface of the motherboard 200, making it easier to expand the amount of memory that works with the CPU 300 and improve the server's operating capacity.

[0166] This disclosure also provides an electronic device. The electronic device may include at least one server as described in the foregoing embodiments, as well as a server rack, power supply, network switch, and other devices. The power supply is coupled to the server to provide operating power; the network switch is coupled to the server to enable signal interaction between the server and other devices in the network.

[0167] Since the electronic device includes the server described in some of the above embodiments, the electronic device also has the beneficial effects of the server described in some of the above embodiments, which will not be repeated here.

[0168] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A server, characterized in that, include: Motherboard, including expansion memory connectors; A central processing unit (CPU) is located on the motherboard and coupled to the expansion memory connector, wherein the expansion memory connector is coupled to the CPU's RP port; A memory module is mounted on the motherboard and is coupled to the CPU; An extended memory module is located on one side of the motherboard and is spaced apart from the motherboard; the extended memory module is coupled to the extended memory connector; The extended memory module includes multiple extended memory units; each extended memory unit is coupled to one or more extended memory connectors; The server includes a first cable that supports a cache coherency bus. The extended memory unit includes a first high-speed connector and a memory medium. The first high-speed connector is coupled to the extended memory connector via a first cable. The memory medium is coupled to the first high-speed connector. The extended memory unit also includes an extended memory controller, which is connected in series between the first high-speed connector and the memory medium. One extended memory controller is coupled to a plurality of memory media, including one or more types of memory media.

2. The server according to claim 1, characterized in that, Each of the extended memory units includes a circuit board; The circuit boards, belonging to different extended memory units, are spaced apart from each other.

3. The server according to claim 1, characterized in that, Each of the extended memory units includes a circuit board; The multiple circuit boards belonging to different extended memory units are interconnected to form an integrated structure.

4. The server according to any one of claims 1 to 3, characterized in that, Also includes: The outer casing forms a receiving cavity, and the main board is located within the receiving cavity; The bracket is connected to the outer casing; The bracket is located on one side of the motherboard and is spaced apart from the motherboard, and the extended memory module is mounted on the bracket.

5. The server according to any one of claims 1 to 4, characterized in that, The extended memory module and the CPU are located on the same side of the motherboard; The orthographic projection of the extended memory module on the motherboard at least partially overlaps with the orthographic projection of the CPU on the motherboard.

6. The server according to any one of claims 1 to 4, characterized in that, The server also includes: The memory module is positioned at an interval from the CPU; The orthographic projection of the extended memory module on the motherboard at least partially overlaps with the orthographic projection of the memory module on the motherboard.

7. An electronic device, characterized in that, It includes a power supply and a server, wherein the server is coupled to the power supply; wherein the server is the server as described in any one of claims 1 to 6.

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