Display substrate and display device

Abstract

The present disclosure provides a display substrate and a display device. The display substrate includes a base substrate, a first conductive layer, a second conductive layer and an insulating layer, the first conductive layer is located on one side of the base substrate, and includes a first conductive portion extending along a first direction, the second conductive layer is located on the side of the first conductive layer away from the base substrate, the insulating layer is located between the first conductive layer and the second conductive layer, at least one first conductive portion includes a first hollow portion, the first hollow portion includes a plurality of groove structures arranged along the second direction, the groove structure extends along the first direction, and there is an angle between the first direction and the second direction. The present disclosure sets a first hollow portion in the first conductive portion, and the adhesion between the first conductive portion and the layer film can be enhanced by the plurality of groove structures in the first hollow portion arranged along the second direction and extending along the first direction, thereby improving the product yield and improving the stability of product performance.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a display substrate and a display device. Background Art

[0002] Mini-LED (Mini-Light-Emitting Diode) is a new type of LED display technology derived from small-pitch LEDs, also known as sub-millimeter light-emitting diodes. Due to its good display effect and thin experience, as well as its high contrast and long life, it has a clear trend of use in the high-end display field.

[0003] At present, the mainstream driving method for Mini-LED is an active matrix (AM)-like driving method that uses the IC chip of the lamp group as the control source. This driving method can achieve refined zoning control, but the backplane wiring of this driving method is complicated and the winding length is greatly increased. In order to achieve a lower voltage drop IR Drop, materials with lower resistivity (such as Cu) are used in the manufacturing process, and the laying width is increased as much as possible during the design. This leads to the problem of reduced adhesion of the metal layer on the insulating layer OC material during production, resulting in a large number of product detachment defects. Summary of the invention

[0004] An object of the present disclosure is to provide a display substrate and a display device.

[0005] According to a first aspect of the present disclosure, a display substrate is provided, comprising:

[0006] substrate substrate;

[0007] A first conductive layer, located on one side of the base substrate, comprising a first conductive portion extending along a first direction;

[0008] A second conductive layer, located on a side of the first conductive layer away from the substrate;

[0009] an insulating layer, located between the first conductive layer and the second conductive layer;

[0010] Among them, at least one of the first conductive parts includes a first hollow part, the first hollow part includes a plurality of groove structures arranged along the second direction, the groove structures extend along the first direction, and there is an angle between the first direction and the second direction.

[0011] In an exemplary embodiment of the present disclosure, the first conductive layer includes a plurality of first conductive portions having different sizes in the second direction, the size of the first hollow portion in the second direction is positively correlated with the size of the first conductive portion corresponding thereto in the second direction, and the number of slot structures in the first hollow portion is positively correlated with the size of the first conductive portion corresponding thereto in the second direction.

[0012] In an exemplary embodiment of the present disclosure, the ratio of the size of the first hollow portion in the second direction to the size of the corresponding first conductive portion in the second direction is 20%-40%, wherein the size of the first hollow portion in the second direction is the sum of the sizes of all slot structures in the first hollow portion in the second direction.

[0013] In an exemplary embodiment of the present disclosure, a ratio of a size of the groove structure in the first hollow portion in the first direction to a size of the first conductive portion in the first direction is 0.3%-0.5%.

[0014] In an exemplary embodiment of the present disclosure, the groove structures in the first hollow portion are arranged at equal intervals along the second direction.

[0015] In an exemplary embodiment of the present disclosure, the size of the first hollow portion in the first direction is positively correlated with the size of the corresponding first conductive portion in the first direction, and the number of first hollow portions is negatively correlated with the size of the corresponding first conductive portion in the first direction.

[0016] In an exemplary embodiment of the present disclosure, the first hollow portions are arranged at equal intervals along the first direction.

[0017] In an exemplary embodiment of the present disclosure, the first conductive layer includes a plurality of first conductive portions having different sizes in the second direction;

[0018] The distance between two adjacent slot structures in the second direction is positively correlated with the size of the corresponding first conductive portion in the second direction.

[0019] In an exemplary embodiment of the present disclosure, the ratio of the interval between two adjacent slot structures in the second direction to the size of the corresponding first conductive part in the second direction is 8%-10%.

[0020] In an exemplary embodiment of the present disclosure, wherein the second conductive layer includes a second conductive portion;

[0021] The at least one first conductive portion further includes a second hollow portion, and at least a portion of the orthographic projection of the second conductive portion on the base substrate is located within a region enclosed by the orthographic projection of the second hollow portion on the base substrate.

[0022] In an exemplary embodiment of the present disclosure, there is a gap between an orthographic projection edge of a portion of the second conductive portion corresponding to the second hollow portion and an orthographic projection edge of the second hollow portion on the base substrate.

[0023] In an exemplary embodiment of the present disclosure, the second conductive portion includes at least one of a pad, a first lead, a second lead, and a functional unit.

[0024] In an exemplary embodiment of the present disclosure, wherein the second conductive portion includes a plurality of groups of pads, and each group of pads includes a plurality of sub-pads;

[0025] The orthographic projections of at least some of the sub-pads on the base substrate are respectively located in the area surrounded by the orthographic projections of each second hollow portion, and the orthographic projection periphery of each sub-pad has a gap with the orthographic projection edge of the corresponding second hollow portion.

[0026] In an exemplary embodiment of the present disclosure, in the first direction, a distance between two adjacent first hollow portions is equal to a distance between two adjacent groups of pads.

[0027] In an exemplary embodiment of the present disclosure, the first conductive portion includes at least two first hollow portions arranged in sequence along a first direction, and the ratio of the spacing between the at least two first hollow portions in the first direction to the spacing between two adjacent groups of pads is between 0.8-2.

[0028] In an exemplary embodiment of the present disclosure, the second conductive portion includes a first lead extending along the first direction;

[0029] At least part of the orthographic projection of the first lead on the base substrate overlaps with the area enclosed by the orthographic projection of the second hollow portion on the base substrate, and there is a gap between the orthographic projection edge of at least one side of the first lead and the orthographic projection edge of the second hollow portion.

[0030] In an exemplary embodiment of the present disclosure, the second conductive portion includes a second lead extending along the second direction;

[0031] At least part of the orthographic projection of the second lead on the base substrate overlaps with the area enclosed by the orthographic projection of the second hollow portion on the base substrate, and there is a gap between the orthographic projection edge of at least one side of the second lead and the orthographic projection edge of the second hollow portion.

[0032] In an exemplary embodiment of the present disclosure, the second conductive portion includes a plurality of functional units;

[0033] The orthographic projections of the functional units on the base substrate are located one by one within the area enclosed by the orthographic projections of the second hollow portions, and the orthographic projection peripheries of the functional units have gaps with the orthographic projection edges of the corresponding second hollow portions.

[0034] In an exemplary embodiment of the present disclosure, the second conductive portion includes a plurality of groups of pads and first leads corresponding to the plurality of groups of pads one by one, and the extending direction of the plurality of groups of pads, the extending direction of the first leads, and the extending direction of the first hollow portion are all the first direction;

[0035] The orthographic projections of the one-to-one corresponding first leads on the base substrate are located within the orthographic projection area of ​​the first hollow portion on the base substrate.

[0036] In an exemplary embodiment of the present disclosure, the orthographic projections of the plurality of groups of pads on the base substrate are located within an orthographic projection region of the first hollow portion on the base substrate.

[0037] In an exemplary embodiment of the present disclosure, the functional unit includes a test conductive portion electrically connected to the pad, the first lead or the second lead, and the test conductive portion is used to detect electrical properties of the pad, the first lead or the second lead.

[0038] In an exemplary embodiment of the present disclosure, it further includes:

[0039] A buffer layer, located between the substrate and the first conductive layer;

[0040] The insulating layer is filled into the first hollow portion, and the insulating layer is in contact with the buffer layer through the first hollow portion.

[0041] According to another aspect of the present disclosure, a display device is provided, comprising the display substrate described above.

[0042] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0044] Figure 1 A schematic diagram of a cross-sectional structure of a display substrate provided in an embodiment of the present disclosure;

[0045] Figure 2 A schematic diagram of the structure of a display substrate provided in an embodiment of the present disclosure;

[0046] Figure 3 A schematic structural diagram of another display substrate provided in an embodiment of the present disclosure;

[0047] Figure 4 The embodiments of the present disclosure provide Figure 2 Enlarged view of the middle M region;

[0048] Figure 5 The embodiments of the present disclosure provide Figure 4 Schematic diagram of the cross section along the AA direction;

[0049] Figure 6 The embodiments of the present disclosure provide Figure 2 Enlarged view of the middle N region;

[0050] Figure 7 The embodiments of the present disclosure provide Figure 6 Schematic diagram of the cross section along the AA direction;

[0051] Figure 8 The embodiments of the present disclosure provide Figure 2 Another enlarged view of the N region;

[0052] Fig. 9 The embodiments of the present disclosure provide Figure 2 Another enlarged view of the N region;

[0053] Fig.10 The embodiments of the present disclosure provide Figure 2 Another enlarged view of the N region;

[0054] Fig.11 The embodiments of the present disclosure provide Figure 2 Another enlarged view of the N region;

[0055] Fig.12 The embodiments of the present disclosure provide Figure 2 Enlarged view of the middle F area;

[0056] Fig.13 The embodiments of the present disclosure provide Fig.12 Schematic diagram of the cross section along the AA direction;

[0057] Fig.14 The embodiments of the present disclosure provide Figure 2 Enlarged view of the middle G area;

[0058] Fig.15 The embodiments of the present disclosure provide Fig.14 Schematic diagram of the cross section along the AA direction;

[0059] Fig.16 A schematic diagram of the structure of a solder pad provided in an embodiment of the present disclosure;

[0060] Fig.17 The embodiments of the present disclosure provide Fig.16 Cross-section along the AA direction;

[0061] Fig.18 A schematic diagram of the structure of another solder pad provided in an embodiment of the present disclosure;

[0062] Fig.19 The embodiments of the present disclosure provide Fig.18 Cross-section along the AA direction;

[0063] Fig. 20 A schematic diagram of the structure of another solder pad provided in an embodiment of the present disclosure;

[0064] Fig.21 A schematic diagram of the structure of another solder pad provided in an embodiment of the present disclosure;

[0065] Fig. 22 A schematic diagram of the structure of a first lead provided in an embodiment of the present disclosure;

[0066] Fig.23 A schematic diagram of the structure of a second lead provided by an embodiment of the present disclosure;

[0067] Fig.24 A schematic diagram of the structure of a test conductive part provided in an embodiment of the present disclosure;

[0068] Fig.25 A schematic structural diagram of a pad group and a first lead provided in an embodiment of the present disclosure;

[0069] Fig.26 The embodiments of the present disclosure provide Fig. 27 Cross-section along the AA direction;

[0070] Fig. 27 A schematic structural diagram of another pad group and a first lead provided in an embodiment of the present disclosure;

[0071] Fig.28 The embodiments of the present disclosure provide Fig.29 Cross-section along the AA direction;

[0072] Fig.29 A schematic structural diagram of another pad group and a first lead provided in an embodiment of the present disclosure.

[0073] In the figure: 10, base substrate; 2, first conductive layer; 20, first conductive part; 201, first hollow part; 2010, first groove structure; 2011, second groove structure; 202, second hollow part; 2021, third groove structure; 3, second conductive layer; 30, second conductive part; 301, 3011, 3012, pad; 302, first lead; 303, second lead; 304, test conductive part; 4, first insulating layer; 5, second insulating layer; 6, third insulating layer; 7, fourth insulating layer; 8, buffer layer; EU, light-emitting unit; L, light-emitting device. DETAILED DESCRIPTION

[0074] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present disclosure will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted. In addition, the drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0075] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0076] In the drawings, the thickness of regions and layers may be exaggerated for clarity. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.

[0077] The described features, structures or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details, or other methods, components, materials, etc. may be adopted. In other cases, known structures, materials or operations are not shown or described in detail to avoid blurring the main technical ideas of the present disclosure.

[0078] When a structure is “on” another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is “directly” disposed on the other structure, or that the structure is “indirectly” disposed on the other structure via another structure.

[0079] The terms "a", "an", "the" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to indicate an open-ended inclusive meaning and mean that there may be additional elements / components / etc. in addition to the listed elements / components / etc. The terms "first" and "second" etc. are used only as labels and are not intended to limit the quantity of their objects.

[0080] like Figure 1 As shown, a display substrate provided by an embodiment of the present disclosure includes a base substrate 10, a first conductive layer 2, a second conductive layer 3, a first insulating layer 4, a second insulating layer 5, a third insulating layer 6 and a fourth insulating layer 7. Figure 1 It can be seen that the first conductive layer 2 is arranged on one side of the base substrate 10, including a first conductive portion 20 extending along the first direction, at least one first conductive portion 20 includes a first hollow portion 201, and the first hollow portion 201 may include a plurality of groove structures arranged along the second direction, the groove structure extends along the first direction, and there is an angle between the first direction and the second direction. The second conductive layer 3 is arranged on the side of the first conductive layer 2 away from the base substrate 10, including a second conductive portion 30. A first insulating layer 4 and a second insulating layer 5 are arranged between the first conductive layer 2 and the second conductive layer 3, a third insulating layer 6 and a fourth insulating layer 7 are arranged above the second conductive layer 3, and a buffer layer 8 may be arranged between the base substrate 10 and the first conductive layer 2. In some embodiments, the first insulating layer 4 and the third insulating layer 6 may be inorganic insulating materials, such as at least one of silicon oxide, silicon nitride, and silicon oxynitride; the second insulating layer 5 and the fourth insulating layer 7 may be organic insulating materials, such as organic resins. It can be understood that the specific material selection of the first insulating layer 4, the second insulating layer 5, the third insulating layer 6, and the fourth insulating layer 7 is not limited thereto. It can be understood that the depth of the groove structure perpendicular to the plane where the base substrate 10 is located is basically equal to the thickness of the first conductive layer 2 or the first conductive part 20 perpendicular to the plane where the base substrate 10 is located, that is, the groove structure is a hollow slit running through the first conductive part 20.

[0081] Figure 1 In the figure, the first direction is a direction perpendicular to the paper surface, and the second direction is a horizontal direction parallel to the paper surface, that is, the angle between the first direction and the second direction is 90°, that is, the first direction and the second direction are perpendicular. Of course, the above is just an example, and the angle between the first direction and the second direction is not limited to 90°, and the embodiments of the present disclosure do not make specific limitations.

[0082] In the embodiment of the present disclosure, since the first conductive layer includes a first conductive portion extending along the first direction, at least one first conductive portion includes a first hollow portion, the first hollow portion includes a plurality of groove structures arranged along the second direction, and the groove structure extends along the first direction, the groove structure can reduce the occupied area of ​​the first conductive portion and the base substrate and the first conductive portion and the insulating layer, thereby enhancing the adhesion between the first conductive portion and the base substrate and the first conductive portion and the insulating layer, thereby reducing the defective rate of the product.

[0083] The first conductive layer 2 is usually used to arrange various signal lines, that is, the first conductive part 20 can be various signal lines, such as a common voltage line GND, a driving voltage line VLED, a source power line PWR, a source address line DI, etc. Optionally, the thickness of the first conductive layer 2 is about 1.5 to 7 μm, and its material can include copper, for example, it can be formed by sputtering, such as a stacked material of MoNb / Cu / MoNb, in which the material on one side of the stack close to the substrate is MoNb, and the thickness is about It is mainly used to improve the adhesion between the film layer and the substrate. The middle layer material of the stack is Cu, which is the preferred material for the electrical signal transmission channel. The material on the side away from the substrate is MoNb, with a thickness of about The first conductive layer can also be formed by electroplating. Specifically, a seed layer can be formed by using MoNiTi to increase the nucleation density of metal grains in the subsequent electroplating process, and then copper with low resistivity can be made by electroplating, and then an anti-oxidation layer can be made. The material can be MoNiTi.

[0084] The second conductive layer 3 is usually used to set pads and connect leads. Optionally, the film thickness of the second conductive layer is about about.

[0085] like Figure 1As shown, the second conductive layer 3 in the embodiment of the present disclosure may include a second conductive part 30, and the second conductive part 30 may be a pad 301 for binding various electrical components, such as a pad 3011 for installing a light-emitting component, and / or a pad 3012 for installing a functional component such as a driver chip or a sensor; the second conductive part 30 includes a lead with a connecting function, that is, the second conductive part 30 may also include a first lead 302 extending along a first direction and a second lead 303 extending along a second direction. The pad 301 is a portion of the second conductive part 30 to be electrically connected to an electronic component (such as a light-emitting device, a driving circuit, a sensor, etc.), and its surface away from the substrate side needs to be partially exposed before being connected to the electronic component. The surface away from the substrate side will be covered by an insulating material layer to ensure the reliability and stability of the electrical path. In order to prevent the problem of oxidation that may occur when the pad 301 is exposed to the air during the process from the substrate process to the process of setting the electronic component on the substrate, an anti-oxidation material layer can be set only on the exposed surface area of ​​the pad 301, that is, the surface of the pad area will have one more layer of structure than the area where the first lead 302 and the second lead 303 are located; or the second conductive part 30 is set as a whole as a stacked structure with at least two layers, and the film layer material away from the base substrate 10 is an anti-oxidation metal or alloy material, specifically, it can be composed of a stacked structure such as MoNb / Cu / CuNi, the bottom layer material MoNb in the stack is mainly used to improve adhesion, the middle layer Cu in the stack is mainly used to transmit electrical signals due to its low resistivity, and the top layer CuNi in the stack can both prevent the middle layer from oxidizing and ensure the firmness of the connection with the electronic component.

[0086] In one embodiment, the first conductive layer 2 may include multiple first conductive parts 20 with different sizes in the second direction, the size of the first hollow part 201 in the second direction is positively correlated with the size of the corresponding first conductive part 20 in the second direction, and the number of groove structures in the first conductive part 20 is positively correlated with the size of the corresponding first conductive part 20 in the second direction.

[0087] like Figure 2 As shown, the first conductive layer 2 includes first conductive portions with different widths in the second direction, for example, 20-1 and 20-2. The dimension of the first conductive portion 20-1 in the second direction is greater than the dimension of the first conductive portion 20-2 in the second direction. Figure 1 It can be seen that the size of the first hollow portion 201 corresponding to the first conductive portion 20-1 in the second direction is larger than the size of the first hollow portion 201 corresponding to the first conductive portion 20-2 in the second direction, and the number of groove structures in the first hollow portion 201 corresponding to the first conductive portion 20-1 is larger than the number of groove structures in the first hollow portion 201 corresponding to the first conductive portion 20-2.

[0088] It should be noted that the size of the first hollow portion 201 in the second direction is the sum of the sizes of all the groove structures in the first hollow portion 201 in the second direction.

[0089] In a specific design, the ratio of the size of the first hollow portion 201 in the second direction to the size of the corresponding first conductive portion 20 in the second direction can be set between 20% and 40% according to actual needs.

[0090] In the embodiment of the present disclosure, the size of the first hollow portion 201 in the second direction is the sum of the sizes of all the groove structures in the first hollow portion in the second direction.

[0091] It should be noted that the dimensions in the figures of the embodiments of the present disclosure are only for reference and do not represent the actual dimensions.

[0092] The size of the groove structure in the first hollow portion 201 in the first direction is positively correlated with the size of the corresponding first conductive portion 20 in the first direction. Specifically, according to actual needs, the ratio of the size of the groove structure in the first hollow portion 201 in the first direction to the size of the first conductive portion 20 in the first direction can be set between 0.3% and 0.5%.

[0093] The size of the first hollow portion is set to be positively correlated with the size of the first conductive portion. First hollow portions of different sizes can be set according to first conductive portions of different sizes, thereby better enhancing the adhesion between the first conductive portion and the base substrate, and better enhancing the adhesion between the first conductive portion and the insulating layer.

[0094] In one embodiment, the arrangement of the groove structures in the first hollow portion 201 in the second direction may be arranged at equal intervals.

[0095] In one embodiment, when the first conductive portion includes a plurality of first hollow portions, the first hollow portions 201 may be arranged at equal intervals along the first direction.

[0096] The groove structures in the first hollow portion are arranged at equal intervals, and / or the multiple first hollow portions in the first conductive portion are arranged at equal intervals, so that the adhesion at each position of the first conductive portion is uniform, thereby improving the product yield.

[0097] In one embodiment, the size of the first hollow portion 201 in the first direction is positively correlated with the size of the corresponding first conductive portion 20 in the first direction, and the number of the first hollow portions 201 is negatively correlated with the size of the corresponding first conductive portion 20 in the first direction.

[0098] Since the smaller the size of the first conductive part in the first direction, the smaller the adhesion between the first conductive part and the film layer, the number of the first hollow parts can be set to be negatively correlated with the size of the corresponding first conductive part in the first direction.

[0099] Setting the size of the first hollow portion in the first direction to be positively correlated with the size of the first conductive portion in the first direction, and setting the number of the first hollow portions to be negatively correlated with the size of the first conductive portion in the first direction, can better enhance the adhesion between the first conductive portion and the base substrate, and better enhance the adhesion between the first conductive portion and the insulating layer.

[0100] like Figure 2 As shown, the first conductive layer includes a plurality of first conductive portions having different sizes in the second direction, Figure 2 In the figure, the size of the first conductive part 20-1 in the second direction is larger than the size of the first conductive part 20-2 in the second direction. The larger the size of the first conductive part in the second direction, the larger the spacing between the groove structures in the first hollow part can be set, and the larger the spacing between two adjacent first hollow parts in the first direction can also be set.

[0101] In one embodiment, the spacing of the first hollow portions 201 in the first direction can be equal to the spacing of two adjacent groups of pads in the first direction. In another embodiment, the ratio of the spacing of the first hollow portions 201 in the first direction to the spacing of two adjacent groups of pads in the first direction can be between 0.8-2.

[0102] A group of solder pads in the embodiment of the present disclosure refers to a plurality of solder pads located in a light-emitting unit EU, which may specifically include solder pads for soldering light-emitting devices and solder pads for soldering driver chips; the spacing between two adjacent groups of solder pads in the first direction refers to the distance between two solder pads located in the same relative position in two light-emitting units EU adjacently arranged in the first direction.

[0103] like Figure 3 As shown, a light-emitting unit 3011 includes four light-emitting devices L connected in series, with the light-emitting device electrically connected to the driving voltage line VLED as the starting point of the series connection of the four light-emitting devices, and the light-emitting device electrically connected to the driving chip as the end point of the series connection of the four light-emitting devices. The four light-emitting devices are driven by one driving chip.

[0104] It should be noted that in the embodiments of the present disclosure, the number of light-emitting devices L in each light-emitting unit EU is not limited, and can be any number such as 5, 6, 7, 8, etc., but not limited to 4; the connection relationship of the light-emitting devices L in each light-emitting unit EU is not limited to series connection, and can also be connected in parallel, or in a combination of series and parallel. In addition, the light-emitting device L can be Mini LED, MicroLED, OLED, QLED or any other type of light-emitting device.

[0105] like Figure 3 As shown, D1 is the spacing between the first hollow portions on the first conductive portion 20 - 1 in the first direction, D3 is the spacing between the first hollow portions on the first conductive portion 20 - 2 in the first direction, and D2 is the spacing between two adjacent groups of pads in the first direction.

[0106] It should be noted that the spacing of the first hollow portions in the first direction is the distance between two groove structures with the same relative position in the two first hollow portions in the first direction. The spacing of the two groups of pads in the first direction is the distance between the sides of the pads of the two groups of pads soldered with the driver chip facing the same direction in the first direction.

[0107] Due to limitations of substrate size and process, when manufacturing the second conductive part 30 , it is often inevitable to overlap with the first conductive part 20 . The overlapping area between the two is a weak performance area, which is prone to short circuit or open circuit, resulting in defects or affecting reliability.

[0108] For example, if the orthographic projection of the soldering pad on the substrate overlaps with the orthographic projection of the signal line on the substrate, then when the electronic component is bound and connected to the soldering pad, such as when the LED chip is soldered using reflow soldering technology, since the instantaneous temperature of the reflow soldering process is as high as 260-265°C, and an insulating layer is provided between the soldering pad and the signal line, and this temperature range is easy to exceed the temperature resistance value of the insulating layer, resulting in damage to the insulating layer, thereby causing a short circuit between the soldering pad and the signal line.

[0109] For another example, dust, foreign matter and other particles are inevitably generated in the thin film manufacturing process. When particles exist in the overlapping area of ​​the lead and the signal line, it is easy to cause unstable conduction between the lead and the signal line, affecting the reliability of the product. Furthermore, when using the needle test method to test the current or voltage of the upper lead, it is easy to penetrate the insulation layer and pierce the signal line below, resulting in inaccurate testing or reduced accuracy.

[0110] One reason for the short circuit between the first conductive part 20 and the second conductive part 30 is that the first conductive part 20 is usually thicker and wider, so that the first conductive part 20 can have a lower resistance, thereby reducing the IR voltage drop and RC delay problems and lower resistance when providing a larger voltage / current; while the second conductive part 30 is usually narrower and shorter, and exists as a lead, pad and other structures. Therefore, there is a certain potential difference between the two. Because in the glass-based film process, the insulating layer between the two conductive parts is in a semi-solid and semi-liquid state before solidification, the water vapor introduced in this process may remain in the insulating layer. When there is a voltage difference in the voltage signal transmitted between the first conductive part 20 and the second conductive part 30, water will produce an electrochemical reaction in the presence of the potential difference, forming OH in the insulating layer. - , OH - This will cause a short circuit between the first conductive portion 20 and the second conductive portion 30 .

[0111] It can be seen that in order to ensure product quality and performance, a short circuit between the first conductive part 20 and the second conductive part 30 should be avoided as much as possible.

[0112] In some embodiments, for small-sized products, the line width ratio of the first conductive part 20 and the second conductive part 30 is about 20 to 30; for large-sized products, the line width ratio of the first conductive part 20 and the second conductive part 30 can be as high as 100 times or even more, so the second conductive part 30 must overlap with the first conductive part 20.

[0113] In order to reduce the probability of a short circuit between the first conductive part 20 and the second conductive part 30, a first hollow part 201 can be set at the position where the first conductive part 20 and the second conductive part 30 overlap. Since the first hollow part 201 includes a groove structure, the presence of the groove structure can reduce the overlapping area of ​​the first conductive part 20 and the second conductive part 30, thereby reducing the probability of a short circuit between the first conductive part 20 and the second conductive part 30.

[0114] Specifically, Figure 2 As shown, the first hollow portion 201 may include a first groove structure 2010 (2010-1 and 2010-2) and a second groove structure 2011, the orthographic projection of the first groove structure 2010 (2010-1 and 2010-2) on the base substrate 10 at least partially overlaps with the orthographic projection of the second conductive portion 30 (second lead 303) on the base substrate 10, and the orthographic projection of the second groove structure 2011 on the base substrate 10 does not overlap with the orthographic projection of the second conductive portion 30 on the base substrate 10.

[0115] The first groove structure 2010 is arranged in the first conductive part 20 and at least partially overlaps with the second conductive part 30. Therefore, the first groove structure 2010 can reduce the overlapping area between the first conductive part and the buffer layer, and reduce the overlapping area between the first conductive part and the insulating layer, thereby enhancing the adhesion between the first conductive part and the buffer layer, and enhancing the adhesion between the first conductive part and the insulating layer, while also reducing the probability of a short circuit between the first conductive part 20 and the second conductive part 30, thereby reducing the product defective rate.

[0116] The orthographic projection of the first groove structure 2010 on the base substrate 10 may partially fall within the orthographic projection range of the second conductive portion 30 on the base substrate 10, or may completely fall within the orthographic projection range of the second conductive portion 30 on the base substrate 10. Figure 2 As shown, a portion of the first groove structure 2010 - 1 falls within the orthographic projection range of the second lead 303 on the substrate, and the entire first groove structure 2010 - 2 falls within the orthographic projection range of the first lead 302 on the substrate.

[0117] In the embodiment of the present disclosure, if the second conductive part overlaps with the first conductive part, and the second conductive part is a second lead, the size of the first slot structure in the first direction may be larger than the size of the second lead in the first direction, but it is necessary to ensure that the first slot structure does not interrupt the signal transmission of the first conductive part;

[0118] If the second conductive part and the first conductive part do not overlap, when the substrate size is 1850 mm*1500 mm, the size of the second groove structure in the first direction may be between 300 μm and 500 μm, and the size of the second groove structure in the second direction may be between 100 μm and 300 μm.

[0119] The following is a detailed description with examples.

[0120] like Figure 4 As shown, Figure 2 Magnified view of the middle M region.

[0121] Figure 4 In the embodiment, the orthographic projection of the first groove structure 2010 on the base substrate 10 falls within the range of the orthographic projection of the second lead 303 on the base substrate 10, and the size of the first groove structure 2010 in the first direction is greater than the size of the second lead 303 in the first direction.

[0122] refer to Figure 5 ,for Figure 4 Schematic diagram of the cross section along the AA direction.

[0123] like Figure 6 As shown, Figure 2 Magnified view of the middle N region.

[0124] Figure 6 In the embodiment, the orthographic projection of the first groove structure 2010 on the substrate falls within the range of the orthographic projection of the first lead 302 on the substrate 10, and the dimension of the first groove structure 2010 in the second direction is smaller than the dimension of the first lead 302 in the second direction.

[0125] It should be noted that Figure 6 The dotted line portion is the portion of the first slot structure 2010 that is blocked by the second lead 302 .

[0126] refer to Figure 7 ,for Figure 6 Schematic diagram of the cross section along the AA direction.

[0127] like Figure 8 As shown, Figure 2 Magnified view of the middle N region.

[0128] Figure 8 In the embodiment, the orthographic projection of the first groove structure 2010 on the substrate falls within the range of the orthographic projection of the first lead 302 on the substrate 10, and the dimension of the first groove structure in the second direction is greater than the dimension of the first lead 302 in the second direction.

[0129] It should be noted that Figure 8 The dotted line portion is the portion of the first slot structure 2010 that is blocked by the second lead 302 .

[0130] like Fig. 9 As shown, Figure 2 Magnified view of the middle N region.

[0131] Fig. 9 In the embodiment, the orthographic projection of the first groove structure 2010 on the substrate falls within the range of the orthographic projection of the first lead 302 on the substrate 10, and the size of the first groove structure 2010 in the second direction is greater than the size of the first lead 302 in the second direction.

[0132] It should be noted that Fig. 9 The dotted line portion is the portion of the first slot structure 2010 that is blocked by the second lead 302 .

[0133] like Fig.10 As shown, Figure 2 Magnified view of the middle N region.

[0134] Fig.10 In the embodiment, the orthographic projections of the first groove structure 2010 on the substrate all fall within the range of the orthographic projections of the first lead 302 on the substrate 10 , and the size of the first groove structure 2010 in the second direction is smaller than the size of the first lead 302 in the second direction.

[0135] like Fig.11As shown, Figure 2 Magnified view of the middle N region.

[0136] Fig.11 In the embodiment, the orthographic projections of the first groove structure 2010 on the base substrate all fall within the range of the orthographic projections of the second lead 303 on the base substrate 10 , and the size of the first groove structure 2010 in the first direction is smaller than the size of the second lead 303 in the second direction.

[0137] In one embodiment, the first conductive layer 2 may include multiple first conductive parts 20 with different sizes in the second direction. If the first conductive parts 20 and the second conductive parts 30 do not overlap with each other, the spacing between two adjacent groove structures in the first hollow part 201 in the second direction is positively correlated with the size of the corresponding first conductive parts in the second direction. Specifically, the ratio of the spacing between two adjacent groove structures in the second direction to the size of the corresponding first conductive parts 20 in the second direction can be between 8% and 10%, for example, 100μm-200μm.

[0138] like Fig.12 As shown, Figure 2 A magnified view of the middle F region. Fig.12 It can be seen that the first conductive layer 2 includes two first conductive parts, 20-1 and 20-2, with different sizes in the second direction, wherein the size of 20-1 in the second direction is larger than the size of 20-2 in the second direction, and the spacing between the groove structures 2011-1 in the first hollow part 201-1 in 20-1 is larger than the spacing between the groove structures 2011-2 in the first hollow part 201-2 in 20-2.

[0139] refer to Fig.13 ,for Fig.12 Schematic diagram of the cross section along the AA direction.

[0140] because Fig.12 In the embodiment, the first hollow portion 201-1 does not overlap with the second conductive portion 30, and the first hollow portion 201-2 does not overlap with the second conductive portion 30. Fig.13 The second conductive portion 30 is not shown.

[0141] If the first conductive layer 2 includes multiple first conductive parts 20 with different sizes in the second direction, and the first conductive parts 20 and the second conductive parts 30 partially overlap, then the spacing of the groove structures in the first hollow part of the first conductive part 20 in the second direction is positively correlated with the size of the corresponding first conductive part 20 in the second direction. Specifically, the ratio of the spacing between two adjacent groove structures in the second direction to the size of the corresponding first conductive part 20 in the second direction can be between 0-8%. For example, if the substrate size is 1850mm*1500mm, the spacing of the groove structures in the second direction can be between 5mm and 10mm.

[0142] In the embodiment of the present disclosure, the first conductive portion 20 may include not only the first hollow portion 201 but also a second hollow portion 202. Fig.14 As shown, the second hollow portion 202 includes a third groove structure 2021, and the third groove structure 2021 extends along the second direction, and at least part of the orthographic projection of the second conductive portion 30 on the substrate is located in the area surrounded by the orthographic projection of the second hollow portion 202 on the substrate. In other words, in the thickness direction of the display substrate, the second conductive portion 30 and the first conductive portion 20 at least partially do not overlap, so the non-overlapping area can avoid short circuits between the two due to static electricity, process technology, testing, etc., thereby improving the stability of product performance. Of course, in a completely ideal situation, if all second conductive portions 30 and first conductive portions 20 do not overlap, short circuits can be completely avoided.

[0143] In the present disclosure, when describing the “overlap” between two structures, it means that the orthographic projection of one of the structures on the substrate at least partially overlaps with the orthographic projection of the other structure on the substrate.

[0144] In one embodiment, the second hollow portion 202 may include one third groove structure or may include multiple third groove structures, wherein if the second hollow portion 202 includes one third groove structure 2021, since the third groove structure 2021 extends along the second direction, the second hollow portion 202 also extends along the second direction; if the second hollow portion 202 includes multiple third groove structures 2021, the multiple third groove structures 2021 can be arranged along the first direction, that is, the second hollow portion 202 extends along the first direction, and the multiple third groove structures 2021 can also be arranged along the second direction, that is, the second hollow portion 202 extends along the second direction.

[0145] like Fig.14 As shown, Figure 2 Magnified view of region G in the middle.

[0146] The first conductive portion 20 includes a second hollow portion 202 , and the second hollow portion 202 includes three third slot structures 2021 extending along the second direction and arranged along the second direction. The orthographic projections of the third slot structures 2021 all fall within the orthographic projection of the second lead 303 .

[0147] It should be noted that, since the third groove structure 2021 is covered by the second lead 303, Fig.12 The mid-slot structure is indicated by a dotted line.

[0148] refer to Fig.15 ,for Fig.14 Schematic diagram of the cross section along the AA direction.

[0149] The second hollow portion 202 can enhance the adhesion between the first conductive layer and the film layer on one hand, and can also reduce the probability of a short circuit between the first conductive portion 20 and the second conductive portion 30 on the other hand.

[0150] In a specific implementation, at least a portion of the orthographic projection of the second conductive portion 30 on the base substrate 10 is located within a region enclosed by the orthographic projection of the second hollow portion 202 on the base substrate 10 .

[0151] The second hollow portion 202 is hollowed out in the overlapping area of ​​the first conductive portion 20 and the second conductive portion 30, thereby preventing the first conductive portion 20 and the second conductive portion 30 from short-circuiting in the overlapping area due to static electricity, process technology, testing, etc., thereby avoiding affecting the stability of product performance.

[0152] Furthermore, a certain gap can be set between the orthographic edge of the portion of the second conductive portion 30 corresponding to the second hollow portion 202 and the orthographic edge of the second hollow portion 202 on the base substrate 10, so that a certain distance is maintained between the edge of the second conductive portion 30 and the first conductive portion 20, further reducing the possibility of a short circuit between the two.

[0153] In the embodiment of the present disclosure, the second conductive portion 30 may include at least one of a pad 301 , a first lead 302 , a second lead 303 , and a functional unit (a test conductive portion 304 ).

[0154] In one embodiment, the second conductive portion 30 includes multiple groups of pads 301, each group of pads includes multiple sub-pads, and the orthographic projections of at least some of the sub-pads on the base substrate 10 are respectively located one by one in the area enclosed by the orthographic projections of each second hollow portion 202, and the outer periphery of the orthographic projection of each sub-pad has a gap with the orthographic projection of the corresponding second hollow portion.

[0155] In this embodiment, the pad 301 may be a conductive pattern for achieving electrical bonding with an electronic component, and the electronic component includes a light emitting diode, a sensor, a driving chip, and the like.

[0156] refer to Fig.16 Taking the pad for mounting a light emitting diode as an example, the pad 301 includes two sub-pads, one is a sub-pad P, and the other is a sub-pad N.

[0157] In this embodiment, the first conductive portion 20 is a common voltage line GND, and the pad of the light-emitting diode overlaps with the common voltage line GND in the thickness direction of the display substrate. In the thickness direction of the substrate, the orthographic projection of the sub-pad P on the base substrate 10 is located in the area surrounded by the orthographic projection of a third groove structure 2021 in the second hollow portion 202, and the orthographic projection of the sub-pad P has a gap with the orthographic projection edge of the third groove structure 2021. Similarly, the orthographic projection of the sub-pad N on the base substrate 10 is located in the area surrounded by the orthographic projection of another third groove structure 2021 in the second hollow portion 202, and the orthographic projection of the sub-pad N has a gap with the orthographic projection edge of the third groove structure 2021.

[0158] In this embodiment, two slot structures are separated by the first conductive portion 20 which is not hollowed out, so that each slot structure corresponds to its own sub-pad.

[0159] refer to Fig.17 ,for Fig.16 Cross-sectional view along the AA axis.

[0160] The area of ​​the first conductive part 20 facing the sub-pad P and the sub-pad N is hollowed out so that the sub-pads P, the sub-pad N and the first conductive part 20 below no longer overlap, thereby avoiding the problem of short circuit between the pad and the first conductive part 20 due to welding, die bonding, etc.

[0161] Furthermore, the third groove structures 2021 corresponding to the sub-pads of the same pad group may be connected to each other. Fig.18 In this embodiment, the two third groove structures 2021 are interconnected to form a groove structure, that is, the orthographic projections of the sub-pads P and N are located in the area surrounded by the orthographic projections of the same large groove structure. This structure can prevent the sub-pads P, N and the first conductive part 20 from being short-circuited, and reduce the difficulty of hollowing out the first conductive part 20.

[0162] refer to Fig.19 ,for Fig.18 Cross-sectional view along the AA axis.

[0163] In this embodiment, the sub-pad and the third groove structure 2021 may have the same shape, which are both approximately rectangular.

[0164] refer to Fig. 20, taking the pad for installing the driver chip as an example, the pad includes four sub-pads, namely the first input pad Di, the second input pad Pwr, the output pad Out and the common voltage pad Gnd. The above-mentioned first input pad Di is configured to receive a first input signal, which is, for example, an address signal, for selecting the driver chip of the corresponding address. For example, the first input signal can be an 8-bit address signal from the source address line DI, and the address to be transmitted can be obtained by parsing the address signal. The second input pad Pwr is configured to receive a second input signal, which is, for example, a power line carrier communication signal from the source power line PWR. The second input signal not only provides power to the driver chip, but also transmits communication data to the driver chip, and the communication data can be used to control the light-emitting duration of the corresponding light-emitting unit, thereby controlling its visual light-emitting brightness. The output pad Out is configured to output a driving signal. For example, the driving signal can be a driving voltage from the driving voltage line VLED, which is used to drive the light-emitting element to emit light. The common voltage pad Gnd is configured to receive a common voltage signal, such as a ground signal from the common voltage line GND.

[0165] In this embodiment, the first conductive portion 20 is a common voltage line GND, and the pad of the driving chip overlaps with the common voltage line GND in the thickness direction of the display substrate. The first conductive portion 20 includes four second hollow portions 202; in the thickness direction of the substrate, the orthographic projection of the first input pad Di on the base substrate 10 is located in the area surrounded by the orthographic projection of the first second hollow portion 202, and there is a gap between the orthographic projection edge of the first input pad Di and the orthographic projection edge of the second hollow portion 202. The orthographic projection of the second input pad Pwr on the base substrate 10 is located in the area surrounded by the orthographic projection of the second second hollow portion 202, and there is a gap between the orthographic projection edge of the second input pad Pwr and the orthographic projection edge of the second hollow portion 202. The orthographic projection of the output pad Out on the base substrate 10 is located in the area surrounded by the orthographic projection of the third second hollow portion 202, and there is a gap between the orthographic projection edge of the output pad Out and the orthographic projection edge of the second hollow portion 202. The orthographic projection of the common voltage pad Gnd on the base substrate 10 is located within the area surrounded by the orthographic projection of the fourth second hollow portion 202, and there is a gap between the outer edge of the orthographic projection of the common voltage pad Gnd and the edge of the orthographic projection of the second hollow portion 202. In this embodiment, the four second hollow portions 202 are separated by the unhollowed first conductive portion 20, so that each second hollow portion 202 corresponds to its own sub-pad.

[0166] The area of ​​the first conductive part 20 facing the four sub-pads is hollowed out so that the four sub-pads no longer overlap with the first conductive part 20 below, thereby avoiding the problem of short circuit between the pads and the first conductive part 20 .

[0167] Furthermore, the second hollow portions 202 corresponding to the sub-pads of the same pad group may be interconnected, thereby reducing the difficulty of hollowing out. Fig.21 In this embodiment, four second hollow portions 202 are interconnected to form one second hollow portion 202, that is, the orthographic projections of the first input pad Di, the second input pad Pwr, the output pad Out, and the common voltage pad Gnd are located within the area surrounded by the orthographic projection of the same large second hollow portion 202. This structure can prevent each sub-pad from being short-circuited with the first conductive portion 20 below, and reduce the precision requirement for the hollowing process of the first conductive portion 20.

[0168] Fig. 22 In the Figure 2 The corresponding pads 3011 or 3012 complete the binding connection, for example, the light emitting device L is connected to the pad 3011 correspondingly, and the driving chip IC is connected to the pad 3012 correspondingly.

[0169] In this embodiment, the sub-pad is substantially pentagonal in shape, and the second hollow portion 202 is substantially rectangular in shape.

[0170] In other embodiments, each pad may also have other numbers of sub-pads, such as 1, 3, etc. Accordingly, a corresponding number of second hollow portions may be included, so that each sub-pad has a corresponding second hollow portion below it, to avoid overlapping at the sub-pads. This will not be described in detail here.

[0171] In one embodiment, reference Fig. 22 The second conductive part 30 includes a first lead 302, and the first lead 302 extends along the first direction in the figure. Taking the figure as an example, the first lead 302 is a first direction lead extending from the LED light emitting diode. In other embodiments, the first lead 302 can also be a first direction lead extending from the driver chip pad.

[0172] Continue to refer Fig. 22 In this embodiment, the first conductive portion 20 is also a common voltage line GND, and the first lead extending in the first direction overlaps with a portion of the common voltage line GND extending in the first direction in the thickness direction of the substrate.

[0173] The first conductive part 20 includes a second hollow part 202, and the second hollow part 202 includes four third groove structures 2021, which extend along the second direction and are arranged along the first direction. The orthographic projection of at least one section of the first lead 302 on the base substrate 10 is located within the area surrounded by the orthographic projection of the second hollow part 202, that is, the first conductive part 20 corresponding to at least one section of the first lead 302 is hollowed out, so that the first lead 302 and the first conductive part 20 below no longer overlap in this area, thereby avoiding short circuits between the first lead 302 and the first conductive part 20 due to static electricity, testing, and process reasons.

[0174] The area of ​​the first conductive part 20 directly below the first lead 302 can be completely hollowed out, or only a section can be hollowed out. In other words, the second hollowed-out part 202 can be disposed below all the first lead 302, or only below a part of the first lead 302. Fig. 22 In the second hollow portion 202 corresponding to the lower portion of the first lead 302, in other embodiments, at least two third groove structures 2021 may also be interconnected, as long as the interconnected groove structures are arranged along the first direction and extend along the second direction, thereby reducing the difficulty of hollowing out.

[0175] It should be noted that Fig. 22 In the figure, a light emitting diode or a driver chip has been bonded to the position of the pad 301, so the light emitting diode or the driver chip covers the pad 301, and what is actually seen in the figure is the light emitting diode or the driver chip.

[0176] In one embodiment, reference Fig.23 The second conductive part 30 may further include a second lead 303 extending along the second direction. The second lead 303 may be a second direction lead extending from the driver chip pad, or may be a second direction lead extending from the LED light emitting diode.

[0177] In this embodiment, the first conductive portion 20 is also a common voltage line GND, and the second lead line 303 extending in the second direction overlaps with a portion of the common voltage line GND extending in the first direction in the substrate thickness direction.

[0178] The first conductive part 20 includes a second hollow part 202, and the second hollow part 202 is located at the portion of the first conductive part 20 extending in the first direction; the orthographic projection of at least one section of the second lead 303 on the base substrate 10 is located in the area surrounded by the orthographic projection of the second hollow part 202. In other words, the first conductive part 20 corresponding to at least one section of the second lead 303 is hollowed out, so that the second lead 303 and the first conductive part 20 below no longer overlap in this area, thereby avoiding short circuit between the second lead 303 and the first conductive part 20 due to static electricity, testing, and process.

[0179] The second lead 303 may be completely hollowed out below, or only a section may be hollowed out. In other words, the second hollow portion 202 may be disposed below the entire second lead 303 , or only below a portion of the second lead 303 .

[0180] Fig.23 The second hollow portion 202 below the second lead 303 includes only one third slot structure 2021. In other embodiments, it may also include multiple third slot structures, such as Fig.24 As shown, when the second hollow portion 202 includes a plurality of third groove structures, at least two third groove structures may also be interconnected, thereby reducing the difficulty of hollowing out.

[0181] In this embodiment, the first conductive portion 20 below the second lead 303 is hollowed out, thereby preventing a short circuit between the second lead 303 and the first conductive portion 20 due to static electricity or process reasons.

[0182] In the present disclosure, in the first direction, the second hollow portion 202 corresponding to the second lead 303 can be located at the upper edge or the lower edge of the first conductive portion 20, or can be located in the middle of the first conductive portion 20. Therefore, the orthographic projection edge of at least one of the upper and lower sides of the second lead 303 and the orthographic projection edge of the second hollow portion 202 have a gap. Fig.23 The second hollow portion 202 shown in the figure is a closed opening area, the orthographic projection of a section of the second lead 303 overlaps with the orthographic projection of the second hollow portion 202, and the orthographic projection edge of at least one of the upper and lower sides has a gap with the orthographic projection edge of the second hollow portion 202.

[0183] It should be noted that, since the second lead 303 extends along the second direction, the second hollow portion 202 also extends along the second direction. For the second hollow portion 202 in a first conductive portion 20, the second hollow portion 202 should have a length in the second direction that is less than the width of the first conductive portion 20, otherwise the first conductive portion 20 will be cut off. Therefore, when the second lead 303 passes through the entire first conductive portion 20 in the second direction, only a portion of the second lead 303 should be hollowed out. It can be understood that the longer the length of the second hollow portion 202 in the second direction, the greater the IR Drop effect on the first conductive portion 20 extending in the first direction, resulting in a decrease in signal strength. However, the longer the length of the second hollow portion 202 in the second direction, the less the overlap area between the second lead 303 and the first conductive portion 20, and the less likely it is to generate static electricity.

[0184] In actual products, the second direction length of the second hollow portion 202 needs to be set by comprehensively considering two reasons. In addition, the second lead 303 can also cross multiple first conductive portions 20 extending in the first direction at the same time, so one or more groove structures can be set in each first conductive portion 20. When a second lead 303 does not cross the first conductive portion 20, that is, when the orthographic projection of the second lead 303 is only located in the orthographic projection of one first conductive portion 20, the corresponding second hollow portion 202 can include multiple third groove structures, which correspond to multiple parts on the second lead 303 respectively.

[0185] In other embodiments, the second direction in which the second lead 303 extends may not be perpendicular to the first direction. Regardless of the direction, it should be ensured that the second hollow portion 202 corresponding to the second lead 303 does not cut off the first conductive portion 20 and minimizes the impact on IR Drop.

[0186] In this embodiment, since the shape of the first lead 302 or the second lead 303 is generally a bar, the shape of the third groove structure in the second hollow portion 202 is also generally a bar. The present disclosure does not limit the specific shape of the third groove structure in the second hollow portion 202, which may be consistent with the shape of the lead or inconsistent.

[0187] In one embodiment, the second conductive part 30 may further include several functional units for realizing specific functions. The functional units may include pads, first leads, second leads, and test conductive parts. The following description will be made by taking the functional unit as the test conductive part as an example.

[0188] The test conductive part 304 is electrically connected to the pad 301 , the first lead 302 or the second lead 303 , and is used to detect the electrical performance of the pad 301 or the first lead 302 or the second lead 303 .

[0189] For example, the current or voltage characteristics of the pad can be tested by the needle test method. Specifically, Fig.25 The figure shows the test conductive parts 304 and the second hollow part 202 corresponding to the three sub-pads in the driver chip pad. The three test conductive parts 304 are respectively arranged near the first input pad Di, the second input pad Pwr, and the output pad Out. One end is connected to the sub-pad for testing the voltage and / or current of the sub-pad, and the other end can also be connected to the first lead or the second lead. The film layer above the test conductive part 304 is opened to expose the test conductive part 304 to the outside so that the needle test can be performed here.

[0190] like Fig.25 As shown, a second hollow portion 202 may include three third slot structures 2021, and the orthographic projections of the three test conductive parts 304 on the substrate are located one by one in the orthographic projections of each third slot structure 2021, and there is a gap between the orthographic projection of the test conductive part 304 and the orthographic projection edge of the corresponding third slot structure 2021. In other words, the first conductive part 20 corresponding to the lower portion of the test conductive part 304 is hollowed out so that the test conductive part 304 and the lower first conductive part 20 no longer overlap in this area, thereby avoiding the possibility of piercing the test conductive part 304 and contacting the first conductive part 20 during the needle test, causing a short circuit or inaccurate testing. Since the common voltage pad Gnd is connected to the common voltage line GND through a via, the current or voltage of the common voltage pad Gnd can be directly tested on the common voltage line GND.

[0191] refer to Fig.26 ,for Fig.25 Cross-sectional view along the AA axis.

[0192] The number of the test conductive parts 304 in this embodiment is only an example, and the specific number can be set as needed. For example, only one test conductive part 304 can be set for a certain sub-pad. The present application does not specifically limit the number of the test conductive parts 304. In this embodiment, the three slot structures 2021 can be interconnected, such as Fig. 27 As shown, the difficulty of hollowing out is reduced.

[0193] refer to Fig.28 ,for Fig. 27 Cross-sectional view along the AA axis.

[0194] In one embodiment, the second conductive portion includes multiple groups of solder pads and first leads corresponding one-to-one to the multiple groups of solder pads, the extension direction of the multiple groups of solder pads, the extension direction of the first leads and the extension direction of the first hollow portion are all in the first direction, the orthographic projections of the one-to-one corresponding first leads on the substrate substrate are located within the orthographic projection area of ​​the first hollow portion on the substrate substrate, and / or the orthographic projections of the multiple groups of solder pads on the substrate substrate are located within the orthographic projection area of ​​the first hollow portion on the substrate substrate.

[0195] like Fig.29 As shown, the orthographic projections of the first lead 302 and the plurality of pads 301 on the base substrate are all within the orthographic projection area of ​​the first hollow portion 201 on the base substrate.

[0196] The first conductive portion 20 corresponding to at least one section of the first lead 302 is hollowed out, and / or the first conductive portion 20 corresponding to at least one section of the plurality of pads is hollowed out, so that the first lead 302 and the pad no longer overlap with the first conductive portion 20 below in this area, thereby avoiding a short circuit between the first lead 302 and the pad and the first conductive portion 20 due to static electricity, testing, or process.

[0197] The above describes in detail the types of various second conductive parts 10 and the hollow parts corresponding to the first conductive parts. The display substrate disclosed in the present invention may include only any one of the second conductive parts 10 and its corresponding hollow parts, or may include at least any two second conductive parts 10 and their corresponding hollow parts. For example, the substrate may include a pad and a first lead arranged in a first direction, and also include a first hollow part and a second hollow part; it may also include a pad and a test conductive part, and also include a first hollow part and a second hollow part; it may also include a pad, a first lead, a second lead and a test conductive part 304 at the same time, and also include a first hollow part and a second hollow part, etc., which will not be listed one by one here.

[0198] The embodiment of the present invention further provides a display device, which includes the display substrate in the above embodiment. Since the display device includes the above display substrate, it has the same beneficial effects, and the present invention will not be repeated here.

[0199] The present invention does not impose any specific restrictions on the applicability of the display device, which can be any product or component with a flexible display function, such as a television, a laptop computer, a tablet computer, a wearable display device, a mobile phone, a car display, a navigation, an e-book, a digital photo frame, an advertising light box, etc.

[0200] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. A display substrate, wherein: include: substrate substrate; A first conductive layer, located on one side of the base substrate, comprising a first conductive portion extending along a first direction; A second conductive layer, located on a side of the first conductive layer away from the substrate; an insulating layer, located between the first conductive layer and the second conductive layer; Wherein, at least one of the first conductive parts includes a first hollow part, the first hollow part includes a plurality of slot structures arranged along the second direction, the slot structures extend along the first direction, and an angle exists between the first direction and the second direction; Wherein, the second conductive layer includes a second conductive portion; The at least one first conductive portion further includes a second hollow portion, and at least a portion of the orthographic projection of the second conductive portion on the base substrate is located within a region enclosed by the orthographic projection of the second hollow portion on the base substrate.

2. The display substrate according to claim 1, wherein: The first conductive layer includes multiple first conductive parts with different sizes in the second direction, the size of the first hollow part in the second direction is positively correlated with the size of the corresponding first conductive part in the second direction, and the number of groove structures in the first hollow part is positively correlated with the size of the corresponding first conductive part in the second direction.

3. The display substrate according to claim 2, wherein: The ratio of the size of the first hollow portion in the second direction to the size of the corresponding first conductive portion in the second direction is 20%-40%, wherein the size of the first hollow portion in the second direction is the sum of the sizes of all slot structures in the first hollow portion in the second direction.

4. The display substrate according to claim 2, wherein: The ratio of the size of the groove structure in the first hollow portion in the first direction to the size of the first conductive portion in the first direction is 0.3%-0.5%.

5. The display substrate according to claim 2, wherein: The groove structures in the first hollow portion are arranged at equal intervals along the second direction.

6. The display substrate according to claim 2, wherein: The size of the first hollow portion in the first direction is positively correlated with the size of the corresponding first conductive portion in the first direction, and the number of the first hollow portions is negatively correlated with the size of the corresponding first conductive portion in the first direction.

7. The display substrate according to claim 6, wherein: The first hollow portions are arranged at equal intervals along the first direction.

8. The display substrate according to claim 1, wherein: The first conductive layer includes a plurality of first conductive portions having different sizes in the second direction; The distance between two adjacent slot structures in the second direction is positively correlated with the size of the corresponding first conductive part in the second direction.

9. The display substrate according to claim 8, wherein: The ratio of the distance between two adjacent slot structures in the second direction to the size of the corresponding first conductive part in the second direction is 8%-10%.

10. The display substrate according to claim 1, wherein: There is a gap between an orthographic projection edge of a portion of the second conductive portion corresponding to the second hollow portion and an orthographic projection edge of the second hollow portion on the base substrate.

11. The display substrate according to claim 1, wherein: The second conductive portion includes at least one of a pad, a first lead, a second lead, and a functional unit.

12. The display substrate according to claim 11, wherein: The second conductive portion includes a plurality of groups of pads, and each group of pads includes a plurality of sub-pads; The orthographic projections of at least some of the sub-pads on the base substrate are respectively located in the area surrounded by the orthographic projections of each second hollow portion, and the orthographic projection periphery of each sub-pad has a gap with the orthographic projection edge of the corresponding second hollow portion.

13. The display substrate according to claim 12, wherein: In the first direction, the distance between two adjacent first hollow portions is equal to the distance between two adjacent groups of pads.

14. The display substrate according to claim 12, wherein: The first conductive portion includes at least two first hollow portions arranged in sequence along a first direction, and a ratio of a spacing between the at least two first hollow portions in the first direction to a spacing between two adjacent groups of pads is between 0.8 and 2.

15. The display substrate according to claim 11, wherein: The second conductive portion includes a first lead extending along the first direction; At least part of the orthographic projection of the first lead on the base substrate overlaps with the area enclosed by the orthographic projection of the second hollow portion on the base substrate, and there is a gap between the orthographic projection edge of at least one side of the first lead and the orthographic projection edge of the second hollow portion.

16. The display substrate according to claim 11, wherein: The second conductive portion includes a second lead extending along the second direction; At least part of the orthographic projection of the second lead on the base substrate overlaps with the area enclosed by the orthographic projection of the second hollow portion on the base substrate, and there is a gap between the orthographic projection edge of at least one side of the second lead and the orthographic projection edge of the second hollow portion.

17. The display substrate according to claim 11, wherein: The second conductive part includes a plurality of functional units; The orthographic projections of the functional units on the base substrate are located one by one within the area enclosed by the orthographic projections of the second hollow portions, and the orthographic projection peripheries of the functional units have gaps with the orthographic projection edges of the corresponding second hollow portions.

18. The display substrate according to claim 11, wherein: The second conductive portion includes a plurality of pads and first leads corresponding to the plurality of pads, and the extending direction of the plurality of pads, the extending direction of the first leads and the extending direction of the second hollow portion are all the first direction; The orthographic projections of the one-to-one corresponding first leads on the base substrate are located within the orthographic projection area of ​​the second hollow portion on the base substrate.

19. The display substrate according to claim 12, wherein: The orthographic projections of the plurality of pads on the base substrate are located within the orthographic projection region of the second hollow portion on the base substrate.

20. The display substrate according to claim 11, wherein: The functional unit includes a test conductive part electrically connected to the pad, the first lead or the second lead, and the test conductive part is used to detect the electrical performance of the pad, the first lead or the second lead.

21. The display substrate according to any one of claims 1 to 20, wherein: Also includes: A buffer layer, located between the substrate and the first conductive layer; The insulating layer is filled into the first hollow portion, and the insulating layer is in contact with the buffer layer through the first hollow portion.

22. A display device, wherein: Comprising a display substrate as described in any one of claims 1-21.

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