Substrate assembly for mechanical and electrical connection and method of riveting thereof
By using a point-contact connection method between conductive substrate and embossed components, the problems of contact area and resistance deviation in riveting methods are solved, achieving a stable mechanical and electrical connection, and the connection quality can be inspected visually.
CN115552711BActive Publication Date: 2026-06-16LG ENERGY SOLUTION LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- LG ENERGY SOLUTION LTD
- Filing Date
- 2021-07-28
- Publication Date
- 2026-06-16
Smart Images
Figure CN115552711B_ABST
Abstract
The present disclosure relates to a substrate assembly and a riveting method thereof, the substrate assembly including: a first substrate made of an electrically conductive material; a second substrate made of an electrically conductive material, spaced apart from and facing the first substrate, and combined with the first substrate by riveting; a plurality of embossing members each protruding from an inner side surface of the second substrate and in point contact with an inner side surface of the first substrate, wherein the first substrate and the second substrate are mechanically and electrically connected through the plurality of embossing members, and more particularly, the present disclosure relates to a substrate assembly and a riveting method thereof capable of reducing mass deviation when a plurality of substrates are mechanically and electrically connected.
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