Transport assembly and apparatus for processing a substrate having the same

Abstract

The present invention provides a transfer assembly and an apparatus for processing a substrate having the transfer assembly. Specifically, the substrate processing apparatus includes: an atmospheric pressure transfer module having a first hand with a substrate placed on it, equipped with a first transfer robot; a vacuum transfer module having a second hand with a substrate placed on it, equipped with a second transfer robot; a load-locking chamber positioned between the atmospheric pressure transfer module and the vacuum transfer module, and having an internal space convertible between atmospheric pressure atmosphere and vacuum atmosphere; a process chamber connected to the vacuum transfer module and processing the substrate; and an annular support that can be transferred and supports the annular member supported by the first or second transfer robot at the process chamber, and the annular support includes: a plate on which the annular member is placed; and at least one leg protruding from the bottom surface of the plate and positioned at the first or second hand.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2021-0083589, filed with the Korean Intellectual Property Office on June 28, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of the inventive concept described herein relate to a transport assembly and a substrate processing apparatus, and more specifically to a transport assembly for transporting a substrate and an annular member and a substrate processing apparatus having the transport assembly. Background Technology

[0004] Plasma refers to an ionized gaseous state composed of ions, free radicals, and electrons. Plasma is generated by extremely high temperatures, strong electric fields, or high-frequency electromagnetic fields (radio frequency (RF) electromagnetic fields). Semiconductor device manufacturing processes may include etching processes that use plasma to remove thin films formed on substrates such as wafers. Etching processes are performed by causing plasma ions and / or free radicals to collide with or react with the thin film on the substrate.

[0005] Plasma-based substrate processing equipment includes a process chamber, a support assembly for supporting the substrate within the process chamber, and a plasma source for processing the substrate by generating plasma from a gas. The support assembly includes an electrostatic chuck that holds the substrate in place by electrostatic force, and a focusing ring surrounding the outer periphery of the substrate seated on the electrostatic chuck. The focusing ring distributes plasma with high uniformity on the substrate surface. As etching is repeatedly performed on the substrate, the focusing ring is also etched, thereby gradually changing its shape. Depending on the change in the shape of the focusing ring, the direction of ion and / or free radical incident on the substrate changes, and therefore the etching characteristics of the substrate change. Therefore, when etching of the substrate is repeatedly performed, or when the shape of the focusing ring is changed outside of permissible limits, replacement of the focusing ring is required.

[0006] Generally, focusing ring replacement is achieved by an operator opening the process chamber, retrieving the used focusing ring from the open chamber, and installing the unused focusing ring into the process chamber. However, this replacement method not only requires a significant amount of work time but also carries a high possibility of introducing particles into the process chamber. Therefore, recently, a replacement method has been used whereby the used focusing ring is retrieved from the process chamber and introduced into a ring chamber by a transfer robot of the substrate processing equipment, and then a new focusing ring is retrieved from the ring chamber and introduced into the process chamber by a transfer robot.

[0007] The transfer of the focus ring can be performed by a transfer robot that transfers the substrate. Alternatively, the focus ring can be transferred by the transfer robot using a ring-shaped support. When the focus ring is transferred using a ring-shaped support, the pads used to support the substrate may be contaminated by the ring-shaped support. For this reason, the problem of transferring contaminants to the substrate occurs simultaneously with the substrate transfer. This situation leads to an increase in the defect rate of the substrate processing process. Furthermore, when the ring-shaped support sitting on the substrate shakes, the focus ring sitting on the ring-shaped support may slip or become distorted. This situation may cause a change in the mounting position of the focus ring within the process chamber, making it possible that the focus ring is not properly mounted in the process chamber. Summary of the Invention

[0008] An embodiment of the present invention provides a conveying assembly for stably conveying annular components and a substrate processing apparatus having the conveying assembly.

[0009] An embodiment of the present invention provides a conveying assembly for stably conveying a ring-shaped support, the ring-shaped support being used to convey a ring-shaped component without altering the structure of the conveyor; and a substrate processing apparatus having the conveying assembly.

[0010] The present invention provides a substrate processing apparatus for minimizing contaminants on a support pad of a substrate by means of an annular support, for conveying a transfer hand identical to the annular support and the substrate, and having the transfer assembly.

[0011] The technical objectives of this invention are not limited to the above-mentioned technical objectives, and other unmentioned technical objectives will become apparent to those skilled in the art from the following description.

[0012] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: an atmospheric pressure transfer module with a first transfer robot having a first hand on which a substrate is placed; a vacuum transfer module with a second transfer robot having a second hand on which a substrate is placed; a load-locking chamber positioned between the atmospheric pressure transfer module and the vacuum transfer module, and having an internal space convertible between atmospheric pressure and vacuum atmospheres; a process chamber connected to the vacuum transfer module and processing the substrate; and an annular support supported by either the first or second transfer robot for transferring and supporting an annular member disposed in the process chamber, wherein the annular support includes: a plate on which the annular member is placed; and at least one leg protruding from the bottom surface of the plate and positioned at the first or second hand.

[0013] In the implementation scheme, the feet are provided as pads.

[0014] In one embodiment, at least one substrate support pad for supporting the substrate is disposed on the top surface of the first hand or the second hand, and wherein when the annular bracket is placed on the first hand or the second hand, the pad is disposed at a height spaced upward from the substrate support pad.

[0015] In the implementation scheme, the pad and the substrate support pad are positioned so as not to interfere with each other when viewed from above as the first or second transfer robot transfers the annular component.

[0016] In this implementation, the liner is cylindrical.

[0017] In one embodiment, the support leg is configured as a pin, and at least one substrate support pad for supporting the substrate is disposed on the top surface of the first or second hand, and further includes a hole for inserting the end of the pin.

[0018] In one embodiment, when the annular bracket is placed on the first hand or the second hand, the pin is positioned at a height that separates the plate from the base plate support pad.

[0019] In the implementation scheme, the pin and the base plate support pad are positioned so as not to interfere with each other when viewed from above as the first or second transfer robot transfers the annular component.

[0020] In the implementation, the pin is configured as a cylindrical shape with a downwardly convex bottom surface.

[0021] In the implementation plan, the plate is in the form of a circular plate.

[0022] In one embodiment, the load-locking chamber includes a plurality of support shelves supporting the substrate or the annular member, wherein a plurality of recesses are formed through the plate at the edge region of the plate, and when the first transfer robot or the second transfer robot moves from the top side of the plurality of support shelves to the bottom side, the annular member supported by the annular bracket sits on the support shelves, and the plurality of recesses are positioned to align with the plurality of support shelves, so that the annular bracket moves together with the first transfer robot and the second transfer robot.

[0023] The present invention provides a conveying assembly. The conveying assembly includes: an annular support for supporting an annular member; and a conveying robot having a conveyor arm for selectively conveying a substrate and the annular support, wherein the annular support includes: a plate on which the annular member is placed; and at least one leg protruding from the bottom surface of the plate and positioned at the conveyor arm.

[0024] In the implementation, the support leg is configured as a pad.

[0025] In one embodiment, at least one substrate support pad for supporting the substrate is placed on the top surface of the conveyor, and wherein the pad is positioned at a height that the plate is spaced upward from the substrate support pad when the annular bracket is placed on the conveyor.

[0026] In one embodiment, the pad and the substrate support pad are positioned so as not to overlap when viewed from above as the transfer robot transfers the annular component.

[0027] In one embodiment, the leg is configured as a pin, and at least one substrate support pad for supporting the substrate is disposed on the top surface of the conveyor, and further includes a hole for inserting the end of the pin, wherein when the annular bracket is placed on the conveyor, the pin is positioned at a height that the plate is spaced upward from the substrate support pad, and the pin and the substrate support pad are positioned so as not to interfere with each other when viewed from above as the conveyor robot conveys the annular member.

[0028] In one embodiment, the plate is in the form of a circular plate.

[0029] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a loading port on which a container for storing substrates, an annular support, or an annular member is placed; an index chamber having an interior that maintains an atmospheric pressure atmosphere and is equipped with a transfer robot; a load-locking chamber having an interior that is convertible between atmospheric pressure and vacuum pressure; and an annular support used during the transfer of the annular member between the loading port, the load-locking chamber, and the index chamber, wherein the transfer robot includes: a transfer hand selectively transferring the substrate and the annular support; and at least one substrate support pad for supporting the substrate, wherein the load-locking chamber includes a plurality of support shelves supporting the substrate or the annular member, and wherein the annular support includes: a plate on which the annular member is placed; and at least one leg. At least one leg protrudes from the bottom surface of the plate and is positioned at the conveyor arm, wherein a plurality of notches are formed through the plate at the edge region of the plate, and the plurality of notches are positioned to overlap each of the plurality of support shelves when viewed from above, wherein the annular member rests on the support shelf between the annular bracket and the annular member, and wherein the annular member is positioned on the support shelf when the annular bracket is placed on the conveyor arm, wherein the leg is positioned at a height spaced upward from the base plate support pad of the plate, and wherein the leg and the base plate support pad are positioned so as not to interfere with each other when viewed from above when the conveyor arm is conveying the annular member.

[0030] In the implementation, the support leg is configured as a pad.

[0031] In one embodiment, the leg is configured as a pin, and a hole for inserting the end of the pin is further included on the top surface of the transfer robot.

[0032] According to an embodiment of the present invention, the substrate and the annular component can be transported stably.

[0033] According to an embodiment of the invention, when the annular component is being conveyed, the slippage or distortion of the position of the annular support used to convey the annular component at the conveyor hand can be minimized.

[0034] The effects of this invention are not limited to those described above, and other effects not mentioned will become apparent to those skilled in the art from the following description. Attached Figure Description

[0035] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein similar reference numerals throughout refer to similar parts unless otherwise specified.

[0036] Figure 1 A substrate processing apparatus according to an embodiment of the present invention is illustrated schematically.

[0037] Figure 2 schematically shown Figure 1 The first teleporter.

[0038] Figure 3 schematically shown Figure 1 The second transporter.

[0039] Figure 4 To show Figure 1 A planar cross-sectional view of the load-locking chamber.

[0040] Figure 5 The substrate is shown placed Figure 4 The state of the support shelf.

[0041] Figure 6 The ring-shaped component is shown placed in Figure 4 The state of the support shelf.

[0042] Figure 7 It shows Figure 6 The annular bracket on the support shelf is extracted from the load-locking chamber.

[0043] Figure 8 schematically shown Figure 1 The implementation plan for the process chamber.

[0044] Figure 9 A perspective view of an embodiment of a ring support for conveying a ring component is shown schematically.

[0045] Figure 10 for Figure 9 A plan view of the bottom surface of the annular support.

[0046] Figure 11 for Figure 9 Front view of the ring-shaped bracket.

[0047] Figure 12 The annular component and annular support are schematically shown in the arrangement. Figure 2 The status of the first teleporter.

[0048] Figure 13 The annular component and annular support are shown in the figure. Figure 12 A magnified view of the first teleporter's status.

[0049] Figure 14 schematically shown Figure 1 Another implementation scheme for the first transmitter.

[0050] Figure 15 This is a front view of another embodiment of the annular support used to carry the annular component.

[0051] Figure 16 The circular component and the circular support are schematically shown placed on Figure 14 The status of the first teleporter.

[0052] Figure 17 To illustrate the placement of the annular component and the annular support Figure 14 A magnified view of the state of the first transporter.

[0053] [Symbol Explanation]

[0054] 1-Substrate processing equipment; 2-First direction; 4-Second direction; 6-Third direction; 10-Loading port; 20-Atmospheric pressure transfer module; 30-Vacuum transfer module; 40-Load locking chamber; 50-Process chamber; 60-Annular support; 220-Transfer frame; 240-First transfer robot; 242-First transfer hand; 244-Substrate support pad; 246-Hole; 320-Transfer chamber; 340-Second transfer robot; 342-Second transfer hand; 342a-First transfer pad; 342b-Second transfer pad; 342c- Third conveyor liner; 342d - Fourth conveyor liner; 420, 510 - Housing; 421 - Internal space; 422 - First opening; 423 - Second opening; 424 - Gas supply port; 425 - Pressure reducing port; 440 - Support shelf; 442 - Support protrusion; 444 - First shelf liner; 446 - Second shelf liner; 512 - Inlet; 514 - Gate valve; 516 - Discharge port; 518 - Heater; 520 - Support unit; 521 - Dielectric plate; 522 - Cooling plate; 522a - Top flow path; 522b - Third power source; 522c - Third power line; 523 - Insulation board; 524 - Bottom body; 524b - Connecting component; 525 - Electrode; 525a - First power source; 525b - Switch; 525c - First power line; 526 - Heater; 526a - Second power source; 526c - Second power line; 530 - Gas supply unit; 532 - Gas supply nozzle; 534 - Gas supply line; 536 - Gas storage unit; 538 - Valve; 552 - Discharge baffle; 560 - Discharge pipeline; 570 - First lifting pin module; 572 - First lifting pin; 5 74-First pin driver; 580-Second lifting pin module; 582-Second lifting pin; 584-Lifting / lowering plate; 586-Second pin driver; 590-Nozzle unit; 592-Nozzle; 592a-Fourth power supply; 593-Through hole; 594-Gas injection plate; 595-Injection hole; 596-Support part; 620-Plate; 621-Notch; 640-Guide part; 644, 664-Pin; 660-Feet; 662-Pad; F-Container; F1-First container; F2-Second container; R-Annular member; W-Base plate. Detailed Implementation

[0055] The inventive concept can be modified and taken in various forms, and specific embodiments thereof are shown and described in detail in the accompanying drawings. However, the embodiments described in accordance with the inventive concept are not intended to limit the specific forms of disclosure, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions within the spirit and technical scope of the inventive concept. In the description of the inventive concept, detailed descriptions of relevant known technologies may be omitted where such omissions would obscure the essence of the inventive concept.

[0056] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. As used herein, the singular forms “a” and “the” are intended to include the plural forms unless the context clearly indicates otherwise. It should be further understood that the terms “comprises” (comprising) as used in this specification specify the presence of stated features, integers, steps, operations, components, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, components, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Also, the term “exemplary” is intended to refer to an instance or illustration.

[0057] It should be understood that although the terms “first,” “second,” “third,” etc., are used herein to describe various components, parts, areas, layers, and / or sections, such components, parts, areas, layers, and / or sections should not be limited by these terms. These terms are used only to distinguish one component, part, area, layer, or section from another. Therefore, the first component, part, area, layer, or section used below may be referred to as the second component, part, area, layer, or section without departing from the teachings of the inventive concept.

[0058] In the following text, the embodiments of the present invention will be described in detail. Figures 1 to 17 To describe.

[0059] Figure 1 A substrate processing apparatus according to an embodiment of the present invention is illustrated schematically. (Refer to...) Figure 1 The substrate processing apparatus 1 according to the embodiment of the inventive concept may include a loading port 10, an atmospheric pressure transfer module 20, a vacuum transfer module 30, a load locking chamber 40, a process chamber 50, and a ring support 60 (see reference). Figure 9 ).

[0060] Loading port 10 can be located on one side of the atmospheric pressure transfer module 20, which will be described later. One or more loading ports 10 can be provided. The number of loading ports 10 can be increased or decreased depending on process efficiency, footprint printing conditions, and the like. A container F according to an embodiment of the present invention can be placed in the loading port 10. Container F can be loaded onto or unloaded from loading port 10 by a transfer member (not shown) or by an operator, such as an overhead transfer apparatus (OHT), an overhead conveyor, or an automated guided vehicle. Container F can include various types of containers depending on the type of items to be stored. As container F, an airtight container such as a front-opening integrated pod (FOUP) can be used.

[0061] Various items can be stored in container F. Container F may include various types of containers depending on the type of items to be stored. For example, an object to be processed by substrate processing equipment 1 can be stored in a first container F1, which is one of the containers F. The object to be processed can be a substrate W, such as a wafer. A support groove on which the substrate W sits can be provided in the first container F1. Furthermore, in a second container F2, which is another of the containers F, an annular member R mounted on substrate processing equipment 1 and requiring replacement can be stored. The annular member R can be a focusing ring or dielectric ring installed in the process chamber 50, which will be described later. A support groove on which the annular member R sits can be provided in the second container F2. Optionally, the annular member R and an annular support 60 can be stored in the second container F2. A support groove on which the annular support 60 sits can be provided in the second container F2. The outer peripheral diameter of the annular member R can have a diameter larger than the outer peripheral diameter of the substrate W. Therefore, the space in the second container F2 can have a volume slightly larger than the space in the first container F1.

[0062] Atmospheric pressure transmission module 20 and vacuum transmission module 30 can be configured on the first direction 2. Hereinafter, when viewed from above, the direction perpendicular to the first direction 2 is defined as the second direction 4. Furthermore, the direction perpendicular to the plane including both the first direction 2 and the second direction 4 is defined as the third direction 6. Here, the third direction 6 is the direction perpendicular to ground.

[0063] The atmospheric pressure transfer module 20 can selectively transfer the substrate W or the annular member R between the container F and the load-locking chamber 40, which will be described later. For example, the atmospheric pressure transfer module 20 can extract the substrate W from the container F and transfer the substrate W to the load-locking chamber 40, or it can extract the substrate W from the load-locking chamber 40 and transfer the substrate W to the container F. The atmospheric pressure transfer module 20 may include a transfer frame 220 and a first transfer robot 240. The transfer frame 220 may be disposed between the loading port 10 and the load-locking chamber 40. That is, the loading port 10 may be connected to the transfer frame 220. The transfer frame 220 may be atmospheric pressure. An atmospheric pressure atmosphere may be maintained inside the transfer frame 220.

[0064] The transfer frame 220 may include a first transfer robot 240. The first transfer robot 240 may selectively transfer a substrate W or annular member R between a container F located on a loading port 10 and a load-locking chamber 40, which will be described later.

[0065] The first transfer robot 240 is movable in the up / down direction. The first transfer robot 240 may have a first transfer hand 242 that moves forward, backward, or rotates in a horizontal plane. One or more first transfer hands 242 may be provided. The base plate W may be placed on the first transfer hand 242. Optionally, an annular support 60 supporting the annular member R, to be described later, may be placed on the first transfer hand 242. The first transfer robot 240 and the annular support 60 supporting the annular member R can be defined as a transfer assembly for transferring the annular member R between the container F, the atmospheric pressure transfer module 20, and the load-locking chamber 40, to be described later.

[0066] Figure 2 schematically shown Figure 1 The status of the first transporter. (Refer to...) Figure 2 At least one substrate support pad 244 may be disposed on the top surface of the first conveyor 242. For example, three substrate support pads 244 may be disposed to support the substrate placed on the first conveyor 242 at three points. The substrate support pads 244 can prevent the substrate W placed on the first conveyor 242 from sliding. The substrate support pads 244 may be arranged along the circumferential direction of a virtual circle having a radius when viewed from above. The substrate support pads 244 may be provided in a substantially disc-shaped form. Vacuum absorption holes (not shown) may be formed within the substrate support pads 244. The substrate support pads 244 can vacuum-absorb the substrate W for conveying the substrate W.

[0067] Looking back Figure 1The vacuum transfer module 30 can be disposed between the load locking chamber 40 (described later) and the process chamber 50 (described later). The vacuum transfer module 30 may include a transfer chamber 320 and a second transfer robot 340.

[0068] The transfer chamber 320 can maintain an internal vacuum pressure atmosphere. The transfer chamber 320 may include a second transfer robot 340. In one embodiment, the second transfer robot 340 may be located in the central region of the transfer chamber 320. The second transfer robot 340 can selectively transfer the substrate W or the annular member R between the load-locking chamber 40 and the process chamber 50. Selectively, the vacuum transfer module 30 can transfer the substrate W between the process chambers 50. The second transfer robot 340 can move in both horizontal and vertical directions. The second transfer robot 340 may have a second transfer hand 342 that can move forward, backward, or rotate in a horizontal plane. At least one second transfer hand 342 may be provided for the second transfer robot 340.

[0069] Figure 3 It shows Figure 1 The status of the second transporter. (Refer to...) Figure 3 The second conveyor 342 may be relatively larger than the first conveyor 242. A pair of first conveyor pads 342a, a pair of second conveyor pads 342b, a pair of third conveyor pads 342c, and a pair of fourth conveyor pads 342d may be disposed on the top surface of the second conveyor 342. The second conveyor pads 342b and third conveyor pads 342c may be disposed between the first conveyor pads 342a and the fourth conveyor pads 342d. When viewed from above, the second conveyor pads 342b and third conveyor pads 342c may be disposed inside the outer circumference of the substrate W. Therefore, the second conveyor pads 342b and third conveyor pads 342c may support the substrate W. When viewed from above, the first conveyor pads 342a and fourth conveyor pads 342d may be disposed outside the outer circumference of the substrate W and the inner circumference of the annular member R, but may be disposed inside the circumference of the annular member R. Therefore, the first transfer pad 342a and the fourth transfer pad 342d can support the annular member R.

[0070] Return to reference Figure 1 At least one process chamber 50, to be described later, can be connected to the transfer chamber 320. The transfer chamber 320 may be provided in a polygonal shape. The load-locking chamber 40 and the process chamber 50 may be disposed around the transfer chamber 320. For example, such as Figure 1As shown, the hexagonal transfer chamber 320 can be positioned in the central region of the vacuum transfer module 30, and the load-locking chamber 40 and the process chamber 50 can be positioned around the transfer chamber 320. However, the shape of the transfer chamber 320 and the number of process chambers can be modified in various ways and provided according to user needs.

[0071] A load-locking chamber 40 is disposed between the transfer frame 220 and the transfer chamber 320. The load-locking chamber 40 provides a buffer space B in which the substrate W or the annular member R is exchanged between the transfer frame 220 and the transfer chamber 320. In one embodiment, to replace the annular member R disposed in the process chamber 50, the annular member R used in the process chamber 50 can be temporarily held in the load-locking chamber 40. In another embodiment, to transfer a new annular member R, scheduled to replace the old one, to the process chamber 50, the new annular member R can be temporarily held in the load-locking chamber 40.

[0072] As mentioned above, the internal atmosphere of the transfer frame 220 can be maintained at atmospheric pressure, and the internal atmosphere of the transfer chamber 320 can be maintained at vacuum pressure. The load locking chamber 40 is disposed between the transfer frame 220 and the transfer chamber 320, so that its internal atmosphere can switch between atmospheric pressure and vacuum pressure.

[0073] Figure 4 For icon Figure 1 A planar cross-sectional view of the state of the load-locking chamber. Figure 5 The substrate is shown placed Figure 4 The state of the support shelf. Figure 6 The ring-shaped component is shown placed in Figure 4 The state of the support shelf. Figure 7 It shows Figure 6 The annular bracket on the support shelf is extracted from the load-locking chamber.

[0074] Reference Figures 4 to 7 The load-locking chamber 40 may include a housing 420 and a support shelf 440. The housing 420 may have an internal space where a base plate W or an annular member R is placed. The housing 420 may be positioned between the transfer frame 220 and the transfer chamber 320. Furthermore, a first opening 422 and a second opening 423 may be formed on the housing 420. The first opening 422 may be provided on the surface facing the transfer frame 220 and may be opened and closed by a gate valve (not shown). The second opening 423 may be provided on the surface facing the transfer chamber 320 and may be opened and closed by a gate valve (not shown).

[0075] A gas supply port 424 for supplying gas to the internal space 421 of the housing 420 may also be formed in the housing 420. The gas may be an inert gas. For example, the gas may be a gas including nitrogen, argon, or similar gases. However, the inventive concept is not limited thereto, and the gas may be modified in various ways and provided as a known inert gas.

[0076] A pressure-reducing hole 425 for depressurizing the internal space 421 of the housing 420 can be formed at the housing 420. The pressure-reducing hole 425 can be connected to a pressure-reducing member (not shown). The pressure-reducing member can be a pump. However, the inventive concept is not limited thereto, and the pressure-reducing member can be modified in various ways from known devices for depressurizing the internal space 421.

[0077] With the gas supply port 424 and the pressure relief port 425 formed at the housing 420, the pressure inside the housing 420 can be switched between atmospheric pressure and vacuum pressure.

[0078] A support shelf 440 can be disposed within the interior space 421. The support shelf 440 can support the substrate W or the annular member R within the interior space 421. At least one support shelf 440 can be provided. Alternatively, multiple support shelves 440 can be provided. For example, three support shelves 440 can be provided. The multiple support shelves 440 can be provided to be spaced apart from each other when viewed from above. The multiple support shelves 440 can be perpendicularly spaced from each other. For this reason, the substrate W or the annular member R can be supported in multiple layers within the interior space 421.

[0079] Each of the support shelves 440 may include a support protrusion 442. As viewed above, the support protrusion 442 may be positioned to align with a recess 621 formed in the annular support 60, which will be described later. As viewed in cross-section, the support protrusion 442 may have an inverted "L" shape. The support protrusion 442 may include a first shelf pad 444 and a second shelf pad 446.

[0080] The first shelf liner 444 and the second shelf liner 446 can be made of a material that has friction with respect to the substrate W or the annular member R. For example, the first shelf liner 444 and the second shelf liner 446 can be made of a material such as carbon-filled polyether-ether-ketone (PEEK). However, the use of PEEK as the material for the first shelf liner 444 and the second shelf liner 446 is only one embodiment, and various modifications can be made to other known materials with similar properties.

[0081] When viewed from above, the first shelf pad 444 may have an arc shape in its longitudinal direction. The first shelf pad 444 is positioned closer to the pressure relief hole 425 than the second shelf pad 446. When viewed from above, the first shelf pad 444 may be positioned inside the outer periphery of the substrate W. Therefore, as Figure 5 As shown, the first shelf pad 444 can support the substrate W between the substrate W and the annular member R.

[0082] When viewed from above, the second shelf pad 446 may generally have an arcuate shape in its longitudinal direction. The second shelf pad 446 is positioned further away from the pressure relief hole 425 than the first shelf pad 444. When viewed from above, the second shelf pad 446 may be positioned outside the outer circumference of the substrate W and the inner circumference of the annular member R, but it may also be positioned inside the outer circumference of the annular member R. Therefore, the second shelf pad 446 can support the annular member R between the substrate W and the annular member R.

[0083] When viewed from above, the plurality of support protrusions 442 are positioned to align with the plurality of recesses 621 formed in the annular support 60. Therefore, as Figure 6 As illustrated, the annular support 60 on which the annular member R is placed can be introduced to a higher position by the first conveyor 242 relative to the support protrusion 442 within the load locking chamber 40, and when the first conveyor 242 moves downward, the annular member R can be placed on the support protrusion 442, and the annular support 60 can be moved downward by the first conveyor 242 placed on it. Subsequently, as... Figure 7 As shown, the first teleporter 242 is withdrawn.

[0084] Return to reference Figure 1 At least one process chamber 50 may be connected to the transfer chamber 320. Multiple process chambers 50 may be provided. A process chamber 50 may be a chamber for performing processes on a substrate W. A process chamber 50 may be a plasma chamber for treating the substrate W using plasma. For example, a process chamber 50 may be a chamber for performing the following: an etching process for removing a thin film on the substrate W using plasma, an ashing process for removing a photoresist film, a deposition process for forming a thin film on the substrate W, or a dry cleaning process. However, the inventive concept is not limited thereto, and the plasma processing performed in the process chamber 50 may be modified from known plasma processing processes in various ways.

[0085] Figure 8 schematically shown Figure 1 The implementation scheme for the process chamber. Refer to... Figure 8 The process chamber 50 can process the substrate W by transferring plasma to the substrate W. The process chamber 50 may include a housing 510, a support unit 520, a gas supply unit 530, and a plasma source.

[0086] The housing 510 provides a processing space for the substrate processing space. The housing 510 may be provided in a sealed shape. During substrate W processing, the processing space of the housing 510 may typically maintain a vacuum atmosphere. The housing 510 may be formed of a metallic material. In one embodiment, the housing 510 may be made of aluminum. The housing 510 may be grounded. An inlet 512 for loading or unloading the substrate W and the annular member R may be formed on one side of the housing 510. The inlet 512 may be selectively opened and closed by a gate valve 514.

[0087] A discharge port 516 may be formed on the bottom surface of the housing 510. A discharge line 560 may be connected to the discharge port 516. The discharge line 560 may discharge process gases, process byproducts, and the like supplied to the processing space of the housing 510 via the discharge port 516. A discharge baffle 552 may be disposed above the discharge port 516 to allow for more uniform discharge from the processing space. As viewed above, the discharge baffle 552 may have a generally annular shape. Furthermore, at least one hole may be formed at the discharge baffle 552.

[0088] Heater 518 is disposed on the wall of housing 510. Heater 518 heats the wall of housing 510. Heater 518 is electrically connected to a heating power source (not shown). Heater 518 generates heat by resisting the current applied by the heating power source (not shown). The heat generated from heater 518 is transferred to the processing space to maintain the processing space at a predetermined temperature. Heater 518 may be provided as a coiled heating wire. Multiple heaters 518 may be disposed on the wall of housing 510.

[0089] The support unit 520 is located within the housing 510. The support unit 520 may be positioned upwardly spaced from the bottom surface of the housing 510. The support unit 520 supports the substrate W. The support unit 520 includes an electrostatic chuck that uses electrostatic force to attract the substrate W. Alternatively, the support unit 520 may support the substrate W in various ways, such as by vacuum attraction or mechanical clamping. The support unit 520 including the electrostatic chuck will be described below.

[0090] The support unit 520 may include a dielectric plate 521, a cooling plate 522, an insulating plate 523, and a bottom body 524. The dielectric plate 521 is located at the top of the support unit 520. The dielectric plate 521 receives external power and applies electrostatic force to the substrate W. The dielectric plate 521 may be configured as a disc-shaped dielectric material. The substrate W is placed on the top surface of the dielectric plate 521. The top surface of the dielectric plate 521 has a smaller radius than the radius of the substrate W. When the substrate W is placed on the top surface of the dielectric plate 521, the edge region of the substrate W is located outside the dielectric plate 521. An electrode 525 and a heater 526 are embedded in the dielectric plate 521. The electrode 525 may be positioned above the heater 526.

[0091] Electrode 525 is electrically connected to a first power supply 525a. The first power supply 525a may include a DC power supply. A switch 525b is disposed between electrode 525 and the first power supply 525a. Electrode 525 can be electrically connected to the first power supply 525a by turning switch 525b on / off. When switch 525b is on, a DC current is applied to electrode 525. Electrostatic force is generated between electrode 525 and substrate W by the current applied to electrode 525. Therefore, substrate W is attracted to dielectric plate 521.

[0092] Heater 526 is electrically connected to a second power supply 526a. Heater 526 generates heat by resisting the current applied by the second power supply 526a. The generated heat is transferred to substrate W via dielectric plate 521. Substrate W can be maintained at a predetermined temperature by the heat generated from heater 526. Heater 526 may include a helical coil. Multiple heaters 526 are provided. Heaters 526 may be disposed in different areas of dielectric plate 521. For example, heaters 526 for heating the central area of ​​dielectric plate 521 and heaters 526 for heating the edge areas of dielectric plate 521 may be provided, and heaters 526 may be controlled independently of each other.

[0093] In the above example, the heater 526 is disposed within the dielectric plate 521, but the inventive concept is not limited thereto, and the heater 526 may not be disposed within the dielectric plate 521.

[0094] Cooling plate 522 is located below dielectric plate 521. Cooling plate 522 may be provided in a disc shape. Cooling plate 522 may be made of a conductive material. In one embodiment, cooling plate 522 may be made of aluminum. The top central region of cooling plate 522 may have a region corresponding to the bottom surface of dielectric plate 521.

[0095] A top flow path 522a may be disposed within the cooling plate 522. The top flow path 522a may be formed in a spiral shape within the cooling plate 522. The top flow path 522a may cool the cooling plate 522. Cooling fluid may be supplied to the top flow path 522a. In an embodiment, the cooling fluid may be cooling water.

[0096] Cooling plate 522 may include a metal plate. According to an embodiment, the entire area of ​​cooling plate 522 may be provided as a metal plate. Cooling plate 522 may be electrically connected to a third power supply 522b. The third power supply 522b may be provided as a high-frequency power supply that generates high-frequency power. The high-frequency power supply may be provided as an RF power supply. The RF power supply may be set to a high-bias RF power supply. Cooling plate 522 receives high-frequency power from the third power supply 522b. For this reason, cooling plate 522 may act as an electrode. Cooling plate 522 may be provided as ground.

[0097] An insulating plate 523 is disposed below the cooling plate 522. The insulating plate 523 is made of an insulating material and electrically insulates the cooling plate 522 from the bottom body 524, which will be described later. The insulating plate 523 may be provided in a circular plate shape when viewed from above. The insulating plate 523 may have a region corresponding to the area of ​​the cooling plate 522.

[0098] The bottom body 524 is disposed below the cooling plate 522. The bottom body 524 may be disposed below the insulating plate 523. The bottom body 524 may be provided in an annular shape when viewed from above. The first lifting pin module 570 and the second lifting pin module 580, which will be described later, may be positioned within the internal space of the bottom body 524.

[0099] The bottom body 524 has a connecting member 524b. The connecting member 524b connects the outer surface of the bottom body 524 to the inner sidewall of the housing 510. Multiple connecting members 524b may be arranged at regular intervals on the outer surface of the bottom body 524. The connecting member 524b supports the support unit 520 within the housing 510. Furthermore, the connecting member 524b is connected to the inner sidewall of the housing 510, causing the bottom body 524 to be electrically grounded. A first power line 525c connected to a first power source 525a, a second power line 526c connected to a second power source 526a, a third power line 522c connected to a third power source, a first fluid supply line connected to a top flow path, a second fluid supply line connected to a bottom flow path, and the like extend through the internal space of the connecting member 524b to the outside of the housing 510.

[0100] An annular member R is disposed at the edge region of the support unit 520. The annular member R may have an annular shape when viewed from above. The annular member R may have an inner top surface with a lower height than the outer top surface. The bottom surface of the edge region of the substrate W may rest on the inner top surface of the annular member R. Furthermore, the annular member R may have a surface that slopes upward from the center of the substrate W toward the outside of the substrate W between the inner and outer top surfaces of the annular member R. Therefore, when the substrate W is placed on the inner top surface of the annular member R, the substrate W can slide along the sloped surface of the annular member R to properly rest on the inner top surface of the annular member R, even if the replacement position may be slightly inaccurate.

[0101] A gas supply unit 530 supplies processing gas to the processing space of the housing 510. The gas supply unit 530 may include a gas supply nozzle 532, a gas supply line 534, and a gas storage unit 536. The gas supply nozzle 532 may be disposed in the central region of the top surface of the housing 510. An injection port is formed on the bottom surface of the gas supply nozzle 532. The injection port supplies processing gas to the housing 510. The gas supply line 534 connects the gas supply nozzle 532 and the gas storage unit 536. The gas supply line 534 supplies processing gas stored in the gas storage unit 536 to the gas supply nozzle 532. A valve 538 is disposed at the gas supply line 534. The valve 538 can adjust the flow rate of the processing gas supplied via the gas supply line 534 by opening and closing the gas supply line 534.

[0102] A plasma source excites the processing gas within housing 510 into a plasma state. In an embodiment of the inventive concept, capacitively coupled plasma (CCP) is used as the plasma source. The CCP source may include a top electrode and a bottom electrode within housing 510. The top and bottom electrodes may be arranged parallel to each other and perpendicular to each other within housing 510. One of the two electrodes may be supplied with high-frequency power, and the other electrode may be grounded. An electromagnetic field is formed in the space between the two electrodes, and the processing gas supplied to the space can be excited into a plasma state. Substrate processing is performed using plasma. According to an embodiment, the top electrode may be provided as a nozzle unit 590 to be described later, and the bottom electrode may be provided as the aforementioned metal plate. High-frequency power may be applied to the bottom electrode, and the top electrode may be grounded. Alternatively, high-frequency power may be applied to both the top and bottom electrodes separately. For this reason, an electromagnetic field is generated between the top electrodes. The generated electromagnetic field excites the processing gas supplied within housing 510 into a plasma state.

[0103] The first lifting pin module 570 can lift and lower the annular member R disposed on the top surface of the dielectric plate 521. The first lifting pin module 570 may include a first lifting pin 572 and a first pin actuator 574. The first lifting pin 572 can move vertically along pin holes formed in the dielectric plate 521, cooling plate 522, and / or insulating plate 523. Multiple first lifting pins 572 may be provided. When viewed from above, the first lifting pins 572 are positioned in a location that does not overlap with the heater 526 and the top flow path 522a. The first pin actuator 574 can move the first lifting pins 572 vertically. The first pin actuator 574 may be provided in a plurality of forms. The first pin actuator 574 may be a cylinder or motor using gas pressure or hydraulic pressure. However, the inventive concept is not limited thereto, and the first pin actuator 574 may be provided with various known devices capable of providing driving force.

[0104] The second lifting pin module 580 can lift and lower the substrate W. The second lifting pin module 580 may include a second lifting pin 582, a lifting / lowering plate 584, and a second pin driver 586. The second lifting pin 582 can be connected to the lifting / lowering plate 584. The lifting / lowering plate 584 can be moved in the up / down direction by the second pin driver 586.

[0105] The nozzle unit 590 may include a nozzle 592, a gas injection plate 594, and a support portion 596. The nozzle 592 may be positioned downwardly spaced from the top surface of the housing 510 by a predetermined distance. A space may be formed between the gas injection plate 594 and the top surface of the housing 510. The nozzle 592 may be configured as a plate shape with a constant thickness. The bottom surface of the nozzle 592 may be ionized to prevent arcing due to plasma. The cross-section of the nozzle 592 may be provided to have the same form and cross-sectional area as the support unit 520. The nozzle 592 includes a plurality of through holes 593. The through holes 593 penetrate the top and bottom surfaces of the nozzle 592 in an up / down direction. The nozzle 592 may include a metallic material. The nozzle 592 may be electrically connected to a fourth power supply 592a. The fourth power supply 592a may be configured as a high-frequency power supply. Alternatively, the nozzle 592 may be electrically grounded.

[0106] A gas injection plate 594 may be located on the top surface of the nozzle 592. The gas injection plate 594 may be positioned upwardly spaced from the top surface of the housing 510 by a predetermined distance. The gas injection plate 594 may be provided in a plate shape with a constant thickness. The gas injection plate 594 includes an injection hole 595. The injection hole 595 penetrates both the top and bottom surfaces of the gas injection plate 594 in an up / down direction. The injection hole 595 is positioned relative to a through-hole 593 in the nozzle 592. The gas injection plate 594 may comprise a metallic material.

[0107] The support portion 596 supports the side portions of the nozzle 592 and the gas injection plate 594. The top end of the support portion 596 is connected to the top surface of the housing 510, and the bottom end is connected to the side of the nozzle 592 and the gas injection plate 594. The support portion 596 may include a non-metallic material.

[0108] The ring support 60 can be used to carry the ring component R. The ring support 60 can be used by either the first transfer robot 240 or the second transfer robot 340 to carry the ring component R. For example, the ring support 60 can be used by the first transfer robot 240 to transfer the ring component R between the atmospheric pressure transfer module 20 and the load locking chamber 40. The situation where the ring component R is transferred by the first transfer robot 240 will be described below as an example.

[0109] The annular support 60 can be stored inside container F. For example, the annular support 60 can be stored inside a second container F2. In this case, the annular support 60 can be stored below the annular member R, which is stored in the second container F2.

[0110] Figure 9 A perspective view of an embodiment of a ring support for conveying a ring component is shown schematically. Figure 10 for Figure 9 A plan view of the bottom surface of the annular support. Figure 11 for Figure 9 Front view of the ring-shaped support. (Refer to...) Figures 9 to 11 According to an embodiment of the present invention, the annular support 60 may include a plate 620, a guide member 640, and a support leg 660.

[0111] An annular member R can be placed on the top surface of plate 620. Plate 620 can have a plate shape. Plate 620 can have a circular plate shape. For example, plate 620 has a diameter larger than the diameter of the annular member R. Since plate 620 is provided in a circular plate shape, the annular member R can be stably supported on plate 620 and conveyed. The central region of plate 620 can be provided as a barrier plate formed without holes. Alternatively, through holes for reducing the weight of plate 620 can be formed in the central region of plate 620.

[0112] Multiple notches 621 can be formed in the edge region of plate 620. Multiple notches 621 can be provided in the edge region of plate 620. Notches 621 are formed by penetrating from the top surface to the bottom surface of plate 620. Notches 621 can be formed in the edge region of plate 620, and can be formed in the edge region including the outer circumference of plate 620. That is, notches 621 can extend from the edge region of plate 620 to the outer circumference of plate 620. Notches 621 can be formed at multiple locations that, when viewed from above, align with the support shelf 440 provided to the load-locking chamber 40. Furthermore, notches 621 can be formed at multiple locations that, when viewed from above, overlap with the support groove F22 provided to the second container F2. This prevents interference between the annular member R and the support shelf 440 and / or the support groove F22 when the annular member R is being conveyed using the annular support 60.

[0113] When the annular member R is seated on the annular support 60 and the annular support 60 is conveyed by the first conveyor 242, the annular member R can slide by the linear movement of the first conveyor 242 or be seated in a position by the rotational movement of the first conveyor 242. The guide member 640 can prevent such sliding or distortion of the position of the annular member R.

[0114] The guide member 640 can protrude from the top surface of the plate 620. The guide member 640 can protrude upwards from the top surface of the plate 620. The inner circumference of the annular member R, placed on the annular support 60, can have a flat zone (FZ) and a round zone (RZ). The guide member 640 can be formed at a position facing the inner circumference of the flat zone FZ of the annular member R. The guide member 640 can have a shape corresponding to the inner circumference of the annular member R, including the flat zone FZ.

[0115] The foot 660 can be supported in contact with the top surface of the first conveyor 242. The foot 660 can protrude from the bottom surface of the plate 620. The foot 660 can protrude downward from the bottom surface of the plate 620. The foot 660 can be provided as a pad 662. The pad 662 can be made of a material with higher friction than the top surface of the first conveyor 242. In one embodiment, the pad 662 can be made of a material such as carbon-filled polyetheretherketone (PEEK). However, this is only one embodiment, and various modifications can be made and other known materials with similar properties can be provided. The pad 662 can be provided in a cylindrical shape. However, the shape of the pad 662 is not limited to this and can be modified into various shapes. At least one pad 662 can be provided. Multiple pads 662 can be provided. In one embodiment, three pads 662 can be provided on the bottom surface of the plate 620.

[0116] Subsequently, the position of the pad 662 and the specific form of the pad 662 will be described with respect to the first conveyor 242. Figure 12 The annular component and annular support are schematically shown in the arrangement. Figure 2 The status of the first teleporter. Figure 13 The annular component and annular support are shown in the figure. Figure 12 A magnified view of the first teleporter's status.

[0117] Reference Figure 12 When viewed from above, the pad 662 is positioned such that, with the annular bracket 60 supported at the first conveyor 242, this position does not overlap with the substrate support pad 244 of the first conveyor 242. According to an embodiment, the pad 662 may be located within the inner region of the substrate support pad 244.

[0118] Reference Figure 13When the annular support 60 is placed on the first conveyor 242, the plate 620 can be separated from the substrate support pad 244. When the annular support 60 is placed on the first conveyor 242, the pad 662 is positioned at a height that separates the plate 620 from the substrate support pad 244. When the annular support 60 is placed on the first conveyor 242, the pad 662 can be positioned at a height that separates the bottom surface of the plate 620 from the top of the substrate support pad 244. That is, when the annular support 60 is placed on the first conveyor 242, the substrate support pad 244 can be positioned at a height that does not contact the bottom surface of the plate 620. Therefore, when the annular support 60 is conveyed, the substrate support pad 244 can minimize contamination caused by the annular support 60. Therefore, when the first conveyor robot 240 carries the substrate W, it is possible to minimize contamination of the substrate W due to the substrate support pad 244.

[0119] By providing pad 662 to plate 620, it is possible to prevent slippage or distortion of the annular support 60 used to transport the annular member R when the first transport robot 240 transports the annular member R. By providing pad 662 to plate 620, it is possible to prevent slippage or distortion of the annular support 60 when the first transport robot 240 transports the annular support 60. Therefore, the annular member R and / or the annular support 60 can be transported stably. By providing pad 662 to plate 620, the annular member R and / or the annular support 60 can be transported stably without structural changes to the first transport robot 240.

[0120] In the above examples, the situation where the support 660 is provided as a pad 662 has been described as an example, but the inventive concept is not limited thereto. Figure 14 schematically shown Figure 1 Another implementation scheme for the first transmitter. Figure 15 This is a front view of another embodiment of the annular support used to carry the annular component. Figure 16 The circular component and the circular support are schematically shown placed on Figure 14 The status of the first teleporter. Figure 17 The ring-shaped component and ring-shaped support are shown placed in Figure 16 A magnified view of the first teleporter's status.

[0121] Reference Figure 14At least one substrate support pad 244 may be disposed on the top surface of the first conveyor 242. For example, three substrate support pads 244 may be configured to support three points of a conveyed object placed on the first conveyor 242. The object to be conveyed may be a substrate W. The substrate support pads 244 may prevent the substrate W placed on the first conveyor 242 from sliding. The substrate support pads 244 may be arranged along the circumferential direction of a virtual circle having a radius when viewed from above. The substrate support pads 244 may be provided in a substantially cylindrical shape.

[0122] At least one hole 246 may be formed on the top surface of the first conveyor 242. A pin 644, to be described later, may be inserted into the hole 246. The hole 246 may be provided in a form corresponding to the pin 644. The hole 246 may be formed to have a height that does not penetrate the first conveyor 242. The height of the hole 246 may be set to be less than the thickness of the first conveyor 242.

[0123] Another embodiment of the annular support 60 according to the present invention may include a plate 620, a guide member 640, and a support leg 660. The annular support 60 described in the present invention is substantially similar to... Figures 9 to 13 The annular support 60 described herein is provided. In the following text, with reference to... Figures 9 to 13 The description of the overlapping 60 ring-shaped support will be omitted.

[0124] Reference Figures 15 to 17 The support leg 660 can be supported in contact with the top surface of the first conveyor 242. The support leg 660 can protrude from the bottom surface of the plate 620. The support leg 660 can protrude downward from the bottom surface of the plate 620. The support leg 660 can be provided as a pin 664. In one embodiment, the pin 664 can be provided in a cylindrical shape. In another embodiment, the pin 664 can be provided in a cylindrical shape, and its bottom surface can be provided in a convex shape in the downward direction. However, the form of the pin 664 is not limited to this, and it can be modified into various shapes. At least one pin 664 can be provided. Multiple pins 664 can be provided. In one embodiment, three pins 664 can be provided on the bottom surface of the plate 620. The pins 664 can be provided in a number corresponding to the number of holes 246 provided on the top surface of the first conveyor 242. The pins 664 can be provided in a position that overlaps with the holes 246 when the first conveyor 242 supports the annular support 60.

[0125] Pin 664 is inserted into hole 246 provided on top surface of first conveyor 242. Therefore, annular bracket 60 can be supported on first conveyor 242. When annular bracket 60 is supported on first conveyor 242, pin 664 is positioned in a position that does not overlap with base plate support pad 244 of first conveyor 242 when viewed from above.

[0126] When the annular support 60 is placed on the first conveyor 242, the plate 620 can be separated from the substrate support pad 244. When the annular support 60 is placed on the first conveyor 242, the pin 664 can be positioned at a height that separates the plate 620 from the substrate support pad 244. When the annular support 60 is placed on the first conveyor 242, the pin 664 can be positioned at a height that separates the bottom surface of the plate 620 from the top of the substrate support pad 244. That is, when the annular support 60 is placed on the first conveyor 242, the substrate support pad 244 can be positioned at a height that does not contact the bottom surface of the plate 620. Therefore, when the annular support 60 is conveyed, the substrate support pad 244 can minimize contamination caused by the annular support 60. Therefore, when the first conveyor robot 240 carries the substrate W, it is possible to minimize contamination of the substrate W due to the substrate support pad 244.

[0127] By providing pin 664 to plate 620, the first transfer robot 240 and the annular support 60 are inserted and locked via pin 664. Therefore, when the first transfer robot 240 transfers the annular member R, slippage and / or distortion of the annular support 60 used for transferring the annular member R can be prevented. By providing pin 664 to plate 620, it is possible to prevent slippage and / or distortion of the annular support 60 when the first transfer robot 240 transfers the annular support 60. Therefore, the annular member R and / or the annular support 60 can be transferred stably. By providing pin 664 to plate 620, the annular member R and / or the annular support 60 can be transferred stably without altering the structure of the first transfer robot 240.

[0128] In the above description, the situation where the annular support 60 is transported by the first transfer robot 240 is described as an example, but the inventive concept is not limited to this, and the second transfer robot 340 can also use the annular support 60 to transport the annular component R. Even when the annular component R is transported by the second transfer robot 340 using the annular support 60, the above situation is similar to the situation where the annular support 60 is transported by the first transfer robot 240, and therefore its detailed description will be omitted.

[0129] The effects of the present invention are not limited to those described above, and any effects not mentioned can be clearly understood by those skilled in the art from the description and drawings to which the inventive concept pertains.

[0130] Although preferred embodiments of the present invention have been shown and described to date, the present invention is not limited to the specific embodiments described above, and it should be noted that those skilled in the art to which the present invention pertains can implement the present invention in various ways without departing from the essence of the present invention claimed in the claims, and modifications should not be interpreted separately from the technical spirit or intent of the present invention.

Claims

1. A substrate processing apparatus, the substrate processing apparatus comprising: An atmospheric pressure transmission module, wherein the atmospheric pressure transmission module comprises a first transmission robot, the first transmission robot having a first hand, and a base plate being placed on the first hand; A vacuum transfer module, wherein the vacuum transfer module includes a second transfer robot, the second transfer robot having a second hand, and a substrate is placed on the second hand; A load-locking chamber is positioned between the atmospheric pressure transmission module and the vacuum transmission module, and has an internal space that can switch between atmospheric pressure atmosphere and vacuum atmosphere; A process chamber, which is connected to the vacuum transfer module and processes the substrate; as well as A ring-shaped support, which can be supported by the first or second transfer robot for transferring and supporting the ring-shaped component disposed in the process chamber, and... The annular support comprises: A plate, on which the annular component is placed; as well as At least one support leg, the at least one support leg protruding from the bottom surface of the plate and positioned at the first hand or the second hand. The load-locking chamber includes a plurality of support shelves that support the substrate or the annular member, and Multiple notches are formed through the plate at its edge region, and When the first or second transfer robot moves from the top to the bottom of the plurality of support shelves, the annular member supported by the annular bracket sits on the support shelf, and the plurality of notches are positioned to align with the plurality of support shelves, so that the annular bracket moves together with the first and second transfer robots.

2. The substrate processing apparatus according to claim 1, wherein, At least one of the legs is configured as a pad.

3. The substrate processing apparatus according to claim 2, wherein, At least one substrate support pad for supporting the substrate is disposed on the top surface of the first hand or the second hand, and When the annular bracket is placed on the first hand or the second hand, the pad is positioned at a height that is upwardly spaced from the plate and the at least one substrate support pad.

4. The substrate processing apparatus according to claim 3, wherein, The pads and the at least one base plate support pads are positioned so as not to interfere with each other when viewed from above while the first or second transfer robot is transferring the annular component.

5. The substrate processing apparatus according to claim 4, wherein, The liner is cylindrical in shape.

6. The substrate processing apparatus according to claim 1, wherein, The at least one support leg is configured as a pin, and at least one substrate support pad for supporting the substrate is disposed on the top surface of the first hand or the second hand, and further includes a hole for inserting the end of the pin.

7. The substrate processing apparatus according to claim 6, wherein, When the annular bracket is placed on the first hand or the second hand, the pin is positioned at a height that is spaced apart from the at least one base plate support pad on the plate.

8. The substrate processing apparatus according to claim 7, wherein, The pin and the at least one base plate support pad are positioned so as not to interfere with each other when viewed from above as the annular component is being transported by the first or second transfer robot.

9. The substrate processing apparatus according to claim 8, wherein, The pin is configured as a cylindrical shape with a downwardly convex bottom surface.

10. The substrate processing apparatus according to any one of claims 1 to 9, wherein, The plate is in the form of a circular plate.

11. A conveying assembly, the conveying assembly comprising: Annular support for supporting annular components; and A transfer robot equipped with a transfer arm is used to selectively transfer the substrate and the annular support. The annular support comprises: A plate, on which the annular member is placed; and At least one support leg, the at least one support leg protruding from the bottom surface of the plate and configured to rest on the conveyor hand, in, Multiple notches are formed through the plate at the edge region of the plate, and the multiple notches are positioned to align with multiple support shelves configured to support the annular member.

12. The conveying assembly of claim 11, wherein the at least one support leg is configured as a pad.

13. The conveying assembly of claim 12, wherein at least one substrate support pad for supporting the substrate is placed on the top surface of the conveyor hand, and When the annular bracket is placed on the conveyor hand, the pad is positioned at a height that is upwardly spaced from the plate and the substrate support pad of the at least one substrate.

14. The conveying assembly of claim 13, wherein the pad and the substrate support pad of the at least one substrate are positioned so as not to overlap each other when viewed from above as the conveying robot conveys the annular member.

15. The transmission assembly of claim 11, wherein the at least one support leg is configured as a pin, and At least one substrate support pad for supporting the substrate is disposed on the top surface of the conveyor, and further includes a hole for inserting the end of the pin. When the annular bracket is placed on the conveyor hand, the pin is positioned at a height that separates the plate from the at least one base plate support pad upwards, and The pin and the at least one base plate support pad are positioned so as not to interfere with each other when viewed from above as the transfer robot transfers the annular component.

16. The conveying assembly according to any one of claims 11 to 15, wherein the plate is in the form of a circular plate.

17. A substrate processing apparatus, the substrate processing apparatus comprising: A loading port on which a container, annular support, or annular component for storing the substrate is placed; An index chamber having an interior that maintains an atmospheric pressure atmosphere and is equipped with a transfer robot; A load-locking chamber having an interior capable of switching between atmospheric pressure and vacuum pressure; as well as An annular support, used during the transfer of the annular member between the loading port, the load-locking chamber, and the indexing chamber, and The aforementioned delivery robot comprises: A conveyor that selectively conveys the substrate and the annular support; and At least one substrate support pad, the at least one substrate support pad being used to support the substrate, and The load-locking chamber includes a plurality of support shelves that support the substrate or the annular member, and The annular support comprises: A plate, on which the annular member is placed; and At least one support leg, the at least one support leg protruding from the bottom surface of the plate and configured to rest on the conveyor hand, and Multiple notches are formed through the plate at its edge region, and these notches are positioned to overlap each of the multiple support shelves when viewed from above. Wherein, between the annular support and the annular component, when the transfer robot uses the annular support to transfer the annular component, the annular component rests on the support shelf, and When the annular bracket is placed on the conveyor hand, the at least one leg is positioned at a height that is upwardly spaced from the plate and the at least one base plate support pad, and The at least one foot and the at least one base plate support pad are positioned so as not to interfere with each other when viewed from above as the transfer robot transfers the annular component.

18. The substrate processing apparatus of claim 17, wherein the at least one support foot is configured as a pad.

19. The substrate processing apparatus of claim 17, wherein the at least one foot is configured as a pin, and a hole for inserting the end of the pin is further included on the top surface of the transfer robot.

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