Support system, wafer server and preparation method thereof, and task processing method

Abstract

The present disclosure provides a support system, a wafer server and a preparation method thereof, and a task processing method, and belongs to the technical field of computers. The support system comprises a wafer platform and a frame body; wherein the wafer platform is fixed in the frame body, the wafer platform is used for carrying a wafer processing device, and the wafer processing device is fixed on the wafer platform, and the wafer processing device is a processing device prepared based on an unsegmented wafer. According to the embodiment of the present disclosure, the wafer processing device can be fixed better, and the wafer server prepared based on the wafer processing device is protected.

Description

Technical Field

[0001] This disclosure relates to the field of computer technology, and in particular to a support system, a wafer server, a method for fabricating the same, and a task processing method. Background Technology

[0002] A wafer is a crystalline disc made of semiconductor materials such as silicon and gallium arsenide. It is a brittle material with low toughness. As semiconductor technology advances towards miniaturization and high integration, chip sizes are becoming smaller and thinner, leading to greater challenges in storing and transporting wafer-based processing devices. Summary of the Invention

[0003] This disclosure provides a support system, a wafer server, a method for fabricating the same, and a task processing method.

[0004] In a first aspect, this disclosure provides a support system comprising: a wafer platform and a housing;

[0005] The wafer platform is fixed in the frame and is used to support the wafer processing device. The wafer processing device is fixed on the wafer platform and is a processing device based on the fabrication of undivided wafers.

[0006] Secondly, this disclosure provides a method for fabricating a wafer server, the method comprising: fabricating a wafer processing device based on a wafer; fixing the wafer processing device on a wafer platform; fixing the wafer platform within a frame; and obtaining a wafer server.

[0007] Thirdly, this disclosure provides a wafer server, which includes: a wafer processing device and a support system, wherein the wafer processing device is placed in the support system and fixed by the support system; wherein the support system is the support system described in any one of the embodiments of this disclosure, and the wafer server is prepared by the wafer server preparation method described in any one of the embodiments of this disclosure.

[0008] Fourthly, this disclosure provides a task processing method applied to a wafer server. The task processing method includes: responding to a received task processing request and executing a task to be processed; wherein the wafer server is the wafer server described in any one of the embodiments of this disclosure.

[0009] Fifthly, this disclosure provides an electronic device, which is based on a wafer server, comprising: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores one or more computer programs executable by the at least one processor, and the one or more computer programs are executed by the at least one processor to enable the at least one processor to perform the above-described task processing method.

[0010] In a sixth aspect, this disclosure provides an electronic device, which is based on a wafer server, comprising: a plurality of processing cores; and an on-chip network configured to interact with data between the plurality of processing cores and external data; wherein one or more of the processing cores store one or more instructions, and the one or more instructions are executed by the one or more processing cores to enable the one or more processing cores to perform the above-described task processing method.

[0011] In a seventh aspect, this disclosure provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor / processor core, implements the above-described task processing method.

[0012] The embodiments provided in this disclosure can provide a wafer server that is easy to store and transport based on a fixed wafer processing device with a better support system. Moreover, when the wafer processing device is connected to an external circuit board, the connection failure between the wafer processing device and the external circuit board caused by moving or other operations can be reduced, so as to better protect the wafer server.

[0013] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0014] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the embodiments of the present disclosure to explain the disclosure and do not constitute a limitation thereof. The above and other features and advantages will become more apparent to those skilled in the art from the detailed description of exemplary embodiments with reference to the accompanying drawings, in which:

[0015] Figure 1 A schematic diagram of a support system provided in an embodiment of this disclosure;

[0016] Figure 2 A schematic diagram of a support system provided in an embodiment of this disclosure;

[0017] Figure 3A schematic diagram of a support system provided in an embodiment of this disclosure;

[0018] Figure 4 A schematic diagram of a support system provided in an embodiment of this disclosure;

[0019] Figure 5 A schematic diagram of a wafer platform provided in an embodiment of this disclosure;

[0020] Figure 6 A schematic diagram of a support system provided in an embodiment of this disclosure;

[0021] Figure 7 A schematic diagram of a support system provided in an embodiment of this disclosure;

[0022] Figure 8 A schematic diagram of a support system provided in an embodiment of this disclosure;

[0023] Figure 9 A flowchart illustrating a method for fabricating a wafer server according to an embodiment of this disclosure;

[0024] Figure 10 A schematic diagram of a wafer server provided in an embodiment of this disclosure;

[0025] Figure 11 This is a schematic diagram of a wafer processing apparatus provided in an embodiment of the present disclosure;

[0026] Figure 12 This is a schematic diagram of a wafer processing apparatus provided in an embodiment of the present disclosure;

[0027] Figure 13 This is a schematic diagram of a wafer processing apparatus provided in an embodiment of the present disclosure;

[0028] Figure 14 A schematic diagram of a wafer server provided in an embodiment of this disclosure;

[0029] Figure 15 A schematic diagram of a wafer server provided in an embodiment of this disclosure;

[0030] Figure 16 A schematic diagram of a wafer server provided in an embodiment of this disclosure;

[0031] Figure 17 A schematic diagram of a wafer server provided in an embodiment of this disclosure;

[0032] Figure 18 A schematic diagram of a wafer server provided in an embodiment of this disclosure;

[0033] Figure 19 A schematic diagram of a wafer server provided in an embodiment of this disclosure;

[0034] Figure 20 A flowchart of a task processing method provided in an embodiment of this disclosure;

[0035] Figure 21 A block diagram of an electronic device provided in an embodiment of this disclosure;

[0036] Figure 22 This is a block diagram of an electronic device provided in an embodiment of the present disclosure. Detailed Implementation

[0037] To enable those skilled in the art to better understand the technical solutions of this disclosure, exemplary embodiments of this disclosure are described below with reference to the accompanying drawings, including various details of the embodiments of this disclosure to aid understanding. These should be considered merely exemplary. Therefore, those skilled in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this disclosure. Similarly, for clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0038] Where there is no conflict, the various embodiments of this disclosure and the features thereof in the embodiments may be combined with each other.

[0039] As used herein, the term “and / or” includes any and all combinations of one or more related enumerated entries.

[0040] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. As used herein, the singular forms “a” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that when the terms “comprising” and / or “made of” are used in this specification, the presence of the stated feature, integral, step, operation, element, and / or component is specified, but the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof is not excluded. Words such as “connected” or “linked” are not limited to physical or mechanical connections but can include electrical connections, whether direct or indirect.

[0041] Unless otherwise specified, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and this disclosure, and will not be interpreted as having an idealized or overly formal meaning, unless expressly so defined herein.

[0042] Wafers are the raw materials for manufacturing chips. Their primary material is silicon. In related technologies, silicon can be purified and processed into wafers through processes such as ingot forming, slicing, grinding, and polishing. Because silicon is a hard and brittle material, and wafers are relatively thin, their storage and transportation are challenging. After obtaining wafer-level servers based on wafers, how to safely protect and transport these servers has become a pressing problem in this field. In view of this, embodiments of this disclosure provide a support system, a wafer server, a method for fabricating the same, and a task processing method. The support system according to embodiments of this disclosure can effectively support and fix the wafer processing device, resulting in a wafer server that is easy to store and transport. Furthermore, when the wafer processing device is connected to an external circuit board, it can reduce connection failures between the wafer processing device and the external circuit board caused by handling or other operations, thereby better protecting the wafer server.

[0043] In related technologies, after wafer fabrication is completed, the wafer is typically diced, and further processing is performed on the diced dies to create circuit element structures with various functions, thus becoming integrated circuit (IC) products with specific electrical functions. For example, qualified dies in a wafer are diced and packaged to form processing chips with specific functions. Several processing chips are then further packaged to form circuit boards, and multiple circuit boards are further integrated to obtain a corresponding processing device or server. In the embodiments of this disclosure, the wafer processing device is a processing device based on undivided wafers. Considering the characteristics of wafers such as high brittleness and low toughness, conventional server support systems or packaging methods cannot effectively protect the wafer processing device. Therefore, for the wafer processing device, a dedicated support system is provided, with a wafer platform serving as the platform for supporting and fixing the wafer processing device, and the wafer platform is further fixed in a protective frame to form a corresponding wafer server. The first aspect of the embodiments of this disclosure provides a support system.

[0044] Figure 1 This is a schematic diagram of a support system provided according to an embodiment of this disclosure. (Refer to...) Figure 1 The support system includes: a wafer platform 11 and a frame 12;

[0045] The wafer platform 11 is fixed in the frame 12. The wafer platform 11 is used to support the wafer processing device 13, and the wafer processing device 13 is fixed on the wafer platform 11. The wafer processing device 13 is a processing device based on the fabrication of undivided wafers.

[0046] In some possible implementations, the wafer processing device is fixed to the wafer platform by an adhesive, and / or, the wafer processing device is fixed to the wafer platform based on a retaining spring.

[0047] For example, a special chip adhesive is used to attach the wafer processing device to the wafer platform.

[0048] For example, a plurality of fixing springs are arranged around the wafer processing device, and the wafer processing device is pressed against the wafer platform based on the fixing springs to achieve the fixing of the wafer processing device.

[0049] For example, the wafer processing device is attached to the wafer platform using a dedicated chip adhesive, and a retaining spring is used to further secure the wafer processing device to the wafer platform.

[0050] The adhesives and retaining springs mentioned above are relatively simple fixing methods, which can provide some fixation for the wafer processing device, but the fixing effect is not ideal. Therefore, in some possible implementations, the structure of the housing is improved so that the housing itself can effectively fix the wafer processing device, thereby further enhancing the protection of the wafer processing device.

[0051] In some possible implementations, the frame includes a support module and a fixing module. The support module is a cavity structure with an opening at the top, and the fixing module includes a fixing plate and an extension component connected to one side of the fixing plate. The wafer platform is fixed in the cavity of the support module, the fixing plate of the fixing module is fixed at the opening of the support module, and the extension component enters the cavity through the opening to fix the wafer processing device on the wafer platform.

[0052] In some possible implementations, one end of the protruding component is connected to a mounting plate, and the other end contacts the wafer processing device, fixing the wafer processing device to the wafer platform by compression. In other words, the compression force applied by the protruding component can fix the wafer processing device to the wafer platform, effectively preventing the wafer processing device from shifting.

[0053] Furthermore, considering that the extrusion method exerts a primarily downward force on the wafer processing device, the device may experience horizontal displacement under the influence of certain external forces. Therefore, the frame structure can be further adjusted to minimize the occurrence of such situations.

[0054] In some possible implementations, one end of the protruding component is connected to a mounting plate, at least a portion of the other end contacts the wafer processing device, and the remaining portion contacts the wafer platform, thereby fixing the wafer processing device to the wafer platform by compression.

[0055] In other words, the protruding component not only contacts the wafer processing device but also the wafer platform. In this way, not only can the wafer processing device be prevented from shifting in the vertical direction, but the possibility of the wafer processing device shifting in the horizontal direction relative to the wafer platform can also be reduced, thus improving the fixing effect on the wafer processing device.

[0056] The following is combined with Figure 2-5 The method of fixing the wafer processing device in the frame of the wafer system will be explained in detail.

[0057] Figure 2 This is a schematic diagram of a support system provided according to an embodiment of this disclosure. (Refer to...) Figure 2 The support system includes a wafer platform 21 and a frame 22. The wafer platform 21 is used to place the wafer processing device 23. The frame 22 includes a support module 221 and a fixing module 222. The fixing module 222 consists of a fixing plate 2221 and an extension component 2222.

[0058] like Figure 2 As shown, the support module 221 is a cavity with an opening at the top, shaped like a "U". A structure for supporting the fixing plate is provided at the top of the "U", allowing the fixing plate 2221 to be fixed to the support module 221 (e.g., using screws or glue). The wafer platform 21 is located at the bottom of the cavity of the support module 221. The wafer processing device 23 is placed on the wafer platform 21. One end of the protruding component 2222 is fixed to the fixing plate 2221, and the other end enters the cavity through the cavity opening, fixing the wafer processing device 23 to the wafer platform 21.

[0059] In some possible implementations, the protruding part 2222 may or may not be elastic in the vertical direction (e.g., a spring).

[0060] When the protruding member 2222 is elastic, its natural height (i.e., the height of the protruding member without external force applied) should be greater than the distance d1 between the bottom of the fixing plate 2221 and the top of the wafer processing device 23. This ensures that the protruding member 2222 is compressed in its current position, thereby applying a vertically downward force to the wafer processing device 23. Under this force, the wafer processing device 23 is "pressed" onto the wafer platform 21, thus achieving the effect of fixing the wafer processing device 23 to the wafer platform 21.

[0061] When the protruding part 2222 is not elastic, the height of the protruding part 2222 should be precisely set to be equal to or slightly greater than the distance d1 between the bottom of the fixing plate 2221 and the top of the wafer processing device 23, so that the protruding part 2222 can, on the one hand, fix the wafer processing device 23 to the wafer platform 21, and on the other hand, avoid damage to the wafer processing device 23 due to excessive height, or failure to effectively fix the wafer processing device 23 due to insufficient height.

[0062] exist Figure 2 In the support system shown, the fixing plate 2221 is located above the support module. In some possible implementations, the fixing plate may also be located inside the cavity of the support module.

[0063] Figure 3 This is a schematic diagram of a support system provided according to an embodiment of this disclosure. (Refer to...) Figure 3 The support system includes a wafer platform 31 and a frame 32. The wafer platform 31 is used to place the wafer processing device 33. The frame 32 includes a support module 321 and a fixing module 322. The fixing module 322 is composed of a fixing plate 3221 and an extension component 3222. The fixing plate 3221 is disposed inside the cavity of the support module 321.

[0064] like Figure 3 As shown, the support module 321 is a cavity with an opening at the top, shaped like a "U". A latching structure for fixing the fixing plate 3221 is provided at the top of the "U" for fixing the fixing plate 3221, allowing the fixing plate 3221 to be fixed to the top of the cavity inside the support module 321. The wafer platform 31 is located at the bottom of the cavity of the support module 321. The wafer processing device 33 is placed on the wafer platform 31. One end of the protruding component 3222 is fixed to the fixing plate 3221, and the other end enters the cavity through the opening, fixing the wafer processing device 33 to the wafer platform 31.

[0065] The protruding component 3222 can be elastic in the vertical direction, and the natural height of the protruding component 3222 should be greater than the distance d2 between the bottom of the fixing plate 3221 and the top of the wafer processing device 33, so that the protruding component 3222 is in a compressed state in the current position. On the one hand, it can apply an upward force to the fixing plate 3221, so that the fixing plate 3221 is fixed to the top of the cavity under the action of the force and the bayonet structure. On the other hand, it applies a vertical downward force to the wafer processing device 33, so that the wafer processing device 33 is fixed on the wafer platform 31.

[0066] It should be understood that, with Figure 2Similarly, the protruding part 3222 may also be inelastic in the vertical direction. Accordingly, the height of the protruding part 3222 should be precisely set to be equal to or slightly greater than the distance d2 between the bottom of the fixing plate 3221 and the top of the wafer processing device 33. This allows the protruding part 3222 to fix the wafer processing device 33 to the wafer platform 31 and the fixing plate 3221 to the bayonet structure. On the other hand, it avoids damage to the wafer processing device 33 due to excessive height, or failure to effectively fix the wafer processing device 33 and the fixing plate 3221 due to insufficient height.

[0067] Furthermore, in some possible implementations, in order to reduce the damage to the wafer processing apparatus caused by the force exerted by the protruding component, vibration damping structures and anti-vibration structures can be provided at the contact surface between the protruding component and the fixed plate and / or the contact surface between the protruding component and the wafer processing apparatus.

[0068] For example, a damping layer made of damping material is added to the contact surface between the protruding component and the wafer processing device.

[0069] exist Figure 2 and Figure 3 In this design, the support module and the fixing plate together form a closed cavity, in which the wafer processing device is fixed. This allows the wafer processing device to be protected from damage by external forces to a certain extent, thus improving the safety of the wafer processing device.

[0070] because Figure 2 and Figure 3 The support system is shown only in the longitudinal section. To further describe the support system, the following will be done via... Figure 4 The support system is shown from a top-down view.

[0071] Figure 4 This is a schematic diagram of a support system provided according to an embodiment of this disclosure. (Refer to...) Figure 4 The support system is shown from a top view (the fixing plate and other structures are omitted in the figure for easier display of the protruding parts).

[0072] exist Figure 4 In (a), the wafer processing device 43a is fixed on the wafer platform 41a, and the protruding part 42a is a cylindrical structure, including four pillars, one end of each pillar is connected to the fixing plate, and the other end is in contact with the wafer processing device 43a, for fixing the wafer processing device 43a on the wafer platform 41a.

[0073] exist Figure 4In (b), the wafer processing device 43b is fixed on the wafer platform 41b, and the protruding part 42b is a sheet-shaped structure, including four support sheets, one end of each support sheet is connected to the fixing plate, and the other end is in contact with the wafer processing device 43b, for fixing the wafer processing device 43b on the wafer platform 41b.

[0074] exist Figure 4 In (c), the wafer processing device 43c is fixed on the wafer platform 41c, and the protruding part 42c is a cylindrical structure, including four pillars, one end of each pillar is connected to the fixing plate, a part of the other end is in contact with the wafer processing device 43c, and the remaining part is in contact with the wafer platform 41c, which is used to fix the wafer processing device 43c on the wafer platform 41c and prevent the wafer processing device 43c from being displaced in the horizontal direction.

[0075] exist Figure 4 In (d), the wafer processing device 43d is fixed on the wafer platform 41d, and the protruding part 42d is a sheet-shaped structure, including four support plates. One end of each support plate is connected to the fixing plate, a part of the other end is in contact with the wafer processing device 43d, and the remaining part is in contact with the wafer platform 41d. This is used to fix the wafer processing device 43d on the wafer platform 41d and to prevent the wafer processing device 43d from being displaced in the horizontal direction.

[0076] It should be noted that the above description of the number of protruding components and their relative positions to the wafer processing apparatus is merely illustrative. In some possible implementations, other numbers of protruding components may be provided, and the protruding components may be located in other positions. This disclosure does not limit these aspects.

[0077] In some possible implementations, a recess can be provided on the wafer platform specifically for placing the wafer processing device. This recess structure reduces the possibility of the wafer processing device shifting in the horizontal direction.

[0078] Figure 5 This is a schematic diagram of a wafer platform provided in an embodiment of this disclosure. (Refer to...) Figure 5 A groove 511 matching the size of the wafer processing device 53 is provided on the top of the wafer platform 51. The wafer processing device 53 is fixed in the groove 511. The sidewall of the groove 511 can restrict the movement of the wafer processing device 53 in the horizontal direction, thereby reducing the displacement of the wafer processing device 53 in the horizontal direction.

[0079] As mentioned above, the wafer processing apparatus can be fixed to the wafer platform by various means such as adhesives, fixing springs, protruding parts, and grooves. All of the above fixing methods can be used simultaneously, or at least one of them can be used selectively. This disclosure does not limit this.

[0080] In some possible implementations, the wafer processing device itself has limited functionality or processing capabilities. To expand its functionality or improve its processing capabilities, some external circuit boards can be set up and connected to the wafer processing device, so that the two can work together to perform various processing tasks.

[0081] For example, an external circuit board can provide at least one of the following functions: power supply, communication, storage, and clocking. In other words, the wafer processing device can be externally connected to one or more of the following: power supply circuit board, communication circuit board, storage circuit board, and crystal oscillator circuit board.

[0082] It should be noted that the above description of external circuit boards and their functions is merely illustrative, and the embodiments disclosed herein do not limit the number or functions of external circuit boards.

[0083] In some possible implementations, the aforementioned external circuit board can be placed inside the support system.

[0084] Similar to the wafer processing unit, the external circuit board also needs to be fixed in place to prevent it from being disconnected from the wafer processing unit or damaged due to external forces such as moving.

[0085] In some possible implementations, the external circuit board can be fixed to the bottom, side, or wafer platform of the housing. In practical applications, the fixed position of the external circuit board in the support system can be determined based on its size, connection relationship with the wafer processing device, and connection method.

[0086] In some possible implementations, the wafer platform is also used to place at least one external circuit board, which is connected to the wafer processing device. The external circuit board and the wafer processing device can be connected via a wired connection and / or a wireless connection.

[0087] In some possible implementations, the external circuit board is secured to the wafer platform by fixing pins and / or adhesive.

[0088] It should be noted that the external circuit board can be a printed circuit board (PCB) or other circuit board, which is more flexible than the wafer processing device. Therefore, it can be fixed to the wafer platform by means of screws, rivets or other means.

[0089] Figure 6 This is a schematic diagram of a support system provided according to an embodiment of this disclosure. (Refer to...) Figure 6The support system includes a wafer platform 61 and a housing 62. In addition to housing the wafer processing device 63, the wafer platform also houses several external circuit boards 64, which are fixed to the wafer platform 61.

[0090] The external circuit board 64 can be connected to the corresponding functional unit in the wafer processing device 63 via wired connection methods such as power cord, network cable, or optical fiber, and / or the external circuit board 64 can also be connected to the corresponding functional unit in the wafer processing device 63 via electromagnetic wave signals (e.g., laser signals, Bluetooth signals, WIFI signals, etc.).

[0091] Compared to conventional processing devices, wafer processing devices have a higher degree of integration. Therefore, during the execution of tasks, wafer processing devices may generate a large amount of heat, requiring timely heat dissipation to ensure smooth operation. Based on this, in some possible implementations, a cooling module can be incorporated into the support system to dissipate heat from the wafer processing device (which may also include external circuit boards).

[0092] In some possible implementations, the cooling module can employ at least one of liquid cooling or air cooling. Liquid cooling primarily relies on the circulation of coolant to remove heat, while air cooling primarily relies on airflow blowing across the wafer processing device to remove heat.

[0093] In some possible implementations, several fans are installed in the frame to remove heat through the rotation of the fans, thereby cooling the wafer processing device.

[0094] In some possible implementations, the cooling module includes at least one cooling pipe, with one end connected to an inlet and the other end connected to an outlet, so that coolant enters the cooling pipe through the inlet and flows out through the outlet.

[0095] In some possible implementations, the aforementioned cooling pipes are disposed within the wafer platform. Since the wafer processing device is placed on the wafer platform, the heat exchange between it and the wafer platform is relatively fast. Therefore, by embedding cooling pipes in the wafer platform, the coolant can flow along the pipes, quickly carrying away the heat from the wafer processing device, thereby achieving efficient heat dissipation.

[0096] Figure 7 This is a schematic diagram of a support system provided according to an embodiment of this disclosure. (Refer to...) Figure 7The support system includes a wafer platform 71 and a frame 72. The wafer platform 71 supports the wafer processing device 73, and a cooling pipe 711 is provided inside the wafer platform 71. One end of the cooling pipe 711 is connected to a liquid inlet 7111, and the other end is connected to a liquid outlet 7112. During cooling, coolant is introduced into the cooling pipe 711 through the liquid inlet 7111. The coolant flows along the cooling pipe 711, carrying away the heat from the wafer processing device 73, and flows out from the liquid outlet 7112. Through the circulation of the coolant, the wafer processing device 73 can be effectively cooled, ensuring its smooth operation.

[0097] The flow rate of the coolant can be set according to the temperature of the wafer processing unit, which can be collected in real time by a corresponding temperature sensor. When the collected temperature is high, the wafer processing unit needs to be cooled down quickly. Therefore, the flow rate of the coolant can be increased appropriately to quickly remove heat. Conversely, when the temperature is low, the flow rate of the coolant can be reduced appropriately to reduce cooling costs.

[0098] In some possible implementations, an immersion liquid cooling method can be used to dissipate heat from the wafer processing device, which involves immersing the wafer processing device in a coolant and achieving heat dissipation through heat exchange with the coolant.

[0099] For example, the cooling module includes a reservoir containing coolant, and the reservoir is connected to the interior of the housing via a pipe for introducing coolant into the housing to immerse the wafer processing device in the coolant.

[0100] Figure 8 This is a schematic diagram of a support system provided according to an embodiment of this disclosure. (Refer to...) Figure 8The support system includes a wafer platform 81 and a frame 82. The wafer platform 81 supports the wafer processing device 83 and is positioned in the middle of the cavity of the frame 82, creating a space between it and the bottom of the frame 82 for storing coolant. An opening is provided on the side of the frame 82 to connect to a coolant inlet pipe 841, which is connected to a coolant reservoir 842. This inlet pipe allows coolant from the reservoir to be transferred into the frame 82, immersing the wafer processing device 83 in the coolant. Additionally, a partition 85 is provided between the wafer processing device 83 and the top of the frame 82. The partition 85 has several vent holes 851. When the coolant vaporizes due to heat, the pressure in the space below the partition 85 increases, and the gas passes through the vent holes 851 into the condensation space above the partition 85, thus carrying away heat from the lower space. The gas condenses into liquid coolant in the condensation space and flows back to the storage tank 842 via the outlet pipe 843 connected to the side of the frame 82. Considering that some coolant may be lost during the cooling process, new coolant can be added through the filler port 844 when the coolant capacity in the storage tank 842 is insufficient to meet the usage requirements.

[0101] The coolant can be electronic fluorinated liquid, etc., and the embodiments disclosed herein do not limit the coolant.

[0102] It should be noted that the above-mentioned multiple cooling methods can be used simultaneously to enhance the cooling effect (i.e., air cooling and liquid cooling methods can be used simultaneously, or different liquid cooling methods can be used simultaneously). In addition, the above-mentioned cooling methods are only illustrative examples, and the embodiments disclosed herein do not limit the cooling method for the wafer processing apparatus.

[0103] The second aspect of this disclosure provides a method for fabricating a wafer server.

[0104] Figure 9 A flowchart illustrating a method for fabricating a wafer server according to an embodiment of this disclosure. (Refer to...) Figure 9 The preparation method includes:

[0105] In step S91, a wafer processing device is fabricated based on the wafer.

[0106] In step S92, the wafer processing apparatus is fixed on the wafer platform.

[0107] In step S93, the wafer platform is fixed in the frame.

[0108] In step S94, a wafer server is obtained.

[0109] In some possible implementations, the wafer processing apparatus is a processing apparatus based on the fabrication of undipped wafers. This wafer processing apparatus has certain computing power and / or storage capabilities, and can be used to perform at least one of image processing tasks, video processing tasks, speech processing tasks, and text processing tasks.

[0110] In some possible implementations, the wafer processing device needs to work with an external circuit board to perform the task. Therefore, when fabricating the corresponding wafer server, it is also necessary to fix the external circuit board onto the wafer platform and establish a connection between the external circuit board and the wafer processing device.

[0111] In some possible implementations, the external circuit board includes at least one of a power supply circuit board, a communication circuit board, a storage circuit board, and a crystal oscillator circuit board, for providing at least one of the following functions: power supply, communication, storage, and clocking to the wafer processing device.

[0112] In some possible implementations, the connection between the external circuit board and the corresponding functional unit in the wafer processing device can be established through wired connections such as power cords, network cables, and optical fibers, and / or wireless connections can be established between the external circuit board and the corresponding functional unit in the wafer processing device through electromagnetic wave signals.

[0113] It should be noted that the embodiments disclosed herein do not limit the execution order of steps S92 and S93. In other words, the wafer processing device can be fixed on the wafer platform first, and then the wafer platform together with the wafer processing device can be fixed in the frame, or the wafer platform can be fixed in the frame first, and then the wafer processing device can be fixed on the wafer platform. The execution order is related to the fixing method and other details.

[0114] In this embodiment of the disclosure, since the wafer processing device is fragile, a support system is used to fix the wafer processing device to effectively protect it, thereby forming a product-grade wafer server that is easy to transport and store.

[0115] A third aspect of this disclosure provides a wafer server.

[0116] Figure 10 This is a schematic diagram of a wafer server provided according to an embodiment of this disclosure. (Refer to...) Figure 10 The wafer server includes a wafer processing device 101 and a support system 102. The wafer processing device 101 is placed in the support system 102 and fixed by the support system 102.

[0117] The support system adopts any of the support systems in the embodiments of this disclosure, and the wafer server is prepared by the wafer server preparation method in the embodiments of this disclosure.

[0118] In some possible implementations, the support system 102 includes a wafer platform 1021 and a housing 1022.

[0119] In other words, in a wafer server, the wafer processing unit is the core structure, providing processing power, while the support system is an auxiliary structure, protecting the wafer processing unit to ensure the availability of the wafer server. The aforementioned wafer server can be used to manufacture various terminal devices and server products, including computing servers, storage servers, and web (worldwide web) servers. This disclosure does not limit the type of product or the field of application of the wafer server.

[0120] In some possible implementations, the wafer processing apparatus is a processing apparatus based on the fabrication of undipped wafers.

[0121] For example, multiple computing chips are fabricated on a wafer to form a processing device with strong computing capabilities, which can be used to perform various computing tasks.

[0122] For example, multiple memory chips are fabricated on a wafer to form a processing device with a large storage space, which can be used to perform various storage tasks.

[0123] For example, multiple computing chips and at least one memory chip are fabricated on a wafer to form a memory-computing integrated processing device that can be used to perform more complex tasks.

[0124] It should be noted that the above examples of wafer processing devices are merely illustrative, and the embodiments disclosed herein do not limit the functions of the wafer processing devices or the corresponding number of chips.

[0125] Figure 11 This is a schematic diagram of a wafer processing apparatus provided in an embodiment of the present disclosure. (Refer to...) Figure 11 (a) shows the wafer processing apparatus from a top-down view. Figure 11 In (b), the wafer processing apparatus is shown at a cross-sectional angle.

[0126] according to Figure 11 (a) and Figure 11 (b) It is known that the wafer processing device 111 is circular and has multiple dies 112 distributed on it. Moreover, the dies 112 are connected to each other, so that data can be transmitted between the dies 112.

[0127] In some possible implementations, the aforementioned dies 112 have computing functions, and through the computing functions of each die 112 and the connection relationship between dies 112, the wafer processing device 111 can perform computing tasks.

[0128] In some possible implementations, the aforementioned dies have storage functions, and through the storage functions of each die and the connection relationships between dies, the wafer processing device can perform storage-type tasks.

[0129] In some possible implementations, the dies of the wafer processing device have multiple functions. For example, a first functional die is fabricated in the middle region of the wafer, and a second functional die is fabricated in the region other than the middle region, so that the wafer processing device has both the first function and the second function (the first function is the primary function, and the second function is the secondary function), thereby having the ability to process complex tasks.

[0130] Figure 12 This is a schematic diagram of a wafer processing apparatus provided in an embodiment of the present disclosure. (Refer to...) Figure 12 (a) shows the wafer processing apparatus from a top-down view. Figure 12 In (b), the wafer processing apparatus is shown at a cross-sectional angle.

[0131] Reference Figure 12 (a) and Figure 12 (b) On the wafer, a plurality of computing chips 121 are arranged in a square area centered on the wafer's center and with the wafer's diameter as the diagonal, forming a computing array. This computing array serves as the main functional chip of the wafer processing device. Storage chips 122, communication chips 123, and other supporting functional chips are respectively arranged in four rectangular areas outside the square area. Based on the aforementioned main functional chip and multiple supporting functional chips, a wafer processing device integrating in-memory computing is constructed.

[0132] In some possible implementations, external chips can also be packaged on the wafer processing device.

[0133] For example, the wafer processing apparatus includes a wafer body and at least one external chip packaged in the wafer body. The external chip may include computing chips and / or memory chips, etc.

[0134] In other words, to improve the processing power and / or expand the functionality of a wafer processing device, external chips can be connected to the wafer itself. Correspondingly, during task execution, the functions of the wafer itself and the external chips are organically combined to jointly complete various tasks.

[0135] Figure 13 This is a schematic diagram of a wafer processing apparatus provided in an embodiment of the present disclosure. (Refer to...) Figure 13 Multiple external chips 132 are packaged on top of the wafer body 131.

[0136] The packaging methods for the external chip 132 and the wafer body 131 include, but are not limited to: bonding the external chip 132 to the die of the wafer body 131, and / or bonding the external chip 132 to the redistribution layers (RDL) of the wafer body 131. This disclosure does not limit the packaging method of the external chip and the wafer body.

[0137] In some possible implementations, in addition to packaging external chips on the wafer body, at least one external circuit board can be provided outside the wafer processing device, and the wafer processing device is connected to the external circuit board to jointly perform the task to be processed.

[0138] In some possible implementations, the wafer server also includes at least one external circuit board, and the external circuit board is connected to the wafer processing device via a wired connection and / or a wireless connection; wherein the wired connection includes connections based on power lines, network cables, and optical fibers, and the wireless connection includes connections based on electromagnetic wave signals.

[0139] For example, an external circuit board may provide at least one of the following: power, communication, storage, and clock functions for the wafer processing device.

[0140] Figure 14 This is a schematic diagram of a wafer server provided according to an embodiment of this disclosure. (Refer to...) Figure 14 The wafer processing device 141 is fixed on the wafer platform 142, and multiple external circuit boards 143 are fixed on the wafer platform 142 outside the wafer processing device 141. The external circuit boards 143 are connected to the wafer processing device 141 by wired connection and / or wireless connection.

[0141] It should be noted that, in order to ensure the connection between the external circuit board and the wafer processing device, the external circuit board is also fixed to the wafer platform in a certain way, similar to the wafer processing device, to prevent it from shifting and thus disconnecting from the wafer processing device or being damaged.

[0142] In some possible implementations, the external circuit board includes at least one power supply unit, the wafer processing device includes at least one power receiving unit, and the power supply unit is connected to the power receiving unit via a wired connection and / or a wireless connection.

[0143] For example, the power supply unit includes a wired power supply unit, the power receiving unit includes a wired power conversion unit, and the wired power supply unit transmits power to the corresponding wired power conversion unit through a power line.

[0144] For example, the power supply unit includes a wireless charging transmitter unit, the power receiving unit includes a wireless charging receiver unit, and the wireless charging transmitter unit transmits power to the corresponding wireless charging receiver unit through charging electromagnetic wave signals (i.e., wireless charging is achieved by electromagnetic radiation).

[0145] In some possible implementations, considering the large number of chips in the wafer processing device, if only one power supply unit is set on the external circuit board, chips located far from this unit will experience significant voltage drops (voltage division) when receiving power due to the long power supply lines, resulting in low power supply efficiency and poor power supply performance. Therefore, a zoned power supply approach can be used to solve this problem. This involves setting up multiple power supply zones within the wafer processing device, with corresponding power supply units for each zone. Each power supply unit then provides power to the chips within its designated zone, reducing the single-trip length of the power supply lines, thereby reducing voltage drops and improving power supply efficiency and performance.

[0146] In some possible implementations, the external circuit board includes multiple power supply units, and the wafer processing device is provided with multiple power supply areas. Each power supply area includes at least one chip, and each power supply area corresponds to at least one power conversion unit, with a corresponding relationship between the power conversion unit and the power supply unit. The power supply unit establishes a connection with the corresponding power conversion unit so that the power conversion unit can provide power to the chip located in the corresponding power supply area. The power supply unit and the power conversion unit can be connected via wired power supply, wireless power supply, or a combination of both; this disclosure does not impose any limitations on this.

[0147] In some possible implementations, the power supply area can be divided based on indicators such as chip area and chip power consumption. In other words, the power supply area can have the same area or different areas.

[0148] For example, the wafer processing device is divided into several regions, each with a basically the same area, and each region serves as a power supply region, with a corresponding power supply unit and power conversion unit provided therein.

[0149] For example, multiple power supply areas are divided according to the power consumption of the chips in the wafer processing device. The power consumption of each power supply area is basically the same, and corresponding power supply units and power conversion units are set up.

[0150] It should be noted that when dividing the power supply area into equal sections, the power consumption of each area may vary significantly. Therefore, the number of power supply units and power conversion units can be matched to the power consumption of each area. For example, if the power consumption of the first power supply area is five times that of the second power supply area, then five power supply units and five power conversion units should be set up for the first power supply area, and one power supply unit and one power conversion unit should be set up for the second power supply area.

[0151] It should be noted that the above-described method of dividing the power supply area and the corresponding number of power supply units and power conversion units are merely illustrative examples, and the embodiments disclosed herein do not impose any limitations on them.

[0152] In some possible implementations, the external circuit board is also used to provide communication functionality.

[0153] In some possible implementations, the external circuit board includes at least one first wired communication unit, the wafer processing device includes at least one second wired communication unit, and the first wired communication unit is connected to the corresponding second wired communication unit via a network cable or optical fiber.

[0154] In some possible implementations, the external circuit board includes at least one first wireless communication unit, the wafer processing device includes at least one second wireless communication unit, and the first wireless communication unit establishes a connection with the corresponding second wireless communication unit through a communication electromagnetic wave signal.

[0155] Among some possible implementations, wireless communication methods include wireless communication based on communication electromagnetic waves. These communication electromagnetic waves include at least one of laser signals, Bluetooth signals, and Wi-Fi signals.

[0156] For example, the first wireless communication unit includes an optical communication transmitting unit, and the second wireless communication unit includes an optical communication receiving unit. The optical communication transmitting unit establishes a connection with the corresponding optical communication receiving unit through a laser signal.

[0157] For example, the first wireless communication unit includes a short-range communication transmitting unit, and the second wireless communication unit includes a short-range communication receiving unit. The short-range communication transmitting unit establishes a connection with the corresponding short-range communication receiving unit via Bluetooth signal or WIFI signal.

[0158] It should be noted that in a wafer processing device, the functional units and the external circuit board may only have wireless communication or only have wired communication, or they may have both wireless communication and wired communication. This disclosure does not limit this.

[0159] It should also be noted that the functional unit connected to the external circuit board can be a functional unit on the wafer body or an external chip packaged on the wafer body. This disclosure does not limit this.

[0160] The following is combined with Figure 15-18 The wafer server will be explained in detail.

[0161] Figure 15 This is a schematic diagram of a wafer server provided according to an embodiment of this disclosure. (Refer to...) Figure 15 The external circuit board includes a first network cable communication unit 1511, a first optical fiber communication unit 1521 and a power supply unit 1531. Correspondingly, the wafer processing device is provided with a second network cable communication unit 1512, a second optical fiber communication unit 1522 and a power receiving unit 1532.

[0162] The first network cable communication unit 1511 and the second network cable communication unit 1512 establish a communication connection through a network cable 1513, enabling data exchange between them via wired network signals. The first optical fiber communication unit 1521 and the second optical fiber communication unit 1522 establish a communication connection through an optical fiber 1523, enabling data exchange between them via optical fiber signals. The power supply unit 1531 and the power receiving unit 1532 establish a connection through a power line 1533, enabling the power supply unit 1531 to supply power to the power receiving unit 1532 via the power line 1533, so that the power receiving unit 1532 can supply power to the corresponding chip.

[0163] Figure 16 This is a schematic diagram of a wafer server provided according to an embodiment of this disclosure. (Refer to...) Figure 16 The external circuit board includes a short-range communication transmitting unit 1611, an optical communication transmitting unit 1621, and a wireless charging transmitting unit 1631. Correspondingly, the wafer processing device is provided with a short-range communication receiving unit 1612, an optical communication receiving unit 1622, and a wireless charging receiving unit 1632.

[0164] Specifically, the short-range communication transmitting unit 1611 and the short-range communication receiving unit 1612 establish a communication connection via Bluetooth signal 1613, enabling data exchange between them via Bluetooth signal; the optical communication transmitting unit 1621 and the optical communication receiving unit 1622 establish a communication connection via laser signal 1623, enabling data exchange between them via laser signal; and the wireless charging transmitting unit 1631 and the wireless charging receiving unit 1632 establish a connection via charging electromagnetic wave signal 1633, enabling the wireless charging transmitting unit 1631 to provide electrical energy to the wireless charging receiving unit 1632 via the charging electromagnetic wave signal 1633, so that the wireless charging receiving unit 1632 can provide electrical energy to the corresponding chip.

[0165] Figure 17 This is a schematic diagram of a wafer server provided according to an embodiment of this disclosure. (Refer to...) Figure 17 The wafer processing device 171 is fixed on the wafer platform 172, and multiple external chips 173 are three-dimensionally (3D) packaged on the wafer processing device 171. Multiple external circuit boards 174 are fixed on the wafer platform 172 outside the wafer processing device 171.

[0166] The functional units in the external circuit board 174 can establish wireless and / or wired connections with the functional units corresponding to the wafer body and / or the external chip 173.

[0167] Figure 18 This is a schematic diagram of a wafer server provided according to an embodiment of this disclosure. (Refer to...) Figure 18 The external circuit board includes a short-range communication transmitting unit 1811, a first optical fiber communication unit 1821, a wireless charging transmitting unit 1831, and a third network cable communication unit 1841; the wafer body is provided with a second optical fiber communication unit 1822 and a wireless charging receiving unit 1832; the external chips packaged on the wafer body include an external short-range communication chip 1812 and an external network cable communication chip 1842.

[0168] Specifically, the short-range communication transmitting unit 1811 and the external short-range communication chip 1812 establish a communication connection via WIFI signal 1813, enabling data exchange between them via WIFI signal 1813; the first optical fiber communication unit 1821 and the second optical fiber communication unit 1822 establish a communication connection via optical fiber 1823, enabling data exchange between them via optical fiber signal; the wireless charging transmitting unit 1831 and the wireless charging receiving unit 1832 establish a connection via charging electromagnetic wave signal 1833, enabling the wireless charging transmitting unit 1831 to provide power to the wireless charging receiving unit 1832 via charging electromagnetic wave signal 1833; and the third network cable communication unit 1841 and the external network cable communication chip 1842 establish a communication connection via network cable 1843, enabling data exchange between them via wired network signal.

[0169] Figure 19 This is a schematic diagram of a wafer server provided according to an embodiment of this disclosure. (Refer to...) Figure 19 The wafer processing device 191 is divided into multiple sector-shaped power supply regions 1911. Each power supply region 1911 includes at least one chip and a power conversion unit 1912. Furthermore, on the wafer platform 192 outside the wafer processing device 191, a corresponding power supply unit 1913 is provided for each power supply region 1911.

[0170] In some possible implementations, the power supply unit 1913 corresponds to the power supply area 1911 and the power conversion unit 1912. The power supply unit 1913 is connected to the corresponding power conversion unit 1912 via wireless charging or wired charging, providing power to the corresponding power conversion unit 1912, which in turn provides power to the chip located in the corresponding power supply area. Other power supply areas are similar to power supply area 1911 and will not be described further here.

[0171] The fourth aspect of this disclosure provides a task processing method.

[0172] Figure 20 A flowchart illustrating a task processing method provided in this disclosure, applied to a wafer server. (Refer to...) Figure 20 The task processing method includes:

[0173] In step S201, in response to the received task processing request, the task to be processed is executed; wherein, the wafer server is the wafer server as described in any one of the embodiments of this disclosure.

[0174] In some possible implementations, a task processing request is used to instruct a wafer server to perform a task to be processed based on the wafer processing device and / or an external circuit board. The task to be processed includes any one of image processing, speech processing, text processing, or video processing tasks.

[0175] It should be noted that the above examples of tasks to be processed are merely illustrative, and the embodiments disclosed herein do not limit the tasks to be processed.

[0176] It is understood that the various method embodiments mentioned above in this disclosure can be combined with each other to form combined embodiments without violating the principle and logic. Due to space limitations, this disclosure will not elaborate further. Those skilled in the art will understand that in the above methods of specific implementation, the specific execution order of each step should be determined by its function and possible internal logic.

[0177] In addition, this disclosure also provides electronic devices and computer-readable storage media, all of which can be used to implement any of the task processing methods provided in this disclosure. The corresponding technical solutions and descriptions are described in the corresponding descriptions in the method section, and will not be repeated here.

[0178] Figure 21 This is a block diagram of an electronic device provided in an embodiment of the present disclosure.

[0179] Reference Figure 21 This disclosure provides an electronic device, which includes: at least one processor 2101; at least one memory 2102; and one or more I / O interfaces 2103 connected between the processor 2101 and the memory 2102; wherein the memory 2102 stores one or more computer programs that can be executed by the at least one processor 2101, and the one or more computer programs are executed by the at least one processor 2101 to enable the at least one processor 2101 to perform the above-described task processing method.

[0180] In other words, the electronic device is a hardware system corresponding to a wafer server. It is a system prepared on a complete, uncut wafer according to the wafer server preparation method of any one of the embodiments of this disclosure, and it can be used to perform any one of the tasks to be processed.

[0181] In some possible implementations, the wafer processing device in the wafer server includes at least one computing chip and at least one memory chip, with an inter-chip interconnect structure between the computing chip and the memory chip. In the electronic device fabricated based on this wafer server, the processor 2101 corresponds to the computing chip in the wafer processing device, providing computing power; the memory 2102 corresponds to the memory chip, providing storage functionality; and the I / O interface 2103 corresponds to the inter-chip interconnect structure between the computing chip and the memory chip, enabling data transfer between them. Through the organic combination of the aforementioned computing power, storage function, and data transmission function, the electronic device can execute corresponding tasks to be processed.

[0182] Figure 22 This is a block diagram of an electronic device provided in an embodiment of the present disclosure.

[0183] Reference Figure 22 This disclosure provides an electronic device that includes multiple processing cores 2201 and an on-chip network 2202. The multiple processing cores 2201 are all connected to the on-chip network 2202, and the on-chip network 2202 is used to exchange data between the multiple processing cores and external data.

[0184] One or more processing cores 2201 store one or more instructions, and the one or more instructions are executed by one or more processing cores 2201 to enable one or more processing cores 2201 to perform the above-described task processing method.

[0185] In some embodiments, the electronic device may be a neuromorphic chip. Since neuromorphic chips can employ vectorized computation and require external memory, such as Double Data Rate (DDR) synchronous dynamic random access memory, to load parameters such as weights of the neural network model, the batch processing method used in this embodiment offers higher computational efficiency.

[0186] In some possible implementations, the wafer processing device in the wafer server includes at least one computing chip, which includes multiple processing cores, belonging to a multi-core processing chip, and at least some of the processing cores are interconnected via an on-chip network. In an electronic device fabricated based on this wafer server, the multiple processing cores 2201 correspond to the multiple processing cores of the computing chip and are used to provide computing power, and the on-chip network 2202 corresponds to the on-chip network between the multiple processing cores in the computing chip and is used for data interaction between the processing cores.

[0187] In some possible implementations, the wafer processing device includes multiple computing chips arranged in an array, and these chips are interconnected via an inter-chip interconnect structure. Since each computing chip has relatively independent processing capabilities, each chip can be considered a processing core. The array of computing chips corresponds to multiple processing cores 2201, providing computing power. The inter-chip interconnect structure between the multiple computing chips corresponds to an on-chip network 2202, used for data exchange between the processing cores.

[0188] In some possible implementations, the wafer processing device includes multiple computing chips arranged in an array. These chips are interconnected via an inter-chip interconnect structure, and each chip includes multiple processing cores interconnected on-chip. In other words, this wafer server is a "nested" many-core processing system, consisting of multiple smaller many-core systems forming a larger system. Each computing chip's multiple processing cores constitute a smaller many-core system, and these smaller systems are arranged in an array to form a larger many-core system, further enhancing processing power.

[0189] Those skilled in the art will understand that all or some of the steps, systems, and apparatuses disclosed above, and their functional modules / units, can be implemented as software, firmware, hardware, or suitable combinations thereof. In hardware implementations, the division between functional modules / units mentioned above does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may be performed collaboratively by several physical components. Some or all physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit (ASIC). Such software can be distributed on a computer-readable storage medium, which may include computer storage media (or non-transitory media) and communication media (or transient media).

[0190] Example embodiments have been disclosed herein, and while specific terminology has been used, it is for illustrative purposes only and should be construed as such, and is not intended to be limiting. In some instances, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in connection with particular embodiments may be used alone, or in combination with features, characteristics, and / or elements described in connection with other embodiments, unless otherwise expressly indicated. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of this disclosure as set forth by the appended claims.

Claims

1. A support system, characterized in that, include: Wafer platform and enclosure; The wafer platform is fixed in the frame and is used to support the wafer processing device. The wafer processing device is fixed on the wafer platform and is a processing device based on undivided wafers. The wafer platform is provided with a groove whose size matches the wafer processing device, and the wafer processing device is fixed in the groove. The frame includes a support module and a fixing module. The support module is a cavity structure with an opening at the top. The fixing module includes a fixing plate and a protruding part connected to one side of the fixing plate. The wafer platform is fixed to the cavity of the support module, the fixing plate of the fixing module is fixed to the opening of the support module, and the protruding part enters the cavity through the opening to fix the wafer processing device on the wafer platform. One end of the protruding component is connected to the fixing plate, and the other end contacts the wafer processing device, and the wafer processing device is fixed on the wafer platform by extrusion. And / or, One end of the protruding component is connected to the fixing plate, at least a portion of the other end is in contact with the wafer processing device, and the remaining portion is in contact with the wafer platform. The wafer processing device is fixed to the wafer platform by compression. The contact surface between the protruding component and the fixed plate and / or the contact surface between the protruding component and the wafer processing device are provided with vibration damping and anti-vibration structures.

2. The support system according to claim 1, characterized in that, The support module and the fixing plate together form a closed cavity for protecting the wafer processing device.

3. The support system according to claim 1, characterized in that, The wafer processing device is fixed to the wafer platform using an adhesive. And / or, The wafer processing device is fixed on the wafer platform using a fixing spring.

4. The support system according to claim 1, characterized in that, The wafer processing apparatus is connected to at least one external circuit board, and the external circuit board is fixed within the support system; The external circuit board provides the wafer processing device with at least one of the following: power, communication, storage, and clock functions.

5. The support system according to claim 4, characterized in that, The external circuit board is fixed to the wafer platform by fixing nails and / or adhesive.

6. The support system according to claim 1, characterized in that, The support system also includes a cooling module; The cooling module is used to cool the wafer processing device, and the cooling module adopts at least one of liquid cooling and air cooling.

7. The support system according to claim 6, characterized in that, The cooling module includes at least one cooling pipe, one end of which is connected to an inlet and the other end to an outlet, so that coolant enters the cooling pipe through the inlet and flows out through the outlet. And / or, The cooling module is used to immerse the wafer processing device in the coolant.

8. The support system according to claim 7, characterized in that, The cooling pipes are located within the wafer platform.

9. A method for fabricating a wafer server, characterized in that, include: A wafer processing device is fabricated based on a wafer; The wafer processing apparatus is fixed on the wafer platform; The wafer platform is provided with a groove whose size matches that of the wafer processing device, and the wafer processing device is fixed in the groove; The wafer platform is fixed in the frame; the frame includes a support module and a fixing module, the support module is a cavity structure with an opening at the top, and the fixing module includes a fixing plate and an extension component connected to one side of the fixing plate; The wafer platform is fixed to the cavity of the support module, the fixing plate of the fixing module is fixed to the opening of the support module, and the protruding part enters the cavity through the opening to fix the wafer processing device on the wafer platform; one end of the protruding part is connected to the fixing plate, and the other end contacts the wafer processing device, and the wafer processing device is fixed on the wafer platform by compression. And / or, One end of the protruding component is connected to the fixing plate, at least a portion of the other end is in contact with the wafer processing device, and the remaining portion is in contact with the wafer platform. The wafer processing device is fixed to the wafer platform by compression. The contact surface between the protruding component and the fixed plate and / or the contact surface between the protruding component and the wafer processing device are provided with vibration damping and anti-vibration structures; Obtain a wafer server.

10. A wafer server, characterized in that, include: A wafer processing apparatus and a support system, wherein the wafer processing apparatus is placed in the support system and is fixed by the support system; The support system described herein is the support system described in any one of claims 1-8.

11. The wafer server according to claim 10, characterized in that, The wafer server also includes at least one external circuit board, and the external circuit board is connected to the wafer processing device via a wired connection and / or a wireless connection. The wired connection method includes connections established based on power lines, network cables, and optical fibers, while the wireless connection method includes connections established based on electromagnetic wave signals.

12. The wafer server according to claim 11, characterized in that, The external circuit board includes at least one power supply unit, the wafer processing device includes at least one power receiving unit, and the power supply unit is connected to the power receiving unit via a wired connection and / or a wireless connection.

13. The wafer server according to claim 12, characterized in that, The power receiving unit includes a power conversion unit; The external circuit board includes multiple power supply units, and the wafer processing device is provided with multiple power supply areas. Each power supply area includes at least one chip, and each power supply area corresponds to at least one power conversion unit. The power conversion unit and the power supply unit have a corresponding relationship. The power supply unit is connected to the corresponding power conversion unit so that the power conversion unit can provide power to the chip located in the corresponding power supply area.

14. The wafer server according to claim 12 or 13, characterized in that, The power supply unit includes a wired power supply unit, the power receiving unit includes a wired power conversion unit, and the wired power supply unit transmits power to the corresponding wired power conversion unit through a power line. And / or, The power supply unit includes a wireless charging transmitter unit, and the power receiving unit includes a wireless charging receiver unit. The wireless charging transmitter unit transmits power to the corresponding wireless charging receiver unit through charging electromagnetic wave signals.

15. The wafer server according to claim 11, characterized in that, The external circuit board includes at least one first wired communication unit, and the wafer processing device includes at least one second wired communication unit, wherein the first wired communication unit is connected to the corresponding second wired communication unit via a network cable or optical fiber. And / or, The external circuit board includes at least one first wireless communication unit, and the wafer processing device includes at least one second wireless communication unit. The first wireless communication unit establishes a connection with the corresponding second wireless communication unit through a communication electromagnetic wave signal.

16. The wafer server according to claim 15, characterized in that, The communication electromagnetic wave signal includes at least one of laser signal, Bluetooth signal, and WIFI signal; The first wireless communication unit includes an optical communication transmitting unit, and the second wireless communication unit includes an optical communication receiving unit. The optical communication transmitting unit establishes a connection with the corresponding optical communication receiving unit through a laser signal. And / or, The first wireless communication unit includes a short-range communication transmitting unit, and the second wireless communication unit includes a short-range communication receiving unit. The short-range communication transmitting unit establishes a connection with the corresponding short-range communication receiving unit via Bluetooth or WIFI signals.

17. The wafer server according to claim 10, characterized in that, The wafer processing apparatus includes a wafer body and at least one external chip packaged in the wafer body, the external chip including a computing chip and / or a memory chip.

18. A task processing method, characterized in that, Applied to wafer servers, the method includes: In response to a received task processing request, execute the task to be processed; The wafer server mentioned herein is the wafer server as described in any one of claims 10-17.

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