A Cloud Storage and Identification Traceability Method and System Integrating the Electronic Views of Wafers and Chips

Abstract

The present invention discloses a cloud storage and identification traceability method integrating wafer and chip electronic views. The method comprises the following steps: S1, generating a chip electronic view; S2, generating an identification code; S3, downloading the electronic view across all stations and updating defects; S4, screening qualified products and defective products. S1, generating a chip electronic view: According to the wafer model and packaging type, the server automatically generates corresponding wafer electronic views and frame electronic views; S2, generating an identification code. The present invention upgrades the original paper frame simulation diagram to an electronic view in the cloud, connects all existing station devices to achieve networking and linkage, and uses the method of downloading the electronic view from the cloud by the device to mark wafer, frame and defect information, realizing the sharing of wafer, frame and defect information by all process chain devices, so as to achieve the requirements of anti-fooling, anti-error, accurate defect positioning and long-term traceability.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and specifically provides a cloud storage and identification traceability method and system integrating wafer and chip electronic views. Background Art

[0002] In the existing semiconductor production technology, various defects are found and generated from wafer incoming materials to packaging and testing. The positions of chip defects on the wafer or the frame need to be recorded by printing a frame shape simulation diagram on paper. During the production process, for each defect generated in each process, the corresponding defect needs to be manually filled into the printed paper frame simulation diagram according to the defect code. There are thousands of chips on the wafer and the frame every day. The paper-based electronic view cannot meet the accurate recording and transmission of all defect coordinates, nor can it be traced after a long time.

[0003] Deficiencies of the prior art:

[0004] Manually recording on the paper simulation diagram can only record the defect quantity of batches, cannot locate the accurate coordinates of the frame and the wafer, and even less can achieve the long-term traceability of automotive-grade products. Summary of the Invention

[0005] The purpose of the present invention is to provide a cloud storage and identification traceability method and system integrating wafer and chip electronic views to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A cloud storage and identification traceability method integrating wafer and chip electronic views, the method comprising the following steps: S1, generating a chip electronic view; S2, generating an identification code; S3, downloading the electronic view and updating defects for all stations; S4, screening qualified and defective products, wherein:

[0007] S1, generating a chip electronic view: According to the wafer model and packaging type, the server automatically generates the corresponding wafer electronic view and frame electronic view;

[0008] S2, generating an identification code: including the following steps:

[0009] a1, obtaining the wafer position information of each small unit after wafer segmentation on the wafer based on the wafer electronic view generated in step S1;

[0010] a2, obtaining the frame position information of each wafer segmentation small unit on the frame based on the frame electronic view generated in step S1;

[0011] a3, obtaining the product information of the wafer;

[0012] a4. The wafer position information, frame position information, and product information of the wafer obtained based on the above steps are automatically used by the server to generate an identification code and upload it to the cloud;

[0013] S3. Download the electronic views of the entire station and update defects: Each station in the production order downloads the wafer electronic view and the frame electronic view from the cloud, and uploads the included defect information and coordinate information to the cloud, facilitating the next process to further mark defect information based on the information of the previous level;

[0014] S4. Screening of good products and defective products: The laser engraving machine automatically downloads the electronic view at the end of the integrated circuit package, laser engraves good products and defective products respectively, distinguishes good products and defective products at the product end, and eliminates defective products.

[0015] As a further improvement of the present invention, the wafer position information is used to perform coordinate marking on the positions of several small units after the wafer is cut into several small units, ensuring that the wafer small units pasted on the frame with silver paste after cutting are all valid wafers, and initially eliminating defective wafers.

[0016] As a further improvement of the present invention, the product information of the wafer includes the batch information of the wafer and the chip number information of the wafer.

[0017] As a further improvement of the present invention, the identification code in this method includes a wafer identification code and a frame identification code. The wafer identification code is a barcode, and the frame identification code is a QR code. The identification code is photo-etched on the chip obtained after the wafer is encapsulated in the frame.

[0018] As a further improvement of the present invention, the entire station includes a wafer cutting device, a wafer bonding device, a full-automatic wire bonding machine, a full-automatic copper sheet wire bonding connection device, a full-automatic testing machine, a full-automatic plastic encapsulation machine, and a full-automatic optical inspection machine.

[0019] As a further improvement of the present invention, each station device of the entire station uploads the information including defects and coordinates to the cloud after completing the corresponding processing technology. The cloud updates the data, and the next station device skips the processing of defective products on the frame according to the information of the frame electronic view downloaded from the cloud.

[0020] As a further improvement of the present invention, the frame electronic view can request based on the frame number information, and an updated frame electronic view is generated based on the frame position information and the frame electronic view.

[0021] As a further improvement of the present invention, the identification code is used to trace the position information of the frame where the wafer small unit is located and the product information of the wafer, and is used to trace the position information of the small unit captured on the wafer, improving the accuracy of the wafer source information.

[0022] The present invention also includes a cloud storage, identification traceability and system integrating a wafer and a chip electronic view, which includes a memory, a processor and a processing unit. The memory is used for storing program instructions, and the processor is used for running the program instructions and executing them through the processing unit.

[0023] As a further improvement of the present invention, the processing unit includes:

[0024] A wafer position information acquisition module, which is used for obtaining the position information of each cell on its own wafer according to the wafer electronic view;

[0025] A frame position acquisition module, which is used for obtaining the position information of the unit on the frame;

[0026] A product information acquisition module, which is used for obtaining the product information of the wafer, including the batch information of the wafer and the chip number information of the wafer;

[0027] A generation module, which is used for generating an identification code of the wafer based on the position information of the wafer, the position information of the frame and the product information;

[0028] An identification module, which is used for optically etching the identification code generated by the packaging of the wafer on the chip;

[0029] A scanning module, which is used for scanning the identification code to obtain the chip marking traceability result.

[0030] Compared with the prior art, the beneficial effects of the present invention are:

[0031] In the present invention, the original paper frame simulation diagram is upgraded to an electronic view in the cloud, and all existing station devices are connected to achieve networking and linkage. The method of using the device to download the electronic view from the cloud is used to mark the wafer, frame and defect information, realizing the sharing of wafer, frame and defect information by all process chain devices, so as to achieve the requirements of anti-fooling, anti-mistake, accurate defect positioning and long-term traceability. Description of the Drawings

[0032] Figure 1 It is a flowchart of a cloud storage and identification traceability method and system integrating a wafer and a chip electronic view;

[0033] Figure 2 It is a frame electronic view of a cloud storage and identification traceability method and system integrating a wafer and a chip electronic view;

[0034] Figure 3 It is a schematic diagram of chip processing equipment data transmission of a cloud storage and identification traceability method and system integrating a wafer and a chip electronic view. Detailed Embodiments

[0035] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clear and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0036] It should be noted that when an element is referred to as being "fixed", "mounted", "connected" or "disposed" on another element, it can be directly on the other element or indirectly on the other element. It should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation in the specification, and thus cannot be understood as a limitation to the present invention.

[0037] As a further improvement of the present invention, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0038] Embodiment

[0039] Please refer to Figures 1-3 , the present invention provides a technical solution: a cloud storage and identification traceability method integrating wafer and chip electronic views, and this method includes the following steps: S1, generating a chip electronic view; S2, generating an identification code; S3, downloading the electronic view for all stations and updating defects; S4, screening qualified products and defective products, where:

[0040] S1, generating a chip electronic view: The processor runs the program instructions stored in the memory, and uses the product information acquisition module to acquire the product information of the wafer, including the batch information of the wafer and the chip number information of the wafer. The server generates a wafer electronic view through the batch information of the wafer and the chip number information of the wafer;

[0041] S2, generating an identification code: includes the following steps:

[0042] a1, obtaining the wafer position information of each small unit after wafer segmentation on its wafer based on the wafer electronic view generated in step S1, and the wafer position information acquisition module obtains the position information of each small area on its own wafer according to the wafer electronic view;

[0043] a2. Obtain the frame position information of each wafer segmentation unit on its frame based on the generated frame electronic view in step S1. Implement the segmentation of the units through a wafer cutting device and transmit the updated wafer electronic view to the cloud. Then, the wafer bonding device automatically downloads the updated wafer electronic view from the cloud, pastes the units on the frame with silver paste according to the position information of the units on the wafer, directly eliminates the defective units, and the server automatically generates a frame electronic view according to the packaging type;

[0044] a3. Obtain the product information of the wafer;

[0045] a4. Automatically generate an identification code based on the wafer position information, frame position information, and wafer product information obtained in the above steps and upload it to the cloud. Obtain the numbered information described in the frame electronic view of the above frame through the frame position acquisition module, and obtain the position information of the wafer placed on the frame or the frame unit number information. Locate the position of the wafer on the frame according to the frame unit number information, obtain the position information of the unit on the frame and update the frame electronic view and transmit it to the cloud. At the same time, the generation module generates an identification code of the wafer based on the position information of the wafer, the position information of the frame, and the product information and uploads it to the cloud;

[0046] S3. Download the electronic view and update the defects for all stations: Each station downloads the wafer electronic view and the frame electronic view from the cloud in the production order, and uploads the included defect information and coordinate information to the cloud, facilitating the next process to further mark the defect information based on the information of the previous level;

[0047] S4. Screening of good and defective products: The laser engraving machine automatically downloads the electronic view at the end of the integrated circuit package, performs laser engraving on good and defective products respectively, distinguishes good and defective products at the product end, and eliminates the defective products.

[0048] The wafer position information is used to mark the coordinates of the positions of several units after the wafer is cut into several units, ensuring that the wafer units pasted on the frame with silver paste after cutting are all valid wafers, and initially eliminating defective wafers.

[0049] The product information of the wafer includes the batch information of the wafer and the chip number information of the wafer.

[0050] In this method, the identification code includes a wafer identification code and a frame identification code. The wafer identification code is a bar code, and the frame identification code is a QR code. The identification code is photo-etched on the chip obtained after the wafer is encapsulated in the frame. The identification code on the chip surface can be scanned and recognized, and the result of tracking the chip mark, that is, the chip source information, can be obtained. There is no need to query and obtain the chip source information one by one, which can improve the efficiency of obtaining the chip source information.

[0051] The whole station includes a wafer dicing equipment, a wafer pasting equipment, a full-automatic bonding machine, a full-automatic copper sheet bonding and connecting line equipment, a full-automatic testing machine, a full-automatic encapsulation machine and a full-automatic optical inspection machine.

[0052] After each station equipment of the whole station completes the corresponding processing technology, it uploads the information including defects and coordinates to the cloud. The cloud updates the data, and the next station equipment automatically skips the processing of defective products on the frame according to the information of the frame electronic view downloaded from the cloud.

[0053] The frame electronic view can request according to the frame number information, generate and update the frame electronic view based on the frame position information and the frame electronic view, describe the number information according to the frame electronic view on the above frame, and obtain the position information of the wafer placed on the frame or the frame unit number information. Locate the position of the wafer on the frame according to the frame unit number information, improving the accuracy of the position information described in the wafer.

[0054] The identification code is used to trace the position information of the frame where the wafer small unit is located and the product information of the wafer, and is used to trace the position information of the small unit captured on the wafer, improving the accuracy of the wafer source information.

[0055] A cloud storage, identification traceability and system integrating wafer and chip electronic views, including a memory, a processor and a processing unit. The memory is used to store program instructions, and the processor is used to run and execute the program instructions through the processing unit.

[0056] The processing unit includes:

[0057] A wafer position information acquisition module, used to obtain the position information of each cell on its own wafer according to the wafer electronic view;

[0058] A frame position acquisition module, used to obtain the position information of the small unit on the frame, describe the number information according to the frame electronic view on the above frame, and obtain the position information of the wafer placed on the frame or the frame small unit number information. Locate the position of the wafer on the frame according to the frame small unit number information, improving the accuracy of the position information described in the wafer;

[0059] A product information acquisition module, used to obtain the product information of the wafer, including the batch information of the wafer and the chip number information of the wafer;

[0060] A generation module, used to generate an identification code of the wafer based on the position information of the wafer, the position information of the frame and the information of the product;

[0061] An identification module, used to optically etch the identification code generated by the encapsulation of the wafer on the chip;

[0062] A scanning module for scanning identification codes to obtain chip marking traceability results.

[0063] In this device, the processor runs the program instructions stored in the memory, and uses the product information acquisition module to obtain the product information of the wafer, including the batch information of the wafer and the chip number information of the wafer. The server generates a wafer electronic view through the batch information of the wafer and the chip number information of the wafer. Then, the wafer position information acquisition module obtains the position information of each cell on its own wafer according to the wafer electronic view, realizes the segmentation of small units through a wafer cutting device, and transmits the updated wafer electronic view to the cloud. Then, through the wafer bonding device, the updated wafer electronic view is automatically downloaded from the cloud, and the small units are pasted on the frame with silver paste according to the position information of the small units on the wafer. The defective small units are directly removed, and the server automatically generates a frame electronic view according to the packaging type. The frame position acquisition module obtains the serial number information described in the frame electronic view of the above frame, and obtains the position information of the wafer placed on the frame or the frame small unit serial number information. The position of the wafer on the frame is located according to the frame small unit serial number information, the position information of the small unit on the frame is obtained, and the frame electronic view is updated and transmitted to the cloud. At the same time, the generation module generates an identification code of the wafer based on the position information of the wafer, the position information of the frame, and the information of the product, and uploads it to the cloud. Then, it is processed by a fully automatic bonding machine. The fully automatic bonding machine first downloads the updated frame electronic view from the cloud in the previous step, skips the defective small units on the frame during the processing, updates and uploads the frame electronic view after the processing is completed. The fully automatic optical inspection machine and the fully automatic plastic sealing machine adopt the same working method. Then, through the identification module, a laser engraver etches the identification code, and words are engraved on the defective products and good products for easy management. The scanning module scans the identification code to obtain the chip marking traceability result. The present invention upgrades the original paper frame simulation diagram to an electronic view in the cloud, connects all the existing stations and devices to achieve networking and linkage, and uses the method of the device downloading the electronic view from the cloud to mark the wafer, frame, and defect information, realizing the sharing of wafer, frame, and defect information by all the devices in the whole process chain, so as to achieve the requirements of anti-fooling, anti-mistake, accurate positioning of defects, and long-term traceability.

[0064] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusively, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0065] Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cloud storage and identification traceability method integrating wafer and chip electronic views, which is applied to a cloud storage and identification traceability system for integrating wafer and chip electronic views. The system includes a frame position acquisition module and a generation module. Characterized in that: The method includes the following steps: S1, generating a chip electronic view; S2, generating an identification code; S3, downloading the chip electronic view for all stations and updating defects; S4, screening qualified products and defective products, where: S1, generating a chip electronic view: According to the wafer model and packaging type, the server automatically generates corresponding wafer electronic views and frame electronic views. S2, generating an identification code: including the following steps: a1, obtaining the wafer position information of each small unit after wafer segmentation on the wafer based on the wafer electronic view generated in step S1; a2, obtaining the frame position information of each small unit after wafer segmentation on the frame based on the frame electronic view generated in step S1; a3, obtaining the product information of the wafer; a4, automatically generating an identification code based on the wafer position information, frame position information, and product information of the wafer obtained from the above steps through the server and uploading it to the cloud. S3, downloading the chip electronic view for all stations and updating defects: Each station downloads the wafer electronic view and frame electronic view from the cloud according to the production order, and uploads the included defect information and coordinate information to the cloud, facilitating the next process to further mark defect information on the information of the previous level. S4, screening qualified products and defective products: The laser engraver automatically downloads the chip electronic view at the end of the integrated circuit package, performs laser engraving on qualified products and defective products respectively, distinguishes qualified products and defective products at the product end, and eliminates defective products. The wafer position information is used to mark the positions of small units after wafer segmentation with coordinates, ensuring that all small units after wafer segmentation pasted on the frame with silver paste are valid wafers, and initially eliminating defective wafers. The step a4 of automatically generating an identification code based on the wafer position information, frame position information, and product information of the wafer obtained from the above steps through the server and uploading it to the cloud specifically includes obtaining the numbered information described in the frame electronic view of the above frame through the frame position acquisition module, and obtaining the wafer position information of the wafer placed on the frame or the numbered information of small units after wafer segmentation on the frame. Locating the position of the wafer on the frame according to the numbered information of small units after wafer segmentation, obtaining the frame position information of small units after wafer segmentation on the frame and updating the frame electronic view and transmitting it to the cloud. At the same time, the generation module generates an identification code of the wafer based on the wafer position information, frame position information, and product information of the wafer and uploads it to the cloud.

2. The cloud storage and identification traceability method for integrating wafer and chip electronic views according to claim 1. Characterized in that: The product information of the wafer includes the batch information of the wafer and the chip number information of the wafer.

3. The cloud storage and identification traceability method for integrating wafer and chip electronic views according to claim 1. Characterized in that: The identification code includes a wafer identification code and a frame identification code. The wafer identification code is a bar code, and the frame identification code is a QR code. The identification code is photo-etched on the chip obtained after the wafer is encapsulated in the frame.

4. The cloud storage and identification traceability method for integrating the electronic view of a wafer and a chip according to claim 1, characterized in that: The whole station includes a wafer dicing device, a wafer bonding device, a full-automatic bonding machine, a full-automatic copper sheet bonding and wiring device, a full-automatic testing machine, a full-automatic plastic encapsulation machine, and a full-automatic optical inspection machine.

5. The cloud storage and identification traceability method for integrating the electronic view of a wafer and a chip according to claim 1, characterized in that: After each station device of the whole station completes the corresponding processing technology, it uploads the information including defects and coordinates to the cloud. The cloud updates the data, and the next station device skips the processing of defective products on the frame automatically according to the information of the frame electronic view downloaded from the cloud.

6. The cloud storage and identification traceability method for integrating the electronic view of a wafer and a chip according to claim 1, characterized in that: The frame electronic view can generate an updated frame electronic view based on the frame number information request, the frame position information, and the frame electronic view.

7. The cloud storage and identification traceability method for integrating the electronic view of a wafer and a chip according to claim 1, characterized in that: The identification code is used to trace the frame position information of the frame where the small unit is located after wafer dicing and the product information of the wafer, and is used to trace the wafer position information of the small unit captured on the wafer after wafer dicing, improving the accuracy of the wafer source information.

8. The cloud storage and identification traceability system for integrating the electronic view of a wafer and a chip applying the method according to any one of claims 1-7 includes a memory, a processor, and a processing unit, characterized in that: The memory is used to store program instructions, and the processor is used to run the program instructions to execute through the processing unit.

9. The cloud storage and identification traceability system for integrating the electronic view of a wafer and a chip according to claim 8, characterized in that: The processing unit includes: A wafer position information acquisition module, which is used to obtain the wafer position information of the small unit on its own wafer after wafer dicing according to the wafer electronic view; A frame position acquisition module, which is used to obtain the frame position information of the small unit on the frame after wafer dicing; A product information acquisition module, which is used to obtain the product information of the wafer, including the batch information of the wafer and the chip number information of the wafer; A generation module, which is used to generate the identification code of the wafer based on the wafer position information, the frame position information, and the product information of the wafer; An identification module, which is used to photo-etch the identification code generated by the encapsulation of the wafer on the chip; A scanning module, which is used to scan the identification code to obtain the chip marking traceability result.

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