Multiple ime structure and method of manufacturing the same

Abstract

The present invention provides an IME structure, which includes a film, a first plastic resin located at the lower part of the film, and a second plastic resin located at the lower part of the first plastic resin, an electronic circuit is formed on the upper part of the second plastic resin by a plating process, and an electronic component is installed, the electronic component including an LED light source, a plurality of convex light guides that direct the distribution and direction of illumination are formed on the upper part of the second plastic resin, and the LED light source is installed in the space provided by the light guides.

Description

Technical Field

[0001] This invention relates to a multi-IME (In-mold electronics) structure using an electronic circuit plating process and its manufacturing method. Background Technology

[0002] IME technology is a recently emerging technology that integrates printed conductive inks and in-mold decoration techniques to realize 3D shapes and functions. In the automotive industry, Ford first commercialized it on the top control panel in 2012, and it has since developed rapidly, expanding to home appliances, medical devices, consumer electronics, portable electronic devices, defense, and aerospace.

[0003] Typically, IME technology includes: first, printing trim, touch controls, or antennas onto a plastic film; second, mounting (surface mount) various electronic components onto the film; third, thermoforming the film into a 3D shape; and finally, an integrated process that fuses the 3D film and plastic resin together through insert molding. Finished products manufactured in this way are used in the automotive industry, such as on dashboards or door panels, and are considered aesthetically pleasing exterior films. These films are touched using gestures similar to those on a smartphone, such as touch or push / pull actions, to open doors or raise / lower windows. IME products offer many advantages, providing most of the electrical and electronic functions required by automobiles without the need for mechanical buttons, handles, linkages, shafts, or motors, saving space, and providing well-designed exterior finishes.

[0004] The existing IME-related technology utilizes a process involving two thin films for fabrication as follows.

[0005] First, after the design is printed on the upper film A, it is formed into the specified shape and then cut. The design can be decoration, logo, symbol, button design to display the operation or function of the item, etc., without restrictions.

[0006] In addition, electronic circuits are printed on the lower film B with conductive ink, and then electronic components are installed. The electronic components are joined by a reflow soldering process, and the lower film B is shaped and cut in the same shape as the upper film A.

[0007] Then, the upper film A, plastic resin, and lower film B are injection molded to complete the final product.

[0008] However, the conductive circuit structure is subject to many limitations due to the shape of the lower thin film B using the above method, resulting in a very complex manufacturing process.

[0009] Looking at prior patents related to IME, Korean Patent Publication No. 10-2016-0094936 discloses the following: generating a thin film, forming a conductor and pattern on the thin film, attaching electronic components to the thin film, and then injection molding it into a three-dimensional shape. Korean Patent Publication No. 10-2017-0130395 discloses the following: screen printing a conductor on a substrate, mounting electronic components, and then injection molding it into a three-dimensional shape. US Patent Publication No. 2018-0213651 discloses the following process: forming a conductive circuit on a thin film, mounting electronic components, thermoforming the thin film, and manufacturing a three-dimensional structure. The limitation of these patents is that they disclose general content, namely, mounting electronic circuit patterns and electronic components on a single thin film and molding the thin film.

[0010] Taking into account the aforementioned prior technologies and patents, the inventors proposed an IME structure in patent application No. 10-2020-0174369, filed on December 14, 2020. This structure includes a designed thin film, a first plastic resin located beneath the thin film, and a second plastic resin located beneath the first plastic resin. An electronic circuit is formed on the top or both sides of the second plastic resin using a plating process, and electronic components are mounted thereon, integrating the thin film, the first plastic resin, and the second plastic resin containing the electronic circuit and electronic components. The structure may also include a terminal portion electrically connected to a part of the electronic circuit, extending downwards through a through-hole in the second plastic resin.

[0011] The present invention further improves the above structure from multiple perspectives. Summary of the Invention

[0012] Therefore, the object of the present invention is to provide a robust and durable IME structure applicable to automotive or home appliance products, and an IME structure based on which the light emitted from LED elements can be effectively adjusted.

[0013] To achieve the above objectives, the present invention provides an IME structure, comprising: a thin film, a first plastic resin located below the thin film, and a second plastic resin located below the first plastic resin. Electronic circuits are formed on the top and bottom of the second plastic resin by a plating process, and electronic components are mounted thereon. The electronic components include LEDs, IC chips, resistor chips, capacitors, touch-activated / closed switching devices, and vibration-type micro motors for touch dragging, ambient light, or tactile functions.

[0014] Furthermore, the present invention provides an IME structure, comprising: a thin film, a first plastic resin located below the thin film, and a second plastic resin located below the first plastic resin. Electronic circuits are formed on the top and bottom of the second plastic resin by a plating process, and electronic components are mounted thereon. The electronic components include an LED light source. A plurality of raised light guides are formed on the top of the second plastic resin to guide the distribution and direction of illumination, and the LED light source is mounted in the space provided by the light guides.

[0015] An assembly component protruding outward is formed in the second plastic resin, and a receiving portion is formed on the opposite side of the first plastic resin in a matching form, thereby allowing the first and second plastic resins to be assembled.

[0016] An adhesive layer is formed on the surface of the second plastic resin, which allows the first and second plastic resins to bond together.

[0017] An encapsulation component or lens is formed on top of the second plastic resin in the form of surrounding the LED element, thereby having a capsule structure.

[0018] A patterned portion can be formed on the underside of the first plastic resin, opposite to the LED element. The patterned portion is curved and has tiny bumps and depressions.

[0019] Patterned areas can be formed on the inner side of the light guide surrounding the LED element.

[0020] In order to form a design in the first plastic resin, an injection molding process is used to complete the base of the first plastic resin. The surface of the base is coated. In order to form a design with a specified shape, a metal layer is formed by a plating process. The metal layer is etched according to the design shape, and a coating operation can be performed. In this case, an assembly component that protrudes outward can also be formed in the second plastic resin. A receiving part is formed on the opposite side of the first plastic resin in a matching form, thereby assembling the first plastic resin and the second plastic resin, or an adhesive layer is formed on the second plastic resin so that the first plastic resin and the second plastic resin are bonded together.

[0021] An assembly component is formed in a first plastic resin, and a receiving portion is formed on the opposite side of a second plastic resin in a matching form, thereby enabling the assembly of the first and second plastic resins.

[0022] This invention provides a process that is simpler than prior art, and achieves the effect of providing an improved IME structure and its manufacturing method. Electronic circuits are embodied on the surface of plastic resin using a plating process, minimizing the limitations caused by product shape. It is robust, has good adhesion and high durability. When the electronic components are LED light sources, a structure that can guide and adjust the lighting can be set up to achieve a variety of light patterns. Attached Figure Description

[0023] Figure 1 Figure a is a cross-sectional view before assembly of the components showing the IME structure of the present invention.

[0024] Figure 1 Figure b is Figure 1 a cross-sectional view after assembly of a.

[0025] Figure 2 Figure a is a cross-sectional view before assembly of the components showing the IME structure of another embodiment according to the present invention.

[0026] Figure 2 Figure b is Figure 2 a cross-sectional view after assembly of a.

[0027] Figure 3 Figure a is a cross-sectional view before assembly of the components showing the IME structure of another embodiment according to the present invention.

[0028] Figure 3 Figure b is Figure 3 a cross-sectional view after assembly of a.

[0029] Figure 4 is a cross-sectional view showing an embodiment of the capsule structure of the present invention.

[0030] Figure 5 is a cross-sectional view showing another embodiment of the capsule structure of the present invention.

[0031] Figure 6 Figure a is a cross-sectional view before assembly of the IME structure with a light pattern structure of the present invention.

[0032] Figure 6 Figure b is Figure 6 a cross-sectional view after assembly of a.

[0033] Figure 7 is a cross-sectional view of another embodiment of the IME structure with a light pattern structure of the present invention.

[0034] Figure 8 Figures a to Figure 8 e are diagrams showing in sequence the manufacturing process of the first plastic resin formed with a design of the present invention and perspective views of the first plastic resin according to each process. Detailed Description of the Invention

[0035] Each embodiment of the present invention is merely an example for helping to understand the present invention, and the present invention is not limited to these embodiments. The present invention can be constituted by at least any combination of one or more of the individual constitutions and individual functions included in each embodiment.

[0036] <IME Structure 1>

[0037] Figure 1 a is a cross-sectional view showing the constituent elements of the IME structure 1 of the present invention before assembly. Figure 1 b is a cross-sectional view after assembly. IME Structure 1 can also be applied to any field such as automobiles, home appliances, and mobile phones, but the following explanation mainly focuses on automobiles.

[0038] The IME structure 1 comprises, from top to bottom: a thin film 2, a first plastic resin 4 located below the thin film 2, and a second plastic resin 6 located below the first plastic resin 4. An electronic circuit 8 and an electronic component 10 are formed on the upper part 6a and / or the lower part of the second plastic resin 6. The IME structure 1 is an integrated structure comprising the designed thin film 2, the first plastic resin 4, and the second plastic resin 6 on which the electronic circuit 8 and electronic component 10 are formed.

[0039] The film 2 is formed with designs such as decorations, logos, symbols, and button icons indicating the operation or function of the item. The film material can be various materials such as PC, PMMA, PET, and TPU, without limitation. Although the example shows a convex curved surface in the center of the film 2 with flat sides, forming an overall disc shape, it is not limited to this. To allow the illumination portion of the film 2 to penetrate, a through-hole 22 is formed in the printing layer or design structure layer. Light from electronic components 10, such as LEDs, can be emitted through the through-hole 22.

[0040] Although the first plastic resin 4 is generally similar in shape to the film 2 and is joined to the bottom of the film 2 on top, its side height is sufficiently high, thus giving the first plastic resin 4 a robust and thick structure that completely surrounds and seals the top 6a and sides of the second plastic resin 6. The type of resin can be any type of plastic resin, such as PC, acrylic, ABS, AES, PMMA, PI, PPA, etc., without limitation.

[0041] The electronic circuit 8 includes circuit patterns, cables, or conductive ink for supplying current or power to the electronic component 10, and is particularly unrestricted. The electronic circuit 8 can be formed not only on the upper surface 6a of the second plastic resin 6, but also on the lower surface 6b of the second plastic resin 6.

[0042] Electronic component 10 includes a capacitance sensor, a chip, a processor, an electrical switch, etc., and any of these can be selected for mounting (surface mounting) depending on the application of IME structure 1. A touch portion is placed on the thin film 2, and depending on the capacitance method, a switching device for turning the LED element L on / off or a vibration micro motor for tactile function can also be mounted as electronic component 10.

[0043] In order to connect the electronic circuit 8 and the motherboard (not shown in the figure), the terminal portion 100 is mounted on the lower 6b of the second plastic resin 6. The terminal portion 100 is electrically connected to a part of the electronic circuit 8 and is connected to a part of the electronic circuit formed on the upper 6a of the second plastic resin 6 through the through hole 6'.

[0044] In the following description, we will focus on the case where electronic component 10 is the light source, i.e., LED component L.

[0045] In an embodiment of the present invention, an upwardly extending, raised light guide 200 that guides the distribution and direction of illumination is formed on the top of the second plastic resin 6. Furthermore, LED elements L are respectively mounted in the spaces provided between the two light guides 200 on the left and between the two light guides 200 on the right. The light guides 200 guide the light emitted from each LED element L so that it is not scattered to the surroundings, but emitted directly towards the through-hole 22. The shape and number of the light guides 200 do not limit the scope of the present invention and are appropriately selected according to the LED elements L. A plurality of guiding receiving portions 200a for accommodating the light guides 200 are formed on the bottom of the first plastic resin 4.

[0046] Preferably, the manufacturing process of the IME structure 1 of the present invention is a dual-insertion injection molding process of film 2, first plastic resin 4 and second plastic resin 6. The first plastic resin 4 and second plastic resin 6 are injection molded according to the shape of the final product and in a form that appropriately three-dimensionally represents the light guide 200 and the guide receiving portion 200a. Then, film 2 is placed on top, and resin is supplied into the mold, thereby completing the IME structure 1 in an integral form. Figure 1 b).

[0047] The IME structure 1 of the present invention can be accessed via Figure 2 a and Figure 2 Another embodiment of b is used for fabrication. With Figure 1 The difference lies in that a hook receiving portion 4c is formed on the side of the first plastic resin 4, and a hook 6c is formed on the side of the second plastic resin 6 in a matching manner. Thus, by adding an assembly-type joint structure with the hook 6c to the double injection molding structure, the first plastic resin 4 and the second plastic resin 6 can be robustly manufactured as a single unit. A boss can be used instead of a hook, and a spiral fastening connection method can be selectively employed. The assembly component like the hook and the receiving portion that engages or receives it can be appropriately selected using any method such as threading or forced extrusion. Furthermore, as a variation of another embodiment, the assembly component can be formed in the first plastic resin, and a receiving portion can be formed on the opposite side of the second plastic resin in a matching manner, thereby assembling the first and second plastic resins.

[0048] The IME structure 1 of the present invention can be fabricated through Figure 3 another embodiment of a Figure 3 and Figure 1 . The difference lies in that an adhesive layer 6d is formed on the upper surface 6a of the second plastic resin 6. Thus, based on the double injection molding structure, an adhesive bonding structure using the adhesive layer 6d is added, enabling the first plastic resin 4 and the second plastic resin 6 to be firmly fabricated as one body.

[0049] <Encapsulation Structure of the Light Source Portion in the IME Structure 1>

[0050] Next, referring to Figure 4 and Figure 5 , the encapsulation structure of the LED element L of the present invention will be described. These structures can all be applied to the Figures 1 to 3 IME structure 1.

[0051] In Figure 4 , the encapsulation member 50 that forms a capsule structure surrounds the LED element L disposed between the light guides 200 on the upper surface 6a of the second plastic resin 6. The encapsulation member 50 can be made of various materials such as epoxy resin, silicone resin, and ceramic and is bonded. Using a doser, an appropriate amount is sprayed at the desired location, and the encapsulation member 50 is fabricated through various hardening processes such as heat hardening or UV hardening.

[0052] In Figure 5 , the lens 60 that forms a capsule structure surrounds the LED element L disposed between the light guides 200 on the upper surface 6a of the second plastic resin 6. The lens 60 can be made of any injection - moldable material and can be deformed in shape and structure according to specifications. The lens 60 can be formed in an assembled or adhesive - bonded form at the desired location.

[0053] According to the present invention as described above, the following excellent effects are achieved: The components including the LED element L can be protected from heat or pressure through the capsule structure, a light diffusion function can be imparted, and the traveling angles such as the light distribution can be adjusted.

[0054] <Light Pattern Structure in the IME Structure 1> <着

[0055] Next, as another embodiment of the present invention, an embodiment adopting a light pattern structure will be described.

[0056] Figure 6 a shows a cross - sectional view before assembly of the IME structure 1 with a light pattern structure of the present invention, Figure 6 b shows a cross - sectional view after assembly.

[0057] Below the first plastic resin 4, the pattern portion P is formed in a curved surface shape, and the pattern portion P is a hemispherical shape that is recessed upward at a position facing the LED element L of the second plastic resin 6. Minute concavo-convex portions are formed on the surface of the pattern portion P. When the first plastic resin 4 and the second plastic resin 6 are joined, as shown in the figure, the pattern portion P is provided so as to surround the LED element L. Effects such as the direction, scattering, concentration, reflection, and diffusion of light can be appropriately adjusted and controlled by the pattern portion P. The shape of the pattern portion P is made in various forms in consideration of the desired light effects, and can be applied to products such as indoor auxiliary lights that are exposed to the outside or inside. In addition, the concavo-convex portions can be variously made into sharp tip shapes or hemispherical shapes. Next, Figure 7 is a cross-sectional view of the second plastic resin 6 of the IME structure 1 having a light pattern structure according to another embodiment of the present invention.

[0058] Unlike Figure 6 this, a pattern portion P is formed on the inner side surface of the light guide member 200 that surrounds the LED element L in Figure 7 . Minute concavo-convex portions are formed on the surface of the pattern portion P. In this case, while the light passes through the pattern portion P, multiple parallel light beams converge into one light beam and travel sideward, so that a side diffusion effect of the light can be expected. Figure 7 The structure of Figure 6 also exhibits the same effect.

[0059] <Design Embodiment Structure in IME Structure 1>

[0060] Although the formation of the design in the thin film 2 has been described in Figure 1 , according to another embodiment of the present invention, the design can be formed in the first plastic resin 4. Figure 8 a to Figure 8 e are views sequentially showing the manufacturing process of forming the design in the first plastic resin 4 of the present invention and the three-dimensional views of the first plastic resin 4 according to each process.

[0061] First, the base 400 of the first plastic resin 4 is completed by an injection molding process. The material of the base 400 includes all moldable plastic resins such as PC, PMMA (acrylic), ABS, and AES.

[0062] Next, a coating operation is performed on the surface of the base 400 to form a coating layer. The coating operation is carried out through multiple processes including primer coating (base coating), or a single top coating. The top coating is to apply a transparent coating as a sealing material on the material placed below, and is for protecting the outer surface of the product from deformation due to exposure to sunlight.

[0063] Then, to reflect the specified design, a metal layer is formed in the first plastic resin 4 using metals such as indium (In), aluminum, or nickel. The metal layer can be formed by vapor deposition or plating processes.

[0064] Then, for example, a laser is used to etch or corrode the metal layer formed by vapor deposition or coating processes according to the designed shape. Figure 8 In the example of d, the remaining metal layer portion is etched to display the design of "M".

[0065] Finally, to showcase the beautiful colors, a coating process is performed using paint. Figure 8 e).

[0066] To complete IME structure 1, it can be done by using... Figure 2 and Figure 3 The assembly or bonding process described in the basic instructions will combine the first plastic resin 4 and the second plastic resin 6, which embodies the design.

[0067] The above design and manufacturing processes are all applicable to the aforementioned embodiments of the present invention.

[0068] The embodiments of the present invention have been described above, but are not limited thereto. Various modifications and variations can be made to the present invention. It is self-evident that the scope of the present invention extends to the same or equivalent scope as the claims set forth below.

Claims

1. An IME structure, characterized in that, include: A thin film, a first plastic resin located below the thin film, and a second plastic resin located below the first plastic resin, an electronic circuit is formed on or below the second plastic resin by a plating process, and electronic components are installed, including an LED light source, and a plurality of raised light guides are formed on the second plastic resin to guide the distribution and direction of illumination, and an LED light source is installed in the space provided by the light guides. An assembly component protruding outward is formed in the second plastic resin, and a receiving portion is formed on the opposite side of the first plastic resin in a matching form, thereby assembling the first plastic resin and the second plastic resin. Alternatively, an assembly component is formed in the first plastic resin, and a receiving portion is formed on the opposite side of the second plastic resin in a matching form, thereby assembling the first plastic resin and the second plastic resin. In order to form the design in the first plastic resin, an injection molding process is used to complete the base of the first plastic resin, the surface of the base is coated, a metal layer is formed by vapor deposition and plating processes to form the design of the specified shape, the metal layer is etched according to the designed shape, and a coating operation is performed.

2. The IME structure according to claim 1, characterized in that, An adhesive layer is formed on top of the second plastic resin, so that the first plastic resin and the second plastic resin are bonded together.

3. The IME structure according to claim 1, characterized in that, An encapsulation component or lens is formed on top of the second plastic resin in the form of surrounding the LED element, thereby having a capsule structure.

4. The IME structure according to claim 1, characterized in that, A patterned portion is formed on the underside of the first plastic resin, opposite to the LED element. The patterned portion is curved and has tiny bumps and depressions.

5. The IME structure according to claim 1, characterized in that, A patterned portion is formed on the inner side of the light guide surrounding the LED element.

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