Radiant thermometer
By stacking multiple substrates in the radiation thermometer and fixing them with inter-substrate connectors and elastic components, separating the heat source from the housing, and setting up lenses and filters, miniaturization and electromagnetic noise problems are solved, achieving higher measurement accuracy and stability.
CN115667863BActive Publication Date: 2026-05-26HORIBA LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HORIBA LTD
- Filing Date
- 2021-06-23
- Publication Date
- 2026-05-26
AI Technical Summary
Technical Problem
Existing radiation thermometers are limited in circuit size during miniaturization and are susceptible to electromagnetic noise interference, which affects measurement accuracy.
Method used
The signal processing unit is constructed by stacking multiple substrates, connected by inter-substrate connectors, and fixed by elastic components. The housing is divided into two parts to isolate the heat source, and lenses and wavelength selective filters are provided to reduce the thermal impact.
Benefits of technology
This technology enables miniaturization of the radiation thermometer and expansion of its circuitry, enhancing its electromagnetic noise immunity and improving measurement accuracy and stability.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN115667863B_ABST
Abstract
The present invention provides a radiation thermometer that can be miniaturized and has a larger circuit scale. The radiation thermometer includes: an infrared sensor (2); a signal processing unit (4) for processing the signal of the infrared sensor (2); and a housing (5) for housing the infrared sensor (2) and the signal processing unit (4). The signal processing unit (4) is constructed by stacking multiple substrates (41-44) through spacers (45).
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