Display panel, manufacturing method thereof, display device and tiled display device

Abstract

Disclosed are a display panel, a manufacturing method thereof, a display device, and a tiled display device, which relate to the field of display technologies and are used to improve the problem of too wide a bezel. The display panel includes a circuit backplane and a reflective layer. The circuit backplane includes: a first main surface, a second main surface, and a plurality of side surfaces. The first main surface is configured to carry a plurality of light-emitting devices. The second main surface is disposed opposite to the first main surface. The plurality of side surfaces connect the first main surface and the second main surface. Among them, at least one of the plurality of side surfaces is a selected side surface. The reflective layer covers the selected side surface, and the reflective layer is configured to be removable under predetermined process conditions. The display panel provided by the present disclosure can reflect laser through the reflective layer to reduce the laser cutting taper of the front encapsulation film, and the reflective layer itself can be removed, so as to reduce the bezel width and improve the problem of light leakage at the bezel, thereby improving the display effect of the tiled display device.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, a display device, and a tiled display device. Background Art

[0002] As a new generation of display technology, micro light emitting diode (LED) chips, including Micro LED chips and Mini LED chips, are mostly used in display devices for seamless tiling. Mini / Micro LED display devices have characteristics such as high contrast, long lifespan, and low power consumption. Summary of the Invention

[0003] Some embodiments of the present disclosure aim to provide a display panel, a manufacturing method thereof, a display device, and a tiled display device, which are used to improve the problems of too wide a seam and easy light leakage at the seam of the tiled display device.

[0004] To achieve the above object, the following technical solutions are provided:

[0005] On the one hand, a display panel is provided. The display panel includes a circuit backplane and a reflective layer. The circuit backplane includes a first main surface, a second main surface, and a plurality of side surfaces. The first main surface is configured to carry a plurality of light-emitting devices. The second main surface is disposed opposite to the first main surface. The plurality of side surfaces connect the first main surface and the second main surface. Among them, at least one of the plurality of side surfaces is a selected side surface. The reflective layer covers the selected side surface, and the reflective layer is configured to be removable under predetermined process conditions.

[0006] In some embodiments, the thickness of the reflective layer is H1, and H1 satisfies: 5μm ≤ H1 ≤ 20μm.

[0007] In some embodiments, the predetermined process conditions include at least one of applying an external force, heating, and light irradiation.

[0008] In some embodiments, an anti-adhesive layer is provided on the surface of the reflective layer close to the selected side surface.

[0009] In some embodiments, the viscosity strength of the anti-adhesive layer is P, and P satisfies: 5gf / 25mm ≤ P ≤ 10gf / 25mm.

[0010] In some embodiments, the anti-adhesive layer includes a heat-reducible adhesive or a UV-reducible adhesive.

[0011] In some embodiments, the display panel further includes: a plurality of connection leads, each of the plurality of connection leads extending from the first main surface through the selected side surface to the second main surface. Wherein, the reflective layer covers the portion of the plurality of connection leads located on the selected side surface.

[0012] In some embodiments, the display panel further includes: a light-blocking layer disposed on a side of the reflective layer close to the selected side surface. The light-blocking layer includes a first portion, wherein the first portion is located on the selected side surface and covers the portion of the plurality of connection leads located on the selected side surface.

[0013] In some embodiments, the light-blocking layer further includes a second portion. The second portion covers a part of the first main surface.

[0014] In some embodiments, a direction perpendicular to the boundary line connecting the selected side surface and the first main surface and parallel to the first main surface is a first direction. The length of the second portion in the first direction is a, and a satisfies: 50 μm ≤ a ≤ 300 μm.

[0015] In some embodiments, the light-blocking layer further includes a third portion, the third portion is disposed at an end of the first portion away from the second portion, and the third portion covers at least a part of the second main surface.

[0016] In some embodiments, a direction perpendicular to the boundary line connecting the selected side surface and the first main surface and parallel to the first main surface is a first direction. The dimension of the third portion in the first direction is b, and the dimension of the circuit backplane in the first direction is c, and b and c satisfy: 20 μm ≤ b ≤ c.

[0017] In some embodiments, the optical density value OD of the light-blocking layer satisfies: OD ≥ 2.

[0018] In some embodiments, the material of the light-blocking layer includes at least one of thermoplastic polyurethane elastomer rubber and polyimide.

[0019] In some embodiments, the thickness of the light-blocking layer is H2, and H2 satisfies: 10 μm ≤ H2 ≤ 100 μm.

[0020] In some embodiments, the display panel further includes: a plurality of light-emitting devices and a first protective layer. The plurality of light-emitting devices are located on the first main surface. The first protective layer is located on the first main surface. The first protective layer covers the plurality of light-emitting devices and fills the gap regions between the plurality of light-emitting devices.

[0021] In some embodiments, the side surface of the first protective layer close to the selected side surface is substantially flush with the side surface of the light-blocking layer far from the selected side surface.

[0022] In some embodiments, a first alignment mark is provided on the light-blocking layer, and a second alignment mark that is in alignment cooperation with the first alignment mark is provided on the circuit backplane.

[0023] In some embodiments, the first alignment mark is located in at least one of the first part, the second part, and the third part of the light-blocking layer.

[0024] In some embodiments, the first alignment mark includes at least two alignment holes, and the shape of the alignment holes is any one of a circular hole, a T-shaped hole, or a cross-shaped hole.

[0025] In some embodiments, the display panel further includes: a second protective layer, which covers the plurality of connection leads and fills the gap region between the plurality of connection leads.

[0026] In a second aspect, a display device is provided. The display device includes: the display panel as described in any one of the above; and, a driving circuit board. The driving circuit board is located on the side where the second main surface of the circuit backplane is located. The driving circuit board is coupled to the circuit backplane through a plurality of connection leads.

[0027] In a third aspect, a tiled display device is provided. The tiled display device includes: a plurality of the above-described display devices that are tiled together.

[0028] In a fourth aspect, a method for manufacturing a display panel is provided. The manufacturing method includes: manufacturing a circuit backplane. The circuit backplane includes a first main surface and a second main surface that are oppositely disposed, and a plurality of side surfaces that connect the first main surface and the second main surface; the first main surface is configured to be capable of carrying a plurality of light-emitting devices; at least one of the plurality of side surfaces is a selected side surface. The manufacturing method further includes: providing a reflective layer that covers the selected side surface. The reflective layer is configured to be removable under predetermined process conditions.

[0029] In some embodiments, the method for manufacturing a display panel further includes: providing a light-blocking layer that at least covers the selected side surface. The light-blocking layer includes a first part that covers the selected side surface. The steps of providing the reflective layer that covers the selected side surface and providing the light-blocking layer that at least covers the selected side surface include: first attaching the reflective layer to the first part of the light-blocking layer, and then setting the side surface of the light-blocking layer far from the reflective layer to at least cover the selected side surface.

[0030] In some embodiments, the light-blocking layer further includes a second portion covering part of the first main surface and a third portion covering at least part of the second main surface. The step of disposing the side surface of the light-blocking layer away from the reflective layer to at least cover the selected side surface includes one of the following: first attaching the first portion to the selected side surface, and then bending the second portion and the third portion so that the second portion covers part of the first main surface and the third portion covers at least part of the second main surface; or, first covering the second portion on part of the first main surface, then attaching the first portion to the selected side surface, and finally covering the third portion on at least part of the second main surface; or, first covering the third portion on at least part of the second main surface, then attaching the first portion to the selected side surface, and finally covering the second portion on part of the first main surface.

[0031] In some embodiments, before the step of disposing the light-blocking layer that at least covers the selected side surface, the manufacturing method further includes: forming a plurality of connecting leads on the first main surface, the selected side surface, and the second main surface, each connecting lead in the plurality of connecting leads extending from the first main surface through the selected side surface to the second main surface; forming a second protective layer covering the plurality of connecting leads.

[0032] In some embodiments, the manufacturing method further includes: disposing a plurality of light-emitting devices on the first main surface; forming a first protective film covering the plurality of light-emitting devices, the first protective film filling the gap regions between the plurality of light-emitting devices; using a laser cutting process to cut the first protective film along a cutting position on the first protective film to form a first protective layer; removing the reflective layer under the predetermined process conditions.

[0033] In some embodiments, the cutting position is located on a side of the reflective layer away from the selected side surface; in a direction perpendicular to the selected side surface, the distance between the cutting position and the reflective layer is a preset value.

[0034] In some embodiments, the preset value is approximately 0.2 mm.

[0035] The display panel, the manufacturing method thereof, the display device, and the tiled display device provided by the present disclosure have the following beneficial effects:

[0036] The display panel provided by the present disclosure, by providing a reflective layer, when a laser beam cuts the front encapsulation film, the reflective layer can reduce the taper of the laser beam by reflecting the laser light, thereby reducing the outward expansion size when cutting the front encapsulation film and reducing the taper on the side of the front encapsulation film. Therefore, the seam width after splicing two display panels can be reduced. Additionally, since the reflective layer is provided on one side where the seam is formed, the reflective layer will also increase the seam. Thus, after cutting is completed, removing the reflective layer under predetermined process conditions can further reduce the seam width. By reducing the seam width, the problem of light leakage at the seam can be improved, thereby enhancing the display effect.

[0037] The beneficial effects achievable by the manufacturing method of the display panel, the display device, and the tiled display device provided by the present disclosure at least include the beneficial effects achievable by the display panel provided by the above technical solution, which will not be elaborated herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] To more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings in the following description are only the drawings of some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams and do not limit the actual sizes of the products, the actual processes of the methods, the actual timings of the signals, etc. involved in the embodiments of the present disclosure.

[0039] Figure 1 Structural diagram of a tiled display device provided for some embodiments of the present disclosure;

[0040] Figure 2 Structural diagram of a display device provided for some embodiments of the present disclosure;

[0041] Figure 3 For Figure 2 Partial structural diagram of the display device provided at C;

[0042] Figure 4 For Figure 3 Cross-sectional structural diagram of the display device obtained by taking a section of the partial structural diagram of the display device provided along DD';

[0043] Figure 5 Cross-sectional structural diagram of a display device provided for some embodiments of the present disclosure;

[0044] Figure 6 Structural diagram of multiple connection leads on the selected side surface of a display device provided for some embodiments of the present disclosure;

[0045] Figure 7 Cross-sectional structural diagram of a display device provided for other embodiments of the present disclosure;

[0046] Figure 8 Cross-sectional structure diagram of a display device provided for some further embodiments of the present disclosure;

[0047] Figure 9 Cross-sectional structure diagram of a display device provided for some other embodiments of the present disclosure;

[0048] Figure 10 Cross-sectional structure diagram of a display device provided for some other embodiments of the present disclosure;

[0049] Figure 11 Front view structure diagram of a light-blocking layer disposed on a display panel provided for some embodiments of the present disclosure;

[0050] Figure 12 Top view structure diagram of a light-blocking layer disposed on a display panel provided for some embodiments of the present disclosure;

[0051] Figure 13 Cross-sectional structure diagram of a display device provided for some other embodiments of the present disclosure;

[0052] Figure 14 Flow chart of a method for manufacturing a display panel provided for some embodiments of the present disclosure;

[0053] Figure 15 Flow chart of a method for manufacturing a display panel provided for some other embodiments of the present disclosure;

[0054] Figure 16 Flow chart of a method for manufacturing a display panel provided for some further embodiments of the present disclosure;

[0055] Figure 17 Flow chart of a method for manufacturing a display panel provided for some other embodiments of the present disclosure;

[0056] Figure 18 Flow chart of a method for manufacturing a display panel provided for some other embodiments of the present disclosure;

[0057] Figure 19 Flow chart of a method for manufacturing a display panel provided for some other embodiments of the present disclosure;

[0058] Figure 20 Flow chart of a method for manufacturing a display panel provided for some other embodiments of the present disclosure;

[0059] Figure 21 Flow chart of a method for manufacturing a display panel provided for some other embodiments of the present disclosure;

[0060] Figure 22 Cross-sectional structure diagram of a display panel provided for some other embodiments of the present disclosure;

[0061] Figure 23 is a structural diagram of laser cutting a display panel in the related art;

[0062] Figure 24 is a structural diagram of splicing display panels in the related art. Specific Embodiments

[0063] The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are only a part rather than all of the embodiments of the present disclosure. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those of ordinary skill in the art shall fall within the protection scope of the present disclosure.

[0064] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular form "comprises" and the present participle form "comprising", are interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" etc. are intended to indicate that the specific features, structures, materials or characteristics related to the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0065] Hereinafter, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present disclosure, unless otherwise stated, the meaning of "a plurality" is two or more.

[0066] In describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, in describing some embodiments, the term "connected" may be used to indicate that two or more components have direct physical or electrical contact with each other. Also, for example, in describing some embodiments, the term "coupled" may be used to indicate that two or more components have direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also mean that two or more components do not have direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content herein.

[0067] "At least one of A, B, and C" has the same meaning as "at least one of A, B, or C" and includes the following combinations of A, B, and C: only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0068] As used herein, the use of "adapted to" or "configured to" means open and inclusive language, which does not exclude devices adapted to or configured to perform additional tasks or steps.

[0069] Additionally, the use of "based on" is open and inclusive because a process, step, calculation, or other action "based on" one or more of the stated conditions or values can in practice be based on additional conditions or values beyond those stated.

[0070] As used herein, "about", "substantially", or "approximately" includes the stated value and an average within an acceptable deviation range of the specific value, where the acceptable deviation range is determined by a person of ordinary skill in the art considering the measurement being discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system).

[0071] As used herein, "parallel", "perpendicular", "equal" include the stated situations and situations similar to the stated situations, where the range of the similar situations is within an acceptable deviation range, and the acceptable deviation range is determined by a person of ordinary skill in the art considering the measurement being discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, that the difference between the two equal values is less than or equal to 5% of either one.

[0072] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions is exaggerated for clarity. Thus, variations in the shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Accordingly, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but include shape deviations resulting from, for example, manufacturing. For example, an etched region shown as rectangular will typically have curved features. Thus, the regions shown in the drawings are schematic in nature, and their shapes are not intended to depict the actual shape of the regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0073] Currently, a certain number of small-sized Mini / Micro LED display devices are used to splice and realize the image display of a super-large Mini / Micro LED display device, and there is a strong commercial demand for high-end large screens.

[0074] In a splicing display device, the size of the splicing seam is an important factor affecting the display effect of the splicing display device. Please refer to Figure 23 , the display panel includes a front encapsulation film M disposed on the light-emitting side of the circuit backplane 1. The front encapsulation film M can protect the circuit structure and the light-emitting elements. Further, the color of the front encapsulation film M can be a dark color, such as black, dark gray, dark green, etc., which can improve the contrast of the displayed image. In order to obtain a front encapsulation film M that matches the size of the display panel, during the manufacturing process, the front encapsulation film M needs to be laser-cut.

[0075] Please continue to refer to Figure 23 , when the front encapsulation film M is laser-cut, since the laser beam X is conical, a large taper will be formed on the side surface F of the front encapsulation film M. In addition, in order to avoid laser damage to the side circuits and even the display area, it is necessary to increase the seam width. In this way, when two panels are spliced, the splicing seam is large, and the splicing seam cannot be completely aligned, and it is easy to have the problem that the lower end contacts the splicing and there is a large splicing seam at the upper end. Please refer to Figure 24 , a triangular T-shaped splicing seam appears at the splicing seam, resulting in the prominent splicing seam. Since the prominent splicing seam will cause light leakage at the splicing seam, which will further affect the display effect.

[0076] Based on this, some embodiments of the present disclosure provide a splicing display device 1000. Please refer to Figure 1 , the splicing display device 1000 is formed by splicing a plurality of display devices 100. Since the frame size of each display device 100 used for splicing is very small, for example, not exceeding half of the pitch between two adjacent pixels in each display device 100, the splicing seam between two adjacent display devices 100 in the splicing display device 1000 is difficult to be detected by the naked eye within the viewing distance during actual viewing, and a better display effect can be presented.

[0077] The display device 100 includes a display panel and a driving circuit board. The driving circuit board is used to provide a display control signal to the display panel to drive the display panel to realize screen display.

[0078] Please refer to Figures 2 to 4 , some embodiments of the present disclosure provide a display panel 10, which can be applied to the above display device 100. In some embodiments, the display panel 10 includes: a display area AA (Active Area, abbreviated as AA area; also referred to as an effective display area) and a peripheral area BB located on at least one side of the AA area.

[0079] In the above display panel 10, a plurality of pixels P' and a plurality of signal lines L are arranged in the display area AA, and the plurality of signal lines L are electrically connected to the plurality of pixels P'. Exemplarily, each pixel P' includes sub-pixels P of at least three colors, and the sub-pixels P of the plurality of colors at least include a first-color sub-pixel, a second-color sub-pixel, and a third-color sub-pixel. The first color, the second color, and the third color are three primary colors (for example, red, green, and blue).

[0080] In some embodiments, please refer to Figure 4 , Figure 5 and Figures 7 to 10 , the display panel 10 includes a circuit backplane 1, and the circuit backplane 1 includes: a first main surface 11, a second main surface 12, and a plurality of side surfaces 13 connecting the first main surface 11 and the second main surface 12. At least one of the plurality of side surfaces 13 is a selected side surface 13a.

[0081] In some examples, there may also be a plurality of side surfaces 13 as the selected side surface 13a. Exemplarily, please refer to Figure 2 , the cross-sections of the first main surface 11 and the second main surface 12 are both rectangular, and the first main surface 11 and the second main surface 12 are connected by four side surfaces 13. Among the four side surfaces 13, two relatively arranged side surfaces 13 are simultaneously used as the selected side surface 13a.

[0082] Please continue to refer to Figure 4 , Figure 5 and Figures 7 to 10 , the first main surface 11 is configured to carry a plurality of light-emitting devices 111. The driving circuit board 20 is located on the side where the second main surface 12 of the circuit backplane 1 is located. The driving circuit board 20 is coupled to the circuit backplane 1 through a plurality of connection leads 2.

[0083] Please refer to Figure 4 , Figure 5 and Figures 7 to 10, the display panel 10 further includes a reflective layer 3, and the reflective layer 3 covers the selected side surface 13a. The reflective layer 3 is configured to be removable under predetermined process conditions.

[0084] By providing the above-mentioned reflective layer 3, when the laser beam cuts the front encapsulation film from one side of the second main surface 12 to one side of the first main surface 11, the reflective layer 3 can reduce the taper of the laser beam by reflecting the laser light, thereby reducing the outward expansion size when cutting the front encapsulation film and reducing the taper on the side of the front encapsulation film. Therefore, the seam width after splicing two display panels 10 can be reduced. In addition, since the reflective layer 3 is provided on the side where the seam is formed, the reflective layer 3 will also increase the seam. Therefore, after the cutting is completed, removing the reflective layer 3 under predetermined process conditions can further reduce the seam width. By reducing the seam width, the problem of light leakage at the seam can be improved, thereby enhancing the display effect.

[0085] In some examples, the circuit backplane 1 includes a substrate and a driving circuit layer provided on one side of the substrate. The material of the substrate can be selected from rigid materials such as glass, quartz, and plastic. The driving circuit layer includes, for example, thin film transistors (TFTs) or micro driving chips and the above-mentioned multiple signal lines L, etc. The driving circuit layer is coupled to a plurality of light-emitting devices and is configured to drive the plurality of light-emitting devices to emit light.

[0086] In some embodiments, the thickness of the reflective layer 3 is H1, and H1 satisfies: 5μm ≤ H1 ≤ 20μm. Exemplarily, the thickness H1 of the reflective layer 3 is 5μm, 15μm, or 20μm.

[0087] When the thickness of the reflective layer 3 is in the range of 5μm to 20μm, the reflective layer 3 can not only play a good role in reflecting light, but also prevent the distance between the circuit backplanes 1 in adjacent display panels 10 from being too large and affecting the display effect. For example, when the thickness of the reflective layer 3 is equal to 5μm or approaches 5μm, the distance between the laser beam and the selected side surface 13a can be made smaller. After removing the reflective layer 3, the side surface obtained after laser cutting is closer to the selected side surface 13a, which is beneficial to reducing the distance between the adjacent selected side surfaces 13a of the two display panels 10 during splicing, thereby presenting a better display effect. Another example is that when the thickness H1 of the reflective layer 3 is equal to 20μm or approaches 20μm, the reflective layer 3 can have a sufficient thickness to enable the reflective layer 3 to play a good role in reflecting light.

[0088] In addition, it should be noted that due to certain uncontrollable errors (such as manufacturing process errors, equipment precision, measurement errors, etc.), when the thickness H1 of the reflective layer 3 is 4.9 μm, 4.96 μm, etc. (for example, the floating range does not exceed 0.5 μm), it can also be considered that the thickness H1 of the reflective layer 3 meets the limiting condition of being equal to 5 μm; when the thickness H1 of the reflective layer 3 is 20.1 μm, 20.35 μm, etc. (for example, the floating range does not exceed 0.5 μm), it can also be considered that the thickness H1 of the reflective layer 3 meets the limiting condition of being equal to 20 μm.

[0089] In some embodiments, the predetermined process conditions include at least one of applying an external force, heating, and light irradiation.

[0090] The reflective layer 3 can be removed by one or a combination of the above methods. It can be understood that applying an external force, light irradiation, or heating can all achieve the purpose of removing the reflective layer 3.

[0091] Moreover, the operation is simple and the practicability is strong.

[0092] In some embodiments, please refer to Figure 5 , a viscosity-reducing adhesive layer 31 is provided on the surface of the side of the reflective layer 3 close to the selected side surface 13a.

[0093] The viscosity of the viscosity-reducing adhesive layer 31 can be reduced under specific conditions. When the reflective layer 3 is pasted through the viscosity-reducing adhesive layer 31, under specific conditions, the viscosity of the viscosity-reducing adhesive layer 31 can be reduced, so that the reflective layer 3 and the viscosity-reducing adhesive layer 31 can be removed simultaneously. If other curing adhesives are used and the reflective layer 3 is directly torn off by applying an external force, it is easy to damage the pasting surface or other nearby structures. Therefore, when the viscosity-reducing adhesive layer 31 is provided to fix the reflective layer 3, the reflective layer 3 is easier to remove, and no damage will be caused to its attached surface and nearby structures during removal. Moreover, the viscosity-reducing adhesive layer 31 itself is easy to remove and not easy to remain. It will not affect other performances of the display panel 10.

[0094] In some embodiments, the viscosity strength of the viscosity-reducing adhesive layer 31 is S, and S satisfies: 5 gf / 25 mm ≤ S ≤ 10 gf / 25 mm. Exemplarily, the viscosity strength S of the viscosity-reducing adhesive layer 31 is 5 gf / 25 mm, 75 gf / 25 mm, or 105 gf / 25 mm.

[0095] "gf / 25mm" represents the number of grams (g) of force that can be borne per 25 mm in length, that is, the tensile force that can be borne per 25 square millimeters of area. When the viscosity strength S of the adhesive release layer 31 is in the range of 5 gf / 25mm to 10 gf / 25mm, it means that the tensile force that the adhesive release layer 31 per 25 square millimeters of area can bear is in the range of 5 g to 10 g. When the viscosity strength of the adhesive release layer 31 is in this range, it can ensure that the adhesive release layer 31 has a relatively large bonding strength, thereby ensuring that the reflective layer 3 is firmly fixed. On the other hand, the adhesiveness of the adhesive release layer 31 is not too large, which is convenient for removal after laser cutting is completed.

[0096] In some embodiments, the adhesive release layer 31 includes a heat-activated adhesive release agent or a UV (Ultraviolet) adhesive release agent.

[0097] The heat-activated adhesive release agent or the UV adhesive release agent has the advantage of being easy to remove. In some examples, the bonding strength can be reduced by heating the heat-activated adhesive release agent to remove the adhesive release layer 31. In other examples, the adhesive force of the UV adhesive release agent can be sharply decreased by irradiating ultraviolet light to remove the adhesive release layer 31.

[0098] In some examples, please refer to Figures 2 to 10 , the display panel 10 further includes a plurality of connection leads 2, and each of the plurality of connection leads 2 extends from the first main surface 11 through the selected side surface 13a to the second main surface 12. Among them, the reflective layer 3 covers the part of the plurality of connection leads 2 located on the selected side surface 13a.

[0099] It can be understood that the connection lead 2 extends from the first main surface 11 through the selected side surface 13a to the second main surface 12, that is to say, the display panel 10 adopts the side-wiring method. The side-wiring method enables the conductive patterns on the relatively two surfaces of the display panel 10 to be coupled. Exemplarily, through the plurality of connection leads 2, a plurality of light-emitting devices 111 located on the first main surface 11 are coupled to the driving circuit board 20 located on the second main surface 12, so that the driving circuit board 20 can provide electrical signals to control the plurality of light-emitting devices to emit light. The side-wiring can narrow the border of the display device, and each of the connection leads 2 in the side-wiring is an independent electrical path. The reflective layer 3 covers the part of the plurality of connection leads 2 located on the selected side surface 13a, so as to protect the connection leads 2 located on the selected side surface 13a and prevent the cutting laser beam from damaging the connection leads 2.

[0100] In some examples, please refer to Figure 2 , Figure 3 and Figure 6, a plurality of connection leads 2 are parallel to each other and arranged at intervals. Among them, the width of each connection lead 2 is not limited and is related to the size of the structure coupled thereto, and can be set according to actual requirements.

[0101] In some embodiments, please refer to Figures 2 to 10 , the display panel 10 further includes a plurality of first electrodes 21 and a plurality of second electrodes 22.

[0102] The plurality of first electrodes 21 are disposed on the first main surface 11, and each first electrode 21 is coupled to a portion of the connection lead 2 located on the first main surface 11. And each first electrode 21 is coupled to each light-emitting element 111, and outputs the signal transmitted by the connection lead 2 to the corresponding light-emitting element 111 to realize image display.

[0103] The plurality of second electrodes 22 are disposed on the second main surface 12, and each second electrode 22 is coupled to a portion of a connection lead 2 located on the second main surface 12. And each second electrode 22 is coupled to the driving circuit board 20, and controls the signal transmission of the corresponding connection lead 2 through the driving circuit board 20.

[0104] In some embodiments, please refer to Figures 2 to 5 And Figures 7 to 10 , the display panel 10 further includes a partition wall 4. The partition wall 4 is disposed in the peripheral region BB of the circuit backplane and in the gap region between the plurality of light-emitting devices 111 and the plurality of first electrodes 21. Exemplarily, please refer to Figure 2 , the partition wall 4 can be disposed around the display area AA, for example, disposed around the display area AA in a circle, or the partition wall 4 can also be disposed only on one side of the peripheral region BB close to the selected side surface 13a.

[0105] The partition wall 4 is fabricated before the plurality of connection leads 2, so that during the process of fabricating the plurality of connection leads 2, for example, sputtering the material of the plurality of connection leads 2 by a sputtering process, the partition wall 4 can prevent the material of the plurality of connection leads 2 from splashing onto the display area AA of the display panel 10 and affecting the fabrication accuracy of the components in the display area AA.

[0106] In some examples, the thickness of the partition wall 4 is greater than the thickness of the portion of the connection lead 2 located on the first main surface 11 and less than the total thickness of the portion of the connection lead 2 located on the first main surface 11 and the stacked film layers disposed on the surface of the connection lead 2.

[0107] In some examples, the material of the partition wall 4 is not limited as long as it can prevent the material of the plurality of connection leads 2 from splashing onto the display area AA. For example, the partition wall 4 is made of an elastic material, for example, the elastic material can be a resin material, or a stack of a resin material and a metal film layer material.

[0108] In some embodiments, please refer to Figures 7 to 10 , the display backplane 10 further includes a second protective layer 5, and the second protective layer 5 covers the plurality of connection leads 2 and fills the gap regions between the plurality of connection leads 2.

[0109] The second protective layer 5 is a corrosion protection layer, which can protect the connection leads 2 and prevent the connection leads 2 from being corroded due to long-term contact with water and oxygen, resulting in an increase in the resistance of the connection leads 2 or even breakage.

[0110] In some examples, the material of the second protective layer 5 is a material with high antioxidant performance, which can block external water and oxygen and avoid corrosion of the connection leads 2. Exemplarily, the material of the second protective layer 5 includes OC (OverCover) glue or dark ink material. The OC glue includes black glue and white glue. For example, the second protective layer 5 is a black glue layer. The dark ink material has high hardness and good corrosion resistance, and can cover the plurality of connection leads 2, thereby better protecting the connection leads.

[0111] In some embodiments, please refer to Figures 8 to 10 , the display panel 10 further includes a light-blocking layer 6, and the light-blocking layer 6 is disposed on one side of the reflective layer 3 close to the selected side surface 13a. The light-blocking layer 6 includes a first portion 61, wherein the first portion 61 is located on the selected side surface 13a and covers the portion of the plurality of connection leads 2 located on the selected side surface 13a.

[0112] Such a design can solve the problem of light leakage on the side of the display panel 10. In addition, the light-blocking layer 6 can also protect the plurality of connection leads 2 on the selected side surface 13a.

[0113] In some examples, the reflective layer 3 is disposed on one side of the light-blocking layer 6 away from the selected side surface 13a, and the reflective layer 3 can protect the light-blocking layer 6 and avoid damaging the light-blocking layer 6 during laser cutting.

[0114] In some embodiments, please refer to Figure 9 and Figure 10 , the light-blocking layer 6 further includes a second portion 62. The second portion 62 covers a part of the first main surface 11.

[0115] The second portion 62 is located in the peripheral region BB of the first main surface 11, and the second portion 62 can play a lapping role to strengthen the fixing effect of the light-blocking layer 6 and avoid the light-blocking layer 6 from falling off.

[0116] In some embodiments, please refer to Figure 9 and Figure 10The direction perpendicular to the boundary line connecting the first main surface 11 and the selected side surface 13a and parallel to the first main surface 11 is the first direction Y. The length of the second portion 62 in the first direction Y is a, and a satisfies: 50 μm ≤ a ≤ 300 μm. Exemplarily, the length a is 50 μm, 100 μm, or 300 μm.

[0117] It should be noted that in the production of display panels, die bonding operations are required. Die bonding refers to the process of bonding wafers to the designated areas of the display panel through a colloid (generally a conductive adhesive or an insulating adhesive for LEDs), forming a thermal path or an electrical path, and providing conditions for subsequent wire bonding. Due to the requirements of the die bonding operation of the die bonding equipment, the light-emitting device 111 needs to be at an appropriate distance from other devices. When the length a is equal to 50 μm or approaches 50 μm, the operation requirements of the die bonding equipment can be met. In addition, the seamless splicing structure has certain requirements for the distance between the light-emitting device 111 and the outer frame, that is, the distance between the light-emitting device 111 and the outer frame cannot be too long. Otherwise, the distance between the light-emitting devices 111 between adjacent panels is too large, which will affect the display effect at the splicing position. Therefore, when the length a is equal to 300 μm or approaches 300 μm, the requirements for the setting distance of the light-emitting device 111 in the seamless splicing product can be met, ensuring a good splicing display effect.

[0118] In addition, it should be noted that due to certain uncontrollable errors (such as manufacturing process errors, equipment accuracy, measurement errors, etc.), when the length a is 49.8 μm, 49.98 μm, etc. (for example, the floating range does not exceed 0.5 μm), it can also be considered that the length a meets the limiting condition of being equal to 50 μm; when the length a is 300.1 μm, 300.35 μm, etc. (for example, the floating range does not exceed 0.5 μm), it can also be considered that the length a meets the limiting condition of being equal to 300 μm.

[0119] In some embodiments, please refer to Figure 10 The light-blocking layer 6 further includes a third portion 63. The third portion 63 is disposed at one end of the first portion 61 away from the second portion 62, and the third portion 63 covers at least a part of the second main surface 12.

[0120] It should be noted that the second main surface 12 is the side opposite to the first main surface 11, that is, the light-emitting side of the display panel 10, which is also the back surface of the display panel 10. The light of the light-emitting device 111 needs to be emitted from the front surface (i.e., the first main surface 11) to display the picture. Light leakage from the back surface will affect the display effect. Therefore, the light-blocking layer 6 includes the third portion 63 disposed on the second main surface 12, which can effectively reduce the problem of light leakage from the back surface of the display panel 10.

[0121] The above-mentioned "covering at least part of the second major surface" means that the second major surface 12 is completely covered by the light-blocking layer 6, or only a part is covered by the light-blocking layer 6. The specific coverage range can be selected according to conditions such as the required display effect and the size of the display panel.

[0122] In some examples, refer to Figure 11 and Figure 12 , in the display panel 10, two oppositely arranged side surfaces 13 are selected side surfaces 13a, and light-blocking layers 6 are respectively provided on the two selected side surfaces 13a. The light-blocking layers 13a on both sides respectively include: a first part 61, a second part 62, and a third part 63. The third parts 63 on both sides jointly cover the second major surface 12, and in the first direction Y, the third part 63 partially covers the second major surface 12.

[0123] In some embodiments, the direction perpendicular to the boundary line connecting the selected side surface 13a and the first major surface 11 and parallel to the first major surface 11 is the first direction Y. The dimension of the third part 63 in the first direction is b, and the dimension of the circuit backplane 1 in the first direction is c, and b and c satisfy: 20μm ≤ b ≤ c.

[0124] When the length b of the third part 63 in the first direction Y is between 20μm and c, it can not only ensure that the third part 63 can have a good light-blocking effect on the second major surface 12, but also ensure that the light-blocking layer 6 is fixed reliably, avoiding the light-blocking layer 6 from slipping during attachment. When the length b is equal to 20μm or approaches 20μm, it can ensure that the third part 63 can be stably fixed on the second major surface 12, thus ensuring that the entire light-blocking layer 6 is fixed reliably and avoiding the light-blocking layer 6 from peeling off starting from the third part 63. When the length b is equal to c, or approaches c, it can ensure that the back side of the display panel 10 (i.e., the side where the second major surface 12 is located) has a good light leakage prevention effect.

[0125] In addition, it should be noted that due to certain uncontrollable errors (such as manufacturing process errors, equipment precision, measurement errors, etc.), when the length b is a value such as 20.4μm, 20.38μm (for example, the floating range does not exceed 0.5μm), the length b can also be considered to meet the limiting condition of being equal to 20μm.

[0126] In some embodiments, the optical density value OD of the light-blocking layer satisfies: OD ≥ 2. Exemplarily, the optical density value OD of the light-blocking layer is 2, 3, 4, or 5.

[0127] The optical density, also known as absorbance, is the common logarithm of the ratio of the transmittance of the incident light to the transmitted light. The calculation formula is OD = lg(incident light / transmitted light) or OD = lg(1 / transmittance). From this formula, it can be seen that when the value of OD is greater than or equal to 2, the value range of the transmittance of the light-blocking layer 6 is less than or equal to 1%, that is, only no more than 1% of the light incident on the light-blocking layer 6 can pass through the light-blocking layer. Such a design can ensure that the light-blocking layer 6 has a good light-blocking effect.

[0128] The material of the light-blocking layer 6 includes at least one of thermoplastic polyurethane elastomer rubber and polyimide.

[0129] Since the thermoplastic polyurethane elastomer rubber has good toughness, when the light-blocking layer 6 uses this material, the requirement for the light-blocking layer 6 to be bent can be met. Polyimide has good toughness and strength, which can not only meet the bending requirements of the light-blocking layer 6, but also has sufficient strength. During the pasting process, it is not only easy to bend, but also not easy to break, and can play a good role in protection and light blocking.

[0130] In some examples, the light-blocking layer 6 uses a dark film material. Compared with light colors, when other parameters are the same, the darker the color, the better the light-blocking effect. Exemplarily, the light-blocking layer 6 is a black film material.

[0131] In some embodiments, the thickness of the light-blocking layer 6 is H2, and H2 satisfies: 10μm ≤ H2 ≤ 100μm. Exemplarily, the thickness H2 of the light-blocking layer is 10μm, 50μm or 100μm.

[0132] When the thickness of the light-blocking layer is in the range of 10μm to 100μm, when the thickness H2 of the light-blocking layer 6 is equal to or approaches 10μm, it can be avoided that the light-blocking layer 6 is too thin, so as to ensure that the light-blocking layer 6 has a good light-blocking effect. When the thickness H2 of the light-blocking layer 6 is equal to 100μm or approaches 100μm, it can also be avoided that the light-blocking layer 6 is too thick, so as to avoid the problem of rebound and inability to paste firmly when bending the light-blocking layer 6 during the pasting process.

[0133] In addition, it should be noted that due to certain uncontrollable errors (such as manufacturing process errors, equipment precision, measurement errors, etc.), when the thickness H2 of the light-blocking layer 6 is 9.8μm, 9.78μm and other values (for example, the floating range does not exceed 0.5μm), it can also be considered that the thickness H2 of the light-blocking layer 6 meets the limiting condition of being equal to 10μm; when the thickness H2 of the light-blocking layer 6 is 100.1μm, 100.35μm and other values (for example, the floating range does not exceed 0.5μm), it can also be considered that the length a meets the limiting condition of being equal to 100μm.

[0134] In some embodiments, please refer to Figure 13, the display panel 10 further includes the above-mentioned plurality of light-emitting devices 111 and a first protective layer 7 (i.e., the above-mentioned front encapsulation film), and the plurality of light-emitting devices 111 are located on the first main surface 11. The first protective layer 7 covers the plurality of light-emitting devices 111 located on the first main surface 11 and fills the gap regions between the plurality of light-emitting devices 111.

[0135] In some examples, when the light-blocking layer 6 includes a second portion 62 located on the first main surface 11, the first protective layer 7 also covers the second portion 62 of the light-blocking layer 6. The first protective layer 7 functions to further protect the circuit structure, for example, to protect the plurality of light-emitting devices 111 from being damaged by bumps during subsequent processes.

[0136] In some examples, the material of the first protective layer 7 has high light transmittance and is dark in color. For example, the material of the first protective layer 7 can be black silicone or black resin. In this way, while protecting the plurality of light-emitting devices 111, the light extraction efficiency of the plurality of light-emitting devices 111 is ensured, and the problem that the external ambient light is reflected after irradiating the metal material pattern in the display panel 10, resulting in a reduction in the contrast of the picture, is avoided, and the contrast is improved.

[0137] In some embodiments, please continue to refer to Figure 13 , the side surface of the first protective layer 7 close to the selected side surface 13a is substantially flush with the side surface of the light-blocking layer 6 far from the selected side surface 13a.

[0138] That is to say, the side surface obtained after the first protective layer 7 is laser-cut is substantially flush with the side surface of the light-blocking layer 6 far from the selected side surface 13a. Thus, when removing the reflective layer 3 and splicing two display devices, the adjacent light-blocking layers 6 and the adjacent first protective layers 7 can be aligned respectively, achieving the minimum splicing seam while reducing the distance between adjacent display panels 10.

[0139] In some embodiments, please refer to Figure 12 , a first alignment mark Q is provided on the light-blocking layer 6, and a second alignment mark Q' that is aligned and cooperates with the first alignment mark Q is provided on the circuit backplane 1.

[0140] Such a design can provide an alignment reference for the light-blocking layer 6 when attaching it, ensure that the light-blocking layer 6 is attached to a predetermined position, and ensure the bonding accuracy.

[0141] In some embodiments, the first alignment mark 6 is located in at least one of the first portion 61, the second portion 62, and the third portion 63 of the light-blocking layer 6.

[0142] When the light-blocking layer 6 only includes the first part 61, the first alignment mark Q is located on the first part 61. When the light-blocking layer 6 further includes the second part 62 and / or the third part 63, according to the attaching sequence, the first alignment mark Q is disposed on the part that is attached first. When the first alignment mark Q is disposed on the part that is attached first, it can ensure that the part that is attached first has a high attaching accuracy. Since the other parts and the first part 61 are of an integral structure and are attached in sequence following the part that is attached first, the other parts can also ensure a high attaching accuracy.

[0143] In some embodiments, the first alignment mark Q includes at least two alignment holes, and the shape of the alignment holes is any one of a circular hole, a T-shaped hole, or a cross-shaped hole.

[0144] The first alignment mark Q is in the form of alignment holes, which is convenient to manufacture and can better achieve the function of the positioning mark. Moreover, when the attaching surface is determined, at least two alignment holes are required to completely position the light-blocking layer 6 for the positioning of the attaching position.

[0145] In some examples, please refer to Figure 12 , the first alignment mark Q is two circular holes arranged at intervals, and the two circular holes are arranged at intervals along the length direction of the intersection edge 13b of the second main surface 12 and the selected side surface 13a. The corresponding second alignment mark Q' also has two circular holes.

[0146] In other examples, the first alignment mark Q is a cross-shaped hole, and the second alignment mark Q' is a circular hole.

[0147] Based on the above technical solution of the display panel, some embodiments of the present disclosure provide a method for manufacturing a display panel. Please refer to Figure 5 and Figure 14 , this manufacturing method includes S1 and S2.

[0148] S1. Manufacture the circuit backplane 1. The circuit backplane 1 includes a first main surface 11 and a second main surface 12 that are oppositely arranged, and a plurality of side surfaces 13 connecting the first main surface 11 and the second main surface 12. The first main surface 11 is configured to carry a plurality of light-emitting devices 111. At least one of the plurality of side surfaces 13 is a selected side surface 13a.

[0149] S2. Set the reflective layer 3 covering the selected side surface 13a, and the reflective layer 3 is configured to be removable under predetermined process conditions.

[0150] A reflective layer 3 is provided on a selected side surface 13a of the circuit backplane 1. When a laser beam cuts the front encapsulation film from one side of the second main surface 12 to the other side of the first main surface 11, the reflective layer 3 can reduce the taper of the laser beam by reflecting the laser light, thereby reducing the outward expansion size when cutting the front encapsulation film and reducing the taper on the side of the front encapsulation film. Therefore, the seam width after splicing two display panels 10 can be reduced. Additionally, since the reflective layer 3 is provided on the side where the seam is formed, the reflective layer 3 will also increase the seam. Therefore, after cutting is completed, removing the reflective layer 3 under predetermined process conditions can further reduce the seam width. By reducing the seam width, the problem of light leakage at the seam can be improved, thereby enhancing the display effect.

[0151] In some embodiments, referring to Figure 8 and Figure 15 , the method for manufacturing a display panel further includes S3 and S4.

[0152] S3. Provide a light-blocking layer 6 that at least covers the selected side surface 13a; the light-blocking layer 6 includes a first portion 61 that covers the selected side surface 13a.

[0153] The steps of providing the reflective layer 3 that covers the selected side surface 13a and the light-blocking layer 6 that at least covers the selected side surface 13a include:

[0154] S4. First attach the reflective layer 3 to the first portion 61 of the light-blocking layer 6, and then set the side surface of the light-blocking layer 6 away from the reflective layer 3 to at least cover the selected side surface 13a.

[0155] With this design, the attachment accuracy can be improved and the process flow can be simplified, only requiring sequential attachment operations on the circuit backplane 1.

[0156] In some embodiments, the light-blocking layer 6 further includes a second portion 62 that covers a part of the first main surface 11 and a third portion 63 that covers at least a part of the second main surface 12.

[0157] On this basis, in some examples, the step of setting the side surface of the light-blocking layer 6 away from the reflective layer 3 to at least cover the selected side surface 13a in S4 includes: S41 and S42; or S401, S402, and S403; or S4001, S4002, and S4003.

[0158] Please refer to Figures 10 to 12 , and Figure 16 .

[0159] S41. First attach the first portion 61 to the selected side surface 13a.

[0160] S42. Then bend the second part 62 and the third part 63 so that the second part 62 is attached to part of the first main surface 11 and the third part 63 is attached to at least part of the second main surface 12.

[0161] In this manufacturing process, the above-mentioned first alignment mark Q is located on the first part 61 of the light-blocking layer 6, and the second alignment mark Q' is located on the selected side surface 13a.

[0162] Please refer to Figures 10 to 12 , and Figure 17 .

[0163] S401. First, attach the second part 62 to part of the first main surface 11.

[0164] S402. Then attach the first part 61 to the selected side surface 13a.

[0165] S403. Finally, attach the third part 63 to at least part of the second main surface 12.

[0166] In this manufacturing process, the above-mentioned first alignment mark Q is located on the second part 62 of the light-blocking layer 6, and the second alignment mark Q' is located on the first main surface 11.

[0167] Please refer to Figures 10 to 12 , and Figure 18 .

[0168] S4001. First, attach the third part 63 to at least part of the second main surface 12.

[0169] S4002. Then attach the first part 61 to the selected side surface 13a.

[0170] S4003. Finally, attach the second part 62 to part of the first main surface 11.

[0171] In this manufacturing process, the above-mentioned first alignment mark Q is located on the third part 63 of the light-blocking layer 6, and the second alignment mark Q' is located on the second main surface 12.

[0172] In this manufacturing process, the third part 63 of the light-blocking layer 6 is in large-area contact with the second main surface 12 of the circuit backplane 1, and it is not easy to fall off or shift during attachment. Accurate attachment can be achieved when the material and equipment tolerances are measured in advance.

[0173] In some embodiments, please refer to Figures 4 to 10 and Figure 19 , before the step of setting the reflective layer 3 covering the selected side surface 13a, it further includes: S01 and S02.

[0174] S01. Form a plurality of connecting leads 2 on the first main surface 11, the selected side surface 13a, and the second main surface 12. Each of the plurality of connecting leads 2 extends from the first main surface 11 through the selected side surface 13a to the second main surface 12.

[0175] In this step, the material of the plurality of connecting leads 2 can be metal. On this basis, for example, please refer to Figure 20 , and this step S01 includes: S011 and S012.

[0176] S011. Form a metal layer on the first main surface 11, the selected side surface 13a, and the second main surface 12 of the circuit backplane.

[0177] Exemplarily, electroplating process, evaporation process, pad printing silver paste, sputtering process (such as multi-arc magnetron sputtering process), etc. can be used for the deposition of the metal layer to form a metal layer on the first main surface 11, the selected side surface 13a, and the second main surface 12 of the circuit backplane 1. The above processes are used to precipitate multiple layers of metal layers in sequence to obtain multiple layers of metal layers arranged in a stacked manner.

[0178] S012. Pattern the metal layer to obtain a plurality of connecting leads 2. Each of the plurality of connecting leads 2 passes through the selected side surface 13a and the second main surface 11 in sequence from the first main surface 11 of the circuit backplane 1.

[0179] In some examples, a laser etching process with higher process accuracy is used to pattern the metal layer to obtain a plurality of connecting leads 2.

[0180] Continue to refer to Figure 19 and structure Figures 7 to 10 .

[0181] S02. Form a second protective layer 5, and the second protective layer 5 covers the plurality of connecting leads 2.

[0182] The second protective layer 5 is OC (over coating) glue or an ink layer. In some examples, methods such as spraying process and deposition process can be used to form the second protective layer 5.

[0183] Exemplarily, the material of the second protective layer 5 is formed on the side of the plurality of connecting leads 2 away from the circuit backplane 1 by the deposition process, and at the same time on the gaps between the plurality of connecting leads 2 and the surface of the circuit backplane 1, so as to form a continuous and integral second protective layer 5 that covers the plurality of connecting leads 2 and a part of the first main surface 11, the selected side surface 13a, and a part of the second main surface 12.

[0184] In some embodiments, please refer to Figure 13 and Figure 21, the manufacturing method of the display panel further includes S001, and S5 to S7.

[0185] S001. Dispose a plurality of light-emitting devices 111 on the first main surface 11.

[0186] Exemplarily, this step S001 can be located between S02 and S2. The plurality of light-emitting devices 111 are used to achieve light-emitting display under the control of the circuit backplane.

[0187] S5. Form a first protective film covering the plurality of light-emitting devices 111, and the first protective film fills the gap regions between the plurality of light-emitting devices.

[0188] In some examples, the first protective film is formed by a lamination process. The lamination process can include a vacuum lamination process or a roll lamination process.

[0189] S6. Adopt a laser cutting process to cut the first protective film along the cutting position R on the first protective film to form a first protective layer 7.

[0190] In some examples, a UV ps (Picosecond) laser (picosecond ultraviolet laser) is used for laser cutting to ensure the cutting accuracy.

[0191] S7. Remove the reflective layer through predetermined process conditions.

[0192] The above-mentioned predetermined process conditions include at least one of applying an external force, heating, and light irradiation. When the reflective layer 3 is fixed by setting a viscosity-reducing adhesive layer 31, in some examples, the viscosity-reducing adhesive layer 31 is a thermal viscosity-reducing adhesive, then the above-mentioned predetermined process condition is heating, and by heating the viscosity-reducing adhesive layer 31, the viscosity of the viscosity-reducing adhesive layer 31 is rapidly reduced, so as to remove the viscosity-reducing adhesive layer 31 and the reflective layer 3 together. In other examples, the viscosity-reducing adhesive layer 31 is a UV viscosity-reducing adhesive, then the above-mentioned predetermined process condition is light irradiation, and by irradiating ultraviolet rays on the viscosity-reducing adhesive layer 31, the viscosity of the viscosity-reducing adhesive layer 31 can be rapidly reduced, so as to remove the viscosity-reducing adhesive layer 31 and the reflective layer 3 together.

[0193] In some embodiments, please refer to Figure 22 , the cutting position R is located on the side of the reflective layer 3 away from the selected side surface 13a, and in the direction perpendicular to the selected side surface 13a, the distance between the cutting position R and the reflective layer 3 is a preset value W.

[0194] Since during laser cutting, the heat generated by the laser beam will have a certain amount of outward expansion on the cutting dimension, therefore, when cutting the first protective layer 7, there is a distance of a preset value W between the cutting position R and the outer surface of the reflective layer 3. After cutting, the side surface of the first protective layer 7 can be flush with the surface of the light-blocking layer 6 on the side away from the selected side surface 13a. In some examples, the preset value W is approximately 0.2 mm. The above "approximately" includes the stated value and the average value within the acceptable deviation range of the specific value. The acceptable deviation range is, for example, 25% of 0.2 mm. For example, the preset value W is a value such as 0.18 mm, 0.2 mm, or 0.22 mm.

[0195] The display panel, its manufacturing method, the display device, and the tiled display device provided by some embodiments of the present disclosure can reduce the side taper of the front encapsulation film during laser cutting by providing a tearable reflective layer, thereby reducing the seam width. By providing a light-blocking layer, light leakage from the side and back of the display panel can be prevented, thereby improving the display effect. Moreover, providing a reflective layer and a light-blocking layer on the side of the display panel can also protect the side structure (such as connecting leads), avoiding the collision damage of the structure during the manufacturing process.

[0196] The above are only the specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure, thinking of changes or substitutions, should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A display panel, characterized in that, comprising: A circuit backplane, comprising: A first main surface configured to carry a plurality of light-emitting devices; A second main surface disposed opposite to the first main surface; and, A plurality of side surfaces connecting the first main surface and the second main surface; wherein at least one of the plurality of side surfaces is a selected side surface; A plurality of connection leads, each of the plurality of connection leads extending from the first main surface through the selected side surface to the second main surface; A barrier wall disposed between the plurality of light-emitting devices and the plurality of connection leads and configured to be prepared before the plurality of connection leads; A reflective layer covering the selected side surface and covering the portion of the plurality of connection leads located on the selected side surface; the reflective layer is configured to be removable under predetermined process conditions.

2. The display panel according to claim 1, characterized in that, The thickness of the reflective layer is H1, and H1 satisfies: 5μm ≤ H1 ≤ 20μm.

3. The display panel according to claim 1, characterized in that, The predetermined process conditions include at least one of applying an external force, heating, and light irradiation.

4. The display panel according to claim 1, characterized in that, An anti-adhesive layer is provided on the surface of the reflective layer on the side close to the selected side surface.

5. The display panel according to claim 4, characterized in that, The viscosity strength of the anti-adhesive layer is S, and S satisfies: 5gf / 25mm ≤ S ≤ 10gf / 25mm.

6. The display panel according to claim 4, characterized in that, The anti-adhesive layer comprises a heat-reducible adhesive or a UV-reducible adhesive.

7. The display panel according to any one of claims 1 to 6, characterized in that, further comprising: A light-blocking layer disposed on the side of the reflective layer close to the selected side surface; The light-blocking layer comprises a first portion, wherein the first portion is located on the selected side surface and covers the portion of the plurality of connection leads located on the selected side surface.

8. The display panel according to claim 7, characterized in that, The light-blocking layer further comprises a second portion; the second portion covers a part of the first main surface.

9. The display panel according to claim 8, characterized in that, The direction perpendicular to the boundary line connecting the first main surface and the selected side surface and parallel to the first main surface is the first direction; The length of the second portion in the first direction is a, and a satisfies: 50μm ≤ a ≤ 300μm.

10. The display panel according to claim 8, characterized in that, The light-blocking layer further comprises a third portion, the third portion is disposed at one end of the first portion away from the second portion, and the third portion covers at least a part of the second main surface.

11. The display panel according to claim 10, characterized in that, The direction perpendicular to the boundary line connecting the first main surface and the selected side surface and parallel to the first main surface is the first direction; The size of the third part along the first direction is b, and the size of the circuit backplane along the first direction is c, where b and c satisfy: 20μm ≤ b ≤ c.

12. The display panel according to claim 7, wherein, the optical density value OD of the light-blocking layer satisfies: OD ≥ 2.

13. The display panel according to claim 7, wherein, the material of the light-blocking layer includes at least one of thermoplastic polyurethane elastomer rubber and polyimide.

14. The display panel according to claim 7, wherein, the thickness of the light-blocking layer is H2, and H2 satisfies: 10μm ≤ H2 ≤ 100μm.

15. The display panel according to any one of claims 8 to 14, wherein, further comprising: a plurality of light-emitting devices located on the first main surface; a first protective layer located on the first main surface; the first protective layer covers the plurality of light-emitting devices and fills the gap regions between the plurality of light-emitting devices.

16. The display panel according to claim 15, wherein, the side surface of the first protective layer close to the selected side surface is substantially flush with the side surface of the light-blocking layer far from the selected side surface.

17. The display panel according to any one of claims 8 to 14, wherein, a first alignment mark is provided on the light-blocking layer, and a second alignment mark for alignment cooperation with the first alignment mark is provided on the circuit backplane.

18. The display panel according to claim 17, wherein, the first alignment mark is located on at least one of the first part, the second part, and the third part of the light-blocking layer.

19. The display panel according to claim 18, wherein, the first alignment mark includes at least two alignment holes, and the shape of the alignment holes is any one of circular holes, T-shaped holes, or cross-shaped holes.

20. The display panel according to any one of claims 1 to 6, wherein, further comprising: a second protective layer that covers the plurality of connection leads and fills the gap regions between the plurality of connection leads.

21. A display device, wherein, comprising: a display panel according to any one of claims 1 to 20; and, a driving circuit board located on the side where the second main surface of the circuit backplane is located; the driving circuit board is coupled to the circuit backplane through a plurality of connection leads.

22. A tiled display device, wherein, comprising: a plurality of display devices according to claim 21 that are tiled together.

23. A method for manufacturing a display panel, wherein, comprising: manufacturing a circuit backplane; the circuit backplane includes a first main surface and a second main surface that are oppositely arranged, and a plurality of side surfaces that connect the first main surface and the second main surface; the first main surface is configured to carry a plurality of light-emitting devices; at least one of the plurality of side surfaces is a selected side surface; manufacturing a retaining wall, the retaining wall being located between the plurality of light-emitting devices and the selected side surface; A plurality of connecting leads are formed on a side of the retaining wall on the first main surface away from the plurality of light-emitting devices, on the selected side surface, and on the second main surface; each connecting lead of the plurality of connecting leads extends from the first main surface through the selected side surface to the second main surface; A reflective layer covering the selected side surface is provided, and a portion of the plurality of connecting leads located on the selected side surface is covered; the reflective layer is configured to be removable under predetermined process conditions.

24. The method for manufacturing a display panel according to claim 23, wherein, further comprising: Providing a light-blocking layer covering at least the selected side surface; the light-blocking layer includes a first portion covering the selected side surface; The steps of providing the reflective layer covering the selected side surface and providing the light-blocking layer covering at least the selected side surface include: First, attaching the reflective layer to the first portion of the light-blocking layer, and then setting a side surface of the light-blocking layer away from the reflective layer to cover at least the selected side surface.

25. The method for manufacturing a display panel according to claim 24, wherein, The light-blocking layer further includes a second portion covering a part of the first main surface and a third portion covering at least a part of the second main surface; The step of setting a side surface of the light-blocking layer away from the reflective layer to cover at least the selected side surface, includes one of the following: First, attaching the first portion to the selected side surface, and then bending the second portion and the third portion so that the second portion covers a part of the first main surface and the third portion covers at least a part of the second main surface; Or, First, attaching the second portion to a part of the first main surface, then attaching the first portion to the selected side surface, and finally attaching the third portion to at least a part of the second main surface; Or, First, attaching the third portion to at least a part of the second main surface, then attaching the first portion to the selected side surface, and finally attaching the second portion to a part of the first main surface.

26. The method for manufacturing a display panel according to any one of claims 23 to 25, wherein, Before the step of providing the reflective layer covering the selected side surface, further comprising: Forming a second protective layer covering the plurality of connecting leads.

27. The method for manufacturing a display panel according to any one of claims 23 to 25, wherein, further comprising: Providing a plurality of light-emitting devices on the first main surface; Forming a first protective film covering the plurality of light-emitting devices, the first protective film filling a gap region between the plurality of light-emitting devices; Using a laser cutting process to cut the first protective film along a cutting position on the first protective film to form a first protective layer; Removing the reflective layer through the predetermined process conditions.

28. The method for manufacturing a display panel according to claim 27, wherein, The cutting position is located on a side of the reflective layer away from the selected side surface; in a direction perpendicular to the selected side surface, the distance between the cutting position and the reflective layer is a preset value.

29. The method for manufacturing a display panel according to claim 28, wherein, the preset value is approximately 0.2 mm.

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