Camera module and optical device

Abstract

The present embodiment relates to a camera module including: a first substrate; a second substrate spaced apart from the first substrate in an optical axis direction on the first substrate; an image sensor electrically connected to the second substrate; a housing arranged on the second substrate; and a passive element arranged between the first substrate and the second substrate, wherein the passive element is arranged at a position lower than a position of a lower end portion of the housing.

Description

Technical Field

[0001] This invention relates to camera modules and optical devices. Background Technology

[0002] With the widespread availability of various portable terminals and the commercialization of wireless internet services, consumer demand for portable terminals is also diversifying, leading to the installation of various types of add-ons in portable terminals.

[0003] Among these add-on devices is a camera module for capturing subjects as photographs or video images. Meanwhile, optical image stabilization (OIS) is applied to recent camera modules to correct for hand shakiness during shooting. Furthermore, with the enhancement of portable terminal functions and the increase in pixel count, the size of image sensors and the aperture of lenses are also increasing.

[0004] However, in conventional camera modules, the size of the image sensor increases with the number of pixels, and with the multilayer ceramic capacitors (MLCCs) electrically connected to the image sensor positioned above the second substrate of the chip-scale package (CSP), the back focal length (BFL) of the lens increases, resulting in an increase in the height of the camera module in the Z direction. The BFL of the lens refers to the distance between the image sensor and the upper surface of the lowermost lens among multiple lenses disposed in the lens holder, along with the optical axis.

[0005] In addition, in conventional camera modules, when multilayer ceramic capacitors (MLCCs) as passive components are mounted in the first substrate of a chip-scale package (CSP), there is a problem of increased size of the camera module in the X and Y directions because the passive components are placed outside the solder balls to avoid the solder balls between the first and second substrates. Summary of the Invention

[0006] Technical issues

[0007] This embodiment aims to provide a camera module including a chip-scale package (CSP), wherein passive components are disposed beneath a second substrate.

[0008] Technical solutions

[0009] The camera module according to this embodiment includes: a first substrate; a second substrate, the second substrate being spaced apart from the first substrate along the optical axis direction on the first substrate; an image sensor, the image sensor being electrically connected to the second substrate; a housing, the housing being disposed on the second substrate; and a passive element, the passive element being disposed between the first substrate and the second substrate, wherein the passive element may be disposed at a position lower than the lower end of the housing.

[0010] The camera module includes a plurality of first conductive components disposed between a first substrate and a second substrate and electrically connecting the first substrate and the second substrate, wherein passive components may be disposed between the plurality of first conductive components.

[0011] The first substrate includes a first side portion, a second side portion, a third side portion, and a fourth side portion. The first side portion and the second side portion are disposed on opposite sides of each other. The third side portion and the fourth side portion connect the first side portion and the second side portion and are disposed on opposite sides of each other. The plurality of first conductive members include a first unit conductive member to a third unit conductive member disposed between the first side portion of the first substrate and the image sensor. The passive element may include a first passive element and a second passive element. The first passive element is disposed between the first unit conductive member and the second unit conductive member, and the second passive element is disposed between the second unit conductive member and the third unit conductive member.

[0012] The camera module may include a second conductive member for electrically connecting the upper surface of the image sensor to the lower surface of the second substrate.

[0013] Passive components can overlap with the housing in the optical axis direction.

[0014] Passive components can overlap with the image sensor in a direction perpendicular to the optical axis.

[0015] Passive components can be designed not to overlap with the housing in a direction perpendicular to the optical axis.

[0016] The camera module may include: a lens holder disposed in a housing; a lens coupled to the lens holder; and a filter disposed in a second substrate and between the lens and the image sensor.

[0017] The camera module may include a reinforcing plate, which is attached to the lower surface of the first substrate.

[0018] The camera module according to this embodiment includes: a first substrate; a second substrate, the second substrate being spaced apart from the first substrate along the optical axis direction on the first substrate; an image sensor electrically connected to the second substrate; a housing disposed on the second substrate; a lens holder disposed inside the housing; a lens connected to the lens holder and disposed above the image sensor; and a passive element disposed between the first substrate and the second substrate, wherein the passive element may overlap with the lens holder in the optical axis direction.

[0019] The camera module according to this embodiment includes: a first substrate; a second substrate spaced apart from the first substrate in the optical axis direction; an image sensor disposed in the first substrate; a housing disposed on the second substrate; and a first adhesive member and a passive element disposed on the first substrate, wherein the passive element may be disposed at a position lower than the second substrate.

[0020] The passive components and the first adhesive component can be disposed between the first substrate and the second substrate.

[0021] A space is included between the first substrate and the second substrate, and the passive components and the first adhesive member can be accommodated in the space.

[0022] The housing can overlap with the passive component in the optical axis direction.

[0023] The first adhesive component can overlap with the housing in the optical axis direction.

[0024] The first adhesive component may include solder balls, and the first adhesive component may include multiple adhesive components, and passive components may be disposed between the multiple adhesive components.

[0025] The first adhesive member may include multiple adhesive members, and the multiple adhesive members may be disposed along the outer edge region of the first substrate.

[0026] The height of the first adhesive component in the optical axis direction can be higher than the height of the image sensor in the optical axis direction.

[0027] The second substrate includes: a first portion that overlaps with a passive element in the optical axis direction; and a second portion that extends from the first portion and does not overlap with the passive element in the optical axis direction, wherein the second portion of the second substrate can be coupled to an image sensor in a flip-chip manner.

[0028] The image sensor includes an effective image area, and a second portion of the second substrate may not overlap with the effective image area of ​​the image sensor in the optical axis direction.

[0029] The camera module according to this embodiment includes: a first substrate; a housing disposed on the first substrate; an image sensor disposed in the first substrate; a second substrate disposed inside the housing; and a first adhesive member and a passive element disposed in the first substrate, wherein the passive element may be disposed below the second substrate.

[0030] The passive components and the first adhesive component can be disposed between the first substrate and the second substrate.

[0031] The housing can be designed not to overlap with passive components in the optical axis direction.

[0032] The first adhesive component may include solder balls, and the first adhesive component may include multiple adhesive components, and passive components may be disposed between the multiple adhesive components.

[0033] The optical device according to this embodiment may include a camera module.

[0034] Beneficial effects

[0035] This embodiment provides a camera module including a chip-scale package (CSP), wherein passive components are disposed below a second substrate.

[0036] Furthermore, by placing the passive components located at the upper portion of the second substrate of a conventional CSP below the second substrate, the BFL of the lens can be minimized, and thereby the height of the camera module in the z-direction can be minimized.

[0037] In addition, by placing conventional passive components located outside the solder balls under the second substrate, the size of the camera module in the x and y directions can be minimized. Attached Figure Description

[0038] Figure 1 This is a cross-sectional view of the camera module according to this embodiment.

[0039] Figure 2 This is a bottom view of the camera module according to this embodiment.

[0040] Figure 3 This is a side view of some configurations of the camera module according to this embodiment.

[0041] Figure 4 This is a cross-sectional view of the camera module according to a modified embodiment of this embodiment. Detailed Implementation

[0042] In the following, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0043] However, the technical concept of the present invention is not limited to the embodiments described, but can be implemented in various forms, and within the scope of the technical concept of the present invention, one or more constituent elements can be selectively combined or substituted between embodiments.

[0044] Furthermore, unless explicitly defined and described, the terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having meanings that are commonly understood by those skilled in the art, and commonly used terms, such as those defined in dictionaries, may be interpreted in the context of the relevant art.

[0045] Furthermore, the terminology used in this specification is for describing embodiments and is not intended to limit the invention.

[0046] In this specification, unless specifically stated in the phrase, the singular form may include the plural form, and when described as “at least one (or more than one) of A, B and C”, it may include one or more of all combinations that can be combined with A, B and C.

[0047] Furthermore, when describing components of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended only to distinguish components from other components, and they do not limit the nature, order, or sequence of the components.

[0048] Furthermore, when a component is described as being “connected,” “linked,” or “interconnected” to another component, the component is not only directly connected, linked, or interconnected to another component, but may also include situations where the “connection,” “linking,” or “interconnection” is made due to another component between other components.

[0049] Additionally, when described as being formed or arranged "above" or "below" each component, "above" or "below" means not only that the two components are in direct contact, but also that one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below," it can include not only the meaning of an upward direction based on a component, but also the meaning of a downward direction based on a component.

[0050] As used below, “optical axis direction” is defined as the optical axis direction of the lens and / or image sensor connected to the lens drive device.

[0051] In the following text, "vertical direction" can refer to a direction parallel to the optical axis. The vertical direction can correspond to the "z-axis direction." In the following text, "horizontal direction" can refer to a direction perpendicular to the vertical direction. That is, the horizontal direction can be perpendicular to the optical axis. Therefore, the horizontal direction can include both the "x-axis direction" and the "y-axis direction."

[0052] In the following description, the configuration of the camera module according to this embodiment will be described with reference to the accompanying drawings.

[0053] Figure 1 This is a cross-sectional view of the camera module according to this embodiment; Figure 2 This is a bottom view of the camera module according to this embodiment; and Figure 3This is a side view of some configurations of the camera module according to this embodiment.

[0054] The camera module 10 may include a first substrate 110. The first substrate 110 may be a printed circuit board (PCB). The first substrate 110 may be a flexible printed circuit board (FPCB). An image sensor 140 may be disposed in the first substrate 110. The image sensor 140 may be mounted on the upper surface of the first substrate 110. The length of the first substrate 110 in the direction perpendicular to the optical axis may be longer than the length of the image sensor 140 in the corresponding direction. A reinforcing plate 111 may be disposed in the first substrate 110. The reinforcing plate 111 may be disposed on the lower surface of the first substrate 110. A first adhesive member 180 may be disposed in the first substrate 110. The first adhesive member 180 may be disposed on the upper surface of the first substrate 110. A passive element 130 may be disposed in the first substrate 110. The passive element 130 may be disposed on the upper surface of the first substrate 110. The outer edge of the first substrate 110 may be positioned in the optical axis direction at a position corresponding to the outer edge of the second substrate 120.

[0055] The first substrate 110 may include a reinforcing plate 111. The reinforcing plate 111 may be disposed below the first substrate 110. The reinforcing plate 111 may be disposed on the lower surface of the first substrate 110. The reinforcing plate 111 may be coupled to the lower surface of the first substrate 110. The reinforcing plate 111 may include a metallic material. The reinforcing plate 111 may support the thin and flexible first substrate 110 so as not to deform.

[0056] Camera module 10 may include a second substrate 120. The second substrate 120 may include a printed circuit board (PCB). The second substrate 120 may include a rigid PCB. The second substrate 120 may be spaced apart from the first substrate 110 in the optical axis direction. The second substrate 120 may overlap with at least a portion of the first substrate 110 in the optical axis direction. The second substrate 120 may be configured to be closer to the outer edge region of the first substrate 110 relative to the central region of the first substrate 110. The first substrate 110 may be spaced apart from the image sensor 140 in the optical axis direction. At least a portion of the second substrate 120 may overlap with the image sensor 140 in the optical axis direction. The second substrate 120 may overlap with the outer edge region of the image sensor 140 in the optical axis direction. The second substrate 120 may be configured to avoid the light-receiving portion of the image sensor 140. The second substrate 120 may not overlap with the light-receiving portion of the image sensor 140 in the optical axis direction. The second substrate 120 may be disposed on the first substrate 110. The second substrate 120 may be disposed above the first substrate 110.

[0057] The second substrate 120 may include a first portion and a second portion. The first portion overlaps with the passive element 130 in the optical axis direction, and the second portion extends from the first portion and does not overlap with the passive element 130 in the optical axis direction. At least a portion of the first portion of the second substrate 120 may overlap with the housing 150 in the optical axis direction. At least a portion of the first portion may protrude further outward than the housing 150. The second portion of the second substrate 120 may be flip-chip bonded to the image sensor 110. The second portion of the second substrate 120 may not overlap with the housing 150 in the optical axis direction. The second portion of the second substrate 120 may overlap with the lens holder 160 in the optical axis direction. The second portion of the second substrate 120 may overlap with the filter 170 in the optical axis direction. The second portion of the second substrate 120 may not overlap with the effective image area of ​​the image sensor 140 in the optical axis direction. The second portion of the second substrate 120 may protrude inward than the housing 150.

[0058] A first adhesive member 180 may be disposed in the second substrate 120. The first adhesive member 180 may be disposed on the lower surface of the second substrate 120. The first adhesive member 180 may be attached to the lower surface of the second substrate 120. At least a portion of the second substrate 120 may be disposed above the image sensor 140. A second adhesive member 190 may be disposed in the second substrate 120. The second adhesive member 190 may be disposed on the lower surface of the second substrate 120. The second adhesive member 190 may be disposed between the second substrate 120 and the image sensor 140. A passive element 130 may be disposed in the second substrate 120. The passive element 130 may be disposed on the lower surface of the second substrate 120. The passive element 130 may be fixed to the lower surface of the second substrate 120.

[0059] The first adhesive member 180 may be a first conductive member. The first conductive member can electrically connect the first substrate 110 to the second substrate 120. The first conductive member may include solder. The first conductive member may include conductive epoxy resin. The second adhesive member 190 may be a second conductive member. The second conductive member can electrically connect the second substrate 120 to the image sensor 140. The second conductive member may include solder. The second conductive member may include conductive epoxy resin.

[0060] A housing 150 may be disposed in the second substrate 120. The housing 150 may be connected to the second substrate 120. The housing 150 may be disposed on the upper surface of the second substrate 120. A filter 170 may be disposed in the second substrate 120. The filter 170 may be disposed on the upper surface of the second substrate 120.

[0061] Camera module 10 may include a passive element 130. Passive element 130 may include a multilayer ceramic capacitor (MLCC). Passive element 130 may be electrically connected to image sensor 140. Passive element 130 may be disposed in a first substrate 110. Passive element 130 may be disposed on the upper surface of the first substrate 110. Passive element 130 may be disposed in the outer edge region of the first substrate 110. Passive element 130 may be disposed in a second substrate 120. Passive element 130 may be disposed on the lower surface of the second substrate 120. Passive element 130 may be disposed between the first substrate 110 and the second substrate 120. Passive element 130 may be disposed further outward on the first substrate 110 than image sensor 140. Passive element 130 may be accommodated in the space between the first substrate 110 and the second substrate 120.

[0062] The passive component 130 may include a device portion 131 and solder 132 connected to the device portion 131. The solder 132 may include multiple solders 132. The solder 132 may include two types of solders 132. The solder 132 may be connected to both sides of the device unit 131. The solder 132 may be secured by contacting the upper surface of the first substrate 110. The solder 132 may secure the device portion 131 to the first substrate 110. The solder 132 may contact the lower surface of the second substrate 120. The solder 132 may secure the device portion 131 to the second substrate 120.

[0063] The passive component 130 can overlap with the housing 150 in the optical axis direction. The solder portion of the passive component 130 can overlap with the housing 150 in the optical axis direction. At least a portion of the device portion 131 of the passive component 130 can overlap with the housing 150 in the optical axis direction. Thus, the housing 150, the second substrate 120, the passive component 130, and the first substrate 110 can function as a support structure. That is, this support structure can withstand external impacts. Furthermore, due to the rigid passive component, the tilt of the camera module 10 can be minimized.

[0064] The passive element 130 can be disposed between a plurality of first adhesive members 180. In a conventional camera module, the passive element 130 is disposed at the upper portion of the second substrate 120, and only solder balls are disposed between the first substrate 110 and the second substrate 120. However, in the camera module 10 according to this embodiment, the passive element 130 is disposed below the second substrate 120. For this purpose, a portion of the first adhesive members 180 disposed between the first substrate 110 and the second substrate 120 is replaced by the passive element 130, so that the passive element 130 can be disposed between a plurality of first adhesive members 180. As a result, the height of the camera module 10 in the z-axis direction can be minimized. In addition, the dimensions of the camera module 10 in the x-axis and y-axis directions can be minimized.

[0065] The height of the passive element 130 in the optical axis direction can be greater than the height of the image sensor 140 in the optical axis direction. If the height of the passive element 130 in the optical axis direction is too low, the space where the image sensor 140 is disposed may become narrower. Conversely, if the height of the passive element 130 in the optical axis direction is too high, the total height of the camera module 10 may increase when the housing 150 is disposed on the second substrate 120 attached to the passive element 130. Therefore, the height of the passive element 130 can be configured to maintain a minimum height for the camera module 10 while ensuring sufficient space for the image sensor 140 to be disposed therein.

[0066] The first substrate 110 may include a first side and a second side disposed opposite to each other, and a third side and a fourth side connecting the first side and the second side and disposed opposite to each other. A plurality of first conductive members may include a first unit conductive member to a third unit conductive member disposed between the first side of the first substrate 110 and the image sensor 140. A passive element 130 may include a first passive element and a second passive element, the first passive element being disposed between the first unit conductive member and the second unit conductive member, and the second passive element being disposed between the second unit conductive member and the third unit conductive member. The passive element 130 may be disposed between the image sensor 140 and the first side of the first substrate 110. The passive element 130 may be disposed between the image sensor 140 and the second side of the first substrate 110. The passive element 130 may be disposed between the image sensor 140 and the third side of the first substrate 110. The passive element 130 may be disposed between the image sensor 140 and the fourth side of the first substrate 110.

[0067] Camera module 10 may include image sensor 140. Image sensor 140 may have a configuration in which light passing through lens 161 and filter 170 is incident to form an image. Image sensor 140 may be mounted on first substrate 110. Image sensor 140 may be electrically connected to first substrate 110. For example, image sensor 140 may be connected to first substrate 110 via surface mount technology (SMT). As another example, image sensor 140 may be connected to first substrate 110 via flip chip technology. Image sensor 140 may be configured such that lens 161 is aligned with the optical axis. That is, the optical axis of image sensor 140 and the optical axis of lens 161 may be aligned. Image sensor 140 may convert light incident on an effective image area of ​​image sensor 140 into an electrical signal. Image sensor 140 may be any of charge-coupled device (CCD), metal-oxide-semiconductor (MOS), CPD, and CID. Image sensor 140 may be electrically connected to passive element 130.

[0068] Image sensor 140 may be disposed below second substrate 120. Image sensor 140 may be coupled to second substrate 120. Image sensor 140 may be coupled to second substrate 120 via flip-chip technology. Image sensor 140 may be spaced apart from second substrate 120 in the optical axis direction. Image sensor 140 may overlap with at least a portion of second substrate 120 in the optical axis direction. The effective image area of ​​image sensor 140 may not overlap with second substrate 120 in the optical axis direction. Image sensor 140 may be disposed on first substrate 110. Image sensor 140 may be disposed in second substrate 120. Image sensor 140 may be electrically connected to second substrate 120. Image sensor 140 may be disposed between first substrate 110 and second substrate 120.

[0069] The camera module 10 may include a housing 150. The housing 150 may be disposed within the second substrate 120. The housing 150 may be attached to the upper surface of the second substrate 120. The housing 150 may be spaced apart from the first substrate 110 in the optical axis direction. The housing 150 may overlap with the light-receiving element in the optical axis direction. The housing 150 may overlap with the first adhesive member 180 in the optical axis direction. Thus, the housing 150, the second substrate 120, the passive element 130, and the first substrate 110 can function as a support structure. That is, this support structure can withstand external impacts. The housing 150 may be a covering member. The housing 150 may be a cover. The housing 150 may be a shielding member. The housing 150 may be a shield.

[0070] Lens holder 160 may be disposed inside housing 150. At least a portion of lens holder 160 may be disposed inside housing 150. Housing 150 may be coupled to lens holder 160. Housing 150 may be threadedly coupled to lens holder 160. In this case, the inner circumferential surface of housing 150 may include a threaded shape. As a modified embodiment, housing 150 may be coupled to lens holder 160 without threads. In this case, the inner circumferential surface of housing 150 may not include threads. Filter 170 may be disposed inside housing 150.

[0071] Camera module 10 may include a lens holder 160. The lens holder 160 may be a lens barrel. The lens holder 160 may be disposed inside housing 150. At least a portion of the lens holder 160 may be disposed inside housing 150. The lens holder 160 may be coupled to housing 150. The lens holder 160 may be threaded to housing 150. In this case, the outer peripheral surface of the lens holder 160 may include a threaded shape. As a modified embodiment, the lens holder 160 may be coupled to housing 150. In this case, the outer peripheral surface of the lens holder 160 may not include threads. The lens holder 160 may house a lens. The lens holder 160 may have a plurality of lenses 161 disposed therein. The lenses 161 may be disposed at positions corresponding to image sensor 140.

[0072] Camera module 10 may include a filter 170. The filter 170 can be used to block light of a specific frequency band from entering the image sensor 140 after passing through lens 161. The filter 170 may be configured parallel to the xy plane. The filter 170 may be disposed between lens 161 and image sensor 140. The filter 170 may include an infrared filter. The infrared filter can block light in the infrared region from entering the image sensor 140. The filter 170 may be disposed in the second substrate 120. The filter 170 may be coupled to the upper surface of the second substrate 120.

[0073] Camera module 10 may include a first adhesive member 180. The first adhesive member 180 may be conductive. The first adhesive member 180 may include a conductive member. The first adhesive member 180 may be disposed in the first substrate 110. The first adhesive member 180 may be disposed on the first substrate 110. The first adhesive member 180 may be disposed on the upper surface of the first substrate 110. The first adhesive member 180 may be attached to the upper surface of the first substrate 110. The first adhesive member 180 may include a plurality of first adhesive members 180. The plurality of first adhesive members 180 may be spaced apart from each other. The first adhesive member 180 may be disposed on the outer edge region of the first substrate 110. The first adhesive member 180 may be disposed on the first substrate 110 further outward than the image sensor 140. Passive element 130 may be disposed among the plurality of first adhesive members 180. The first adhesive members 180 may be disposed along the outer edge of the first substrate 110.

[0074] The first adhesive member 180 may be disposed in the second substrate 120. The first adhesive member 180 may be disposed on the lower surface of the second substrate 120. The first adhesive member 180 may be attached to the lower surface of the second substrate 120. The first adhesive member 180 may be disposed between the first substrate 110 and the second substrate 120. The first adhesive member 180 can separate the first substrate 110 and the second substrate 120 from each other. The first adhesive member 180 can separate the first substrate 110 and the second substrate 120 from each other in the optical axis direction. The height of the first adhesive member 180 in the optical axis direction may be greater than the height of the image sensor 140 in the optical axis direction. If the height of the first adhesive member 180 in the optical axis direction is too low, the space in which the image sensor 140 is disposed may become narrower. Furthermore, if the height of the first adhesive member 180 in the optical axis direction is too high, the total height of the camera module 10 will increase. Therefore, the height of the first adhesive member 180 can be configured to maintain a minimum height of the camera module 10 while ensuring space for the image sensor 140 to be disposed therein. The first adhesive member 180 can be accommodated in the space between the first substrate 110 and the second substrate 120.

[0075] The first adhesive member 180 may overlap with the housing 150 in the optical axis direction. The first adhesive member 180 may overlap with at least a portion of the housing 150 in the optical axis direction. Therefore, the first adhesive member 180 may include solder. The first adhesive member 180 may include solder balls.

[0076] The camera module 10 may include a second adhesive member 190. The second adhesive member 190 may be conductive. The second adhesive member 190 may include a conductive member with conductivity. The second adhesive member 190 may be a flip-chip bonding assembly. The second adhesive member 190 may be disposed on the lower surface of the second substrate 120. The second adhesive member 190 may be disposed on the upper surface of the image sensor 140. The second adhesive member 190 may be disposed between the image sensor 140 and the second substrate 120. The second adhesive member 190 can fix the image sensor 140 and the second substrate 120.

[0077] The camera module may include a third adhesive member (not shown). The third adhesive member may include a side filler. The third adhesive member may be disposed between the first substrate 110 and the second substrate 120. The third adhesive member may be disposed adjacent to the outer surface of the first substrate 110 and the second substrate 120. The third adhesive member may be disposed outside the passive element 130. The third adhesive member may be disposed outside the first adhesive member 180. This seals the open area between the first substrate 110 and the second substrate 120. This prevents foreign matter from entering the gaps between the first substrate 110, the second substrate 120, the first adhesive member 180, and the passive element 130.

[0078] In the camera module 10 according to this embodiment, components such as active components and driver ICs, in addition to passive components 130, can be mounted between the first substrate 110 and the second substrate 120.

[0079] In the following description, the configuration of the camera module according to the modified embodiment will be described with reference to the accompanying drawings. Except for the connection point between the camera module 20 and the housing 150 according to this embodiment, the camera module 20 according to the modified embodiment can be constructed identically. In the following description, the configuration identical to that of the camera module 10 according to this embodiment may be omitted for the camera module 20 according to the modified embodiment.

[0080] Figure 4 This is a cross-sectional view of the camera module according to a modified embodiment of this embodiment.

[0081] According to a modified embodiment, the camera module 20 may include a housing 150. The housing 150 may be coupled to a first substrate 110. In this case, the third adhesive member may be omitted. The housing 150 may be disposed on the outer surface of a second substrate 120. The housing 150 may not overlap with the passive element 130 in the optical axis direction. The housing 150 may not overlap with the first adhesive member 180 in the optical axis direction. The housing 150 may be disposed outside the first adhesive member 180. The housing 150 may be disposed outside the passive element 130. The housing 150 may be disposed outside the second substrate 120. In this case, the second substrate 120 may be disposed inside the housing 150. The first adhesive member 180 may be disposed inside the housing 150. The passive element 130 may be disposed inside the housing 150.

[0082] Although embodiments of the invention have been described above with reference to the accompanying drawings, it will be understood by those skilled in the art that the invention can be implemented in other specific forms without altering its technical spirit or essential characteristics. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

Claims

1. A camera module, comprising: First substrate; A second substrate is disposed on the first substrate and spaced apart from the first substrate in the optical axis direction; An image sensor, which is electrically connected to the second substrate; A housing, the housing being disposed on the second substrate; A passive component is disposed between the first substrate and the second substrate; as well as A plurality of first conductive components are disposed between the first substrate and the second substrate and electrically connect the first substrate and the second substrate. The passive component is positioned below the lower end of the housing. The first substrate includes a first side portion, a second side portion, a third side portion, and a fourth side portion. The first side portion and the second side portion are configured opposite to each other. The third side portion and the fourth side portion connect the first side portion and the second side portion and are configured opposite to each other. The plurality of first conductive components include a first unit conductive component, a second unit conductive component, and a third unit conductive component disposed between the first side portion of the first substrate and the image sensor. The passive component includes a first passive component and a second passive component. The first passive component is disposed between the first unit conductive component and the second unit conductive component, and the second passive component is disposed between the second unit conductive component and the third unit conductive component.

2. The camera module according to claim 1, wherein, Each of the plurality of first conductive components includes solder.

3. The camera module according to claim 1, wherein, The camera module includes a filter disposed on the second substrate, wherein the second substrate includes a hole disposed between the filter and the image sensor.

4. The camera module according to claim 1, comprising a second conductive member, the second conductive member electrically connecting the upper surface of the image sensor to the lower surface of the second substrate.

5. The camera module according to claim 4, wherein, The passive element overlaps with the housing in the optical axis direction.

6. The camera module according to claim 1, wherein, The passive element overlaps with the image sensor in a direction perpendicular to the optical axis.

7. The camera module according to claim 1, wherein, The passive element does not overlap with the housing in a direction perpendicular to the optical axis.

8. The camera module according to claim 1, comprising: A lens retainer, wherein the lens retainer is disposed in the housing; A lens, which is connected to the lens holder; as well as A filter is disposed on the second substrate and between the lens and the image sensor.

9. The camera module according to claim 1, wherein, The camera module includes a reinforcing plate that is connected to the lower surface of the first substrate.

10. The camera module according to claim 1, wherein, In the direction of the optical axis, the thickness of the passive element is greater than the thickness of the image sensor.

11. The camera module according to claim 1, wherein, The passive element and the first conductive member are disposed along the edge of the upper surface of the first substrate.

12. The camera module according to claim 8, wherein, The filter does not overlap with the passive element in the direction of the optical axis.

13. The camera module according to claim 8, wherein, The filter overlaps with the housing in a direction perpendicular to the optical axis.

14. The camera module according to claim 8, wherein, The lens includes multiple lenses, the multiple lenses including the uppermost lens, and The uppermost lens is positioned above the upper end of the housing.

15. The camera module according to claim 1, wherein, The passive element includes a third passive element, which is opposite to the first passive element with respect to the image sensor, and In a direction perpendicular to the optical axis, the image sensor is disposed between the first passive element and the third passive element.

16. A camera module, comprising: First substrate; The second substrate is on the first substrate and is spaced apart from the first substrate along the optical axis; An image sensor, which is electrically connected to the second substrate; A housing, wherein the housing is disposed on the first substrate; A lens retainer, wherein the lens retainer is disposed in the housing; A lens, which is coupled to the lens holder and disposed on the image sensor; A passive component is disposed between the first substrate and the second substrate; as well as A plurality of first conductive components are disposed between the first substrate and the second substrate and electrically connect the first substrate and the second substrate. The passive element overlaps with the lens holder in the optical axis direction. The first substrate includes a first side portion, a second side portion, a third side portion, and a fourth side portion. The first side portion and the second side portion are configured opposite to each other. The third side portion and the fourth side portion connect the first side portion and the second side portion and are configured opposite to each other. The plurality of first conductive components include a first unit conductive component, a second unit conductive component, and a third unit conductive component disposed between the first side portion of the first substrate and the image sensor. The passive component includes a first passive component and a second passive component. The first passive component is disposed between the first unit conductive component and the second unit conductive component, and the second passive component is disposed between the second unit conductive component and the third unit conductive component.

17. The camera module according to claim 16, wherein, The passive element overlaps with the housing in a direction perpendicular to the optical axis.

18. The camera module according to claim 16, wherein, The image sensor overlaps with the housing in a direction perpendicular to the optical axis.

19. A camera module, comprising: First substrate; A second substrate is disposed on the first substrate and spaced apart from the first substrate in the optical axis direction; An image sensor, which is electrically connected to the second substrate; A lens holder, wherein the lens holder is disposed on the second substrate; A passive component is disposed between the first substrate and the second substrate; as well as A plurality of first conductive components are disposed between the first substrate and the second substrate and electrically connect the first substrate and the second substrate. The first substrate includes a first side portion, a second side portion, a third side portion, and a fourth side portion. The first side portion and the second side portion are configured opposite to each other. The third side portion and the fourth side portion connect the first side portion and the second side portion and are configured opposite to each other. The plurality of first conductive components include a first unit conductive component, a second unit conductive component, and a third unit conductive component disposed between the first side portion of the first substrate and the image sensor. The passive component includes a first passive component and a second passive component. The first passive component is disposed between the first unit conductive component and the second unit conductive component, and the second passive component is disposed between the second unit conductive component and the third unit conductive component.

20. An optical device comprising a camera module according to any one of claims 1 to 19.

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