Line identification module and display device

Abstract

The display device comprises a substrate, a photosensitive device layer located on the substrate, the photosensitive device layer comprising a plurality of photosensitive devices, a bias metal layer and a noise reduction metal layer arranged in sequence on a side of the photosensitive device layer away from the substrate, a light guide film layer comprising at least two light shielding layers stacked, each light shielding layer having light transmission holes arranged in an array, the light transmission holes in each light shielding layer corresponding one by one and at least partially overlapping in orthographic projection on the substrate, the orthographic projection of the corresponding light transmission holes on the substrate being located within the orthographic projection of the photosensitive devices on the substrate, and the light shielding layer adjacent to the photosensitive device layer being arranged in the same layer as at least one of the bias metal layer and the noise reduction metal layer, and a microlens layer located on a side of the light guide film layer away from the photosensitive device layer, the microlens layer comprising a plurality of microlenses, the orthographic projection of the microlenses on the substrate covering and being larger than the orthographic projection of the light transmission holes on the substrate.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a texture recognition module and display device. Background Technology

[0002] With the rapid development of the information industry, biometric technology has been used more and more widely. In particular, since different users have different fingerprints, it is easy to verify user identity. Therefore, fingerprint recognition technology has been widely used in mobile terminals, smart homes and other fields to provide security for user information.

[0003] Optical fingerprint recognition is one method of fingerprint identification. The principle of optical fingerprint recognition is as follows: When a finger is placed above a display product, the light emitted by the light source within the display product illuminates the valleys and ridges of the finger. After reflection from these points, the light then strikes the photosensitive device within the display product. Because the light intensity reflected from the valleys and ridges differs, the photosensitive device generates different electrical signals based on these differences, thus achieving fingerprint recognition. Summary of the Invention

[0004] The texture recognition module and display device provided in this disclosure are as follows:

[0005] On one hand, embodiments of this disclosure provide a texture recognition module, including:

[0006] Substrate;

[0007] A photosensitive device layer is located on the substrate, and the photosensitive device layer includes a plurality of photosensitive devices;

[0008] A bias metal layer is located on the side of the photosensitive device layer that is away from the substrate.

[0009] A noise-reducing metal layer is located on the side of the bias metal layer that is away from the photosensitive device layer;

[0010] The light guide film layer includes at least two stacked light-shielding layers, each of the light-shielding layers having light-transmitting holes arranged in an array, the light-transmitting holes in each of the light-shielding layers being one-to-one and their orthogonal projections on the substrate at least partially overlapping, the orthogonal projections of the corresponding light-transmitting holes on the substrate being located within the orthogonal projection of the photosensitive device on the substrate, and the light-shielding layer adjacent to the photosensitive device layer being disposed in the same layer as at least one of the bias metal layer and the noise reduction metal layer;

[0011] A microlens layer is located on the side of the light guide film layer opposite to the photosensitive device layer. The microlens layer includes a plurality of microlenses, the orthogonal projection of which covers and is larger than the orthogonal projection of the light-transmitting hole on the substrate.

[0012] Optionally, in the texture recognition module provided in the embodiments of this disclosure, the aperture of the light-transmitting hole correspondingly provided in each of the light-shielding layers increases sequentially in the direction away from the photosensitive device layer.

[0013] Optionally, in the texture recognition module provided in the embodiments of this disclosure, the centers of the light-transmitting holes in each of the light-shielding layers coincide on the orthographic projection of the light on the substrate.

[0014] Optionally, in the texture recognition module provided in the embodiments of this disclosure, the light guide film layer includes a first light-shielding layer, a first light-transmitting layer, a second light-shielding layer, a second light-transmitting layer, a third light-shielding layer, and a third light-transmitting layer sequentially stacked on the photosensitive device layer; wherein,

[0015] The first light-shielding layer includes an array of first light-transmitting holes, the second light-shielding layer includes an array of second light-transmitting holes, and the third light-shielding layer includes an array of third light-transmitting holes.

[0016] Optionally, in the texture recognition module provided in the embodiments of this disclosure, the first light-shielding layer and the bias metal layer are reused.

[0017] Optionally, in the texture recognition module provided in the embodiments of this disclosure, the first light-shielding layer and the noise-reducing metal layer are of the same layer and the same material.

[0018] Optionally, in the texture recognition module provided in the embodiments of this disclosure, the first light-shielding layer and the bias metal layer are reused, and the second light-shielding layer and the noise-reducing metal layer are in the same layer and made of the same material.

[0019] Optionally, in the texture recognition module provided in the embodiments of this disclosure, the light guide film layer and the microlens satisfy the following relationship:

[0020] L=h+h1+h2+h3+h x1 +h x2 ;

[0021]

[0022] W0 = L * tanθ;

[0023] (W1-W0) / (2h1)≤(W2-W1) / [2(h2+h x1 )]≤(W3-W2) / [2(h3+h x2 )];

[0024] Where L is the distance between the upper surface of the microlens and the first light-shielding layer; θ is the light-receiving angle; K is a specific coefficient related to the microlens; W0 is the aperture of the first light-transmitting hole; W1 is the aperture of the second light-transmitting hole; W2 is the aperture of the third light-transmitting hole; W3 is the aperture of the microlens; h1 is the thickness of the first light-transmitting layer; h2 is the thickness of the second light-transmitting layer; h3 is the thickness of the third light-transmitting layer; h x1 h is the thickness of the second light-shielding layer. x2 The thickness of the third light-shielding layer.

[0025] Optionally, in the texture recognition module provided in the embodiments of this disclosure, 1°≤θ≤10°, 2μm≤W0≤10μm, 4μm≤W1≤15μm, 6μm≤W2≤18μm, 10μm≤W3≤30μm, 1μm≤h1≤10μm, 1μm≤h2≤5μm, 1μm≤h3≤10μm, 1μm≤h x1 ≤2μm, 1μm≤h x2 ≤2μm.

[0026] Optionally, in the texture recognition module provided in the embodiments of this disclosure, each photosensitive device includes at least one independent sub-photosensitive device, and the sub-photosensitive device includes a first electrode, a photoelectric conversion layer and a second electrode stacked together;

[0027] The sub-photosensitive devices are arranged in a one-to-one correspondence with the microlenses, and the orthogonal projection of the photoelectric conversion layer on the substrate is located within the orthogonal projection of the corresponding microlens on the substrate.

[0028] Optionally, the texture recognition module provided in the embodiments of this disclosure further includes a plurality of pixel driving circuits and a plurality of connection electrodes located between the photosensitive device layer and the substrate.

[0029] Each photosensitive device includes multiple independent sub-photosensitive devices, wherein the first electrode and the connecting electrode are disposed on the same layer, and the first electrodes of all the sub-photosensitive devices are electrically connected to the pixel driving circuit through the connecting electrode, and the second electrodes of all the sub-photosensitive devices are electrically connected to the bias metal layer respectively.

[0030] Optionally, in the texture recognition module provided in the embodiments of this disclosure, the bias metal layer includes multiple bias lines, each bias line includes a main body extending along the column direction and multiple protrusions on the same side of the main body, and each protrusion is electrically connected to each of the second electrodes in one of the photosensitive devices.

[0031] Optionally, in the texture recognition module provided in the embodiments of this disclosure, the pixel driving circuit includes: a reset transistor, an amplifying transistor, and a readout transistor, wherein the reset transistor and the readout transistor are dual-gate transistors.

[0032] Optionally, in the texture recognition module provided in the embodiments of this disclosure, the distance between the surface of the substrate facing the photosensitive device layer and the vertex of the microlens is greater than or equal to 30 μm and less than or equal to 50 μm.

[0033] On the other hand, this disclosure provides a display device including the texture recognition module provided in this disclosure and a display module located on the texture recognition module, wherein the display module and the texture recognition module are fixed together by optical adhesive.

[0034] Optionally, in the display device provided in the embodiments of this disclosure, the orthographic projection of the texture recognition module on the plane where the display device is located approximately coincides with the orthographic projection of the display module on the plane where the display device is located, and the optical adhesive is located in the border area of ​​the display module.

[0035] Optionally, in the display device provided in the embodiments of this disclosure, the display module includes an organic electroluminescent display panel, a heat dissipation film disposed on a side away from the display surface of the organic electroluminescent display panel, and a middle frame located on the side of the heat dissipation film away from the organic electroluminescent display panel. The heat dissipation film includes a hollow structure, the texture recognition module is disposed in the hollow structure, and the texture recognition module is fixed to the middle frame by the optical adhesive. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the structure of a texture recognition module provided in an embodiment of the present disclosure;

[0037] Figure 2 In order to include Figure 1 A schematic diagram of a cross-sectional structure along line I-II in the display device of the texture recognition module shown;

[0038] Figure 3 In order to include Figure 1 A schematic diagram of another cross-sectional structure along line I-II in the display device of the texture recognition module shown;

[0039] Figure 4 In order to include Figure 1 A schematic diagram of another cross-sectional structure along line I-II in the display device of the texture recognition module shown;

[0040] Figure 5 Collimated optical path diagram provided for embodiments of this disclosure;

[0041] Figure 6 for Figure 5 The curve of the collection angle versus transmittance of the collimated optical path is shown.

[0042] Figure 7 for Figure 5 The image shows the fingerprint recognition effect of the collimated optical path.

[0043] Figure 8 This is a schematic diagram of the structure of a texture recognition module provided in an embodiment of the present disclosure;

[0044] Figure 9 In order to include Figure 8 A schematic diagram of a cross-sectional structure along line I'-II' in the display device of the texture recognition module shown;

[0045] Figure 10 In order to include Figure 8 A schematic diagram of another cross-sectional structure along line I'-II' in the display device of the texture recognition module shown;

[0046] Figure 11 In order to include Figure 8 A schematic diagram of another cross-sectional structure along line I'-II' in the display device of the texture recognition module shown;

[0047] Figure 12 This is a schematic diagram of a photosensitive device with nine microlenses provided in this disclosure;

[0048] Figure 13 This is a schematic diagram of a photosensitive device corresponding to sixteen microlenses provided in this disclosure;

[0049] Figure 14 for Figure 1 The fingerprint recognition effect diagram of the pattern recognition module shown;

[0050] Figure 15 for Figure 1 The graph shows the fingerprint signal quantity of the fingerprint recognition module.

[0051] Figure 16 for Figure 8 The fingerprint recognition effect diagram of the pattern recognition module shown;

[0052] Figure 17 for Figure 8 The graph shows the fingerprint signal quantity of the fingerprint recognition module.

[0053] Figure 18 for Figure 12 The fingerprint recognition effect diagram of the pattern recognition module shown;

[0054] Figure 19 for Figure 12 The graph shows the fingerprint signal quantity of the fingerprint recognition module.

[0055] Figure 20 for Figure 13 The fingerprint recognition effect diagram of the pattern recognition module shown;

[0056] Figure 21 for Figure 13 The graph shows the fingerprint signal quantity of the fingerprint recognition module.

[0057] Figure 22 for Figure 15 , Figure 17 , Figure 19 and Figure 21 The normalized curve of the fingerprint signal quantity of the fingerprint recognition module is shown.

[0058] Figure 23 for Figure 1 The diagram shows the stacked structure of a pixel region in the fingerprint recognition module.

[0059] Figure 24 for Figure 23 A schematic diagram of the active layer structure;

[0060] Figure 25 for Figure 23 Schematic diagram of the structure of the middle gate metal layer;

[0061] Figure 26 for Figure 23 Schematic diagram of the structure of the middle gate insulating layer and the interlayer dielectric layer;

[0062] Figure 27 for Figure 23 Schematic diagram of the structure of the central source drain metal layer;

[0063] Figure 28 for Figure 23 A schematic diagram of the structure of the first insulating layer;

[0064] Figure 29 for Figure 23 Schematic diagram of the structure of the first flat layer;

[0065] Figure 30 for Figure 23 A schematic diagram of the structure of the layer containing the first electrode;

[0066] Figure 31 for Figure 23 A schematic diagram of the structure of the photoelectric conversion layer and the layer containing the second electrode;

[0067] Figure 32 for Figure 23 Schematic diagram of the structure of the middle protective layer and the resin layer;

[0068] Figure 33 for Figure 23 A schematic diagram of the structure of the second insulating layer;

[0069] Figure 34 for Figure 23 Schematic diagram of the structure of the medium bias metal layer;

[0070] Figure 35 for Figure 23 Schematic diagram of the middle shielding layer;

[0071] Figure 36 for Figure 23 Schematic diagram of the structure of the second light-shielding layer;

[0072] Figure 37 for Figure 23 Schematic diagram of the structure of the third light-shielding layer;

[0073] Figure 38 for Figure 23 Schematic diagram of the structure of the microlens layer;

[0074] Figure 39 for Figure 23 A schematic diagram of the mid-pixel driving circuit;

[0075] Figure 40 for Figure 8 The diagram shows the stacked structure of a pixel region in the fingerprint recognition module.

[0076] Figure 41 for Figure 40 A schematic diagram of the structure of the layer containing the first electrode;

[0077] Figure 42 for Figure 40 A schematic diagram of the structure of the photoelectric conversion layer and the layer containing the second electrode;

[0078] Figure 43 for Figure 40 Schematic diagram of the structure of the medium bias metal layer;

[0079] Figure 44 for Figure 40 Schematic diagram of the structure of the second light-shielding layer;

[0080] Figure 45 for Figure 40 Schematic diagram of the structure of the third light-shielding layer;

[0081] Figure 46 for Figure 40 Schematic diagram of the structure of the microlens layer;

[0082] Figure 47 A schematic diagram of the structure of a display device provided in an embodiment of this disclosure;

[0083] Figure 48 This is another schematic diagram of the structure of the display device provided in the embodiments of this disclosure. Detailed Implementation

[0084] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. It should be noted that the dimensions and shapes of the figures in the drawings do not reflect actual proportions and are only intended to illustrate the content of this disclosure. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout the drawings.

[0085] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure and the claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “inner,” “outer,” “upper,” and “lower” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0086] In related technologies, under-display fingerprint recognition display devices include a collimating film and a fingerprint recognition module, which are bonded together using optical adhesive (OCA). The collimating film comprises a single-layer aperture with a light-transmitting hole and a microlens located on the side of the single-layer aperture facing away from the fingerprint recognition module. However, due to limitations in the collimating film process and the single-layer aperture structure, crosstalk exists in the optical path within the range of 40° to 50°, resulting in a decrease in fingerprint image quality under strong outdoor light and affecting the user experience. Furthermore, due to the imprinted lens process, the collimating film exhibits spatial noise such as diagonal lines. Additionally, misalignment between the lens and the photosensitive device in the fingerprint recognition substrate leads to moiré patterns in the lens and optical path; these diagonal moiré patterns pose a significant challenge to image ISP algorithms. Furthermore, the current collimator uses organic resin material for its single-layer aperture. After being bonded with optical adhesive, the interior of the single-layer aperture is filled with air. When the collimator undergoes temperature-related reliability tests such as double 85°C and thermal shock, the mechanical properties of the single-layer aperture change due to heat, which alters the overall optical path and the appearance of the collimator, causing reliability issues.

[0087] To at least address the aforementioned technical problems in related technologies, this disclosure provides a texture recognition module, such as... Figure 1 and Figure 2 As shown, it includes:

[0088] Substrate 101;

[0089] A photosensitive device layer is located on the substrate 101, and the photosensitive device layer includes a plurality of photosensitive devices 102;

[0090] The bias metal layer 103 is located on the side of the photosensitive device layer that is away from the substrate 101;

[0091] The noise reduction metal layer 104 is located on the side of the bias metal layer 103 that is away from the photosensitive device layer;

[0092] The light guide film layer 105 includes at least two stacked light-shielding layers a, each light-shielding layer having light-transmitting holes H arranged in an array. The light-transmitting holes H in each light-shielding layer a correspond one-to-one and their orthogonal projections on the substrate 101 at least partially overlap. The orthogonal projections of the corresponding light-transmitting holes H on the substrate 101 are located within the orthogonal projection of the photosensitive device 102 on the substrate 101. The light-shielding layer a adjacent to the photosensitive device layer is disposed in the same layer as at least one of the bias metal layer 103 and the noise reduction metal layer 104. The shape of the light-transmitting holes H can be circular or square, etc., and is not limited here.

[0093] The microlens layer is located on the side of the light guide film layer 105 away from the photosensitive device layer. The microlens layer includes a plurality of microlenses 106. The orthogonal projection of the microlenses 106 on the substrate 101 covers and is larger than the orthogonal projection of the light-transmitting hole H on the substrate.

[0094] In the fingerprint recognition module provided in this embodiment, by setting the light-shielding layer a adjacent to the photosensitive device layer in the same layer as at least one of the bias metal layer 103 and the noise reduction metal layer 104, a light guide film layer 105 containing multiple light-shielding layers a and a microlens 106 are directly integrated above the photosensitive device 102. This can effectively improve the problems of large-angle crosstalk, film material diagonal / moiré patterns, and poor reliability in the collimation film solution in related technologies, thereby improving the accuracy of the fingerprint information identified in the optical fingerprint recognition process.

[0095] Furthermore, by directly integrating the light guide film layer 105 and the microlens 106 in this disclosure, the optical adhesive used in related technologies is saved, and the thickness of optical adhesive is generally greater than 25 μm. Therefore, the thickness of the texture recognition module of this disclosure can be greatly reduced. Specifically, in this disclosure, the distance between the surface of the substrate 101 facing the photosensitive device layer (i.e., the upper surface of the substrate 101) and the vertex of the microlens 106 is greater than or equal to 30 μm and less than or equal to 50 μm.

[0096] In some embodiments, in the texture recognition module provided in this disclosure, to reduce light crosstalk between adjacent light-transmitting holes H and obtain a better collimation effect, such as... Figure 1 and Figure 2 As shown, in the direction Y away from the photosensitive device layer, the apertures of the corresponding light-transmitting holes H in each light-shielding layer a can be sequentially increased. The regions where the orthographic projections of the light-transmitting holes H at the same position in each light-shielding layer a completely overlap on the substrate 101 constitute a collimating hole structure, which serves to collimate light rays incident at various angles at that position. This allows light rays forming a certain angle (e.g., less than or equal to 10°) with the normal perpendicular to the surface of the light-guiding film layer 105 to pass through the collimating hole structure, while light rays exceeding this angle (e.g., greater than 10°) are blocked. The difference between the minimum and maximum angles at which light rays can pass is the light-receiving angle.

[0097] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 1 and Figure 2 As shown, the centers of the corresponding light-transmitting holes H in each light-shielding layer a coincide on the substrate 101, ensuring that the light-transmitting holes H at the same position in each light-shielding layer a can form a collimation hole structure with good collimation effect. During fabrication, the centers of the light-transmitting holes H at the same position in each light-shielding layer a are made to overlap as completely as possible on the substrate 101. However, due to the alignment error in the actual fabrication process, the centers of the light-transmitting holes H at the same position in each light-shielding layer a may be slightly offset, and complete overlap cannot be guaranteed; that is, partial overlap may occur.

[0098] In some embodiments, in the texture recognition module provided in this disclosure, such as Figures 2 to 4 As shown, the light guide film layer 105 may include a first light-shielding layer a1, a first light-transmitting layer b1, a second light-shielding layer a2, a second light-transmitting layer b2, a third light-shielding layer a3, and a third light-transmitting layer b3 sequentially stacked on top of the photosensitive device layer. The first light-shielding layer a1 acts as a field stop and includes an array of first light-transmitting holes H1. The second and third light-shielding layers a2 and a3 prevent light crosstalk, with the second light-shielding layer a2 including an array of second light-transmitting holes H2, and the third light-shielding layer a3 including an array of third light-transmitting holes H3. In some embodiments, the apertures of the first, second, and third light-transmitting holes H1 and H2 gradually increase, and the centers of the first, second, and third light-transmitting holes H1, H2, and H3 are approximately coincidentally projected onto the substrate 101.

[0099] In some embodiments, such as Figure 1As shown, the texture recognition module includes a display area AA and a light-shielding area BB. In related technologies, the pattern of the noise-reducing metal layer 104 is generally located within the light-shielding area BB, and the pattern of the bias metal layer 103 is generally located within the display area AA. Furthermore, the light-transmitting hole H in this disclosure is located within the display area AA. Therefore, in the texture recognition module provided in the embodiments of this disclosure, in order to reduce the number of film layers, such as... Figure 2 As shown, the first light-shielding layer a1 can be reused with the bias metal layer 103; or, as... Figure 3 As shown, the first light-shielding layer a1 is the same layer and material as the noise-reducing metal layer 104; or, as... Figure 4 As shown, the first light-shielding layer a1 is reused with the bias metal layer 103, and the second light-shielding layer a2 is the same layer and material as the noise-reducing metal layer 104, which is not specifically limited here.

[0100] In some embodiments, the microlens 106 can be fabricated on the third light-transmitting layer b3 in 2.5 μm increments using a hot reflow process. Depending on current process capabilities, such as... Figure 5 As shown, the height h of the microlens 106 ranges from 1μm to 10μm, and its aperture W3 ranges from 10μm to 30μm. The aperture W0 of the first light-transmitting hole H1 ranges from 2μm to 10μm, the aperture W1 of the second light-transmitting hole H2 ranges from 4μm to 15μm, and the aperture W2 of the third light-transmitting hole H3 ranges from 6μm to 18μm; the thickness h1 of the first light-transmitting layer b1 ranges from 1μm to 10μm, the thickness h2 of the second light-transmitting layer b2 ranges from 1μm to 5μm, the thickness h3 of the third light-transmitting layer b3 ranges from 1μm to 10μm, and the thickness h of the second light-shielding layer a2... x1 The value range is 1μm-2μm, and the thickness h of the third light-shielding layer a3 is... x2 The value range is 1μm-2μm.

[0101] In addition, such as Figure 5 As shown, to achieve collimation, stray light interference must be avoided, which requires proper control of the relationship between the above parameters:

[0102] The distance L between the upper surface of the microlens 106 and the first light-shielding layer a1 satisfies the following formula:

[0103] L=h+h1+h2+h3+h x1 +h x2 (1);

[0104] K is a specific coefficient related to the microlens 106;

[0105] The aperture W0 of the first light-transmitting hole H1 satisfies the condition: W0=L*tanθ, where θ is the light-receiving angle, and the value of θ is in the range of 1°-10°;

[0106] The light guide film layer 105 and the microlens 106 satisfy the following relationship:

[0107] (W1-W0) / (2h1)≤(W2-W1) / [2(h2+h x1 )]≤(W3-W2) / [2(h3+h x2 (3).

[0108] This disclosure designs a light guide film layer 105 and a microlens 106 based on the production line manufacturing capabilities. The design parameters include: the aperture W3 of the microlens 106 is 16 μm; the arch height h of the microlens 106 is 4 μm; the aperture W0 of the first light-transmitting hole H1 in the first light-shielding layer a1 is 2.5 μm; the aperture W1 of the second light-transmitting hole H2 in the second light-shielding layer a2 is 6.6 μm; the aperture W2 of the third light-transmitting hole H3 in the third light-shielding layer a3 is 10.7 μm; the thickness h1 of the first light-transmitting layer b1 is 6.44 μm; the thickness h2 of the second light-transmitting layer b2 is 3.7 μm; the thickness h3 of the third light-transmitting layer b3 is 6 μm; and the thickness h of the second light-shielding layer a2 is... x1 The thickness h of the third light-shielding layer a3 is 1 μm. x2 It is 1μm.

[0109] Furthermore, this disclosure presents optical tests on the light guide film layer 105 and microlens 106 with the aforementioned design parameters, and the results are as follows: Figure 6 and Figure 7 As shown. By Figure 6 As can be seen, the light guide film layer 105 and microlens 106 with the above design parameters can transmit light from 0° to 10°, and can make each selected beam of light correspond precisely to the ridge of the fingerprint without other stray light interference, thus achieving accurate fingerprint recognition.

[0110] Optionally, in the texture recognition module provided in the embodiments of this disclosure, such as Figures 1 to 4 , Figures 8 to 11 As shown, each photosensitive device 102 includes at least one independent sub-photosensitive device S. The sub-photosensitive device S includes a first electrode 1021, a photoelectric conversion layer 1022, and a second electrode 1023 stacked together. The sub-photosensitive devices S are arranged in a one-to-one correspondence with the microlenses 106, and the orthogonal projection of the photoelectric conversion layer 1022 on the substrate 101 is located within the orthogonal projection of the corresponding microlens 106 on the substrate 101, so that all the fingerprint reflected light after being converged by the microlenses 106 is absorbed by the corresponding photoelectric conversion layer 1022, thereby increasing the signal amount and increasing the signal-to-noise ratio.

[0111] Specifically, Figure 1 It is shown that each photosensitive device 102 includes a sub-photosensitive device S. Figure 8 Each photosensitive device 102 is shown to include four sub-photosensitive devices S. In some embodiments, such as... Figure 12 As shown, each photosensitive device 102 may also include nine sub-photosensitive devices S; or, as... Figure 13 As shown, each photosensitive device 102 may further include sixteen sub-photosensitive devices S. Of course, the number of sub-photosensitive devices 102 included in each photosensitive device 102 can also be other values, and is not limited here. Correspondingly, in Figure 1 , Figure 8 , Figure 12 and Figure 13 In this configuration, each photosensitive device 102 corresponds to one, four, nine, or sixteen microlenses 106, respectively. Optionally, a constant period (lens space) exists during the fabrication of the microlenses 106, meaning the distance between the centers of two adjacent microlenses 106 is fixed.

[0112] Figure 14 and Figure 15 This is in response to the presence of photosensitive device 102 and microlens 106. Figure 1 The optical test results show a one-to-one correspondence. Figure 16 and Figure 17 This is in response to the presence of photosensitive device 102 and microlens 106. Figure 8 The optical test results show a one-to-four correspondence. Figure 18 and Figure 17 This is in response to the presence of photosensitive device 102 and microlens 106. Figure 12 The optical test results show the one-to-nine correspondence. Figure 20 and Figure 21 This is in response to the presence of photosensitive device 102 and microlens 106. Figure 13 The optical test results show a one-to-sixteen correspondence. Figure 22 The curves from top to bottom represent... Figure 1 , Figure 8 , Figure 12 and Figure 13 The diagram shows the relationship between the light-receiving angle and transmittance of the collimating aperture structure in the display substrate. Figures 14 to 22 It can be seen that, under the same light-gathering angle (0°-10°), Figure 1 , Figure 8 , Figure 12 and Figure 13 The center transmittance of the collimating hole structure in the display substrate decreases sequentially, and the area enclosed by the entire curve and the horizontal axis also decreases sequentially. The larger the area, the higher the fingerprint signal value.

[0113] In some embodiments, in the texture recognition module provided in this disclosure, such as Figures 2 to 4 and such Figures 9 to 11 As shown, it may further include: a buffer layer 107, an active layer 108, a gate insulating layer (GI) 109, a gate metal layer 110, an interlayer dielectric layer (ILD) 111, a source / drain metal layer (SD1) 112, a first insulating layer (PVX1) 113, a first planarization layer (PLN1) 114, a cover layer 115, a resin layer 116, a second insulating layer (PVX2) 117, a third insulating layer (PVX3) 118, a barrier layer 119, an ITO shielding layer 120, and a fourth insulating layer (OC) 121; wherein, in Figure 2 and Figure 9 In this structure, the third insulating layer 118, the barrier layer 119, the shielding layer 120, and the fourth insulating layer 121 correspond to the first light-transmitting layer a1; Figure 3 and Figure 10 In this context, the barrier layer 119, the shielding layer 120, and the fourth insulating layer 121 correspond to the first light-transmitting layer a1; Figure 4 and Figure 11 In the middle, the third insulating layer 118 is equivalent to the first light-transmitting layer a1, and the blocking layer 119, the shielding layer 120 and the fourth insulating layer 121 are equivalent to the second light-transmitting layer a2.

[0114] When a photosensitive device 102 includes a sub-photosensitive device S and is correspondingly configured with a microlens 106, the area where a photosensitive device 102 is located is a pixel area, and its layout design is as follows: Figures 23 to 38 As shown. In some embodiments, each pixel region may further include Figure 39 The pixel driving circuit shown includes a reset TFT T1, an amplifying TFT T2, and a read TFT T3. The gate of the reset TFT T1 is electrically connected to the first scan signal line G1, the first electrode of the reset TFT T1 is electrically connected to the power supply line VDD, and the second electrode of the reset TFT T1 is electrically connected to the first electrode 1021. The gate of the amplifying TFT T2 is electrically connected to the first electrode 1021, the first electrode of the amplifying TFT T2 is electrically connected to the power supply line VDD, and the second electrode of the amplifying TFT T2 is electrically connected to the first electrode of the read TFT T3. The gate of the read TFT T3 is electrically connected to the second scan signal line G2, and the second electrode of the read TFT T3 is electrically connected to the read line Test. The first electrode plate of the capacitor C is grounded to GND, and the second electrode plate of the capacitor C is electrically connected to the first electrode 1021.

[0115] Specifically, Figure 23 A stacked image of a pixel region is shown.

[0116] exist Figure 24 The diagram shows a pattern of an active layer 108 in a pixel region, specifically including an active layer for a reset transistor T1, an amplification transistor T2, and a readout transistor T3.

[0117] Figure 25 The diagram shows a pattern of a gate metal layer 110 in a pixel region, specifically including the gates of a reset transistor T1, an amplification transistor T2, and a readout transistor T3, as well as a first scan signal line G1 and a second scan signal line G2. The reset transistor T1 and the readout transistor T3 may include two gates, i.e., dual-gate transistors, to reduce noise.

[0118] Figure 26 The diagram shows a pattern of a gate insulating layer 109 and an interlayer dielectric layer 111 in a pixel region, specifically including vias for connecting the active layer and source / drain of a reset transistor T1, vias for connecting the active layer and source / drain of an amplification transistor T2, vias for connecting the active layer and source / drain of a read transistor T3, and vias for connecting the gate of the amplification transistor T2 to the source / drain of the reset transistor T1.

[0119] Figure 27 The diagram shows a pattern of source / drain metal layers 112 in a pixel region, specifically including the source / drain of reset transistor T1, amplification transistor T2 and readout transistor T3, power supply line VDD and readout line Test, wherein the source / drain of reset transistor T1 and the gate of amplification transistor T2 have an overlap area T1+T2 to achieve electrical connection between them.

[0120] Figure 28 The pattern of the first insulating layer 113 in a pixel region is shown, specifically including a via for connecting the gate of the amplifying transistor T2 to the first electrode 1021 of the sub-photosensitive device S.

[0121] Figure 29 The pattern of a first planarization layer 114 in a pixel region is shown, specifically including a via for connecting the gate of the amplifying transistor T2 to the first electrode 1021 of the sub-photosensitive device S.

[0122] Figure 30 The diagram shows a pattern of a first electrode 1021 (also known as SD2) in a pixel region, specifically including the first electrode 1021 of a sub-photosensitive device S.

[0123] Figure 31 The diagram shows a pattern of a photoelectric conversion layer 1022 (also known as a PIN) and a second electrode 1023 (also known as an ITO cap) in a pixel region, specifically including a photoelectric conversion layer 1022 and a second electrode 1023 of a sub-photosensitive device S.

[0124] Figure 32The pattern of resin layer 116 and protective layer 115 in a pixel region is shown, specifically including a via for connecting a second electrode 1023 of a sub-photosensitive device S to a bias metal layer 103 (also referred to as TM).

[0125] Figure 33 The pattern of a second insulating layer 117 in a pixel region is shown, specifically including a via for connecting a second electrode 1023 of a sub-photosensitive device S to a bias metal layer 103 (also referred to as TM).

[0126] Figure 34 The diagram illustrates a pattern of a bias metal layer 103 in a pixel region, specifically including a main body M extending along the column direction, and multiple protrusions T on the same side of the main body. The protrusions T are electrically connected to the second electrode 1023 of a sub-photosensitive device S. Figure 32 Specifically, the bias metal layer 103 is reused as the first light-shielding layer b1, and therefore, the protrusion T has a first light-transmitting hole H1.

[0127] Figure 35 The pattern of the shielding layer 120 in a pixel area is shown.

[0128] Figure 36 The pattern of the second light-shielding layer b2 in a pixel region is shown, specifically including a second light-transmitting hole H2 that overlaps with the first light-transmitting hole H1.

[0129] Figure 37 The pattern of the third light-blocking layer b3 in a pixel region is shown, specifically including a third light-transmitting hole H3 that overlaps with both the first light-transmitting hole H1 and the second light-transmitting hole H2.

[0130] Figure 38 The pattern of a microlens layer in a pixel region is shown, specifically including a microlens 106 that completely covers the photoelectric conversion layer 1022, the first light-transmitting hole H1, the second light-transmitting hole H2, and the third light-transmitting hole H3.

[0131] The above example illustrates the layout design of a pixel region provided in this disclosure, using a photosensitive device 102 including a sub-photosensitive device S and correspondingly configured with a microlens 106. It should be understood that, as Figures 40 to 46 As shown, in this disclosure, a photosensitive device 102 may also include multiple sub-photosensitive devices S, and each sub-photosensitive device S is correspondingly arranged with a microlens 106. In order to facilitate the explanation of the layout design of a pixel area in this case, the following only describes the structure of the layer containing the photosensitive device 102, the light guide film layer 105 and the microlens 106. The structure of other film layers can be found in the above-mentioned content that a photosensitive device 102 includes a sub-photosensitive device S and is correspondingly arranged with a microlens 106, and will not be repeated here.

[0132] In some embodiments, such as Figures 9 to 11 , Figures 40 to 46 As shown, each photosensitive device 102 includes multiple independent sub-photosensitive devices S. The texture recognition module may also include multiple connecting electrodes 122. The connecting electrodes 122 are disposed on the same layer as the first electrode 1021. The first electrodes 1021 of all sub-photosensitive devices S are electrically connected to the pixel driving circuit (specifically the gate of the amplifying transistor T2) through the connecting electrodes 122. The second electrodes 1023 of all sub-photosensitive devices S are electrically connected to the bias metal layer 103 through through holes penetrating the resin layer 116 and the second insulating layer 117, respectively, so as to load driving signals for the photosensitive device 102 through the pixel driving circuit and the bias metal layer 103.

[0133] In some embodiments, in the texture recognition module provided in this disclosure, such as Figure 34 and Figure 43 As shown, the bias metal layer 103 may include multiple bias lines, each bias line being electrically connected to a row of photosensitive devices 102. Specifically, as described above, the bias line may include a main body M extending along the column direction, and multiple protrusions T on the same side of the main body M, each protrusion T being electrically connected to a second electrode 1022 in a photosensitive device 102.

[0134] Generally, in the texture recognition module provided in the embodiments of this disclosure, such as Figure 1 and Figure 8 As shown, it may also include a gate driver chip (Gate IC) 123 and a source driver chip (Source IC) 123 located in the bonding region BD. Other essential components of the texture recognition module are those that should be understood by those skilled in the art and will not be described in detail here.

[0135] Based on the same inventive concept, embodiments of this disclosure provide a display device, such as... Figure 47 As shown, the device includes the texture recognition module 01 provided in this embodiment and a display module 02 located on top of the texture recognition module 01. The display module 02 and the texture recognition module 01 are fixed together by optical adhesive 03. Since the principle by which this display device solves the problem is similar to that of the texture recognition module, the implementation of the display device provided in this embodiment can refer to the implementation of the texture recognition module provided in this embodiment, and repeated details will not be described again.

[0136] In some embodiments, in the display device provided in the present disclosure, such as Figure 47As shown, the orthographic projection of the texture recognition module 01 on the plane of the display device roughly coincides with the orthographic projection of the display module 02 on the plane of the display device. The optical adhesive 03 is located in the frame area of ​​the display module 01, so that there is an air gap between the texture recognition module 01 and the display module 02, which helps to maintain the direction of light propagation of the finger reflected light unchanged; at the same time, full-screen fingerprint recognition can be realized.

[0137] In some embodiments, in the display device provided in the present disclosure, such as Figure 48 As shown, the display module 02 may include an organic electroluminescent display panel 201, a heat dissipation film 202 disposed on the side opposite to the display surface of the organic electroluminescent display panel 201, and a middle frame 203 located on the side of the heat dissipation film 202 opposite to the organic electroluminescent display panel 201. The heat dissipation film 202 includes a hollow structure, and the pattern recognition module 01 is disposed in the hollow structure. The pattern recognition module 01 is fixed to the middle frame 203 by optical adhesive 03 to realize local fingerprint recognition in the area where the hollow structure is located.

[0138] In some embodiments, the heat dissipation film 202 may include graphite in contact with the organic electroluminescent display panel 201, foam in contact with the mid-frame 203, and copper foil located between the graphite and the foam. The organic electroluminescent display panel 201 includes, from top to bottom, a protective cover plate, optical adhesive, polarizer, encapsulation layer, cathode, light-emitting functional layer, anode, and driving backplate.

[0139] During fingerprint recognition, when a finger touches the organic electroluminescent display panel 201, the light guide film layer 105 and microlens 106 can nearly collimate and filter out small-angle light, directing it to the photoelectric conversion layer 1022 of the underlying photosensitive device 102. The photoelectric conversion layer 1022 can detect the intensity of the reflected light from the fingerprint. Since the energy of the diffusely reflected light from the valleys and ridges is different, the light intensity detected by the photosensitive device 102 array is different, thereby acquiring fingerprint image information.

[0140] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this disclosure without departing from the spirit and scope of the embodiments of this disclosure. Therefore, if these modifications and variations to the embodiments of this disclosure fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include these modifications and variations.

Claims

1. A texture recognition module, wherein, include: Substrate; A photosensitive device layer is located on the substrate, and the photosensitive device layer includes a plurality of photosensitive devices; A bias metal layer is located on the side of the photosensitive device layer that is away from the substrate. A noise-reducing metal layer is located on the side of the bias metal layer that is away from the photosensitive device layer; The light guide film layer includes at least two stacked light-shielding layers, each of the light-shielding layers having light-transmitting holes arranged in an array, the light-transmitting holes in each of the light-shielding layers being one-to-one and their orthogonal projections on the substrate at least partially overlapping, the orthogonal projections of the corresponding light-transmitting holes on the substrate being located within the orthogonal projection of the photosensitive device on the substrate, and the light-shielding layer adjacent to the photosensitive device layer being disposed in the same layer as at least one of the bias metal layer and the noise reduction metal layer; A microlens layer is located on the side of the light guide film layer opposite to the photosensitive device layer. The microlens layer includes a plurality of microlenses. The orthogonal projection of the microlenses on the substrate covers and is larger than the orthogonal projection of the light-transmitting hole on the substrate. The light guide film layer comprises a first light-shielding layer, a first light-transmitting layer, a second light-shielding layer, a second light-transmitting layer, a third light-shielding layer, and a third light-transmitting layer, sequentially stacked on the photosensitive device layer; wherein, The first light-shielding layer includes an array of first light-transmitting holes, the second light-shielding layer includes an array of second light-transmitting holes, and the third light-shielding layer includes an array of third light-transmitting holes; the light-guiding film layer and the microlens satisfy the following relationship: ； ； ； ； Where L is the distance between the upper surface of the microlens and the first light-shielding layer; θ is the light-receiving angle; K is a specific coefficient related to the microlens; W0 is the aperture of the first light-transmitting hole; W1 is the aperture of the second light-transmitting hole; W2 is the aperture of the third light-transmitting hole; W3 is the aperture of the microlens; h is the thickness of the microlens; h1 is the thickness of the first light-transmitting layer; h2 is the thickness of the second light-transmitting layer; h3 is the thickness of the third light-transmitting layer; h x1 h is the thickness of the second light-shielding layer. x2 The thickness of the third light-shielding layer; Wherein, 1°≤θ≤10°, 2μm≤W0≤10μm, 4μm≤W1≤15μm, 6μm≤W2≤18μm, 10μm≤W3≤30μm, 1μm≤h1≤10μm, 1μm≤h2≤5μm, 1μm≤h3≤10μm, 1μm≤h x1 ≤2μm, 1μm≤h x2 ≤2μm.

2. The texture recognition module as described in claim 1, wherein, In the direction away from the photosensitive device layer, the aperture of the light-transmitting hole corresponding to each of the light-shielding layers increases sequentially.

3. The texture recognition module as described in claim 2, wherein, The centers of the light-transmitting holes in each of the light-shielding layers coincide on the orthographic projection of the light-transmitting holes onto the substrate.

4. The texture recognition module as described in claim 1, wherein, The first light-shielding layer is reused with the bias metal layer.

5. The texture recognition module as described in claim 1, wherein, The first light-shielding layer and the noise-reducing metal layer are of the same layer and the same material.

6. The texture recognition module as described in claim 1, wherein, The first light-shielding layer is reused with the bias metal layer, and the second light-shielding layer is the same layer and material as the noise-reducing metal layer.

7. The texture recognition module as described in claim 1, wherein, Each of the photosensitive devices includes at least one independent sub-photosensitive device, and the sub-photosensitive device includes a first electrode, a photoelectric conversion layer and a second electrode stacked together. The sub-photosensitive devices are arranged in a one-to-one correspondence with the microlenses, and the orthogonal projection of the photoelectric conversion layer on the substrate is located within the orthogonal projection of the corresponding microlens on the substrate.

8. The texture recognition module as described in claim 7, wherein, It also includes multiple pixel driving circuits and multiple connection electrodes located between the photosensitive device layer and the substrate. Each photosensitive device includes multiple independent sub-photosensitive devices, wherein the first electrode and the connecting electrode are disposed on the same layer, and the first electrodes of all the sub-photosensitive devices are electrically connected to the pixel driving circuit through the connecting electrode, and the second electrodes of all the sub-photosensitive devices are electrically connected to the bias metal layer respectively.

9. The texture recognition module as described in claim 8, wherein, The bias metal layer includes multiple bias lines, each bias line including a main body extending in a column direction and multiple protrusions on the same side of the main body, each of the protrusions being electrically connected to each of the second electrodes in one of the photosensitive devices.

10. The texture recognition module as described in claim 8, wherein, The pixel driving circuit includes a reset transistor, an amplification transistor, and a readout transistor, wherein the reset transistor and the readout transistor are dual-gate transistors.

11. The texture recognition module as described in any one of claims 1-10, wherein, The distance between the surface of the substrate facing the photosensitive device layer and the vertex of the microlens is greater than or equal to 30 μm and less than or equal to 50 μm.

12. A display device, wherein, Includes a texture recognition module as described in any one of claims 1-11, and a display module located on top of the texture recognition module, wherein the display module and the texture recognition module are fixed together by optical adhesive.

13. The display device as claimed in claim 12, wherein, The orthographic projection of the texture recognition module on the plane of the display device roughly coincides with the orthographic projection of the display module on the plane of the display device, and the optical adhesive is located in the border area of ​​the display module.

14. The display device as claimed in claim 12, wherein, The display module includes an organic electroluminescent display panel, a heat dissipation film disposed on a side opposite to the display surface of the organic electroluminescent display panel, and a middle frame located on the side of the heat dissipation film opposite to the organic electroluminescent display panel. The heat dissipation film includes a hollow structure, and the texture recognition module is disposed within the hollow structure and is fixed to the middle frame by the optical adhesive.

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