Amplifier with distributed differential positive feedback

Abstract

An amplifier apparatus is provided that includes a first amplifier connected to receive an input voltage. The first amplifier outputs an internal voltage. The structure further includes a second amplifier having an input node connected to receive the internal voltage and an output node that outputs an output voltage. A resistive feedback loop is connected to the input node and the output node of the second amplifier. A first cross-coupled bandwidth boosting stage is connected to the input node of the second amplifier and a second cross-coupled bandwidth boosting stage is connected to the output node of the second amplifier. The cross-coupled bandwidth boosting stages form a distributed differential positive feedback structure.

Description

Technical Field

[0001] This invention relates to amplifiers, and more particularly, to devices using amplifiers in conjunction with optical receivers. Background Technology

[0002] Optical receivers are typically used to transmit data using optical pulses. In an optical receiver, a transimpedance amplifier (TIA) receives current from a photodiode and outputs an initial voltage. TIAs often have high gain and bandwidth requirements in a system. Therefore, some traditional amplifiers, such as Cherry-Hooper amplifiers, are frequently used in high-speed designs where a trade-off between bandwidth and gain is necessary. Consequently, bandwidth boosting devices are sometimes used in conjunction with these amplifiers. Such bandwidth boosting devices may occupy a considerable amount of circuit space (large footprint) or may only provide limited bandwidth extension. Summary of the Invention

[0003] Some of the amplifier devices described herein include a first amplifier connected to receive an input voltage. The first amplifier outputs an internal voltage. These structures also include a second amplifier having an input node connected to receive the internal voltage and an output node that outputs the internal voltage. A resistive feedback loop is connected to the input and output nodes of the second amplifier. A first cross-coupled bandwidth booster stage is connected to the input node of the second amplifier, while a second cross-coupled bandwidth booster stage is connected to the output node of the second amplifier. The cross-coupled bandwidth booster stages form a distributed differential positive feedback structure.

[0004] Other amplifier devices described herein include a positive voltage input port and a negative voltage input port. A first inverting amplifier has a first input connected to both the positive and negative voltage input ports. A first inverting amplifier has a first output connected to internal positive and negative voltage nodes. A second inverting amplifier has a second input connected to internal positive and negative voltage nodes. A second inverting amplifier has a second output connected to both positive and negative voltage output ports. Furthermore, a resistive feedback loop is connected to the second input and second output of the second inverting amplifier. A first cross-coupled inverting amplifier is connected to the second input of the second inverting amplifier. A second cross-coupled inverting amplifier is connected to the second output of the second inverting amplifier.

[0005] Some of the optical receivers described herein include photodiodes that output current. A transimpedance amplifier is connected to receive the current and output an initial voltage. These structures also include bandwidth boosting devices with at least one boosting stage. Each boosting stage includes a first amplifier connected to receive the input voltage (the first amplifier outputs an internal voltage), a second amplifier having an input node connected to receive the internal voltage and an output node that outputs the output voltage, a resistive feedback loop connected to the input and output nodes of the second amplifier, a first cross-coupled bandwidth boosting stage connected to the input node of the second amplifier, and a second cross-coupled bandwidth boosting stage connected to the output node of the second amplifier. Attached Figure Description

[0006] The embodiments described herein will be better understood from the following detailed description with reference to the accompanying drawings, which are not necessarily drawn to scale, and wherein:

[0007] Figure 1A-Figure 1B This is a schematic diagram of an amplifier device according to an embodiment of this document;

[0008] Figure 2 yes Figure 1A-Figure 1B A schematic diagram of a specific example of the amplifier device shown;

[0009] Figures 3-4 These are schematic diagrams of other amplifier devices according to embodiments of the present invention; and

[0010] Figure 5 Is using with Figures 1A-4 A schematic diagram of the receiver of the stage of the amplifier device shown.

[0011] Explanation of reference numerals in the attached figures

[0012] 100 Amplifier Equipment or Stage

[0013] Project 100A

[0014] Project 100B

[0015] Project 100C

[0016] 102 Input Voltage

[0017] 103 Structure

[0018] 104 Output Voltage Node

[0019] 110 First Amplifier Equipment

[0020] 112 First Cross-Coupling Bandwidth Enhancement Stage

[0021] 114 First Cross-Coupling Bandwidth Enhancement Stage

[0022] 116 Resistor Feedback Loop

[0023] 118 Resistive Feedback Loop

[0024] 120 resistor

[0025] 122 Resistor

[0026] 124 Second Amplifier

[0027] 126 Second Cross-Coupling Bandwidth Enhancement Stage

[0028] 128 Second Cross-Coupling Bandwidth Enhancement Stage

[0029] 130 Positive Voltage Line / Node

[0030] 132 Negative Voltage Line / Node

[0031] 140 optical receiver

[0032] 142 Photodiode

[0033] 144 Transimpedance Amplifier

[0034] 148 Single-ended to differential amplifier devices

[0035] 150-bit Modular Digital Converter (ADC)

[0036] 152 Digital Output Signal

[0037] 200 Amplifier Equipment

[0038] 210 First Amplifier Equipment

[0039] 212 First cross-coupled inverting amplifier

[0040] 214 First cross-coupled inverting amplifier

[0041] 216 Resistor Feedback Loop

[0042] 218 Resistive Feedback Loop

[0043] 220 resistor

[0044] 222 resistor

[0045] 224 Second Amplifier Device

[0046] 226 Second Cross-Coupled Inverting Amplifier

[0047] 228 Second Cross-Coupled Inverting Amplifier

[0048] 230 Positive Voltage Input Port

[0049] 232 Negative Voltage Input Port

[0050] 234 First Inverting Amplifier

[0051] 236 Second Inverting Amplifier

[0052] 240 Positive Voltage Line

[0053] 241 Positive Voltage Node

[0054] 242 nodes

[0055] 243 Positive Voltage Node

[0056] 244 Positive Voltage Node

[0057] 245 nodes

[0058] 246 nodes

[0059] 248 Positive Voltage Output Port

[0060] 250 negative voltage line

[0061] 251 Negative Voltage Node

[0062] 252 nodes

[0063] 253 Negative Voltage Node

[0064] 254 Negative Voltage Nodes

[0065] 255 nodes

[0066] 256 nodes

[0067] 258 Negative voltage output port. Detailed Implementation

[0068] As mentioned above, bandwidth enhancement devices are sometimes used in conjunction with optical receiver amplifiers. Such bandwidth enhancement devices can occupy a considerable amount of circuit space (large footprint) or may only provide limited bandwidth extension. In view of these issues, the device disclosed below uses a cross-coupled bandwidth enhancement stage to provide a distributed differential positive feedback structure that offers both bandwidth extension and high gain. Furthermore, the distributed differential positive feedback structure described herein has a small footprint and low layer count, making it easy to implement.

[0069] Figure 1AAn exemplary embodiment of an amplifier device or stage 100 including bandwidth enhancement devices is shown. The internal components within each amplifier device and component discussed below can be formed from any currently known (or future-developed) amplifier component, including field-effect transistor (FET) based amplifier devices, bipolar junction transistor (BJT) based amplifier devices, etc., and such devices can be based on any form of technology, such as complementary metal-oxide-semiconductor (CMOS) or other semiconductor technologies.

[0070] In other components, Figure 1A The amplifier device 100 shown includes a first amplifier 110 (e.g., a transconductance inverting amplifier) ​​that receives an input voltage 102 and outputs an internal voltage along positive voltage lines / nodes 130 and 132. These configurations also include a second amplifier 124 (e.g., a transconductance inverting amplifier) ​​having an input node that receives the internal voltage (located where the input of the second amplifier 124 intersects with positive voltage lines / nodes 130 and 132) and an output node that provides the output at the output voltage node 104 (located where the output of the second amplifier 124 intersects with positive voltage lines / nodes 130 and 132). One or more resistive feedback loops 116, 118, each having some controllable resistors (e.g., resistors 120, 122, resistance lines, etc.) connected to provide feedback from the output node to the input node of the second amplifier 124.

[0071] First cross-coupled bandwidth boosting stages 112, 114 may be connected to the input node of the second amplifier 124. These configurations may also include second cross-coupled bandwidth boosting stages 126, 128 connected to the output node of the second amplifier 124. Each of the first cross-coupled bandwidth boosting stages 112, 114 and the second cross-coupled bandwidth boosting stages 126, 128 has an amplifier component connected in the opposite direction (e.g., oppositely connected inputs and outputs) relative to the voltage nodes of the first amplifier 110 and the second amplifier 124. In some configurations herein, the first cross-coupled bandwidth boosting stages 112, 114 and the second cross-coupled bandwidth boosting stages 126, 128 have the same (and identically cross-coupled) amplifier components.

[0072] A first amplifier 110, a second amplifier 124, first cross-coupled bandwidth boosting stages 112 and 114, and second cross-coupled bandwidth boosting stages 126 and 128 are connected to a positive voltage line / node 130 and a negative voltage line / node 132. The first amplifier 110 and the second amplifier 124 each have positive input and output nodes connected to the positive voltage line / node 130, and negative input and output nodes connected to the negative voltage line / node 132. In contrast, the first cross-coupled bandwidth boosting stages 112 and 114 and the second cross-coupled bandwidth boosting stages 126 and 128 have an amplifier assembly connected between the positive voltage line / node 130 and the negative voltage line / node 132.

[0073] like Figure 1B As shown, the first cross-coupled bandwidth enhancement stages 112, 114 and the second cross-coupled bandwidth enhancement stages 126, 128 form a distributed differential positive feedback structure 136 between the positive voltage line / node 130 and the negative voltage line / node 132. Figure 1A-Figure 1B As shown, the distributed differential positive feedback structure 136 is connected to the input and output of the second amplifier 124.

[0074] This distributed differential positive feedback structure 136 avoids using peak inductors as bandwidth enhancement devices. The distributed differential positive feedback structure 136 uses amplifiers to provide a stronger bandwidth extension with high gain, while reducing the device footprint, making the structure easier to implement in existing devices. The cross-coupling of the amplifiers balances the amplification between the positive and negative nodes. Therefore, compared to corresponding inductor-based bandwidth enhancement devices, Figure 1A-Figure 1B The multi-amplifier device 100 shown occupies less area and has fewer layers. Additionally, Figure 1A-Figure 1B The structure shown has a high quality (Q) factor.

[0075] Figure 2 It is similar to Figure 1A-Figure 1B A schematic diagram of a specific example of the amplifier device 200 shown. Although Figure 1A-Figure 1B The structure shown can use any form of amplifier component, but Figure 2 A more specific, non-limiting example shown is the use of an inverting amplifier. The structure described is not limited to an inverting amplifier, but... Figure 2 It can only be implemented Figure 1A-Figure 1B This is one example of many different ways of implementing the concept, and the claims set forth below are intended to apply to all of these possible implementations.

[0076] Figure 2The exemplary amplifier device 200 shown includes positive (230) and negative (232) voltage input ports and positive (240) and negative (250) voltage lines extending to positive (248) and negative (258) output ports. Various nodes (241-246) are along the positive voltage line 240 and various nodes (251-256) are along the negative voltage line 250.

[0077] Figure 2 The diagram shows a first inverting amplifier 234, which has first inputs connected to positive and negative voltage input ports 230, 232. The first inverting amplifier 234 forms a first amplifier device 210 (e.g., a transconductance inverting amplifier), which is an example of the first amplifier device 110 shown in FIG. 1. The first inverting amplifier 234 has first outputs connected to internal positive and negative voltage nodes 241, 251. A second inverting amplifier 236 has second inputs connected to internal positive and negative voltage nodes 243, 253. The second inverting amplifier 236 forms a second amplifier device 224 (e.g., a transconductance inverting amplifier), which is an example of the second amplifier device 124 shown in FIG. 1. The second inverting amplifier 236 has second outputs connected to positive and negative voltage nodes 244, 254, which are connected to positive and negative voltage output ports 248, 258. In addition, resistive feedback loops 216 and 218 with resistors 220 and 222 are connected to the second input (at nodes 243 and 253) and the second output (at nodes 244 and 254) of the second inverting amplifier 236.

[0078] Figure 2 Also shown are first cross-coupled inverting amplifiers 212, 214 connected to the second input of the second inverting amplifier 236. These first cross-coupled inverting amplifiers 212, 214 correspond to Figure 1A-Figure 1B The first cross-coupled bandwidth boost stages 112 and 114 are shown in the diagram. Second cross-coupled inverting amplifiers 226 and 228 are connected to the second output of the second inverting amplifier 236. These second cross-coupled inverting amplifiers 226 and 228 correspond to... Figure 1A-Figure 1B The second cross-coupled bandwidth boosting stages 126 and 128 are shown. The first cross-coupled inverting amplifiers 212 and 214 and the second cross-coupled inverting amplifiers 226 and 228 may have the same amplifier components.

[0079] like Figure 2As shown, the first cross-coupled inverting amplifiers 212 and 214 are identified as cross-coupled because they are connected in opposite directions to each other relative to the internal positive and negative voltage lines 240 and 250, wherein the output of inverter 212 and the input of inverter 214 are connected to the positive voltage line 240 (at nodes 241 and 242) and the input of inverter 212 and the output of inverter 214 are connected to the negative voltage line 250 (at nodes 251 and 252).

[0080] Similarly, the second cross-coupled inverting amplifiers 226 and 228 are identified as cross-coupled because they are connected in opposite directions to each other relative to the internal positive and negative voltage lines 240 and 250, with the output of inverter 226 and the input of inverter 228 connected to the positive voltage line 240 (at nodes 245 and 246), and the input of inverter 226 and the output of inverter 228 connected to the negative voltage line 250 (at nodes 255 and 256).

[0081] The first inverting amplifier 234 and the second inverting amplifier 236 are each connected to (having) positive input nodes (230, 243) and output nodes (241, 244) and negative input nodes (232, 253) and output nodes (251, 254), which are connected to internal positive and negative voltage nodes / lines 240, 250. However, the first cross-coupled inverting amplifiers 212, 214 and the second cross-coupled inverting amplifiers 226, 228 are connected in opposite directions relative to the internal positive and negative voltage nodes / lines 240, 250. Specifically, as Figure 2 As shown, the first cross-coupled inverting amplifiers 212, 214 and the second cross-coupled inverting amplifiers 226, 228 have amplifier components connected between internal positive and negative voltage nodes / lines 240, 250.

[0082] As in Figure 1A-Figure 1B The example of the first and second cross-coupled bandwidth enhancement stages (112, 114 and 126, 128) shown in the diagram, with the first and second cross-coupled inverting amplifiers (212 and 214, 226 and 228) forming a distributed differential positive feedback structure between the internal positive and negative voltage lines 240, 250. As described above, the use of the first and second cross-coupled inverting amplifiers (212 and 214, 226 and 228) provides stronger bandwidth extension and high gain while reducing device footprint, especially compared to corresponding inductor-based bandwidth enhancement devices. By using amplifiers to enhance bandwidth, the distributed differential positive feedback structure is independent of processing parameters that can be changed by altering the resistance, and the output impedance of the distributed differential positive feedback structure 136 has a smaller impact. Furthermore, Figure 1A-Figure 1BThe structure shown has a high quality (Q) factor.

[0083] Specifically, by viewing Figure 2 The transfer function shown in the example demonstrates the increase in bandwidth and quality (Q) factor.

[0084] Its form is a second-order system:

[0085]

[0086] in,

[0087] b0=gm1R1R2(-1+gm2R f )

[0088] a0=R1+R2+gm2R1R2-gm f1 R1R2-gm f2 R1R2+R F -gm f1 R1R f -gm f2 R2R f +gm f1 gm f2 R1R2R f

[0089] a1=C1R1R2+C2R1R2+C1R1R f +C2R2R f -C2gm f1 R1R2R f -C1gm f2 R1R2R f

[0090] a2=C1C2R1R2R f

[0091] In the transfer function above, gm represents the gain circuit component, Rf represents the resistor circuit component, C represents the capacitor circuit component, etc. This transfer function is a typical form for a second-order system. Solving the denominator yields two conjugate poles of the following form.

[0092]

[0093] As gm0f and gm1f increase, a0 and a1 decrease, but a2 remains unchanged. This causes the conjugate poles to approach the imaginary axis, increasing the Q-factor and bandwidth. Therefore, the above distributed differential positive feedback structure increases both the quality factor (Q) and bandwidth while increasing the gain.

[0094] Although Figure 1A-Figure 1BOne configuration is shown in which a distributed differential positive feedback structure is connected to the input and output of a second amplifier 124. However, where the required increase in bandwidth is secondary in terms of footprint, manufacturing cost, etc., one of the cross-coupled bandwidth boosting stages (112, 114 or 126, 128) can be connected from... Figure 1A-Figure 1B The amplifier structure 100 shown is removed. Therefore, Figure 3 It shows the relationship with Figure 1A-Figure 1B The same structure as shown, but with... Figure 3 Structure 101 in the text does not include cross-coupled bandwidth enhancement stages 126 and 128. Similarly, Figure 4 It shows the relationship with Figure 1A-Figure 1B The same structure as shown, but with... Figure 4 Structure 103 in the text does not include cross-coupled bandwidth enhancement stages 112 and 114.

[0095] Note that, in having Figure 3 and Figure 4 In the case of the structure shown, the increase in bandwidth will not be like Figure 1A-Figure 2 The structure shown is as large as it appears. Specifically, in a structure with... Figure 3 and Figure 4 In the case of this structure, the parasitic capacitance in high-speed nodes will increase (relative to) Figure 1A-Figure 2 (As shown in the diagram), and the increase in parasitic capacitance will limit the increase in bandwidth. Therefore, if the distributed differential positive feedback structure is only used for the input or output of the second amplifier 124, the increase in parasitic capacitance may require a larger feedback coefficient for an effective bandwidth boost. Note that, with Figure 1A-Figure 2 The distributed feedback structure shown increases parasitic capacitance, thereby reducing the impact on bandwidth and Q factor.

[0096] Figure 5 This is a schematic diagram illustrating an example of a photoreceiver 140 using a multi-stage amplifier device described above. The photoreceiver 140 includes some form of photoreceiver that outputs current, such as a photodiode 142. A transimpedance amplifier (TIA) 144 (with a resistive feedback loop 146) is connected to receive current from the photodiode 142, and the transimpedance amplifier 144 outputs an initial voltage. A single-ended to differential amplifier device (S2D) 148 converts the initial voltage into a positive and a negative voltage.

[0097] These architectures also include bandwidth enhancement devices with at least one enhancement stage. While any number of stages can be used depending on the implementation, Figure 5 The examples shown include three (-Gm) levels (numbered 1-3), which are in Figure 5The data is displayed as items 100A, 100B, and 100C. Items 100A-100C are those discussed above. Figures 1A-4 Any amplifier device shown. The analog-to-digital converter (ADC) 150 receives the bandwidth-boosted differential voltage signal output by the final boost stage 100C. The ADC 150 converts the voltage signal into a digital output signal 152, which is then provided to other communication devices that process digital signals.

[0098] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the foregoing. As used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. Unless specifically stated otherwise, a component referred to in the singular form is not intended to mean “one and only one,” but rather “one or more.”

[0099] The embodiments described herein can be used in a variety of electronic applications, including but not limited to advanced sensors, memory / data storage, semiconductors, microprocessors, and other applications. The resulting devices and structures, such as integrated circuit (IC) chips, can be distributed by the manufacturer in raw wafer form (i.e., a single wafer with multiple unpackaged chips), bare die, or packaged form. In the latter case, the chip is mounted in a single-chip package (e.g., a plastic carrier with leads attached to a motherboard or other higher-level carrier) or a multi-chip package (e.g., a ceramic carrier, one or both of which have surface interconnects or buried interconnects). In any case, the chip is then integrated with other chips, discrete circuit components, and / or other signal processing devices as part of (a) an intermediate product, such as a motherboard, or (b) a final product. The final product can be any product that includes the integrated circuit chip, ranging from toys and other low-end applications to advanced calculator products with displays, keyboards or other input devices, and central processing units.

[0100] The description of this embodiment has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the embodiments disclosed herein. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the embodiments herein. The embodiments were chosen and described in order to best explain their principles and practical application, and to enable those skilled in the art to understand the various embodiments with various modifications suitable for the particular intended use.

[0101] While the foregoing has described in detail only with a limited number of embodiments, it should be readily understood that the embodiments herein are not limited to such a disclosure. Rather, the components herein can be modified to incorporate any number of variations, alterations, substitutions, or equivalent arrangements not previously described but commensurate with the spirit and scope herein. Furthermore, while various embodiments have been described, it should be understood that aspects herein may be included only by some of the described embodiments. Therefore, the following claims should not be considered as being limited by the foregoing description. All structural and functional equivalents of the components of the various embodiments described throughout this disclosure, which are known to or will be known hereafter by those skilled in the art, are expressly incorporated herein by reference and are intended to be covered by this disclosure. Therefore, it should be understood that changes may be made to the specific embodiments disclosed, which are within the scope outlined by the appended claims.

Claims

1. An amplifier device, characterized in that, include: The Cherry-Hooper amplifier includes a first amplifier and a second amplifier connected to the first amplifier; as well as The distributed differential positive feedback structure includes a first cross-coupled bandwidth boosting stage connected between the output node of the first amplifier and the input node of the second amplifier, and a second cross-coupled bandwidth boosting stage connected to the output node of the second amplifier. The first amplifier, the second amplifier, the first cross-coupled bandwidth boosting stage, and the second cross-coupled bandwidth boosting stage are connected to the positive voltage node and the negative voltage node.

2. The amplifier device according to claim 1, characterized in that, The first amplifier is connected to receive an input voltage, wherein the first amplifier outputs an internal voltage. The second amplifier's input node is connected to receive the internal voltage, and the second amplifier outputs an output voltage at its output node. The Cherry-Hooper amplifier further includes a resistive feedback loop connected to the input node and the output node of the second amplifier.

3. The amplifier device according to claim 1, characterized in that, Each of the first cross-coupled bandwidth enhancement stage and the second cross-coupled bandwidth enhancement stage has an amplifier component connected in opposite directions relative to the voltage nodes of the first amplifier and the second amplifier.

4. The amplifier device according to claim 1, characterized in that, The first cross-coupled bandwidth enhancement stage and the second cross-coupled bandwidth enhancement stage have amplifier components connected between the positive voltage node and the negative voltage node.

5. The amplifier device according to claim 1, characterized in that, The first cross-coupled bandwidth enhancement stage and the second cross-coupled bandwidth enhancement stage form a distributed differential positive feedback between the positive voltage node and the negative voltage node.

6. The amplifier device according to claim 1, characterized in that, The first amplifier and the second amplifier each have positive input and output nodes connected to the positive voltage node and negative input and output nodes connected to the negative voltage node.

7. An amplifier device, characterized in that, include: Positive and negative voltage input ports; A first inverting amplifier has a first input connected to the positive and negative voltage input ports, wherein the first inverting amplifier has a first output connected to internal positive and negative voltage nodes; The second inverting amplifier has a second input connected to the internal positive and negative voltage nodes, wherein the second inverting amplifier has a second output connected to the positive and negative voltage output ports; A resistive feedback loop is connected to the second input and the second output of the second inverting amplifier; A first cross-coupled inverting amplifier is connected between the first output of the first inverting amplifier and the second input of the second inverting amplifier; and A second cross-coupled inverting amplifier is connected to the second output of the second inverting amplifier. The first inverting amplifier, the second inverting amplifier, the first cross-coupled inverting amplifier, and the second cross-coupled inverting amplifier are connected to the internal positive and negative voltage nodes, and the internal positive and negative voltage nodes extend to the positive and negative voltage output ports.

8. The amplifier device according to claim 7, characterized in that, At least one of the first inverting amplifiers and the second inverting amplifier form a Cherry-Hooper amplifier.

9. The amplifier device according to claim 7, characterized in that, The first cross-coupled inverting amplifier and the second cross-coupled inverting amplifier are connected in opposite directions relative to the internal positive and negative voltage nodes.

10. The amplifier device according to claim 7, characterized in that, The first cross-coupled inverting amplifier and the second cross-coupled inverting amplifier have amplifier components connected between the internal positive and negative voltage nodes.

11. The amplifier device according to claim 7, characterized in that, The first cross-coupled inverting amplifier and the second cross-coupled inverting amplifier form a distributed differential positive feedback between the internal positive and negative voltage nodes.

12. The amplifier device according to claim 7, characterized in that, The first inverting amplifier and the second inverting amplifier each have positive input and output nodes and negative input and output nodes connected to the internal positive and negative voltage nodes.

13. An amplifier device, characterized in that, include: Photodiode, output current; A transimpedance amplifier is connected to receive the current and output an initial voltage; as well as A bandwidth enhancement device, comprising at least one enhancement level, wherein each of the at least one enhancement level includes: A first amplifier is connected to receive an input voltage, wherein the first amplifier outputs an internal voltage; A second amplifier has an input node connected to receive the internal voltage, wherein the second amplifier includes an output node that outputs the output voltage. A resistive feedback loop is connected to the input node and the output node of the second amplifier; A first cross-coupled bandwidth enhancement stage is connected between the output node of the first amplifier and the input node of the second amplifier; and The second cross-coupled bandwidth boosting stage is connected to the output node of the second amplifier. The first amplifier, the second amplifier, the first cross-coupled bandwidth boosting stage, and the second cross-coupled bandwidth boosting stage are connected to the positive voltage node and the negative voltage node.

14. The amplifier device according to claim 13, characterized in that, Each of the first cross-coupled bandwidth enhancement stage and the second cross-coupled bandwidth enhancement stage has an amplifier component connected in opposite directions relative to the voltage nodes of the first amplifier and the second amplifier.

15. The amplifier device according to claim 13, characterized in that, The first cross-coupled bandwidth enhancement stage and the second cross-coupled bandwidth enhancement stage have amplifier components connected between the positive voltage node and the negative voltage node.

16. The amplifier device according to claim 13, characterized in that, The first cross-coupled bandwidth enhancement stage and the second cross-coupled bandwidth enhancement stage form a distributed differential positive feedback between the positive voltage node and the negative voltage node.

17. The amplifier device according to claim 13, characterized in that, The first amplifier and the second amplifier each have positive input and output nodes connected to the positive voltage node and negative input and output nodes connected to the negative voltage node.

18. The amplifier device according to claim 13, characterized in that, The first cross-coupled bandwidth boosting stage and the second cross-coupled bandwidth boosting stage have the same amplifier components.

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