Camera module and electronic device

Abstract

The application relates to a camera module and electronic equipment. The camera module comprises an optical lens, a photosensitive assembly and a pressure-resistant structure. The photosensitive assembly comprises a circuit board and a photosensitive chip arranged on the circuit board. The optical lens is arranged on the upper surface of the circuit board. The lower surface of the circuit board is provided with the pressure-resistant structure. When the upper surface of the circuit board is pressed, the pressure-resistant structure is used for maintaining the shape of the circuit board. The camera module is provided with the pressure-resistant structure on the lower surface of the circuit board, effectively resisting the change of the warping degree of the circuit board after being pressed, enabling the circuit board to maintain the original warping degree when the circuit board is assembled with the photosensitive chip, guaranteeing the flatness of the photosensitive chip, and thus improving the imaging quality of the camera module.

Description

Technical Field

[0001] This application relates to the field of camera equipment, and more particularly to a camera module and electronic device. Background Technology

[0002] Camera modules are a crucial component of intelligent equipment, and their application scope and volume in the market are constantly growing. With technological advancements, both work and life are increasingly advocating for intelligentization, and a key prerequisite for achieving this is effective interaction with the external environment. A crucial method for achieving this effective interaction is visual perception, which primarily relies on camera modules. It can be said that camera modules have transformed from obscurity into a vital and critical component of intelligent equipment.

[0003] As consumers' demands for mobile phone photography increase, the functions of mobile phone cameras, or camera modules, are becoming increasingly sophisticated. Features such as portrait shooting, telephoto shooting, optical zoom, and optical image stabilization are all integrated into cameras with limited space. Functions like autofocus, optical image stabilization, and optical zoom often rely on optical actuators, sometimes referred to as motors. However, as the image quality requirements for mobile phone camera modules become increasingly stringent, the size of the image sensor is also increasing, leading to larger and heavier lenses and consequently, more demanding assembly requirements for the camera module.

[0004] In the structure of a camera module, one of its key imaging elements is the photosensitive chip. For the photosensitive chip to function properly during normal operation of the camera module, a corresponding circuit structure is required. During camera module assembly, the photosensitive chip is typically mounted on the upper surface of a circuit board and connected to the circuit board via wires. When the circuit board is connected to an external power supply, the normal operation of the photosensitive chip is guaranteed. Currently, with the trend towards larger chips, the area of ​​the photosensitive chip in camera modules is constantly increasing, and the area of ​​the corresponding circuit board is also increasing accordingly. Due to the inherent characteristics of the circuit board, it has a certain degree of warping at the factory. When the photosensitive chip is mounted on the circuit board, to adapt to the warped circuit board, the warping is compensated for during the mounting process, allowing the photosensitive chip to form an image normally.

[0005] However, the assembly of the camera module involves multiple steps. After setting the photosensitive chip on the circuit board, other components such as the lens holder, lens, and motor need to be installed. At the same time, after the camera module is assembled, it needs to be installed in the terminal device for corresponding imaging. In the subsequent assembly process, other components need to be supported on the circuit board structure, so they will exert a certain pressure on the circuit board, causing the warpage of the circuit board to change, thereby affecting the flatness of the photosensitive chip fixed to it. If the photosensitive chip warps to a certain extent, usually the warpage of the photosensitive chip is difficult to observe with the naked eye, which will affect the imaging quality of the camera module.

[0006] During the assembly of the camera module, the pressure that causes the original warpage of the circuit board to change may affect the imaging quality of the camera module whether it is during the pre - shipment inspection of the camera module or when it is assembled into the terminal device for imaging. At the same time, in order to improve the imaging quality of the camera module, the existing terminal devices are equipped with more than one camera module. To meet the market demand, the camera module needs to be mass - produced. If the problem of the change in the warpage value of the circuit board during the subsequent assembly process cannot be effectively solved, it will seriously affect the detection and production efficiency of the camera module. Summary of the Invention

[0007] Based on the above problems, the present application provides a camera module and an electronic device, which can maintain the original warpage of the circuit board during assembly through a compressive structure, effectively improving the imaging quality of the camera module.

[0008] After bonding the photosensitive chip and the circuit board with glue, the warpage of the circuit board will also change due to the self - variation of the glue. The present application can partially improve the influence of the glue on imaging by setting a compressive structure.

[0009] An embodiment of the present application provides a camera module, including: an optical lens; a photosensitive component, including a circuit board and a photosensitive chip disposed on the circuit board, the optical lens is disposed on the upper surface of the circuit board, and a compressive structure is disposed on the lower surface of the circuit board. When the upper surface of the circuit board is pressurized, the compressive structure is used to maintain the warpage of the circuit board.

[0010] According to some embodiments of the present application, the compressive structure is a closed - loop structure, and the compressive structure is disposed at the edge of the lower surface of the circuit board.

[0011] According to some embodiments of the present application, the compressive structure is in the shape of a double - square.

[0012] According to some embodiments of the present application, the thickness of the compressive structure is 15 - 30 um.

[0013] According to some embodiments of this application, the width of the compressive strength structure is 0.3 to 1 mm.

[0014] According to some embodiments of this application, the material of the pressure-resistant structure is ink.

[0015] According to some embodiments of this application, the ink is applied to the lower surface of the circuit board by spraying or printing.

[0016] According to some embodiments of this application, the material of the pressure-resistant structure may also be conductive cloth, copper foil, or Mylar.

[0017] According to some embodiments of this application, the optical lens includes: a lens mount disposed on the upper surface of the circuit board; a motor disposed on the lens mount; and a lens disposed inside the motor, wherein the motor drives the lens to move relative to the photosensitive chip.

[0018] According to some embodiments of this application, the optical lens includes: a lens mount disposed on the upper surface of the circuit board; and a lens disposed within the lens mount.

[0019] According to some embodiments of this application, a connector is provided at one end of the circuit board, and the connector is used to supply power to the circuit board.

[0020] According to some embodiments of this application, the circuit board is connected to the connector via a flexible circuit board structure.

[0021] According to some embodiments of this application, the photosensitive chip is bonded and fixed to the upper surface of the circuit board and is connected to the circuit board through gold wires.

[0022] According to some embodiments of this application, the surface of the photosensitive chip is perpendicular to the normal line passing through the center point of the circuit board.

[0023] One embodiment of this application provides an electronic device, including: a camera module as described above; and an electronic device body, wherein the camera module is assembled on the electronic device body.

[0024] The camera module of this application has a pressure-resistant structure on the lower surface of the circuit board to prevent deformation under pressure, so that the circuit board maintains the warp degree when assembled with the photosensitive chip, ensuring the flatness of the photosensitive chip, effectively improving the imaging quality of the camera module, and increasing the production efficiency of the camera module. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without exceeding the scope of protection claimed by this application.

[0026] Figure 1 This is a schematic diagram of the circuit board deformation under pressure in an existing camera module;

[0027] Figure 2 This is a schematic diagram of the compressive strength structure of this application;

[0028] Figure 3 This is a bottom view of the circuit board with a pressure-resistant structure as described in this application;

[0029] Figure 4 This is a schematic diagram of the camera module in this application. Figure 1 ;

[0030] Figure 5 This is an exploded view of the camera module in this application;

[0031] Figure 6 This is a cross-sectional view of the camera module of this application;

[0032] Figure 7 This is a schematic diagram of the electronic device of this application;

[0033] Figure 8 This is a schematic diagram of the camera module in this application. Figure 2 . Detailed Implementation

[0034] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0035] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0036] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or connections that allow for communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0037] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0038] To simplify the disclosure of this application, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0039] The preferred embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit this application.

[0040] like Figure 1 As shown, in the camera module, the photosensitive component 1 is a crucial component, comprising a circuit board 11 and a photosensitive chip 12. The photosensitive chip 12, as the imaging element, is generally located on the upper surface of the circuit board 11 and is electrically connected to the circuit board 11 via wires. Due to the characteristics of its constituent materials, the circuit board 11 in the camera module exhibits a certain degree of warpage before leaving the factory, with a warpage value of Q. In this embodiment, the warpage value Q refers to the vertical distance between the highest point and the lowest point of the lower surface of the circuit board 11. Typically, the circuit board 11 forms a warped shape with higher edges and a lower center; the larger the area of ​​the circuit board 11, the larger the warpage value Q.

[0041] The circuit board 11 includes a chip mounting area and a peripheral area. The mounting area is used to mount the photosensitive chip 12. The circuit board 11 is also equipped with electronic components, including but not limited to capacitors and resistors, which are located in the peripheral area.

[0042] When the photosensitive chip 12 is mounted on the circuit board 11, in order to adapt to the warped circuit board 11, the warping problem of the circuit board 11 has been compensated by adjusting the photosensitive chip 12. The flatness of the photosensitive chip 12 mounted on the circuit board 11 has been ensured by the testing equipment, so that the photosensitive chip 12 can form images normally.

[0043] Currently, with the development of large chip modules, the size of the photosensitive chip 12 and the circuit board 11 is gradually increasing. Therefore, the photosensitive chip 12 is more sensitive to changes in the warping of the circuit board 11. After the photosensitive chip 12 is fixed to the circuit board 11, during the subsequent assembly of the module, when components such as the lens, lens mount, and motor are assembled onto the circuit board 11, they will all exert certain pressure on the circuit board 11, causing changes in the warping of the circuit board 11. This affects the flatness of the photosensitive chip 12 bonded to the circuit board 11, causing the photosensitive chip 12 to bend to a certain extent. The bending of the photosensitive chip 12 is difficult to observe with the naked eye, but it will affect the overall imaging quality of the camera module, and in severe cases, it may cause the entire module to malfunction.

[0044] Example 1

[0045] like Figure 2 and Figure 3 As shown, in this embodiment of the application, to prevent changes in the flatness of the photosensitive chip 12 due to changes in the warpage of the circuit board 11 after being subjected to pressure, a pressure-resistant structure is provided in the camera module, especially a corresponding pressure-resistant structure 3 is provided on the circuit board 11. The pressure-resistant structure 3 allows the circuit board 11 to maintain its original warpage after being subjected to external pressure, thereby ensuring the flatness of the photosensitive chip 12 itself and effectively improving the imaging quality of the camera module.

[0046] In one specific embodiment, a corresponding pressure-resistant structure 3 is provided on the lower surface of the circuit board 11, that is, a corresponding pressure-resistant structure 3 is provided at the warped position of the side of the circuit board 11. In order not to increase the overall thickness of the camera module and to ensure the miniaturization of the overall structure of the camera module, the corresponding pressure-resistant structure 3 is only provided at the warped position of the circuit board 11.

[0047] like Figure 4 , Figure 5 and Figure 6 As shown, this embodiment provides a camera module 100, which includes a photosensitive component 1, an optical lens 2, and a pressure-resistant structure 3.

[0048] The photosensitive assembly 1 includes a circuit board 11 and a photosensitive chip 12, wherein the central axis 12 of the photosensitive chip coincides with the optical axis of the optical lens 2. During the assembly of the camera module 100, the photosensitive chip 12 and the circuit board 11 are fixedly bonded to form the photosensitive assembly 1. At this time, the circuit board 11 has a certain degree of warping around its perimeter, such as... Figure 5As shown, during the subsequent assembly process, when the optical lens 2 and the photosensitive component 1 are assembled, the optical lens 2 is fixedly bonded to the upper surface of the circuit board 11 through its edge. The resulting pressure is applied to the side of the circuit board 11, thereby changing its warp and altering the flatness of the photosensitive chip 12 bonded to it, thus affecting the overall imaging quality of the module. Furthermore, when the camera module 100 is assembled onto the electronic device, the pressure on the optical lens 2 is also transmitted to the side of the circuit board 11, changing its warp.

[0049] In this embodiment, a pressure-resistant structure 3 is provided on the lower surface of the circuit board 11. The pressure-resistant structure 3 is located at the warped position on the lower surface of the circuit board 11, so that the thickness of the pressure-resistant structure 3 can resist the deformation caused by external pressure on the circuit board 11. Thus, even if the upper surface of the circuit board is subjected to pressure during subsequent installation, the pressure-resistant structure 3 supports the circuit board 11 to maintain its original shape, resisting the external pressure applied to the circuit board 11, thereby ensuring the flatness of the photosensitive chip 12 in the camera module and ensuring the imaging quality of the camera module 100.

[0050] In this embodiment, the camera module 100 has a pressure-resistant structure 3 on the lower surface of the circuit board 11 to maintain the original warp of the circuit board 11 and prevent deformation of the circuit board 11 from affecting the flatness of the photosensitive chip. Compared with traditional camera modules, the camera module 100 improves the imaging quality and is suitable for mass production.

[0051] According to an optional technical solution of this application, the pressure-resistant structure 3 is disposed on the edge of the lower surface of the circuit board. The pressure-resistant structure 3 is a closed-loop structure surrounding the edge of the circuit board 11, so as to provide uniform support for the circuit board 11 and ensure the flatness of the photosensitive chip 12 in the camera module.

[0052] According to an optional technical solution of this application, the pressure-resistant structure 3 is U-shaped. Typically, the circuit board 11 is rectangular, and the pressure-resistant structure 3 is set in a U-shape to match the circuit board 11, providing stable support and preventing excessive deformation of the circuit board 11. Simultaneously, the U-shaped pressure-resistant structure 3 does not increase the height of the camera module itself, which is beneficial for the miniaturization of the camera module. The shape of the pressure-resistant structure 3 can be changed according to the shape of the circuit board 11, and this application does not impose any limitations on this.

[0053] According to an optional technical solution of this application, for circuit boards 11 with a warpage value Q greater than 15µm, a pressure-resistant structure 3 is more necessary. The larger the warpage value Q, the more easily the flatness of the photosensitive chip 12 is affected when the circuit board 11 is under pressure. The thickness of the pressure-resistant structure 3 can be set to be basically consistent with the warpage value Q of the circuit board 11, so that the pressure-resistant structure 3 can better support the circuit board 11. Optionally, the thickness of the pressure-resistant structure 3 is 15-30µm, for example, the thickness of the pressure-resistant structure 3 is 15µm, 20µm, 25µm, 30µm, etc., and the thickness of the pressure-resistant structure 3 can be set according to requirements.

[0054] Optionally, such as Figure 3 As shown, in this embodiment, the width D of the pressure-resistant structure 3 is 0.3–1 mm. For example, the width D of the pressure-resistant structure 3 is 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1 mm. The data range given in this embodiment is for reference only. The specific thickness and width of the pressure-resistant structure 3 need to be set according to the specific dimensions of the module, such as simultaneously considering the size of the photosensitive chip 12, the size of the circuit board 11 itself, and its extremely small deformation after being compressed. The deformation of the circuit board 11 can be detected using corresponding detection tools.

[0055] According to an optional technical solution of this application, the material of the pressure-resistant structure 3 is ink. An ink layer is provided on the lower surface of the circuit board 11 as the pressure-resistant structure 3. The ink layer on the lower surface of the circuit board 11 is mainly used to maintain the warpage of the circuit board 11 itself, and the ink is located at the warped position of the circuit board 11. The ink layer itself has a certain thickness, and the ink layer can provide some support for the warped circuit board itself. It is preferable that the thickness of the ink layer is basically consistent with the warpage value Q of the circuit board 11. Setting the ink layer into a U-shaped structure does not increase the thickness of the camera module itself, so as to achieve miniaturization of the overall structure of the camera module 100 and meet the increasingly precise requirements of electronic devices. The ink itself has a relatively simple manufacturing process, which can be achieved by spraying or printing, effectively simplifying the manufacturing process of the camera module and improving the production efficiency of the camera module.

[0056] Specifically, when the pressure-resistant structure 3 is made of ink, it can be applied to the lower surface of the circuit board 11 by spraying or printing. In one optional embodiment, a baffle is used to cover areas on the lower surface of the circuit board 11 that do not require ink filling. Then, a sprayer is used to spray the corresponding ink onto the uncovered areas. Spraying is stopped when the ink reaches a predetermined thickness, thus forming the pressure-resistant structure 3. In another optional embodiment, the ink layer is prepared by printing. A corresponding grid structure is set up and covered on the lower surface of the circuit board. The ink is then brushed onto the grid structure using a printing method. Once the ink thickness reaches a predetermined value, brushing is stopped, and the ink is allowed to air dry naturally before proceeding to subsequent assembly steps.

[0057] The aforementioned application of an ink layer on the lower surface of the circuit board is only one implementation of the pressure-resistant structure. Other methods can also be used to maintain the warp of the circuit board, ensuring it retains its original warp degree under external pressure. For example, the ink can be replaced with conductive cloth, copper foil, or Mylar, etc. These materials share the following characteristics: they possess a certain thickness, allowing for good adhesion to the circuit board 11. When the material is applied to the warped portion of the circuit board 11, it provides support. When the circuit board 11 is subjected to external pressure, the material maintains its original warp degree, ensuring the flatness of the photosensitive chip 12 and improving the imaging quality of the camera module 100.

[0058] According to an optional technical solution of this application, the camera module 100 is an autofocus camera module. The optical lens 2 includes: a lens 21, a motor 22, and a lens mount 23. The lens mount 23 is disposed on the upper surface of the circuit board 11. Optionally, the lower surface of the lens mount 23 is bonded to the edge of the upper surface of the circuit board 11 with adhesive. The motor 22 is disposed on the lens mount 23. Optionally, the motor 22 can be a voice coil motor; this application does not limit the type of motor 22. The lens 21 is disposed inside the motor 22, and the motor 22 drives the lens 21 to move relative to the photosensitive chip 12. The photosensitive chip 12 is located on the optical axis of the lens 21, and the movement of the lens 21 achieves autofocus of the camera module 100. Optionally, there can be multiple lenses 21, which are sequentially disposed on the motor 22.

[0059] During the assembly of the camera module 100, the circuit board 11 and the photosensitive chip 12 are fixedly bonded to form the photosensitive component 1, and the circuit board 11 has a certain degree of warping around its perimeter. In subsequent assembly processes, when the lens mount 23, motor 22, and lens 21 are assembled, the lens mount 23 is fixedly bonded to the edge of the upper surface of the circuit board 11 through its edge portion. The pressure applied to the lens 21, motor 22, and lens mount 23 will ultimately be applied to the side of the circuit board 11. This pressure alters the warping of the circuit board 11, causing changes in the flatness of the photosensitive chip 12 bonded to it, thereby affecting the imaging quality of the camera module 100.

[0060] By setting a corresponding anti-pressure structure 3 on the lower surface of the circuit board 11 of the autofocus camera module, the deformation caused by external pressure on the circuit board 11 can be resisted. This ensures that during subsequent installation, whether the lens mount 23 is subjected to force or the lens 21 and motor 22 apply pressure to the lens mount 23, the circuit board 11 can maintain its original warp to resist the external pressure applied to the circuit board 11, thereby ensuring the flatness of the photosensitive chip 12 in the camera module 100.

[0061] Optionally, a filter is provided on the lens mount 23, located between the lens 21 and the image sensor 12, to filter light passing through the lens 21. Specifically, the filter is positioned in the light propagation path formed by the lens 21 and the image sensor 12, filtering out light fluctuations that affect image quality, such as infrared light. The filter can be an infrared filter, a blue glass filter, a wafer-level infrared cutoff filter, a transmissive filter, a visible light filter, etc.

[0062] According to an optional technical solution of this application, the camera module 100 is a fixed-focus camera module. The optical lens 2 includes a lens mount and a lens element. The lens mount is disposed on the upper surface of the circuit board 11, and the lens element is disposed inside the lens mount.

[0063] During the assembly of the camera module 100, the circuit board 11 and the photosensitive chip 12 are fixedly bonded to form the photosensitive component 1, and the circuit board 11 has a certain degree of warping around its perimeter. In subsequent assembly processes, when the lens mount and lens are assembled, the lens mount is fixedly bonded to the edge of the upper surface of the circuit board 11 through its edge portion. The pressure applied to the lens and lens mount is ultimately applied to the side of the circuit board 11. Under pressure, the circuit board 11 changes its warping, causing a change in the flatness of the photosensitive chip 12 bonded to it, thereby affecting the imaging quality of the camera module 100.

[0064] By setting a corresponding anti-pressure structure 3 on the lower surface of the circuit board 11 of the fixed focal length camera module, the deformation caused by external pressure on the circuit board 11 can be resisted. This ensures that during subsequent installation, whether the lens mount or the lens is under force, the circuit board 11 can maintain its original warp to resist the external pressure applied to the circuit board 11, thereby ensuring the flatness of the photosensitive chip 12 in the camera module 100.

[0065] The mirror mount is located on the upper surface of the circuit board 11, and the pressure-resistant structure 3 is disposed on the lower surface of the circuit board 11. The mirror mount is bonded to the circuit board 11 with adhesive, and variations in the adhesive may affect the warpage of the circuit board 11. By providing the pressure-resistant structure 3, the impact of adhesive variations on the circuit board 11 can be partially mitigated.

[0066] According to an optional technical solution of this application, the circuit board 11 is connected to the connector 5, and the circuit board 11 is connected to the electronic device through the connector 5, and the connector 5 supplies power to the circuit board 11.

[0067] According to an optional technical solution of this application, the circuit board 11 is connected to the connector 5 through the flexible board structure 4, so that the connector 5 has a certain degree of freedom, which facilitates the connection of the connector 5 to electronic devices.

[0068] Optionally, the photosensitive chip 12 is bonded and fixed to the upper surface of the circuit board 11, and is connected to the circuit board 11 by gold wire.

[0069] According to an optional technical solution of this application, the surface of the photosensitive chip 12, including the upper surface and the lower surface of the photosensitive chip 12, is perpendicular to the normal line passing through the center point of the circuit board 11, so as to improve the imaging quality of the camera module 100.

[0070] Example 2

[0071] like Figure 7 As shown, this embodiment provides an electronic device, which includes a camera module 100 and an electronic device body 200 as described above. The camera module 100 is assembled into the electronic device body 200. Optionally, the electronic device in this embodiment can be a mobile phone, tablet computer, wearable device, television, vehicle, monitoring device, etc., and this application does not limit it to these. The camera module 100 works with the electronic device to realize the function of image acquisition and reproduction of target objects.

[0072] During the assembly of the camera module 100, the circuit board 11 and the photosensitive chip 12 are fixedly bonded to form the photosensitive component 1, and the circuit board 11 has a certain degree of warping around its perimeter. When assembling the camera module 100 onto the electronic device body 200, in order to ensure the thinness and lightness of the electronic device, the outer shell 210 of the electronic device body 200 needs to be tightly integrated with the camera module 100. The force exerted by the outer shell 210 of the electronic device body 200 on the camera module 100 will eventually be transmitted to the circuit board 11 of the camera module 100, causing a change in the warping of the circuit board 11 itself, affecting the flatness of the photosensitive chip 12, and thus affecting the quality of the image captured by the entire electronic device.

[0073] This application provides a corresponding pressure-resistant structure 3 on the lower surface of the circuit board 11 of the camera module 100, which can resist the deformation caused by external pressure on the circuit board 11. This allows the circuit board 11 to maintain its original warpage and resist external pressure when the camera module 100 is assembled with the electronic device body 200, even if it is subjected to pressure from the outer shell 210 of the electronic device body 200. This ensures the flatness of the photosensitive chip 12 in the camera module 100.

[0074] like Figure 8 As shown, a corresponding pressure-resistant structure 3 is provided on the lower surface of the circuit board 11. The thickness of the pressure-resistant structure 3 is set to be basically consistent with the warpage value Q of the circuit board 11. The pressure-resistant structure 3 can be provided on the lower surface of the circuit board 11 after the photosensitive chip 12 is assembled onto the circuit board 11, or a process of providing the pressure-resistant structure 3 can be added after the assembly of other components of the camera module 100. Preferably, the pressure-resistant structure 3 is provided on the lower surface of the circuit board 11 after the photosensitive chip 12 is assembled onto the circuit board 11.

[0075] According to an optional technical solution of this application, the material of the pressure-resistant structure 3 is ink. An ink layer is provided on the lower surface of the circuit board 11 as the pressure-resistant structure 3. The ink layer on the lower surface of the circuit board 11 is mainly used to maintain the warpage of the circuit board 11 itself, and the ink is mainly located at the warped positions of the circuit board 11. The ink layer itself has a certain thickness, which can provide some support for the warped circuit board itself. It is preferable that the thickness of the ink layer is basically consistent with the warpage value Q of the circuit board 11. Setting the ink layer into a U-shaped structure does not increase the thickness of the camera module itself, thus achieving miniaturization of the overall structure of the camera module 100 and meeting the increasingly sophisticated needs of electronic devices. The ink itself has a relatively simple manufacturing process, requiring only spraying or printing, which can effectively simplify the manufacturing process of the camera module and improve the production efficiency of the camera module.

[0076] Specifically, when the pressure-resistant structure 3 is made of ink, it can be applied to the lower surface of the circuit board 11 by spraying or printing. The ink spraying process is as follows: A baffle is used to cover the areas on the lower surface of the circuit board 11 that are not filled with ink. Then, a spraying machine is used to spray the corresponding ink onto the uncovered areas. Spraying is stopped when the ink reaches a predetermined thickness, thus forming the pressure-resistant structure 3. The ink printing process is as follows: A corresponding grid structure is set up and covered on the lower surface of the circuit board. The ink is then brushed onto the grid structure using a printing method. Once the ink thickness reaches the predetermined requirement, brushing is stopped, and the ink is allowed to air dry naturally before proceeding to the subsequent assembly steps.

[0077] The camera module with a pressure-resistant structure provided in this application is suitable for various types of camera module structures, especially for camera modules with large image sensor sizes. It can also be used in periscope modules, OIS image stabilization modules, and retractable camera modules, etc., which can effectively improve the pressure resistance of the camera module to better ensure the imaging quality of the camera module.

[0078] The camera module of this application features a pressure-resistant structure on the lower surface of the circuit board. This structure effectively resists changes in the warpage of the circuit board under pressure, ensuring that the circuit board maintains its warpage during assembly with the photosensitive chip, thus significantly improving the image quality of the camera module. The pressure-resistant structure does not increase the thickness of the camera module, facilitating its miniaturization. After the camera module is assembled into the electronic device body, the pressure exerted by the outer casing of the electronic device body on the camera module will not cause changes in the warpage of the circuit board, ensuring that the flatness of the photosensitive chip remains unchanged and improving the yield rate of the electronic device.

[0079] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the technical solutions and core ideas of this application. Therefore, any changes or modifications made by those skilled in the art based on the ideas of this application, and on the specific implementation methods and application scope of this application, are all within the scope of protection of this application. In summary, the content of this specification should not be construed as a limitation of this application.

Claims

1. A camera module, characterized in that, include: Optical lens; A photosensitive component includes a circuit board and a photosensitive chip disposed on the circuit board. An optical lens is disposed on the upper surface of the circuit board, and a pressure-resistant structure is provided on the lower surface of the circuit board. When the upper surface of the circuit board is subjected to pressure, the pressure-resistant structure is used to maintain the warpage of the circuit board. The pressure-resistant structure is a closed-loop structure and is disposed at the edge of the lower surface of the circuit board. The pressure-resistant structure is U-shaped and has a thickness of 15-30 μm.

2. The camera module according to claim 1, characterized in that, The width of the compressive strength structure is 0.3 to 1 mm.

3. The camera module according to claim 1, characterized in that, The material of the pressure-resistant structure is ink.

4. The camera module according to claim 3, characterized in that, The ink is applied to the lower surface of the circuit board by spraying or printing.

5. The camera module according to claim 1, characterized in that, The material of the pressure-resistant structure can also be conductive cloth, copper foil, or Mylar.

6. The camera module according to claim 1, characterized in that, The optical lens includes: A mirror mount is disposed on the upper surface of the circuit board; The motor is mounted on the mirror mount; A lens is disposed inside the motor, and the motor drives the lens to move relative to the photosensitive chip.

7. The camera module according to claim 1, characterized in that, The optical lens includes: A mirror mount is disposed on the surface of the circuit board; The lens is disposed within the lens mount.

8. The camera module according to claim 1, characterized in that, A connector is provided at one end of the circuit board, and the connector is used to supply power to the circuit board.

9. The camera module according to claim 8, characterized in that, The circuit board is connected to the connector via a flexible circuit board structure.

10. The camera module according to claim 1, characterized in that, The photosensitive chip is bonded and fixed to the upper surface of the circuit board and is connected to the circuit board through gold wires.

11. The camera module according to claim 1, characterized in that, The surface of the photosensitive chip is perpendicular to the normal line passing through the center point of the circuit board.

12. An electronic device, characterized in that, include: The camera module according to any one of claims 1 to 11; The electronic device body, wherein the camera module is assembled on the electronic device body.

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