Magnetic assembly, power conversion module and process method of magnetic assembly

Abstract

This application relates to a magnetic component, a power conversion module, and a manufacturing method for the magnetic component. The magnetic component includes a first conductive structure, a second conductive structure, and a core material. The first conductive structure includes a first connecting portion, a first conductive body, and a second connecting portion. The second conductive structure includes a third connecting portion, a second conductive body, and a fourth connecting portion. The core material is pressed together with the first and second conductive structures. The first and second conductive structures are embedded within the core material. The first and third connecting portions are exposed on a fifth surface, and the second and fourth connecting portions are exposed on a sixth surface. The first and second connecting portions are exposed on any two of the first, second, third, and fourth surfaces, respectively. The third and fourth connecting portions are exposed on any two of the first, second, third, and fourth surfaces, respectively.

Description

Technical Field

[0001] This application relates to a magnetic component and its power conversion module, and more particularly to a small-sized magnetic component and its power conversion module. Background Technology

[0002] With the rapid development of technologies such as mobile communication and cloud computing, power conversion modules have been widely used in communication products and data centers. As communication products are moving towards higher power and smaller size, power conversion modules need to address issues of conversion efficiency, size, and heat dissipation. Therefore, designing reasonable structures and layouts for power conversion modules and the magnetic components used in them to improve conversion efficiency, reduce size, and lower thermal resistance is a current industry trend.

[0003] Currently, power conversion modules commonly employ two-phase interleaved parallel buck converter circuits, which offer advantages such as low output current ripple, small output filter size, and high system output power, thus enjoying widespread use in power conversion modules. This two-phase interleaved parallel buck converter circuit further utilizes winding-coupled magnetic components, i.e., coupled inductors, to further reduce the output current ripple of the power conversion module and improve its dynamic response. However, the magnetic components in the power conversion module have significant losses, and the magnetic components constituting the inductors are also relatively large. Therefore, reducing the size and losses of the magnetic components is a key technology for improving the efficiency of power conversion modules.

[0004] Traditional power conversion modules consist of a main frame and magnetic components. The main frame is constructed from a printed circuit board. The magnetic components consist of an E-type magnetic core and windings, with the E-type magnetic core embedded within the main frame to form an inductor. However, due to the large height tolerance of the E-type magnetic core and the main frame constructed from the printed circuit board, the overall height tolerance of the power conversion module is large, and the effective volume is small. This results in significant losses in the magnetic core and windings of the magnetic components, making the inductor formed by the magnetic components prone to saturation.

[0005] Therefore, developing a magnetic component and its power conversion module that overcomes the above-mentioned shortcomings is an urgent need at present. Summary of the Invention

[0006] The purpose of this application is to provide a magnetic component and its power conversion module, which can achieve the advantage of small size.

[0007] To achieve the above objectives, a broader embodiment of this application provides a magnetic component comprising a first conductive structure, a second conductive structure, a core material, a first electroplating structure, and a second electroplating structure. The first conductive structure includes a first connecting portion, a first conductive body, and a second connecting portion, wherein the first conductive body is connected between the first connecting portion and the second connecting portion. The second conductive structure includes a third connecting portion, a second conductive body, and a fourth connecting portion, wherein the second conductive body is connected between the third connecting portion and the fourth connecting portion. The powder core material is pressed together with the first and second conductive structures to form the first, second, third, fourth, fifth, and sixth surfaces of the magnetic component. The first and second conductive structures are embedded within the powder core material, and the first and third surfaces are positioned opposite each other, as are the second and fourth surfaces, and the fifth and sixth surfaces. The first and third connecting portions are both exposed on the fifth surface, and the second and fourth connecting portions are both exposed on the sixth surface. The first and second connecting portions are exposed on any two of the first, second, third, and fourth surfaces, and the third and fourth connecting portions are exposed on any two of the first, second, third, and fourth surfaces, respectively. A first electroplated structure is electroplated on the fifth, second, and sixth surfaces. A second electroplated structure is electroplated on the fifth, fourth, and sixth surfaces.

[0008] To achieve the above objectives, another broader embodiment of this application provides a power conversion module, comprising a first circuit board, a magnetic component, and two switching components. The first circuit board includes a first surface and a second surface disposed opposite to each other. The structure of the magnetic component is as described above. The two switching components are disposed on the first circuit board, and the two switching components are respectively connected to a first connection portion of a first conductive structure and a second connection portion of a second conductive structure via wiring within the first circuit board.

[0009] To achieve the above objectives, another broader embodiment of this application provides a manufacturing method for a magnetic component. First, a first conductive structure and a second conductive structure are provided. The first conductive structure includes a first connecting portion, a first conductive body, and a second connecting portion, with the first conductive body connected between the first and second connecting portions. The second conductive structure includes a third connecting portion, a second conductive body, and a fourth connecting portion, with the second conductive body connected between the third and fourth connecting portions. Next, a core material is provided, and the core material is pressed together with the first and second conductive structures to form a first, second, third, fourth, fifth, and sixth surface of the magnetic component. The first and second conductive structures are embedded within the core material, with the first and third surfaces facing each other, the second and fourth surfaces facing each other, and the fifth and sixth surfaces facing each other. Next, the core material is polished so that the first and third connecting portions are exposed on the fifth surface, and the second and fourth connecting portions are exposed on the sixth surface. Furthermore, the first and second connecting portions are exposed on any two of the first, second, third, and fourth surfaces, and the third and fourth connecting portions are exposed on any two of the first, second, third, and fourth surfaces, respectively. Next, a first electroplated structure is electroplated on the fifth, second, and sixth surfaces, and a second electroplated structure is electroplated on the fifth, fourth, and sixth surfaces. Attached Figure Description

[0010] Figure 1A This is a schematic diagram of the power conversion module according to the first embodiment of this application.

[0011] Figure 1B for Figure 1A The diagram shows a structural schematic of the power conversion module from another perspective.

[0012] Figure 1C for Figure 1A The diagram shows an exploded view of the power conversion module.

[0013] Figure 1D for Figure 1C The diagram shows an exploded view of the power conversion module from another perspective.

[0014] Figure 2 for Figure 1A The equivalent circuit topology of the power conversion module is shown.

[0015] Figure 3A for Figure 1A The diagram shows a structural schematic of a first embodiment of the magnetic component of the power conversion module.

[0016] Figure 3B for Figure 3A The diagram shows the exploded structure of the magnetic component.

[0017] Figure 3C for Figure 3A The flowchart of the manufacturing process for the magnetic component is shown.

[0018] Figure 3D for Figure 3A The flowchart shows another process for manufacturing the magnetic component.

[0019] Figure 4A for Figure 1A The diagram shows a second embodiment of the magnetic component of the power conversion module.

[0020] Figure 4B for Figure 4A The diagram shows the exploded structure of the magnetic component.

[0021] Figure 5A for Figure 1A The diagram shows a third embodiment of the magnetic component of the power conversion module.

[0022] Figure 5B for Figure 5A The diagram shows the exploded structure of the magnetic component.

[0023] Figure 6A for Figure 1A The diagram shows a fourth embodiment of the magnetic component of the power conversion module.

[0024] Figure 6B for Figure 6A The diagram shows the exploded structure of the magnetic component.

[0025] Figure 7 This is an exploded structural diagram of the power conversion module according to the second embodiment of this application.

[0026] Figure 8A This is a schematic diagram of the power conversion module according to the third embodiment of this application.

[0027] Figure 8B for Figure 8A The diagram shows a structural schematic of the power conversion module from another perspective.

[0028] Figure 9A This is a schematic diagram of the power conversion module according to the fourth embodiment of this application.

[0029] Figure 9B for Figure 9A The diagram shows an exploded view of the power conversion module.

[0030] Figure 10A for Figure 9A The diagram shows the structure of the magnetic component of the power conversion module.

[0031] Figure 10B for Figure 10A The diagram shows the exploded structure of the magnetic component.

[0032] Figure 11A for Figure 9A A schematic diagram of another embodiment of the magnetic component of the power conversion module shown.

[0033] Figure 11B for Figure 11A The diagram shows the exploded structure of the magnetic component.

[0034] Figure 12 This is a schematic diagram of the power conversion module according to the fifth embodiment of this application.

[0035] Figure 13A for Figure 12 The diagram shows the structure of the magnetic component of the power conversion module.

[0036] Figure 13B for Figure 13A The diagram shows the exploded structure of the magnetic component.

[0037] Figure 14A This is a schematic diagram of the power conversion module according to the sixth embodiment of this application.

[0038] Figure 14B for Figure 14A The diagram shows a structural schematic of the power conversion module from another perspective.

[0039] Figure 14C for Figure 14A The diagram shows an exploded view of the power conversion module.

[0040] Figure 15A This is a structural schematic diagram of a fifth embodiment of the magnetic component of a power conversion module.

[0041] Figure 15B for Figure 15A The diagram shows the exploded structure of the magnetic component.

[0042] Figure 16A This is a schematic diagram of a sixth embodiment of the magnetic component of a power conversion module.

[0043] Figure 16B for Figure 16A The diagram shows the exploded structure of the magnetic component.

[0044] The reference numerals in the attached figures are explained as follows:

[0045] 1, 1a, 1b, 1c, 1d, 1e: Power conversion modules

[0046] Vin+: Input positive terminal

[0047] Vin-: Negative input terminal

[0048] Vo+: Positive output terminal

[0049] Vo-: Negative output terminal

[0050] Cin: Input capacitance

[0051] Q1A, Q2A, Q1B, Q2B: Switching elements

[0052] L1: First Inductor

[0053] L2: Second Inductor

[0054] Co: Output capacitor

[0055] 2: First circuit board

[0056] 21: First Page

[0057] 22: Second page

[0058] 23: Groove

[0059] 3, 3a, 3b, 3c, 3d, 3e, 3f, 3g, 3h: Magnetic components

[0060] 301: First Page

[0061] 302: Second Page

[0062] 303: Third Page

[0063] 304: Fourth Page

[0064] 305: Page 5

[0065] 306: Page Six

[0066] 307: Solder pad

[0067] 31: First conductive structure

[0068] 311: First connecting part

[0069] 312: First conductive body

[0070] 312a: First extension

[0071] 312b: Second extension

[0072] 312c: Third Extension

[0073] 312d: Fourth Extension

[0074] 312e: Fifth Extension

[0075] 313: Second connecting part

[0076] 32: Second conductive structure

[0077] 321: Third connecting part

[0078] 322: Second conductive body

[0079] 322a: Fourth Extension

[0080] 322b: Fifth Extension

[0081] 322c: Sixth Extension

[0082] 322a: Sixth Extension

[0083] 322b: Seventh Extension

[0084] 322c: Eighth Extension

[0085] 322d: Ninth Extension

[0086] 322e: Tenth Extension

[0087] 323: Fourth connecting part

[0088] 33: Powder core material

[0089] 34: First electroplating structure

[0090] 34a: First sub-plated conductive part

[0091] 35: Second electroplating structure

[0092] 35a: Second sub-plated conductive part

[0093] 36: Third conductive structure

[0094] 37: Fourth conductive structure

[0095] 38: Ferrite Structure

[0096] 4: Switching components

[0097] 5: Second circuit board

[0098] 51: First Page

[0099] 52: Second page

[0100] θ1~θ12: included angle

[0101] S1, S2, S3, S4, S5: Steps Detailed Implementation

[0102] Some typical embodiments embodying the features and advantages of this application will be described in detail in the following description. It should be understood that this application can have various variations in different forms, all of which do not depart from the scope of this application, and the descriptions and drawings therein are for illustrative purposes only and not for limiting this application.

[0103] Please see Figure 1A , Figure 1B , Figure 1C , Figure 1D , Figure 2 , Figure 3A and Figure 3B ,in Figure 1A This is a schematic diagram of the power conversion module according to the first embodiment of this application. Figure 1B for Figure 1A The diagram shown is a structural schematic of the power conversion module from another perspective. Figure 1C for Figure 1A The diagram shown is an exploded view of the power conversion module. Figure 1D for Figure 1C The diagram shows an exploded view of the power conversion module from another perspective. Figure 2 for Figure 1A The equivalent circuit topology of the power conversion module is shown below. Figure 3A for Figure 1A The diagram shows a structural schematic of a first embodiment of the magnetic component of the power conversion module. Figure 3B for Figure 3A The diagram shows an exploded view of the magnetic component. In this embodiment, the power conversion module 1 can be an interleaved parallel Buck circuit, as shown in the circuit topology... Figure 2As shown, the power conversion module 1 includes an input positive terminal Vin+, an input negative terminal Vin-, an output positive terminal Vo+, an output negative terminal Vo-, an input capacitor Cin, four switching elements Q1A, Q2A, Q1B, Q2B, a first inductor L1, a second inductor L2, and an output capacitor Co. The input negative terminal Vin- and the output negative terminal Vo- are shorted to each other. The input capacitor Cin is electrically connected between the input positive terminal Vin+ and the input negative terminal Vin-. The two switching elements Q1A and Q2A are connected in series to form a first half-bridge arm, which is electrically connected between the input positive terminal Vin+ and the input negative terminal Vin-. The first half-bridge arm and the input capacitor Cin form a closed loop. The other two switching elements, Q1B and Q2B, are connected in series to form a second half-bridge arm, electrically connected between the positive input terminal Vin+ and the negative input terminal Vin-. The second half-bridge arm and the input capacitor Cin form another closed loop, and the second half-bridge arm is connected in parallel with the first half-bridge arm. The voltage phase of the drive signal used to drive the second half-bridge arm is 180 degrees different from the voltage phase of the drive signal used to drive the first half-bridge arm. One end of the first inductor L1 is electrically connected to the midpoint of the first half-bridge arm, and the other end is electrically connected to the positive output terminal Vo+. One end of the second inductor L2 is electrically connected to the midpoint of the second half-bridge arm, and the other end is electrically connected to the positive output terminal Vo+. The output capacitor Co is electrically connected between the positive output terminal Vo+ and the negative output terminal Vo-.

[0104] In some embodiments, the first inductor L1 and the second inductor L2 are coupled to reduce the output current ripple of the first half-bridge arm and the second half-bridge arm, and improve the dynamic response of the power conversion module 1.

[0105] In terms of actual structure, such as Figures 1A to 1D As shown, the power conversion module 1 of this embodiment is disposed on a system board (not shown), and the power conversion module 1 includes a first circuit board 2, a magnetic component 3, two switching components 4, an input capacitor Cin, and a second circuit board 5. The first circuit board 2 includes a first surface 21 and a second surface 22 disposed opposite to each other. The magnetic component 3 is used to construct... Figure 2 The first inductor L1 and the second inductor L2 are shown, and the magnetic component 3 has a first surface 301, a second surface 302, a third surface 303, a fourth surface 304, a fifth surface 305, and a sixth surface 306. The first surface 301 and the third surface 303 of the magnetic component 3 are arranged opposite each other, the second surface 302 and the fourth surface 304 of the magnetic component 3 are arranged opposite each other, and the fifth surface 305 and the sixth surface 306 of the magnetic component 3 are arranged opposite each other. The first surface 301, the second surface 302, the third surface 303, and the fourth surface 304 of the magnetic component 3 are located between the fifth surface 305 and the sixth surface 306 of the magnetic component 3. The fifth surface 305 of the magnetic component 3 is attached to the second surface 22 of the first circuit board 2. The two switch components 4 respectively include Figure 2 The switching elements (Q1A and Q2A) on the first half-bridge arm and the switching elements (Q1B and Q2B) on the second half-bridge arm are shown. Two switching assemblies 4 are disposed on the first surface 21 of the first circuit board 2, and are electrically connected to the magnetic component 3 via wiring within the first circuit board 2. Since the switching assembly 4 is the component with the highest loss in the overall power conversion module 1, when an additional heat sink (not shown) is installed to dissipate heat from the power conversion module 1, the heat sink can be installed adjacent to the switching assembly 4 to minimize the distance between the heat sink and the switching assembly 4 and reduce thermal resistance, thereby effectively reducing the temperature of the switching assembly 4, and thus reducing the overall temperature of the power conversion module 1. The input capacitor Cin is disposed on the first surface 21 of the first circuit board 2, adjacent to the two switching assemblies 4, and is electrically connected to the switching assembly 4 via wiring within the first circuit board 2. The second circuit board 5 includes a first surface 51 and a second surface 52. The first surface 51 and the second surface 52 of the second circuit board 5 are arranged opposite to each other. The first surface 51 of the second circuit board 5 is attached to the sixth surface 306 of the magnetic component 3, so that the second circuit board 5 and the first circuit board 2 are located on opposite sides of the magnetic component 3, and the second circuit board 5 and the first circuit board 2 are electrically connected through the magnetic component 3. The second circuit board 5 is disposed on the system board through the second surface 52.

[0106] The following is based on Figure 3A and Figure 3B The structure of the magnetic component 3 is further explained below. The magnetic component 3 includes a first conductive structure 31, a second conductive structure 32, a core material 33, a first electroplating structure 34, a second electroplating structure 35, a third conductive structure 36, and a fourth conductive structure 37. The first conductive structure 31 is manufactured by pre-forming and is used to form the first winding of the magnetic component 3, while also transmitting power signals. It includes a first connecting portion 311, a first conductive body 312, and a second connecting portion 313. The first connecting portion 311 is the input terminal of the first conductive structure 31. The first connecting portion 311 is adjacent to the first surface 301 and the fifth surface 305 of the magnetic component 3, and a portion of the first connecting portion 311 is exposed on the first surface 301 and the fifth surface 305 of the magnetic component 3. The first connecting portion 311 extends from the fifth surface 305 of the magnetic component 3 toward the sixth surface 306. The first conductive body 312 is connected between the first connecting portion 311 and the second connecting portion 313, and one end of the first conductive body 312 is connected to the first connecting portion 311 and extends from the first surface 301 of the magnetic component 3 toward the third surface 303. The included angle θ1 between the first conductive body 312 and the first connecting portion 311 is between 60 degrees and 120 degrees. Figure 3BAs shown, in this embodiment, the included angle θ1 between the first conductive body 312 and the first connecting portion 311 is 90 degrees, making the first conductive body 312 parallel to the fifth surface 305 and the sixth surface 306 of the magnetic component 3. The second connecting portion 313 is the output end of the first conductive structure 31, and the second connecting portion 313 and the first connecting portion 311 are respectively partially exposed on any two of the first surface 301, the second surface 302, the third surface 303, and the fourth surface 304 of the magnetic component 3. In this embodiment, the second connecting portion 313 is adjacent to the third surface 303 and the sixth surface 306 of the magnetic component 3, and part of the second connecting portion 313 is exposed on the third surface 303 and the sixth surface 306 of the magnetic component 3. The second connecting portion 313 is connected to the other end of the first conductive body 312 and extends from the fifth surface 305 toward the sixth surface 306. The included angle θ2 between the second connecting portion 313 and the first conductive body 312 is between 60 degrees and 120 degrees. Figure 3B As shown, in this embodiment, the included angle θ2 between the second connecting part 313 and the first conductive body 312 is 90 degrees.

[0107] The second conductive structure 32 is pre-formed and serves as the second winding of the magnetic component 3, while also transmitting power signals. The second conductive structure 32 is spaced apart from the first conductive structure 31 and is adjacent to the fourth surface 304 of the magnetic component 3 relative to the first conductive structure 31. The second conductive structure 32 includes a third connecting portion 321, a second conductive body 322, and a fourth connecting portion 323. The third connecting portion 321 is the input terminal of the second conductive structure 32. The third connecting portion 321 is adjacent to the first surface 301 and the fifth surface 305 of the magnetic component 3, and a portion of the third connecting portion 321 is exposed on the first surface 301 and the fifth surface 305 of the magnetic component 3. The third connecting portion 321 extends from the fifth surface 305 of the magnetic component 3 towards the sixth surface 306. The second conductive body 322 is connected between the third connecting portion 321 and the fourth connecting portion 323, and one end of the second conductive body 322 is connected to the third connecting portion 321 and extends from the first surface 301 of the magnetic component 3 toward the third surface 303. The included angle θ3 between the second conductive body 322 and the third connecting portion 321 is between 60 degrees and 120 degrees. Figure 3BAs shown, in this embodiment, the included angle θ3 between the second conductive body 322 and the third connecting portion 321 is 90 degrees, making the second conductive body 322 parallel to the fifth surface 305 and the sixth surface 306 of the magnetic component 3. The fourth connecting portion 323 is the output end of the second conductive structure 32, and the fourth connecting portion 323 and the third connecting portion 321 are respectively partially exposed on any two of the first surface 301, the second surface 302, the third surface 303, and the fourth surface 304 of the magnetic component 3. In this embodiment, the fourth connecting portion 323 is adjacent to the third surface 303 and the sixth surface 306 of the magnetic component 3, and a portion of the fourth connecting portion 323 is exposed on the third surface 303 and the sixth surface 306 of the magnetic component 3. The fourth connecting portion 323 is connected to the other end of the second conductive body 322 and extends from the fifth surface 305 toward the sixth surface 306. The included angle θ4 between the fourth connecting portion 323 and the second conductive body 322 is between 60 degrees and 120 degrees. Figure 3B As shown, in this embodiment, the included angle θ4 between the fourth connecting part 323 and the second conductive body 322 is 90 degrees.

[0108] Of course, in some embodiments, the number of conductive structures is not limited to two, but can be varied according to the number of windings required to be formed by the magnetic component 3. In some embodiments, the first conductive structure 31 and the second conductive structure 32 exposed on the fifth surface 305 and the sixth surface 306 of the magnetic component 3 are metal-plated to form welding surfaces, thereby forming solder pads. In other embodiments, not only are the first conductive structures 31 and the second conductive structures 32 exposed on the fifth surface 305 and the sixth surface 306 of the magnetic component 3 metal-plated, but the areas surrounding the exposed surfaces of the first conductive structures 31 and the second conductive structures 32 on the fifth surface 305 and the sixth surface 306 of the magnetic component 3 are also metal-plated, thereby forming large-area solder pads. In another embodiment, the remaining surfaces of the magnetic component 3 that do not include the first conductive structures 31 and the second conductive structures 32 exposed on the fifth surface 305 and the sixth surface 306 can also be metal-plated, thereby forming large-area solder pads. In the above embodiments, electroplating the first conductive structure 31 and the second conductive structure 32 exposed to the first surface 301 and the third surface 303 of the magnetic component 3 can also achieve the protective effect against oxidation.

[0109] The core material 33 is used to form the magnetic core of the magnetic component 3, and is pressed together with the first conductive structure 31 and the second conductive structure 32 to form the first surface 301, the second surface 302, the third surface 303, the fourth surface 304, the fifth surface 305, and the sixth surface 306 of the magnetic component 3, wherein the first conductive structure 31 and the second conductive structure 32 are embedded in the core material 33. In some embodiments, the core material 33 has a granular structure, such as an iron-nickel-molybdenum alloy, an iron-silicon-aluminum alloy core, an iron-nickel alloy, an iron core, a permalloy core, a molybdenum-permalloy core, or an amorphous / nanocrystalline core. Since the magnetic component 3 of this embodiment utilizes the first conductive structure 31 and the second conductive structure 32 to form a winding, and utilizes the core material 33 to form a magnetic core, the magnetic component 3 of this embodiment does not require an additional printed circuit board to set the winding and magnetic core. This eliminates the dimensional tolerances of the printed circuit board, thereby eliminating assembly tolerances between the printed circuit board and the magnetic core, reducing the volume of the magnetic component 3, and improving its performance, such as increasing inductance, increasing saturation current, reducing core loss, and reducing winding loss. In some embodiments, the core material 33 comprises multiple core particles, each core particle comprising an insulating layer (not shown). The insulating layer covers the core particles to isolate the core material 33 from the first conductive structure 31 and from the second conductive structure 32. The insulating layer is an organic coating agent (e.g., epoxy resin, polyamide resin, silicone resin, polyvinyl alcohol, phenolic resin, or polystyrene) or an inorganic coating agent (e.g., mica, water glass, or oxide layer).

[0110] Furthermore, in the aforementioned arrangement of the first conductive structure 31, the second conductive structure 32, and the core material 33, the conductive bodies of the first conductive structure 31 and the second conductive structure 32 are arranged approximately parallel to the fifth surface 305 and the sixth surface 306 of the magnetic component 3. This results in a thinner core material 33 along the magnetic field lines, leading to a more uniform distribution of magnetic field lines and lower core loss and higher saturation current capability. Additionally, since the two connecting portions of each conductive structure are exposed on opposite sides of the magnetic component 3 (i.e., the first surface 301 and the third surface 303 of the magnetic component 3), and the conductive bodies of the first conductive structure 31 and the second conductive structure 32 are approximately perpendicular to the first surface 301 and the third surface 303 of the magnetic component 3, the cross-sectional length and cross-sectional area of ​​the core material 33 through which the magnetic field lines generated by the conductive bodies pass are longer, resulting in lower core loss and higher saturation current capability.

[0111] In some embodiments, the first electroplating structure 34 includes a plurality of first sub-electroplated conductive portions 34a for constituting the differential signal structure of the magnetic component 3, for example... Figure 3BThe eight first sub-plated conductive portions 34a shown are parallel to each other. Four of the first sub-plated conductive portions 34a and four others are located on both sides of the third conductive structure 36. Among the four first sub-plated conductive portions 34a, two adjacent first sub-plated conductive portions 34a form one differential signal pair, and two adjacent first sub-plated conductive portions 34a form another differential signal pair, thus the four first sub-plated conductive portions 34a form two differential signal pairs. The second plating structure 35 includes a plurality of second sub-plated conductive portions 35a to form the differential signal structure of the magnetic component 3, for example... Figure 3B The eight second sub-plated conductive portions 35a shown are parallel to each other. Four of the second sub-plated conductive portions 35a and four others are located on both sides of the fourth conductive structure 37. Among the four first plating conductive portions 35a, two adjacent first plating conductive portions 35a form one differential signal pair, and two adjacent first plating conductive portions 35a form another differential signal pair, thus the four first plating conductive portions 35a form two differential signal pairs. The differential signal pairs of the first sub-plated conductive portions 34a and the second sub-plated conductive portions 35a solve the problem of magnetic flux dispersion generated on and around the surface of the magnetic component 3, thereby avoiding coupling voltage caused by magnetic flux dispersion passing through the loop formed by the conductive structure, and thus solving the problem of control signals being easily interfered with.

[0112] The first electroplating structure 34 is used to transmit control signals and power signals, and is electroplated on the fifth surface 305, the second surface 302 and the sixth surface 306 of the magnetic component 3, and is respectively connected to the second surface 22 of the first circuit board 2 and the first surface 51 of the second circuit board 5. The control signals and power signals provided by the system board are transmitted to the first circuit board 2 through the wiring in the second circuit board 5 and the first electroplating structure 34, and then transmitted to the switching component 4 located on the first surface 21 of the first circuit board 2 through the wiring in the first circuit board 2, so that the control signals and power signals are transmitted between the first circuit board 2 and the second circuit board 5. The control signal can be a PWM signal or a current sensing signal, and the power signal can be a positive input signal or a grounded power signal. In some embodiments, a portion of the first electroplated structure 34 is a pre-formed structure, while another portion of the first electroplated structure 34 is made of copper strips and is disposed on the fifth surface 305, the second surface 302, and the sixth surface 306 of the magnetic component 3 by pressing. Alternatively, the first electroplated structure 34 is an electroplated metal structure, such as copper, and is disposed on the fifth surface 305, the second surface 302, and the sixth surface 306 of the magnetic component 3 by electroplating. The thickness of the electroplated metal structure is greater than 15 μm, for example, it can be 35 μm or 50 μm. The aforementioned first electroplated structure 34 can achieve the advantages of strong current transmission capability and low loss. Furthermore, the first electroplated structure 34 has a small volume and high density, resulting in a high connection density of transmitted control signals and power signals.

[0113] The second electroplating structure 35 is used to transmit control signals and power signals, and is electroplated on the fifth surface 305, the fourth surface 304 and the sixth surface 306 of the magnetic component 3, and is respectively connected to the second surface 22 of the first circuit board 2 and the first surface 51 of the second circuit board 5. The control signals and power signals provided by the system board are transmitted to the first circuit board 2 through the wiring in the second circuit board 5 and the second electroplating structure 35, and then transmitted to the switching component 4 located on the first surface 21 of the first circuit board 2 through the wiring in the first circuit board 2, so that the control signals and power signals are transmitted between the first circuit board 2 and the second circuit board 5. The control signal can be a PWM signal or a current sensing signal, and the power signal can be a positive input signal or a grounded power signal. In some embodiments, a portion of the second electroplated structure 35 is a pre-formed structure, while another portion of the second electroplated structure 35 is made of copper strips and is disposed on the fifth surface 305, fourth surface 304, and sixth surface 306 of the magnetic component 3 by pressing. Alternatively, the second electroplated structure 35 is an electroplated metal structure, such as copper, and is disposed on the fifth surface 305, fourth surface 304, and sixth surface 306 of the magnetic component 3 by electroplating. The thickness of the electroplated metal structure is greater than 15 μm, for example, it can be 35 μm or 50 μm. The aforementioned second electroplated structure 35 can achieve the advantages of strong current transmission capability and low loss. Furthermore, the second electroplated structure 35 has a small volume and high density, resulting in a high connection density of transmitted control signals and power signals.

[0114] In some embodiments, the first electroplated structure 34 disposed on the second surface 302 and the second electroplated structure 35 disposed on the fourth surface 304 can achieve corrosion resistance and solder resist effect by coating materials. In other embodiments, the thickness of the first electroplated structure 34 and the thickness of the second electroplated structure 35 are less than the thickness of the first conductive structure 31 or the thickness of the second conductive structure 32. In another embodiment, metal electroplating can be performed on the fifth surface 305 and the sixth surface 306 of the magnetic component 3 to form solder pads, connecting part of the first electroplated structure 34 and part of the second electroplated structure 35 (see reference). Figure 8B (As shown).

[0115] The third conductive structure 36 is located on the second surface 302 of the magnetic component 3. A portion of the third conductive structure 36 is exposed on the fifth surface 305 and the sixth surface 306 of the magnetic component 3. The third conductive structure 36 is connected between the second surface 22 of the first circuit board 2 and the first surface 51 of the second circuit board 5 for grounding. The fourth conductive structure 37 is located on the fourth surface 304 of the magnetic component 3. A portion of the fourth conductive structure 37 is exposed on the fifth surface 305 and the sixth surface 306 of the magnetic component 3. The fourth conductive structure 37 is connected between the second surface 22 of the first circuit board 2 and the first surface 51 of the second circuit board 5 for grounding. In some embodiments, the third conductive structures 36 and fourth conductive structures 37 exposed on the fifth surface 305 and sixth surface 306 of the magnetic component 3 are electroplated to form welding surfaces, thereby constituting power pads. This achieves a low-impedance connection between the fifth surface 305 and sixth surface 306 of the magnetic component 3 and provides high current carrying capacity. Meanwhile, the third conductive structures 36 and fourth conductive structures 37 exposed on the second surface 302 and fourth surface 304 of the magnetic component 3 achieve a low-impedance connection between the first circuit board 2 and the second circuit board 5, and are grounded via the second circuit board 5. In other embodiments, not only are the third conductive structures 36 and fourth conductive structures 37 exposed on the fifth surface 305 and sixth surface 306 of the magnetic component 3 metal-plated, but the areas surrounding the exposed surfaces of the third conductive structures 36 and fourth conductive structures 37 on the fifth surface 305 and sixth surface 306 of the magnetic component 3 are also metal-plated, thereby forming large-area pads. In another embodiment, the remaining surfaces of the magnetic component 3 that do not include the third conductive structure 36 and the fourth conductive structure 37 exposed on the fifth surface 305 and the sixth surface 306 can also be metal-plated to form a large-area solder pad. In the above embodiments, electroplating the third conductive structure 36 and the fourth conductive structure 37 exposed on the second surface 302 and the fourth surface 304 of the magnetic component 3 can also achieve an anti-oxidation protection effect.

[0116] Please refer to the previous document. Figures 1A to 1D and cooperate Figure 2In this embodiment, the power flow of the power conversion module 1 is as follows: First, the second circuit board 5 of the power conversion module 1 receives the input voltage power signal provided by the system board. Next, the input voltage power signal is transmitted to the switching assembly 4 via the first electroplating structure 34 and the second electroplating structure 35. The switching assembly 4 converts the input voltage power signal into a pulse width voltage signal and outputs it to the magnetic core assembly 3. Then, the pulse width voltage signal is converted into an output voltage power signal via the magnetic assembly 3 (i.e., the first conductive structure 32 and the second conductive structure 33), wherein the DC voltage amplitude of the output voltage power signal is less than the DC voltage amplitude of the input voltage power signal. Next, the output voltage power signal output by the magnetic assembly 3 is transmitted to the second circuit board 5, and then to the system board; while the ground wire GND in the power conversion module 1 is connected to the second circuit board 5 via the system board, and then connected to the switching assembly 4 via the third conductive structure 36 and the fourth conductive structure 37, forming a grounding network between the power conversion module 1 and the system board.

[0117] Please see Figure 3C and cooperate Figure 3A and Figure 3B ,in Figure 3C for Figure 3AThe flowchart illustrates the manufacturing process of the magnetic component. First, step S1 is performed, providing a first conductive structure 31 and a second conductive structure 32. The first conductive structure 31 includes a first connecting portion 311, a first conductive body 312, and a second connecting portion 313, with the first conductive body 312 connected between the first connecting portion 311 and the second connecting portion 313. The second conductive structure 32 includes a third connecting portion 321, a second conductive body 322, and a fourth connecting portion 323, with the second conductive body 322 connected between the third connecting portion 321 and the fourth connecting portion 323. In some embodiments, the first conductive structure 31 and the second conductive structure 32 are fabricated using a pre-forming process. Next, step S2 is performed, providing a core material 33. The core material 33 is pressed together with the first conductive structure 31 and the second conductive structure 32 to form a first surface 301, a second surface 302, a third surface 303, a fourth surface 304, a fifth surface 305, and a sixth surface 306 of the magnetic component 3. The first conductive structure 31 and the second conductive structure 32 are embedded in the core material 33, wherein the first surface 301 and the third surface 303 are arranged opposite each other, the second surface 302 and the fourth surface 304 are arranged opposite each other, and the fifth surface 305 and the sixth surface 306 are arranged opposite each other. In some embodiments, the granular core material 33 is coated with an insulating layer before being pressed together with the first conductive structure 31 and the second conductive structure 32. Next, step S3 is performed, polishing the core material 33 so that the first connecting portion 311 and the third connecting portion 321 are both exposed on the fifth surface 305 of the magnetic component 3, and the second connecting portion 313 and the fourth connecting portion 323 are both exposed on the sixth surface 306 of the magnetic component 3. Furthermore, the first connecting portion 311 and the second connecting portion 313 are respectively exposed on any two of the first surface 301, the second surface 302, the third surface 303, and the fourth surface 304 of the magnetic component 3, and the third connecting portion 321 and the fourth connecting portion 323 are respectively exposed on any two of the first surface 301, the second surface 302, the third surface 303, and the fourth surface 304 of the magnetic component 3. Next, step S4 is performed, electroplating the first electroplated structure 34 on the fifth surface 305, the second surface 302, and the sixth surface 306, and electroplating the second electroplated structure 35 on the fifth surface 305, the fourth surface 304, and the sixth surface 306.

[0118] Finally, in some embodiments, such as Figure 3D As shown, step S4 may be followed by step S5, which involves performing a coating process. A coating material is applied to the first electroplating structure 34 on the second surface 302 and the second electroplating structure 35 on the fourth surface 304 to achieve corrosion resistance and solder resistance. In some embodiments, the manufacturing method may further anneal the magnetic component 3 to reduce core loss and increase performance stability.

[0119] Please see Figure 4A and Figure 4B ,in Figure 4A for Figure 1A The diagram shows a second embodiment of the magnetic component of the power conversion module. Figure 4B for Figure 4A The diagram shows an exploded view of the magnetic component. As shown, compared to... Figure 3A and Figure 3B The magnetic component 3 shown in this embodiment, 3a, further includes a ferrite structure 38. The ferrite structure 38 is embedded within the core material 33 and located between the first conductive structure 31 and the second conductive structure 32. The ferrite structure 38 is parallel to the first conductive body 312 of the first conductive structure 31 and the second conductive body 322 of the second conductive structure 32. The DC magnetic flux amplitudes generated by the first conductive structure 31 and the second conductive structure 32 cancel each other out at the location of the ferrite structure 38, and the AC magnetic flux amplitudes generated by the first conductive structure 31 and the second conductive structure 32 are superimposed at the location of the ferrite structure 38. The ferrite structure 38 significantly reduces the loss of the magnetic core composed of the core material 33 and achieves the advantage of reducing the core volume. The scheme of embedding the ferrite structure within the core material and located between the first and second conductive structures can be applied in all embodiments disclosed in this invention, and the shape and size of the ferrite structure can be designed according to the embodiments.

[0120] Please see Figure 5A and Figure 5B ,in Figure 5A for Figure 1A The diagram shows a third embodiment of the magnetic component of the power conversion module. Figure 5B for Figure 5A The diagram shows an exploded view of the magnetic component. As shown, compared to... Figure 3A and Figure 3B The magnetic component 3 shown in this embodiment, the first conductive body 312 of the first conductive structure 31 of the magnetic component 3b further includes a first extension 312a, a second extension 312b, and a third extension 312c. One end of the first extension 312a is connected to the first connecting portion 311 and extends from the first surface 301 of the magnetic component 3b toward the third surface 303. The included angle θ1 between the first extension 312a and the first connecting portion 311 is between 60 degrees and 120 degrees. Figure 5B As shown, in this embodiment, the included angle θ1 between the first extension 312a and the first connecting portion 311 is 90 degrees. One end of the second extension 312b is connected to the other end of the first extension 312a and extends from the second surface 302 of the magnetic component 3b toward the fourth surface 304. The included angle θ2 between the second extension 312b and the first extension 312a is between 60 degrees and 120 degrees. Figure 5B As shown, in this embodiment, the included angle θ2 between the second extension 312b and the first extension 311 is 90 degrees. One end of the third extension 312c is connected to the other end of the second extension 312b and extends from the first surface 301 of the magnetic component 3b toward the third surface 303, wherein the included angle θ3 between the third extension 312c and the second extension 312b is between 60 degrees and 120 degrees. Figure 5B As shown, in this embodiment, the included angle θ3 between the third extension 312c and the second extension 312b is 90 degrees. The second connecting portion 313 is connected to the other end of the third extension 312c and extends from the fifth surface 305 of the magnetic component 3b toward the sixth surface 306, wherein the included angle θ4 between the second connecting portion 313 and the third extension 312c is between 60 degrees and 120 degrees. Figure 5B As shown, in this embodiment, the included angle θ4 between the second connecting portion 313 and the third extension portion 312c is 90 degrees.

[0121] In addition, compared to Figure 3A and Figure 3B The magnetic component 3 shown in this embodiment, the second conductive body 322 of the second conductive structure 32 of the magnetic component 3b further includes a fourth extension 322a, a fifth extension 322b, and a sixth extension 322c. One end of the fourth extension 322a is connected to the third connecting portion 323 and extends from the first surface 301 of the magnetic component 3b toward the third surface 303. The included angle θ5 between the fourth extension 322a and the third connecting portion 321 is between 60 degrees and 120 degrees. Figure 5B As shown, in this embodiment, the included angle θ5 between the fourth extension 322a and the third connecting portion 321 is 90 degrees. One end of the fifth extension 322b is connected to the other end of the fourth extension 322a and extends from the fourth surface 304 of the magnetic component 3b toward the second surface 302. The included angle θ6 between the fifth extension 322b and the fourth extension 322a is between 60 degrees and 120 degrees. Figure 5B As shown, in this embodiment, the included angle θ6 between the fifth extension 322b and the fourth extension 322a is 90 degrees. One end of the sixth extension 322c is connected to the other end of the fifth extension 322b and extends from the first surface 301 of the magnetic component 3b toward the third surface 303. The included angle θ7 between the sixth extension 322c and the fifth extension 322b is between 60 degrees and 120 degrees. Figure 5BAs shown, in this embodiment, the included angle θ7 between the sixth extension 322c and the fifth extension 322b is 90 degrees. The fourth connecting portion 323 is connected to the other end of the sixth extension 322c and extends from the fifth surface 305 of the magnetic component 3b toward the sixth surface 306, wherein the included angle θ8 between the fourth connecting portion 323 and the sixth extension 322c is between 60 degrees and 120 degrees. Figure 5B As shown, in this embodiment, the included angle θ8 between the fourth connecting portion 323 and the sixth extension portion 322c is 90 degrees. Furthermore, in this embodiment, the length of the first connecting portion 311 is less than the length of the third connecting portion 321, the length of the second connecting portion 313 is greater than the length of the fourth connecting portion 323, the shortest distance between the first connecting portion 311 and the second surface 302 of the magnetic component 3b is less than the shortest distance between the third connecting portion 321 and the second surface 302 of the magnetic component 3b, and the shortest distance between the second connecting portion 313 and the second surface 302 of the magnetic component 3b is greater than the shortest distance between the fourth connecting portion 323 and the second surface 302 of the magnetic component 3b. According to... Figure 5A and 5B As can be seen, in this embodiment, the first conductive structure 31 and the second conductive structure 32 partially overlap each other, and there is a gap at the overlap between the first conductive structure 31 and the second conductive structure 32. The gap may have an insulating medium to prevent the first conductive structure 31 and the second conductive structure 32 from contacting each other. Because the first conductive structure 31 and the second conductive structure 32 in this embodiment have a large number of bends, the AC magnetic flux frequency of the magnetic core composed of the powder core material 33 of the magnetic component 3b in this embodiment increases and the amplitude decreases. As a result, the equivalent output inductance of the power conversion module 1 composed of the magnetic component 3b in this embodiment is greatly improved and the output ripple is greatly reduced.

[0122] Please see Figure 6A and Figure 6B ,in Figure 6A for Figure 1A The diagram shows a fourth embodiment of the magnetic component of the power conversion module. Figure 6B for Figure 6A The diagram shows an exploded view of the magnetic component. As shown, compared to... Figure 3A and Figure 3B The magnetic component 3 shown in this embodiment, the first conductive body 312 of the first conductive structure 31 of the magnetic component 3c further includes a first extension 312a, a second extension 312b, a third extension 312c, a fourth extension 312d, and a fifth extension 312e. One end of the first extension 312a is connected to the first connecting portion 311 and extends from the first surface 301 of the magnetic component 3c toward the third surface 303. The included angle θ1 between the first extension 312a and the first connecting portion 311 is between 60 degrees and 120 degrees. Figure 6B As shown, in this embodiment, the included angle θ1 between the first extension 312a and the first connecting portion 311 is 90 degrees. One end of the second extension 312b is connected to the other end of the first extension 312a and extends from the second surface 302 of the magnetic component 3c toward the fourth surface 304. The included angle θ2 between the second extension 312b and the first extension 312a is between 60 degrees and 120 degrees. Figure 6B As shown, in this embodiment, the included angle θ2 between the second extension 312b and the first extension 312a is 90 degrees. One end of the third extension 312c is connected to the other end of the second extension 312b and extends from the first surface 301 of the magnetic component 3c toward the third surface 303. The included angle θ3 between the third extension 312c and the second extension 312b is between 60 degrees and 120 degrees. Figure 6B As shown, in this embodiment, the included angle θ3 between the third extension 312c and the second extension 312b is 90 degrees. One end of the fourth extension 312d is connected to the other end of the third extension 312c and extends from the fourth surface 304 of the magnetic component 3c toward the second surface 302. The included angle θ4 between the fourth extension 312d and the third extension 312c is between 60 degrees and 120 degrees. Figure 6B As shown, in this embodiment, the included angle θ4 between the fourth extension 312d and the third extension 312c is 90 degrees. One end of the fifth extension 312e is connected to the other end of the fourth extension 312d and extends from the first surface 301 of the magnetic component 3c toward the third surface 303. The included angle θ5 between the fifth extension 312e and the fourth extension 312d is between 60 degrees and 120 degrees. Figure 6B As shown, in this embodiment, the included angle θ5 between the fifth extension 312e and the fourth extension 312d is 90 degrees. The second connecting portion 313 is connected to the other end of the fifth extension 312e and extends from the fifth surface 305 of the magnetic component 3c toward the sixth surface 306, wherein the included angle θ6 between the second connecting portion 313 and the fifth extension 312e is between 60 degrees and 120 degrees. Figure 6B As shown, in this embodiment, the included angle θ6 between the second connecting portion 313 and the fifth extension portion 312e is 90 degrees.

[0123] In addition, compared to Figure 3A and Figure 3BThe magnetic component 3 shown in this embodiment, the second conductive body 322 of the second conductive structure 32 of the magnetic component 3c further includes a sixth extension 322a, a seventh extension 322b, an eighth extension 322c, a ninth extension 322d, and a tenth extension 322e. One end of the sixth extension 322a is connected to the third connecting portion 321 and extends from the first surface 301 of the magnetic component 3c toward the third surface 303. The included angle θ7 between the sixth extension 322a and the third connecting portion 321 is between 60 degrees and 120 degrees. Figure 6B As shown, in this embodiment, the included angle θ7 between the sixth extension 322a and the third connecting portion 321 is 90 degrees. One end of the seventh extension 322b is connected to the other end of the sixth extension 322a and extends from the fourth surface 304 of the magnetic component 3c toward the second surface 302. The included angle θ8 between the seventh extension 322b and the sixth extension 322a is between 60 degrees and 120 degrees. Figure 6B As shown, in this embodiment, the included angle θ8 between the seventh extension 322b and the sixth extension 322a is 90 degrees. One end of the eighth extension 322c is connected to the other end of the seventh extension 322b and extends from the first surface 301 of the magnetic component 3c toward the third surface 303. The included angle θ9 between the eighth extension 322c and the seventh extension 322b is between 60 degrees and 120 degrees. Figure 6B As shown, in this embodiment, the included angle θ9 between the eighth extension 322c and the seventh extension 322b is 90 degrees. One end of the ninth extension 322d is connected to the other end of the eighth extension 322c and extends from the second surface 302 of the magnetic component 3c toward the fourth surface 304. The included angle θ10 between the ninth extension 322d and the eighth extension 322c is between 60 degrees and 120 degrees. Figure 6B As shown, in this embodiment, the included angle θ10 between the ninth extension 322d and the eighth extension 322c is 90 degrees. One end of the tenth extension 322e is connected to the other end of the ninth extension 322d and extends from the first surface 301 of the magnetic component 3c toward the third surface 303. The included angle θ11 between the tenth extension 322e and the ninth extension 322d is between 60 degrees and 120 degrees. Figure 6B As shown, in this embodiment, the included angle θ11 between the tenth extension 322e and the ninth extension 322d is 90 degrees. The fourth connecting portion 323 is connected to the other end of the tenth extension 322e and extends from the fifth surface 305 of the magnetic component 3c toward the sixth surface 306, wherein the included angle θ12 between the fourth connecting portion 323 and the tenth extension 322e is between 60 degrees and 120 degrees. Figure 6BAs shown, in this embodiment, the included angle θ12 between the fourth connecting portion 323 and the tenth extension portion 322e is 90 degrees. Furthermore, in this embodiment, the length of the first connecting portion 311 is less than the length of the third connecting portion 321, the length of the second connecting portion 313 is greater than the length of the fourth connecting portion 323, the shortest distance between the first connecting portion 311 and the second surface 302 of the magnetic component 3c is less than the shortest distance between the third connecting portion 321 and the second surface 302 of the magnetic component 3c, and the shortest distance between the second connecting portion 313 and the second surface 302 of the magnetic component 3c is less than the shortest distance between the fourth connecting portion 323 and the second surface 302 of the magnetic component 3c.

[0124] according to Figure 6A and Figure 6B As can be seen, in this embodiment, the first conductive structure 31 and the second conductive structure 32 partially overlap each other, and there is a gap at the overlap between the first conductive structure 31 and the second conductive structure 32. The gap may have an insulating medium to prevent the first conductive structure 31 and the second conductive structure 32 from contacting each other. Because the first conductive structure 31 and the second conductive structure 32 in this embodiment have a large number of bends, the AC magnetic flux frequency of the magnetic core composed of the powder core material 33 of the magnetic component 3c in this embodiment increases and the amplitude decreases. As a result, the equivalent output inductance of the power conversion module 1 composed of the magnetic component 3c in this embodiment is greatly improved and the output ripple is greatly reduced. In addition, the thickness of the magnetic core composed of the powder core material 33 in this embodiment is relatively thin, which enables the magnetic component 3c to be thin.

[0125] Please see Figure 7 ,in Figure 7 This is an exploded structural diagram of the power conversion module according to the second embodiment of this application. As shown in the figure, compared to... Figures 1A to 1D The power conversion module 1 shown in this embodiment has a first circuit board 2 that further includes a groove 23. The groove 23 is formed by the indentation of the second surface 22 of the first circuit board 2. The input capacitor Cin is disposed in the groove 23, which greatly reduces the area of ​​the first circuit board 2 of the power conversion module 1a in this embodiment, thereby greatly reducing the overall area of ​​the power conversion module 1a and increasing the power density of the power conversion module 1a.

[0126] Please see Figure 8A and Figure 8B ,in Figure 8A This is a schematic diagram of the power conversion module according to the third embodiment of this application. Figure 8B for Figure 8A The diagram shows a structural schematic of the power conversion module from another perspective. As shown in the figure, compared to... Figures 1A to 1DThe power conversion module 1 shown in this embodiment includes only a first circuit board 2 and a magnetic component 3, excluding a second circuit board, to reduce the overall height of the power conversion module 1b and increase its power density. In this embodiment, the sixth surface 306 of the magnetic component 3 of the power conversion module 1b has multiple solder pads 307 for transmitting positive input signals, grounded power signals, and positive output signals, and can replace the transmission function of the second circuit board. Furthermore, a portion of the first electroplated structure 34 and a portion of the second electroplated structure 35 can be connected via the multiple solder pads 307 on the sixth surface 306 of the magnetic component 3. The total area of ​​multiple solder pads 307 is greater than 50%, or even more than 80%, of the area of ​​the sixth surface 306. The multiple solder pads 307 can be formed by pressing copper strips onto the sixth surface 306 of the magnetic component 3. One side of the copper strip is pressed with an iron powder magnetic core, and the other side of the copper strip is connected to the system board by welding, thus fixing the power conversion module onto the system board and establishing an electrical connection with the system board. By setting copper strips to form large-area solder pads, the air gap between the magnetic component 3 and the system board can be eliminated; the thermal resistance between the magnetic component 3 and the system board is reduced, thereby also reducing the vertical thermal resistance between the switching component 4 and the system board, and thus also reducing the vertical thermal resistance between the switching component 4 and the heat sink.

[0127] Please see Figure 9A , Figure 9B , Figure 10A and Figure 10B ,in Figure 9A This is a schematic diagram of the power conversion module according to the fourth embodiment of this application. Figure 9B for Figure 9A The diagram shown is an exploded view of the power conversion module. Figure 10A for Figure 9A The diagram shown is a structural schematic of the magnetic component of the power conversion module. Figure 10B for Figure 10A The diagram shows an exploded view of the magnetic component. As shown, compared to... Figures 1A to 1D In the power conversion module 1 of this embodiment, the two switching components 4 of the power conversion module 1c are respectively located on the first diagonal of the first circuit board 2. Some of the multiple input capacitors Cin and the other input capacitors Cin are respectively disposed on the first surface 21 of the first circuit board 2 and adjacent to the two switching components 4. The input capacitors Cin are electrically connected to the switching components 4 through the wiring in the first circuit board 2.

[0128] The following is based on Figure 10A and Figure 10BThe structure of the magnetic component 3d in the power conversion module 1c of this embodiment is further explained. The first conductive structure 31 of the magnetic component 3d is a cuboid structure. One end of the first conductive structure 31 is exposed on the fifth surface 305 of the magnetic component 3d to form the input terminal of the magnetic component 3d, and is connected to the switch component 4 through wiring in the first circuit board 2. The other end of the first conductive structure 31 is exposed on the sixth surface 306 of the magnetic component 3d to form the output terminal of the magnetic component 3d. The first conductive structure 31 extends from the fifth surface 305 of the magnetic component 3d toward the sixth surface 306. The angle between the first conductive structure 31 and the fifth surface 305 of the magnetic component 3d is between 60 degrees and 120 degrees, for example, 90 degrees. The angle between the first conductive structure 31 and the sixth surface 306 of the magnetic component 3d is between 60 degrees and 120 degrees, for example, 90 degrees. The second conductive structure 32 of the magnetic component 3d is a cuboid structure and is arranged parallel to the first conductive structure 32. One end of the second conductive structure 32 is exposed on the fifth surface 305 of the magnetic component 3d to form the input terminal of the magnetic component 3d, and is connected to the switch component 4 through wiring in the first circuit board 2. The other end of the second conductive structure 32 is exposed on the sixth surface 306 of the magnetic component 3d to form the output terminal of the magnetic component 3d. The second conductive structure 32 extends from the fifth surface 305 of the magnetic component 3d toward the sixth surface 306. The angle between the second conductive structure 32 and the fifth surface 305 of the magnetic component 3d is between 60 degrees and 120 degrees, for example, 90 degrees. The angle between the second conductive structure 32 and the sixth surface 306 of the magnetic component 3d is between 60 degrees and 120 degrees, for example, 90 degrees. Since the first conductive structure 31 and the second conductive structure 32 of the magnetic component 3d in this embodiment are connected between the fifth surface 305 and the sixth surface 306 of the magnetic component 3d in a nearly perpendicular manner, the winding path formed by the first conductive structure 31 and the second conductive structure 32 is shorter, the parasitic resistance of the winding is smaller, and the conduction loss of the winding is smaller.

[0129] Please see Figure 11A and Figure 11B ,in Figure 11A for Figure 9A The diagram shows a structural schematic of another embodiment of the magnetic component of the power conversion module. Figure 11B for Figure 11A The diagram shows an exploded view of the magnetic component. As shown, compared to... Figure 10A and Figure 10BThe magnetic component 3d shown in this embodiment has a first conductive structure 31 including a first connecting portion 311, a first conductive body 312, and a second connecting portion 313. The first connecting portion 311 is the input terminal of the first conductive structure 31, and a portion of the first connecting portion 311 is exposed on the fifth surface 305 of the magnetic component 3e. The first connecting portion 311 extends from the fifth surface 305 towards the sixth surface 306 of the magnetic component 3e. The first conductive body 312 is connected between the first connecting portion 311 and the second connecting portion 313, and one end of the first conductive body 312 is connected to the first connecting portion 311 and extends from the second surface 302 towards the fourth surface 304 of the magnetic component 3e. The angle θ1 between the first conductive body 312 and the first connecting portion 311 is between 60 degrees and 120 degrees. Figure 11B As shown, in this embodiment, the angle θ1 between the first conductive body 312 and the first connecting portion 311 is 90 degrees, making the first conductive body 312 parallel to the fifth surface 305 and the sixth surface 306 of the magnetic component 3e. The second connecting portion 313 is the output end of the first conductive structure 31, and a portion of the second connecting portion 313 is exposed on the sixth surface 306 of the magnetic component 3e. The second connecting portion 313 is connected to the other end of the first conductive body 312 and extends from the fifth surface 305 toward the sixth surface 306. The angle θ2 between the second connecting portion 313 and the first conductive body 312 is between 60 degrees and 120 degrees. Figure 11B As shown, in this embodiment, the included angle θ2 between the second connecting part 313 and the first conductive body 312 is 90 degrees.

[0130] In addition, compared to Figure 10A and Figure 10B The magnetic component 3d shown in this embodiment has a second conductive structure 32 including a third connecting portion 321, a second conductive body 322, and a fourth connecting portion 323. The third connecting portion 321 is the input terminal of the second conductive structure 32, and a portion of the third connecting portion 321 is exposed on the fifth surface 305 of the magnetic component 3e. The third connecting portion 321 extends from the fifth surface 305 of the magnetic component 3e toward the sixth surface 306. The second conductive body 322 connects the third connecting portion 321 and the fourth connecting portion 323, and one end of the second conductive body 322 is connected to the third connecting portion 321 and extends from the fourth surface 302 of the magnetic component 3e toward the second surface 302. The angle θ3 between the second conductive body 322 and the third connecting portion 321 is between 60 degrees and 120 degrees. Figure 11BAs shown, in this embodiment, the angle θ3 between the second conductive body 322 and the third connecting portion 321 is 90 degrees, making the second conductive body 322 parallel to the fifth surface 305 and the sixth surface 306 of the magnetic component 3e. The fourth connecting portion 323 is the output end of the second conductive structure 32, and a portion of the fourth connecting portion 323 is exposed on the sixth surface 306 of the magnetic component 3e. The fourth connecting portion 323 is connected to the other end of the second conductive body 322 and extends from the fifth surface 305 toward the sixth surface 306. The angle θ4 between the fourth connecting portion 323 and the second conductive body 322 is between 60 degrees and 120 degrees. Figure 11B As shown, in this embodiment, the included angle θ4 between the fourth connecting portion 323 and the second conductive body 322 is 90 degrees. Because the first conductive structure 31 and the second conductive structure 32 of this embodiment undergo numerous bends, the AC magnetic flux frequency of the magnetic core composed of the powder core material 33 in the magnetic component 3e of this embodiment increases, while the amplitude decreases. Consequently, the equivalent output inductance of the power conversion module composed of the magnetic component 3e of this embodiment is significantly increased, and the output ripple is significantly reduced.

[0131] Please see Figure 12 , Figure 13A and Figure 13B ,in Figure 12 This is an exploded view of the power conversion module according to the fifth embodiment of this application. Figure 13A for Figure 12 The diagram shown is a structural schematic of the magnetic component of the power conversion module. Figure 13B for Figure 13A The diagram shows an exploded view of the magnetic component. As shown, compared to... Figures 1A to 1D In the power conversion module 1 of this embodiment, the two switching components 4 of the power conversion module 1d are respectively located on the first diagonal of the first circuit board 2. Some of the multiple input capacitors Cin and the other input capacitors Cin are respectively disposed on the first surface 21 of the first circuit board 2 and adjacent to the two switching components 4. The input capacitors Cin are electrically connected to the switching components 4 through the wiring in the first circuit board 2.

[0132] The following is based on Figure 13A and Figure 13BThe structure of the magnetic component 3f of the power conversion module 1d in this embodiment is further explained. The first conductive structure 31 of the magnetic component 3f includes a first connecting portion 311, a first conductive body 312, and a second connecting portion 313. The first connecting portion 311 is the input terminal of the first conductive structure 31. The first connecting portion 311 is adjacent to the first surface 301 and the fifth surface 305 of the magnetic component 3f, and a portion of the first connecting portion 311 is exposed on the first surface 301 and the fifth surface 305 of the magnetic component 3f. The first connecting portion 311 extends from the fifth surface 305 of the magnetic component 3f toward the sixth surface 306. The first conductive body 312 is connected between the first connecting portion 311 and the second connecting portion 313. One end of the first conductive body 312 is connected to the first connecting portion 311 and extends from the first surface 301 of the magnetic component 3f toward the fourth surface 304. The first conductive body 312 is parallel to the fifth surface 305 and the sixth surface 306 of the magnetic component 3f. The second connection portion 313 is the output end of the first conductive structure 32 and is adjacent to the fourth surface 304 and the sixth surface 306 of the magnetic component 3f. A portion of the second connection portion 313 is exposed on the fourth surface 304 and the sixth surface 306 of the magnetic component 3f. The second connection portion 313 is connected to the other end of the first conductive body 312 and extends from the fifth surface 305 toward the sixth surface 306.

[0133] The second conductive structure 32 of the magnetic component 3f is spaced apart from the first conductive structure 31 and includes a third connecting portion 321, a second conductive body 322, and a fourth connecting portion 323. The third connecting portion 321 is the input terminal of the second conductive structure 32. The third connecting portion 321 is adjacent to the third surface 303 and the fifth surface 305 of the magnetic component 3f, and a portion of the third connecting portion 321 is exposed on the third surface 303 and the fifth surface 305 of the magnetic component 3f. The third connecting portion 321 extends from the fifth surface 305 of the magnetic component 3f toward the sixth surface 306. The second conductive body 322 is connected between the third connecting portion 321 and the fourth connecting portion 323. One end of the second conductive body 322 is connected to the third connecting portion 321 and extends from the third surface 303 of the magnetic component 3f toward the second surface 302. The second conductive body 322 is parallel to the fifth surface 305 and the sixth surface 306 of the magnetic component 3f. The fourth connection portion 323 is the output terminal of the second conductive structure 32 and is adjacent to the second surface 302 and the sixth surface 306 of the magnetic component 3f. A portion of the fourth connection portion 323 is exposed on the second surface 302 and the sixth surface 306 of the magnetic component 3f. The fourth connection portion 323 is connected to the other end of the second conductive body 322 and extends from the fifth surface 305 toward the sixth surface 306. Because the DC magnetic flux amplitude generated by the first conductive structure 31 and the second conductive structure 32 in this embodiment is superimposed on the core material 33 located between the first conductive structure 31 and the second conductive structure 32, and the AC magnetic flux amplitude generated by the first conductive structure 31 and the second conductive structure 32 cancels each other out on the core material 33 located between the first conductive structure 31 and the second conductive structure 32, the equivalent output inductance of the power conversion module constituted by the core component 3f in this embodiment is greatly increased, and the output ripple current is greatly reduced.

[0134] Please see Figure 14A , Figure 14B and Figure 14C ,in Figure 14A This is a schematic diagram of the power conversion module according to the sixth embodiment of this application. Figure 14B for Figure 14A The diagram shown is a structural schematic of the power conversion module from another perspective. Figure 14C for Figure 14A The diagram shows an exploded view of the power conversion module. As shown, the power conversion module 1e in this embodiment is similar to... Figures 8A to 8B The power conversion module 1b shown is compared to... Figures 8A to 8BThe power conversion module 1b shown in this embodiment has its switching assembly 4 and input capacitor Cin embedded within the first circuit board 2. This effectively reduces the overall height of the power conversion module 1e and facilitates the placement of thermal pads and heat sinks on the first surface 21 of the first circuit board 2, allowing them to be evenly distributed on the power conversion module 1e. In other embodiments, the switching assembly 4 and input capacitor Cin are integrated with the first circuit board 2 using encapsulation, which also effectively reduces the overall height of the power conversion module and facilitates the placement of thermal pads and heat sinks on the first surface 21 of the first circuit board 2.

[0135] Please see Figure 15A and Figure 15B ,in Figure 15A This is a schematic diagram of the fifth embodiment of the magnetic component of the power conversion module. Figure 15B for Figure 15A The diagram shows an exploded view of the magnetic component. As shown, compared to... Figure 5A and Figure 5BThe magnetic component 3b shown in this embodiment has a portion of the first sub-electroplated conductive part 34a in the first electroplating structure 34 and a portion of the second sub-electroplated conductive part 35a in the second electroplating structure 35, which are respectively made using pre-formed conductive materials. The first sub-electroplated conductive part 34a and the second sub-electroplated conductive part 35a located on the fifth surface 305 of the magnetic component 3g have bending structures, and the first sub-electroplated conductive part 34a and the second sub-electroplated conductive part 35a located on the sixth surface 306 of the magnetic component 3g have bending structures, so that the first sub-electroplated conductive part 34a and the second sub-electroplated conductive part 35a located on the sixth surface 306 of the magnetic component 3g are connected to each other. In addition, the third conductive structure 36 and the fourth conductive structure 37 located on the fifth surface 305 and the sixth surface 306 of the magnetic component 3g also have bending structures, and the third conductive structure 36 and the fourth conductive structure 37 located on the sixth surface 306 of the magnetic component 3g are connected to each other. In some embodiments, the first electroplating structure 34, the second electroplating structure 35, the third conductive structure 36, and the fourth conductive structure 37 can be copper strips. By bending the copper strips, the first electroplating structure 34, the second electroplating structure 35, the third conductive structure 36, and the fourth conductive structure 37 can form large-area solder pads on the fifth surface 305 and the sixth surface 306 of the magnetic component 3g to transmit input signals or grounded power signals. As a result, the above structure eliminates the air gap between the first electroplating structure 34 and the second electroplating structure 35 on the fifth surface 305 and the sixth surface 306 of the magnetic component 3g and the circuit board. In some embodiments, the first connecting portion 311 of the first conductive structure 31 and the third connecting portion 321 of the second conductive structure 32 may also have a bent structure, thereby increasing the area of ​​the first connecting portion 311 and the third connecting portion 321 exposed on the fifth surface 305. Similarly, the second connecting portion 313 of the first conductive structure 31 and the fourth connecting portion 323 of the second conductive structure 32 may also have a bent structure, thereby increasing the area of ​​the second connecting portion 313 and the fourth connecting portion 323 exposed on the sixth surface 306. That is, the first conductive structure 31 and the second conductive structure 32 can be copper strips, with the connecting portion and conductive body formed by bending the copper strips, and large-area pads formed on the fifth surface 305 and the sixth surface 306 respectively by forming a bent structure. This magnetic component 3g has low vertical thermal resistance and can be dissipated by mounting a heat sink. The total area of ​​the solder pads on the sixth surface 306 is greater than 50%, or even more than 80%, of the area of ​​the sixth surface. One side of each of the multiple solder pads 307 is pressed with an iron powder magnetic core, and the other side is connected to the system board by welding copper strips. This fixes the power conversion module on the system board and establishes an electrical connection with the system board. By bending the copper strips to form large-area solder pads, the air gap between the magnetic component 3 and the system board can be eliminated. This reduces the thermal resistance between the magnetic component 3 and the system board, thereby also reducing the vertical thermal resistance between the switching component 4 and the system board, as well as the vertical thermal resistance between the switching component 4 and the heat sink.

[0136] Please see Figure 16A and Figure 16B ,in Figure 16A This is a schematic diagram of the sixth embodiment of the magnetic component of the power conversion module. Figure 16B for Figure 16A The diagram shows an exploded view of the magnetic component. As shown, compared to... Figure 3A and Figure 3B The magnetic component 3 shown in this embodiment, the first conductive body 312 of the first conductive structure 31 of the magnetic component 3h further includes a first extension 312a, a second extension 312b, and a third extension 312c. One end of the first extension 312a is connected to the first connecting portion 311 and extends from the first surface 301 of the magnetic component 3h toward the third surface 303. One end of the second extension 312b is connected to the other end of the first extension 312a and extends from the second surface 302 of the magnetic component 3h toward the fourth surface 304. One end of the third extension 312c is connected to the other end of the second extension 312b and extends from the first surface 301 of the magnetic component 3h toward the third surface 303. The second connecting portion 313 is connected to the other end of the third extension 312c and extends from the sixth surface 306 of the magnetic component 3h toward the fifth surface 305. In this embodiment, the first connecting portion 311 and the second connecting portion 313 of the first conductive structure 31 have bending structures and are both exposed on the fifth surface 305 or the sixth surface 306 of the magnetic component 3h to form large-area solder pads for the first connecting portion 311 and the second connecting portion 313, respectively, and are electrically connected to the second surface 22 of the first circuit board 2.

[0137] In addition, compared to Figure 3A and Figure 3BThe magnetic component 3 shown in this embodiment, the second conductive body 322 of the second conductive structure 32 of the magnetic component 3h further includes a fourth extension 322a, a fifth extension 322b, and a sixth extension 322c. One end of the fourth extension 322a is connected to the third connecting portion 321 and extends from the first surface 301 of the magnetic component 3h toward the third surface 303. One end of the fifth extension 322b is connected to the other end of the fourth extension 322a and extends from the fourth surface 304 of the magnetic component 3h toward the second surface 302. One end of the sixth extension 322c is connected to the other end of the fifth extension 322b and extends from the first surface 301 of the magnetic component 3h toward the third surface 303. The fourth connecting portion 323 is connected to the other end of the sixth extension 322c and extends from the sixth surface 306 of the magnetic component 3h toward the fifth surface 305. In this embodiment, the third connecting portion 321 and the fourth connecting portion 323 of the second conductive structure 32 each have a bent structure and are both exposed on the fifth surface 305 or the sixth surface 306 of the magnetic component 3h, forming large-area solder pads for the third connecting portion 321 and the fourth connecting portion 323 respectively (this embodiment uses the fifth surface as an example). The magnetic component 3g has low vertical thermal resistance and can be dissipated by attaching a heat sink. The total area of ​​the solder pads disposed on the fifth surface 305 is greater than 50% or even more than 80% of the area of ​​the fifth surface, so as to electrically connect with the first surface 21 or the second surface 22 of the first circuit board 2. In some embodiments, the switch component 4 and the magnetic component 3h are located on opposite sides of the first circuit board 2. In other embodiments, the switch component 4 and the magnetic component 3h are located on the same side of the first circuit board 2 and are coplanar. In other embodiments, the switch component 4 and the magnetic component 3h are located on the same side of the first circuit board 2, and the switch component 4 is located between the first circuit board 2 and the magnetic component 3h. The aforementioned arrangement of the magnetic component 3h results in a low vertical thermal resistance and, when an additional heat sink is added, achieves good heat dissipation. One side of each of the multiple solder pads 307 is pressed with an iron powder magnetic core, and the other side is connected to the system board via a welded copper strip. This fixes the power conversion module to the system board and establishes an electrical connection. The large-area solder pads formed by bending the copper strip eliminate the air gap between the magnetic component 3 and the system board, reducing the thermal resistance between them. In some embodiments, this also reduces the vertical thermal resistance between the switching component 4 and the system board, or between the switching component 4 and the heat sink.

[0138] Of course, the magnetic components of the above embodiments can be applied to different power conversion modules, that is, different magnetic components can be used in the power conversion module, and are not limited to the forms of the above embodiments.

[0139] In summary, the magnetic component of this application utilizes a first conductive structure and a second conductive structure to form a winding, and uses a powder core material to form a magnetic core. Therefore, the magnetic component of this application does not require an additional printed circuit board to set up the winding and magnetic core, eliminating the dimensional tolerances of a printed circuit board and thus eliminating assembly tolerances between the printed circuit board and the magnetic core. This reduces the size of the magnetic component and improves its performance, such as increasing inductance, increasing saturation current, reducing core loss, and reducing winding loss. Furthermore, since the two connecting parts of each conductive structure are exposed on both sides of the magnetic component, and the conductive bodies of the first and second conductive structures are approximately perpendicular to the first and third surfaces of the magnetic component, the cross-sectional length and cross-sectional area of ​​the powder core material through which the magnetic lines of force generated by the conductive bodies pass are relatively long, resulting in lower core loss and higher saturation current capability of the magnetic core.

Claims

1. A magnetic component comprising: A first conductive structure includes a first connecting portion, a first conductive body, and a second connecting portion, wherein the first conductive body is connected between the first connecting portion and the second connecting portion; A second conductive structure includes a third connecting portion, a second conductive body, and a fourth connecting portion, wherein the second conductive body is connected between the third connecting portion and the fourth connecting portion; A core material is pressed together with a first conductive structure and a second conductive structure to form a first surface, a second surface, a third surface, a fourth surface, a fifth surface, and a sixth surface of the magnetic component. The first conductive structure and the second conductive structure are embedded in the core material, and the first surface and the third surface are arranged opposite to each other, the second surface and the fourth surface are arranged opposite to each other, and the fifth surface and the sixth surface are arranged opposite to each other. The first connecting portion and the third connecting portion are both exposed on the fifth surface, the second connecting portion and the fourth connecting portion are both exposed on the sixth surface, and the first connecting portion and the second connecting portion are respectively exposed on any two of the first surface, the second surface, the third surface, and the fourth surface. The third connecting portion and the fourth connecting portion are respectively exposed on any two of the first surface, the second surface, the third surface, and the fourth surface. A first electroplated structure, electroplated on the fifth surface, the second surface, and the sixth surface; and A second electroplating structure is electroplated on the fifth, fourth, and sixth surfaces.

2. The magnetic component of claim 1, wherein the first conductive structure and the second conductive structure are spaced apart.

3. The magnetic component as claimed in claim 1, wherein the first connecting portion is exposed on the first and fifth surfaces of the magnetic component and extends from the fifth surface toward the sixth surface; one end of the first conductive body is connected to the first connecting portion and extends from the first surface toward the third surface; the second connecting portion is connected to the other end of the first conductive body and extends from the fifth surface toward the sixth surface, and the second connecting portion is exposed on the third and sixth surfaces of the magnetic component; the third connecting portion is exposed on the first and fifth surfaces of the magnetic component and extends from the fifth surface toward the sixth surface; one end of the second conductive body is connected to the third connecting portion and extends from the first surface toward the third surface; and the fourth connecting portion is connected to the other end of the second conductive body and extends from the fifth surface toward the sixth surface, and the fourth connecting portion is exposed on the third and sixth surfaces of the magnetic component.

4. The magnetic component of claim 3, wherein the magnetic component comprises a ferrite structure embedded in the core material and located between the first conductive structure and the second conductive structure.

5. The magnetic component of claim 1, wherein the first connecting portion is exposed on the first and fifth surfaces of the magnetic component and extends from the fifth surface toward the sixth surface; the first conductive body includes a first extension, a second extension, and a third extension; one end of the first extension is connected to the first connecting portion and extends from the first surface toward the third surface; one end of the second extension is connected to the other end of the first extension and extends from the second surface toward the fourth surface; one end of the third extension is connected to the other end of the second extension and extends from the first surface toward the third surface; the second connecting portion is connected to the other end of the third extension and extends from the fifth surface toward the sixth surface; and the second connecting portion is exposed on the third and sixth surfaces of the magnetic component; the third connecting portion is exposed on the magnetic component. The first and fifth surfaces of the component are provided, and the second conductive body includes a fourth extension, a fifth extension, and a sixth extension. One end of the fourth extension is connected to the third connecting portion and extends from the first surface to the third surface. One end of the fifth extension is connected to the other end of the fourth extension and extends from the fourth surface to the second surface. One end of the sixth extension is connected to the other end of the fifth extension and extends from the first surface to the third surface. The fourth connecting portion is connected to the other end of the sixth extension and extends from the fifth surface to the sixth surface. The fourth connecting portion is exposed on the third and sixth surfaces of the magnetic component. The length of the first connecting portion is less than the length of the third connecting portion, and the length of the second connecting portion is greater than the length of the fourth connecting portion.

6. The magnetic component of claim 1, wherein the first connecting portion is exposed on the first surface and the fifth surface of the magnetic component and extends from the fifth surface toward the sixth surface; the first conductive body includes a first extension, a second extension, a third extension, a fourth extension, and a fifth extension; one end of the first extension is connected to the first connecting portion and extends from the first surface toward the third surface; one end of the second extension is connected to the other end of the first extension and extends from the second surface toward the fourth surface; and one end of the third extension... One end of the fourth extension is connected to the other end of the third extension and extends from the first surface toward the third surface; one end of the fifth extension is connected to the other end of the fourth extension and extends from the fourth surface toward the second surface; one end of the fifth extension is connected to the other end of the fourth extension and extends from the first surface toward the third surface; the second connecting portion is connected to the other end of the fifth extension and extends from the fifth surface toward the sixth surface, and the second connecting portion is exposed on the third and sixth surfaces of the magnetic assembly; the third connecting portion is exposed on the magnetic assembly. The first and fifth surfaces of the component are provided, and the second conductive body extends from the fifth surface toward the sixth surface. The second conductive body includes a sixth extension, a seventh extension, an eighth extension, a ninth extension, and a tenth extension. One end of the sixth extension is connected to the third connecting portion and extends from the first surface toward the third surface. One end of the seventh extension is connected to the other end of the sixth extension and extends from the fourth surface toward the second surface. One end of the eighth extension is connected to the other end of the seventh extension and extends from the first surface toward the third surface. The ninth extension is configured such that one end is connected to the other end of the eighth extension and extends from the second surface toward the fourth surface; one end of the tenth extension is connected to the other end of the ninth extension and extends from the first surface toward the third surface; the fourth connecting portion is connected to the other end of the tenth extension and extends from the fifth surface toward the sixth surface; and the fourth connecting portion is exposed on the third and sixth surfaces of the magnetic component. The length of the first connecting portion is less than the length of the third connecting portion, and the length of the second connecting portion is greater than the length of the fourth connecting portion.

7. The magnetic component of claim 1, wherein the first connecting portion is exposed on the first and fifth surfaces of the magnetic component and extends from the fifth surface toward the sixth surface; one end of the first conductive body is connected to the first connecting portion and extends from the first surface toward the fourth surface; the second connecting portion is connected to the other end of the first conductive body and extends from the fifth surface toward the sixth surface, and the second connecting portion is exposed on the fourth and sixth surfaces of the magnetic component; the third connecting portion is exposed on the third and fifth surfaces of the magnetic component and extends from the fifth surface toward the sixth surface; one end of the second conductive body is connected to the third connecting portion and extends from the third surface toward the second surface; the fourth connecting portion is connected to the other end of the second conductive body and extends from the fifth surface toward the sixth surface, and the fourth connecting portion is exposed on the second and sixth surfaces of the magnetic component.

8. The magnetic component of claim 1, wherein the first connecting portion is exposed on the first surface and the fifth surface of the magnetic component and extends from the fifth surface toward the sixth surface; the first conductive body includes a first extension, a second extension, and a third extension; one end of the first extension is connected to the first connecting portion and extends from the first surface toward the third surface; one end of the second extension is connected to the other end of the first extension and extends from the second surface toward the fourth surface; one end of the third extension is connected to the other end of the second extension and extends from the first surface toward the third surface; the second connecting portion is connected to the other end of the third extension and extends from the sixth surface toward the fifth surface; and the second connecting portion is exposed on the first surface and the fifth surface of the magnetic component. The third and fifth surfaces; the third connecting portion is exposed on the first and fifth surfaces of the magnetic component and extends from the fifth surface toward the sixth surface. The second conductive body includes a fourth extension, a fifth extension and a sixth extension. One end of the fourth extension is connected to the third connecting portion and extends from the first surface toward the third surface. One end of the fifth extension is connected to the other end of the fourth extension and extends from the fourth surface toward the second surface. One end of the sixth extension is connected to the other end of the fifth extension and extends from the first surface toward the third surface. The fourth connecting portion is connected to the other end of the sixth extension and extends from the sixth surface toward the fifth surface. The fourth connecting portion is exposed on the third and fifth surfaces of the magnetic component.

9. The magnetic component of claim 8, wherein the first connecting portion and the second connecting portion of the first conductive structure each have a bending structure to form a solder pad, and the third connecting portion and the fourth connecting portion of the second conductive structure each have a bending structure to form another solder pad.

10. The magnetic component of claim 1, wherein the magnetic component comprises a plurality of solder pads respectively disposed on the fifth surface or the sixth surface of the magnetic component, wherein the sum of the areas of the plurality of solder pads disposed on the fifth surface is greater than 50% of the area of ​​the fifth surface, and / or the sum of the areas of the plurality of solder pads disposed on the sixth surface is greater than 50% of the area of ​​the sixth surface.

11. The magnetic component of claim 10, wherein the plurality of solder pads are formed of copper strips and are disposed on the fifth or sixth surface of the magnetic component by pressing.

12. The magnetic component as claimed in claim 1, wherein the first conductive structure and the second conductive structure are respectively used to form the windings of the magnetic component and to transmit power signals.

13. The magnetic component of claim 1, wherein the magnetic component includes a third conductive structure and a fourth conductive structure, the third conductive structure being located on the second surface of the magnetic component, and the fourth conductive structure being located on the fourth surface of the magnetic component, wherein the third conductive structure and the fourth conductive structure are used for grounding.

14. The magnetic component as claimed in claim 1, wherein the first electroplating structure and the second electroplating structure are respectively used to transmit control signals and power signals.

15. The magnetic component of claim 1, wherein the first electroplating structure includes a plurality of first sub-electroplated conductive portions, two adjacent first sub-electroplated conductive portions forming a differential signal pair, the plurality of first sub-electroplated conductive portions being parallel to each other, and the second electroplating structure includes a plurality of second sub-electroplated conductive portions, two adjacent second sub-electroplated conductive portions forming another differential signal pair, the plurality of second sub-electroplated conductive portions being parallel to each other.

16. The magnetic component as claimed in claim 15, wherein the first sub-plated conductive portion and the second sub-plated conductive portion located on the fifth surface of the magnetic component each have a bent structure, and the first sub-plated conductive portion and the second sub-plated conductive portion located on the sixth surface of the magnetic component each have a bent structure.

17. The magnetic component of claim 1, wherein the first conductive structure is a one-piece molded structure and the second conductive structure is a one-piece molded structure.

18. The magnetic component of claim 1, wherein the thickness of the first electroplated structure and the thickness of the second electroplated structure are less than the thickness of the first conductive structure or the thickness of the second conductive structure.

19. The magnetic component as claimed in claim 1, wherein the core material is an iron core, an iron-silicon-aluminum core, a permalloy core, a molybdenum-permalloy core, or an amorphous / nanocrystalline core.

20. The magnetic component of claim 1, wherein the core material comprises a plurality of core particles, each core particle comprising an insulating layer for coating the core particle, wherein the insulating layer is an organic coating agent or an inorganic coating agent.

21. A power conversion module, comprising: A first circuit board includes a first side and a second side disposed opposite to each other; The magnetic component as claimed in claim 1, wherein the fifth surface of the magnetic component is attached to the second surface of the first circuit board; and Two switch assemblies are disposed on the first circuit board. The two switch assemblies are respectively connected to the first connection portion of the first conductive structure and the second connection portion of the second conductive structure via wiring in the first circuit board.

22. The power conversion module of claim 21, wherein the power conversion module includes a second circuit board, including a first surface and a second surface disposed opposite to each other, the first surface of the second circuit board being attached to the magnetic component, wherein the first circuit board and the second circuit board are respectively located on opposite sides of the magnetic component, and the second connection portion of the first conductive structure and the fourth connection portion of the second conductive structure are respectively connected to a system board via wiring in the second circuit board.

23. The power conversion module of claim 21, wherein the first circuit board includes a recess formed by the second surface of the first circuit board, and the power conversion module includes a plurality of input capacitors disposed in the recess of the first circuit board.

24. The power conversion module as claimed in claim 21, wherein the power conversion module includes a plurality of input capacitors disposed on the first side of the first circuit board, and the two switching components are disposed on the first side of the first circuit board.

25. The power conversion module as claimed in claim 21, wherein the power conversion module includes a plurality of input capacitors embedded in the first circuit board, and the two switching components are embedded in the first circuit board.

26. The power conversion module of claim 21, wherein the first connection portion is exposed on the first and fifth surfaces of the magnetic component and extends from the fifth surface toward the sixth surface; one end of the first conductive body is connected to the first connection portion and extends from the first surface toward the third surface; the second connection portion is connected to the other end of the first conductive body and extends from the fifth surface toward the sixth surface, and the second connection portion is exposed on the third and sixth surfaces of the magnetic component; the third connection portion is exposed on the first and fifth surfaces of the magnetic component and extends from the fifth surface toward the sixth surface; one end of the second conductive body is connected to the third connection portion and extends from the first surface toward the third surface; the fourth connection portion is connected to the other end of the second conductive body and extends from the fifth surface toward the sixth surface, and the fourth connection portion is exposed on the third and sixth surfaces of the magnetic component.

27. The power conversion module of claim 21, wherein the magnetic component includes a ferrite structure embedded in the core material and located between the first conductive structure and the second conductive structure.

28. The power conversion module of claim 21, wherein the first connection portion is exposed on the first surface and the fifth surface of the magnetic component and extends from the fifth surface toward the sixth surface; the first conductive body includes a first extension, a second extension, and a third extension; one end of the first extension is connected to the first connection portion and extends from the first surface toward the third surface; one end of the second extension is connected to the other end of the first extension and extends from the second surface toward the fourth surface; one end of the third extension is connected to the other end of the second extension and extends from the first surface toward the third surface; the second connection portion is connected to the other end of the third extension and extends from the fifth surface toward the sixth surface; and the second connection portion is exposed on the third surface and the sixth surface of the magnetic component; the third connection portion is exposed on the magnetic component. The first and fifth surfaces of the magnetic component are provided, and the second conductive body includes a fourth extension, a fifth extension, and a sixth extension. One end of the fourth extension is connected to the third connecting portion and extends from the first surface to the third surface. One end of the fifth extension is connected to the other end of the fourth extension and extends from the fourth surface to the second surface. One end of the sixth extension is connected to the other end of the fifth extension and extends from the first surface to the third surface. The fourth connecting portion is connected to the other end of the sixth extension and extends from the fifth surface to the sixth surface. The fourth connecting portion is exposed on the third and sixth surfaces of the magnetic component. The length of the first connecting portion is less than the length of the third connecting portion, and the length of the second connecting portion is greater than the length of the fourth connecting portion.

29. The power conversion module of claim 21, wherein the first connection portion is exposed on the first surface and the fifth surface of the magnetic component and extends from the fifth surface toward the sixth surface; the first conductive body includes a first extension, a second extension, a third extension, a fourth extension, and a fifth extension; one end of the first extension is connected to the first connection portion and extends from the first surface toward the third surface; one end of the second extension is connected to the other end of the first extension and extends from the second surface toward the fourth surface; the third extension... One end of the fourth extension is connected to the other end of the third extension and extends from the first surface toward the third surface; one end of the fifth extension is connected to the other end of the third extension and extends from the fourth surface toward the second surface; one end of the fifth extension is connected to the other end of the fourth extension and extends from the first surface toward the third surface; the second connecting portion is connected to the other end of the fifth extension and extends from the fifth surface toward the sixth surface, and the second connecting portion is exposed to the third and sixth surfaces of the magnetic component; the third connecting portion is exposed to the magnetic... The first and fifth surfaces of the sexual component are provided, and the second conductive body extends from the fifth surface toward the sixth surface. The second conductive body includes a sixth extension, a seventh extension, an eighth extension, a ninth extension, and a tenth extension. One end of the sixth extension is connected to the third connecting portion and extends from the first surface toward the third surface. One end of the seventh extension is connected to the other end of the sixth extension and extends from the fourth surface toward the second surface. One end of the eighth extension is connected to the other end of the seventh extension and extends from the first surface toward the third surface. The ninth extension is configured such that one end of the ninth extension is connected to the other end of the eighth extension and extends from the second surface toward the fourth surface; one end of the tenth extension is connected to the other end of the ninth extension and extends from the first surface toward the third surface; the fourth connecting portion is connected to the other end of the tenth extension and extends from the fifth surface toward the sixth surface, and the fourth connecting portion is exposed on the third and sixth surfaces of the magnetic component; wherein the length of the first connecting portion is less than the length of the third connecting portion, and the length of the second connecting portion is greater than the length of the fourth connecting portion.

30. The power conversion module of claim 21, wherein the first connection portion is exposed on the first and fifth surfaces of the magnetic component and extends from the fifth surface toward the sixth surface; one end of the first conductive body is connected to the first connection portion and extends from the first surface toward the fourth surface; the second connection portion is connected to the other end of the first conductive body and extends from the fifth surface toward the sixth surface, and the second connection portion is exposed on the fourth and sixth surfaces of the magnetic component; the third connection portion is exposed on the third and fifth surfaces of the magnetic component and extends from the fifth surface toward the sixth surface; one end of the second conductive body is connected to the third connection portion and extends from the third surface toward the second surface; the fourth connection portion is connected to the other end of the second conductive body and extends from the fifth surface toward the sixth surface, and the fourth connection portion is exposed on the second and sixth surfaces of the magnetic component.

31. The power conversion module of claim 21, wherein the first connection portion is exposed on the first and fifth surfaces of the magnetic component and extends from the fifth surface toward the sixth surface; the first conductive body includes a first extension, a second extension, and a third extension; one end of the first extension is connected to the first connection portion and extends from the first surface toward the third surface; one end of the second extension is connected to the other end of the first extension and extends from the second surface toward the fourth surface; one end of the third extension is connected to the other end of the second extension and extends from the first surface toward the third surface; the second connection portion is connected to the other end of the third extension and extends from the sixth surface toward the fifth surface; and the second connection portion is exposed on the magnetic component. The third and fifth surfaces; the third connecting portion is exposed on the first and fifth surfaces of the magnetic component and extends from the fifth surface toward the sixth surface. The second conductive body includes a fourth extension, a fifth extension and a sixth extension. One end of the fourth extension is connected to the third connecting portion and extends from the first surface toward the third surface. One end of the fifth extension is connected to the other end of the fourth extension and extends from the fourth surface toward the second surface. One end of the sixth extension is connected to the other end of the fifth extension and extends from the first surface toward the third surface. The fourth connecting portion is connected to the other end of the sixth extension and extends from the sixth surface toward the fifth surface. The fourth connecting portion is exposed on the third and fifth surfaces of the magnetic component.

32. The power conversion module of claim 31, wherein the first connecting portion and the second connecting portion of the first conductive structure each have a bending structure to form a solder pad, and the third connecting portion and the fourth connecting portion of the second conductive structure each have a bending structure to form another solder pad.

33. The power conversion module of claim 21, wherein the magnetic component includes a plurality of solder pads respectively disposed on the fifth surface or the sixth surface of the magnetic component, wherein the sum of the areas of the plurality of solder pads disposed on the fifth surface is greater than 50% of the area of ​​the fifth surface, and / or the sum of the areas of the plurality of solder pads disposed on the sixth surface is greater than 50% of the area of ​​the sixth surface.

34. The power conversion module of claim 33, wherein the plurality of solder pads are formed of copper strips and are disposed on the fifth or sixth surface of the magnetic component by pressing.

35. The power conversion module of claim 21, wherein the first conductive structure and the second conductive structure are respectively used to form the windings of the magnetic component and to transmit power signals.

36. The power conversion module of claim 21, wherein the magnetic component includes a third conductive structure and a fourth conductive structure, the third conductive structure being located on the second surface of the magnetic component, and the fourth conductive structure being located on the fourth surface of the magnetic component, wherein the third conductive structure and the fourth conductive structure are used for grounding.

37. The power conversion module as claimed in claim 21, wherein the first electroplating structure and the second electroplating structure are respectively used to transmit control signals and power signals.

38. The power conversion module as claimed in claim 21, wherein the first electroplating structure includes a plurality of first sub-electroplating conductive parts, two adjacent first sub-electroplating conductive parts form a differential signal pair, the plurality of first sub-electroplating conductive parts are parallel to each other, and the second electroplating structure includes a plurality of second sub-electroplating conductive parts, two adjacent second sub-electroplating conductive parts form another differential signal pair, the plurality of second sub-electroplating conductive parts are parallel to each other.

39. The power conversion module as claimed in claim 21, wherein the first conductive structure is an integrally formed structure and the second conductive structure is an integrally formed structure.

40. The power conversion module of claim 21, wherein the thickness of the first electroplated structure and the thickness of the second electroplated structure are less than the thickness of the first conductive structure or the thickness of the second conductive structure.

41. The power conversion module as described in claim 21, wherein the powder core material is an iron powder core, an iron-silicon-aluminum powder core, a permalloy powder core, a molybdenum-permalloy powder core, or an amorphous / nanocrystalline powder core.

42. The power conversion module of claim 21, wherein the core material comprises a plurality of core particles, each core particle comprising an insulating layer for coating the core particle, wherein the insulating layer is an organic coating agent or an inorganic coating agent.

43. A method for manufacturing a magnetic component, comprising: (a) A first conductive structure and a second conductive structure are provided, wherein the first conductive structure includes a first connecting portion, a first conductive body and a second connecting portion, and the first conductive body is connected between the first connecting portion and the second connecting portion; the second conductive structure includes a third connecting portion, a second conductive body and a fourth connecting portion, and the second conductive body is connected between the third connecting portion and the fourth connecting portion. (b) A core material is provided, which is pressed together with the first conductive structure and the second conductive structure to form a first surface, a second surface, a third surface, a fourth surface, a fifth surface and a sixth surface of the magnetic component, and the first conductive structure and the second conductive structure are embedded in the core material, wherein the first surface and the third surface are arranged opposite to each other, the second surface and the fourth surface are arranged opposite to each other, and the fifth surface and the sixth surface are arranged opposite to each other; (c) Polishing the core material so that the first connecting portion and the third connecting portion are both exposed on the fifth surface, the second connecting portion and the fourth connecting portion are both exposed on the sixth surface, and the first connecting portion and the second connecting portion are respectively exposed on any two of the first surface, the second surface, the third surface, and the fourth surface, and the third connecting portion and the fourth connecting portion are respectively exposed on any two of the first surface, the second surface, the third surface, and the fourth surface; and (d) Electroplating a first electroplating structure on the fifth, second and sixth surfaces, and electroplating a second electroplating structure on the fifth, fourth and sixth surfaces.

44. The manufacturing process of claim 43, wherein the manufacturing process further comprises annealing the magnetic component.

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