Electronic device

Abstract

The application provides an electronic device, which comprises a shell and a display screen, the display screen is installed on the shell, wherein the electronic device further comprises a carrier plate and a flexible flat cable, the carrier plate is loaded with devices, the carrier plate and the flexible flat cable are arranged between the shell and the display screen, and the flexible flat cable is welded to the carrier plate. By adopting the welding connection mode of the flexible flat cable and the carrier plate, the use of the existing connector can be cancelled, so that the distance between the shell and the display screen is reduced from the sum of the thickness of the carrier plate and the height of the connector to the sum of the thickness of the carrier plate and the height of the devices thereon, which is beneficial to the thin design of the electronic device. Meanwhile, the cancellation of the connector can save a large amount of under-screen space, which is beneficial to the arrangement and optimization of the devices and the circuit.

Description

Technical Field

[0001] This application relates to the field of electronic terminal technology, and more particularly to an electronic device. Background Technology

[0002] Both FFC (Flexible Flat Cable) and FPC (Flexible Printed Circuit) cables are used for signal connections in electronic products such as monitors, laptops, desktops, and mobile phones. Currently, the only way to connect FFC or FPC cables to a PCB (Printed Circuit Board) is by mounting connectors on the PCB and connecting them to the FFC or FPC cable to achieve signal transmission. However, the connectors have a large height and width requirement perpendicular to the screen surface, resulting in a small screen-to-body ratio and limited under-screen space. Summary of the Invention

[0003] The purpose of this application is to provide an electronic device to solve the problem that the use of connectors and FFC cables in the prior art cannot achieve the goal of making electronic products thinner and lighter.

[0004] This application provides an electronic device, including a housing and a display screen, wherein the display screen is mounted on the housing, and the electronic device further includes a carrier board and a flexible flat cable, wherein the carrier board is loaded with devices, the carrier board and the flexible flat cable are disposed between the housing and the display screen, and the flexible flat cable is soldered to the carrier board.

[0005] This application eliminates the need for existing connectors by using a flexible flat cable soldered to the carrier board. This reduces the distance between the housing and the display screen from the sum of the carrier board thickness and the connector height to the sum of the carrier board thickness and the height of the components on it, facilitating the design of thin electronic devices. Furthermore, eliminating the connector saves significant under-screen space, which is beneficial for the layout and optimization of components and circuitry.

[0006] In one possible implementation, the welding height between the flexible flat cable and the carrier board is less than the height of the device on the carrier board, or the welding thickness between the flexible flat cable and the carrier board is less than the thickness of the device on the carrier board. This allows the distance between the electronic device's housing and the display screen to be further reduced to at least the sum of the thickness of the carrier board 1 and the device thickness, facilitating a thinner design for the electronic device.

[0007] In one possible implementation, the flexible flat cable includes a conductive layer, on which at least a solder layer is provided in part, and / or on which holes for filling solder are provided.

[0008] In this case, a solder layer is provided on the conductive layer in at least a portion. In the case where the conductive layer does not have holes, the solder layer can improve the bonding effect between the solder layer and the solder, enhance solderability, and improve the welding strength between the flexible flat cable and the carrier board.

[0009] In the case where the conductive layer has holes for filling solder but no solder layer, the solder is filled onto the carrier plate through these holes, so that both sides of the conductive layer can have solder, which simplifies the soldering operation while ensuring the soldering strength.

[0010] By providing both a solder layer and holes for filling solder on the conductive layer, the soldering operation can be simplified while ensuring reliable soldering connection between the conductive layer and the carrier plate.

[0011] In one possible implementation, the flexible flat cable further includes an insulating layer. The conductive layer has a soldering area, and the insulating layer covers the portion of the conductive layer outside the soldering area. This effectively isolates the conductive layer from contact with other components, preventing leakage. Simultaneously, by not providing an insulating layer for the soldering area, the conductive layer can be easily soldered to the carrier board through its soldering area, thus achieving the connection between the flexible flat cable and the carrier board. Furthermore, the insulating layer also enhances the strength and bending resistance of the flexible flat cable, preventing deformation or damage from slight interference.

[0012] In one possible implementation, the insulation layer has a window aligned with the welding area. This window simplifies welding, allows for more flexible welding position settings, and enables the wiring on either side of the welding area to be bent as needed, thus broadening the application range of the flexible flat cable.

[0013] In one possible implementation, the welding area is located at the end of the conductive layer, and the end of the conductive layer with the welding area extends from the insulating layer. The end of the conductive layer extending from the insulating layer can be directly welded to the carrier board, eliminating the need for openings in the insulating layer.

[0014] In one possible implementation, an adhesive layer is provided between the welded area and the insulating layer after welding. This can enhance the strength and bending resistance of the conductive layer at the interface.

[0015] In one possible implementation, the insulating layer is made of one or more of polyethylene terephthalate (PET), polyimide (PI), liquid crystal polymer (LCP), and polyether ether ketone (PEEK). This allows the insulating layer to acquire excellent electrical insulation, fatigue resistance, and other properties.

[0016] In one possible implementation, the insulating layer comprises a polyethylene terephthalate (PET) layer and a polyimide (PI) layer. The polyimide (PI) layer covers the conductive layer near the welding area, and the polyethylene terephthalate (PET) layer covers the conductive layer away from the welding area. By using a combination of PET and PI layers throughout the insulating layer, the PI material can be used near the welding area to utilize its high-temperature resistance, preventing melting and ensuring welding quality. Meanwhile, PET material can be used in areas away from the welding area. This approach effectively reduces the cost of the insulating layer while achieving both insulation and protection.

[0017] In one possible implementation, the insulating layer includes a first film layer and a second film layer, which are respectively disposed on opposite sides of the conductive layer. This facilitates manufacturing processes.

[0018] In one possible implementation, the material of the solder layer is tin, gold, or silver. Tin, gold, and silver have strong solderability, which can effectively ensure the strength and reliability of the solder joint between the conductive layer and the carrier board.

[0019] In one possible implementation, the conductive layer comprises at least one copper sheet. This copper sheet has a certain width to facilitate surface opening and also to facilitate welding and fixing between the copper sheet and the carrier plate.

[0020] In one possible implementation, the flexible flat cable is welded to the carrier board using laser welding, ultrasonic welding, reflow soldering, or hot-press soldering. This ensures consistent welding quality.

[0021] In one possible implementation, the carrier board is one of a camera module board, a microphone board, or a multilayer PCB board.

[0022] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0023] Figure 1 This is a diagram showing the connection status of circuit boards and circuits in the prior art.

[0024] Figure 2 A diagram showing the state of a conductive layer with a weld layer but no holes during welding (I);

[0025] Figure 3 Diagram (II) showing the state of a conductive layer with a weld layer but no holes during welding;

[0026] Figure 4This is a diagram showing the state of a conductive layer with holes but no solder layer during welding.

[0027] Figure 5 A schematic diagram showing an opening in the soldering area of ​​the conductive layer;

[0028] Figure 6 This is a diagram showing the state of a conductive layer that has both holes and a weld layer during welding.

[0029] Figure 7 A three-dimensional view of an insulating layer disposed on a conductive layer (the insulating layer has windows);

[0030] Figure 8 A cross-sectional view of an insulating layer on a conductive layer (the insulating layer has windows);

[0031] Figure 9 A three-dimensional view of an insulating layer on a conductive layer (the insulating layer does not have windows);

[0032] Figure 10 A cross-sectional view of a conductive layer with an insulating layer (the insulating layer does not have windows);

[0033] Figure 11 This is a schematic diagram of a structure in which an insulating layer made of PI material is disposed on a conductive layer (the end of the conductive layer does not extend out of the insulating layer);

[0034] Figure 12 A schematic diagram of a structure in which an insulating layer, including a PET layer and a PI layer, is disposed on a conductive layer;

[0035] Figure 13 This is a schematic diagram of a laptop computer.

[0036] Figure 14 A cross-sectional view of an insulating layer disposed on a conductive layer with a solder layer (the insulating layer includes a PET layer and a PI layer);

[0037] Figure 15 This is a schematic diagram of a structure in which an insulating layer made of PI material is disposed on a conductive layer (the end of the conductive layer extends out of the insulating layer);

[0038] Figure 16 This is a diagram showing the state of adhesive application in the welding area.

[0039] Figure label:

[0040] 100 - Circuit board;

[0041] 200-Connector;

[0042] 300-devices;

[0043] 400-line;

[0044] 1-Carrier plate;

[0045] 2- Flexible flat cable;

[0046] 21-Conductive layer;

[0047] 211-hole;

[0048] 22 - Insulation layer;

[0049] 221 - First film layer;

[0050] 222 - Second film layer;

[0051] 23 - Weld layer;

[0052] 24 - Open the window;

[0053] 25-PET layer;

[0054] 26-PI layers;

[0055] 3- Solder;

[0056] 4- Laptops;

[0057] 41-Shell;

[0058] 42-Motherboard;

[0059] 43 - Display screen;

[0060] 5-Glue.

[0061] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Detailed Implementation

[0062] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0063] In the description of this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more; the terms "connected," "fixed," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0064] In the description of this specification, it should be understood that the directional terms such as "upper" and "lower" used in the embodiments of this application are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should also be understood that when it is mentioned that an element is connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected to the other element "upper" or "lower" through an intermediate element.

[0065] This application provides an electronic device, including devices with a display screen and a housing, such as monitors, laptops, desktops, all-in-one computers, mobile phones, tablets, or smartwatches. This embodiment does not specifically limit the type of electronic device. Electronic devices typically include a display screen and a housing, with a circuit board integrated between them. Various devices capable of performing different functions are configured on the circuit board, such as camera modules and microphone modules. These devices need to be connected to the main control unit of the electronic device via lines, and the main control unit can transmit signals through these lines to achieve the aforementioned functions.

[0066] Figure 1 This is a state diagram of the connection between the circuit board and the circuit in the prior art, such as... Figure 1 As shown, existing circuits typically require connectors 200 (such as BTB / Zif / WTB connectors) to connect to the circuit board 100. This involves soldering connectors onto the circuit board 100 and then inserting the circuit 400 into the interface of the connector 200 to complete the connection. However, existing connectors 200 are all three-dimensional block structures with a large Z-axis (perpendicular to the display surface) height, usually greater than the height of the components 300 on the circuit board 100. This necessitates a larger distance between the housing and the display, making it difficult to achieve a thin design in electronic devices. Simultaneously, the large overall volume of the connector 200 reduces the under-screen space of the electronic device, and the large width requirement of the connector 200 in the direction parallel to the display also reduces the screen-to-body ratio.

[0067] Therefore, this application provides an electronic device including a housing and a display screen mounted on the housing. The electronic device also includes a carrier board 1 and a flexible flat cable 2. The carrier board 1 carries devices capable of performing various functions. The carrier board 1 and the flexible flat cable 2 are disposed between the housing and the display screen, and the flexible flat cable 2 is soldered to the carrier board 1. The carrier board 1 can be a circuit board, such as a single-layer or multi-layer PCB (Printed Circuit Board), FPC (Flexible Printed Circuit Board), etc. The carrier board 1 has a certain width and length, and its surface can be used to mount various functional components. The carrier board 1 is relatively thin. When mounted on the housing, its surface is parallel to the display screen. At this point, the thickness of the carrier board 1 and the height of the components on it limit the distance between the housing and the display screen. However, by using a flexible flat cable 2 to solder to the carrier board 1, the use of existing connectors can be eliminated. The soldering height between the flexible flat cable 2 and the carrier board 1 at the soldering point is much smaller than the height of the components on the carrier board 1. This reduces the distance between the housing and the display screen from the sum of the carrier board 1's thickness and the connector height to the sum of the carrier board 1's thickness and the height of the components, facilitating a thinner design for electronic devices. Simultaneously, eliminating the connector saves significant under-screen space—the space between the display screen and the housing—which is beneficial for the arrangement and optimization of components and circuitry.

[0068] Furthermore, because connectors have large dimensions in both width and length, the circuit boards that connect to them also need to be large, resulting in a reduced screen-to-body ratio. In this embodiment, by using soldering instead of connectors, the soldering area does not need to occupy a large area on the carrier board 1, thereby reducing the width and length of the carrier board 1 and increasing the screen-to-body ratio.

[0069] The flexible flat cable 2 can be an FFC (Flexible Flat Cable) cable, an FPC (Flexible Printed Circuit) cable, or other flexible flat cables. In this embodiment, the flexible flat cable 2 is preferably an FFC cable. FFC cables allow for arbitrary selection of the number and spacing of wires, making wiring more convenient and greatly reducing the size of electronic devices.

[0070] It should be noted that the welding height between the flexible flat cable 2 and the carrier board 1 is less than the height of the device on the carrier board 1, or the welding thickness between the flexible flat cable 2 and the carrier board 1 is less than the thickness of the device on the carrier board 1. Here, the welding height between the flexible flat cable 2 and the carrier board 1, and the height of the device on the carrier board 1, refer to the height dimension perpendicular to the surface of the display screen, or the welding thickness between the flexible flat cable 2 and the carrier board 1, and the thickness of the device on the carrier board 1, refer to the thickness dimension perpendicular to the surface of the display screen. This application uses the example where the welding thickness between the flexible flat cable 2 and the carrier board 1 is less than the thickness of the device on the carrier board 1 for illustration.

[0071] It is understandable that for existing electronic devices with connectors, the thickness of the connector is usually greater than the thickness of the components on the carrier board. Therefore, the thickness of the electronic device is determined by both the carrier board thickness and the thickness of the connector on the carrier board. This means the overall thickness of the electronic device must be at least greater than the sum of the carrier board thickness and the connector thickness, preventing further reduction in thickness and hindering the achievement of a thinner design. Therefore, in this embodiment, by using a connection method where the carrier board 1 is soldered to the flexible flat cable 2, the use of existing connectors can be eliminated. The solder thickness at the soldering point between the flexible flat cable 2 and the carrier board 1 is much smaller than the height of the components on the carrier board 1. This allows the distance between the electronic device's casing and the display screen to be further reduced to at least the sum of the carrier board 1 thickness and the component thickness, which is beneficial for achieving a thinner design for the electronic device.

[0072] The flexible flat cable 2 includes a conductive layer 21, which enables signal transmission between the main control unit and the carrier board 1. The flexible flat cable 2 can be directly soldered to the carrier board 1 through the conductive layer 21.

[0073] In one specific embodiment, a welding layer 23 is at least partially disposed on the conductive layer 21, while the conductive layer 21 does not have holes 211. Specifically, the welding layer 23 may be disposed in a certain area on the conductive layer 21 where it is welded to the carrier plate 1. In one welding operation mode, such as... Figure 2 As shown, solder 3 can be added to the welding area on the carrier plate 1 first, and then the welding area on the conductive layer 21 can be overlapped to the welding area on the carrier plate 1. A preset welding process is then used to weld the overlap between the conductive layer 21 and the carrier plate 1. In another welding operation method, as shown... Figure 3 As shown, solder 3 can also be added to the welding parts on the carrier plate 1 first, then the welding parts on the conductive layer 21 can be overlapped to the welding parts on the carrier plate 1, and then solder 3 can be added to the welding parts on the conductive layer 21 so that the welding parts of the conductive layer 21 are buried in the solder 3. Then, the overlap position of the conductive layer 21 and the carrier plate 1 can be welded using a preset welding process.

[0074] During welding, the temperature at the welding position is high. After the welding layer 23 and the solder 3 melt and fuse together, a reliable connection between the conductive layer 21 and the carrier plate 1 is achieved through the fusion of the welding layer 23 and the solder 3.

[0075] Compared to the method of directly welding the conductive layer 21 to the carrier plate 1, by setting the welding layer 23 on the conductive layer 21, the welding layer 23 and the solder 3 can have a better bonding effect, enhance solderability, and improve the welding strength between the flexible flat cable 2 and the carrier plate 1.

[0076] It should be noted that the conductive layer 21 generally has a relatively long length. Before setting the solder layer 23 on the conductive layer 21, the position of the solder layer 23 on the conductive layer 21 can be determined according to the length requirements of the flexible flat cable 2 required by the electronic device. Of course, in order to simplify the process of setting the solder layer 23 on the conductive layer 21, the entire surface of the conductive layer 21 can also be covered with the solder layer 23. When applied to electronic devices, only the length required by the electronic device needs to be cut.

[0077] In another specific embodiment, such as Figure 4 and Figure 5 As shown, the conductive layer 21 may have holes 211 for filling with solder 3, but the conductive layer 21 does not have a welding layer 23. During the welding operation, the welding part on the conductive layer 21 can be overlapped with the welding part on the carrier plate 1, and then solder 3 is added to the conductive layer 21. Since the conductive layer 21 has holes 211, the solder 3 can fill the carrier plate 1 through the holes 211. Then, a preset welding process can be used to weld the overlap position between the conductive layer 21 and the carrier plate 1. In this embodiment, the solder 3 can fill the space between the conductive layer 21 and the carrier plate 1 from the side of the conductive layer 21 away from the carrier plate 1 through the holes 211 on the conductive layer 21, so that both sides of the conductive layer 21 can have solder 3. During the welding process, the molten solder 3 can completely cover and fix the welding part of the conductive layer 21 to the carrier plate 1, thereby improving the welding strength between the conductive layer 21 and the carrier plate 1. At the same time, this embodiment only requires adding solder 3 to the conductive layer 21, simplifying the welding operation.

[0078] The hole 211 on the conductive layer 21 can be formed in the soldering area of ​​the conductive layer 21 to allow the solder 3 to pass through. The hole 211 can be made by laser drilling 211 or mechanical drilling 211, and this embodiment does not limit the process.

[0079] In yet another specific embodiment, such as Figure 6As shown, the conductive layer 21 has both a welding layer 23 and holes 211 for filling with solder 3. During the welding operation, the welding portion on the conductive layer 21 can be overlapped with the welding portion on the carrier plate 1, and then solder 3 is added to the conductive layer 21. Since the conductive layer 21 has holes 211, the solder 3 can fill the carrier plate 1 through the holes 211. Then, a preset welding process can be used to weld the overlap position between the conductive layer 21 and the carrier plate 1. During welding, the high heat causes the welding layer 23 and the solder 3 to melt and bond together. At the same time, the molten welding layer 23 and the solder 3 can completely cover and fix the welding portion of the conductive layer 21 to the carrier plate 1. Thus, this embodiment simplifies the welding operation and ensures the reliability of the welded connection between the conductive layer 21 and the carrier plate 1.

[0080] The welding process used between the flexible flat cable 2 and the carrier board 1 can be laser welding, ultrasonic welding, reflow welding, or hot-press solder welding, etc.

[0081] In addition, the solder 3 mentioned above can be tin. The way to add solder 3 can be to pre-apply tin at the soldering position on the carrier board 1, or to apply tin manually, such as by feeding tin wire or spraying tin. This embodiment does not limit this.

[0082] As a specific implementation, the flexible flat cable 2 also includes an insulating layer 22. The conductive layer 21 has a soldering area, and the insulating layer 22 covers the portion of the conductive layer 21 outside the soldering area. This soldering area is the area on the conductive layer 21 that needs to be soldered to the carrier board 1 through a soldering process. It is understood that the carrier board 1 and the main control unit in an electronic device are usually kept at a certain distance and need to be connected via the flexible flat cable 2. The flexible flat cable 2 is prone to contact with components located between the carrier board 1 and the main control unit. If the conductive layer 21 is completely exposed, leakage is likely to occur, leading to short circuits, burn-out, and other problems between the flexible flat cable 2 and other components. Therefore, in this embodiment, by providing an insulating layer 22 on the conductive layer 21 outside the soldering area, contact between the conductive layer 21 and other components can be effectively isolated, preventing leakage. Simultaneously, by not providing an insulating layer 22 on the soldering area, the conductive layer 21 can be easily soldered to the carrier board 1 through its soldering area, thus achieving the connection between the flexible flat cable 2 and the carrier board 1. In addition, the insulation layer 22 can also enhance the strength and bending resistance of the flexible flat cable 2, and prevent the flexible flat cable 2 from being deformed or damaged by slight interference.

[0083] In one specific embodiment, such as Figure 7 and Figure 8As shown, the insulating layer 22 can completely cover the conductive layer 21, with a window 24 only opened at a position opposite to the welding area. This allows the welding area to be exposed through the window 24, facilitating the addition of solder 3 and the welding operation. The welding area can be located at a predetermined position between the two ends of the conductive layer 21. Depending on the welding position, the window 24 can be positioned at a corresponding location on the insulating layer 22. Therefore, by providing the window 24 on the insulating layer 22, welding is facilitated, the welding position is more flexible, and the lines on both sides of the welding area can be bent as needed, broadening the application of the flexible flat cable 2.

[0084] In another specific embodiment, such as Figure 9 and Figure 10 As shown, the welding area can be located at the end of the conductive layer 21, meaning that a length of the conductive layer 21 at its end can be the welding area, and the end of the conductive layer 21 with the welding area extends from the insulating layer 22. In this embodiment, the end of the conductive layer 21 extending from the insulating layer 22 can be directly welded to the carrier plate 1, and there is no need for a window 24 on the insulating layer 22. The length of the insulating layer 22 can be determined according to the length requirements of the conductive layer 21.

[0085] Furthermore, it should be noted that in this embodiment, the end of the conductive layer 21 with the welding area extends from the insulating layer 22, meaning that the welding area only has the insulating layer 22 on one side. The end face of the insulating layer 22 forms the interface between the welding area and the insulating layer 22. The portion of the flexible flat cable 2 with the insulating layer 22 has stronger bending resistance, while the welding area without the insulating layer 22 has weaker bending resistance and is prone to bending deformation. Moreover, the easily bent and deformed portion occurs at the interface position, and bending deformation can lead to fatigue fracture of the conductive layer 21 located at the interface position. Therefore, after welding, an adhesive layer can be provided between the welding area and the insulating layer 22, i.e., the adhesive layer is preferably provided at the interface position, thereby enhancing the strength and bending resistance of the conductive layer 21 at the interface position.

[0086] Specifically, the insulating layer 22 is made of, but is not limited to, one or a combination of two or more of polyethylene terephthalate (PET), polyimide (PI), liquid crystal polymer (LCP), and polyether ether ketone (PEEK). The insulating layer 22 can be entirely made of any of the aforementioned materials; it can also consist of multiple segments, each made of any of the aforementioned materials, which are then combined to form the complete insulating layer 22. The length of each segment can be the same or different, depending on the dimensions of the conductive layer 21 and the location of the welding area. The insulating layer 22 can be applied to the conductive layer 21 using a hot-pressing process, or other existing processes can be used; this embodiment does not limit the application of these processes.

[0087] In one specific embodiment, the insulating layer 22 is made of PET. The insulating layer 22 of PET material has excellent electrical insulation, creep resistance, fatigue resistance, abrasion resistance and dimensional stability. Moreover, PET material is inexpensive, which saves on the manufacturing cost of electronic devices.

[0088] In another specific embodiment, since the melting point of PET material is 105°C, during the welding process of the conductive layer 21, a certain range of heat-affected zone exists around the welding area. This heat-affected zone is formed by the diffusion of heat from the welding area. The temperature of the heat-affected zone remains high, which can cause the PET material in contact with the heat-affected zone to melt and flow towards the welding position, forming voids at the welding position. Therefore, in this embodiment, as... Figure 11 As shown, the insulating layer 22 is made of PI. Because it is resistant to high temperatures of over 400°C, it will not melt when it comes into contact with the heat-affected zone, thus ensuring the welding effect between the conductive layer 21 and the carrier plate 1 and preventing voids from forming at the welding position.

[0089] In yet another specific embodiment, such as Figure 12 As shown, the insulating layer 22 includes a PET layer 25 and a PI layer 26, with the PI layer 26 covering the conductive layer 21 near the welding area. It should be noted that the cost of PI material is much higher than that of PET material. If the insulating layer 22 were entirely made of PI material, the overall cost of the electronic device would increase. Therefore, in this embodiment, the insulating layer 22 uses a combination of PET layer 25 and PI layer 26. Specifically, the insulating layer 22 can use PI material near the welding area, utilizing the high-temperature resistance of PI material to avoid melting and ensure welding quality, while using PET material in areas away from the welding area. This achieves insulation and protection while effectively reducing the cost of the insulating layer 22.

[0090] Specifically, such as Figure 7 and Figure 9 As shown, the insulating layer 22 includes a first film layer 221 and a second film layer 222, which are respectively disposed on both sides of the conductive layer 21. Both the first film layer 221 and the second film layer 222 can be in sheet form. During the fabrication of the flexible flat cable 2, the conductive layer 21 can be disposed between the first film layer 221 and the second film layer 222, and a hot-pressing process can be used to hot-press the first film layer 221, the conductive layer 21, and the second film layer 222 into a single integral structure, thereby fixing the first film layer 221 and the second film layer 222 onto the conductive layer 21.

[0091] As a specific implementation, the material of the welding layer 23 is tin, gold, or silver. The welding layer 23 is a plating layer formed on the conductive layer 21 through a surface treatment process. Tin, gold, and silver have strong solderability, effectively ensuring the strength and reliability of the weld between the conductive layer 21 and the carrier plate 1. In this embodiment, the preferred material for the welding layer 23 is tin, as tin as the welding layer 23 ensures welding strength while reducing costs.

[0092] As a specific implementation, the conductive layer 21 can be made of copper, specifically including at least one copper sheet. The copper sheet has a certain width, and through holes 211 can be formed on the surface of the copper sheet for adding solder 3 into the holes 211 and for adding solder 3 between the copper sheet and the carrier plate 1 after passing through the holes 211, thus ensuring the reliability of the soldering.

[0093] As a specific implementation, the carrier board 1 in this application embodiment can be one of a camera module board, a microphone board, or a multilayer PCB board.

[0094] This application is specifically illustrated through the following embodiments.

[0095] Example 1:

[0096] like Figure 13 As shown, the electronic device can be a laptop computer 4. The carrier board 1 can be a small camera module board, which is fixed to the laptop's casing 41 and located between the display screen 43 and the casing 41. The flexible flat cable 2 is an FPC cable. One end of the FPC cable is soldered to the camera module board using processes such as laser soldering, ultrasonic soldering, reflow soldering, or hot-press soldering. The other end of the FPC cable is connected to the motherboard 42 of the laptop computer 4, thereby enabling signal transmission between the motherboard 42 and the camera module board through the FPC cable. In this embodiment, as... Figure 4 and Figure 5 As shown, holes 211 for adding solder 3 can be set on the conductive layer 21 of the FPC cable by means of mechanical drilling 211, laser drilling 211, etc. The conductive layer 21 is provided with an insulating layer 22, and the insulating layer 22 is made of PI, such as Figure 11 As shown. The conductive layer 21 is made of copper wire.

[0097] In this embodiment, solder 3 can fill the holes 211, and can also fill the conductive layer 21 from the side away from the camera module board through the holes 211 on the conductive layer 21, so that both sides of the conductive layer 21 can have solder 3. During the welding process, the molten solder 3 can completely cover and fix the welding part of the conductive layer 21 to the camera module board, thereby improving the welding strength between the conductive layer 21 and the camera module board. At the same time, this embodiment only needs to add solder 3 to the conductive layer 21, without having to add solder 3 separately to the camera module board, simplifying the welding operation.

[0098] Furthermore, in this embodiment, as Figure 7 and Figure 8 As shown, the insulating layer 22 can completely cover the conductive layer 21, with an opening 24 only at a position opposite to the welding area. This opening 24 exposes the welding area, facilitating the addition of solder 3 and the welding operation. The welding area can be located at a predetermined position between the two ends of the conductive layer 21, meaning that the welding area has insulating layers 22 on both sides along the length of the flexible flat cable 2. The insulating layers 22 improve the bending resistance of the flexible flat cable 2 on both sides of the welding area, ensuring the strength of the welding position even without adhesive after welding. Furthermore, the welding method between the camera module board and the FPC cable reduces the Z-axis space between the camera module board and the laptop casing, thereby reducing the overall thickness of the screen and achieving a thinner laptop design. In addition, the welding method replaces the use of traditional connectors, reducing the width of the camera module board and improving the laptop's screen-to-body ratio.

[0099] Example 2:

[0100] This electronic device can be a display product, the carrier board 1 can be a microphone board, and the flexible flat cable 2 is an FFC cable. One end of the FFC cable is connected to the microphone board via laser soldering, ultrasonic soldering, reflow soldering, or hot-press soldering. The other end of the FFC cable is connected to the motherboard of the display product, thus enabling signal transmission between the motherboard and the microphone board. In this embodiment, as... Figure 5 and Figure 6 As shown, holes 211 for adding solder 3 can be set on the conductive layer 21 of the FFC cable by means of mechanical drilling 211, laser drilling 211, etc. The conductive layer 21 is provided with an insulating layer 22, which is made of a combination of PET and PI. Figure 12 As shown. The conductive layer 21 is made of tin-plated copper wire.

[0101] In this embodiment, solder 3 can fill the holes 211, and can also be filled from the side of the conductive layer 21 away from the microphone board through the holes 211 on the conductive layer 21, so that both sides of the conductive layer 21 can have solder 3, which is tin. During the soldering process, the molten tin can completely cover and fix the soldering part of the conductive layer 21 to the microphone board, thereby improving the soldering strength between the conductive layer 21 and the microphone board. At the same time, this embodiment only needs to add tin to the conductive layer 21, without adding tin separately to the microphone board, simplifying the soldering operation.

[0102] Furthermore, in this embodiment, the insulating layer 22 includes a PET layer 25 and a PI layer 26. After the insulating layer 22 is disposed on the conductive layer 21, the PET layer 25 and the PI layer 26 are joined together along the length of the conductive layer 21. The PI layer 26 covers the conductive layer 21 near the welding area, thereby utilizing the high-temperature resistance of the PI material to avoid melting due to heat and ensure welding quality. Using PET material in areas away from the welding area achieves insulation and protection while effectively reducing the cost of the insulating layer 22.

[0103] In this embodiment, the conductive layer 21 is a tin-plated copper wire. During welding, the temperature at the welding position is high, and the tin layer and tin material on the copper wire melt and combine into one, thereby achieving a reliable connection between the conductive layer 21 and the microphone board through the fusion of the tin layer and tin material.

[0104] In addition, such as Figure 9 and Figure 14 As shown, the welding area is located at the end of the conductive layer 21, that is, a section of the length at the end of the conductive layer 21 is the welding area, and the end of the conductive layer 21 with the welding area extends out from the insulating layer 22 and can be directly welded to the microphone board without opening a window 24 in the insulating layer 22, thus simplifying the process.

[0105] This embodiment effectively improves welding strength by using tin-plated copper wire and creating holes 211 on the tin-plated copper wire for adding solder. This eliminates the need for adhesive application in the welding area, simplifying the process. Simultaneously, the microphone board and FFC cable are welded together, replacing the use of traditional connectors. This allows for further reduction in the width and other dimensions of the microphone board, thereby increasing space in the display architecture and saving production costs.

[0106] Example 3:

[0107] The electronic device can be a novel sandwich architecture, which includes a multi-layer PCB board and a flexible flat cable 2, which is an FFC flat cable. The FFC flat cable is soldered to the multi-layer PCB board, that is, the FFC flat cable can realize signal transmission and conduction of the multi-layer PCB board through the soldering process.

[0108] In this embodiment, as Figure 3 As shown, the conductive layer 21 of the FFC cable is a tin-plated copper wire, and no holes 211 are required on the tin-plated copper wire. Before soldering, solder can be added to the soldering position on the PCB board, and then the soldering area of ​​the FFC cable can be overlapped on the solder of the PCB board. Then, solder can be added to the side of the FFC cable away from the PCB board, so that both sides of the soldering area of ​​the FFC cable are covered with solder. During soldering, the solder and the tin layer on the tin-plated copper wire melt and fuse together, thus achieving reliable soldering of the FFC cable to the multilayer PCB board through the fusion of the tin layer and the solder. Using the soldering method of this embodiment, no glue treatment is required after soldering, which can ensure the strength of the soldering position.

[0109] It should be noted that the welding process enables the connection between the FFC cable and the multi-layer PCB board, replacing the existing connector. It also fully utilizes the flexibility of the FFC cable to achieve a 180° fold between the multi-layer PCB boards to connect them. There is no need to set up a bracket between the multi-layer PCB boards, which effectively reduces the Z-axis height of the sandwich architecture and saves production costs.

[0110] In this embodiment, as Figure 15 As shown, the insulating layer 22 is made of PI. By utilizing the high temperature resistance of PI material, the problem of melting due to heat can be avoided, thus ensuring the welding quality.

[0111] In addition, such as Figure 9 and Figure 15 As shown, the welding area is located at the end of the conductive layer 21, that is, a section of the length at the end of the conductive layer 21 is the welding area, and the end of the conductive layer 21 with the welding area extends out from the insulating layer 22 and can be directly welded to the PCB board without opening a window 24 in the insulating layer 22, thus simplifying the process.

[0112] Example 4:

[0113] This electronic device can be a flexible electronic product, such as a foldable screen, a flexible keyboard, or a flexible wearable electronic product. Flexible electronic products integrate various substrates, and the flexible flat cable 2 used to connect these substrates is an FFC flat cable. The FFC flat cable is soldered to the substrate, meaning that signal transmission and conduction between substrates can be achieved using the FFC flat cable. The substrate can be an FFC board or an FPC board.

[0114] Among them, such as Figure 5 and Figure 12As shown, the conductive layer 21 of the FFC cable is made of copper wire. Holes 211 for adding solder 3 (tin slurry) can be formed on the copper wire through mechanical drilling 211, laser drilling 211, or other methods. The tin slurry can fill the holes 211, or it can fill from the side of the conductive layer 21 away from the substrate through the holes 211, so that both sides of the conductive layer 21 have tin slurry. During the soldering process, the molten tin slurry can completely cover and fix the soldering part of the conductive layer 21 to the substrate, thereby improving the soldering strength between the conductive layer 21 and the substrate. At the same time, in this embodiment, only tin slurry needs to be added to the conductive layer 21, without the need to add tin slurry separately to the microphone board, simplifying the soldering operation.

[0115] In this embodiment, as Figure 12 As shown, the insulating layer 22 includes a PET layer 25 and a PI layer 26. After the insulating layer 22 is disposed on the conductive layer 21, the PET layer 25 and the PI layer 26 are joined together along the length of the conductive layer 21. The PI layer 26 covers the conductive layer 21 near the welding area, thereby utilizing the high-temperature resistance of the PI material to avoid melting due to heat and ensure welding quality. Using PET material in areas away from the welding area achieves insulation and protection while effectively reducing the cost of the insulating layer 22.

[0116] In addition, such as Figure 9 As shown, the welding area is located at the end of the conductive layer 21, that is, a section of the length at the end of the conductive layer 21 is the welding area, and the end of the conductive layer 21 with the welding area extends out from the insulating layer 22 and can be directly welded to the substrate without opening a window 24 on the insulating layer 22, thus simplifying the process.

[0117] Among them, such as Figure 16 As shown, in this embodiment, the conductive layer 21 is soldered using unplated copper wire. After soldering, adhesive 5 can be applied to the soldering position to further enhance the connection strength between the FFC cable and the substrate at the soldering position.

[0118] It should be noted that flexible electronic products need to be bent in certain application scenarios. Therefore, in this embodiment, a welding process is adopted, which not only realizes the connection between the FFC cable and the substrate, but also makes full use of the flexibility of the FFC cable to achieve 180° reversal. This gives the flexible electronic products more design space in terms of bending angle matching, and the welding connection method replaces the application of existing connectors, which significantly reduces production costs.

[0119] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An electronic device comprising a housing and a display screen, the display screen being mounted on the housing, characterized in that, The electronic device further includes a carrier board and a flexible flat cable. The carrier board is loaded with devices. The carrier board and the flexible flat cable are disposed between the housing and the display screen, and the flexible flat cable is soldered to the carrier board. The welding thickness between the flexible flat cable and the carrier board is less than the thickness of the device on the carrier board; The flexible flat cable includes a conductive layer, on which at least a solder layer is partially disposed, and / or The conductive layer has holes for filling solder, allowing the solder to fill the space between the conductive layer and the carrier board from the side of the conductive layer away from the carrier board through the holes. The flexible flat cable also includes an insulating layer. The conductive layer has a soldering area, and the insulating layer covers the portion of the conductive layer outside the soldering area. The soldering area is located at the end of the conductive layer, and the end of the conductive layer with the soldering area extends from the insulating layer. The end face of the insulating layer forms an interface between the soldering area and the insulating layer. In the soldered state, an adhesive layer is provided between the soldering area and the insulating layer, and the adhesive layer is located at the interface.

2. The electronic device according to claim 1, characterized in that, The insulating layer is made of one or more of polyethylene terephthalate (PET), polyimide (PI), liquid crystal polymer (LCP), and polyether ether ketone (PEEK).

3. The electronic device according to claim 2, characterized in that, The insulating layer comprises a polyethylene terephthalate (PET) layer and a polyimide (PI) layer, wherein the polyimide (PI) layer covers the conductive layer at a position close to the welding area, and the polyethylene terephthalate (PET) layer covers the conductive layer at a position away from the welding area.

4. The electronic device according to any one of claims 1-3, characterized in that, The insulating layer includes a first film layer and a second film layer, which are respectively disposed on both sides of the conductive layer.

5. The electronic device according to any one of claims 1-3, characterized in that, The flexible flat cable is either an FFC cable or an FPC cable.

6. The electronic device according to any one of claims 1-3, characterized in that, The material of the weld layer is tin, gold, or silver.

7. The electronic device according to any one of claims 1-3, characterized in that, The conductive layer comprises at least one copper sheet.

8. The electronic device according to any one of claims 1-3, characterized in that, The flexible flat cable is welded to the carrier board using laser welding, ultrasonic welding, reflow soldering, or hot-press soldering.

9. The electronic device according to any one of claims 1-3, characterized in that, The carrier board is one of the following: camera module board, microphone board, multilayer PCB board, FPC board, or FFC board.

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