Temperature control methods, devices, equipment and storage media for system-on-a-chip

Abstract

This invention discloses a method, apparatus, device, and storage medium for temperature control of a system-on-a-chip (SoC). The method includes: acquiring attribute information of the SoC and generating a temperature control sequence based on the attribute information; acquiring the current temperature of the SoC at the current moment and determining a target temperature range for the SoC based on the current temperature; within the target temperature range, acquiring at least one reference time prior to the current moment and a reference temperature corresponding to each reference time, and determining a temperature change trend of the SoC based on the current temperature and the reference temperatures; selecting a target sequence element corresponding to the change trend from the temperature control sequence based on the target temperature range and the temperature change trend, and controlling the temperature of the SoC based on the target sequence element. This invention achieves accurate temperature control of the SoC, with high control efficiency and without affecting the SoC's performance.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of multi-core embedded development technology, and in particular to a method, apparatus, device and storage medium for temperature control of a system-on-a-chip. Background Technology

[0002] A system-on-a-chip (SoC) is a technology that integrates a complete system onto a single chip, which can package all or part of the necessary electronic circuitry.

[0003] At present, temperature control of the on-chip system is mainly achieved by reducing the number of working cores or lowering the operating frequency of the working cores.

[0004] However, this method of separately controlling the number of working cores and the operating frequency will affect the performance of the on-chip system, and the temperature control effect is poor, often requiring repeated adjustments, resulting in low control efficiency. Summary of the Invention

[0005] This invention provides a method, apparatus, device, and storage medium for temperature control of a system-on-a-chip (SoC), enabling accurate temperature control of the SoC with high efficiency and without affecting the SoC's performance.

[0006] In a first aspect, embodiments of the present invention provide a method for temperature control of a system-on-a-chip, comprising:

[0007] The system acquires the attribute information of the on-chip system and generates a temperature control sequence based on the attribute information; wherein the temperature control sequence includes at least two sequence elements.

[0008] Obtain the current temperature of the on-chip system at the current moment, and determine the target temperature range of the on-chip system based on the current temperature;

[0009] Within the target temperature range, at least one reference time prior to the current time is obtained, along with a reference temperature corresponding to each reference time, and the temperature change trend of the on-chip system is determined based on the current temperature and each of the reference temperatures.

[0010] Based on the target temperature range and the temperature change trend, a target sequence element corresponding to the change trend is selected in the temperature control sequence, and the temperature of the on-chip system is controlled according to the target sequence element.

[0011] Secondly, embodiments of the present invention also provide a temperature control device for a system-on-a-chip, comprising:

[0012] A temperature control sequence generation module is used to acquire attribute information of the on-chip system and generate a temperature control sequence based on the attribute information; wherein the temperature control sequence includes at least two sequence elements;

[0013] The target temperature range determination module is used to obtain the current temperature of the on-chip system at the current moment, and determine the target temperature range of the on-chip system based on the current temperature.

[0014] A temperature change trend determination module is used to acquire at least one reference time before the current time and a reference temperature corresponding to each reference time within the target temperature range, and to determine the temperature change trend of the on-chip system based on the current temperature and each of the reference temperatures.

[0015] The temperature control module is used to select a target sequence element corresponding to the temperature change trend in the temperature control sequence according to the target temperature range and the temperature change trend, and to control the temperature of the on-chip system according to the target sequence element.

[0016] Thirdly, embodiments of the present invention also provide a temperature control device for a system-on-a-chip, characterized in that the temperature control device for the system-on-a-chip includes:

[0017] One or more processors;

[0018] Storage device for storing one or more programs.

[0019] When the one or more programs are executed by the one or more processors, the one or more processors implement the on-chip temperature control method as described in any embodiment of the present invention.

[0020] Fourthly, embodiments of the present invention also provide a storage medium containing computer-executable instructions, characterized in that the computer-executable instructions, when executed by a computer processor, are used to perform a temperature control method for a system-on-a-chip as described in any embodiment of the present invention.

[0021] This invention provides an embodiment of a system-on-a-chip (SoC) that acquires attribute information and generates a temperature control sequence based on that information. The temperature control sequence includes at least two sequence elements. The current temperature of the SoC is acquired, and a target temperature range for the SoC is determined based on this current temperature. Within the target temperature range, at least one reference time prior to the current time and a reference temperature corresponding to each reference time are acquired. The temperature change trend of the SoC is determined based on the current temperature and the reference temperatures. Based on the target temperature range and the temperature change trend, a target sequence element corresponding to the change trend is selected in the temperature control sequence. The temperature of the SoC is then controlled based on the target sequence element, achieving accurate temperature control of the SoC with high efficiency and without affecting the SoC's performance. Attached Figure Description

[0022] Figure 1 This is a flowchart of a temperature control method for a system-on-a-chip according to Embodiment 1 of the present invention;

[0023] Figure 2 This is a schematic diagram of the structure of a temperature control device for a system-on-a-chip in Embodiment 2 of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of a temperature control device for a system-on-a-chip in Embodiment 3 of the present invention. Detailed Implementation

[0025] The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit the scope of the invention. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the embodiments of the present invention, and not all structures.

[0026] Example 1

[0027] Figure 1 This is a flowchart of a temperature control method for a system-on-a-chip (SoC) according to Embodiment 1 of the present invention. This embodiment is applicable to situations requiring accurate temperature control of an SoC. The method can be executed by an SoC temperature control device, which can be implemented through software and / or hardware and integrated into the SoC temperature control equipment. In this embodiment, the SoC temperature control device can be a computer, server, or tablet computer, etc. Specifically, refer to... Figure 1 The method specifically includes the following steps:

[0028] Step 110: Obtain the attribute information of the on-chip system and generate a temperature control sequence based on the attribute information.

[0029] The temperature control sequence includes at least two sequence elements.

[0030] The system-on-chip (SoC) attribute information may include the number of working cores in the SoC and a frequency list consisting of the operating frequencies of each working core; it should be understood that the operating frequency of each working core is not unique. It should be noted that in this embodiment, the number of working cores in the SoC can be either the maximum or the minimum number of cores, and this embodiment does not impose any limitation on it.

[0031] In this embodiment, before regulating the temperature of the system-on-chip, the attribute information of the system-on-chip can be obtained first, and then a temperature regulation sequence can be generated based on the obtained attribute information. The temperature regulation sequence may include at least two sequence elements, such as 10, 12 or 20, etc. In this embodiment, each sequence element can be arranged in ascending or descending order, and this embodiment does not limit it.

[0032] In an optional implementation of this embodiment, generating a temperature control sequence based on the attribute information may include: determining the number of sequence elements in the temperature control sequence based on the maximum number of working cores and the minimum number of working cores; determining the element content of the target sequence element based on the number of working cores corresponding to the target sequence element and the working frequency; and sorting each sequence element according to the element content of each sequence element to obtain the temperature control sequence.

[0033] The element content of the sequence element includes at least one of the following: the number of working cores corresponding to the sequence element, the working frequency, and the target calculation result of the number of working cores and the working frequency; correspondingly, the step of sorting each sequence element according to the element content of each sequence element to obtain a temperature control sequence may include: sorting each sequence element according to the size relationship of the target calculation result to obtain a temperature control sequence.

[0034] It is understood that the temperature control sequence involved in this embodiment can be sorted in ascending order or in descending order according to the size of the target calculation result, and this embodiment does not limit it.

[0035] In a specific implementation, after obtaining the number of working cores and the frequency list of the system-on-chip, the number of sequence elements in the temperature control sequence can be determined according to the maximum number of cores and the minimum number of cores of the working nuclei;示例性的, the number of sequence elements can be any positive integer greater than or equal to the minimum number of cores, or less than or equal to the maximum number of cores, which is not limited in this embodiment. Further, the element content of the target sequence element can be determined according to the number of working cores corresponding to the target sequence element and the working frequency; where the element content of the sequence element can include: the number of working cores corresponding to the sequence element, the working frequency, and the target calculation result of the number of the working cores and the working frequency; in this embodiment, the target calculation result of the target sequence element can be the product of the number of working cores and the working frequency; further, the sequence elements can be sorted according to the magnitude relationship of the respective target calculation results, so as to obtain the temperature control sequence.

[0036] In a specific example of this embodiment, the maximum number of cores N in the system-on-chip can be obtained (since the system-on-chip is a multi-core system, N is any positive integer greater than or equal to 2 in this embodiment), and the effective frequency list F = <freq0, freq1,..., freqM>; the minimum number of cores N_min configured by the user is obtained; in this embodiment, if N_min < 1, then N_min = 1; if N_min > N, then N_min = N, that is, the minimum number of cores is equal to the maximum number of cores at this time; further, the lowest frequency freq_min configured by the user can be obtained; in this embodiment, if freq_min > max(F), then freq_min = max(F); if freq_min < min(F), then freq_min = min(F); further, a temperature control sequence <C1, C2,..., Ct> can be generated, where Ci = <n, freq, weight = f(n, freq)>; in this embodiment, n is a positive integer not greater than N and not less than N_min; freq is an element in the list F not less than freq_min; f(n, freq) represents the relative power consumption weight when n cores work at the freq frequency. The higher the power consumption weight, the higher the generated heat, the easier the junction temperature of the core rises, and the higher the system performance. In this embodiment, weight = f(n, freq) = n * freq; record <ci>The number of elements in the sequence is COUNT; furthermore, it can be sorted by weight from largest to smallest. <ci>The sequence is sorted; that is, if i>j, then Ci.weight>=Cj.weight.

[0037] Step 120: Obtain the current temperature of the on-chip system at the current moment, and determine the target temperature range of the on-chip system based on the current temperature.

[0038] The target temperature range can be a high-temperature region, a low-temperature region, or a safe temperature region.

[0039] In an optional implementation of this embodiment, after generating the temperature control sequence based on the attribute information of the on-chip system, the temperature of the on-chip system at the current moment can be further obtained, and the target temperature range of the on-chip system can be determined based on the current temperature.

[0040] In this embodiment, determining the target temperature range of the on-chip system based on the current temperature may include the following: when the current temperature is greater than or equal to a first set temperature threshold, the target temperature range of the on-chip system is determined to be a high-temperature region; when the current temperature is less than or equal to a second set temperature threshold, the target temperature range of the on-chip system is determined to be a low-temperature region; when the current temperature is greater than the second set temperature threshold and less than the first set temperature threshold, the target temperature range of the on-chip system is determined to be a safe temperature region.

[0041] Wherein, the first set temperature threshold is greater than the second set temperature threshold. For example, if the first set temperature threshold is 150 degrees Celsius, then the second set temperature threshold can be 80 degrees Celsius. This embodiment does not limit it.

[0042] In a specific example of this embodiment, if the current temperature of the on-chip system is 160 degrees Celsius, which is greater than the first set temperature threshold (150 degrees Celsius), then the target temperature range in which the on-chip system is currently located can be determined to be a high-temperature region; if the current temperature of the on-chip system is 60 degrees Celsius, which is less than the second set temperature threshold (80 degrees Celsius), then the target temperature range in which the on-chip system is currently located can be determined to be a low-temperature region; if the current temperature of the on-chip system is 100 degrees Celsius, which is greater than the second set temperature threshold and less than the first set temperature threshold, then the target temperature range in which the on-chip system is currently located can be determined to be a safe temperature region.

[0043] Step 130: Within the target temperature range, obtain at least one reference time prior to the current time and a reference temperature corresponding to each reference time, and determine the temperature change trend of the on-chip system based on the current temperature and each of the reference temperatures.

[0044] In an optional implementation of this embodiment, after determining the target temperature range where the on-chip system is currently located, multiple reference times before the current time and reference temperatures corresponding to each reference time can be obtained within the target temperature range, and then the temperature change trend of the on-chip system can be determined based on the current temperature and each reference temperature.

[0045] In an optional implementation of this embodiment, determining the temperature change trend of the on-chip system based on the current temperature and each of the reference temperatures may include the following: when the current temperature is greater than each of the reference temperatures and the reference temperatures gradually increase, the temperature change trend is determined to be an upward trend; when the current temperature is less than each of the reference temperatures and the reference temperatures gradually decrease, the temperature change trend is determined to be a downward trend; when the changes in the current temperature and the reference temperatures are reciprocating or similar, the temperature change trend is determined to be a stable trend.

[0046] It should be noted that the temperature change trend involved in this embodiment can refer to any temperature range, and this embodiment does not limit it.

[0047] Step 140: Based on the target temperature range and the temperature change trend, select a target sequence element corresponding to the change trend in the temperature control sequence, and control the temperature of the on-chip system according to the target sequence element.

[0048] In an optional implementation of this embodiment, after determining the target temperature range currently in which the on-chip system is located and the temperature change trend of the on-chip system, a target sequence element corresponding to the change trend can be selected in the temperature control sequence according to the target temperature range and the temperature change trend; furthermore, the temperature of the on-chip system can be controlled according to the target sequence element.

[0049] In an optional implementation of this embodiment, selecting a target sequence element corresponding to the temperature change trend from the temperature control sequence, based on the target temperature range and the temperature change trend, may include the following: when the target temperature range is a high-temperature region and the temperature change trend is an upward trend, selecting a first target sequence element to rapidly degrade the performance of the on-chip system (e.g., cool it down); when the target temperature range is a high-temperature region and the temperature change trend is a downward trend, selecting a second target sequence element; when the target temperature range is a high-temperature region and the temperature change trend is a stable trend, selecting a third target sequence element; wherein, the third target... The sequence element's index is less than the index of the second target sequence element; the second target sequence element's index is less than the index of the first target sequence element; when the target temperature range is a low-temperature region, a fourth target sequence element is selected to rapidly improve the on-chip system's performance (e.g., by increasing temperature); when the target temperature range is a safe temperature range and the temperature change trend is upward, a fifth target sequence element is selected; when the target temperature range is a safe temperature range and the temperature change trend is downward, a sixth target sequence element is selected; when the target temperature range is a safe temperature range and the temperature change trend is stable, no target sequence element needs to be selected.

[0050] In a specific example of this embodiment, if Tc is higher than limit, that is, the target temperature range is a high-temperature region; where Tc is the current temperature and limit is the first set temperature threshold; if the temperature shows an upward trend and exceeds limit for a long time, performance needs to be reduced as quickly as possible; that is, C[i] is adjusted to a smaller value with the maximum step size, i.e., C[i] → C[i+max], and i+max does not exceed <ci>Maximum sequence limit; where C[i+max] is the first target sequence element; if the temperature exceeds the limit for a long time and shows a decreasing trend, performance still needs to be reduced quickly, i.e., C[i]→C[i+max / 2], and i+max / 2 does not exceed <ci>The maximum sequence limit is set, where C[i+max / 2] is the element of the second target sequence. If the limit is just exceeded, or the sequence is relatively stable, the sequence is adjusted in a smaller step size towards the smaller value, i.e., C[i]→C[i+max / 4], and i+max / 4 does not exceed 1 / 2. <ci>Maximum sequence limit, where C[i+max / 4] is the third target sequence element.

[0051] If Tc is less than target, meaning the target temperature range is in the low-temperature region; where Tc is the current temperature and target is the second set temperature threshold; in this case, it is within the absolutely safe temperature range, so performance is rapidly improved, i.e., C[i] → C[i-max / 2], and i-max / 2 does not exceed <ci>Minimum sequence constraint, where C[i-max / 2] is the fourth target sequence element.

[0052] If Tc is between the target and limit, meaning the target temperature range is within the safe temperature range; if the temperature increases continuously or rapidly, adjust with a smaller step size, i.e., C[i] → C[i+max / 4], and i+max / 4 does not exceed <ci>Maximum sequence limit; where C[i+max / 4] is the fifth target sequence element; if the temperature decreases continuously or sharply, adjust with a smaller step size, i.e.: C[i]→C[i-max / 4], and i-max / 4 does not exceed <ci>Minimum sequence limit; where C[i-max / 4] is the sixth target sequence element; if the temperature fluctuates, no temperature control adjustment is performed, and there is no need to select a target sequence element.

[0053] Furthermore, adjusting the temperature of the on-chip system according to the target sequence element may include: adjusting the number of working cores of the on-chip system to the number of working cores corresponding to the target sequence element; and adjusting the operating frequency of the on-chip system to the operating frequency corresponding to the target sequence element.

[0054] Existing solutions primarily regulate the temperature of the on-chip system by individually reducing the number of working cores or lowering their operating frequency. However, this method of separately regulating the number of working cores and their operating frequency can impact the performance of the on-chip system, and the temperature regulation effect is poor, often requiring repeated adjustments, resulting in low regulation efficiency.

[0055] This embodiment addresses the shortcomings of existing technologies by acquiring the attribute information of the on-chip system and generating a temperature control sequence based on that information. The temperature control sequence includes at least two sequence elements. The current temperature of the on-chip system is acquired, and a target temperature range for the system is determined based on this temperature. Within the target temperature range, at least one reference time prior to the current time and a reference temperature corresponding to each reference time are acquired, and the temperature change trend of the on-chip system is determined based on the current temperature and the reference temperatures. Based on the target temperature range and the temperature change trend, a target sequence element corresponding to the change trend is selected from the temperature control sequence, and the temperature of the on-chip system is controlled according to the target sequence element. This allows for accurate simultaneous adjustment of the number of working cores and the operating frequency of the on-chip system, achieving precise temperature control with high efficiency and without affecting the system's performance.

[0056] To enable those skilled in the art to better understand the temperature control method of the on-chip system in this embodiment, a specific example is provided below, and the specific process includes:

[0057] I. Preparatory Work

[0058] 1. Read the maximum number of cores N in the on-chip system and the list of valid frequencies F =<freq0,freq1,…,freqM> ;

[0059] 2. Obtain the minimum number of cores N_min configured by the user; if N_min<1, then N_min=1; if N_min>N, then N_min=N;

[0060] 3. Obtain the minimum frequency freq_min configured by the user. If freq_min > max(F), then freq_min = max(F); if freq_min < min(F), then freq_min = min(F);

[0061] 4. Generate a valid regulation <C1, C2,..., Ct> sequence, where Ci = <n, freq, weight = f(n, freq)>; where,

[0062] a) n is a positive integer not greater than N and not less than N_min;

[0063] b) freq is an element in the list F that is not less than freq_min;

[0064] c) f(n, freq) represents the relative power consumption weight when n cores operate at the freq frequency. The higher the power consumption weight, the higher the generated heat, the easier it is for the core junction temperature to rise, and the higher the system performance. The simple calculation method adopted in this example is: weight = f(n, freq) = n * freq;

[0065] d) Record <ci>The number of elements in the sequence is COUNT;

[0066] 5. Arrange the items from largest to smallest weight. <ci>The sequence is sorted; that is, if i>j, then Ci.weight>=Cj.weight;

[0067] 6. Obtain the target junction temperature: target(second set temperature threshold); obtain the limit junction temperature: limit(first set temperature threshold), and target <limit;

[0068] II. Temperature Control Implementation

[0069] 1. Initialize the temperature control flag flag = 0, delt = 2 (adjust according to the actual situation, take 2 in this embodiment);

[0070] 2. Obtain the current junction temperature Tc, and record the historical temperatures as Th;

[0071] 3. Obtain the number of available cores Nc and the highest available frequency Fc in the current system configuration, calculate Weight = f(Nc, Fc), and find the value of Weight within the range of Nc and Fc. <ci>The position Index in it, that is, Cindex.weight == Weight; Index_h = Index;

[0072] 4. If Tc > limit

[0073] a) If the temperature has an upward trend and Th > limit, it is necessary to directly and sharply reduce the performance: Index += 8;

[0074] b) If Th > limit and it is working in a dangerous temperature environment, it is necessary to significantly reduce the performance: Index += 4;

[0075] c) Except for the situations in a) and b), when the temperature rises mildly and just breaks through the limit temperature, it is necessary to normally reduce the performance: Index += 2;

[0076] d) If Index > COUNT, index = COUNT;

[0077] 5. If Tc > target and Tc <= limit:

[0078] a) Configure the temperature control flag flag according to the temperature change trend:

[0079] i. If Tc > Th + delt and the temperature rises significantly, it is necessary to reduce the performance: Flag += 2;

[0080] ii. If Tc < Th - delt and the temperature drops significantly, it is necessary to improve the performance: Flag -= 2;

[0081] iii. If Tc is between Th and Th + delt and the temperature fluctuates upward within the normal range: Flag += 1

[0082] iv. If Tc is between Th and Th - delt and the temperature fluctuates downward within the normal range: Flag -= 1;

[0083] b) Adjust the temperature control direction according to the temperature control flag;

[0084] i. If flag >= 2, the temperature has risen significantly or has been fluctuating upward continuously, it is necessary to reduce the performance:

[0085] 1. Flag = 0;

[0086] 2. Index++;

[0087] 3. If Index > COUNT, index = COUNT;

[0088] ii. If flag <= -2, and the temperature drops significantly or fluctuates continuously downwards, performance can be improved:

[0089] 1. Flag = 0;

[0090] 2. Index = index - 1;

[0091] 3. If Index < 0, then Index = 0;

[0092] 6. If Tc <= target, the temperature is within the safe range, and performance can be rapidly improved.

[0093] a) If Index > 4, then Index = Index - 4;

[0094] b) If index > 0, then index = index - 1;

[0095] 7. If Index equals index_h, go to step 9;

[0096] 8. If Index is not equal to index_h;

[0097] a) Based on the index <ci>Retrieving Cindex items from a list<n,f,w> ;

[0098] b) Configure the specific number of cores n and frequency f in the system;

[0099] c) Proceed to step 9;

[0100] 9. Th = Tc; Proceed to step 2.

[0101] In this embodiment of the invention, the weights for temperature regulation can be calculated by the influence of the number and frequency of the working cores on power. Different combinations of the number of cores and frequencies are sorted according to the weights. At the same time, temperature change trends and intensity indicators can be generated based on the current junction temperature and historical junction temperature. Combined with a weight of 1, the junction temperature and system performance can be balanced and adjusted to ensure that the system can operate with relatively high performance at a safe junction temperature.

[0102] Example 2

[0103] Figure 2 This is a schematic diagram of a temperature control device for a system-on-a-chip according to Embodiment 2 of the present invention. This device can execute the temperature control methods for the system-on-a-chip involved in the above embodiments. (Refer to...) Figure 2 The device includes: a temperature control sequence generation module 210, a target temperature range determination module 220, a temperature change trend determination module 230, and a temperature control module 240.

[0104] Temperature control sequence generation module 210 is used to acquire attribute information of the on-chip system and generate a temperature control sequence based on the attribute information; wherein the temperature control sequence includes at least two sequence elements;

[0105] The target temperature range determination module 220 is used to obtain the current temperature of the on-chip system at the current moment, and determine the target temperature range of the on-chip system at the current time based on the current temperature.

[0106] Temperature change trend determination module 230 is used to acquire at least one reference time before the current time and a reference temperature corresponding to each reference time within the target temperature range, and determine the temperature change trend of the on-chip system based on the current temperature and each of the reference temperatures.

[0107] The temperature control module 240 is used to select a target sequence element corresponding to the temperature change trend in the temperature control sequence according to the target temperature range and the temperature change trend, and to control the temperature of the on-chip system according to the target sequence element.

[0108] In this embodiment, the solution obtains the attribute information of the on-chip system through a temperature control sequence generation module and generates a temperature control sequence based on the attribute information; obtains the current temperature of the on-chip system at the current moment through a target temperature range determination module and determines the target temperature range in which the on-chip system is currently located based on the current temperature; obtains at least one reference time before the current moment and a reference temperature corresponding to each reference time within the target temperature range through a temperature change trend determination module, and determines the temperature change trend of the on-chip system based on the current temperature and each of the reference temperatures; and selects a target sequence element corresponding to the change trend from the temperature control sequence based on the target temperature range and the temperature change trend through a temperature control module, and controls the temperature of the on-chip system based on the target sequence element, thereby achieving accurate temperature control of the on-chip system with high efficiency and without affecting the working performance of the on-chip system.

[0109] In an optional implementation of this embodiment, the attribute information of the on-chip system includes:

[0110] List of the number and frequency of working cores;

[0111] Correspondingly, the temperature control sequence generation module 210 is specifically used to determine the number of sequence elements in the temperature control sequence based on the maximum number of working cores and the minimum number of working cores;

[0112] The element content of the target sequence element is determined based on the number of working cores corresponding to the target sequence element and the working frequency;

[0113] The sequence elements are sorted according to their content to obtain the temperature control sequence.

[0114] In an optional implementation of this embodiment, the element content of the sequence element includes at least one of the following:

[0115] The number of working cores and the working frequency corresponding to the sequence element, and the target calculation results of the number of working cores and the working frequency;

[0116] Correspondingly, the temperature control sequence generation module 210 is also specifically used to sort each of the sequence elements according to the size relationship of the target calculation results to obtain the temperature control sequence.

[0117] In an optional implementation of this embodiment, the target temperature range determination module 220 is specifically used to determine that the target temperature range where the on-chip system is currently located is a high temperature region when the current temperature is greater than or equal to a first set temperature threshold.

[0118] When the current temperature is less than or equal to the second set temperature threshold, the target temperature range in which the on-chip system is currently located is determined to be a low temperature region;

[0119] When the current temperature is greater than the second set temperature threshold and less than the first set temperature threshold, the target temperature range in which the on-chip system is currently located is determined to be a safe temperature range.

[0120] In an optional implementation of this embodiment, the temperature change trend determination module 230 is specifically used to determine that the temperature change trend is an upward trend when the current temperature is greater than each of the reference temperatures and the reference temperatures gradually increase.

[0121] When the current temperature is lower than each of the reference temperatures, and each of the reference temperatures gradually decreases, the temperature change trend is determined to be a downward trend.

[0122] When the current temperature and the changes of each of the reference temperatures show a recurring or similar pattern, the temperature change trend is determined to be a stable trend.

[0123] In an optional implementation of this embodiment, the temperature control module 240 is specifically used to select a first target sequence element when the target temperature range is a high temperature region and the temperature change trend is an upward trend, so as to rapidly degrade the performance of the on-chip system.

[0124] When the target temperature range is a high-temperature region and the temperature change trend is a downward trend, the second target sequence element is selected;

[0125] When the target temperature range is a high-temperature region and the temperature change trend is a stable trend, a third target sequence element is selected; wherein, the index of the third target sequence element is less than the index of the second target sequence element; the index of the second target sequence element is less than the index of the first target sequence element;

[0126] When the target temperature range is in the low temperature region, a fourth target sequence element is selected to rapidly improve the performance of the on-chip system.

[0127] When the target temperature range is within a safe temperature range and the temperature change trend is upward, the fifth target sequence element is selected;

[0128] When the target temperature range is within a safe temperature range and the temperature change trend is downward, the sixth target sequence element is selected;

[0129] When the target temperature range is within a safe temperature range and the temperature change trend is stable, there is no need to select target sequence elements.

[0130] In an optional implementation of this embodiment, the temperature control module 240 is further specifically used to adjust the number of working cores of the on-chip system to the number of working cores corresponding to the target sequence element;

[0131] In addition, the operating frequency of the on-chip system is adjusted to the operating frequency corresponding to the target sequence element.

[0132] The temperature control device for a system-on-a-chip provided in this embodiment of the invention can execute the temperature control method for a system-on-a-chip provided in any embodiment of the invention, and has the corresponding functional modules and beneficial effects of executing the method.

[0133] Example 3

[0134] Figure 3 This is a schematic diagram of the structure of a temperature control device for a system-on-a-chip provided in Embodiment 3 of the present invention, as shown below. Figure 3 As shown, the temperature control device of the system-on-a-chip includes a processor 30, a memory 31, an input device 32, and an output device 33; the number of processors 30 in the temperature control device of the system-on-a-chip can be one or more. Figure 3 Taking a processor 30 as an example; the processor 30, memory 31, input device 32, and output device 33 in the temperature control device of the system-on-a-chip can be connected via a bus or other means. Figure 3 Taking the example of a connection between China and Israel via a bus.

[0135] The memory 31, as a computer-readable storage medium, can be used to store software programs, computer-executable programs, and modules, such as the program instructions / modules corresponding to the temperature control method of the system-on-a-chip in this embodiment of the invention (e.g., the temperature control sequence generation module 210, the target temperature range determination module 220, the temperature change trend determination module 230, and the temperature control module 240 in the temperature control device of the system-on-a-chip). The processor 30 executes various functional applications and data processing of the temperature control device of the system-on-a-chip by running the software programs, instructions, and modules stored in the memory 31, thereby realizing the temperature control method of the system-on-a-chip described above.

[0136] The memory 31 may primarily include a program storage area and a data storage area. The program storage area may store the operating system and at least one application program required for a given function; the data storage area may store data created based on terminal usage. Furthermore, the memory 31 may include high-speed random access memory and non-volatile memory, such as at least one disk storage device, flash memory, or other non-volatile solid-state storage device. In some instances, the memory 31 may further include memory remotely located relative to the processor 30, which can be connected via a network to the system-on-chip's temperature control device. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0137] Input device 32 can be used to receive input digital or character information, and to generate key signal inputs related to user settings and function control of the temperature control device of the on-chip system. Output device 33 may include display devices such as a display screen.

[0138] Example 4

[0139] Embodiment 4 of the present invention also provides a storage medium containing computer-executable instructions, which, when executed by a computer processor, are used to perform a temperature control method for a system-on-a-chip, the method comprising:

[0140] The system acquires the attribute information of the on-chip system and generates a temperature control sequence based on the attribute information; wherein the temperature control sequence includes at least two sequence elements.

[0141] Obtain the current temperature of the on-chip system at the current moment, and determine the target temperature range of the on-chip system based on the current temperature;

[0142] Within the target temperature range, at least one reference time prior to the current time is obtained, along with a reference temperature corresponding to each reference time, and the temperature change trend of the on-chip system is determined based on the current temperature and each of the reference temperatures.

[0143] Based on the target temperature range and the temperature change trend, a target sequence element corresponding to the change trend is selected in the temperature control sequence, and the temperature of the on-chip system is controlled according to the target sequence element.

[0144] Of course, the computer-executable instructions provided in the embodiments of the present invention are not limited to the method operations described above, but can also perform related operations in the temperature control method of the system-on-chip provided in any embodiment of the present invention.

[0145] Based on the above description of the implementation methods, those skilled in the art can clearly understand that the present invention can be implemented using software and necessary general-purpose hardware, and of course, it can also be implemented using hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as a computer floppy disk, read-only memory (ROM), random access memory (RAM), flash memory, hard disk, or optical disk, etc., including several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments of the present invention.

[0146] It is worth noting that in the embodiments of the temperature control device of the above-mentioned system-on-a-chip, the various units and modules included are only divided according to functional logic, but are not limited to the above division, as long as the corresponding functions can be realized; in addition, the specific names of each functional unit are only for easy differentiation and are not used to limit the scope of protection of the present invention.

[0147] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.< / ci> < / ci> < / ci> < / ci> < / ci> < / ci> < / ci> < / ci> < / ci> < / ci> < / ci> < / ci>

Claims

1. A method of temperature regulation for a system-on-chip, the method comprising: The method comprises the following steps: obtaining attribute information of a system on chip, and generating a temperature regulation sequence according to the attribute information; wherein the temperature regulation sequence comprises at least two sequence elements; obtaining a current temperature of the system on chip at a current time, and determining a target temperature range in which the system on chip is currently located according to the current temperature; obtaining at least one reference time before the current time and a reference temperature corresponding to each reference time in the target temperature range, and determining a temperature variation trend of the system on chip according to the current temperature and each reference temperature; selecting a target sequence element corresponding to the variation trend in the temperature regulation sequence according to the target temperature range and the temperature variation trend, and regulating the temperature of the system on chip according to the target sequence element; the attribute information of the system on chip comprises: a number of working cores and a frequency list; correspondingly, the generation of the temperature regulation sequence according to the attribute information comprises: determining the number of sequence elements in the temperature regulation sequence according to the maximum number of working cores and the minimum number of working cores; determining the element content of the target sequence element according to the number of working cores corresponding to the target sequence element and the working frequency; sorting each sequence element according to the element content of each sequence element to obtain the temperature regulation sequence.

2. The method of claim 1, wherein, The element content of the sequence element comprises at least one of the following: the number of working cores corresponding to the sequence element, the working frequency, and the target calculation result of the number of working cores and the working frequency; correspondingly, the sorting of each sequence element according to the element content of each sequence element to obtain the temperature regulation sequence comprises: sorting each sequence element according to the size relationship of the target calculation result to obtain the temperature regulation sequence.

3. The method of claim 1, wherein, The determination of the target temperature range in which the system on chip is currently located according to the current temperature comprises one of the following: when the current temperature is greater than or equal to a first set temperature threshold, determining that the target temperature range in which the system on chip is currently located is a high temperature region; when the current temperature is less than or equal to a second set temperature threshold, determining that the target temperature range in which the system on chip is currently located is a low temperature region; when the current temperature is greater than the second set temperature threshold and less than the first set temperature threshold, determining that the target temperature range in which the system on chip is currently located is a safe temperature region.

4. The method of claim 1, wherein, The determination of the temperature variation trend of the system on chip according to the current temperature and each reference temperature comprises one of the following: when the current temperature is greater than each reference temperature, and each reference temperature gradually increases, determining that the temperature variation trend is an upward trend; when the current temperature is less than each reference temperature, and each reference temperature gradually decreases, determining that the temperature variation trend is a downward trend; when the variation of the current temperature and each reference temperature presents reciprocating variation or is similar, determining that the temperature variation trend is a stable trend.

5. The method according to claim 3 or 4, characterized in that, The selecting the target sequence element corresponding to the change trend in the temperature regulation sequence according to the target temperature range and the temperature change trend comprises the following one: When the target temperature range is a high temperature region and the temperature change trend is an upward trend, a first target sequence element is selected to reduce the performance of the system on chip rapidly; When the target temperature range is a high temperature region and the temperature change trend is a downward trend, a second target sequence element is selected; When the target temperature range is a high temperature region and the temperature change trend is a stable trend, a third target sequence element is selected; wherein the serial number of the third target sequence element is less than that of the second target sequence element; and the serial number of the second target sequence element is less than that of the first target sequence element; When the target temperature range is a low temperature region, a fourth target sequence element is selected to improve the performance of the system on chip rapidly; When the target temperature range is a safe temperature region and the temperature change trend is an upward trend, a fifth target sequence element is selected; When the target temperature range is a safe temperature region and the temperature change trend is a downward trend, a sixth target sequence element is selected; When the target temperature range is a safe temperature region and the temperature change trend is a stable trend, no target sequence element is selected.

6. The method of claim 5, wherein, The temperature regulation of the system on chip according to the target sequence element comprises: adjusting the number of working cores of the system on chip to the number of working cores corresponding to the target sequence element; and adjusting the working frequency of the system on chip to the working frequency corresponding to the target sequence element. The temperature regulation sequence generation module is configured to acquire attribute information of a system on chip and generate a temperature regulation sequence according to the attribute information; wherein the temperature regulation sequence comprises at least two sequence elements; 7. A temperature regulation apparatus for a system-on-chip, the apparatus comprising: The target temperature range determination module is configured to acquire a current temperature of the system on chip at a current time and determine a target temperature range in which the system on chip is currently located according to the current temperature; The temperature change trend determination module is configured to acquire at least one reference time before the current time and a reference temperature corresponding to each reference time in the target temperature range, and determine a temperature change trend of the system on chip according to the current temperature and the reference temperatures; The temperature regulation module is configured to select a target sequence element corresponding to the change trend in the temperature regulation sequence according to the target temperature range and the temperature change trend, and regulate the temperature of the system on chip according to the target sequence element. The attribute information of the system on chip comprises: a list of the number and frequency of working cores; The temperature regulation sequence generation module is specifically configured to determine the number of sequence elements in the temperature regulation sequence according to the maximum number of working cores and the minimum number of working cores; determine the element content of the target sequence element according to the number of working cores and the working frequency corresponding to the target sequence element. ​ ​ The temperature regulation sequence is obtained by sorting the sequence elements according to the element content of each sequence element.

8. A temperature regulation apparatus for a system on a chip, comprising: The temperature regulation device of the system on chip comprises: one or more processors; a memory device for storing one or more programs, when the one or more programs are executed by the one or more processors, so that the one or more processors implement the temperature regulation method of the system on chip as claimed in any one of claims 1-6.

9. A storage medium containing computer-executable instructions, wherein: The computer executable instructions when executed by a computer processor are used to perform the temperature regulation method of the system on chip as claimed in any one of claims 1-6.

Images