A continuous feeding device and method for a silicon wafer inserter

Abstract

This invention relates to a continuous feeding device and method for a silicon wafer insertion machine. The method utilizes a continuous feeding device for the silicon wafer insertion machine, which includes a hoisting mechanism. Below the hoisting mechanism are a carrier and a feeding mechanism. The hoisting mechanism includes a crossbeam, with horizontal hoisting rails at both ends. A slidable jaw traverse sliding plate is mounted on each horizontal hoisting rail. A hoisting rack is horizontally mounted on one side of the jaw traverse sliding plate. A jaw traverse motor mounting frame is installed on the hoisting crossbeam, and a jaw traverse motor is mounted on the mounting frame. A jaw traverse gear is mounted on the working shaft of the jaw traverse motor, meshing with the hoisting rack. This invention achieves continuous feeding of the silicon wafers by effectively linking the hoisting mechanism, the silicon wafer carrier, and the feeding mechanism, enabling the wafers to detach from the silicon wafer carrier, transport the wafers in segments, and ensure uninterrupted operation of the silicon wafer insertion machine.

Description

Technical Field

[0001] This invention belongs to the field of equipment technology for producing solar photovoltaic products, and relates to a continuous feeding device and method for silicon wafer insertion machines. Background Technology

[0002] Silicon wafers used in solar photovoltaic products are generally obtained by wire cutting silicon rods. After debinding, the silicon wafers need to be fed into a wafer insertion machine for insertion. The common feeding method is to manually remove the silicon wafers from the debinding machine and place them into a wafer loading box. Then, the wafer loading box is placed into the wafer insertion machine. The pushing device of the insertion machine conveys the wafer loading box containing the silicon wafers to the loading position of the insertion machine. After the loading mechanism of the insertion machine removes all the silicon wafers from the wafer loading box, the empty wafer loading box is removed manually. Then, the wafer loading box containing the silicon wafers is manually placed back into the insertion machine, and this cycle continues.

[0003] Patent CN113394150A discloses a silicon wafer conveying and dispersing device, which includes a conveying component capable of conveying silicon wafers; clamping components are located on both sides of the conveying component, forming a receiving area between the clamping components and the conveying component to accommodate the silicon wafers, and the clamping components can clamp and convey the silicon wafers. This device's conveying and dispersing mechanism has only one silicon wafer conveying belt and two clamping belts on both sides; furthermore, during silicon wafer feeding, the silicon wafer carrier cannot detach from the silicon wafers until all silicon wafers in the carrier have been conveyed, at which point the carrier can leave the conveying and dispersing device. Since the secondary belt and the third belt of the silicon wafer conveying belt are both driven by a single drive shaft, the secondary belt and the third belt must move synchronously, making it impossible to simultaneously add new batches of silicon wafers during silicon wafer conveying and dispersing. This disrupts the continuity of production, results in insufficient automation of the entire production process, and affects production efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a continuous feeding device and method for a silicon wafer insertion machine, which can solve the above-mentioned problems, and has a high degree of automation in feeding, effectively improving the yield and production capacity of silicon wafers.

[0005] According to the technical solution provided by the present invention: a continuous feeding device for a silicon wafer insertion machine, the continuous feeding device for the silicon wafer insertion machine includes a hoisting mechanism, and a carrier and a feeding mechanism are arranged in sequence below the hoisting mechanism. The hoisting mechanism includes a crossbeam, and a hoisting horizontal slide rail is respectively provided at the top of both ends of the hoisting crossbeam. A chuck transverse sliding plate is slidably arranged on the hoisting horizontal slide rail. A hoisting rack is horizontally arranged on one side of the chuck transverse sliding plate. A chuck transverse motor mounting frame is installed on the hoisting crossbeam. A chuck transverse motor is arranged on the chuck transverse motor mounting frame. A chuck transverse gear is installed on the working shaft of the chuck transverse motor. The chuck transverse gear meshes with the hoisting rack. A chuck is vertically arranged on one side of the chuck transverse sliding plate. The chuck is located below the chuck transverse sliding plate. The lower part of the chuck is a horizontally extending clamping plate. A silicon wafer pressing mechanism is arranged on the hoisting crossbeam.

[0006] The support includes a support frame, with an upper clamping rod assembly at the top and a lower support rod assembly at the bottom. The support frame includes two opposing end plates connected by a frame rod. The upper clamping rod assembly includes an upper sliding plate that slides vertically in a groove at the top of the end plate. The left and right sides of the upper sliding plate are slidably connected to one side of a first connecting rod. The other end of the first connecting rod is fixedly connected to the outer end of a first crankshaft, and the inner end of the first crankshaft is connected to the end of the upper clamping rod. A sliding plate positioning mechanism is provided between the end plate and the upper sliding plate. The lower support rod assembly includes a lower sliding plate that slides vertically in a groove at the bottom of the end plate. The upper ends of second connecting rods are hinged to both sides of the lower sliding plate. The lower ends of the second connecting rods are fixedly connected to second rotating shafts. The middle part of the second rotating shaft slides in the end plate, and the lower support rod is connected between the two second rotating shafts.

[0007] The feeding mechanism includes a first conveying mechanism and a second conveying mechanism. The first conveying mechanism is provided with a front synchronous straightening mechanism and a silicon wafer pre-clamping mechanism on both sides from top to bottom. The second conveying mechanism is provided with a rear synchronous straightening mechanism on both sides.

[0008] As a further improvement of the present invention, the first conveying mechanism includes a first drive shaft and a first driven shaft arranged in parallel. A first driving pulley is sleeved on the first drive shaft, and a first driven pulley is sleeved on the first driven shaft. A first conveyor belt is installed between the first driving pulley and the first driven pulley. The first drive shaft is driven to rotate by a first drive motor. The front synchronous straightening mechanism includes a first upper sliding plate and a first upper sliding motor. A first upper rack is provided on the first upper sliding plate. A first upper gear is installed on the working shaft of the first upper sliding motor. The first upper gear meshes with the first upper rack. A front-end synchronous straightening mounting plate is provided, with a front-end synchronous straightening drive pulley and a front-end synchronous straightening driven pulley rotatably mounted at both ends of the front-end synchronous straightening drive pulley and the front-end synchronous straightening driven pulley respectively. A front-end synchronous straightening belt is sleeved between the front-end synchronous straightening drive pulley and the front-end synchronous straightening driven pulley. The front-end synchronous straightening drive pulley is driven by a front-end synchronous straightening motor. The silicon wafer pre-clamping mechanism includes a pre-clamping slide plate and a pre-clamping motor. A pre-clamping rack is provided on the pre-clamping slide plate, and a pre-clamping gear is installed on the working shaft of the pre-clamping motor. The pre-clamping gear meshes with the pre-clamping rack, and a pre-clamping pressure strip is provided on the inner side of the pre-clamping slide plate. The second conveying mechanism includes a second drive shaft and a second driven shaft arranged in parallel. A second drive pulley is fitted onto the second drive shaft, and a second driven pulley is fitted onto the second driven shaft. A second conveyor belt is installed between the second drive pulley and the second driven pulley. The second drive shaft is driven to rotate by a second drive motor. The rear-stage synchronous straightening mechanism includes a rear-stage synchronous straightening mounting plate. A rear-stage synchronous straightening drive pulley and a rear-stage synchronous straightening driven pulley are rotatably mounted at both ends of the mounting plate. A rear-stage synchronous straightening belt is fitted between the rear-stage synchronous straightening drive pulley and the rear-stage synchronous straightening driven pulley. The rear-stage synchronous straightening drive pulley is driven by a rear-stage synchronous straightening motor.

[0009] As a further improvement of the present invention, the silicon wafer clamping mechanism includes clamping mounting plates, several of which are evenly distributed on both sides of the lifting beam. A clamping cylinder is vertically mounted in the clamping mounting plate, with the piston end of the clamping cylinder pointing vertically downwards and connected to the clamping plate. An extension inlet and a retraction inlet are provided on the cylinder body of the clamping cylinder. The retraction inlet is connected to the atmosphere, and the extension inlet is connected to an air source via a pressure regulating valve. The clamping plate is connected to a guide mechanism, which includes a guide mounting plate located on one side of the clamping mounting plate. A guide rod is vertically slidably mounted in the guide mounting plate, and the bottom of the guide rod is connected to the clamping plate. The slide plate positioning mechanism includes a positioning hole and a ball-head plunger. The positioning hole is located on the upper slide plate, and the fixed end of the ball-head plunger is mounted on the end plate, with the positioning bead in the ball-head plunger facing the positioning hole. The upper and lower slide plates are vertically slidably mounted on the end plate via a slide rail. First rotating shafts are provided on the left and right sides of the upper slide plate, extending into first sliding grooves on the first connecting rod. The middle part of the first crankshaft is rotatably mounted in the end plate via a bearing seat. Sliding grooves are provided on both sides of the lower part of the end plate. The second rotating shaft slides in the lower slide groove; both the upper slide plate and the upper part of the lower slide plate are equipped with contact blocks.

[0010] As a further improvement of the present invention, a first drive shaft is rotatably mounted in a conveying frame, and a first drive motor is mounted in the conveying frame via a motor mount; a first drive pulley is sleeved on one end of the first drive shaft, and the other end is connected to the first drive motor via a pulley and a transmission belt; a first upper sliding motor is fixedly mounted on the conveying frame, and a front synchronous straightening mounting plate is mounted on the first upper sliding plate via a first connecting plate; the first connecting plate is vertically arranged, with its upper and lower ends respectively connecting the first upper sliding plate and the front synchronous straightening mounting plate; a pre-clamping slide plate is slidably connected to the conveying frame via a slide rail; a second drive pulley is sleeved on one end of the second drive shaft, and the other end is connected to the second drive motor via a pulley and a transmission belt.

[0011] As a further improvement of the present invention, the silicon wafer clamping mechanism includes a clamping mounting plate, several clamping mounting plates are evenly distributed on both sides of the hoisting beam, a clamping slide rod is vertically slidably installed in the clamping mounting plate, the lower end of the clamping slide rod is connected to a clamping plate, a clamping spring is sleeved on the clamping slide rod, and the two ends of the clamping spring abut against the clamping mounting plate and the clamping plate respectively.

[0012] As a further improvement of the present invention, the lower support rod and the upper clamping rod are wrapped with protective sleeves.

[0013] A continuous feeding method for a silicon wafer insertion machine, characterized in that it includes the continuous feeding device for the silicon wafer insertion machine as described above.

[0014] The method includes the following steps:

[0015] Step 1: The silicon wafer is placed on the two lower support rods of the carrier. The clamping plate of the hoisting mechanism is clamped at the bottom of the lower slide plate on both sides of the carrier. The hoisting mechanism moves upward, and the clamping plate contacts the contact block on the lower slide plate and pulls the lower slide plate upward. At the same time, the second connecting rod moves upward, driving the second rotating shaft to move inward in the lower slide groove, thereby causing the lower support rod to move inward and close together. The silicon wafer is still held on the two lower support rods of the carrier. The upper slide plate slides downward under the action of gravity. The first rotating shaft pushes the first connecting rod to rotate, causing the first crank shaft to rotate. The rotation of the first crank shaft causes the upper clamping rod to move inward. The two upper clamping rods move inward to clamp the two sides of the silicon wafer.

[0016] Step 2: The hoisting mechanism lifts the lower slide plate, raising the carrier and silicon wafer together and moving it onto the first conveyor belt. The bottom of the silicon wafer contacts the first conveyor belt. Then, the clamping plate of the hoisting mechanism moves to the top of the lower slide plate and moves down to contact the contact block on the lower slide plate, pressing the lower slide plate downward. The lower slide plate slides downward, and the second connecting rod drives the second rotating shaft to move outward in the lower slide groove, thereby moving the lower support rod outward. The lower support rod disengages from the bottom of the silicon wafer and moves to the outside of the silicon wafer. Then, the clamping plate moves again and clamps the bottom of the upper slide plate, lifting the upper slide plate upward. This causes the first connecting rod and the first crank shaft to rotate in opposite directions, causing the upper clamping rod to move outward and disengage from the outside of the silicon wafer, completing the separation of the silicon wafer from the carrier.

[0017] Step 3: The clamping plate continues to lift the upper slide plate upwards. The pre-clamping motor works to drive the pre-clamping gear to rotate. The rotation of the pre-clamping gear drives the pre-clamping rack to move. The movement of the pre-clamping rack drives the pre-clamping slide plate to move closer to the silicon wafer. The pre-clamping pressure strips on the inner sides of the two pre-clamping slide plates clamp the lower parts of both sides of the silicon wafer and stabilize the silicon wafer on the first conveyor belt, thus completing the pre-clamping of the silicon wafer on the feeding mechanism.

[0018] Step 4: The hoisting mechanism continues to lift the upper sliding plate and remove the carrier. All the silicon wafers on the carrier remain on the first conveyor belt. After the carrier is removed, the first upper sliding motor drives the first upper gear to rotate. The rotation of the first upper gear drives the first upper rack to move. The movement of the first upper rack drives the first upper sliding plate, the first connecting plate, the front synchronous straightening mounting plate, and the front synchronous straightening belt to move closer to the silicon wafer. The two front synchronous straightening belts clamp the upper sides of the silicon wafer. Then, the two pre-clamping pressure bars retract. The first drive motor and the front synchronous straightening motor operate, and the first conveyor belt... The first synchronous conveyor belt and the second synchronous straightening belt convey the silicon wafers together, transporting them to the second conveyor belt until the wafers are on the second conveyor belt. The second synchronous straightening belt clamps the two sides of the silicon wafers. The second drive motor drives the second conveyor belt to move backward, and the second synchronous straightening motor drives the second synchronous straightening belt to transport them backward. The second conveyor belt and the second synchronous straightening belt transport the wafers synchronously. When the outermost silicon wafer in a group of wafers moves to the end of the second conveyor belt, the feeding mechanism picks up the wafer and moves it to the wafer insertion mechanism of the wafer insertion machine, thus completing the wafer feeding.

[0019] As a further improvement of the present invention, after the step, another silicon wafer will approach the feeding mechanism, and then the feeding mechanism will continue to suck up the approaching silicon wafer. This cycle is repeated to feed the wafer inserter. When the first conveyor belt has transferred all the silicon wafers in a carrier to the second conveyor belt, the first conveyor belt is empty. At this time, the hoisting mechanism moves a new carrier containing silicon wafers to the first conveyor belt. The silicon wafers in the new carrier are left on the first conveyor belt. The first conveyor belt then transfers a new set of silicon wafers to the second conveyor belt. In this way, before the set of silicon wafers in the previous carrier is finished being picked up, a new set of silicon wafers has been transferred to connect with the previous set of silicon wafers on the second conveyor belt. This can realize continuous feeding of silicon wafers.

[0020] As a further improvement of the present invention, in step 1, the two upper clamping rods move inward to clamp the two sides of the silicon wafer, and the positioning beads in the ball-head plunger are embedded in the positioning hole to complete the positioning of the upper clamping rod clamping state.

[0021] As a further improvement of the present invention, in step 2, after the card plate moves again and locks onto the bottom of the upper slide plate, and the upper slide plate is pulled upward, the positioning ball in the ball head plunger disengages from the positioning hole.

[0022] 1. This invention achieves the purpose of continuously supplying materials to the silicon wafer insertion machine by effectively linking the hoisting mechanism, the silicon wafer carrier, and the feeding mechanism through the effective linkage of the three components: hoisting mechanism, silicon wafer carrier, and feeding mechanism.

[0023] 2. In this invention, the first and second conveyor belts are controlled independently. While the silicon wafers are being conveyed by the first conveyor belt to the second conveyor belt and picked up by the feeding mechanism (suction head) for insertion into the wafer inserter, the hoisting mechanism can simultaneously place a new silicon wafer carrier containing silicon wafers onto the first conveyor belt. The silicon wafer carrier then releases the silicon wafers onto the first conveyor belt, and the hoisting mechanism removes the empty silicon wafer carrier. The silicon wafers remaining on the first conveyor belt are conveyed to the second conveyor belt, allowing for continuous feeding of silicon wafers without interruption, greatly improving the automation level and production efficiency of the entire feeding process. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the continuous feeding device for the silicon wafer insertion machine of the present invention.

[0025] Figure 2 This is a schematic diagram of the hoisting mechanism in the continuous feeding device of the silicon wafer insertion machine of the present invention.

[0026] Figure 3 This is a schematic diagram of the structure of the carrier in the continuous feeding device of the silicon wafer insertion machine of the present invention.

[0027] Figure 4 This is a schematic diagram of the feeding mechanism in the continuous feeding device of the silicon wafer insertion machine of the present invention.

[0028] Figure 5 This is a schematic diagram of the feeding mechanism installed on the conveying frame in the continuous feeding device of the silicon wafer insertion machine of the present invention.

[0029] Figure 6 This is a schematic diagram of the second embodiment of the silicon wafer pressing mechanism on the hoisting mechanism in the continuous feeding device of the silicon wafer insertion machine of the present invention.

[0030] Figures 1-6The system includes: 1. Lifting mechanism; 1.1. Lifting horizontal slide rail; 1.2. Claw lateral sliding plate; 1.3. Lifting rack; 1.4. Claw lateral moving motor mounting bracket; 1.5. Claw lateral moving motor; 1.6. Claw lateral moving gear; 1.7. Claw; 1.8. Clamping plate; 1.9. Pressing mounting plate; 1.10. Pressing cylinder; 1.11. Floating joint; 1.12. Pressing plate; 1.13. Guide mounting plate; 1.14. Linear bearing; 1.15. Guide rod; 1.16. Pressing slide rod. 1.16, Compression Spring; 1.17, Bearing Unit; 2, End Plate; 2.1, Frame Rod; 2.2, Upper Slide Plate; 2.3, First Connecting Rod; 2.4, First Rotating Shaft; 2.5, First Crankshaft; 2.6, Upper Clamping Rod; 2.7, Positioning Hole; 2.8, Ball-Head Plunger; 2.9, Lower Slide Plate; 2.10, Second Connecting Rod; 2.11, Second Rotating Shaft; 2.12, Lower Support Rod; 2.13, Lower Slide Groove; 2.14, Bearing Seat; 2.15, Contact Block; 2.16, First Slide Groove; 2.41, Feeding Mechanism; 3. 3.1 Conveying frame; 3.2 First drive shaft; 3.3 First drive pulley; 3.4 First driven pulley; 3.5 First conveyor belt; 3.6 First upper sliding plate; 3.7 First upper sliding motor; 3.8 First upper rack; 3.9 First upper gear; 3.10 Front synchronous straightening mounting plate; 3.11 First connecting plate; 3.12 Front synchronous straightening drive pulley; 3.13 Front synchronous straightening belt; 3.14 Pre-clamping slide plate; 3.15 Components include: 3.16 pre-clamping motor, 3.17 pre-clamping rack, 3.18 second drive shaft, 3.19 second drive pulley, 3.20 second driven pulley, 3.21 second transmission belt, 3.22 second drive motor, 3.23 front synchronous straightening motor, 3.24 rear synchronous straightening mounting plate, 3.25 rear synchronous straightening drive pulley, 3.26 rear synchronous straightening driven pulley, 3.27 rear synchronous straightening belt, and 3.28 rear synchronous straightening motor. Detailed Implementation

[0031] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0032] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0033] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of the invention described herein. Furthermore, terms such as "comprising" and "having" mean that in addition to those already listed in "comprising" and "having," other unlisted contents may also be included; for example, a process, method, system, product, or device may include a series of steps or units, not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products, or devices.

[0034] Due to the angle of the drawing, some parts may not be drawn, but their positions and connections can be understood from the text descriptions.

[0035] like Figure 1 As shown, the present invention is a continuous feeding device for a silicon wafer insertion machine, including a hoisting mechanism 1, and a carrier 2 and a feeding mechanism 3 arranged sequentially below the hoisting mechanism 1.

[0036] like Figure 2 As shown, the hoisting mechanism 1 includes a hoisting beam 1.1. Hoisting horizontal slide rails 1.2 are respectively installed at the top of both ends of the hoisting beam 1.1. A slidable claw transverse sliding plate 1.3 is mounted on the hoisting horizontal slide rail 1.2. A hoisting rack 1.4 is horizontally installed on one side of the claw transverse sliding plate 1.3. A claw transverse motor mounting bracket 1.5 is installed on the hoisting beam 1.1. A claw transverse motor 1.6 is installed on the claw transverse motor mounting bracket 1.5. A claw transverse gear 1.7 is installed on the working shaft of the claw transverse motor 1.6. The claw transverse gear 1.7 meshes with the hoisting rack 1.4. A claw 1.8 is vertically installed on one side of the claw transverse sliding plate 1.3, located below the claw transverse sliding plate 1.8. The lower part of the claw 1.8 is a horizontally extending clamping plate 1.81. A silicon wafer clamping mechanism is installed on the hoisting beam 1.1.

[0037] The chuck lateral movement motor 1.6 drives the chuck 1.8 to move laterally through a gear and rack structure, thereby switching the horizontal position of the chuck plate 1.81.

[0038] In this embodiment, the silicon wafer clamping mechanism includes a clamping mounting plate 1.9. Several clamping mounting plates 1.9 are evenly distributed on both sides of the hoisting beam 1.1. A clamping cylinder 1.10 is vertically mounted in the clamping mounting plate 1.9. The piston end of the clamping cylinder 1.10 is vertically downward and connected to the clamping plate 1.12 through a floating joint 1.11.

[0039] The compression cylinder 1.10 has an extension inlet and a retraction inlet on its cylinder body. The retraction inlet is connected to the atmosphere, and the extension inlet is connected to the air source through a pressure regulating valve.

[0040] In the non-compression state, the air source enters the cylinder body of the compression cylinder 1.10 through the pressure regulating valve from the extended inlet. The piston rod of the compression cylinder 1.10 is in the extended state. When the compression plate 1.12 moves down to contact the silicon wafer, the silicon wafer pushes the piston rod of the compression cylinder 1.10 and keeps it in close contact with the compression plate 1.12.

[0041] To ensure smoother lifting and lowering of the clamping plate 1.12, the clamping plate 1.12 is connected to a guide mechanism, which includes a guide mounting plate 1.13. The guide mounting plate 1.13 is located on one side of the clamping mounting plate 1.9. A guide rod 1.15 is vertically slidably mounted in the guide mounting plate 1.13 through a linear bearing 1.14. The bottom of the guide rod 1.15 is connected to the clamping plate 1.12.

[0042] A pressure pad is laid at the bottom of the pressure plate 1.12. The pressure pad is made of a soft material such as sponge.

[0043] like Figure 6 As shown, in the second embodiment, the silicon wafer clamping mechanism includes a clamping mounting plate 1.9. Several clamping mounting plates 1.9 are evenly distributed on both sides of the hoisting beam 1.1. A clamping slide rod 1.16 is vertically slidably installed in the clamping mounting plate 1.9. The lower end of the clamping slide rod 1.16 is connected to a clamping plate 1.12. A clamping spring 1.17 is sleeved on the clamping slide rod 1.16. The two ends of the clamping spring 1.17 abut against the clamping mounting plate 1.9 and the clamping plate 1.12, respectively.

[0044] The upper end of the pressing slide bar 1.16 is provided with an anti-disengagement block to prevent the pressing slide bar 1.16 from sliding out of the pressing mounting plate 1.9.

[0045] In the uncompressed state, the compression spring 1.17 is in the relaxed state. When the compression plate 1.12 moves down to contact the silicon wafer, the compression spring 1.17 is compressed and pushes the compression plate 1.12, so that the compression plate 1.12 is in close contact with the silicon wafer.

[0046] The hoisting mechanism 1 is mounted on the moving mechanism. It is driven by the moving mechanism to move up and down, left and right, and forward and backward.

[0047] like Figure 4 As shown, the carrier 2 includes a carrier frame, with an upper clamping rod assembly on the upper part of the carrier frame and a lower support rod assembly on the lower part of the carrier frame.

[0048] The bottom of the carrier 2 is open, which allows the silicon wafer to fall from the carrier and be released onto the feeding mechanism 3. The carrier frame includes two oppositely arranged end plates 2.1, which are connected by a frame rod 2.2.

[0049] The upper clamping rod assembly includes an upper sliding plate 2.3, which slides vertically in the upper groove of the end plate 2.1. The upper sliding plate 2.3 is slidably connected to one side of the first connecting rod 2.4 on the left and right sides. The other end of the first connecting rod 2.4 is fixedly connected to the outer end of the first crankshaft 2.6. The inner end of the first crankshaft 2.6 is connected to the end of the upper clamping rod 2.7.

[0050] A slide positioning mechanism is provided between the end plate 2.1 and the upper slide plate 2.3. The slide positioning mechanism includes a positioning hole 2.8 and a ball plunger 2.9. The positioning hole 2.8 is opened on the upper slide plate 2.3, and the fixed end of the ball plunger 2.9 is installed on the end plate 2.1. The positioning ball in the ball plunger 2.9 faces the positioning hole 2.8.

[0051] The upper slide plate 2.3 moves downward, and the positioning ball in the ball plunger 2.9 is inserted into the positioning hole 2.8, completing the positioning of the upper clamping rod 2.7 in the clamping state. The upper slide plate 2.3 moves upward, and the positioning ball in the ball plunger 2.9 disengages from the positioning hole 2.8.

[0052] The lower support rod assembly includes a lower slide plate 2.10, which slides vertically in a groove at the bottom of the end plate 2.1. The upper ends of the second connecting rods 2.11 are hinged to both sides of the lower slide plate 2.10. The lower ends of the second connecting rods 2.11 are fixedly connected to the second rotating shafts 2.12. The middle part of the second rotating shafts 2.12 slides in the end plate 2.1. The lower support rod 2.13 is connected between the two second rotating shafts 2.12.

[0053] Specifically, the upper slide plate 2.3 and the lower slide plate 2.10 are vertically slidably mounted on the end plate 2.1 via slide rails. The upper slide plate 2.3 has first rotating shafts 2.5 on its left and right sides, which extend into the first sliding grooves 2.41 on the first connecting rod 2.4. The middle part of the first crankshaft 2.6 is rotatably mounted in the end plate 2.1 via a bearing seat 2.15. The lower part of the end plate 2.1 has lower sliding grooves 2.14 on both sides, in which the second rotating shaft 2.12 slides.

[0054] Both the upper sliding plate 2.3 and the lower sliding plate 2.10 are equipped with contact blocks 2.16 on their upper parts to facilitate movement when moving up and down.

[0055] The lower support rod 2.13 and the upper clamping rod 2.7 are wrapped with a protective sleeve. The sleeve is made of a soft material such as sponge, so that it will not damage the silicon wafer when it comes into contact with it.

[0056] like Figure 5 As shown, the feeding mechanism 3 is installed in the conveying frame 3.1. In this embodiment, two sets of feeding mechanisms 3 are installed in the conveying frame 3.1.

[0057] like Figure 4As shown, the feeding mechanism 3 includes a first conveying mechanism and a second conveying mechanism. The first conveying mechanism is provided with a front synchronous straightening mechanism and a silicon wafer pre-clamping mechanism on both sides from top to bottom, and the second conveying mechanism is provided with a rear synchronous straightening mechanism on both sides.

[0058] The first conveying mechanism includes a first drive shaft 3.2 and a first driven shaft arranged in parallel. A first drive pulley 3.3 is sleeved on the first drive shaft 3.2, and a first driven pulley 3.4 is sleeved on the first driven shaft. A first conveyor belt 3.6 is installed between the first drive pulley 3.3 and the first driven pulley 3.4. The first drive shaft 3.2 is driven to rotate by a first drive motor 3.5.

[0059] Specifically, the first drive shaft 3.2 is rotatably mounted in the conveying frame 3.1, and the first drive motor 3.5 is mounted in the conveying frame 3.1 via a motor mount. One end of the first drive shaft 3.2 is fitted with a first drive pulley 3.3, and the other end is connected to the first drive motor 3.5 via a pulley and a drive belt.

[0060] The front-end synchronous straightening mechanism includes a first upper sliding plate 3.7 and a first upper sliding motor 3.8. A first upper rack 3.9 is mounted on the first upper sliding plate 3.7. A first upper gear 3.10 is mounted on the working shaft of the first upper sliding motor 3.8, meshing with the first upper rack 3.9. A front-end synchronous straightening mounting plate 3.11 is mounted on the first upper sliding plate 3.7. A front-end synchronous straightening drive pulley 3.13 and a front-end synchronous straightening driven pulley are rotatably mounted at both ends of the mounting plate 3.11. A front-end synchronous straightening belt 3.14 is fitted between the front-end synchronous straightening drive pulley 3.13 and the front-end synchronous straightening driven pulley. The front-end synchronous straightening drive pulley 3.13 is driven by the front-end synchronous straightening motor 3.23.

[0061] Specifically, the first upper sliding motor 3.8 is fixedly mounted on the conveyor frame 3.1; the first upper rack 3.9 is perpendicular to the first conveyor belt 3.6; the first upper sliding plate 3.7 is connected to the front synchronous straightening mounting plate 3.11 via the first connecting plate 3.12; the first connecting plate 3.12 is vertically arranged, with its upper and lower ends connecting the first upper sliding plate 3.7 and the front synchronous straightening mounting plate 3.11 respectively; the front synchronous straightening mounting plate 3.11 is horizontally arranged. The front synchronous straightening belt 3.14 is parallel to the first conveyor belt 3.6.

[0062] The silicon wafer pre-clamping mechanism includes a pre-clamping slide plate 3.15 and a pre-clamping motor 3.16. A pre-clamping rack 3.17 is provided on the pre-clamping slide plate 3.15, and a pre-clamping gear is installed on the working shaft of the pre-clamping motor 3.16. The pre-clamping gear meshes with the pre-clamping rack 3.17, and a pre-clamping pressure strip is provided on the inner side of the pre-clamping slide plate 3.15.

[0063] Specifically, the pre-clamping slide plate 3.15 is slidably connected to the conveyor frame 3.1 via a slide rail, and the housing of the pre-clamping motor 3.16 is fixedly installed on the conveyor frame 3.1. The pre-clamping pressure bar and the front synchronous straightening belt 3.14 are both parallel to the first conveyor belt 3.6.

[0064] To avoid damaging the silicon wafer, the pre-clamping strip is a sponge strip.

[0065] The second conveying mechanism includes a second drive shaft 3.18 and a second driven shaft arranged in parallel. A second drive pulley 3.19 is sleeved on the second drive shaft 3.18, and a second driven pulley 3.20 is sleeved on the second driven shaft. A second conveyor belt 3.21 is installed between the second drive pulley 3.19 and the second driven pulley 3.20. The second drive shaft 3.18 is driven to rotate by a second drive motor 3.22.

[0066] Specifically, the second drive shaft 3.18 is rotatably mounted in the conveying frame 3.1, and the first drive motor 3.5 is mounted in the conveying frame 3.1 via a motor mount. One end of the second drive shaft 3.18 is fitted with a second drive pulley 3.19, and the other end is connected to the second drive motor 3.22 via a pulley and a drive belt.

[0067] The rear-stage synchronous straightening mechanism includes a rear-stage synchronous straightening mounting plate 3.24. A rear-stage synchronous straightening drive pulley 3.25 and a rear-stage synchronous straightening driven pulley 3.26 are rotatably mounted at both ends of the mounting plate 3.24. A rear-stage synchronous straightening belt 3.27 is fitted between the drive pulley 3.25 and the driven pulley 3.26. The rear-stage synchronous straightening drive pulley 3.25 is driven by a rear-stage synchronous straightening motor 3.28.

[0068] Specifically, the rear synchronous straightening motor 3.28 is fixedly mounted on the conveyor frame 3.1, and the rear synchronous straightening mounting plate 3.24 is horizontally set. The rear synchronous straightening belt 3.27 is parallel to the second conveyor belt 3.6.

[0069] In this embodiment, to improve the stability of the conveying process, there are two sets of the first driving pulley 3.3, the first driven pulley 3.4, and the first conveyor belt 3.6, as well as two sets of the second driving pulley 3.19, the second driven pulley 3.20, and the second conveyor belt 3.21. The first conveyor belt 3.6 and the second conveyor belt 3.21 are at the same height, and a small portion of the end of the first conveyor belt 3.6 that connects to the second conveyor belt 3.21 extends into the space between the two second conveyor belts 3.21. This facilitates the transfer of silicon wafers 3.29 from the first conveyor belt 3.6 to the second conveyor belt 3.21. The front synchronous straightening belt 3.14 and the rear synchronous straightening belt 3.27 are on the same plane, with the rear synchronous straightening belt 3.27 being slightly higher. The end of the front synchronous straightening belt 3.14 intersects with the beginnings of the two rear synchronous straightening belts 3.27. This facilitates the transition of silicon wafer 3.29 on the front-end synchronous straightening belt 3.14 to the rear-end synchronous straightening belt 3.27.

[0070] To avoid damaging the silicon wafer, protective pads are wrapped around the outer periphery of the front synchronous straightening belt 3.14 and the rear synchronous straightening belt 3.27. The protective pads are made of soft materials such as sponge.

[0071] This invention also provides a continuous feeding method for a silicon wafer insertion machine, the specific feeding method comprising the following steps:

[0072] After the silicon wafers in the carrier 2 have undergone the previous process (de-adhesive removal), they are placed on the two lower support rods 2.13 of the carrier 2. The clamping plate 1.81 of the hoisting mechanism 1 is engaged with the bottom of the lower sliding plates 2.10 on both sides of the carrier 2. The hoisting mechanism 1 is driven upward by the moving mechanism, and the clamping plate 1.81 contacts the contact block 2.16 on the lower sliding plate 2.10, lifting the lower sliding plate 2.10 upward. At the same time, the second connecting rod 2.11 moves upward, driving the second rotating shaft 2.12 to move inward in the lower sliding groove 2.14, thereby... The lower support rod 2.13 moves inward and closes, while the silicon wafer remains on the two lower support rods 2.13 of the carrier 2. The upper slide plate 2.3 slides downward under the action of gravity. The first rotating shaft 2.5 pushes the first connecting rod 2.4 to rotate, causing the first crankshaft 2.6 to rotate. The rotation of the first crankshaft 2.6 causes the upper clamping rod 2.7 to move inward. The two upper clamping rods 2.7 move inward to clamp the two sides of the silicon wafer. The positioning ball in the ball plunger 2.9 is embedded in the positioning hole 2.8, completing the positioning of the upper clamping rod 2.7 in the clamping state. The lifting mechanism 1 lifts the lower slide plate 2.10, raising the carrier 2 along with the silicon wafer and moving it onto the first conveyor belt 3.6. The bottom of the silicon wafer contacts the first conveyor belt 3.6. Then, the clamping plate 1.81 of the lifting mechanism 1 moves above the lower slide plate 2.10 and moves down to contact the upper contact block 2.16 of the lower slide plate 2.10, pressing the lower slide plate 2.10 downward. The lower slide plate 2.10 slides downward, and the second connecting rod 2.11 drives the second rotating shaft 2.12 to move outward within the sliding groove 2.14, thereby... The lower support rod 2.13 moves outward, disengaging from the bottom of the silicon wafer and moving to the outside of the wafer. Then, the clamping plate 1.81 moves and engages with the bottom of the upper sliding plate 2.3, pulling the upper sliding plate 2.3 upward. The positioning ball in the ball plunger 2.9 disengages from the positioning hole 2.8, causing the first connecting rod 2.4 and the first crankshaft 2.6 to rotate in opposite directions. This causes the upper clamping rod 2.7 to move outward, disengaging from the outside of the silicon wafer, thus releasing the restriction on the silicon wafer. At this point, the bottom and sides of the silicon wafer are unrestricted, and simultaneously, the lifting mechanism 1... The horizontal pressure plate 26 presses down on the top of the silicon wafer, which remains stable on the first conveyor belt 3.6. Then, the clamping plate 1.81 continues to lift the upper sliding plate 2.3 upwards to the preset height. At this time, the pre-clamping motor 3.16 operates, driving the pre-clamping gear to rotate. The rotation of the pre-clamping gear drives the pre-clamping rack 3.17 to move. The movement of the pre-clamping rack 3.17 drives the pre-clamping sliding plate 3.15 to move closer to the silicon wafer. The pre-clamping pressure bars on the inner sides of the two pre-clamping sliding plates 3.15 clamp the lower parts of both sides of the silicon wafer, thus securing the silicon wafer. Once the device is firmly secured on the first conveyor belt 3.6, the hoisting mechanism 1 continues to lift the upper slide plate 2.3 and remove the carrier 2. All the silicon wafers on the carrier 2 remain on the first conveyor belt 3.6. After the carrier 2 is removed, the first upper sliding motor 3.8 operates, driving the first upper gear 3.10 to rotate. The rotation of the first upper gear 3.10 drives the first upper rack 3.9 to move. The movement of the first upper rack 3.9 drives the first upper sliding plate 3.7, the first connecting plate 3.12, and the front synchronous straightening mounting plate 3.11 and the front synchronous straightening belt 3.14 approach the silicon wafer, clamping the upper sides of the silicon wafer at both points. Then, the two pre-clamping pressure bars retract. At this time, the first drive motor 3.5 and the front synchronous straightening motor 3.23 operate, and the first conveyor belt 3.6 and the front synchronous straightening belt 3.14 transport the silicon wafer synchronously. The front synchronous straightening belt 3.14 and the first conveyor belt 3.6 together transport the silicon wafer to the second conveyor belt 3.21 until the silicon wafer is transported to the second conveyor belt 3.21. The upper section of the synchronous straightening belt 3.27 clamps the two sides of the silicon wafer. The second drive motor 3.22 drives the second conveyor belt 3.21 to move backward, and the lower section of the synchronous straightening motor 3.28 drives the lower section of the synchronous straightening belt 3.27 to convey backward. The second conveyor belt 3.21 and the lower section of the synchronous straightening belt 3.27 convey synchronously. When the outermost silicon wafer in a group moves to the end of the second conveyor belt 3.21, the feeding mechanism picks up the silicon wafer and moves it to the wafer insertion mechanism of the wafer insertion machine. At this time, the next silicon wafer will approach. The feeding mechanism continuously picks up approaching silicon wafers, thus feeding the wafer insertion machine in a cyclical manner. When the first conveyor belt 3.6 has transferred all the silicon wafers from one carrier 2 to the second conveyor belt 3.21, the first conveyor belt 3.6 becomes empty. At this point, the lifting mechanism 1 moves a new carrier 2 containing silicon wafers to the first conveyor belt 3.6. The silicon wafers in the new carrier 2 remain on the first conveyor belt 3.6, which then transfers a new set of silicon wafers to the second conveyor belt 3.21. Thus, on the second conveyor belt 3.21, before the previous set of silicon wafers from the carrier 2 has finished being removed, a new set of silicon wafers has already been transferred to connect with the previous set. This achieves continuous silicon wafer feeding with almost no downtime, improving feeding efficiency and the wafer insertion machine's production efficiency. The entire feeding process is highly automated. The lifting mechanism 1 works in conjunction with the carrier 2 and the feeding mechanism 3 to achieve continuous silicon wafer feeding and replacement.

[0073] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the present invention, and the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A continuous feeding device for a silicon wafer insertion machine, the continuous feeding device for the silicon wafer insertion machine comprising a hoisting mechanism (1), a carrier (2) and a feeding mechanism (3) being arranged sequentially below the hoisting mechanism (1), characterized in that, The hoisting mechanism (1) includes a hoisting beam (1.1), with hoisting horizontal slide rails (1.2) respectively installed at the top of both ends of the hoisting beam (1.1). A claw transverse sliding plate (1.3) is slidably installed on the hoisting horizontal slide rail (1.2). A hoisting rack (1.4) is horizontally installed on one side of the claw transverse sliding plate (1.3). A claw transverse motor mounting bracket (1.5) is installed on the hoisting beam (1.1), and a claw is installed on the claw transverse motor mounting bracket (1.5). A transverse motor (1.6) is used. A chuck transverse gear (1.7) is installed on the working shaft of the chuck transverse motor (1.6). The chuck transverse gear (1.7) meshes with the hoisting rack (1.4). A chuck (1.8) is vertically arranged on one side of the chuck transverse sliding plate (1.3). The chuck (1.8) is located below the chuck transverse sliding plate (1.3). The lower part of the chuck (1.8) is a horizontally extended chuck plate (1.81). A silicon wafer clamping mechanism is set on the hoisting beam (1.1). The carrier (2) includes a carrier frame, with an upper clamping rod assembly on the upper part of the carrier frame and a lower support rod assembly on the lower part of the carrier frame; the carrier frame includes two oppositely arranged end plates (2.1), which are connected by a frame rod (2.2); the upper clamping rod assembly includes an upper sliding plate (2.3), which slides vertically in the upper groove of the end plate (2.1), and the left and right sides of the upper sliding plate (2.3) are slidably connected to one side of the first connecting rod (2.4), and the other end of the first connecting rod (2.4) is fixedly connected to the outer end of the first crankshaft (2.6). 6) The inner end is connected to the end of the upper clamping rod (2.7); a sliding plate positioning mechanism is provided between the end plate (2.1) and the upper sliding plate (2.3); the lower support rod assembly includes a lower sliding plate (2.10); the lower sliding plate (2.10) slides vertically in the lower groove of the end plate (2.1); the upper ends of the second connecting rods (2.11) are hinged on both sides of the lower sliding plate (2.10); the lower end of the second connecting rod (2.11) is fixedly connected to the second rotating shaft (2.12); the middle part of the second rotating shaft (2.12) slides in the end plate (2.1); the lower support rod (2.13) is connected between the two second rotating shafts (2.12); The feeding mechanism (3) includes a first conveying mechanism and a second conveying mechanism. The first conveying mechanism is provided with a front synchronous straightening mechanism and a silicon wafer pre-clamping mechanism on both sides from top to bottom. The second conveying mechanism is provided with a rear synchronous straightening mechanism on both sides.

2. The continuous feeding device for the silicon wafer insertion machine as described in claim 1, characterized in that, The first conveying mechanism includes a first drive shaft (3.2) and a first driven shaft arranged in parallel. A first driving pulley (3.3) is sleeved on the first drive shaft (3.2), and a first driven pulley (3.4) is sleeved on the first driven shaft. A first conveyor belt (3.6) is installed between the first driving pulley (3.3) and the first driven pulley (3.4). The first drive shaft (3.2) is driven to rotate by a first drive motor (3.5). The front-end synchronous straightening mechanism includes a first upper sliding plate (3.7) and a first upper sliding motor (3.8). A first upper rack (3.9) is provided on the first upper sliding plate (3.7). A first upper gear (3.10) is installed on the working shaft of the first upper sliding motor (3.8). The first upper gear (3.10) meshes with the first upper rack (3.9). The first upper sliding plate (3.7) is provided with... A front-end synchronous straightening mounting plate (3.11) is provided, with a front-end synchronous straightening drive pulley (3.13) and a front-end synchronous straightening driven pulley respectively rotatably mounted at both ends of the front-end synchronous straightening drive pulley (3.13) and the front-end synchronous straightening driven pulley respectively. A front-end synchronous straightening belt (3.14) is sleeved between the front-end synchronous straightening drive pulley (3.13) and the front-end synchronous straightening driven pulley. The front-end synchronous straightening drive pulley (3.13) is driven by a front-end synchronous straightening motor (3.23). The silicon wafer pre-clamping mechanism includes a pre-clamping slide plate (3.15) and a pre-clamping motor (3.16). A pre-clamping rack (3.17) is provided on the pre-clamping slide plate (3.15). A pre-clamping gear is installed on the working shaft of the pre-clamping motor (3.16). The pre-clamping gear meshes with the pre-clamping rack (3.17). A pre-clamping pressure strip is provided on the inner side of the pre-clamping slide plate (3.15). The second conveying mechanism includes a second drive shaft (3.18) and a second driven shaft arranged in parallel. A second drive pulley (3.19) is fitted onto the second drive shaft (3.18), and a second driven pulley (3.20) is fitted onto the second driven shaft. A second conveyor belt (3.21) is installed between the second drive pulley (3.19) and the second driven pulley (3.20). The second drive shaft (3.18) is driven to rotate by a second drive motor (3.22). The rear synchronous straightening mechanism includes a rear synchronous straightening mounting plate (3.24), with a rear synchronous straightening drive pulley (3.25) and a rear synchronous straightening driven pulley (3.26) rotatably mounted at both ends of the rear synchronous straightening mounting plate (3.24). A rear synchronous straightening belt (3.27) is fitted between the rear synchronous straightening drive pulley (3.25) and the rear synchronous straightening driven pulley (3.26). The rear synchronous straightening drive pulley (3.25) is driven by a rear synchronous straightening motor (3.28).

3. The continuous feeding device for the silicon wafer insertion machine as described in claim 1, characterized in that, The silicon wafer clamping mechanism includes clamping mounting plates (1.9), several clamping mounting plates (1.9) are evenly distributed on both sides of the hoisting beam (1.1), and clamping cylinders (1.10) are vertically mounted in the clamping mounting plates (1.9). The piston end of the clamping cylinder (1.10) is vertically downward and connected to the clamping plate (1.12). The clamping cylinder (1.10) has an extension inlet and a retraction inlet on its cylinder body. The retraction inlet is connected to the atmosphere, and the extension inlet is connected to the air source through a pressure regulating valve. The clamping plate (1.12) is connected to the guide mechanism, which includes a guide mounting plate (1.13). The guide mounting plate (1.13) is located on one side of the clamping mounting plate (1.9), and a guide rod (1.15) is vertically slidably mounted in the guide mounting plate (1.13). The bottom of the guide rod (1.15) is connected to the clamping plate (1.12). 12); The sliding plate positioning mechanism includes a positioning hole (2.8) and a ball plunger (2.9). The positioning hole (2.8) is opened on the upper sliding plate (2.3). The fixed end of the ball plunger (2.9) is installed on the end plate (2.1). The positioning ball in the ball plunger (2.9) faces the positioning hole (2.8). The upper sliding plate (2.3) and the lower sliding plate (2.10) are vertically slidably installed on the end plate (2.1) via a slide rail. The upper sliding plate (2.3) has a first rotating shaft (2.5) on its left and right sides. The first rotating shaft (2.5) extends into the first sliding groove (2.41) on the first connecting rod (2.4). The middle part of the first crankshaft (2.6) is rotatably installed in the end plate (2.1) via a bearing seat (2.15). The lower part of the end plate (2.1) has a lower sliding groove (2.14) on both sides. The second rotating shaft (2.12) slides in the lower sliding groove (2.14); the upper sliding plate (2.3) and the lower sliding plate (2.10) are both provided with contact blocks (2.16).

4. The continuous feeding device for the silicon wafer insertion machine as described in claim 2, characterized in that, The first drive shaft (3.2) is rotatably mounted in the conveying frame (3.1), and the first drive motor (3.5) is mounted in the conveying frame (3.1) through a motor mount; one end of the first drive shaft (3.2) is fitted with a first drive pulley (3.3), and the other end is connected to the first drive motor (3.5) through a pulley and a transmission belt; the first upper sliding motor (3.8) is fixedly mounted on the conveying frame (3.1), and the first upper sliding plate (3.7) is mounted on the front synchronous straightening mounting plate (3.11) through the first connecting plate (3.12). The first connecting plate (3.12) is vertically set, and the upper and lower ends are respectively connected to the first upper sliding plate (3.7) and the front synchronous straightening mounting plate (3.11); the pre-clamping slide plate (3.15) is slidably connected to the conveying frame (3.1) through a slide rail, and one end of the second drive shaft (3.18) is fitted with a second drive pulley (3.19), and the other end is connected to the second drive motor (3.22) through a pulley and a transmission belt.

5. The continuous feeding device for the silicon wafer insertion machine as described in claim 1, characterized in that, The silicon wafer clamping mechanism includes a clamping mounting plate (1.9), several clamping mounting plates (1.9) are evenly distributed on both sides of the hoisting beam (1.1), a clamping slide rod (1.16) is vertically slidably installed in the clamping mounting plate (1.9), the lower end of the clamping slide rod (1.16) is connected to the clamping plate (1.12), and a clamping spring (1.17) is sleeved on the clamping slide rod (1.16), with the two ends of the clamping spring (1.17) respectively abutting against the clamping mounting plate (1.9) and the clamping plate (1.12).

6. The continuous feeding device for the silicon wafer insertion machine as described in claim 1, characterized in that, The lower support rod (2.13) and the upper clamp rod (2.7) are wrapped with protective sleeves.

7. A continuous feeding method for a silicon wafer insertion machine, characterized in that, Includes the continuous feeding device for the silicon wafer insertion machine as described in any one of claims 1-6. The method includes the following steps: Step 1: The silicon wafer is placed on the two lower support rods (2.13) of the carrier (2). The clamping plate (1.81) of the hoisting mechanism (1) is clamped at the bottom of the lower sliding plates (2.10) on both sides of the carrier (2). The hoisting mechanism (1) moves upward, and the clamping plate (1.81) contacts the contact block (2.16) on the lower sliding plate (2.10) to lift the lower sliding plate (2.10). At the same time, the second connecting rod (2.11) moves upward, driving the second rotating shaft (2.12) to slide down the groove (2.14). The silicon wafer moves inward, causing the lower support rod (2.13) to move inward and close together. The silicon wafer remains on the two lower support rods (2.13) of the carrier (2). The upper slide plate (2.3) slides downward under the action of gravity. The first rotating shaft (2.5) pushes the first connecting rod (2.4) to rotate, causing the first crankshaft (2.6) to rotate. The rotation of the first crankshaft (2.6) causes the upper clamping rod (2.7) to move inward. The two upper clamping rods (2.7) move inward to clamp the two sides of the silicon wafer. Step 2: The hoisting mechanism (1) lifts the lower slide plate (2.10) to lift the carrier (2) together with the silicon wafer and move it onto the first conveyor belt (3.6). The bottom of the silicon wafer contacts the first conveyor belt (3.6). Then, the clamping plate (1.81) of the hoisting mechanism (1) moves to the upper part of the lower slide plate (2.10) and moves down to contact the contact block (2.16) on the lower slide plate (2.10), pressing the lower slide plate (2.10) down. The lower slide plate (2.10) slides down, and the second connecting rod (2.11)... The second rotating shaft (2.12) is driven to move outward in the sliding groove (2.14), thereby causing the lower support rod (2.13) to move outward. The lower support rod (2.13) moves away from the bottom of the silicon wafer and moves to the outside of the silicon wafer. Then the clamping plate (1.81) moves and clamps the bottom of the upper sliding plate (2.3) and pulls the upper sliding plate (2.3) upward, causing the first connecting rod (2.4) and the first crank shaft (2.6) to rotate in opposite directions, causing the upper clamping rod (2.7) to move outward and detach from the outside of the silicon wafer, thus completing the separation of the silicon wafer from the carrier (2). Step 3, the clamping plate (1.81) continues to lift the upper slide plate (2.3), the pre-clamping motor (3.16) works to drive the pre-clamping gear to rotate, the pre-clamping gear rotates to drive the pre-clamping rack (3.17) to move, the pre-clamping rack (3.17) moves to drive the pre-clamping slide plate (3.15) to move closer to the silicon wafer, the pre-clamping pressure strips on the inner side of the two pre-clamping slide plates (3.15) clamp the lower part of both sides of the silicon wafer and stabilize the silicon wafer on the first conveyor belt (3.6), thus completing the pre-clamping of the silicon wafer on the feeding mechanism (3); Step 4: The hoisting mechanism (1) continues to lift the upper slide plate (2.3) and remove the carrier (2). All the silicon wafers on the carrier (2) remain on the first conveyor belt (3.6). After the carrier (2) is removed, the first upper sliding motor (3.8) drives the first upper gear (3.10) to rotate. The rotation of the first upper gear (3.10) drives the first upper rack (3.9) to move. The movement of the first upper rack (3.9) drives the first upper sliding plate (3.7), the first connecting plate (3.12), the front synchronous straightening mounting plate (3.11), and the front synchronous straightening belt (3.14) to move closer to the silicon wafer. The two front synchronous straightening belts (3.14) clamp the upper sides of the silicon wafer. Then the two pre-clamping pressure bars retract. The first drive motor (3.5) and the front synchronous straightening motor (3.23) work. The feed belt (3.6) and the front synchronous straightening belt (3.14) convey the silicon wafers synchronously. The front synchronous straightening belt (3.14) and the first conveyor belt (3.6) together convey the silicon wafers to the second conveyor belt (3.21) until the silicon wafers are conveyed onto the second conveyor belt (3.21). The rear synchronous straightening belt (3.27) clamps the two sides of the silicon wafers. The second drive motor (3.22) drives the second conveyor belt (3.21) to move backward. The rear synchronous straightening motor (3.28) drives the rear synchronous straightening belt (3.27) to convey backward. The second conveyor belt (3.21) and the rear synchronous straightening belt (3.27) convey the silicon wafers synchronously. When the outermost silicon wafer in a group of silicon wafers moves to the end of the second conveyor belt (3.21), the feeding mechanism picks up the silicon wafer and moves it to the insertion mechanism of the insertion machine, thus completing the feeding of the silicon wafers.

8. The continuous feeding method for a silicon wafer insertion machine as described in claim 7, characterized in that, After step 4, the next silicon wafer will approach the feeding mechanism, and the feeding mechanism will continue to suck up the approaching silicon wafer. This cycle is repeated to feed the wafer inserter. When the first conveyor belt (3.6) transfers all the silicon wafers in a carrier (2) to the second conveyor belt (3.21), the first conveyor belt (3.6) will be empty. At this time, the hoisting mechanism (1) will move a new carrier (2) with silicon wafers to the first conveyor belt (3.6). The silicon wafers in the new carrier (2) will remain on the first conveyor belt (3.6). The first conveyor belt (3.6) will then transfer a new set of silicon wafers to the second conveyor belt (3.21). In this way, on the second conveyor belt (3.21), before the set of silicon wafers in the previous carrier (2) is finished being picked up, a new set of silicon wafers has been transferred over to connect with the previous set of silicon wafers. This can realize continuous feeding of silicon wafers.

9. The continuous feeding method for a silicon wafer insertion machine as described in claim 7, characterized in that, In step 1, the two upper clamping rods (2.7) move inward to clamp the two sides of the silicon wafer. The positioning bead in the ball head plunger (2.9) is embedded in the positioning hole (2.8), completing the positioning of the upper clamping rod (2.7) clamping state.

10. The continuous feeding method for a silicon wafer insertion machine as described in claim 7, characterized in that, In step 2, the card plate (1.81) moves again and locks onto the bottom of the upper slide plate (2.3). After the upper slide plate (2.3) is pulled up, the positioning ball in the ball head plunger (2.9) disengages from the positioning hole (2.8).

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