An LED dynamic presentation smart card and method of use thereof

Abstract

This invention discloses a smart card with dynamic LED display, comprising a substrate, a control circuit board, and a top plate. The substrate and top plate are connected by a snap-fit ​​structure and a sealing structure. Both the substrate and top plate are equipped with a prompting component and an anti-slip structure. The control circuit board includes a contactless antenna module, a voltage regulator module, multiple driver modules, a first chip module, a second chip module, and a protection circuit. This invention also discloses a method of use. The invention improves ease of use and safety by providing fluorescent and temperature change prompts through the prompting component; it prevents mutual interference by using a contactless antenna module composed of a wireless power supply coil and a contactless communication coil, ensuring stable power supply and transaction data, and guaranteeing the stability of the subsequent dynamic display and data interaction of the smart card; and it provides protection against circuit breakers.

Description

Technical Field

[0001] This invention relates to the technical field of smart transaction cards, specifically to a smart card with dynamic LED display and its usage method. Background Technology

[0002] Due to the rapid development of electronic devices, smart card consumption has spread to various fields, including phone cards, bank cards, and medical insurance cards. Because smart card consumption brings convenience to both users, it has become a deeply popular consumption method.

[0003] Existing contactless smart card manufacturing processes employ an integrated structure design where the integrated circuit chip and antenna circuitry are embedded and encapsulated within a plastic substrate. This design prevents disassembly for internal component replacement, maintenance, and repair, requiring card remanufacturing, which is time-consuming and disrupts normal user experience. Furthermore, the disassembly and sorting process for recycling is cumbersome, resulting in low recycling rates. Current smart cards lack a notification function, making them difficult to locate quickly in low-light or dark environments, reducing ease of finding them, increasing the risk of loss, and impacting user experience. Additionally, existing smart cards contain internal electronic modules that generate heat during use. Without a temperature indicator, malfunctions in these modules or prolonged power-on use can cause overheating, requiring users to physically touch the card to detect abnormal temperatures. Excessive heat can lead to… Damage to smart cards can easily lead to accidents and pose certain security risks. Existing smart cards have poor heat dissipation; heat buildup can easily damage internal electronic modules, and prolonged heat buildup may affect user comfort and the overall user experience. To enhance appearance, existing smart cards feature LEDs for dynamic display during use; however, these LEDs and transaction modules all use the same coil for interaction, which serves as both power supply and antenna. This lack of separation makes them susceptible to magnetic interference, potentially affecting the LED display during data exchange and impacting the overall appearance. Furthermore, existing smart cards lack protection circuits; however, a malfunction in the internal coil leading to overvoltage or overcurrent can damage internal chips or corrupt chip data, affecting user experience. Summary of the Invention

[0004] This invention addresses the shortcomings of current technology by providing a smart card with dynamic LED display.

[0005] The present invention also provides a method of use.

[0006] The technical solution adopted by the present invention to achieve the above objectives is as follows:

[0007] A smart card with dynamic LED display includes a substrate, a control circuit board, and a top plate. The substrate has a cavity, the control circuit board is disposed in the cavity, and the top plate is disposed above the substrate. The substrate and the top plate are provided with a snap-fit ​​connection structure and a sealing structure. Both the substrate and the top plate are also provided with a prompting component and an anti-slip structure. The top plate is provided with a pattern display portion, and the substrate is provided with a contact heat dissipation structure.

[0008] The control circuit board includes a contactless antenna module, a voltage regulator module, multiple driver modules, a chip module one, and a chip module two. The contactless antenna module includes a wireless power supply coil, a contactless communication coil, and a placement board. The wireless power supply coil and the contactless communication coil are disposed on the placement board. An amorphous material layer is provided between the wireless power supply coil and the contactless communication coil. The amorphous material layer is used to provide magnetic shielding for the contactless communication coil and is treated to reduce magnetic loss. The wireless power supply coil has connection terminals VA1 and VB1, and the contactless communication coil has connection terminals VA2 and VB2. The wireless power supply coil is electrically connected to the voltage regulator module. The voltage regulator module is electrically connected to the chip module one and the driver modules. The chip module one and the chip module two are electrically connected. Each chip module one is electrically connected to multiple driver modules. Each of the multiple driver modules has an LED array module. The voltage regulator module has a voltage regulator circuit, and the voltage regulator circuit has a protection circuit.

[0009] Chip module one is an SE chip, which includes an SPI interface module and a GPIO module. Chip module two is an SE non-contact wafer chip. Both chip module one and chip module two have pins 5, 6, 7, 8, 9, and 10. Pin 5 is connected to the connection terminal VA2. Pin 6 is connected to the connection terminal VB2. Pin 7 of chip module one is connected to pin 7 of chip module two. Pin 8 of chip module one is connected to pin 8 of chip module two. Pin 9 of chip module one is connected to pin 9 of chip module two. Pin 10 of chip module one is connected to pin 10 of chip module two.

[0010] As a further improvement, the substrate includes a bottom plate and multiple side plates. The snap-fit ​​connection structure is provided with multiple hooks and slots. The multiple hooks are respectively disposed on the top of the side plates, and the multiple slots are respectively disposed on the edge of the top plate. The hooks are respectively engaged with the slots to snap and connect.

[0011] As a further improvement, the sealing structure includes an annular protrusion and an annular groove. The annular groove is disposed at the bottom of the top plate, and the annular protrusion is disposed on the top of multiple side plates of the substrate. The annular protrusion includes an annular block one and an annular block two. The annular block two is disposed next to the inner side of the annular block one. The annular groove includes an annular groove one and an annular groove two. The annular groove two is disposed next to the inner side of the annular groove one. The annular block one is connected to the annular groove one, and the annular block two is connected to the annular groove two.

[0012] As a further improvement, both the first and second annular blocks are chamfered, and both the first and second annular grooves are chamfered. The chamfers fit and fit together. Sealing rings are provided between the first annular block and the first annular groove, and between the second annular block and the second annular groove.

[0013] As a further improvement, the bottom surface of the substrate and the top surface of the top plate are both provided with grooves, and each groove is provided with multiple slots. The multiple slots are connected and communicate with the cavity. The substrate and the top plate are also provided with a prompting component. The prompting component includes multiple fluorescent temperature-changing adhesive strips. The multiple fluorescent temperature-changing adhesive strips are respectively disposed in the grooves. The multiple fluorescent temperature-changing adhesive strips are provided with multiple contact parts. The contact parts are respectively disposed in the slots and are connected and communicate with the cavity.

[0014] As a further improvement, the anti-slip structure is a frosted anti-slip surface composed of multiple particles. The anti-slip structure is respectively disposed on the bottom surface of the substrate and the top surface of the top plate. The LED light array module is disposed below the pattern display part. The pattern display part includes a transparent part and a colored ink part.

[0015] As a further improvement, the outer side of the side plate is provided with a groove 1, and the inner side of the side plate is provided with a groove 2. Multiple through holes 1 connect and communicate between the groove 1 and the groove 2. The contact heat dissipation structure includes multiple thermally conductive silicone strips. Each of the multiple thermally conductive silicone strips includes a thermally conductive silicone strip 1, a thermally conductive silicone strip 2, and multiple thermally conductive silicone pillars. The thermally conductive silicone strip 1 is disposed in the groove 1, the thermally conductive silicone strip 2 is disposed in the groove 2, and the multiple thermally conductive silicone pillars are respectively disposed in the through holes 1. One end of the thermally conductive silicone pillar is connected to the thermally conductive silicone strip 1, and the other end of the thermally conductive silicone pillar is connected to the thermally conductive silicone strip 2. Each thermally conductive silicone strip 1 is also provided with multiple heat dissipation grooves, and the inner side of each of the multiple heat dissipation grooves is also provided with multiple strip-shaped grooves 1.

[0016] As a further improvement, the voltage regulator module includes capacitor C3, capacitor C1, a bridge full-wave voltage regulator circuit, and a Zener diode D3. Connection terminal VA1 is connected to one end of capacitor C3, connection terminal VB1 is connected to the other end of capacitor C3, one end of capacitor C1 is connected to one end of capacitor C3, and the other end of capacitor C1 is connected to the other end of capacitor C3. The bridge full-wave voltage regulator circuit has connection terminal one, connection terminal two, and connection terminal three. One end of capacitor C1 is connected to connection terminal two, and the other end of capacitor C1 is also connected to connection terminal one. Connection terminal two is connected to one end of the Zener diode D3, and the other end of the Zener diode D3 has a ground terminal. A VIN connection terminal is provided between connection terminal two and the Zener diode D3, and the Zener diode D3 also has a VCC connection terminal.

[0017] The protection circuit includes two fuse protectors, which are respectively located between the connection terminal VA1 and one end of the capacitor C3, and between the connection terminal VB1 and the other end of the capacitor C3.

[0018] As a further improvement, the chip module one is also provided with a VCC1 connection terminal and a VCC2 connection terminal, the VCC1 connection terminal and the VCC2 connection terminal are connected, the VCC1 connection terminal and the VCC2 connection terminal are provided with a fourth connection terminal and a fifth connection terminal, the fourth connection terminal is provided with a capacitor C4, the other end of the capacitor C4 is connected to a ground terminal, the fifth connection terminal is provided with a test terminal M, the sixth connection terminal is provided between the fifth connection terminal and the test terminal M, the sixth connection terminal is connected to the VCC connection terminal, the chip module one is also provided with a VSS connection terminal and a pin terminal 11, the pin terminal 11 is provided with a resistor R4, the other end of the resistor R4 is provided with a DI1 terminal;

[0019] Each voltage regulator circuit includes a chip module three and a capacitor C5. The chip module three has connection terminals OR, OG, OB, GND, VCC3, DI, and DO. Each connection terminal VCC3 is connected to the VIN connection terminal. A connection terminal seven is provided between each connection terminal VCC3 and the VIN connection terminal. Each connection terminal seven is connected to one end of the capacitor C5. Both the connection terminal GND and the other end of the capacitor C5 have a ground terminal two. Each connection terminal DI is connected to the DI1 terminal. Each connection terminal DO has a resistor R5. Each resistor R5 has a connection terminal DO1, which is used to connect to another voltage regulator circuit.

[0020] The LED array module is composed of multiple light-emitting diodes. One end of each of the multiple light-emitting diodes is connected in series, and the other end of each of the multiple light-emitting diodes is also provided with a resistor R11. The other end of the resistor R11 is connected to the connection terminal OR, connection terminal OG, and connection terminal OB, respectively. The other end of the connection terminal GND and the capacitor C5 are all provided with a ground terminal.

[0021] A method of using a smart card that implements the aforementioned LED dynamic display includes the following steps;

[0022] (1) Drive power supply: Place the smart card with LED dynamic display on the driver with coil. The coil of the driver operates to power the non-contact antenna module. The non-contact antenna module provides power.

[0023] (2) Voltage regulation and rectification: The current is regulated and rectified through the voltage regulator circuit. The voltage and current after the regulation are used to power the chip module and the driver module, respectively.

[0024] (3) Data processing and transaction: When chip module 1 and chip module 2 interact with each other, and chip module 2 interacts with the driver to exchange transaction data, chip module 2 sends control signals back to chip module 1 for processing.

[0025] (4) LED dynamic display: After receiving and processing the feedback signal, the chip module controls the drive module to perform actions. The drive module turns on and controls the LED array module according to the control signal (DATA control signal) sent by the chip module, so that the LED array module performs brightness and opening and closing actions, and performs dynamic display in combination with the pattern display part.

[0026] (5) Reset after transaction: After the transaction is completed, the smart card of the LED dynamic display is disconnected from the external driver with coil, the non-contact antenna module is powered by no magnetic induction, the chip module and the driver module are powered off and in the off position, the LED array module ends the dynamic display, and the whole process is completed.

[0027] The beneficial effects of this invention are as follows: This invention, through a snap-fit ​​connection structure, allows for a detachable connection between the top plate and the base plate, facilitating the replacement and maintenance of the internal control circuit board without requiring re-making of the card, reducing card production time, ensuring normal user operation, and enabling the reuse of some smart card components. This facilitates sorting and disassembly during subsequent disposal, improving the convenience of recycling, reducing manufacturing costs, and minimizing environmental pollution. The invention also includes a prompting component providing fluorescent and temperature change indicators. The fluorescent indicator allows for quick identification of the smart card's location in dimly lit environments, facilitating retrieval. The temperature change indicator changes color with temperature, providing a clear indication of the smart card's temperature, preventing short circuits in internal control circuit board components or abnormally high temperatures caused by prolonged placement on the driver. This facilitates rapid cooling of the smart card, improving safety. The design incorporates a heat dissipation structure to increase the direct contact area between the control circuit board and the external environment, thereby improving heat conduction and dissipation efficiency. This prevents heat buildup from the contactless antenna module during smart card use, avoiding potential safety hazards caused by heat accumulation inside the smart card, enhancing security, reducing residual heat, improving user comfort, and enhancing the user experience. By separating the power supply coil and the contactless communication coil with an amorphous material layer between them, the power supply and transaction data communication are separated, preventing mutual interference and ensuring stable power supply and transaction data. This guarantees the stability of the subsequent smart card dynamic display and data interaction. A protection circuit is included to prevent circuit disconnection, protecting against abnormal overcurrent and overvoltage from affecting other components on the control circuit board and preventing data loss, thus improving safety and protection and extending the smart card's lifespan.

[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall structure of the smart card dynamically displayed by LEDs in this embodiment;

[0030] Figure 2 This is a schematic diagram of the LED dynamic display of the smart card from a low angle in this embodiment;

[0031] Figure 3 This is a cross-sectional view of this embodiment;

[0032] Figure 4 This is a schematic diagram of the non-contact antenna module structure in this embodiment;

[0033] Figure 5 This is a schematic diagram of the control circuit board module in this embodiment;

[0034] Figure 6 This is a schematic diagram of the control circuit board in this embodiment;

[0035] Figure 7 This is a schematic diagram of the usage method in this embodiment. Detailed Implementation

[0036] The following description is only a preferred embodiment of the present invention and does not limit the scope of protection of the present invention.

[0037] For examples, see the appendix. Figures 1-7 A smart card 1 with dynamic LED display includes a base plate 2, a control circuit board 3, and a top plate 4. The base plate 2 has a cavity 5, the control circuit board 3 is disposed in the cavity 5, and the top plate 4 is disposed above the base plate 2. A snap-fit ​​connection structure 6 and a sealing structure 7 are provided between the base plate 2 and the top plate 4. The base plate 2 and the top plate 4 are also provided with a prompting component 8 and an anti-slip structure 9. The top plate 4 has a pattern display part 10, and the base plate 2 has a contact heat dissipation structure 11.

[0038] The control circuit board 3 includes a contactless antenna module 30, a voltage regulator module 31, multiple drive modules 32, a first chip module 33, and a second chip module 34. The contactless antenna module 30 is electrically connected to the voltage regulator module 31. The voltage regulator module 31 is electrically connected to the first chip module 33 and the drive modules 32. The first chip module 33 and the second chip module 34 are electrically connected. The first chip module 33 is electrically connected to multiple drive modules 32. Each drive module 32 is equipped with an LED array module 35. The voltage regulator module 31 is equipped with a voltage regulator circuit 37. The voltage regulator circuit 37 is equipped with a protection circuit 38. The contactless antenna module 30 is used for non-contact connection with an external driver with a coil.

[0039] The substrate 2 includes a bottom plate and multiple side plates. The snap-fit ​​connection structure 6 is provided with multiple hooks 60 and slots 61. The multiple hooks 60 are respectively disposed on the top of the side plates, and the multiple slots 61 are respectively disposed on the edge of the top plate 4. The hooks 60 are respectively engaged with the slots 61 to fasten and connect. The snap-fit ​​connection structure 6 makes the top plate 4 and the substrate 2 detachably connected, thereby facilitating the replacement and maintenance of the internal control circuit board 3. This allows some components of the smart card 1 to be reused, reducing manufacturing costs and environmental pollution, and also facilitating sorting and disassembly during subsequent disposal, improving the convenience of subsequent recycling.

[0040] The sealing structure 7 includes an annular protrusion 70 and an annular groove 71. The annular groove 71 is disposed at the bottom of the top plate 4. The annular protrusion 70 is disposed on the top of multiple side plates of the substrate 2. The annular protrusion 70 includes an annular block one and an annular block two. The annular block two is disposed next to the inner side of the annular block one. The annular groove 71 includes an annular groove one and an annular groove two. The annular groove two is disposed next to the inner side of the annular groove one. The annular block one is connected to the annular groove one, and the annular block two is connected to the annular groove two.

[0041] Both the first and second annular blocks have beveled surfaces 700, and both the first and second annular grooves have beveled surfaces 710. The beveled surfaces 700 and 701 are fitted together and connected. A sealing ring 72 is provided between the first annular block and the first annular groove, and between the second annular block and the second annular groove. The sealing structure 7 is used to form a double sealing structure to improve the sealing performance and thus improve the waterproof performance.

[0042] The bottom surface of the substrate 2 and the top surface of the top plate 4 are both provided with grooves. Each groove has multiple slots, and each slot is connected to the cavity 5. The indicator component 8 includes multiple fluorescent temperature-changing adhesive strips, which are respectively disposed in the grooves. Each fluorescent temperature-changing adhesive strip has multiple contact parts, which are respectively disposed in the slots and connected to the cavity 5. The indicator component 8 is sealed to the substrate 2. The indicator component 8 provides fluorescent and temperature change indicators. The fluorescent indicator function allows for quick identification of the smart card 1 in dimly lit environments, facilitating retrieval. The temperature change indicator function changes color with temperature, providing a clear indication of the smart card 1's temperature. This prevents short circuits in the internal control circuit board components or abnormally high temperatures caused by prolonged placement on the driver, facilitating rapid cooling of the smart card and improving safety.

[0043] The anti-slip structure 9 is a frosted anti-slip surface composed of multiple particles. The anti-slip structure 9 is respectively disposed on the bottom surface of the substrate 2 and the top surface of the top plate 4. The LED light array module 35 is disposed below the pattern display part 10. The pattern display part 10 includes a transparent part and a colored ink part. The anti-slip structure 9 is used to prevent slipping and make it easy to hold. The pattern display part 10 is used to cooperate with the LED light array module 35 to realize the dynamic display action of the smart card 1 and improve the viewing experience during use.

[0044] The outer side of the side plate has a first groove, and the inner side of the side plate has a second groove. Multiple through holes connect the first and second grooves. The contact heat dissipation structure 11 includes multiple thermally conductive silicone strips. Each thermally conductive silicone strip includes a first thermally conductive silicone strip 110, a second thermally conductive silicone strip 112, and multiple thermally conductive silicone pillars 111. The first thermally conductive silicone strip 110 is disposed within the first groove, the second thermally conductive silicone strip 112 is disposed within the second groove, and the multiple thermally conductive silicone pillars 111 are respectively disposed within the through holes. One end of each thermally conductive silicone pillar 111 is connected to the first thermally conductive silicone strip 110. The other end of the thermally conductive silicone pillar 111 is connected to the thermally conductive silicone strip 112. Each thermally conductive silicone strip 110 is also provided with multiple heat dissipation grooves 1100. The inner side of each of the multiple heat dissipation grooves 1100 is also provided with multiple strip grooves. The contact heat dissipation structure 11 is fused and sealed with the side plate. The contact heat dissipation structure 11 is used to control the direct contact area between the circuit board 3 and the outside world, thereby improving the heat conduction and heat dissipation effect and efficiency, preventing the heat generated by the non-contact antenna module 30 from accumulating when the smart card 1 is in use, preventing the occurrence of safety hazards caused by heat accumulation inside the smart card 1, and improving security.

[0045] The contactless antenna module 30 includes a wireless power supply coil 300, a contactless communication coil 301, and a placement plate 302. The wireless power supply coil 300 and the contactless communication coil 301 are disposed on the placement plate 302. An amorphous material layer 303 is provided between the wireless power supply coil 300 and the contactless communication coil 301. The amorphous material layer 303 is used to provide magnetic shielding for the contactless communication coil 301 and is treated to reduce magnetic loss. The wireless power supply coil 300 has a connection terminal VA1 and a connection terminal VB1, and the contactless communication coil 301 has a connection terminal VA2 and a connection terminal VB2. The voltage regulator module 31 includes a capacitor C3, a capacitor C1, a bridge full-wave voltage regulator circuit, and a Zener diode D3. The connection terminal VA1 is connected to one end of the capacitor C3, and the connection terminal VB1 is connected to the other end of the capacitor C3. One end of the capacitor C1 is connected to one end of the capacitor C3, and the other end of the capacitor C1 is connected to the capacitor C3. The other end is connected to the bridge full-wave stabilizing circuit 37, which has a connection terminal 1a, a connection terminal 1b, and a connection terminal 1c. One end of the capacitor C1 is connected to the connection terminal 1b, and the other end of the capacitor C1 is also connected to the connection terminal 1a. The connection terminal 1b is connected to one end of the Zener diode D3, and the other end of the Zener diode D3 has a ground terminal. A VIN connection terminal is provided between the connection terminal 1b and the Zener diode D3. The Zener diode D3 also has a VCC connection terminal. The wireless power supply coil 300 is used to provide power to the circuit in the smart card 1. The contactless communication coil 301 is used for communication and interaction of transaction data. The amorphous material layer 303 is used to provide magnetic shielding, prevent interference, ensure the stability of power supply and transaction data, and ensure the stability of the dynamic display effect and data interaction of the smart card 1. The contactless power supply antenna module 30 is used to greatly reduce the overall thickness and volume of the smart card 1.

[0046] The protection circuit 38 includes two fuse protectors, which are respectively located between the connection terminal VA1 and one end of the capacitor C3, and between the connection terminal VB1 and the other end of the capacitor C3. The protection circuit 38 is used to provide circuit disconnection protection, prevent abnormal overcurrent and overvoltage from affecting other components in the control circuit board 3, prevent data loss, improve safety and protection, and thus extend the service life of the smart card.

[0047] Chip module 33 is an SE chip, which includes an SPI interface module and a GPIO module. Chip module 34 is an SE non-contact wafer chip. Both chip module 33 and chip module 34 have pins 5, 6, 7, 8, 9, and 10. Pin 5 is connected to connection terminal VA2, pin 6 is connected to connection terminal VB2, pin 7 of chip module 33 is connected to pin 7 of chip module 34, pin 8 of chip module 33 is connected to pin 8 of chip module 34, pin 9 of chip module 33 is connected to pin 9 of chip module 34, and pin 10 of chip module 33 is connected to pin 10 of chip module 34.

[0048] The chip module 33 also has a VCC1 connection terminal and a VCC2 connection terminal, which are connected. The VCC1 connection terminal and the VCC2 connection terminal have a connection terminal 1d and a connection terminal 1e. The connection terminal 1d has a capacitor C4, and the other end of the capacitor C4 is connected to a ground terminal. The connection terminal 1e has a test terminal M. The connection terminal 1f is located between the connection terminal 1e and the test terminal M. The connection terminal 1f is connected to the VCC connection terminal. The chip module 33 also has a VSS connection terminal and a pin terminal 11. The pin terminal 11 has a resistor R4, and the other end of the resistor R4 has a DI1 terminal.

[0049] Each voltage regulator circuit 37 includes a chip module three and a capacitor C5. The chip module three has connection terminals OR, OG, OB, GND, VCC3, DI, and DO. Each connection terminal VCC3 is connected to the VIN connection terminal. A connection terminal 1g is provided between each connection terminal VCC3 and the VIN connection terminal. Each connection terminal 1g is connected to one end of the capacitor C5. Each connection terminal GND and one end of the capacitor C5 have a ground terminal two. Each connection terminal DI is connected to the DI1 terminal. Each connection terminal DO has a resistor R5. Each resistor R5 has a connection terminal DO1. The connection terminal DO1 is used to connect to another voltage regulator circuit 37.

[0050] The LED array module 35 is composed of multiple light-emitting diodes. One end of each of the multiple light-emitting diodes is connected in series, and the other end of each of the multiple light-emitting diodes is also provided with a resistor R11. The other end of the resistor R11 is connected to the connection terminal OR, connection terminal OG, and connection terminal OB, respectively. The connection terminal GND and the other end of the capacitor C5 are both provided with a ground terminal. The LED array module 35 is used to perform display control according to the control signal and, together with the pattern display part 10, realizes the appearance display.

[0051] A method of using a smart card 1 that implements the LED dynamic display includes the following steps;

[0052] (1) Drive power supply: Place the smart card 1 with LED dynamic display on the driver with coil. The coil of the driver operates to supply power to the non-contact antenna module 30, which provides power.

[0053] (2) Voltage regulation and rectification: The current is regulated and rectified through the voltage regulator circuit 37. The voltage and current after the rectification are respectively used to power the chip module 33 and the driver module 32.

[0054] (3) Data processing and transaction: When chip module 1 33 and chip module 2 34 interact with each other, and when chip module 2 34 interacts with the driver to exchange transaction data, chip module 2 34 sends control signals back to chip module 1 33 for processing.

[0055] (4) LED dynamic display: After receiving and processing the feedback signal, the chip module 33 controls the drive module 32 to perform actions. The drive module 32 performs the opening and control actions of the LED light array module 35 according to the control signal (DATA control signal) sent by the chip module 33, so that the LED light array module 35 performs brightness and opening and closing actions, and performs dynamic display in combination with the pattern display part 10.

[0056] (5) Reset after transaction completion: After the transaction is completed, the smart card 1 with LED dynamic display is disconnected from the external driver with coil, the non-contact antenna module 30 is powered without magnetic induction, the chip module 33 and the driver module 32 are powered off and in the off position, the LED array module 35 ends the dynamic display, and the whole process is completed.

[0057] This invention features a snap-fit ​​connection structure that allows for a detachable connection between the top plate and the base plate. This facilitates the replacement and maintenance of the internal control circuit board without requiring re-making of the card, reducing production time and ensuring normal user operation. Furthermore, it allows for the reuse of some smart card components, facilitating sorting and disassembly during subsequent disposal, improving recycling convenience, reducing manufacturing costs, and minimizing environmental pollution. The invention also includes a prompting component providing fluorescent and temperature change indicators. The fluorescent indicator allows for quick location identification in dimly lit environments, facilitating retrieval. The temperature change indicator changes color with temperature, providing clear feedback on the smart card's temperature and preventing short circuits or overheating due to prolonged placement on the driver. This facilitates rapid cooling of the smart card, improving safety. The invention further incorporates a touch-sensitive... The heat dissipation structure increases the direct contact area between the control circuit board and the external environment, thereby improving heat conduction and dissipation efficiency. This prevents heat buildup from the contactless antenna module during smart card use, avoiding potential safety hazards caused by heat accumulation inside the smart card, improving security, reducing residual heat, and enhancing user comfort and experience. By setting up a wireless power supply coil and a contactless communication coil with an amorphous material layer between them, the power supply and transaction data communication are separated, preventing mutual interference and ensuring stable power supply and transaction data. This guarantees the stability of the subsequent smart card dynamic display and data interaction. A protection circuit is included to prevent circuit disconnection, protecting against abnormal overcurrent and overvoltage from affecting other components on the control circuit board and preventing data loss, thus improving safety and protection and extending the smart card's lifespan.

[0058] This invention is not limited to the above-described embodiments. Other smart cards for LED dynamic display and their usage methods obtained by using the same or similar structures, devices, processes or methods as the above-described embodiments of this invention are all within the protection scope of this invention.

Claims

1. A smart card with dynamic LED display, characterized in that: The smart card includes a base plate, a control circuit board, and a top plate. The base plate has a cavity, the control circuit board is disposed in the cavity, and the top plate is disposed above the base plate. The base plate and the top plate are provided with a snap-fit ​​connection structure and a sealing structure. Both the base plate and the top plate are also provided with an anti-slip structure. The top plate is provided with a pattern display part, and the base plate is provided with a contact heat dissipation structure. The control circuit board includes a contactless antenna module, a voltage regulator module, multiple driver modules, a chip module one, and a chip module two. The contactless antenna module includes a wireless power supply coil, a contactless communication coil, and a placement board. The wireless power supply coil and the contactless communication coil are disposed on the placement board. An amorphous material layer is provided between the wireless power supply coil and the contactless communication coil. The amorphous material layer is used to provide magnetic shielding for the contactless communication coil and is treated to reduce magnetic loss. The wireless power supply coil has connection terminals VA1 and VB1, and the contactless communication coil has connection terminals VA2 and VB2. The wireless power supply coil is electrically connected to the voltage regulator module. The voltage regulator module is electrically connected to the chip module one and the driver modules. The chip module one and the chip module two are electrically connected. Each chip module one is electrically connected to multiple driver modules. Each of the multiple driver modules has an LED array module. The voltage regulator module has a voltage regulator circuit, and the voltage regulator circuit has a protection circuit. Chip module one is an SE chip, which includes an SPI interface module and a GPIO module. Chip module two is an SE non-contact wafer chip. Both chip module one and chip module two have pins 5, 6, 7, 8, 9, and 10. Pin 5 is connected to the connection terminal VA2. Pin 6 is connected to the connection terminal VB2. Pin 7 of chip module one is connected to pin 7 of chip module two. Pin 8 of chip module one is connected to pin 8 of chip module two. Pin 9 of chip module one is connected to pin 9 of chip module two. Pin 10 of chip module one is connected to pin 10 of chip module two.

2. The LED dynamic display smart card according to claim 1, characterized in that: The substrate includes a bottom plate and multiple side plates. The snap-fit ​​connection structure is provided with multiple hooks and slots. The multiple hooks are respectively disposed on the top of the side plates, and the multiple slots are respectively disposed on the edge of the top plate. The hooks are respectively engaged with the slots to snap and connect.

3. The LED dynamic display smart card according to claim 2, characterized in that: The sealing structure includes an annular protrusion and an annular groove. The annular groove is disposed at the bottom of the top plate, and the annular protrusion is disposed on the top of multiple side plates of the substrate. The annular protrusion includes an annular block one and an annular block two. The annular block two is disposed next to the inner side of the annular block one. The annular groove includes an annular groove one and an annular groove two. The annular groove two is disposed next to the inner side of the annular groove one. The annular block one is connected to the annular groove one, and the annular block two is connected to the annular groove two.

4. The LED dynamic display smart card according to claim 3, characterized in that: Both the first and second annular blocks have beveled surfaces, and both the first and second annular grooves have beveled surfaces. The beveled surfaces fit together and are connected. Sealing rings are provided between the first annular block and the first annular groove, and between the second annular block and the second annular groove.

5. The LED dynamic display smart card according to claim 4, characterized in that: The bottom surface of the substrate and the top surface of the top plate are both provided with grooves, and each groove is provided with multiple slots. The multiple slots are connected and communicate with the cavity. The substrate and the top plate are also provided with a prompting component. The prompting component includes multiple fluorescent temperature-changing adhesive strips. The multiple fluorescent temperature-changing adhesive strips are respectively disposed in the grooves. The multiple fluorescent temperature-changing adhesive strips are provided with multiple contact parts. The contact parts are respectively disposed in the slots and are connected and communicate with the cavity.

6. The LED dynamic display smart card according to claim 5, characterized in that: The anti-slip structure is a frosted anti-slip surface composed of multiple particles. The anti-slip structure is respectively disposed on the bottom surface of the substrate and the top surface of the top plate. The LED light array module is disposed below the pattern display part. The pattern display part includes a transparent part and a colored ink part.

7. The LED dynamic display smart card according to claim 6, characterized in that: The outer side of the side plate is provided with a first groove, and the inner side of the side plate is provided with a second groove. Multiple through holes are provided between the first groove and the second groove to connect them. The contact heat dissipation structure includes multiple thermally conductive silicone strips. Each of the multiple thermally conductive silicone strips includes a first thermally conductive silicone strip, a second thermally conductive silicone strip, and multiple thermally conductive silicone pillars. The first thermally conductive silicone strip is disposed in the first groove, the second thermally conductive silicone strip is disposed in the second groove, and the multiple thermally conductive silicone pillars are respectively disposed in the first through holes. One end of the thermally conductive silicone pillar is connected to the first thermally conductive silicone strip, and the other end of the thermally conductive silicone pillar is connected to the second thermally conductive silicone strip. Each first thermally conductive silicone strip is also provided with multiple heat dissipation grooves, and the inner side of each heat dissipation groove is also provided with multiple strip-shaped grooves.

8. The LED dynamic display smart card according to claim 7, characterized in that: The voltage regulator module includes capacitor C3, capacitor C1, a bridge full-wave voltage regulator circuit, and a Zener diode D3. Terminal VA1 is connected to one end of capacitor C3, terminal VB1 is connected to the other end of capacitor C3, one end of capacitor C1 is connected to one end of capacitor C3, and the other end of capacitor C1 is connected to the other end of capacitor C3. The bridge full-wave voltage regulator circuit has three connection terminals: terminal one, terminal two, and terminal three. One end of capacitor C1 is connected to terminal two, and the other end of capacitor C1 is also connected to terminal one. Terminal two is connected to one end of the Zener diode D3, and the other end of the Zener diode D3 has a ground terminal. A VIN connection terminal is provided between terminal two and the Zener diode D3, and the Zener diode D3 also has a VCC connection terminal. The protection circuit includes two fuse protectors, which are respectively located between the connection terminal VA1 and one end of the capacitor C3, and between the connection terminal VB1 and the other end of the capacitor C3.

9. The LED dynamic display smart card according to claim 8, characterized in that: The chip module one also has a VCC1 connection terminal and a VCC2 connection terminal, which are connected. The VCC1 connection terminal and the VCC2 connection terminal have a fourth connection terminal and a fifth connection terminal. The fourth connection terminal has a capacitor C4, and the other end of the capacitor C4 is connected to a ground terminal. The fifth connection terminal has a test terminal M. The sixth connection terminal is located between the fifth connection terminal and the test terminal M. The sixth connection terminal is connected to the VCC connection terminal. The chip module one also has a VSS connection terminal and a pin terminal 11. The pin terminal 11 has a resistor R4, and the other end of the resistor R4 has a DI1 terminal. Each voltage regulator circuit includes a chip module three and a capacitor C5. The chip module three has connection terminals OR, OG, OB, GND, VCC3, DI, and DO. Each connection terminal VCC3 is connected to the VIN connection terminal. A connection terminal seven is provided between each connection terminal VCC3 and the VIN connection terminal. Each connection terminal seven is connected to one end of the capacitor C5. Both the connection terminal GND and the other end of the capacitor C5 have a ground terminal two. Each connection terminal DI is connected to the DI1 terminal. Each connection terminal DO has a resistor R5. Each resistor R5 has a connection terminal DO1, which is used to connect to another voltage regulator circuit. The LED array module is composed of multiple light-emitting diodes. One end of each of the multiple light-emitting diodes is connected in series, and the other end of each of the multiple light-emitting diodes is also provided with a resistor R11. The other end of the resistor R11 is connected to the connection terminal OR, connection terminal OG, and connection terminal OB, respectively. The other end of the connection terminal GND and the capacitor C5 are all provided with a ground terminal.

10. A method of using a smart card with LED dynamic display as described in any one of claims 1-9, characterized in that, It includes the following steps; (1) Drive power supply: Place the smart card with LED dynamic display on the driver with coil. The coil of the driver operates to power the non-contact antenna module. The non-contact antenna module provides power. (2) Voltage regulation and rectification: The current is regulated and rectified through the voltage regulator circuit. The voltage and current after the regulation are used to power the chip module and the driver module, respectively. (3) Data processing and transaction: When chip module 1 and chip module 2 interact with each other, and chip module 2 interacts with the driver to exchange transaction data, chip module 2 sends control signals back to chip module 1 for processing. (4) LED dynamic display: After receiving and processing the feedback signal, the chip module controls the drive module to perform actions. The drive module turns on and controls the LED array module according to the DATA control signal sent by the chip module, so that the LED array module performs brightness and opening and closing actions, and performs dynamic display in combination with the pattern display part. (5) Reset after transaction: After the transaction is completed, the smart card of the LED dynamic display is disconnected from the external driver with coil, the non-contact antenna module is powered by no magnetic induction, the chip module and the driver module are powered off and in the off position, the LED array module ends the dynamic display, and the whole process is completed.

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