RF circuit test system and RF circuit test method

Abstract

This application relates to an RF circuit testing system and a RF circuit testing method. The system includes: a network communication module for generating a sampling signal based on a received pre-test signal; a function transfer module connected to the network communication module for transmitting the sampling signal; a function acquisition module connected to the function transfer module for receiving the sampling signal sent by the network communication module via the function transfer module, acquiring test information of the chip under test based on the sampling signal, and transmitting the test information to the network communication module via the function transfer module; and a processing module connected to the network communication module for generating the pre-test signal based on the test attributes of the chip under test, and receiving and processing the test information to obtain the test results of the chip under test. Using this system can reduce testing time and improve testing efficiency.

Description

Technical Field

[0001] This application relates to the field of electronic circuit technology, and in particular to a radio frequency (RF) circuit testing system and a radio frequency (RF) circuit testing method. Background Technology

[0002] Chip RF testing methods have always been a focus of innovation in the chip industry. Technological advancements in chip RF testing methods are crucial for enabling rapid and efficient testing in the chip sector. With the booming development of the domestic chip industry in recent years, chip RF testing methods have become a key focus for RF chip design companies. Therefore, updating chip RF testing methods is both a trend and a challenge in optimizing the entire RF chip product.

[0003] With the development of new energy vehicles, Bluetooth Low Energy (BLE), as a short-range wireless communication solution, is receiving increasing attention from vehicle manufacturers. Because BLE is a wireless technology, after the chip design is fabricated, the internal analog circuitry of the chip needs to be comprehensively tested. This process is characterized by long testing times, complex test content, and inconvenience. In particular, evaluating the chip's radio frequency (RF) performance requires testing the internal analog circuit modules using specialized instruments. Different testing environments need to be set up for different RF circuits, increasing testing costs and complexity, and resulting in low testing efficiency. Summary of the Invention

[0004] Therefore, it is necessary to provide an RF circuit testing system and method that can meet the testing needs of different RF circuits, addressing the aforementioned technical problems.

[0005] Firstly, this application provides a radio frequency (RF) circuit testing system for testing the RF performance of a communication chip. The RF circuit testing system includes:

[0006] The network communication module is used to generate the acquisition signal based on the received pre-test signal;

[0007] A function switching module, connected to the network communication module, is used to transmit the acquired signals;

[0008] A function acquisition module, connected to the function transfer module, is used to receive the acquisition signal sent by the network communication module via the function transfer module, obtain the test information of the chip under test based on the acquisition signal, and transmit the test information to the network communication module via the function transfer module.

[0009] The processing module, connected to the network communication module, is used to generate the pre-test signal according to the test attributes of the chip under test, and to receive and process the test information to obtain the test results of the chip under test.

[0010] In one embodiment, the function acquisition module includes multiple function boards, each function board being connected to each chip under test, for acquiring test information of each chip under test.

[0011] In one embodiment, each of the functional boards is provided with a first communication interface for connecting to the functional transfer module; the functional boards are cascaded.

[0012] In one embodiment, the function switching module includes:

[0013] The adapter board is provided with a second communication interface for connecting to the network communication module and a third communication interface for connecting to the function acquisition module;

[0014] A power supply circuit, located on the adapter board, is used to provide multiple output voltages.

[0015] In one embodiment, the adapter board is further provided with multiple expansion interfaces, each expansion interface being used to connect to the network communication module and each expansion interface being used to receive different types of pre-test signals.

[0016] In one embodiment, the network communication module includes:

[0017] At least one communication unit, and each of the communication units is communicatively connected to the processing module;

[0018] The interface unit is connected to the function transfer module.

[0019] In one embodiment, the network communication module further includes:

[0020] The processing unit is connected to each of the communication units and the interface unit, and is used to control the communication between each of the communication units and the processing module, as well as to receive the test information and the test results.

[0021] A storage unit, connected to the communication unit, is used to store the test information and the test results.

[0022] In one embodiment, the network communication module further includes:

[0023] A prompting unit is connected to the processing unit; the prompting unit is configured with multiple indication states.

[0024] The processing unit is further configured to control the indication state of the prompting unit according to the connection method between the interface unit and the function transfer module and the connection method between the communication unit and the processing module.

[0025] Secondly, this application also provides a radio frequency (RF) circuit testing method for controlling the RF circuit testing system described in any one of the embodiments of this application. The method includes:

[0026] A pre-test signal is generated based on the test attributes of the chip under test, so as to control the network communication module to generate acquisition signals to obtain the test information of the chip under test;

[0027] Receive and process the test information to obtain the test results of the chip under test.

[0028] In one embodiment, the step of generating a pre-test signal based on the test attributes of the chip under test to control the network communication module to generate a collection signal to obtain the test information of the chip under test includes:

[0029] The network communication module is controlled to establish a communication request based on the test attributes of the chip under test;

[0030] A pre-test signal is generated based on the communication connection response signal.

[0031] The aforementioned RF circuit testing system and method involve a processing module that generates a pre-test signal based on the pre-test attributes of the chip under test (TBT) and transmits it to the network communication module. The network communication module then generates an acquisition signal based on the pre-test signal and transmits it to the functional acquisition module via a function transfer module. The functional acquisition module acquires the test information of the TBT based on the acquisition signal. This test information, after passing through the function transfer module and the network communication module, is then transmitted to the processing module for processing to obtain the test results for the TBT. The connections and signal transmission between these modules reduce testing time. Furthermore, the function transfer module allows for control of the functional acquisition module to acquire various test information from different TBT chips according to the testing requirements of different analog circuits, thereby obtaining the corresponding test results based on the testing needs. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a circuit diagram of the internal radio frequency circuit of a Bluetooth chip.

[0034] Figure 2 This is a structural block diagram of a radio frequency circuit testing system provided in one embodiment of this application;

[0035] Figure 3 This is a structural block diagram of a radio frequency circuit testing system provided in another embodiment of this application;

[0036] Figure 4 This is a structural block diagram of a radio frequency circuit testing system provided in another embodiment of this application;

[0037] Figure 5 This is a structural block diagram of the radio frequency circuit testing system provided in another embodiment of this application;

[0038] Figure 6a and Figure 6b This is a circuit diagram of a Bluetooth communication unit provided in one embodiment of this application;

[0039] Figure 7 This is a circuit diagram of a wireless communication unit provided in one embodiment of this application;

[0040] Figure 8 This is a circuit diagram of a gateway interface unit provided in one embodiment of this application;

[0041] Figure 9 This is a circuit diagram of a physical interface unit provided in one embodiment of this application;

[0042] Figure 10 This is a circuit diagram of a processing unit provided in one embodiment of this application;

[0043] Figure 11 This is a structural block diagram of the radio frequency circuit testing system provided in another embodiment of this application;

[0044] Figure 12 This is a circuit diagram of a communication processing unit provided in one embodiment of this application;

[0045] Figure 13 This is a flowchart illustrating a radio frequency circuit testing method provided in one embodiment of this application;

[0046] Figure 14 This is a flowchart illustrating a radio frequency circuit testing method provided in another embodiment of this application;

[0047] Figure 15 This is a schematic diagram of the communication flow of a radio frequency circuit testing method provided in one embodiment of this application;

[0048] Figure 16 This is a schematic diagram of the workflow of the functional acquisition module provided in one embodiment of this application;

[0049] Figure 17This is a schematic diagram illustrating the workflow of a network communication module provided in one embodiment of this application.

[0050] Explanation of reference numerals in the attached figures:

[0051] 10. RF circuit testing system; 11. Network communication module; 111. Communication unit; 112. Interface unit; 113. Processing unit; 114. Storage unit; 115. Prompt unit; 12. Function conversion module; 121. Adapter board; 122. Power supply circuit; 13. Function acquisition module; 131. Function board; 14. Processing module. Detailed Implementation

[0052] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0054] It should be noted that when one element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediary element. Furthermore, in the following embodiments, "connection" should be understood as "electrical connection," "communication connection," etc., if there is transmission of electrical signals or data between the connected objects.

[0055] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0056] As described in the background section, the radio frequency transceiver circuitry internally designed into a BLE chip is as follows: Figure 1As shown, the system mainly includes a receiving path, a transmitting path, and a digital processing baseband. The internal circuit design supports both transmitting and receiving modes. In transmitting mode, the digital baseband sends the data packets to be transmitted to the antenna via digital-to-analog conversion, up-mixing, and a power amplifier (PA) in the transmitting link. A phase-locked loop (PLL) unifies and integrates the clock signal (CLK) to ensure the normal operation of high-frequency devices. In receiving mode, the weak BLE signal received at the antenna is amplified by a low-noise amplifier (LNA) in the receiving link, maintaining a good signal-to-noise ratio to prevent excessive noise amplification. The RF LNA is typically located after the antenna to prevent further noise introduction from other parts of the receiving system, thus reducing its performance. The signal is then split into I-channel and Q-channel signals by two mixers. The I-channel and Q-channel signals are then converted into voltage signals by a transimpedance amplifier (TIA). The two I and Q signals output from the TIA enter a Complex Band-pass Filter (CBPF). The CBPF has a bandwidth of 1.2MHz, and the center frequency of the band-pass filter is 2MHz. The output signal of the band-pass filter is amplified and limited by a limiter before being sent to an analog-to-digital converter (ADC). The ADC has a sampling rate of 128Msps and a resolution of 1 bit. The ADC outputs two data streams, I and Q, to the Digital Baseband (DBB) for data processing, including data decoding and digital filtering. The DBB performs BLE packet detection, synchronization, demodulation, and decoding. The hard-decision bitstream from the demodulated output in the digital receiving circuit is sent to the decoding unit, which then decodes the data according to the data mapping mode configuration and outputs the information bitstream.

[0057] During chip design, due to differences in analog characteristics, different adjustable parameters need to be set on modules. These parameters also need to be cascaded. Each module has many levels of adjustable units. With multiple levels and configurations, there may be hundreds or even thousands of test items, which increases chip testing costs and time and reduces efficiency.

[0058] Based on this, please refer to Figure 2A radio frequency (RF) circuit testing system 10 is provided for testing the RF performance of communication chips. The RF circuit testing system 10 includes a network communication module 11, a function switching module 12, a function acquisition module 13, and a processing module 14. The network communication module 11 generates an acquisition signal based on a pre-test signal generated by the processing module 14. The processing module 14 can be a host computer. The pre-test signal is a signal generated by the processing module 14 based on the test attributes of the chip under test. The acquisition signal is a signal that instructs the function acquisition module 13 to acquire data corresponding to the pre-test attribute. For example, if a certain RF function of the chip under test is to be tested, a pre-test signal corresponding to that function is generated and output to the network communication module 11 to generate the corresponding acquisition signal to acquire data in the chip under test corresponding to that RF function.

[0059] The function transfer module 12 is connected to the network communication module 11 and is used to transmit the acquired signals. The function acquisition module 13 is connected to the function transfer module 12 and is used to receive the acquired signals sent by the network communication module 11 through the function transfer module 12, obtain the test information of the chip under test according to the acquired signals, and transmit the test information to the network communication module 11 through the function transfer module 12. The test information is information corresponding to the pre-test attribute. If the pre-test attribute is a certain radio frequency function, then the test information is all the information corresponding to that radio frequency function. The function transfer board 121 is used to control the function acquisition module 13 to acquire the test information corresponding to the pre-test attribute according to different pre-test attributes.

[0060] The processing module 14 is connected to the network communication module 11. The test information acquired by the function acquisition module 13 is transmitted to the processing module 14 via the function transfer module 12 and the network communication module 11 for processing to obtain the test results of the chip under test. The test results can characterize whether the functions of each RF module of the chip under test are normal.

[0061] In the aforementioned RF circuit testing system 10, the processing module 14 generates a pre-test signal based on the pre-test attributes of the chip under test and transmits it to the network communication module 11. The network communication module 11 then generates an acquisition signal based on the pre-test signal and transmits it to the functional acquisition module 13 via the function transfer module 12. The functional acquisition module 13 acquires the test information of the chip under test based on the acquisition signal. The test information is then transmitted to the processing module 14 after passing through the function transfer module 12 and the network communication module 11 to obtain the test result of the chip under test. The connection and signal transmission between these modules reduce testing time. The function transfer module 12 allows the functional acquisition module 13 to acquire various test information of different chips under test according to the testing requirements of different analog circuits, thereby obtaining corresponding test results based on the testing needs. Furthermore, the system uses separate modules, which, in addition to supporting the testing needs of chip analog circuits, facilitates application expansion to achieve more functions.

[0062] In one embodiment, such as Figure 3 As shown, the function acquisition module 13 includes multiple function boards 131, each function board 131 being connected to a chip under test for acquiring test information from each chip under test. Each function board 131 is provided with a first communication interface for connecting to the function transfer module 12; the function boards 131 are cascaded.

[0063] Function board 131 supports a four-wire download method, including the following four-wire interfaces: circuit power supply voltage VCC, circuit ground GND, digital input / output serial port SWDIO, and clock circuit serial port SWCLK. It supports bidirectional two-wire synchronous serial bus (Inter-Integrated Circuit, I2C) and J-Link download, using a compatible four-wire mode. The level shift (LF) power supply voltage of function board 131 is configurable. Since the system voltage is 12V, the LF voltage needs to be designed to be between 4.5V and 15V. This requires a boost converter chip to increase the voltage to 12V, and the feedback voltage is changed via a DAC to provide a configurable voltage range. Function board 131's LF voltage needs to be configurable from 1.8V to 5V for the chip's VDD voltage, and voltage drop during use needs to be considered to meet the requirements of practical application scenarios. Because many function boards 131 can be distinguished by their circuit numbers, and the application scenarios are unified, the function boards 131 are used to test different data transmission units. At this time, the hardware coding can confirm the type of the board.

[0064] The aforementioned RF circuit testing system 10 collects test information from each chip under test through each function board 131, and selects different function boards 131 through function adapter board 121 to collect test information corresponding to the pre-test attributes of the processing module 14. When testing different RF modules of different chips under test, only the function adapter board 121 needs to be modified without modifying the entire circuit, thus reducing modification costs.

[0065] In one embodiment, such as Figure 4 As shown, the function conversion module 12 includes a conversion board 121 and a power supply circuit 122. The conversion board 121 is also provided with multiple expansion interfaces, each of which is used to connect to the network communication module 11 and to receive different types of pre-test signals.

[0066] The adapter board 121 is designed with different power supply voltage outputs via a network port to support high current power output from the system. It provides an external switching power supply interface for connection to the power module, and a communication interface for connection to the function acquisition module 13. It also supports cascading with the network communication module 11. Furthermore, the adapter board 121, through its expansion interface, is compatible with the expandable functions of the network communication module 11, used to receive pre-test signals. These pre-test signals represent test requirements of the chip under test, excluding test attributes, such as the functions and information of digital or communication modules.

[0067] The aforementioned RF circuit testing system 10, through the settings of the adapter board 121, allows modification of the pre-test attributes corresponding to the acquired signals. This avoids modifying the entire circuit when testing different RF modules of different chips under test, reducing modification costs. Considering other types of tests that may exist later, the expansion interface settings allow for support of different interface testing requirements by only modifying the adapter board 121, further reducing modification costs for the entire system.

[0068] In one embodiment, such as Figure 5 As shown, the network communication module 11 includes at least one communication unit 111, an interface unit 112, a processing unit 113, a storage unit 114, and a prompting unit 115. At least one communication unit 111 is present, and each communication unit 111 is communicatively connected to the processing module 14. The communication unit 111 is used for transmitting communication between the processing module 14 and the network communication module 11. The communication unit 111 includes, but is not limited to, a Bluetooth communication unit, a positioning communication unit, and a wireless communication unit. The Bluetooth communication unit is used to meet the data communication requirements of BLE chip testing and networking. For the circuit configuration of the Bluetooth communication unit, please refer to [reference needed]. Figure 6a and Figure 6b The positioning communication unit is used to meet data interaction in offline mode; the wireless communication unit is used to meet wireless communication needs. Please refer to [reference needed] for the circuit configuration of the wireless communication unit. Figure 7 .

[0069] Interface unit 112 is connected to function conversion module 12. Interface unit 112 includes, but is not limited to, gateway interface unit and physical interface unit. The gateway interface unit can use an automotive-grade CAN high-speed transceiver chip to achieve stable communication. Please refer to [reference needed] for the circuit configuration of the gateway interface unit. Figure 8 The physical interface unit can use a DB26 to achieve interface versatility, improve signal isolation capabilities, and enhance interface connection stability. Please refer to [reference needed] for the circuit configuration of the physical interface unit. Figure 9 .

[0070] The processing unit 113 is connected to each communication unit 111 and interface unit 112, and is used to control the communication between each communication unit 111 and the processing module 14, as well as to receive test information and test results. The processing unit 113 may include an Arm-Cortex GD32F103RE chip with 512KB of Flash memory. For the circuit configuration of the processing unit 113, please refer to [reference needed]. Figure 10 The device has 64KB of SRAM and its main functions include data forwarding, external data communication through various protocol interfaces, sound prompts, SWD download, support for 4-channel serial communication (BLE, GPRS, USB to USART, RS485), support for CAN communication, 4-channel serial peripheral interfaces (including RFReceive, SPI (direct DB26 interface), SD, SPI (74HC595 GPIO simulates SPI)), PWM, DAC, ADC, I2C, etc.

[0071] Storage unit 114 is connected to communication unit 111 and is used to store test information and test results to meet offline testing requirements and store all data during testing. Prompt unit 115 is connected to processing unit 113; prompt unit 115 is configured with multiple indication states; wherein, processing unit 113 is also used to control the indication state of prompt unit 115 according to the connection method between interface unit 112 and function transfer module and the connection method between communication unit 111 and processing module 14. Prompt unit 115 includes at least one of prompt sound, prompt light, and prompt information; when prompt unit 115 is a prompt light, the connection state between modules is indicated by the light.

[0072] The aforementioned RF circuit testing system 10 enables remote testing through the communication unit 111, and offline testing through the storage unit 114, facilitating real-time monitoring of system operation status and remote control of relevant test items; it also enables the acquisition of different functional data through the interface unit 112; and it uses the prompting unit 115 to indicate the connection status between modules, thereby determining the test operation status.

[0073] In one embodiment, please refer to Figure 11The network communication module 11 and the function transfer module 12 are arranged in a parallel layout. Multiple function boards 131 in the function acquisition module 13 are stacked and distributed, cascaded via a CAN bus. Each function board 131 can connect individually to the function transfer module 12, or multiple function boards 131 can connect to each other. In the network communication module 11, the communication unit 111 includes a communication processing unit, a BLE communication unit, a GPRS communication unit, a GPS communication unit, an RF communication unit, a 4G unit, a network port communication unit, and a CAN communication unit. The communication processing unit handles the signal transmission between each communication unit and the processing unit 113. For the circuit configuration of the communication processing unit, please refer to [reference needed]. Figure 12 The BLE communication unit meets the data communication requirements for BLE chip testing and networking. The RF communication unit, an RF433M / 315M unit, meets the wireless communication requirements. The 4G unit's network port communication unit enables remote testing, facilitating real-time monitoring of system operation status and remote control of related test items. The CAN communication unit forms a local area network between the function table and the gateway to better support different function acquisition requirements. The interface unit 112 includes a set of general-purpose extended I / O designs, which facilitate the expansion of other application interfaces. Multiple expansion methods can be formed by cascading the general-purpose extended I / O with the function conversion module 12. The processing unit 113 can be a microcontroller unit (MCU), with the main chip being an Arm-Cortex GD32F103RE chip. It uses an A724UG module to meet the data upload function in offline mode. The A724UG supports the 4G Cat.1 full-band, adapting to different operators and products. It features a direct SIM card and MicroUSB interface, rich built-in network protocols, and integrates multiple industrial standard interfaces. The storage unit 114 can be an SD card. The card is used to fulfill offline testing requirements, data storage, and offline configuration file saving; the indicator unit can be an indicator light, which can switch to different module status indicators through inter-module cascading communication.

[0074] The function adapter module 12 includes an adapter board 121, which connects to the network communication module 11 via a DIP20 connector. It features different power supply voltage outputs via a network port, supporting high-current power output from the system. It provides an external switching power supply interface (POWER), and the adapter board 121 also incorporates a physical network port design, compatible with the gateway module's expandable functionality (CAN Bus). It connects to the function acquisition module 13 via a communication interface. The function acquisition module 13 includes multiple function boards 131 for acquiring test information from each chip under test (DUT). It uses a DUT expansion board to perform functional tests on components of the DUT chip other than the RF module, such as digital or communication modules.

[0075] The aforementioned RF circuit testing system 10 uses an ARM MCU as the main control chip and employs a distributed hardware framework, separating the network communication module 11 from the function board 131. This facilitates convenient interface operation for using and maintaining the equipment's functions. To meet the measurement requirements of RF-related chip parameters, a multi-channel communication local area network is used to simultaneously satisfy the RF testing needs of different chips and functions. A universal extended function interface allows for switching only the function board 131 for different functions, eliminating the need for a complete circuit board redesign. This saves on the cost of testing different chip functions, reduces the testing time required for chip testing, minimizes the number of modifications required for various testing needs, and reduces the test item coverage, thereby helping to achieve rapid verification of chip designs.

[0076] In one embodiment, please refer to Figure 13 A method for testing radio frequency circuits is provided. The method includes steps S100 and S200.

[0077] Step S100: Generate a pre-test signal based on the test attributes of the chip under test, so as to control the network communication module 11 to generate a collection signal to obtain the test information of the chip under test.

[0078] Based on the test attributes of the chip under test, the appropriate firmware is selected for burning and downloading. A pre-test signal is generated and sent to the network communication module 11. The network communication module 11 generates a sampling signal based on the pre-test signal and transmits the sampling signal to the function acquisition module 13 via the function transfer module 12. The firmware is then downloaded to the chip under test according to a preset download method and a preset path by calling the download interface. The chip under test then...

[0079] Step S200: Receive and process test information to obtain the test results of the chip under test.

[0080] Receive test information, complete relevant test items based on the test information, and obtain test results. Optionally, automatically generate relevant test reports based on the test results.

[0081] The above-described RF circuit testing method generates a pre-test signal based on the pre-test attributes of the chip under test (TBT) and transmits it to the network communication module 11. Then, it generates an acquisition signal based on the pre-test signal and transmits it to the functional acquisition module 13 via the function transfer module 12. The functional acquisition module 13 acquires the test information of the TBT based on the acquisition signal. This test information, after passing through the function transfer module 12 and the network communication module 11, is transmitted to the processing module 14 for processing to obtain the test results of the TBT. The connection and signal transmission between these modules reduce testing time. Furthermore, the function transfer module 12 is configured to control the functional acquisition module 13 to acquire various test information from different TBT chips according to the testing requirements of different analog circuits, thereby obtaining corresponding test results based on the testing needs.

[0082] In one embodiment, such as Figure 14 Step S100, generating a pre-test signal based on the test attributes of the chip under test, to control the network communication module 11 to generate a collection signal to obtain the test information of the chip under test, including steps S110 to S120.

[0083] Step S110: Control the network communication module 11 to establish a communication request according to the test attributes of the chip under test.

[0084] Create a new test project or open an existing project according to the test attributes of the chip to be tested, configure test options, establish hardware device communication with network communication module 11, and network communication module 11 establishes a communication request.

[0085] Step S120: Generate a pre-test signal based on the communication connection response signal.

[0086] Specifically, such as Figure 15 The processing module 14 can be a host computer, the communication motherboard includes a network communication module 11, and the test sub-board includes a function acquisition block module. The host computer starts running, creating a new test project or opening an existing project according to the test attributes of the chip under test, configuring test options, and establishing hardware device communication with the communication motherboard. The communication motherboard initiates a communication request. After the host computer confirms a normal communication connection, it opens the corresponding database, configures the test project, and initiates communication with the test sub-board. The test sub-board then initiates a communication request, and the communication connection is established. The workflow of the test sub-board is as follows: Figure 16 As shown, the test daughterboard collects test information from the chip under test according to the test attributes, transmits the collected test information to the communication motherboard for processing and storage, and then uploads it to the host computer. The workflow of the communication motherboard is as follows: Figure 17 As shown, the host computer enters the test process based on the test information, generates test results after the test is completed, and generates a test report based on the test results. The test results and test information are then stored according to a preset format.

[0087] The above-described RF circuit testing method, based on the cooperation between the special functional pins of the internal circuit of the chip under test and the RF circuit testing system 10, acquires the test information of the chip under test and performs tests to obtain the test results through the network communication module 11, processing module 14, function conversion module 12, and function acquisition module 13 in the RF circuit testing system 10. This reduces the problems of long testing time, high testing complexity, and inconvenience in traditional solutions, and can lower the cost of verification after chip fabrication in practical use.

[0088] It should be understood that while the steps in the flowchart above are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order constraint on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowchart above may include multiple steps or stages, which are not necessarily completed at the same time, but may be executed at different times. The execution order of these steps or stages is not necessarily sequential, but may be performed alternately or in turn with other steps or at least some of the steps or stages in other steps.

[0089] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0090] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A radio frequency circuit test system, characterized by, A radio frequency circuit test system for testing radio frequency performance of a communication chip, the radio frequency circuit test system comprising: a network communication module configured to generate a collection signal according to a received pre-test signal; a function switching module connected to the network communication module and configured to transmit the collection signal; a function collection module connected to the function switching module and configured to receive the collection signal transmitted by the network communication module via the function switching module, obtain test information of a chip to be tested according to the collection signal, and transmit the test information to the network communication module via the function switching module; a processing module connected to the network communication module and configured to generate the pre-test signal according to test attributes of the chip to be tested, receive and process the test information to obtain a test result of the chip to be tested; the function switching module comprises: a switching board provided with a second communication interface for connecting to the network communication module and a third communication interface for connecting to the function collection module; a power supply circuit provided on the switching board and configured to provide a plurality of output voltages; a plurality of expansion interfaces, each of which is configured to connect to the network communication module and receive a pre-test signal of different types.

2. The radio frequency circuit test system of claim 1, wherein, The function collection module comprises a plurality of function boards, each of which is connected to the chip to be tested and configured to obtain test information of the chip to be tested.

3. The radio frequency circuit test system of claim 2, wherein, Each of the function boards is provided with a first communication interface for connecting to the function switching module, and the function boards are cascaded.

4. The radio frequency circuit test system of claim 1, wherein, The network communication module comprises: at least one communication unit, each of which is in communication connection with the processing module; an interface unit connected to the function switching module.

5. The radio frequency circuit test system of claim 4, wherein, The network communication module further comprises: a processing unit connected to each of the communication units and the interface unit, configured to control communication between each of the communication units and the processing module, and receive the test information and the test result; a storage unit connected to the communication units and configured to store the test information and the test result.

6. The radio frequency circuit test system of claim 5, wherein, The network communication module further comprises: a prompt unit connected to the processing unit, and the prompt unit is configured with a plurality of indication states; wherein the processing unit is further configured to control the indication state of the prompt unit according to a connection mode between the interface unit and the function switching module and a connection mode between the communication unit and the processing module.

7. A method of testing a radio frequency circuit, characterized by, A method for controlling the radio frequency circuit test system of any one of claims 1-6, the method comprising: generating a pre-test signal according to test attributes of a chip to be tested to control the network communication module to generate a collection signal to obtain test information of the chip to be tested; receiving and processing the test information to obtain a test result of the chip to be tested.

8. The method of claim 7, wherein, The method of generating a pre-test signal according to test attributes of a chip to be tested to control the network communication module to generate a collection signal to obtain test information of the chip to be tested comprises: controlling the network communication module to establish a communication request according to the test attributes of the chip to be tested; generating a pre-test signal according to a communication connection response signal.

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