A mobile terminal

Abstract

This application provides a mobile terminal, comprising: a housing, with a motherboard, a flexible circuit board, and a small board sequentially connected inside; the motherboard including a first daughter board and a frame board; a first interface on one side of the frame board, the first interface including multiple pins; the first daughter board being soldered to the frame board through the first interface; a signal multiplexer, disposed on the motherboard, for multiplexing multiple digital signals to be transmitted from the motherboard, and sending the multiplexed digital signals to the small board through the flexible circuit board; and a signal demultiplexer, disposed on the small board, for demultiplexing and outputting the multiplexed digital signals. This application, by using a signal multiplexer to multiplex multiple digital signals before transmission through the flexible circuit board, reduces the size of the flexible circuit board, effectively optimizing the internal structure of the mobile terminal.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and in particular to a mobile terminal. Background Technology

[0002] With the development of technology, smartphones, tablets, and other smart mobile terminals have rapidly become widespread, greatly promoting social development and making people's lives more convenient. Due to the portability requirements of mobile terminals, internal space is very limited. People have been working hard to realize more functions within this limited space to bring users a better experience. As a result, more and more functional components are being integrated into the internal components of mobile terminals.

[0003] Current designs often employ a three-section architecture to minimize the overall thickness of mobile phones. This involves placing the motherboard above the battery and a smaller board below it, connected by a flexible printed circuit (FPC). Multiple functional components on the smaller board communicate with the processor on the motherboard via the FPC. However, as mobile terminals include more and more functional components, the required FPC becomes increasingly thicker, occupying more internal space and limiting the internal structural design and layout. This also hinders miniaturization and thinner designs. Summary of the Invention

[0004] This application provides a mobile terminal that uses a signal multiplexer to multiplex multiple digital signals before transmitting them through a flexible circuit board, thereby reducing the size of the flexible circuit board and effectively optimizing the internal structure of the mobile terminal.

[0005] In a first aspect, a mobile terminal is provided, including a housing, and internally disposed a motherboard, a flexible circuit board, and a small board connected in sequence. The motherboard includes a first sub-board and a frame board. A first interface is provided on one side of the frame board, and the first interface includes multiple pins. The first sub-board is soldered to the frame board through the first interface. A signal multiplexer is disposed on the motherboard for multiplexing multiple digital signals to be transmitted from the motherboard and sending the multiplexed digital signals to the small board through the flexible circuit board. A signal demultiplexer is disposed on the small board for demultiplexing and outputting the multiplexed digital signals.

[0006] According to the mobile terminal provided in the embodiments of this application, a signal multiplexer is set on the motherboard and a signal demultiplexer is set on the small board. The two signal processors are used in conjunction with each other. The signal multiplexer located on the motherboard (i.e. the signal input end) multiplexes the multiple digital signals to be transmitted and then sends them to the small board through the flexible circuit board. The signal demultiplexer located on the small board (i.e. the signal output end) demultiplexes the multiplexed signals and then transmits them to the corresponding signal receiver. Thus, the normal transmission of multiple digital signals will not be affected.

[0007] Building upon this foundation, the mobile terminal provided in this application employs multiplexing technology to combine multiple digital signals onto a single physical channel for transmission. This effectively utilizes communication lines and reduces the number of physical channels required for signal transmission. Since these physical channels are located on a flexible circuit board, the number of channels is directly proportional to the size of the flexible circuit board. Therefore, reducing the number of physical channels also reduces the size of the flexible circuit board (e.g., width and / or thickness). This expands the space for arranging other components within the mobile terminal, effectively optimizing its internal structure, reducing the difficulty of internal structural design and layout, and facilitating miniaturization and thinner design, thus improving the user experience. Furthermore, the smaller size of the flexible circuit board allows for an increase in battery capacity, enhancing the mobile terminal's battery life.

[0008] Optionally, the signal multiplexer and signal demultiplexer can be signal processing circuits or signal processing chips, such as field programmable gate array (FPGA) circuits.

[0009] Optionally, the small board may be equipped with functional components such as a microphone, speaker, charging port, USB port, SIM card port, radio frequency port or antenna contacts.

[0010] Alternatively, the flexible circuit board can be electrically connected to the motherboard and / or sub-board via a soldering process.

[0011] Optionally, the flexible circuit board is electrically connected to the motherboard and / or sub-board via connectors.

[0012] For example, the connector can be a zero insertion force (ZIF) connector or a board to board (BTB) connector.

[0013] Optionally, the battery is located in the battery compartment between the motherboard and the sub-board. The battery is an energy storage device that provides power to the mobile terminal, and it typically consists of three parts: battery cells, protection circuitry, and a casing. The battery can be a lithium battery, nickel-metal hydride battery, or sodium-ion battery, etc.

[0014] In one possible design, the signal multiplexer is located on the first sub-board, and the flexible circuit board is connected to the frame board.

[0015] In this embodiment, by placing the signal multiplexer on the first daughter board, multiple signals can be multiplexed before being transmitted to the frame board through the first interface. This reduces the number of pins required for the first interface. With the number of pins reduced, the area of ​​the frame board required is also reduced, which helps to reduce the size of the frame board. The internal structure of the mobile terminal is further optimized, and the capacity of the battery is also increased.

[0016] Optionally, the signal multiplexer can be installed as a separate component on the motherboard, or it can be integrated with other components (such as chips or processors) as a module of the integrated device. This application does not limit this. For example, the signal multiplexer can be integrated with a SOC chip, in which case the signal multiplexer can also serve as a processing module of the new chip.

[0017] Similarly, the signal demultiplexer can be set as a separate component on a small board, or it can be integrated with other components (such as chips or processors) as a module of the integrated device. This application does not limit this.

[0018] In one possible design, the frame board is further provided with a first spare interface, which includes multiple pins and is used to solder a first spare sub-board to replace the first sub-board.

[0019] This application enables the frame board to be used with either the first daughter board or the first backup daughter board by setting a first backup interface on the frame board. This improves the adaptability of the frame board, allowing mobile terminal manufacturers to freely choose to use either the first daughter board or the first backup daughter board based on material availability. This eliminates the need to redevelop a frame board adapted to the first backup daughter board when the first daughter board is in short supply, thus ensuring the continuity of production and market launch for the product.

[0020] In one possible design, the first interface shares some pins with the first spare interface.

[0021] The above settings can reduce the number of pins required, which helps to reduce the size of the frame board, minimize the adverse effects on the internal structure of the mobile terminal caused by setting the first backup interface, and minimize the impact on the battery capacity.

[0022] In one possible design, the signal demultiplexer is also used to multiplex the multiple digital signals to be transmitted on the small board, and send the multiplexed digital signals to the motherboard through the flexible circuit board; the signal demultiplexer is also used to demultiplex the multiplexed digital signals and output them.

[0023] In other words, the signal multiplexer has the ability to both multiplex and demultiplex the signal, and the signal demultiplexer also has the ability to both multiplex and demultiplex the signal. The flexible circuit board can transmit digital signals in both directions. In any transmission direction, multiplexing technology is used to combine multiple digital signals and transmit them on a single physical channel. This can further reduce the number of physical channels required for signal transmission, that is, further reduce the size of the flexible circuit board and further optimize the internal structure of the mobile terminal.

[0024] Optionally, all signals that need to be transmitted between the motherboard and the small board can be realized through this flexible circuit board without the need for other circuit boards. For example, the flexible board that was originally set between the battery and the middle frame can be removed, and only this flexible circuit board can be retained. This flexible circuit board can be set between the battery and the back cover.

[0025] In one possible design, the housing includes a back cover, a battery is disposed between the main board and the small board, and the flexible circuit board is located between the battery and the back cover.

[0026] In one possible design, the motherboard further includes a second daughterboard, and a second interface is provided on the other side of the frame board. The second interface includes multiple pins, and the second daughterboard is soldered to the frame board through the second interface.

[0027] In one possible design, the frame board is also provided with a second spare interface, which includes multiple pins. The second spare interface is used to solder a second spare sub-board to replace the second sub-board, and the second interface shares some pins with the second spare interface.

[0028] In one possible design, the first sub-board is a SOC board and the second sub-board is an RF board.

[0029] In one possible design, the frame plate has one or more electronic components. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall structure of the mobile terminal provided in the embodiments of this application.

[0031] Figure 2 yes Figure 1 The image shows a cross-sectional view of the mobile terminal from the AA perspective.

[0032] Figure 3 This is a rear view of the mobile terminal after the cover has been removed, as provided in the embodiments of this application.

[0033] Figure 4 This is a schematic diagram of the overall structure of the motherboard of the mobile terminal provided in this application embodiment.

[0034] Figure 5 yes Figure 4 The diagram shown is an exploded view of the motherboard.

[0035] Figure 6 yes Figure 4 The diagram shows a cross-sectional view of the motherboard from the bottom-up (BB) perspective.

[0036] Figure 7 yes Figure 4 Top view of the frame panel.

[0037] Figure 8 This is a cross-sectional view of another example of the motherboard of the mobile terminal provided in the embodiments of this application.

[0038] Figure 9 This is a schematic diagram illustrating the signal flow between the motherboard and the small board.

[0039] Figure label:

[0040] 100. Housing; 110. Frame; 120. Back cover;

[0041] 200. Display screen;

[0042] 300, Mid-frame;

[0043] 400, Mainboard; 410, First Daughter Board; 411, SOC Chip; 412, First Electronic Component; 413, Signal Multiplexer; 420, Frame Board; 421, Third Interface; 422, Third Electronic Component; 423, First Interface; 424, First Backup Interface; 425, Second Interface; 426, Second Backup Interface; 427, Pin; 430, Second Daughter Board; 431, RF Chip; 432, Second Electronic Component; 433, Fourth Interface; 440, Solder Ball; 410', First Backup Daughter Board; 411', Backup SOC Chip; 412', First Backup Electronic Component; 413', Backup Signal Multiplexer; 430', Second Backup Daughter Board; 431', Backup RF Chip; 432', Second Backup Electronic Component;

[0044] 500, storage battery;

[0045] 600, Small board; 610, Signal demultiplexer; 620, Fifth interface; 630, First functional element; 640, Second functional element;

[0046] 700. Flexible circuit board. Detailed Implementation

[0047] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0048] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0049] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between the components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0050] In the description of this application, it should be understood that the terms "upper", "lower", "side", "front", "rear", etc., indicate the orientation or positional relationship based on the installation orientation or positional relationship, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0051] In the description of this application, it should be noted that the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0052] It should also be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or component as an example. It should be understood that the reference numerals are also applicable to other identical parts or components.

[0053] This application provides a mobile terminal that uses a signal multiplexer on the motherboard to first multiplex multiple digital signals to be transmitted according to a specific format (aggregation and compression). These signals are then transmitted to a smaller board via a flexible circuit board. A signal demultiplexer on the smaller board then demultiplexes the signals according to a corresponding rule (expansion and dispersion). The mobile terminal provided by this application reduces the size of the flexible circuit board without affecting normal signal transmission, effectively optimizing the internal structure of the mobile terminal. This reduces the difficulty of internal structural design and layout, and facilitates miniaturization and thinning of the mobile terminal, thereby improving the user experience.

[0054] The mobile terminal provided in this application is a portable electronic device that has at least one of the following functions: voice and telephone calling function, information input and / or output function, and data storage function. For example, it can be any electronic device such as a mobile phone, tablet computer, e-reader, laptop computer, in-vehicle device, or wearable device, and can also be a foldable device, such as a foldable mobile phone, but is not limited thereto. The specific structure of the mobile terminal provided in this application embodiment will be described below using a mobile phone as an example.

[0055] Figure 1 This is a schematic diagram of the overall structure of the mobile terminal provided in the embodiments of this application. Figure 2 yes Figure 1 The image shows a cross-sectional view of the mobile terminal from the AA perspective. Figure 3 This is a rear view of the mobile terminal after the cover has been removed, as provided in the embodiments of this application. Figures 1-3 As shown, the mobile terminal provided in this application embodiment includes a housing 100 and a display screen 200, with the display screen 200 mounted on the housing 100.

[0056] The housing 100 forms the shape of the mobile terminal. The housing 100 can be a metal housing, such as magnesium alloy, aluminum alloy, or stainless steel. Alternatively, it can be a plastic housing, glass housing, ceramic housing, etc., but is not limited to these. The housing 100 has an internal mounting cavity where various electronic components are installed. Figure 3 (not shown in the image), including, but not limited to, circuit boards, processors mounted on the circuit boards, batteries, and various peripherals such as cameras, flashlights, microphones, and speakers.

[0057] The mobile terminal may also include a display screen 200 disposed on the housing 100. The display screen 200 serves as the front panel of the mobile terminal and forms the aforementioned mounting cavity with the housing 100. The display screen 200 constitutes the display surface of the mobile terminal, used to display images, text, and other information, and to provide information interaction. The display screen 200 may be a light-emitting diode (LED) display screen, a liquid crystal display (LCD) display screen, or an organic light-emitting diode (OLED) display screen, but is not limited to these.

[0058] The display screen 200 can also be a flexible screen (foldable screen) with bending characteristics, in which case the mobile terminal can be a foldable terminal device. This flexible screen can be, for example, an OLED display, an active-matrix organic light-emitting diode (AMOLED) display, a mini organic light-emitting diode (MLED) display, a micro organic light-emitting diode (MOLED) display, a quantum dot light-emitting diode (QLED) display, etc., but is not limited to these.

[0059] like Figures 1-3 As shown, the housing 100 includes a frame 110 and a rear cover 120. The rear cover 120 is fixedly connected to the rear end face of the frame 110, and the display screen 200 is fixedly connected to the front end face of the frame 110. The housing 100 also includes a middle frame 300, which is connected to the frame 110. The display screen 200 is fixedly attached to the front side of the middle frame 300. The rear side of the middle frame 300 and the rear cover 120 accommodate components such as the motherboard 400, the battery 500, and the small board 600.

[0060] Specifically, the interior of the housing 100 also includes a main board 400, a battery 500, and a small board 600 arranged sequentially from top to bottom to form a traditional three-section design architecture. The main board 400 and the small board 600 are electrically connected through a flexible printed circuit (FPC) 700, which is stacked on top of the battery 500.

[0061] The motherboard 400 is a crucial component of the mobile terminal, housing various devices that make up the terminal's circuitry. For example, the motherboard 400 contains the mobile terminal's main circuitry, processor, chips, capacitors, resistors, inductors, interfaces, and plug-ins.

[0062] For example, the motherboard 400 may be equipped with a system-on-a-chip (SOC) chip, a power management unit (PMU) chip, or an RF chip. In addition, the motherboard 400 is usually equipped with various processors such as a central processing unit (CPU), various application processors (AP), graphics processing unit (GPU), or image signal processor (ISP), but is not limited to these.

[0063] The storage battery 500 is located in the battery compartment between the main board 400 and the sub-board 600. The storage battery 500 is an energy storage tool that provides power to the mobile terminal, and it is usually composed of three parts: battery cells, protection circuits, and a casing. The storage battery 500 can be a lithium battery, a nickel-metal hydride battery, or a sodium-ion battery, etc.

[0064] The small board 600 is located at the bottom of the mobile terminal. The small board 600 usually has functional components such as microphone, speaker, charging interface, USB interface, SIM card interface, radio frequency interface or antenna contacts.

[0065] The motherboard 400 and the small board 600 are communicatively connected via a flexible circuit board 700. In one embodiment, the flexible circuit board 700 can be attached to the outer surface of the battery 500 and clamped between the battery 500 and the mid-frame 300 of the mobile terminal. In another embodiment, the flexible circuit board 700 is clamped between the battery 500 and the back cover 120 of the mobile terminal.

[0066] Optionally, the flexible circuit board 700 can be electrically connected to the main board 400 and / or the small board 600 via a soldering process.

[0067] Optionally, the flexible circuit board 700 is electrically connected to the main board 400 and / or the small board 600 via a connector.

[0068] For example, the connector can be a zero insertion force (ZIF) connector or a board to board (BTB) connector.

[0069] like Figure 3As shown, the mobile terminal provided in this application also includes a signal multiplexer 413 and a signal demultiplexer 610 used in conjunction with each other. The signal multiplexer 413 and the signal demultiplexer 610 are capable of processing multiple digital signals transmitted by the flexible circuit board 700.

[0070] Specifically, the signal multiplexer 413 is located on the main board 400, and the signal demultiplexer 610 is located on the small board 600. The signal multiplexer 413 is located at the signal input terminal (upstream end) of the flexible circuit board 700, and the signal demultiplexer 610 is located at the signal output terminal (downstream end) of the flexible circuit board 700. The signal multiplexer 413 is used to multiplex (aggregate and compress) multiple digital signals, and the signal demultiplexer 610 is used to demultiplex (decompose and restore) the multiplexed digital signals. Here, the signal multiplexer 413 and the signal demultiplexer 610 can be signal processing circuits or signal processing chips, such as field programmable gate array (FPGA) circuits.

[0071] Signal multiplexer 413 is used to multiplex (also known as convergence, aggregation, or combining) multiple digital signals to be transmitted from motherboard 400, and sends the multiplexed digital signals to small board 600 via flexible circuit board 700. Signal demultiplexer 610 is used in conjunction with signal multiplexer 413, and their processing logic is completely opposite. Signal demultiplexer 610 is used to demultiplex (also known as recovery, restoration, decomposition, or splitting) the multiplexed digital signals and output them.

[0072] Here, the signal multiplexer 413 can multiplex multiple digital signals according to preset logic. For example, it can multiplex multiple digital signals into one signal and then transmit it through the flexible circuit board 700 to the signal demultiplexer 610 on the small board 600. The signal demultiplexer 610 restores the multiple digital signals according to the corresponding logic and distributes them to the signal receiver, which may be, for example, multiple functional elements set on the small board 600. Therefore, the sender of the multiple signals can come from the processor on the main board 400, which is used to control the operation of the functional elements on the small board 600.

[0073] According to the mobile terminal provided in the embodiments of this application, by setting a signal multiplexer 413 on the motherboard 400 and a signal demultiplexer 610 on the small board 600, the two signal processors are used in conjunction with each other. The signal multiplexer 413 located on the motherboard 400 (i.e. the signal input end) multiplexes the multiple digital signals to be transmitted and then sends them to the small board 600 through the flexible circuit board 700. The signal demultiplexer 610 located on the small board 600 (i.e. the signal output end) demultiplexes the multiplexed signal and then transmits it to the corresponding signal receiver, thereby not affecting the normal transmission of multiple digital signals.

[0074] Building upon this foundation, the mobile terminal provided in this application employs multiplexing technology to combine multiple digital signals onto a single physical channel for transmission. This effectively utilizes communication lines and reduces the number of physical channels required for signal transmission. These physical channels are located on the flexible circuit board 700, and the number of physical channels is directly proportional to the size of the flexible circuit board 700. Therefore, reducing the number of physical channels also reduces the size (e.g., width and / or thickness) of the flexible circuit board 700. This expands the space for arranging other components within the mobile terminal, effectively optimizing its internal structure, reducing the difficulty of internal structural design and layout, and facilitating miniaturization and thinner design, thus improving the user experience. Furthermore, the smaller size of the flexible circuit board 700 allows for an increase in battery capacity, enhancing the mobile terminal's battery life.

[0075] Furthermore, in this embodiment, the signal demultiplexer 610 is also used to multiplex the multiple digital signals to be transmitted from the small board 600, and send the multiplexed digital signals to the main board 400 through the flexible circuit board 700. The signal demultiplexer 413 is also used to demultiplex the multiplexed digital signals and output them. At this time, the multiple digital signals sent from the small board 600 to the main board 400 can also be aggregated and compressed before being sent through the flexible circuit board 700, and then decomposed and restored.

[0076] In other words, the signal multiplexer 413 has the ability to both multiplex and demultiplex the signal, and the signal demultiplexer 610 also has the ability to both multiplex and demultiplex the signal. The flexible circuit board 700 can perform bidirectional transmission of digital signals. In any transmission direction, multiplexing technology is used to combine multiple digital signals and transmit them on a single physical channel. This can further reduce the number of physical channels required for signal transmission, that is, further reduce the size of the flexible circuit board 700 and further optimize the internal structure of the mobile terminal.

[0077] At this time, all signals that need to be transmitted between the main board 400 and the small board 600 can be realized through the flexible circuit board 700 without the need to set up other circuit boards. For example, the flexible board originally set between the battery 500 and the middle frame 300 can be removed, and only the flexible circuit board 700 is retained. The flexible circuit board 700 can be set between the battery 500 and the back cover 120.

[0078] The specific structure of the mobile terminal provided in the embodiments of this application will be further described below with reference to the accompanying drawings. Figure 4 This is a schematic diagram of the overall structure of the motherboard 400 of the mobile terminal provided in this application embodiment. Figure 5 yes Figure 4 The diagram shown is an exploded view of the motherboard 400. Figure 6 yes Figure 4 The diagram shows a cross-sectional view of the motherboard 400 from the BB perspective. Figure 7 yes Figure 4 Top view of frame plate 420 in the middle.

[0079] like Figures 4-6 As shown, the motherboard 400 includes a first sub-board 410, a frame board 420, and a second sub-board 430 stacked sequentially to form a "sandwich" structure. The first sub-board 410, the frame board 420, and the second sub-board 430 correspond to the upper, middle connecting, and lower layers of the "sandwich" structure, respectively. The frame board 420 is designed as a ring structure with a hollowed-out interior. The frame board 420 provides support for the first sub-board 410 and the second sub-board 430, and together they form a closed arrangement space for arranging (accommodating) various electronic components.

[0080] Taking into account factors such as the size, shape, and board layout of each electronic component, multiple electronic components can be arranged together on the first sub-board 410, the frame board 420, or the second sub-board 430, such as... Figures 3-6 As shown, the first sub-board 410 may be equipped with an SOC chip 411, and the second sub-board 430 may be equipped with an RF chip 431. In this case, the first sub-board 410 may be referred to as an SOC board, and the second sub-board 430 may be referred to as an RF board.

[0081] Optionally, the SOC chip 411 and / or the RF chip 431 can be disposed within the placement space.

[0082] Optionally, the SOC chip 411 may also be disposed on the outer surface of the first daughter board 410 (the surface facing away from the space of the ornament), and / or the RF chip 431 may also be disposed on the outer surface of the second daughter board 430.

[0083] Optionally, such as Figures 3-7As shown, other electronic components may also be provided on the first sub-board 410 and the second sub-board 430. For example, a first electronic component 412 may be provided on any surface of the first sub-board 410, and a second electronic component 432 may be provided on any surface of the second sub-board 430.

[0084] Optionally, the frame plate 420 may also be provided with at least one electronic component, for example, a third electronic component 422 may be provided on either side of the plate.

[0085] Optionally, the first electronic component 412, the second electronic component 432, and the third electronic component 422 can be any one of the following electronic components: various circuits, functional components (such as cameras, sensors, etc.), processors, chips, memory, capacitors, resistors, inductors, interfaces, and plugs, but are not limited to these.

[0086] like Figures 5-7 As shown, a first interface 423 is provided on one side of the frame plate 420 (i.e., the upper surface in the figure). The first sub-plate 410 is welded to the frame plate 420 through the first interface 423, thereby realizing the electrical conduction between the two.

[0087] Specifically, the first interface 423 is composed of multiple pins 427. Pins are also commonly referred to as solder feet, so the first interface 423 can also be referred to as a solder pad. The first daughter board 410 is also provided with a corresponding interface (solder pad) at the corresponding position, so that the first daughter board 410 can be soldered to the frame board 420 through solder balls 440 and the first interface 423 to achieve signal conduction.

[0088] like Figures 5-7 As shown, pin 427 is used to transmit digital signals. Since there are many digital signals to be transmitted, the number of pins 427 is also large (e.g., more than 100). Therefore, multiple pins 427 can be arranged around the circumference of the frame board 420 at intervals, and multiple circles can be arranged. The first daughter board 410 is soldered to the pins 427 by solder balls 440. Here, solder balls can also be called solder joints. Adjacent solder balls 440 are isolated from each other. Solder balls 440 can be, for example, tin-plated, nickel-plated, gold-plated, organic solderability preservatives (OSP), electroless nickel immersion gold (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG), etc., but are not limited to these.

[0089] like Figures 3-6As shown, the signal multiplexer 413 is disposed on the first daughter board 410, and the frame board 420 is provided with a third interface 421. The third interface 421 can be a solder pad, or a male or female end of a connector. The flexible circuit board 700 is connected to the frame board 420 through the third interface 421.

[0090] In this embodiment, by placing the signal multiplexer 413 on the first daughter board 410, multiple signals can be multiplexed before being transmitted to the frame board 420 through the first interface 423. This reduces the number of pins 427 required for the first interface 423. With the number of pins 427 reduced, the area of ​​the frame board 420 required is also reduced, which helps to reduce the size of the frame board 420. The internal structure of the mobile terminal is further optimized, and the capacity of the battery 500 is increased.

[0091] Optionally, the signal multiplexer 413 can be installed as a separate component on the motherboard 400, or it can be integrated with other components (such as chips or processors) as a module of the integrated device. This application does not limit this. For example, the signal multiplexer 413 can be integrated with the SOC chip 411, in which case the signal multiplexer 413 can serve as a processing module of the new SOC chip.

[0092] Similarly, the signal demultiplexer 610 can be set as a separate component on the small board 600, or it can be integrated with other components (such as chips or processors) as a module of the integrated device. This application does not limit this.

[0093] Figure 9 This is a schematic diagram illustrating the signal flow between the motherboard 400 and the small board 600. (For example...) Figure 9 As shown, the multiple digital signals generated by the SOC chip 411 and other components on the first character board 410 are first multiplexed by the signal multiplexer 413, then transmitted to the frame board 420 through the first interface 423, and then transmitted to the flexible circuit board 700 through the third interface 421 on the frame board 420. After that, they are transmitted to the signal demultiplexer 610 through the fifth interface 620 on the small board 600. The signal demultiplexer 610 demultiplexes the multiplexed digital signals and outputs them to multiple functional elements on the small board 600, such as the first functional element 630 and the second functional element 640.

[0094] Similarly, the multiple digital signals generated by the first functional element 630, the second functional element 640, and other components are first multiplexed by the signal demultiplexer 610, and then transmitted to the flexible circuit board 700 through the fifth interface 620. After that, they are transmitted to the signal multiplexer 413 through the third interface 421 and the first interface 423 on the frame board 420. The signal multiplexer 413 demultiplexes the multiplexed digital signals and outputs them to the SOC chip 411 and other components.

[0095] like Figure 5 , Figure 6 As shown in the embodiment of this application, a second interface 425 is provided on the other side of the frame plate 420 (i.e., the lower surface in the figure). The second sub-board 430 is welded to the frame plate 420 through the second interface 425, thereby realizing the electrical conduction between the two.

[0096] Specifically, the second interface 425 also includes multiple pins 427, and the second daughter board 430 is provided with a fourth interface 433 at the corresponding position. The fourth interface 433 also includes multiple pins, which are configured one-to-one with the multiple pins 427 of the second interface 425, so that the second daughter board 430 can be soldered to the frame board 420 through the fourth interface 433, solder balls 440, and the second interface 425 to achieve signal conduction.

[0097] Figure 8 This is a cross-sectional view of another example of the motherboard 400 of the mobile terminal provided in this application embodiment. Figures 5-8 As shown in this embodiment, the frame board 420 is further provided with a first spare interface 424. The first spare interface 424 and the first interface 423 are located on the same side and are arranged adjacent to each other. The first spare interface 424 includes a plurality of pins 427. The first spare interface 424 is used to solder a first spare daughter board 410' to replace the first daughter board 410.

[0098] like Figure 8 As shown, the first spare daughter board 410' has the same function as the first daughter board 410 and can be used to replace the first daughter board 410. The first spare daughter board 410' is provided with a spare SOC chip 411', and the first spare daughter board 410' can also be referred to as a spare SOC board.

[0099] The backup SOC chip 411' has the same function as the SOC chip 411, but may be manufactured by different manufacturers or have different models, which may result in different types and / or quantities of signals sent by the two chips. As a result, the first backup daughter board 410' cannot achieve electrical connection with the frame board 420 through the first interface 423.

[0100] This embodiment of the application provides a first spare interface 424 on the frame board 420 that is compatible with the first spare sub-board 410', enabling the frame board 420 to be used with either the first sub-board 410 or the first spare sub-board 410'. This improves the adaptability of the frame board 420, allowing mobile terminal manufacturers to freely choose to use either the first sub-board 410 or the first spare sub-board 410' based on available materials, without needing to redevelop a frame board compatible with the first spare sub-board 410' when the first sub-board 410 is in short supply. This ensures the continuity of production and market launch for the product.

[0101] It should be understood that the first daughter board 410 and the first spare daughter board 410' are respectively provided with multiple electronic components. For example, the first spare daughter board 410' is also provided with a first spare electronic component 412', a spare signal multiplexer 413', etc. Most of the multiple electronic components on the first daughter board 410 and the first spare daughter board 410' may be of the same model, with only a few one or a few different models. For example, the first spare electronic component 412' may be exactly the same as the first electronic component 412, and the spare signal multiplexer 413' may be different from the signal multiplexer 413. They are exactly the same, except that the spare SOC chip 411' is different from the SOC chip 411 (e.g., produced by different suppliers). Considering that there may be a shortage of materials for the SOC chip 411, a first spare daughter board 410' for the SOC chip 411' was developed. Furthermore, a first spare interface 424 adapted to the first spare daughter board 410' (i.e., the SOC chip 411') was developed on the frame board 420. This allows the frame board 420 to be used freely with either the first daughter board 410 or the first spare daughter board 410'.

[0102] It is worth mentioning that the electronic components on the first daughter board 410 and the first spare daughter board 410' can be various processors or chips, etc. In other words, there may be a shortage of other components such as processors or chips. The first spare daughter board 410' can be developed for different types of processors or chips, and a first spare interface 424 that is compatible with each other can be set on the frame board 420. This application does not limit this.

[0103] like Figures 5-8 As shown, some pins 427 of the first interface 423 and the first spare interface 424 are shared. That is, some pins 427 belong to both the first interface 423 and the first spare interface 424. For example, Figures 5-8The upper surface of the middle frame plate 420 has three rings of pins 427. The outer two rings of pins 427 constitute the first interface 423, and the inner two rings of pins 427 constitute the first spare interface 424. At this time, the first interface 423 and the first spare interface 424 share the middle ring of pins 427. This application can reduce the number of pins 427 required by the above arrangement, which is beneficial to reducing the size of the frame plate 420, minimizing the adverse effects on the internal structure of the mobile terminal caused by the setting of the first spare interface 424, and minimizing the impact on the capacity of the battery 500.

[0104] Furthermore, such as Figures 5-8 As shown in the embodiment of this application, the frame board 420 is also provided with a second spare interface 426. The second spare interface 426 and the second interface 425 are located on the same side and are arranged adjacent to each other. The second spare interface 426 includes a plurality of pins 427. The second spare interface 426 is used to solder a second spare sub-board 430' to replace the second sub-board 430.

[0105] Similarly, the second backup daughterboard 430' has the same function as the second daughterboard 430 and can be used to replace the second daughterboard 430. The second backup daughterboard 430' is provided with a backup RF chip 431' and a second backup electronic component 432'. The backup RF chip 431' is a different model from the RF chip 431, while the second backup electronic component 432' is the same model as the second electronic component 432. The second backup daughterboard 430' can also be referred to as a backup RF board.

[0106] The backup RF chip 431' has the same function as the RF chip 431, but the types and / or quantities of signals they transmit may be different, which makes it impossible for the second backup daughter board 430' to achieve electrical connection with the frame board 420 through the second interface 425.

[0107] This embodiment of the application provides a second spare interface 426 on the frame board 420 that is compatible with the second spare sub-board 430', which enables the frame board 420 to be used in any combination with the second sub-board 430 or the second spare sub-board 430', thereby improving the adaptability of the frame board 420.

[0108] Similarly, some pins 427 of the second interface 425 and the second spare interface 426 are shared; that is, some pins 427 belong to both the second interface 425 and the second spare interface 426. For example, Figure 6 , Figure 8The lower surface of the middle frame plate 420 has three rings of pins 427. The outer two rings of pins 427 constitute the second interface 425, and the inner two rings of pins 427 constitute the second spare interface 426. At this time, the second interface 425 and the second spare interface 426 share the middle ring of pins 427. This application can reduce the number of pins 427 required by the above arrangement, which is beneficial to reducing the size of the frame plate 420, minimizing the adverse effects on the internal structure of the mobile terminal caused by the second spare interface 426, and minimizing the impact on the capacity of the battery 500.

[0109] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A mobile terminal, characterized in that, include: The housing (100) has a main board (400), a flexible circuit board (700) and a small board (600) connected in sequence inside. The main board (400) includes a first sub-board (410) and a frame board (420). A first interface (423) is provided on one side of the frame board (420). The first interface (423) includes multiple pins. The first sub-board (410) is soldered to the frame board (420) through the first interface (423). A signal multiplexer (413) is disposed on the motherboard (400) and is used to multiplex multiple digital signals to be transmitted on the motherboard (400) and send the multiplexed digital signals to the small board (600) through the flexible circuit board (700). A signal demultiplexer (610) is provided on the small board (600) and is used to demultiplex the multiplexed digital signal and output it. The signal multiplexer (413) is located on the first sub-board (410) to multiplex multiple signals and then transmit them to the frame board (420) through the first interface (423); the frame board (420) is provided with a third interface (421), and the flexible circuit board (700) is connected to the frame board (420) through the third interface (421).

2. The mobile terminal according to claim 1, characterized in that, The frame board (420) is also provided with a first spare interface (424), which includes multiple pins and is used to solder a first spare sub-board (410') to replace the first sub-board (410).

3. The mobile terminal according to claim 2, characterized in that, The first interface (423) shares some pins with the first spare interface (424).

4. The mobile terminal according to any one of claims 1-3, characterized in that, The signal demultiplexer (610) is also used to multiplex the multiple digital signals to be transmitted on the small board (600) and send the multiplexed digital signals to the main board (400) through the flexible circuit board (700); the signal demultiplexer (413) is also used to demultiplex the multiplexed digital signals and output them.

5. The mobile terminal according to any one of claims 1-4, characterized in that, The housing (100) includes a rear cover (120), and a battery (500) is provided between the main board (400) and the small board (600). The flexible circuit board (700) is located between the battery (500) and the rear cover (120).

6. The mobile terminal according to any one of claims 1-5, characterized in that, The motherboard (400) also includes a second subboard (430). A second interface (425) is provided on the other side of the frame board (420). The second interface (425) includes multiple pins. The second subboard (430) is soldered to the frame board (420) through the second interface (425).

7. The mobile terminal according to claim 6, characterized in that, The frame board (420) is also provided with a second spare interface (426). The second spare interface (426) includes multiple pins. The second spare interface (426) is used to solder a second spare sub-board (430') to replace the second sub-board (430). The second interface (425) shares some pins with the second spare interface (426).

8. The mobile terminal according to claim 6 or 7, characterized in that, The first sub-board (410) is a SOC board, and the second sub-board (430) is a radio frequency board.

9. The mobile terminal according to any one of claims 1-8, characterized in that, The frame plate (420) has one or more electronic components.

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