A method of packaging a MEMS pressure sensor

Abstract

The application relates to the field of micro electro mechanical system, in particular to a MEMS pressure sensor packaging method, which comprises the following steps: S1, providing a MEMS chip, an ASIC chip and a PCB board containing multiple units; S2, bonding the ASIC chip on each unit of the PCB board, and electrically connecting the ASIC chip on each unit with the unit of the PCB board; S3, setting a dam on each unit, and cutting and separating the units on the PCB board to form independent units each with a dam; S4, bonding and fixing the MEMS chip in a cavity surrounded by the dam through glue, and electrically connecting the MEMS chip with the ASIC chip; and S5, fixing an upper cover with a pressure relief hole on the dam to complete the packaging. The application realizes product high integration and product miniaturization.

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