Wavelength conversion module and its manufacturing method

Abstract

A wavelength conversion module and its manufacturing method are disclosed. The wavelength conversion module includes a wavelength conversion substrate, a driving component, and a polymer adhesive ring. The driving component is connected to the wavelength conversion substrate to drive the wavelength conversion substrate to rotate around the axis of the driving component. The polymer adhesive ring is disposed on the wavelength conversion substrate. The above-described wavelength conversion module has better structural reliability and is simple to manufacture. Furthermore, the manufacturing method of the above-described wavelength conversion module can simplify the structure and reduce production procedures and costs.

Description

Technical Field

[0001] This invention relates to an optical module and a method for manufacturing the same, and more particularly to a wavelength conversion module and a method for manufacturing the same. Background Technology

[0002] In projectors with a laser light source, the phosphor wheel is located in the transmission path of the excitation beam generated by the laser. For example, blue laser light emitted from a blue laser source is projected onto the light conversion area of ​​the phosphor wheel, which contains fluorescent material, to excite a yellow converted beam. Generally, the phosphor wheel is assembled with a metal counterweight ring for subsequent dynamic balancing. The metal counterweight ring is made of metals such as aluminum, copper, or stainless steel, and its processing and forming methods include machining on a lathe or milling machine, or stamping. Furthermore, the dynamic balancing of the phosphor wheel includes weighting and weight removal methods. Weighting involves directly filling or attaching weights to the metal counterweight ring, while weight removal involves drilling blind holes or through holes in the metal counterweight ring at the locations where weight needs to be reduced using a drilling machine or similar equipment.

[0003] However, the significant differences in expansion coefficients and physical properties between the counterweights used in the weighting method and the metal counterweight rings result in poor bonding stability, posing a risk of the counterweights flying off during high-speed rotation of the fluorescent wheel. Furthermore, current fluorescent wheel assembly requires at least two layers of adhesive to bond the adapter ring, substrate, coated glass, and drive components together. However, the more layers of adhesive used, the higher the process complexity, the longer the operation time, and the higher the manufacturing cost, further increasing the risk of structural reliability issues.

[0004] The "Background Art" paragraph is only used to help understand the content of this invention. Therefore, the content disclosed in the "Background Art" paragraph may include some known technologies that are not known to those skilled in the art. The content disclosed in the "Background Art" paragraph does not mean that the content or the problems to be solved by one or more embodiments of this invention were known or recognized by those skilled in the art before this application was filed. Summary of the Invention

[0005] This invention provides a wavelength conversion module with better structural reliability.

[0006] This invention provides a method for manufacturing a wavelength conversion module, which simplifies the structure and reduces production procedures and costs.

[0007] Other objects and advantages of the present invention can be further understood from the technical features disclosed herein.

[0008] To achieve one, some, or all of the above-mentioned objectives, or other objectives, one embodiment of the present invention provides a wavelength conversion module, which includes a wavelength conversion substrate, a driving component, and a polymer adhesive ring. The driving component is connected to the wavelength conversion substrate to drive the wavelength conversion substrate to rotate about the axis of the driving component. The polymer adhesive ring is disposed on the wavelength conversion substrate.

[0009] To achieve one, some, or all of the above objectives, or other objectives, an embodiment of the present invention provides a method for manufacturing a wavelength conversion module, comprising the following steps: Providing a mold, wherein the mold includes a first mold core, a support member, and a second mold core. The first mold core has a first opening, and the second mold core has a second opening. One end of the support member is detachably disposed within the first opening, and the second opening of the second mold core is adapted to pass through the other end of the support member, thereby assembling the second mold core onto the first mold core. Filling the first mold core of the mold with a polymeric adhesive. Applying pressure to the first mold core filled with the polymeric adhesive using the second mold core to perform curing and molding. Separating the first mold core, the support member, and the second mold core to form a polymeric ring. Providing a wavelength conversion substrate. Assembling a drive assembly with the wavelength conversion substrate. Connecting the drive assembly to the wavelength conversion substrate.

[0010] Based on the above, the embodiments of the present invention have at least one of the following advantages or effects. In the design of the wavelength conversion module of the present invention, the polymer adhesive ring is disposed on the wavelength conversion substrate, and the polymer adhesive ring is manufactured by molding. Compared with the metal counterweight ring formed by mechanical lathe, milling machine or stamping process in the prior art, the polymer adhesive ring of the wavelength conversion module of the present invention can have better adhesion stability with the counterweight during subsequent dynamic balancing. Furthermore, when the polymer adhesive ring is assembled with the wavelength conversion substrate and the drive component, the use of adhesive layers can be reduced, thereby simplifying the structure, reducing operation time, reducing production procedures and production costs. Therefore, the wavelength conversion module of the present invention can have better structural reliability. Attached Figure Description

[0011] Figure 1A This is a top view schematic diagram of a wavelength conversion module according to an embodiment of the present invention.

[0012] Figure 1B yes Figure 1A A three-dimensional cross-sectional diagram of the wavelength conversion module.

[0013] Figure 1C It is along Figure 1A Schematic diagram of the cross section of line II.

[0014] Figures 2A to 2D yes Figure 1A A schematic diagram of some steps in the fabrication method of the wavelength conversion module.

[0015] Figure 3A This is a three-dimensional cross-sectional schematic diagram of a wavelength conversion module according to another embodiment of the present invention.

[0016] Figure 3B yes Figure 3A A cross-sectional schematic diagram of the wavelength conversion module.

[0017] Figures 4A to 4E yes Figure 3A A schematic diagram illustrating the fabrication method of the wavelength conversion module.

[0018] Figure 5A This is a three-dimensional cross-sectional schematic diagram of a wavelength conversion module according to another embodiment of the present invention.

[0019] Figure 5B yes Figure 5A A cross-sectional schematic diagram of the wavelength conversion module.

[0020] Figure 6A This is a top view schematic diagram of a wavelength conversion module according to another embodiment of the present invention.

[0021] Figure 6B yes Figure 6A A three-dimensional cross-sectional diagram of the wavelength conversion module.

[0022] Figure 6C It is along Figure 6A Schematic diagram of the cross section of line II-II. Detailed Implementation

[0023] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the present invention.

[0024] Figure 1A This is a top view schematic diagram of a wavelength conversion module according to an embodiment of the present invention. Figure 1B yes Figure 1A A three-dimensional cross-sectional diagram of the wavelength conversion module. Figure 1C It is along Figure 1A A cross-sectional view of line II. Please also refer to... Figure 1A , Figure 1B as well as Figure 1CIn this embodiment, the wavelength conversion module 100a is, for example, a fluorescent wheel. The wavelength conversion module 100a includes a wavelength conversion substrate 110a, a driving assembly 120, and a polymer ring 130a. The driving assembly 120 is, for example, a motor. The driving assembly 120 is connected to the wavelength conversion substrate 110a and is used to drive the wavelength conversion substrate 110a to rotate about the axis X of the driving assembly 120. The polymer ring 130a is disposed on the wavelength conversion substrate 110a.

[0025] In detail, in this embodiment, the wavelength conversion substrate 110a and the polymer ring 130a are coaxially arranged with the driving component 120. The wavelength conversion substrate 110a includes a disk substrate 112 and at least one wavelength conversion layer (schematically shown as three wavelength conversion layers 114). The at least one wavelength conversion layer 114 also includes different phosphor layers for receiving the excitation beam projected from the excitation light source to excite a converted beam, the main wavelength of which is different from that of the excitation beam. The disk substrate 112 is used to reflect the converted beam. The wavelength conversion layer 114 is disposed on the disk substrate 112. In addition, the wavelength conversion substrate 110a in this embodiment also includes an optical plate 116, wherein the optical plate 116 is located in the opening of the disk substrate 112. Here, the optical plate 116 is, for example, a light-transmitting plate or a reflective plate, for allowing the excitation beam to pass through or reflect. In other embodiments, the wavelength conversion substrate 110a may not have an optical plate 116, and the opening of the disk substrate 112 may allow the excitation beam to pass through.

[0026] Please refer to this again. Figure 1B Optionally, in this embodiment, the polymer ring 130a may be mixed with a plurality of filler particles 132, wherein the filler particles 132 are, for example, a plurality of polymer particles, a plurality of glass particles, a plurality of ceramic particles, a plurality of metal particles, or a combination of the above particles. In particular, the filler particles 132 occupy less than 95% of the volume of the polymer ring 130a, and the particle size D of each filler particle 132 is, for example, between 0.0001 mm and 0.5 mm. Of course, in another embodiment, the polymer ring may not be mixed with a plurality of filler particles, which is still within the scope of protection of this invention. In addition, the polymer ring 130a of this embodiment also has at least one hole, wherein the hole is, for example, a through hole 133. That is to say, the dynamic balance correction of the wavelength conversion module 100a in this embodiment is achieved by a weight removal method.

[0027] In addition, please refer to the following: Figure 1B and Figure 1CIn this embodiment, the wavelength conversion module 100a further includes an adhesive layer 140 (i.e., a first adhesive layer) and an adhesive layer 150 (i.e., a second adhesive layer). Adhesive layer 140 is disposed between the polymer ring 130a and the wavelength conversion substrate 110a, while adhesive layer 150 is disposed between the drive assembly 120 and the wavelength conversion substrate 110a. Here, the materials of adhesive layer 140 and adhesive layer 150 are, for example, silicone, epoxy resin, acrylic adhesive, inorganic adhesive, or a combination of the above adhesives. Additionally, the wavelength conversion module 100a of this embodiment may also include a counterweight 160, wherein the counterweight 160 is attached to the groove 131 of the polymer ring 130a. Here, the material of the counterweight 160 is, for example, silicone, epoxy resin, acrylic adhesive, inorganic adhesive, or a combination of the above adhesives. In other words, the dynamic balance correction of the wavelength conversion module 100a in this embodiment is achieved by using a weighting method.

[0028] In this embodiment, the polymer ring 130a is mixed with filler particles 132, wherein the main function of the filler particles 132 is to increase the polymer material 130 (e.g., ... Figure 2A (As shown) The rigidity and strength of the polymer ring 130a after molding. For example, compared with a polymer ring without filler particles 132, the rigidity and strength of the polymer ring 130a with filler particles 132 are increased by more than 30%, and the tensile strength can be increased from less than 30 kg / cm² to more than 50 kg / cm². Furthermore, the polymer ring 130a with filler particles 132 can also improve the ring's formability, for example, by increasing the molding dimensional accuracy by more than 30%, and the dimensional tolerance after molding can be increased from ±0.5 mm to ±0.2 mm. In addition, the polymer ring 130a with filler particles 132 can also improve the adhesion between the polymer ring 130a and the counterweight 160, for example, by increasing the adhesion strength by more than 30%. Here, the material of the polymer ring 130a is, for example, silicone, acrylic adhesive, epoxy resin adhesive, or a combination of the above materials.

[0029] Figures 2A to 2D yes Figure 1A A schematic diagram illustrating a portion of the fabrication process of the wavelength conversion module. It should be noted that... Figure 2B for Figure 2A A three-dimensional schematic diagram from another perspective. For the fabrication of the polymer ring 130a in the wavelength conversion module 100a, please refer to [the diagram / reference needed]. Figure 2A , Figure 2B and Figure 2CFirst, a mold 10 is provided, comprising a first mold core 12, a support member 14, and a second mold core 16. The first mold core 12 has a first opening 13a, and the second mold core 16 has a second opening 17a. One end 14a of the support member 14 is detachably disposed within the first opening 13a, and the second opening 17a of the second mold core 16 is adapted to pass through the other end 14b of the support member 14, thereby assembling the second mold core 16 onto the first mold core 12. Furthermore, the mold 10 of this embodiment also includes an auxiliary support member 18. The first mold core 12 further has a third opening 13b, and the second mold core 16 further has a fourth opening 17b. One end 18a of the auxiliary support member 18 is detachably disposed within the third opening 13b, and the fourth opening 17b of the second mold core 16 is adapted to pass through the other end 18b of the auxiliary support member 18, thereby assembling the second mold core 16 onto the first mold core 12. Next, the polymer material 130 is filled into the first mold core 12 of the mold 10.

[0030] Next, please refer to Figure 2C Move the second mold core 16 to apply pressure to the first mold core 12 filled with polymer adhesive 130 for curing and molding. Please refer to... Figure 2D After the polymer adhesive 130 is cured and molded, the first mold core 12, the support member 14, the auxiliary support member 18, and the second mold core 16 are separated to form a polymer ring 130a. The polymer ring 130a forms a hollow ring shape corresponding to the position of the support member 14, while the polymer ring 130a has a through hole 133 corresponding to the position of the auxiliary support member 18.

[0031] Finally, please also refer to Figure 1A , Figure 1B as well as Figure 2D The wavelength conversion substrate 110a, the driving component 120, and the polymer adhesive ring 130a are fixed together by adhesive layers 140 and 150. The driving component 120 is connected to the wavelength conversion substrate 110a to drive the wavelength conversion substrate 110a to rotate around the axis X of the driving component 120. The polymer adhesive ring 130a is disposed on the wavelength conversion substrate 110a. At this point, the fabrication of the wavelength conversion module 100a is complete.

[0032] In short, the polymer ring 130a of this embodiment is formed by the mold 10, and its shape can be close to the circular symmetrical shape or complex asymmetrical shape of existing metal processing. Furthermore, the polymer material 130 can be appropriately formulated to achieve optimal adhesion between it and the counterweight 160 used for dynamic balancing or the adhesive layers 140 and 150. Therefore, compared to metal counterweight rings formed by lathes, milling machines, or stamping processes in the prior art, the polymer ring 130a of this embodiment exhibits better adhesion stability with the counterweight 160 during subsequent dynamic balancing correction. In addition, the polymer ring 130a of this embodiment is applicable to both weighting methods (such as the filling of the component 160) and weight removal methods (such as the setting of through holes 133). Furthermore, due to the high machinability of polymer materials, the polymer ring 130a of this embodiment also has the advantage of ease of operation.

[0033] It must be noted that the following embodiments use the component reference numerals and some content from the foregoing embodiments, with the same reference numerals used to represent the same or similar components, and descriptions of the same technical content omitted. For explanations of the omitted parts, please refer to the foregoing embodiments; these will not be repeated in the following embodiments.

[0034] Figure 3A This is a three-dimensional cross-sectional schematic diagram of a wavelength conversion module according to another embodiment of the present invention. Figure 3B yes Figure 3A A cross-sectional view of the wavelength conversion module. Please also refer to... Figure 1B , Figure 1C , Figure 3A as well as Figure 3B In this embodiment, the wavelength conversion module 100b and Figure 1B Similar to the wavelength conversion module 100a, the difference lies in that, in this embodiment, the polymer adhesive ring 130b is bonded to the wavelength conversion substrate 110a. Specifically, the wavelength conversion substrate 110a of this embodiment has an upper surface 111 and a lower surface 113 that are opposite to each other, and the polymer adhesive ring 130b is located on the upper surface 111 and extends onto a portion of the lower surface 113. The wavelength conversion substrate 110a is fixed by the polymer adhesive ring 130b. Furthermore, in this embodiment, the adhesive layer 150 is disposed between the drive assembly 120 and the polymer adhesive ring 130b located on the lower surface 113 of the wavelength conversion substrate 110b.

[0035] Figures 4A to 4E yes Figure 3A A schematic diagram illustrating the fabrication method of the wavelength conversion module. It should be noted that... Figure 4B for Figure 4A A three-dimensional diagram from another perspective; and Figure 4E for Figure 4DA three-dimensional schematic diagram from another perspective. Regarding the fabrication of the wavelength conversion module 110b, firstly, please refer to... Figure 4A , Figure 4B and Figure 4C A mold 20 is provided, comprising a first mold core 22, a support member 24, and a second mold core 26. The first mold core 22 has a first opening 23a, and the second mold core 26 has a second opening 27a. One end 24a of the support member 24 is detachably disposed within the first opening 23a, and the second opening 27a of the second mold core 26 is adapted to pass through the other end 24b of the support member 24, thereby assembling the second mold core 26 onto the first mold core 22. Furthermore, the mold 20 of this embodiment also includes an auxiliary support member 28, and the second mold core 26 further has a fourth opening 27b. The fourth opening 27b of the second mold core 26 is adapted to pass through the other end 28b of the auxiliary support member 28, thereby assembling the second mold core 26 onto the first mold core 22.

[0036] Next, a wavelength conversion substrate 110a is provided, wherein the wavelength conversion substrate 110a is disposed between the first mold core 22 and the second mold core 26, and one end 28a of the auxiliary support member 28 is adapted to abut against the wavelength conversion substrate 110a. Next, please refer to... Figure 4A The polymer material 130 is filled in the groove of the first mold core 22 of the mold 20 and on the upper surface 111 of the wavelength conversion substrate 110a.

[0037] Next, please refer to Figure 4C The second mold core 26 applies pressure to the wavelength conversion substrate 110a and the first mold core 22, which are filled with polymer adhesive 130, to perform curing and molding. Here, the curing temperature of the polymer adhesive 130 is lower than the melting point of the wavelength conversion substrate 110a, so it will not affect the structural stability of the wavelength conversion substrate 110a. The polymer adhesive 130 is made of, for example, silicone, acrylic adhesive, epoxy resin, or a combination of the above adhesives.

[0038] Afterwards, please refer to the following: Figure 4D and Figure 4EThe first mold core 22, support member 24, auxiliary support member 28, and second mold core 26 are separated to form a polymer adhesive ring 130b bonded to the wavelength conversion substrate 110a. At this time, the formed polymer adhesive ring 130b is located on the upper surface 111 of the wavelength conversion substrate 110a and extends to a portion of the lower surface 113. Further, the polymer adhesive 130 can be formed on the upper surface 111 and lower surface 113 of the wavelength conversion substrate 110a through perforations 111a to fix the wavelength conversion substrate 110a and the optical plate 116. The polymer adhesive ring 130b forms a hollow ring shape corresponding to the position of the support member 24, while through holes 133 are formed corresponding to the position of the auxiliary support member 28.

[0039] Afterwards, please refer to the following: Figure 3A as well as Figure 4D After the polymer adhesive ring 130b is formed on the wavelength conversion substrate 110a, the drive assembly 120 is assembled with the wavelength conversion substrate 110a. The drive assembly 120 is connected to the wavelength conversion substrate 110a through the adhesive layer 150 to drive the wavelength conversion substrate 110a to rotate around the axis X of the drive assembly 120. The polymer adhesive ring 130b is disposed on the wavelength conversion substrate 110a. At this point, the fabrication of the wavelength conversion module 100b is complete.

[0040] In short, in this embodiment, the polymer ring 130b is bonded to and cured onto the wavelength conversion substrate 110a during its formation, and then bonded to the drive assembly 120 using an adhesive layer 150. This reduces the limitations on the selectivity and curing conditions of the polymer adhesive 130 used in forming the polymer ring 130b, while also eliminating a step such as… Figure 1B The use of adhesive layer 140 in the process simplifies the manufacturing process of the overall wavelength conversion module 100b and improves structural reliability.

[0041] Figure 5A This is a three-dimensional cross-sectional schematic diagram of a wavelength conversion module according to another embodiment of the present invention. Figure 5B yes Figure 5A A cross-sectional view of the wavelength conversion module. Please also refer to... Figure 1B , Figure 1C , Figure 5A as well as Figure 5B In this embodiment, the wavelength conversion module 100c and Figure 1BSimilar to the wavelength conversion module 100a, the difference lies in that, in this embodiment, the polymer adhesive ring 130c is bonded to the wavelength conversion substrate 110a and the driving component 120. Specifically, in this embodiment, the polymer adhesive ring 130c is located on the upper surface 111 of the wavelength conversion substrate 110a and extends to the lower surface 113 between the substrate and the driving component 120. That is, in this embodiment, the polymer adhesive ring 130c, the wavelength conversion substrate 110a, and the driving component 120 are bonded together with a polymer adhesive (such as...). Figure 4A In the molding process of the polymer adhesive 130, the three components are shaped and bonded together using a mold. Therefore, this embodiment does not require the use of... Figure 1B The adhesive layers 140 and 150 in the process reduce two manufacturing steps, simplifying the production process. It should be noted that if thermosetting or sintering is used, the curing temperature of the polymer adhesive should be lower than the melting points of the wavelength conversion substrate 110a and the drive component 120 to avoid affecting their stability. Furthermore, if the polymer adhesive contains a solvent, a solvent that will not react with the wavelength conversion substrate 110a or the drive component 120 should be selected to avoid dissolution.

[0042] Figure 6A This is a top view schematic diagram of a wavelength conversion module according to another embodiment of the present invention. Figure 6B yes Figure 6A A three-dimensional cross-sectional diagram of the wavelength conversion module. Figure 6C It is along Figure 6A A cross-sectional view of line II-II. Please also refer to... Figure 3A , Figure 3B , Figure 6A , Figure 6B as well as Figure 6C In this embodiment, the wavelength conversion module 100d and Figure 3A Similar to the wavelength conversion module 100b, the difference is that in this embodiment, the wavelength conversion substrate 110d does not have a wavelength conversion module 100b. Figure 3A The optical plate 116 is included. Specifically, the wavelength conversion substrate 110d is a hollow annular shape, and the wavelength conversion substrate 110d and the polymer ring 130d are coaxially arranged with the driving assembly 120. Here, the wavelength conversion substrate 110d only includes a disk substrate 112 and a wavelength conversion layer 114. The disk substrate 112 has an opening 112a. The opening 112a of the disk substrate 112 is used to allow the excitation beam to pass through. The wavelength conversion layer 114 is disposed on the disk substrate 112. The polymer ring 130d is bonded to the wavelength conversion substrate 110d. That is, in this embodiment, the wavelength conversion module 100d is a phosphor wheel without coated glass.

[0043] Furthermore, in this embodiment, the polymer ring 130d is located on the upper surface 111 of the wavelength conversion substrate 110d and extends to a portion of the lower surface 113. The polymer ring 130d has three blind holes 135 and one through hole 133; here, the polymer ring 130d is not provided with... Figure 3A The groove 131 in the middle means that the shape of the polymer ring 130d in this embodiment is a relatively thick ring. In addition, by utilizing the simultaneous generation of through holes 133 and blind holes 135 during the curing process, a large amount of imbalance is generated to correct the imbalance in the structure.

[0044] In summary, the embodiments of the present invention have at least one of the following advantages or effects. In the design of the wavelength conversion module of the present invention, a polymer adhesive ring is disposed on the wavelength conversion substrate, and the polymer adhesive ring is manufactured by molding. Compared with the metal counterweight ring formed by mechanical lathes, milling machines, or stamping processes in the prior art, the wavelength conversion module of the present invention exhibits better adhesion stability between the polymer adhesive ring and the counterweight during subsequent dynamic balancing. Furthermore, when the polymer adhesive ring is assembled with the wavelength conversion substrate and the drive assembly, the use of adhesive layers can be reduced, thereby simplifying the structure, reducing operation time, production processes, and production costs. Therefore, the wavelength conversion module of the present invention has better structural reliability.

[0045] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All simple equivalent changes and modifications made in accordance with the claims and specification of the present invention are still within the scope of the patent coverage of the present invention. Furthermore, no embodiment or claim of the present invention needs to achieve all the objectives, advantages, or features disclosed in the present invention. In addition, the abstract and title are only used to assist in patent document retrieval and are not intended to limit the scope of the invention. Furthermore, the terms "first," "second," etc., mentioned in this specification or claims are only used to name elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

[0046] Explanation of reference numerals in the attached figures

[0047] 10, 20: Molds

[0048] 12, 22: First mold core

[0049] 13a, 23a: First opening

[0050] 13b: Third opening

[0051] 14, 24: Support components

[0052] 14a, 24a: One end

[0053] 14b, 24b: The other end

[0054] 16, 26: Second mold core

[0055] 17a, 27a: Second opening

[0056] 17b, 27b: Fourth opening

[0057] 18, 28: Auxiliary support components

[0058] 18a, 28a: One end

[0059] 18b, 28b: The other end

[0060] 100a, 100b, 100c, 100d: Wavelength conversion modules

[0061] 110a, 110d: Wavelength conversion substrate

[0062] 111: Upper surface

[0063] 111a: Perforation

[0064] 112: Circular substrate

[0065] 112a: Openings in the disk substrate

[0066] 113: Lower surface

[0067] 114: Wavelength conversion layer

[0068] 116: Optical plate

[0069] 120: Driver Components

[0070] 130: Polymer adhesives

[0071] 130a, 130b, 130c, 130d: Polymer ring adhesives

[0072] 131: Groove

[0073] 132: Filler particles

[0074] 133: Through hole

[0075] 135: Blind Hole

[0076] 140, 150: Adhesive layer

[0077] 160: Counterweight

[0078] D: Particle size

[0079] X: Axis.

Claims

1. A method for manufacturing a wavelength conversion module, characterized in that, include: A mold is provided, the mold including a first mold core, a support member and a second mold core, the first mold core having a first opening and the second mold core having a second opening, one end of the support member being detachably disposed in the first opening, and the second opening of the second mold core being adapted to pass through the other end of the support member, so that the second mold core is assembled on the first mold core; A polymer adhesive is filled into the first mold core of the mold; The second mold core is subjected to pressure on the first mold core filled with the polymer material to perform curing and molding; Separate the first mold core, the support member, and the second mold core to form a polymer ring; Provide wavelength conversion substrate; as well as Assemble the driving component and the wavelength conversion substrate, wherein the driving component is connected to the wavelength conversion substrate.

2. The method for manufacturing the wavelength conversion module according to claim 1, characterized in that, Before filling the polymer material into the first mold core of the mold, the wavelength conversion substrate is provided, the wavelength conversion substrate being disposed between the first mold core and the second mold core; When the polymer adhesive is filled into the first mold core, another polymer adhesive is disposed on the upper surface of the wavelength conversion substrate. The second mold core applies pressure to the wavelength conversion substrate filled with the polymer adhesive and the first mold core; The first mold core, the support member, and the second mold core are separated to form the polymer ring that bonds the wavelength conversion substrate.

3. The method for manufacturing the wavelength conversion module according to claim 2, characterized in that, The curing temperature of the polymer adhesive is lower than the melting point of the wavelength conversion substrate.

4. The method for manufacturing the wavelength conversion module according to claim 3, characterized in that, The polymer ring is located on the upper surface of the wavelength conversion substrate and extends to a portion of the lower surface of the wavelength conversion substrate.

5. A wavelength conversion module, characterized in that, include: Wavelength conversion substrate, driving components, and polymer adhesive rings, among which The driving component is connected to the wavelength conversion substrate and is used to drive the wavelength conversion substrate to rotate about the axis of the driving component; and A polymeric adhesive ring is disposed on the wavelength conversion substrate and bonded to the wavelength conversion substrate. The wavelength conversion substrate has an upper surface and a lower surface that are opposite to each other. The polymeric adhesive ring is located on the upper surface and extends to a portion of the lower surface. The polymeric adhesive ring is formed by the method of manufacturing a wavelength conversion module according to any one of claims 1 to 4.

6. The wavelength conversion module according to claim 5, characterized in that, The polymer adhesive ring is made of silicone, acrylic, epoxy resin, or a combination of the above materials.

7. The wavelength conversion module according to claim 5, characterized in that, The polymer ring is mixed with multiple filler particles, which include multiple polymer particles, multiple glass particles, multiple ceramic particles, multiple metal particles, or a combination of the above particles.

8. The wavelength conversion module according to claim 7, characterized in that, The plurality of filler particles occupy less than 95% of the volume of the polymer ring.

9. The wavelength conversion module according to claim 7, characterized in that, The particle size of each of the plurality of filler particles is between 0.0001 mm and 0.5 mm.

10. The wavelength conversion module according to claim 7, characterized in that, The tensile strength of the polymer rings of the plurality of filler particles is greater than 50 kg / cm².

11. The wavelength conversion module according to claim 5, characterized in that, Also includes: A first adhesive layer is disposed between the polymer ring and the wavelength conversion substrate; as well as A second adhesive layer is disposed between the driving component and the wavelength conversion substrate.

12. The wavelength conversion module according to claim 11, characterized in that, The materials of the first adhesive layer and the second adhesive layer respectively include silicone, epoxy resin, acrylic adhesive, inorganic adhesive or a combination of the above adhesive materials.

13. The wavelength conversion module according to claim 5, characterized in that, Also includes: An adhesive layer is disposed between the drive assembly and the polymer ring located on the lower surface of the wavelength conversion substrate.

14. The wavelength conversion module according to claim 5, characterized in that, The polymer ring is further bonded to the drive assembly, and the polymer ring is located on the upper surface and extends to a portion of the lower surface between the drive assembly and the drive assembly.

15. The wavelength conversion module according to claim 5, characterized in that, The wavelength conversion substrate is hollow and annular, and the wavelength conversion substrate and the polymer ring are coaxially arranged with the driving component.

16. The wavelength conversion module according to claim 15, characterized in that, The wavelength conversion substrate further includes an optical plate, which may include a light-transmitting plate or a reflective plate.

17. The wavelength conversion module according to claim 5, characterized in that, Also includes: The counterweight is attached to the groove of the polymer ring, wherein the material of the counterweight includes silicone, epoxy resin, acrylic, inorganic adhesive, or a combination of the above materials.

18. The wavelength conversion module according to claim 5, characterized in that, The polymer ring has at least one hole, which includes at least one blind hole or at least one through hole.

Images