A rigid-flex board manufacturing method, manufacturing device and rigid-flex board

Abstract

The embodiment of the application discloses a rigid-flexible board manufacturing method, manufacturing equipment and rigid-flexible board. The rigid-flexible board manufacturing method comprises the following steps: forming a rigid plate. Forming a flexible plate, and the surface of the flexible plate is provided with a rigid plate alignment area. Providing a cover film, and performing windowing treatment on the cover film, wherein the cover film window comprises a first rigid plate window. Bonding the cover film to the surface of the flexible plate. Providing a reinforcing sheet, performing windowing treatment on the reinforcing sheet, forming a reinforcing sheet window, and the reinforcing sheet window comprises a second rigid plate window. Forming a prepreg, and the prepreg is in an integral structure. The reinforcing sheet is arranged on the surface of the cover film, the prepreg is arranged on the rigid plate alignment area, the rigid plate is arranged on the surface of the prepreg away from the flexible plate, and the rigid plate is arranged in the rigid plate alignment area. The structure of the whole prepreg is beneficial to the alignment of the prepreg, avoids the problem that the copper seepage short circuit occurs when a hole is drilled to a position without the prepreg, and improves the yield of the rigid-flexible board.

Description

Technical Field

[0001] The present invention relates to rigid-flex plate manufacturing technology, and more particularly to a method for manufacturing a rigid-flex plate, manufacturing equipment, and a rigid-flex plate. Background Technology

[0002] As electronic products continue to develop towards multi-functionality, miniaturization, lightweighting, and high performance, more stringent installation requirements are being placed on printed circuit boards (including rigid-flex boards and flexible boards) that include flexible printed circuit boards (FPCs).

[0003] In the current market, there is an increasing demand for rigid-flex PCBs with a rigid center and flexible surrounding areas. When manufacturing such four-sided suspended rigid-flex PCBs (i.e., the rigid areas are connected to flexible areas on all four sides), small pieces of prepreg are needed between the rigid and flexible boards in areas such as the drilling locations, and the rigid and flexible boards are then pressed together. However, during the placement and pressing processes, these prepregs may be misaligned, resulting in poor precision, easy misalignment, and difficulty in detecting it. This can lead to various problems such as drilling into areas without prepregs, causing interlayer copper leakage and short circuits during drilling. Summary of the Invention

[0004] This invention provides a method, equipment, and rigid-flex PCB manufacturing process to avoid problems such as interlayer copper short circuits caused by drilling into areas without prepreg during hole drilling, thereby improving the yield of rigid-flex PCBs.

[0005] In a first aspect, embodiments of the present invention provide a method for manufacturing a rigid-flexible plate, comprising:

[0006] Forming a rigid plate;

[0007] A flexible plate is formed, the surface of which is provided with a rigid plate alignment area for bonding the rigid plate, and the area of ​​the flexible plate is larger than the area of ​​the rigid plate.

[0008] A covering film is provided, and a window is opened in the covering film to form a covering film window. The covering film window includes a first rigid plate window, and the position of the first rigid plate window is set to correspond to the position of the alignment area of ​​the rigid plate.

[0009] The covering film is bonded to the surface of the flexible plate;

[0010] A reinforcing sheet is provided, and a window is made in the reinforcing sheet to form a reinforcing sheet window. The reinforcing sheet window includes a second rigid plate window, and the position of the second rigid plate window is set to correspond to the position of the alignment area of ​​the rigid plate.

[0011] A semi-cured sheet is formed, wherein the semi-cured sheet is an integral structure and can cover the alignment area of ​​the rigid plate;

[0012] The reinforcing sheet is disposed on the surface of the covering film, the semi-cured sheet is disposed in the alignment area of ​​the rigid plate, the rigid plate is disposed on the surface of the semi-cured sheet away from the flexible plate, and the rigid plate is disposed in correspondence with the alignment area of ​​the rigid plate.

[0013] The positional relationship between the flexible plate, the reinforcing sheet, the prepreg, and the rigid plate is fixed.

[0014] The flexible plate, the reinforcing sheet, the prepreg, and the rigid plate are combined.

[0015] Optionally, the flexible plate further includes gold fingers, the cover film window further includes a first gold finger opening, the first gold finger opening being configured corresponding to the gold fingers; the reinforcing sheet window includes a second gold finger opening, the second gold finger opening being configured corresponding to the gold fingers.

[0016] Optionally, bonding the cover film to the surface of the flexible plate includes aligning and attaching the cover film to the surface of the flexible plate, and performing a quick-press bonding of the cover film.

[0017] Optionally, fixing the positional relationship between the flexible plate, the reinforcing sheet, the prepreg sheet, and the rigid plate includes riveting the flexible plate, the reinforcing sheet, the prepreg sheet, and the rigid plate together with rivets.

[0018] Optionally, before riveting the flexible plate, the reinforcing sheet, the prepreg, and the rigid plate together, a riveting hole is formed on each of the reinforcing sheet, the prepreg, and the rigid plate, the riveting hole being used for the rivet to pass through.

[0019] Optionally, combining the flexible plate, the reinforcing sheet, the prepreg, and the rigid plate includes pressing the flexible plate, the reinforcing sheet, the prepreg, and the rigid plate together.

[0020] Optionally, when fixing the positional relationship between the flexible plate, the reinforcing sheet, the semi-cured sheet and the rigid plate, the first projection of the outline of the window on the second rigid plate on the rigid plate is within the outline of the rigid plate; the distance between the edge of the first projection and the outline of the rigid plate is 0.2mm-1.0mm.

[0021] Optionally, the thickness of the reinforcing sheet is 12.5μm-25μm.

[0022] Secondly, embodiments of the present invention also provide a device for manufacturing a rigid-flexible plate, the device comprising:

[0023] One or more processors;

[0024] Storage device for storing one or more programs.

[0025] When the one or more programs are executed by the one or more processors, the one or more processors implement any of the above-described methods for manufacturing rigid-flex plates.

[0026] Thirdly, embodiments of the present invention also provide a rigid-flex plate, which is manufactured by any of the above-described methods for manufacturing rigid-flex plates.

[0027] In this embodiment of the invention, the prepreg is a monolithic structure that covers the alignment area of ​​the rigid plate. Because the space between the rigid and flexible plates is filled with prepreg, and after alignment, the positional relationships between the flexible plate, reinforcing sheet, prepreg, and rigid plate are fixed, the monolithic structure facilitates prepreg alignment. Furthermore, fixing the prepreg to other laminated structures helps reduce prepreg misalignment. This improves the alignment accuracy of the prepreg and avoids problems such as interlayer copper short circuits caused by drilling into areas without prepreg during hole drilling, thus improving the yield rate of rigid-flex PCBs. Attached Figure Description

[0028] Figure 1 A schematic diagram of the rigid-flex plate film layer fabricated according to a method for manufacturing a rigid-flex plate provided in an embodiment of the present invention;

[0029] Figure 2 A top view of a rigid-flex plate manufactured according to a method for manufacturing a rigid-flex plate provided in an embodiment of the present invention;

[0030] Figure 3 This diagram illustrates the steps of a method for manufacturing a rigid-flex plate according to an embodiment of the present invention. Detailed Implementation

[0031] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0032] Figure 1 A schematic diagram of the rigid-flex plate film layer fabricated according to a method for manufacturing a rigid-flex plate provided in an embodiment of the present invention. Figure 2 A top view of a rigid-flex plate fabricated according to a method for manufacturing a rigid-flex plate provided in an embodiment of the present invention. Figure 3 This is a step diagram illustrating a method for manufacturing a rigid-flex plate according to an embodiment of the present invention. (Refer to...) Figure 1 , Figure 2 and Figure 3 This invention provides a method for manufacturing a rigid-flex plate, comprising:

[0033] S1: Forming rigid plate 1;

[0034] S2: Forming a flexible plate 2, the surface of which is provided with a rigid plate alignment area, the rigid plate alignment area is used to join the rigid plate 1, and the area of ​​the flexible plate 2 is larger than the area of ​​the rigid plate 1.

[0035] S3: Provide a covering film 3, perform windowing on the covering film 3 to form a covering film window, the covering film window includes a first rigid plate window, the position of the first rigid plate window is set to correspond to the position of the rigid plate alignment area;

[0036] S4: Bond the cover film 3 to the surface of the flexible plate 2;

[0037] S5: Provide a reinforcing plate 4, perform windowing on the reinforcing plate 4 to form a reinforcing plate window, the reinforcing plate window includes a second rigid plate window, the position of the second rigid plate window is set to correspond to the position of the rigid plate alignment area;

[0038] S6: Forming a semi-cured sheet 5, which is an integral structure and can cover the alignment area of ​​the rigid plate;

[0039] S7: The reinforcing sheet 4 is placed on the surface of the covering film 3, the semi-cured sheet 5 is placed in the rigid plate alignment area, and the rigid plate 1 is placed on the surface of the semi-cured sheet 5 away from the flexible plate 2. The rigid plate 1 is placed in the alignment area of ​​the rigid plate.

[0040] S8: The positional relationship between the fixed flexible plate 2, the reinforcing sheet 4, the prepreg 5 and the rigid plate 1;

[0041] S9: Combining flexible plate 2, reinforcing sheet 4, prepreg 5 and rigid plate 1.

[0042] In this design, the position and orientation of the rigid plate 1 correspond to the rigid plate alignment area on the surface of the flexible plate 2. The area of ​​the flexible plate 2 is larger than that of the rigid plate 1. A portion of the flexible plate 2 is the rigid plate alignment area, and the areas of the flexible plate 2 outside the rigid plate alignment area can be distributed on one, two, or three sides of the rigid plate alignment area, or surround the rigid plate alignment area. The reinforcing sheet 4, the prepreg 5, and the rigid plate 1 can be provided on only one side of the flexible plate 2, or they can be provided on both sides of the flexible plate 2. The cover film 3 covers the surface of the flexible plate 2 exposed to air, preventing water, oxygen, and other components in the air from corroding the metal circuit layer of the flexible plate 2. The position and shape of the first rigid plate window on the cover film 3 can be the same as the position and shape of the rigid plate alignment area. In other words, the cover film 3 and the rigid plate 1 are complementary on the surface of the flexible plate 2. After aligning the cover film 3 with the flexible plate 2, the cover film 3 is bonded to the surface of the flexible plate 2. Optionally, bonding the cover film 3 to the surface of the flexible board 2 includes aligning and bonding the cover film 3 to the surface of the flexible board 2, and performing fast pressing on the cover film 3. Through the fast pressing process, the cover film 3 and the flexible board 2 are tightly bonded. Opening a window in the reinforcing sheet 4 to form a second rigid plate window allows the rigid plate alignment areas of the rigid plate 1 and the flexible board 2 to be tightly bonded through the prepreg 5, resulting in high bonding strength. The prepreg 5 between the rigid plate 1 and the flexible board 2 is a single piece, filling the gap between them. Therefore, regardless of where a hole is drilled in the rigid plate 1, there is always a prepreg 5 between the rigid plate 1 and the flexible board 2, preventing problems such as interlayer copper short circuits caused by the absence of prepreg at the drilled hole location. Simultaneously, the scheme of filling the gap between the rigid plate 1 and the flexible board 2 with a single piece of prepreg 5 facilitates the fixation of the prepreg 5's position. This invention avoids the problem in related technologies where partial application of prepreg leads to prepreg displacement, resulting in the absence of prepreg at the drilling location. After arranging the flexible plate 2, reinforcing plate 4, prepreg 5, and rigid plate 1 in their correct positions, their positional relationship can be fixed. This invention does not limit the fixing method for the aforementioned laminated structure; any fixing method capable of fixing the laminated structure can be used in this invention. Optionally, fixing the positional relationship between the flexible plate 2, reinforcing plate 4, prepreg 5, and rigid plate 1 can include riveting them together. Riveting can significantly limit displacement between the laminated structures and ensure accurate interlayer alignment. Furthermore, before riveting the flexible plate 2, reinforcing plate 4, prepreg 5, and rigid plate 1, riveting holes can be formed on the reinforcing plate 4, prepreg 5, and rigid plate 1 for the rivets to pass through.By drilling holes in each layer before riveting, the riveting process is facilitated and ensures accuracy. The size of the riveting holes can be determined according to actual needs. For example, the size of the riveting holes can be 2.0mm-4.0mm. After fixing the above structure, the flexible plate 2, reinforcing sheet 4, prepreg 5, and rigid plate 1 need to be integrated. Any interlayer bonding method can be used to combine the above-mentioned stacked structure. Optionally, combining the flexible plate 2, reinforcing sheet 4, prepreg 5, and rigid plate 1 can include pressing the flexible plate 2, reinforcing sheet 4, prepreg 5, and rigid plate 1 together. By pressing, the flexible plate 2, reinforcing sheet 4, prepreg 5, and rigid plate 1 can be tightly bonded together. In this embodiment of the invention, the prepreg 5 is an integral structure that covers the alignment area of ​​the rigid plate. Because the space between the rigid plate 1 and the flexible plate 2 is filled with prepreg 5, and after alignment, the positional relationship between the flexible plate 2, reinforcing sheet 4, prepreg 5, and rigid plate 1 is fixed. The structure of the entire prepreg 5 facilitates the alignment of the prepreg, and fixing the prepreg 5 to other laminated structures also helps reduce the offset of the prepreg 5. This improves the alignment accuracy of the prepreg 5. It avoids problems such as interlayer copper short circuits caused by drilling into areas without prepreg during hole drilling, thus improving the yield of rigid-flex PCBs.

[0043] Optionally, the flexible plate 2 also includes gold fingers 21, and the cover film window also includes a first gold finger opening, which is set correspondingly to the gold fingers 21; the reinforcing sheet window includes a second gold finger opening, which is set correspondingly to the gold fingers 21.

[0044] Both the cover film 3 and the reinforcing sheet 4 cover the flexible plate 2. Therefore, when the flexible plate 2 includes gold fingers 21, windows can be made on the cover film 3 and the reinforcing sheet 4 at the positions of the gold fingers 21. The reinforcing sheet 4 can be made of polyimide (PI). Polyimide has good adhesion and there is no poor adhesion between it and the prepreg 5. At the same time, using only a polyimide sheet as the reinforcing sheet 4 avoids the problem in related technologies where polyimide tape is used to bond to the vicinity of the gold finger area, causing the adhesive layer in the tape to peel off and contaminate the gold finger pads.

[0045] Optionally, when fixing the positional relationship between the flexible plate 2, the reinforcing sheet 4, the prepreg 5 and the rigid plate 1, the first projection of the outline of the second rigid plate window on the rigid plate 1 is within the outline of the rigid plate 1; the distance between the edge of the first projection and the outline of the rigid plate 1 is 0.2mm-1.0mm.

[0046] The prepreg 5 can be located on the side of the reinforcing sheet 4 away from the flexible plate 2. The second rigid plate of the reinforcing sheet 4 has an opening slightly smaller than the alignment area of ​​the rigid plate, which can constrain the reinforcing sheet 4 and prevent incomplete filling and delamination. The thickness of both the reinforcing sheet 4 and the prepreg 5 can be determined according to actual needs. For example, the thickness of the reinforcing sheet 4 is 12.5μm-25μm, and the thickness of the prepreg 5 is 75-250μm.

[0047] This invention also provides a device for manufacturing rigid-flexible plates, the device comprising:

[0048] One or more processors;

[0049] Storage device for storing one or more programs.

[0050] When one or more programs are executed by one or more processors, the one or more processors implement any of the above methods for manufacturing rigid-flex plates.

[0051] Since the rigid-flex plate manufacturing equipment in this embodiment of the invention performs any of the rigid-flex plate manufacturing methods described above, it has the beneficial effects of the rigid-flex plate manufacturing method.

[0052] This invention also provides a rigid-flex plate, which is manufactured by any of the above-described methods for manufacturing rigid-flex plates.

[0053] Since the rigid-flex plate in the embodiments of the present invention is made by any of the rigid-flex plate manufacturing methods described above, it has the beneficial effects corresponding to the rigid-flex plate manufacturing methods.

[0054] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A method of manufacturing a rigid-flex board, characterized by, include: Forming a rigid plate; A flexible plate is formed, the surface of which is provided with a rigid plate alignment area for bonding the rigid plate, and the area of ​​the flexible plate is larger than the area of ​​the rigid plate. A covering film is provided, and a window is opened in the covering film to form a covering film window. The covering film window includes a first rigid plate window, and the position of the first rigid plate window is set to correspond to the position of the alignment area of ​​the rigid plate. The covering film is bonded to the surface of the flexible plate; A reinforcing sheet is provided, and a window is made in the reinforcing sheet to form a reinforcing sheet window. The reinforcing sheet window includes a second rigid plate window, and the position of the second rigid plate window is set to correspond to the position of the alignment area of ​​the rigid plate. A semi-cured sheet is formed, wherein the semi-cured sheet is an integral structure and can cover the alignment area of ​​the rigid plate; The reinforcing sheet is disposed on the surface of the covering film, the semi-cured sheet is disposed in the alignment area of ​​the rigid plate, the rigid plate is disposed on the surface of the semi-cured sheet away from the flexible plate, and the rigid plate is disposed in correspondence with the alignment area of ​​the rigid plate. Fixing the positional relationship between the flexible plate, the reinforcing sheet, the prepreg, and the rigid plate includes riveting the flexible plate, the reinforcing sheet, the prepreg, and the rigid plate together with rivets. Before riveting the flexible plate, the reinforcing sheet, the prepreg, and the rigid plate together, the method further includes forming riveting holes on the reinforcing sheet, the prepreg, and the rigid plate, the riveting holes being used to pass through the rivets; The flexible plate, the reinforcing sheet, the prepreg, and the rigid plate are combined.

2. The method of manufacturing a rigid-flex board according to claim 1, wherein The flexible plate also includes gold fingers, and the cover film window also includes a first gold finger opening, which is configured corresponding to the gold fingers; the reinforcing sheet window includes a second gold finger opening, which is configured corresponding to the gold fingers.

3. The method of manufacturing a rigid-flex board according to claim 1, wherein The step of bonding the cover film to the surface of the flexible plate includes aligning and attaching the cover film to the surface of the flexible plate, and performing a quick press-fit on the cover film.

4. The method for manufacturing a rigid-flexible plate according to claim 1, characterized in that, The combination of the flexible plate, the reinforcing sheet, the prepreg, and the rigid plate includes pressing the flexible plate, the reinforcing sheet, the prepreg, and the rigid plate together.

5. The method for manufacturing a rigid-flexible plate according to claim 1, characterized in that, When fixing the positional relationship between the flexible plate, the reinforcing sheet, the semi-cured sheet and the rigid plate, the first projection of the outline of the window on the second rigid plate on the rigid plate is within the outline of the rigid plate; the distance between the edge of the first projection and the outline of the rigid plate is 0.2mm-1.0mm.

6. The method for manufacturing a rigid-flexible plate according to claim 1, characterized in that, The thickness of the reinforcing sheet is 12.5μm-25μm.

7. A device for manufacturing rigid-flexible plates, characterized in that, The manufacturing equipment includes: One or more processors; Storage device for storing one or more programs. When the one or more programs are executed by the one or more processors, the one or more processors implement the method for manufacturing a rigid-flex plate as described in any one of claims 1-6.

8. A rigid-flex plate, characterized in that, It is manufactured by the method of manufacturing the rigid-flex plate according to any one of claims 1-6.

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