Method for processing a groove of a detection window polishing pad, polishing layer and polishing pad

Abstract

The present invention discloses a method for processing grooves in a polishing pad for a detection window, comprising the following steps: Step 1, a processing tool begins to carve grooves from the non-detection window area of ​​the polishing layer of the polishing pad, forming a basic groove; Step 2, as the processing tool approaches the detection window, the processing tool gradually lifts up until it leaves the polishing layer, forming a detection groove; wherein the detection groove has an inclined structure. Compared with the prior art, the beneficial effects of the present invention are: during the groove processing of the polishing pad for the detection window, when the processing tool jumps out of the window, if the angle between the starting point convergence surface of the processing tool (the surface of the detection groove) and the bottom surface of the polishing layer is ≤80 degrees, no burrs will be generated when the processing tool leaves the polishing pad, eliminating the need for manual burr removal, improving processing efficiency, and effectively solving the burr problem.

Description

Technical Field

[0001] This invention relates to the field of chemical mechanical polishing, and in particular to a method for processing grooves in a polishing pad for a testing window, a polishing layer, and a polishing pad. Background Technology

[0002] The semiconductor industry is the core of the modern electronics industry, and the foundation of the semiconductor industry is the silicon material industry. Although various new semiconductor materials are constantly emerging, more than 90% of semiconductor devices and circuits, especially Ultra Large Scale Integrated Circuits (ULSI), are fabricated based on high-purity, high-quality silicon single-crystal polished wafers and epitaxial wafers. Currently, with the further miniaturization of feature linewidths in ULSI, higher requirements are placed on the planarization of silicon wafer surfaces. Chemical Mechanical Polishing (CMP) is widely recognized as the best global material planarization method in the ULSI stage. This method can obtain a more perfect surface and a higher polishing rate, and has largely replaced traditional techniques such as thermal flow, rotating glass method, etch-back method, and electron all-around resonance method.

[0003] Polishing pads are indispensable consumables in the chemical mechanical polishing (CMP) process of integrated circuit manufacturing. The main function of polishing pads in CMP is to hold and distribute the polishing slurry evenly, while simultaneously providing mechanical friction between the pad and the wafer surface, thereby removing excess layers and achieving wafer surface planarization.

[0004] In chemical mechanical polishing (CMP) processes, some polishing steps require polishing pads with transparent detection windows. Polishing pads with transparent detection windows, in conjunction with the endpoint optical inspection system in the polishing equipment, can quickly and effectively detect whether the wafer has reached the polishing endpoint. The main function of the detection window is to allow detection light to pass through the polishing pad to reach the wafer polishing surface, and also to allow the detection light to be reflected from the wafer polishing surface back to the endpoint optical inspection system.

[0005] The inspection window is made of a transparent material, while the polishing pad is made of an opaque material. In the fabrication of the polishing pad with the inspection window, a tight bond between the inspection window and the polishing pad materials is required to prevent leakage of polishing fluid or water between the two surfaces. Simultaneously, to ensure the light transmittance of the inspection window, the transparent material surface must not be engraved or scratched during the machining of the polishing pad grooves. This necessitates that the engraving tool must bypass the inspection window when carving the grooves on the polishing pad with the inspection window.

[0006] When engraving grooves on a polyurethane polishing pad, to prevent the engraving tool from touching the inspection window, it needs to be lifted near the window and skipped. However, when the engraving tool is lifted, burrs are easily generated on the polishing pad surface at the starting point of the groove. These burrs will cause significant scratches and defects on the wafer surface using this polishing pad. Therefore, it is essential to solve the problem of burrs generated when skipping the inspection window during polishing pad groove engraving.

[0007] The current common practice is to manually remove the burrs near the inspection windows after all the grooves on the polishing pads for the inspection windows have been machined. This method has many drawbacks. Manual polishing reduces the production efficiency of the polishing pads for the inspection windows; at the same time, manual operation cannot guarantee that all burrs are removed, which can easily leave burr residue. Summary of the Invention

[0008] In view of the above-mentioned technical problems, the purpose of this invention is to provide a method for processing polishing pad grooves for inspection windows, a polishing layer, and a polishing pad to overcome the technical defect of burrs generated during the processing of polishing pad grooves.

[0009] To solve the above-mentioned technical problems, the present invention provides a method for processing grooves in a window polishing pad, comprising the following steps:

[0010] Step 1: The machining tool starts carving grooves from the non-inspection window area of ​​the polishing layer of the polishing pad to form a basic groove. Step 2: When the machining tool approaches the inspection window, the machining tool gradually lifts up until it leaves the polishing layer to form an inspection groove. The inspection groove has an inclined structure.

[0011] In some embodiments, step two is a uniform speed engraving process.

[0012] In some embodiments, the detection groove satisfies: a ≤ 80 degrees; where a is the angle between the surface of the detection groove and the bottom surface of the polishing layer.

[0013] The processing method for the groove of the polishing pad for the inspection window includes the following steps: Step 1, the processing tool starts to carve the groove from the non-inspection window area of ​​the polishing layer of the polishing pad to form the basic groove; Step 2, when the processing tool approaches the inspection window, the processing tool is gradually lifted until it leaves the polishing layer to form the inspection groove; wherein the inspection groove has an arc-shaped structure.

[0014] In some embodiments, step two is a variable speed engraving process; wherein the detection groove is a concave arc-shaped structure.

[0015] In some embodiments, the angle b between the cut surface at the end of the detection trench and the bottom surface of the polished layer is ≤80 degrees.

[0016] In some embodiments, step two is a variable speed engraving process; wherein the detection groove is an upwardly convex arc-shaped structure.

[0017] In some embodiments, the angle c between the cut surface at the beginning of the detection trench and the bottom surface of the polished layer is ≤80 degrees.

[0018] The polishing layer is manufactured using a method for processing the polishing pad grooves of the inspection window.

[0019] The polishing pad includes at least a polishing layer; wherein the polishing layer is manufactured by a method for processing the grooves of the inspection window polishing pad.

[0020] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0021] 1. During the groove machining of the inspection window polishing pad, when the machining tool jumps out of the window, if the angle between the starting point of the machining tool (the surface of the inspection groove) and the bottom surface of the polishing layer is ≤80 degrees, no burrs will be generated when the machining tool leaves the polishing pad, eliminating the need for manual burr removal, improving processing efficiency, and effectively solving the burr problem;

[0022] 2. During the groove processing of the inspection window polishing pad, when the processing tool jumps out of the window, if the angle b between the cutting surface at the end of the inspection groove and the bottom surface of the polishing layer is ≤80 degrees or the angle c between the cutting surface at the beginning of the inspection groove and the bottom surface of the polishing layer is ≤80 degrees, no burrs will be generated when the processing tool leaves the polishing pad, eliminating the need for manual burr removal, improving processing efficiency, and effectively solving the burr problem;

[0023] 3. The processing method is generally to process along the groove from one side of the inspection window to the other side of the inspection window. The processing method on both sides of the inspection window adopts a symmetrical processing method to ensure the consistency of the polishing pad groove. Attached Figure Description

[0024] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings.

[0025] Figure 1 This is a schematic diagram of the polishing layer structure of the present invention;

[0026] Figure 2 These are schematic diagrams of Embodiments 1 to 3 of the processing method for detecting the grooves of the polishing pad in the window according to the present invention;

[0027] Figure 3 These are schematic diagrams of Embodiments 4 to 6 of the processing method for detecting the grooves of the polishing pad in the window according to the present invention;

[0028] Figure 4These are schematic diagrams of embodiments seven to nine of the processing method for the polishing pad groove of the detection window according to the present invention.

[0029] Explanation of reference numerals in the accompanying drawings of the polishing pad of this invention:

[0030] 1-Polishing layer 2-Basic groove 3-Machining tool

[0031] 4-Detection window 5-Detection groove Detailed Implementation

[0032] Unless otherwise defined, the technical or scientific terms used in this specification and claims shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention pertains.

[0033] All the values ​​listed in this article, ranging from the lowest to the highest, refer to all values ​​obtained by incrementing the lowest and highest values ​​by one unit when the difference between the lowest and highest values ​​is more than two units.

[0034] In the description of this invention, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0035] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0036] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0037] The polishing pad of the present invention will now be described in further detail with reference to the accompanying drawings. In the following detailed description, only certain exemplary embodiments of the invention are described by way of illustration. It will be readily apparent to those skilled in the art that various modifications can be made to the described embodiments without departing from the spirit and scope of the invention. Therefore, the drawings and description are illustrative in nature and not intended to limit the scope of the claims.

[0038] CMP polishing pads, also known as CMP abrasive pads, are primarily used for polishing semiconductor wafers and sapphire wafers. CMP polishing pads are composed of polyurethane material containing filler to control the pad's hardness. The micro-protrusions on the surface of the polishing pad directly contact the wafer, generating friction to mechanically remove the polishing layer. Under centrifugal force, polishing fluid is evenly sprayed onto the surface of the polishing pad, chemically removing the polishing layer and carrying the reaction products out of the pad. The properties of the polishing pad directly affect the surface quality of the wafer and are one of the direct factors related to the planarization effect. In chemical mechanical polishing (CMP) processes, polishing pads with transparent windows, combined with the endpoint optical detection system in the polishing equipment, can quickly and effectively detect whether the wafer has reached the polishing endpoint. However, the detection window itself does not require grooves; the cutting tool needs to be lifted to skip the detection window when approaching it. Current processing methods involve manual grinding after processing to remove burrs from the grooves on both sides of the detection window, which is inefficient.

[0039] This invention addresses the issue of raising the circular groove cutting tool as it approaches the inspection window 4 during machining to prevent it from touching and scratching the window. The invention defines the tool-raising process, providing a specific lifting stroke for the circular groove cutting tool, resulting in a stroke angle. This stroke angle directly determines whether burrs will form on the polishing pad surface upon final tool lifting.

[0040] Example 1

[0041] like Figure 1 , Figure 2As shown, during the processing of the grooves in the polished layer 1, the basic groove 2 is processed first, starting with the non-inspection window 4 area. The non-inspection window 4 area is typically 0.15 mm on each side of the inspection window 4. This area is designed to maintain a relatively safe distance between the processing tool 3 and the inspection window 4 during upward or downward movements. It should be noted that there is no specific standard for the non-inspection window 4 area; it only needs to match the processing parameters (including but not limited to different machine tools and different setting angles). Next, processing begins. The processing tool 3 (in this embodiment, a circular groove tool) begins carving the grooves along a predetermined path, forming the basic groove 2. In this embodiment, the polishing pad and polished layer 1 are circular, and the grooves (including the basic groove 2 and the inspection groove 5) are multi-layered structures arranged around the center of the polishing pad or polished layer 1. Of course, the shape of the grooves can be adjusted according to different requirements and application scenarios, and is not limited to a circular shape.

[0042] When the machining tool 3 approaches the detection window 4 from the non-detection window 4 area, it is gradually lifted from the bottom of the base groove 2 under the drive of the machining equipment (such as a machine tool). During this process, the lifting speed of the machining tool 3 and its linear speed of carving in the groove are both uniform until the machining tool 3 finally detaches from the polishing layer 1, completing the machining of one side of the detection window 4. After machining one side of the detection groove 5, an upwardly inclined structure is formed on one side of the detection window 4. At the same time, the angle α between the surface of the detection groove 5 and the bottom surface of the polishing layer 1 is ≤ 80 degrees, which is 80 degrees in this embodiment. In this case, the surface of the detection groove 5 is relatively smooth and no burrs are generated. When it is necessary to machine the other side of the detection window 4, a symmetrical machining method can be used.

[0043] Example 2

[0044] like Figure 1 , Figure 2As shown, during the processing of the grooves in the polished layer 1, the basic groove 2 is processed first, starting with the non-inspection window 4 area. The non-inspection window 4 area is typically 0.15 mm on each side of the inspection window 4. This area is designed to maintain a relatively safe distance between the processing tool 3 and the inspection window 4 during upward or downward movements. It should be noted that there is no specific standard for the non-inspection window 4 area; it only needs to match the processing parameters (including but not limited to different machine tools and different setting angles). Next, processing begins. The processing tool 3 (in this embodiment, a circular groove tool) begins carving the grooves along a predetermined path, forming the basic groove 2. In this embodiment, the polishing pad and polished layer 1 are circular, and the grooves (including the basic groove 2 and the inspection groove 5) are multi-layered structures arranged around the center of the polishing pad or polished layer 1. Of course, the shape of the grooves can be adjusted according to different requirements and application scenarios, and is not limited to a circular shape.

[0045] When the machining tool 3 approaches the detection window 4 from the non-detection window 4 area, it is gradually lifted from the bottom of the base groove 2 under the drive of the machining equipment (such as a machine tool). During this process, the lifting speed of the machining tool 3 and its linear speed of carving in the groove are uniform until the machining tool 3 finally detaches from the polishing layer 1, completing the machining of one side of the detection window 4. After machining one side of the detection groove 5, an upwardly inclined structure is formed on one side of the detection window 4. At the same time, the angle α between the surface of the detection groove 5 and the bottom surface of the polishing layer 1 is ≤80 degrees, which is 40 degrees in this embodiment. In this case, the surface of the detection groove 5 is relatively smooth and no burrs are generated. When it is necessary to machine the other side of the detection window 4, a symmetrical machining method can be used.

[0046] Example 3

[0047] like Figure 1 , Figure 2As shown, during the processing of the grooves in the polished layer 1, the basic groove 2 is processed first, starting with the non-inspection window 4 area. The non-inspection window 4 area is typically 0.15 mm on each side of the inspection window 4. This area is designed to maintain a relatively safe distance between the processing tool 3 and the inspection window 4 during upward or downward movements. It should be noted that there is no specific standard for the non-inspection window 4 area; it only needs to match the processing parameters (including but not limited to different machine tools and different setting angles). Next, processing begins. The processing tool 3 (in this embodiment, a circular groove tool) begins carving the grooves along a predetermined path, forming the basic groove 2. In this embodiment, the polishing pad and polished layer 1 are circular, and the grooves (including the basic groove 2 and the inspection groove 5) are multi-layered structures arranged around the center of the polishing pad or polished layer 1. Of course, the shape of the grooves can be adjusted according to different requirements and application scenarios, and is not limited to a circular shape.

[0048] When the machining tool 3 approaches the detection window 4 from the non-detection window 4 area, it is gradually lifted from the bottom of the base groove 2 under the drive of the machining equipment (such as a machine tool). During this process, the lifting speed of the machining tool 3 and its linear speed of carving in the groove are both uniform until the machining tool 3 finally detaches from the polishing layer 1, completing the machining of one side of the detection window 4. After machining one side of the detection groove 5, an upwardly inclined structure is formed on one side of the detection window 4. At the same time, the angle α between the surface of the detection groove 5 and the bottom surface of the polishing layer 1 is ≤80 degrees, which is 10 degrees in this embodiment. In this case, the surface of the detection groove 5 is relatively smooth and no burrs are generated. When it is necessary to machine the other side of the detection window 4, a symmetrical machining method can be used.

[0049] Example 4

[0050] like Figure 1 , Figure 3As shown, during the processing of the grooves in the polished layer 1, the basic groove 2 is processed first, starting with the non-inspection window 4 area. The non-inspection window 4 area is typically 0.15 mm on each side of the inspection window 4. This area is designed to maintain a relatively safe distance between the processing tool 3 and the inspection window 4 during upward or downward movements. It should be noted that there is no specific standard for the non-inspection window 4 area; it only needs to match the processing parameters (including but not limited to different machine tools and different setting angles). Next, processing begins. The processing tool 3 (in this embodiment, a circular groove tool) begins carving the grooves along a predetermined path, forming the basic groove 2. In this embodiment, the polishing pad and polished layer 1 are circular, and the grooves (including the basic groove 2 and the inspection groove 5) are multi-layered structures arranged around the center of the polishing pad or polished layer 1. Of course, the shape of the grooves can be adjusted according to different requirements and application scenarios, and is not limited to a circular shape.

[0051] When the machining tool 3 approaches the detection window 4 from the non-detection window 4 area, it is gradually lifted from the bottom of the base groove 2 under the drive of the machining equipment (such as a machine tool). During this process, the lifting speed of the machining tool 3 and its carving linear speed in the groove are variable. It should be noted that the lifting speed of the machining tool 3 can be variable, or the carving linear speed can be variable (in this embodiment, the lifting speed of the machining tool 3 is variable speed) until the machining tool 3 finally detaches from the polishing layer 1, completing the machining of one side of the detection window 4. After machining one side of the detection groove 5, a concave arc-shaped structure is formed on one side of the detection window 4. At the same time, the angle b between the cut surface where the end of the detection groove 5 is located and the bottom surface of the polishing layer 1 is ≤ 80 degrees. In this embodiment, 80 degrees is used. In this case, the surface of the detection groove 5 is a smooth curved surface and no burrs are generated. When machining the other side of the detection window 4, a symmetrical machining method can be used.

[0052] Example 5

[0053] like Figure 1 , Figure 3As shown, during the processing of the grooves in the polished layer 1, the basic groove 2 is processed first, starting with the non-inspection window 4 area. The non-inspection window 4 area is typically 0.15 mm on each side of the inspection window 4. This area is designed to maintain a relatively safe distance between the processing tool 3 and the inspection window 4 during upward or downward movements. It should be noted that there is no specific standard for the non-inspection window 4 area; it only needs to match the processing parameters (including but not limited to different machine tools and different setting angles). Next, processing begins. The processing tool 3 (in this embodiment, a circular groove tool) begins carving the grooves along a predetermined path, forming the basic groove 2. In this embodiment, the polishing pad and polished layer 1 are circular, and the grooves (including the basic groove 2 and the inspection groove 5) are multi-layered structures arranged around the center of the polishing pad or polished layer 1. Of course, the shape of the grooves can be adjusted according to different requirements and application scenarios, and is not limited to a circular shape.

[0054] When the machining tool 3 approaches the detection window 4 from the non-detection window 4 area, it is gradually lifted from the bottom of the base groove 2 under the drive of the machining equipment (such as a machine tool). During this process, the lifting speed of the machining tool 3 and its carving linear speed in the groove are variable. It should be noted that the lifting speed of the machining tool 3 can be variable, or the carving linear speed can be variable (in this embodiment, the lifting speed of the machining tool 3 is variable speed) until the machining tool 3 finally detaches from the polishing layer 1, completing the machining of one side of the detection window 4. After machining one side of the detection groove 5, a concave arc-shaped structure is formed on one side of the detection window 4. At the same time, the angle b between the cut surface where the end of the detection groove 5 is located and the bottom surface of the polishing layer 1 is ≤ 80 degrees. In this embodiment, 40 degrees is used. In this case, the surface of the detection groove 5 is a smooth curved surface and no burrs are generated. When machining the other side of the detection window 4, a symmetrical machining method can be used.

[0055] Example 6

[0056] like Figure 1 , Figure 3As shown, during the processing of the grooves in the polished layer 1, the basic groove 2 is processed first, starting with the non-inspection window 4 area. The non-inspection window 4 area is typically 0.15 mm on each side of the inspection window 4. This area is designed to maintain a relatively safe distance between the processing tool 3 and the inspection window 4 during upward or downward movements. It should be noted that there is no specific standard for the non-inspection window 4 area; it only needs to match the processing parameters (including but not limited to different machine tools and different setting angles). Next, processing begins. The processing tool 3 (in this embodiment, a circular groove tool) begins carving the grooves along a predetermined path, forming the basic groove 2. In this embodiment, the polishing pad and polished layer 1 are circular, and the grooves (including the basic groove 2 and the inspection groove 5) are multi-layered structures arranged around the center of the polishing pad or polished layer 1. Of course, the shape of the grooves can be adjusted according to different requirements and application scenarios, and is not limited to a circular shape.

[0057] When the machining tool 3 approaches the detection window 4 from the non-detection window 4 area, it is gradually lifted from the bottom of the base groove 2 under the drive of the machining equipment (such as a machine tool). During this process, the lifting speed of the machining tool 3 and its carving linear speed in the groove are variable. It should be noted that the lifting speed of the machining tool 3 can be variable, or the carving linear speed can be variable (in this embodiment, the lifting speed of the machining tool 3 is variable speed) until the machining tool 3 finally detaches from the polishing layer 1, completing the machining of one side of the detection window 4. After machining one side of the detection groove 5, a concave arc-shaped structure is formed on one side of the detection window 4. At the same time, the angle b between the cut surface where the end of the detection groove 5 is located and the bottom surface of the polishing layer 1 is ≤ 80 degrees, which is 10 degrees in this embodiment. In this case, the surface of the detection groove 5 is a smooth curved surface and no burrs are generated. When machining the other side of the detection window 4, a symmetrical machining method can be used.

[0058] Example 7

[0059] like Figure 1 , Figure 4As shown, during the processing of the grooves in the polished layer 1, the basic groove 2 is processed first, starting with the non-inspection window 4 area. The non-inspection window 4 area is typically 0.15 mm on each side of the inspection window 4. This area is designed to maintain a relatively safe distance between the processing tool 3 and the inspection window 4 during upward or downward movements. It should be noted that there is no specific standard for the non-inspection window 4 area; it only needs to match the processing parameters (including but not limited to different machine tools and different setting angles). Next, processing begins. The processing tool 3 (in this embodiment, a circular groove tool) begins carving the grooves along a predetermined path, forming the basic groove 2. In this embodiment, the polishing pad and polished layer 1 are circular, and the grooves (including the basic groove 2 and the inspection groove 5) are multi-layered structures arranged around the center of the polishing pad or polished layer 1. Of course, the shape of the grooves can be adjusted according to different requirements and application scenarios, and is not limited to a circular shape.

[0060] When the machining tool 3 approaches the detection window 4 from the non-detection window 4 area, it is gradually lifted from the bottom of the base groove 2 under the drive of the machining equipment (such as a machine tool). During this process, the lifting speed of the machining tool 3 and its carving linear speed in the groove are variable. It should be noted that the lifting speed of the machining tool 3 can be variable, or the carving linear speed can be variable (in this embodiment, the lifting speed of the machining tool 3 is variable speed) until the machining tool 3 finally detaches from the polishing layer 1, completing the machining of one side of the detection window 4. After machining one side of the detection groove 5, an upwardly convex arc-shaped structure is formed on one side of the detection window 4. At the same time, the angle c between the cutting surface of the first end of the detection groove 5 and the bottom surface of the polishing layer 1 is ≤ 80 degrees. In this embodiment, 80 degrees is used. In this case, the surface of the detection groove 5 is a smooth curved surface and no burrs are generated. When machining the other side of the detection window 4, a symmetrical machining method can be used.

[0061] Example 8

[0062] like Figure 1 , Figure 4As shown, during the processing of the grooves in the polished layer 1, the basic groove 2 is processed first, starting with the non-inspection window 4 area. The non-inspection window 4 area is typically 0.15 mm on each side of the inspection window 4. This area is designed to maintain a relatively safe distance between the processing tool 3 and the inspection window 4 during upward or downward movements. It should be noted that there is no specific standard for the non-inspection window 4 area; it only needs to match the processing parameters (including but not limited to different machine tools and different setting angles). Next, processing begins. The processing tool 3 (in this embodiment, a circular groove tool) begins carving the grooves along a predetermined path, forming the basic groove 2. In this embodiment, the polishing pad and polished layer 1 are circular, and the grooves (including the basic groove 2 and the inspection groove 5) are multi-layered structures arranged around the center of the polishing pad or polished layer 1. Of course, the shape of the grooves can be adjusted according to different requirements and application scenarios, and is not limited to a circular shape.

[0063] When the machining tool 3 approaches the detection window 4 from the non-detection window 4 area, it is gradually lifted from the bottom of the base groove 2 under the drive of the machining equipment (such as a machine tool). During this process, the lifting speed of the machining tool 3 and its carving linear speed in the groove are variable. It should be noted that the lifting speed of the machining tool 3 can be variable, or the carving linear speed can be variable (in this embodiment, the lifting speed of the machining tool 3 is variable speed) until the machining tool 3 finally detaches from the polishing layer 1, completing the machining of one side of the detection window 4. After machining one side of the detection groove 5, an upwardly convex arc-shaped structure is formed on one side of the detection window 4. At the same time, the angle c between the cut surface of the detection groove 5 and the bottom surface of the polishing layer 1 is ≤ 80 degrees, which is 40 degrees in this embodiment. In this case, the surface of the detection groove 5 is a smooth curved surface and no burrs are generated. When machining the other side of the detection window 4, a symmetrical machining method can be used.

[0064] Example 9

[0065] like Figure 1 , Figure 4As shown, during the processing of the grooves in the polished layer 1, the basic groove 2 is processed first, starting with the non-inspection window 4 area. The non-inspection window 4 area is typically 0.15 mm on each side of the inspection window 4. This area is designed to maintain a relatively safe distance between the processing tool 3 and the inspection window 4 during upward or downward movements. It should be noted that there is no specific standard for the non-inspection window 4 area; it only needs to match the processing parameters (including but not limited to different machine tools and different setting angles). Next, processing begins. The processing tool 3 (in this embodiment, a circular groove tool) begins carving the grooves along a predetermined path, forming the basic groove 2. In this embodiment, the polishing pad and polished layer 1 are circular, and the grooves (including the basic groove 2 and the inspection groove 5) are multi-layered structures arranged around the center of the polishing pad or polished layer 1. Of course, the shape of the grooves can be adjusted according to different requirements and application scenarios, and is not limited to a circular shape.

[0066] When the machining tool 3 approaches the detection window 4 from the non-detection window 4 area, it is gradually lifted from the bottom of the base groove 2 under the drive of the machining equipment (such as a machine tool). During this process, the lifting speed of the machining tool 3 and its carving linear speed in the groove are variable. It should be noted that the lifting speed of the machining tool 3 can be variable, or the carving linear speed can be variable (in this embodiment, the lifting speed of the machining tool 3 is variable speed) until the machining tool 3 finally detaches from the polishing layer 1, completing the machining of one side of the detection window 4. After machining one side of the detection groove 5, an upwardly convex arc-shaped structure is formed on one side of the detection window 4. At the same time, the angle c between the cutting surface of the first end of the detection groove 5 and the bottom surface of the polishing layer 1 is ≤ 80 degrees, which is 10 degrees in this embodiment. In this case, the surface of the detection groove 5 is a smooth curved surface and no burrs are generated. When machining the other side of the detection window 4, a symmetrical machining method can be used.

[0067] The table below compares the smoothness of Comparative Example 1 (the angle between the groove 5 and the polished layer 1 is 85 degrees), Comparative Example 2 (the angle between the groove 5 and the polished layer 1 is 90 degrees), and Examples 1 to 9.

[0068] Smoothness Comparison Table

[0069]

[0070] As shown in the table above, when the included angle is less than 80 degrees, the smoothness of the detection groove 5 is significantly improved compared to ordinary products, which can eliminate the need for manual polishing to some extent. The smoothness is best when the included angle is 40 degrees. Furthermore, considering ease of processing, a uniform speed processing technique is generally used, that is, processing the detection groove 5 into a smooth inclined structure. Therefore, considering all the above factors, uniform speed processing of the 40-degree detection groove 5 is the preferred choice.

[0071] The present invention also includes a polishing layer and a polishing pad processed by a method for processing polishing pad grooves using a detection window.

[0072] The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and these equivalent modifications or substitutions are all included within the scope of this application.

Claims

1. A method for processing grooves in a polishing pad for a testing window, characterized in that, Includes the following steps: Step 1: The machining tool (3) starts carving grooves from the non-inspection window (4) area of ​​the polishing layer (1) of the polishing pad to form the basic groove (2); Step 2: When the machining tool (3) approaches the detection window (4), the machining tool (3) is gradually lifted until it leaves the polishing layer (1), forming a detection groove (5); wherein the detection groove (5) is an inclined structure; The detection groove (5) satisfies: a≤80 degrees; where a is the angle between the surface of the detection groove (5) and the bottom surface of the polishing layer (1), so that when a safe jump window distance is formed between the machining tool (3) and the detection window (4), the machining tool (3) has an inclined lifting stroke when it approaches the detection window (4), and a smooth retraction detection groove (5) is formed near the detection window (4). The burrs generated by the lifting of the machining tool (3) near the detection window (4) on the polyurethane polishing pad are removed by the machining angle of the detection groove (5).

2. The processing method for the polishing pad groove of the inspection window according to claim 1, characterized in that, Step two is the process of carving at a constant speed.

3. A method for processing grooves in a polishing pad for a testing window, characterized in that, Includes the following steps: Step 1: The machining tool (3) starts carving grooves from the non-inspection window (4) area of ​​the polishing layer (1) of the polishing pad to form the basic groove (2); Step 2: When the machining tool (3) approaches the detection window (4), the machining tool (3) is gradually lifted until it leaves the polishing layer (1), forming a detection groove (5); wherein the detection groove (5) is an arc-shaped structure; When the detection groove (5) is a concave arc structure, the angle b between the cut surface at the end of the detection groove (5) and the bottom surface of the polishing layer (1) is ≤80 degrees; When the detection groove (5) is an upwardly convex arc structure, the angle c between the cut surface at the beginning of the detection groove (5) and the bottom surface of the polishing layer (1) is ≤80 degrees; When a safe jump window distance is formed between the machining tool (3) and the inspection window (4), the machining tool (3) has an arc-shaped lifting stroke when it approaches the inspection window (4), and a smooth retraction inspection groove (5) is formed near the inspection window (4). The burrs generated by the lifting of the machining tool (3) near the inspection window (4) on the polyurethane polishing pad are removed by the machining angle of the inspection groove (5).

4. The method for processing the polishing pad groove of the inspection window according to claim 3, characterized in that, Step two is the processing step of variable speed carving; among them, the detection groove (5) is a concave arc structure.

5. The method for processing the polishing pad groove of the inspection window according to claim 3, characterized in that, Step 2 is the processing step of variable speed carving; among which, the detection groove (5) is an upward convex arc structure.

6. A polished layer, characterized in that, The polishing layer (1) is processed by the processing method of the polishing pad groove of the inspection window as described in any one of claims 1 to 5.

7. A polishing pad, characterized in that, The polishing pad includes at least a polishing layer (1); wherein the polishing layer (1) is the polishing layer (1) as described in claim 6.

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