Wheel speed sensor for a vehicle

Abstract

The present disclosure relates to a wheel speed sensor for a vehicle, the wheel speed sensor including a base unit, a plurality of support units provided on the base unit, and a chip unit mounted on the support units, respectively, and configured to detect a measurement target. Accordingly, the wheel speed sensor can determine external disturbances under different conditions, thereby quickly detecting external disturbances and making corrections.

Description

Technical Field

[0001] This disclosure relates to wheel speed sensors for vehicles, and more specifically, to wheel speed sensors for vehicles that can have multiple different sensor arrangements to facilitate the detection of noise factors and the performance of correction processes. Background Technology

[0002] Generally, the main brake refers to the device used to reduce the speed of a vehicle and keep it at a stop while it is in motion. Friction brakes have been used as the main brakes for vehicles. Friction brakes use a mechanical friction device to convert the kinetic energy of the moving vehicle into heat energy, and brake the vehicle while releasing frictional heat into the air.

[0003] In vehicle brakes, a device commonly known as an anti-lock braking system (ABS) ensures maneuverability by controlling hydraulic braking pressure when braking a vehicle rapidly or on a slippery surface, and improves braking performance by minimizing stopping distance. ABS broadly includes a hydraulic modulator (hydraulic unit) for controlling the hydraulic pressure supplied to the wheel cylinders based on signals from the ECU (Electronic Control Unit) for controlling the ABS, and a device for detecting the rotational state of the wheels.

[0004] In this context, the device used to detect the rotational state of the wheels is typically called a wheel speed sensor (WSS). A wheel speed sensor is a sensor that uses a Hall effect IC chip to detect the speed of each wheel. Wheel speed sensors are not only a crucial component of ABS / ESP (Electronic Stability Program, vehicle attitude control), but also provide vital information related to the control of other vehicle components.

[0005] Recently, two or more Hall effect IC chips have been housed in a single housing to improve measurement accuracy. However, these multiple Hall effect IC chips have identical performance and are positioned at the same upper end of the magnetic element being measured. Therefore, when the wheel rotates, each Hall effect IC chip acquires the same measurement value, and the control unit compares the individual signals to ensure consistency. Consequently, when all signals are distorted due to external interference, there is a problem of inaccurate signal information being provided. Therefore, this problem needs to be addressed.

[0006] The background technology disclosed herein is disclosed in Korean Patent Application Publication No. 2004-0009439 (published on January 31, 2004, entitled "Method for Detecting Vehicle Speed ​​Using a Speed ​​Sensor"). Summary of the Invention

[0007] The purpose of this disclosure is to provide a wheel speed sensor for a vehicle that can be positioned at multiple different sensor locations, thereby facilitating the detection of noise factors and the execution of corrections.

[0008] Various embodiments relate to a wheel speed sensor for a vehicle, the wheel speed sensor comprising: a base unit; a plurality of support units disposed on the base unit; and chip units respectively mounted on the support units and configured to detect a measurement target, wherein the respective chip units are configured to detect different detection values ​​with respect to the measurement target.

[0009] The chip unit can be positioned at different measurement points by changing the shape or position of the support unit.

[0010] The base unit and support unit can be integrated through injection molding.

[0011] The support unit may include: a first support unit integrated with the base unit and configured such that a first chip unit is mounted on the first support unit; and a second support unit integrated with the base unit and configured such that a second chip unit is mounted on the second support unit.

[0012] The first chip unit and the second chip unit may have a positional difference in one or more of the x-axis, y-axis and z-axis directions.

[0013] The support unit can be assembled into the base unit.

[0014] The support unit may include: a first support unit that can be attached to or detached from the base unit and is configured such that a first chip unit is mounted on the first support unit; and a second support unit that can be attached to or detached from the base unit and is configured such that a second chip unit is mounted on the second support unit.

[0015] The first chip unit and the second chip unit may have positional differences in one or more directions, namely the x-axis, y-axis and z-axis, due to shape differences or assembly position differences between the first support unit and the second support unit.

[0016] The support unit may further include a third support unit, which is connected to one or both of the first support unit and the second support unit, and is attachable to or detachable from the base unit.

[0017] The first support unit and the second support unit may have the same shape, and the first chip unit and the second chip unit may have positional differences in one or more directions, namely the x-axis direction, the y-axis direction and the z-axis direction, due to the third support unit.

[0018] According to the wheel speed sensor for vehicles disclosed herein, chip units mounted on support units disposed on a base unit can measure the target under different conditions based on the shape and position of the support units. Therefore, the wheel speed sensor can determine external interference under different conditions, thereby quickly detecting and correcting external interference. Attached Figure Description

[0019] Figure 1 This is a schematic illustration of a wheel speed sensor for a vehicle according to an embodiment of the present disclosure.

[0020] Figure 2 This is a schematic view illustrating the state in which the base unit and support unit according to the first embodiment of the present disclosure are integrated by injection molding.

[0021] Figure 3 This is a schematic illustration of a support unit that allows a positional difference between a first chip unit and a second chip unit according to a first embodiment of the present disclosure in the x-axis direction.

[0022] Figure 4 This is a schematic illustration of a support unit that allows a positional difference between a first chip unit and a second chip unit according to a first embodiment of the present disclosure in the y-axis direction.

[0023] Figure 5 This is a schematic illustration of a support unit that allows a positional difference between a first chip unit and a second chip unit according to a first embodiment of the present disclosure in the z-axis direction.

[0024] Figure 6 This is a schematic illustration of a support unit that allows a first chip cell and a second chip cell, according to a first embodiment of the present disclosure, to measure magnetic field information in opposite ways.

[0025] Figure 7 This is a schematic view illustrating the assembled state of the base unit and support unit according to the second embodiment of this disclosure.

[0026] Figure 8 This is a schematic illustration of a support unit that allows a positional difference between a first chip unit and a second chip unit according to a second embodiment of the present disclosure in the x-axis direction.

[0027] Figure 9This is a schematic illustration of a support unit that allows a positional difference between a first chip unit and a second chip unit according to a second embodiment of the present disclosure in the y-axis direction.

[0028] Figure 10 This is a schematic illustration of a fixed support unit that allows a positional difference between a first chip unit and a second chip unit according to a second embodiment of the present disclosure in the z-axis direction.

[0029] Figure 11 This is a schematic illustration of a variable support unit that allows a positional difference between a first chip cell and a second chip cell according to a second embodiment of the present disclosure in the z-axis direction.

[0030] Figure 12 This is a schematic illustration of a support unit that allows a first chip cell and a second chip cell, according to a second embodiment of the present disclosure, to measure magnetic field information in opposite ways. Detailed Implementation

[0031] In the following description, a wheel speed sensor for a vehicle will be illustrated with reference to the accompanying drawings through various exemplary embodiments.

[0032] In the following description, embodiments of a wheel speed sensor for a vehicle according to the present disclosure will be described with reference to the accompanying drawings. Here, for clarity and ease of description, the thickness of the lines, the dimensions of the constituent elements, etc., shown in the drawings may be exaggerated. Furthermore, the terminology used below is defined with consideration of the functions in this disclosure and may vary depending on the intention of the user or operator or common practice. Therefore, the terminology should be defined based on the entire contents of this specification.

[0033] Figure 1 This is a schematic illustration of a wheel speed sensor for a vehicle according to an embodiment of the present disclosure. (Refer to...) Figure 1 According to an embodiment of the present disclosure, a wheel speed sensor 1 for a vehicle includes a base unit 10, a support unit 20, and a chip unit 30.

[0034] The base unit 10 can be fixedly mounted on the vehicle body and set up adjacent to the measurement target 100.

[0035] Multiple support units 20 are disposed on the base unit 10. For example, a pair of support units 20 may be disposed on the upper surface of the base unit 10.

[0036] Chip units 30 are mounted on support units 20 and detect the target 100. For example, chip units 30 can cooperate with support units 20 and be integrated with support units 20 by injection molding. Chip units 30 can detect the magnetic field of the target 100 and transmit the detection signal to the control unit.

[0037] In this configuration, the corresponding chip unit 30 is set to detect different values ​​related to the measurement target 100. For example, when the measurement target 100 rotates, the corresponding chip unit 30 reaches a measurable position. The corresponding chip unit 30 has different heights, depths, mounting orientations, and angles, allowing the method of processing and calculating signals to be binary based on the components of the magnetic field. Therefore, accuracy can be improved based on variations in the magnetic field and the area of ​​use. Specifically, the vertical and horizontal decomposition values ​​of the magnetic field components vary depending on the position and orientation of the chip unit 30. Therefore, it is possible to quickly determine whether external interference has occurred, perform corrections, and transmit accurate signals during normal operation.

[0038] The measurement method of chip cell 30 varies depending on the strength of the magnetic field, which varies according to the physical characteristics and distance of the target 100. When the target 100 is weakly magnetic, the difference between signals measured by chip cell 30 located at multiple positions internally is used. Conversely, when the target 100 is ferromagnetic, a single signal is measured at a predetermined position. However, when the measured value varies depending on the position of chip cell 30, noise factors can be detected, and correction can be performed.

[0039] In this case, the chip unit 30 can be positioned at different measurement points by changing the shape or position of the support unit 20.

[0040] Figure 2 This is a schematic view illustrating the state in which the base unit and support unit according to the first embodiment of this disclosure are integrated by injection molding, and Figure 3 This is a schematic illustration of a support unit that allows a positional difference between a first chip unit and a second chip unit according to a first embodiment of the present disclosure in the x-axis direction. Figure 4 This is a schematic illustration of a support unit that allows a positional difference between a first chip unit and a second chip unit according to a first embodiment of the present disclosure in the y-axis direction. Figure 5 This is a schematic illustration of a support unit that allows a positional difference between a first chip unit and a second chip unit according to a first embodiment of the present disclosure in the z-axis direction. Figure 6 This is a schematic illustration of a support unit that allows a first chip cell and a second chip cell, according to a first embodiment of the present disclosure, to measure magnetic field information in opposite ways. Referring below... Figures 2 to 6 Describe the structure in which the base unit 10 and the support unit 20 are integrated by injection molding.

[0041] The base unit 10 and the support unit 20 are manufactured integrally by injection molding in a mold. In this case, when the chip unit 30 is put into the mold, the chip unit 30 can be supported by the support unit 20 during the molding process, and the chip unit 30 and the support unit 20 can be integrated so that they are covered by the base unit 10.

[0042] The support unit 20 according to the first embodiment includes a first support unit 51 and a second support unit 52. The first support unit 51 is integrated with the base unit 10, and a first chip unit 31 is mounted on the first support unit 51. The second support unit 52 is integrated with the base unit 10, and a second chip unit 32 is mounted on the second support unit 52.

[0043] Because the first support unit 51 and the second support unit 52 have different shapes or positions, the first chip unit 31 and the second chip unit 32 have positional differences in one or more of the x-axis direction, y-axis direction and z-axis direction.

[0044] More specifically, the first support unit 51 and the first chip unit 31 are disposed in the central portion of the base unit 10, and the second support unit 52 and the second chip unit 32 are disposed between the first support unit 51 and the right end of the base unit 10 (see...). Figure 3 Due to the positional difference in the x-axis direction, the signal amplitude or calculation method can be binarized by detecting the strength of the magnetic field from the measurement target 100.

[0045] Furthermore, the first support unit 51 and the first chip unit 31 are disposed on the front side of the base unit 10, while the second support unit 52 and the second chip unit 32 are disposed on the rear side of the base unit 10 (see...). Figure 4 Due to the positional difference in the y-axis direction, the signal amplitude or calculation method can be binarized by detecting the strength of the magnetic field from the measurement target 100.

[0046] Furthermore, the second support unit 52 has a longer vertical length than the first support unit 51, and the second chip unit 32 is positioned higher than the first chip unit 31 (see...). Figure 5 Due to the positional difference in the z-axis direction, the signal amplitude or calculation method can be binarized by detecting the strength of the magnetic field from the measurement target 100.

[0047] Furthermore, the first support unit 51 has an angle of inclination in the counterclockwise direction, while the second support unit 52 has an angle of inclination in the clockwise direction, such that the first chip unit 31 and the second chip unit 32 are configured to have angles of inclination in opposite directions (see...). Figure 6In this case, the components in the y-axis direction and the components in the z-axis direction can be decomposed. The vertical and horizontal components of the first chip unit 31 and the second chip unit 32 can be detected, and external noise factors can be detected from the decomposed signal in another direction.

[0048] Figure 7 This is a schematic view illustrating the assembled state of the base unit and support unit according to the second embodiment of this disclosure. Figure 8 This is a schematic illustration of a support unit that allows a positional difference between a first chip unit and a second chip unit according to a second embodiment of the present disclosure in the x-axis direction. Figure 9 This is a schematic illustration of a support unit that allows a positional difference between a first chip unit and a second chip unit according to a second embodiment of the present disclosure in the y-axis direction. Figure 10 This is a schematic illustration of a fixed support unit that allows a positional difference between the first chip unit and the second chip unit according to the second embodiment of this disclosure in the z-axis direction. Figure 11 This is a schematic illustration of a view showing a variable support unit that allows a positional difference between a first chip unit and a second chip unit according to a second embodiment of the present disclosure in the z-axis direction, and Figure 12 This is a schematic illustration of a support unit that allows the first chip cell and the second chip cell according to the second embodiment of this disclosure to measure magnetic field information in opposite ways. Referring below... Figures 7 to 12 Describe the structure of the assembly of the base unit 10 and the support unit 20.

[0049] The base unit 10 has a base hole portion 11 for assembly, and the support unit 20 can be attached to or detached from the base unit 10 via the base hole portion 11 formed in the base unit 10. The support unit 20 can be assembled to the base unit 10 via hooks, and the chip unit 30 can be mounted on the support unit 20.

[0050] The support unit 20 according to the second embodiment includes a first support unit 61 and a second support unit 62. Hooks are provided on the bottom surface of the first support unit 61 for attachment to or detachment from the base unit 10, and a first chip unit 31 is mounted on the upper part of the first support unit 61. Hooks are provided on the bottom surface of the second support unit 62 for attachment to or detachment from the base unit 10, and a second chip unit 32 is mounted on the upper part of the second support unit 62.

[0051] Because the first support unit 61 and the second support unit 62 are assembled into different shapes or positions, the first chip unit 31 and the second chip unit 32 have positional differences in one or more of the x-axis direction, y-axis direction and z-axis direction.

[0052] Furthermore, the first support unit 61 and the second support unit 62 may have the same shape, and the third support unit 63, which is connected to one or both of the first support unit 61 and the second support unit 62, may be attached to the base unit 10 or detached from the base unit 10.

[0053] More specifically, a first support unit 61, on which the first chip unit 31 is mounted, is assembled to the central portion of the base unit 10, and a second support unit 62, on which the second chip unit 32 is mounted, is assembled between the first support unit 61 and the right end of the base unit 10 (see...). Figure 8 Due to the positional difference in the x-axis direction, the signal amplitude or calculation method can be binaryed by detecting the strength of the magnetic field from the measurement target 100. In this arrangement, the first support unit 61 and the second support unit 62 can have the same shape. Furthermore, since the first support unit 61 and the second support unit 62 are selectively assembled to a plurality of base hole portions 11 formed in the base unit 10, a positional difference may occur between the first chip unit 31 and the second chip unit 32.

[0054] Furthermore, a first support unit 61, on which the first chip unit 31 is mounted, is assembled on the front side of the base unit 10, and a second support unit 62, on which the second chip unit 32 is mounted, is assembled on the rear side of the base unit 10 (see...). Figure 9 Due to the positional difference in the y-axis direction, the signal amplitude or calculation method can be binaryed by detecting the strength of the magnetic field from the measurement target 100. In this arrangement, the first support unit 61 and the second support unit 62 can have the same shape. Furthermore, since the first support unit 61 and the second support unit 62 are selectively assembled to a plurality of base hole portions 11 formed in the base unit 10, a positional difference may occur between the first chip unit 31 and the second chip unit 32.

[0055] Furthermore, since the second support unit 62 is formed to have a vertical length longer than the first support unit 61 with a fixed shape, the second chip unit 32 is positioned higher than the first chip unit 31 (see...). Figure 10 Due to the positional difference in the z-axis direction, the signal amplitude or calculation method can be binaryed by detecting the strength of the magnetic field from the measurement target 100. In this arrangement, when the first support unit 61 and the second support unit 62 have the same shape, the third support unit 63 can be additionally mounted on the second support unit 62 to adjust the height (see...). Figure 11The third support unit 63 can be engaged with the second support unit 62 by means of a hook and with the base unit 10 by means of a hook. A plurality of third support units 63 can be manufactured to have various heights or the same shape and stacked.

[0056] Furthermore, a first support unit 61 having an angle of inclination in the counterclockwise direction and a second support unit 62 having an angle of inclination in the clockwise direction are assembled to the base unit 10, such that the first chip unit 31 and the second chip unit 32 are configured to have angles of inclination in opposite directions (see...). Figure 12 In this configuration, the components along the y-axis and z-axis can be decomposed. The vertical and horizontal components of the first chip unit 31 and the second chip unit 32 can be detected, and external noise factors can be detected from the decomposed signal in another direction. In this arrangement, when the first support unit 61 and the second support unit 62 have the same shape, the third support unit 63 can be additionally mounted on one or both of the first support unit 61 and the second support unit 62 to adjust the tilt angle. The third support unit 63 can have a different tilt angle and engages with the first support unit 61 and the second support unit 62 via hooks, and also engages with the base unit 10 via hooks.

[0057] According to the wheel speed sensor 1 for a vehicle according to an embodiment of the present disclosure, chip units 30 mounted on support units 20 disposed on base unit 10 can measure target 100 under different conditions depending on the shape and position of support unit 20. Therefore, wheel speed sensor 1 can determine external interference under different conditions, thereby quickly detecting external interference and performing correction.

[0058] While this disclosure has been described with reference to exemplary embodiments depicted in the accompanying drawings, these exemplary embodiments have been described for illustrative purposes only, and those skilled in the art will understand that various modifications to the exemplary embodiments and any other exemplary embodiments equivalent thereto are available. Therefore, the true scope of protection of this disclosure should be determined by the appended claims.

[0059] Although exemplary embodiments of this disclosure have been disclosed for illustrative purposes, those skilled in the art will understand that various modifications, additions, and substitutions may be made without departing from the scope and spirit of this disclosure as defined by the appended claims.

[0060] Cross-reference to related applications

[0061] This application claims priority and benefit to Korean Patent Application No. 10-2021-0127445, filed on September 27, 2021, which is incorporated herein by reference for all purposes, as set forth herein.

Claims

1. A wheel speed sensor for a vehicle, the wheel speed sensor comprising: A base unit having an upper surface and a lower surface facing different directions; Multiple support units are disposed on the upper surface of the base unit; as well as Chip units, each mounted on the support unit and configured to detect and measure the magnetic field of the target, The corresponding chip units are configured to have different heights, depths, installation directions, or angles relative to the measurement target, such that the components of the magnetic field of the measurement target detected by the corresponding chip units have different detection values.

2. The wheel speed sensor for a vehicle according to claim 1, wherein, The chip unit can be positioned at different measurement points by changing the shape or position of the support unit.

3. The wheel speed sensor for a vehicle according to claim 1, wherein, The base unit and the support unit are integrated by injection molding.

4. The wheel speed sensor for a vehicle according to claim 3, wherein, The support unit includes: A first support unit, integrated with the base unit, and configured such that a first chip unit is mounted on the first support unit; and The second support unit is integrated with the base unit and is configured such that the second chip unit is mounted on the second support unit.

5. The wheel speed sensor for a vehicle according to claim 4, wherein, The first chip unit and the second chip unit have positional differences in one or more of the x-axis, y-axis and z-axis directions.

6. The wheel speed sensor for a vehicle according to claim 1, wherein, The support unit is assembled onto the base unit.

7. The wheel speed sensor for a vehicle according to claim 6, wherein, The support unit includes: A first support unit, which is attachable to or detachable from the base unit, and configured such that a first chip unit is mounted on the first support unit; and A second support unit, which can be attached to or detached from the base unit, is configured such that a second chip unit is mounted on the second support unit.

8. The wheel speed sensor for a vehicle according to claim 7, wherein, The first chip unit and the second chip unit have positional differences in one or more directions, namely the x-axis, y-axis and z-axis, due to shape differences or assembly position differences between the first support unit and the second support unit.

9. The wheel speed sensor for a vehicle according to claim 7, wherein, The support unit further includes a third support unit, which is connected to one or both of the first support unit and the second support unit, and can be attached to or detached from the base unit.

10. The wheel speed sensor for a vehicle according to claim 9, wherein, The first support unit and the second support unit have the same shape, and the first chip unit and the second chip unit have positional differences in one or more directions, namely the x-axis direction, the y-axis direction and the z-axis direction, due to the third support unit.

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