A buffer structure for fiber optic sensors and its fabrication method

Abstract

This invention discloses a buffer structure for fiber optic sensors and its fabrication method, comprising the following steps: providing a substrate, coating the substrate with a polymer colloidal material, and homogenizing the polymer colloidal material to form a homogenized layer; imprinting the homogenized layer using a V-groove mold to form a V-groove on the homogenized layer, and performing segmented heat treatment until the homogenized layer is completely cured; removing the V-groove mold to form a homogenized layer with V-grooves on the substrate, obtaining a composite containment layer; cutting the composite containment layer to production dimensions, and then thermosetting the composite containment layer using a bending mold to obtain a bent composite containment layer with a corresponding bending radius; providing a cover plate, and thermosetting the cover plate using a bending mold to obtain a bent cover plate with the same bending radius as the bent composite containment layer, thus completing the fabrication of the buffer structure. This invention achieves the goal of reducing the installation difficulty of fiber optic sensors and improving their installation applicability.

Description

Technical Field

[0001] This invention relates to the field of optical fiber technology, and specifically to a buffer structure for optical fiber sensors and its fabrication method. Background Technology

[0002] Sensors have been widely used in daily life. With the advent of optical fiber, a new generation of transmission medium, sensors have been further developed, leading to the emergence of fiber optic sensors. The rapid development of fiber optic sensors began in 1977, and their development has now matured significantly. The impact of this new technology is now quite evident, marking a significant milestone in human informatization. As an excellent sensing element, optical fiber is suitable for long-distance transmission and wide monitoring range. Furthermore, its small size, light weight, and resistance to electromagnetic interference and radiation make it suitable for monitoring in harsh environments, such as flammable, explosive, and electromagnetically contaminated environments. Therefore, fiber optic sensors have been widely researched and applied in various fields, becoming a pioneer in the sensor industry.

[0003] Furthermore, fiber optic sensors have significant application value in fields such as new energy vehicles, chemical industry, and power industry. However, when fiber optic sensors are used for detection in these fields, installation is required first. During installation, fiber optic sensors are prone to large bends, even near 90 degrees, which can lead to high losses or even breakage.

[0004] Therefore, when using fiber optic sensors for detection, installers should avoid large bends during installation, as this greatly increases the difficulty of installation and limits the applicability of fiber optic sensors in industrial applications. Summary of the Invention

[0005] To overcome the shortcomings of the prior art, the present invention provides a buffer structure for fiber optic sensors and its preparation method, which solves the technical problem that fiber optic sensors are prone to large bending during installation, resulting in large losses or even breakage, thereby reducing the installation difficulty of fiber optic sensors and improving their installation applicability.

[0006] To solve the above problems, the technical solution adopted by the present invention is as follows:

[0007] A method for fabricating a buffer structure for an optical fiber sensor includes the following steps:

[0008] A substrate is provided, a polymer colloidal material is coated on the substrate, and the polymer colloidal material is homogenized to form a homogenized layer;

[0009] The adhesive layer is imprinted using a V-groove mold to form a V-groove on the adhesive layer. After the adhesive layer is completely cured by segmented heat treatment, the V-groove mold is removed, and an adhesive layer with a V-groove is formed on the substrate to obtain a composite containment layer.

[0010] After the composite accommodating layer is cut to the production size, it is thermoformed using a bending die to obtain a bent composite accommodating layer with a corresponding bending radius.

[0011] A cover plate is provided, and the cover plate is thermoformed using a bending die to obtain a bent cover plate with the same bending radius as the bent composite accommodating layer, thus completing the preparation of the buffer structure;

[0012] The fiber optic sensor is placed in the V-groove of the curved composite receiving layer, and the curved cover plate is aligned with the curved composite receiving layer and fixed to complete the buffering of the fiber optic sensor.

[0013] In a preferred embodiment of the present invention, forming a homogeneous layer includes:

[0014] The polymer colloidal material is homogenized at a rotation speed of 500 to 1500 rpm until a homogenized layer with a thickness of 1 to 2 mm is formed.

[0015] In a preferred embodiment of the present invention, when imprinting the uniform adhesive layer using a V-groove mold, the following steps are included:

[0016] The uniform adhesive layer is directly imprinted using a V-groove mold with a depth of 250–900 μm and an in-groove angle of 30–40 degrees.

[0017] In a preferred embodiment of the present invention, the process of performing segmented heat treatment until the homogeneous adhesive layer is completely cured includes:

[0018] The uniform adhesive layer forming the V-groove is raised from room temperature to 60 degrees Celsius at a temperature gradient of 3-5 degrees Celsius per minute, and held at 60 degrees Celsius for 0.5-1 hour. Then, the temperature is raised to 110 degrees Celsius at a temperature gradient of 3-5 degrees Celsius per minute, and cured at 110 degrees Celsius for 2-2.5 hours until the uniform adhesive layer forming the V-groove is completely cured.

[0019] In a preferred embodiment of the present invention, cutting the composite accommodating layer to production dimensions includes:

[0020] The composite accommodating layer is diced using a diamond dicing machine or a laser dicing machine to obtain a composite accommodating layer with a width of 3-6 mm and a length of 10-20 mm.

[0021] In a preferred embodiment of the present invention, obtaining a curved composite accommodating layer with a corresponding bending radius includes:

[0022] After the composite accommodating layer is attached to the bending mold, it is heated and bent at 75-85 degrees Celsius to obtain a bending composite accommodating layer with a bending radius of 5-30 mm.

[0023] In a preferred embodiment of the present invention, providing a cover plate and obtaining a bent cover plate includes:

[0024] A cover plate with a thickness of 1-2 mm, a width of 3-6 mm, and a length of 10-20 mm is provided. After the cover plate is attached to the bending mold, it is heated and bent at 75-85 degrees Celsius to obtain the bent cover plate.

[0025] The length and width of the cover plate are consistent with the length and width of the cut composite accommodating layer.

[0026] A buffer structure for fiber optic sensors, prepared by the above-described method, includes a bent composite accommodating layer and a bent cover plate. The bent composite accommodating layer includes a substrate and a homogenized layer with V-grooves. The substrate is made of a polymer material with an elastic modulus of 1500-4000 MPa.

[0027] In a preferred embodiment of the present invention, the polymer material used for the spin coat layer with V-grooves is polydimethylsiloxane or polyimide.

[0028] In a preferred embodiment of the present invention, the curved cover plate is made of polyvinyl chloride or polymethyl methacrylate.

[0029] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0030] (1) The buffer structure provided by the present invention is based on the difference in Young's modulus between the optical fiber sensor and the bending composite accommodating layer. The flexibility of the bending composite accommodating layer effectively reduces the probability of the optical fiber sensor breaking and generating large losses under bending conditions, thereby effectively protecting the optical fiber sensor.

[0031] (2) The buffer structure provided by the present invention limits the bending radius of the fiber optic sensor during installation to the bending radius of the buffer structure itself, thereby effectively preventing the fiber optic sensor from generating large losses or breaking due to large bending.

[0032] (3) The buffer structure provided by the present invention prevents large bending during the installation of the fiber optic sensor, thereby greatly reducing the installation difficulty of the fiber optic sensor and improving the applicability of the fiber optic sensor in industrial applications.

[0033] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0034] Figure 1 - is a physical installation diagram of the buffer structure for an optical fiber sensor according to an embodiment of the present invention;

[0035] Figure 2 -yes Figure 1 Optical loss test diagram of the buffer structure for fiber optic sensors installed in the middle;

[0036] Figure 3 - is a usage state diagram of the buffer structure for an optical fiber sensor according to an embodiment of the present invention;

[0037] Figure 4 - is an exploded view of the buffer structure for an optical fiber sensor according to an embodiment of the present invention;

[0038] Figure 5 - is a schematic diagram of the bent composite accommodating layer of the buffer structure for an optical fiber sensor according to an embodiment of the present invention;

[0039] Figure 6 - is a schematic diagram of a V-groove-covered homogenized layer for a buffer structure of an optical fiber sensor according to an embodiment of the present invention.

[0040] Figure 7 - This is a step diagram illustrating the fabrication method of a buffer structure for an optical fiber sensor according to an embodiment of the present invention.

[0041] The reference numerals in the attached figures are as follows: 1. Substrate; 2. Adhesive layer with V-groove; 3. Bending composite receiving layer; 4. Bending cover plate; 5. Fiber optic sensor; 6. Fixing component. Detailed Implementation

[0042] The method for fabricating the buffer structure for the fiber optic sensor 5 provided by this invention, such as... Figure 7 As shown, it includes the following steps:

[0043] Step S1: Provide a substrate 1, coat the substrate 1 with a polymer colloidal material, and homogenize the polymer colloidal material to form a homogenized layer.

[0044] Step S2: Use a V-groove mold to imprint the homogeneous layer, forming a V-groove on the homogeneous layer. After performing segmented heat treatment until the homogeneous layer is completely cured, remove the V-groove mold and form a homogeneous layer 2 with a V-groove on the substrate 1 to obtain a composite containment layer.

[0045] Step S3: After cutting the composite accommodating layer to the production size, use a bending die to thermoset the composite accommodating layer to obtain a bent composite accommodating layer 3 with a corresponding bending radius;

[0046] Step S4: Provide a cover plate, use a bending die to thermoset the cover plate to obtain a bent cover plate 4 with the same bending radius as the bent composite accommodating layer 3, and complete the preparation of the buffer structure;

[0047] The fiber optic sensor 5 is placed in the V-groove of the curved composite receiving layer 3, and the curved cover plate 4 is aligned with the curved composite receiving layer 3 and fixed to complete the buffering of the fiber optic sensor 5.

[0048] Specifically, when fixing the curved cover plate 4 after aligning it with the curved composite receiving layer 3, the curved cover plate 4 and the curved composite receiving layer 3 can be fixed by the fixing component 6, or the curved cover plate 4 and the curved composite receiving layer 3 can be directly bonded and fixed by the adhesive.

[0049] Furthermore, the curved cover plate 4 and the curved composite receiving layer 3 are fixed by fixing component 6, so that the buffer structure can be reused.

[0050] Furthermore, such as Figure 3 and Figure 4 As shown, the fixing component 6 is a plastic clip or a metal clip.

[0051] In step S1 above, as Figure 4 As shown, forming a homogeneous layer includes:

[0052] The polymer colloidal material is homogenized at a speed of 500 to 1500 rpm until a homogenized layer with a thickness of 1 to 2 mm is formed.

[0053] Specifically, using the aforementioned rotation speed for homogenization ensures that the polymer colloidal material forms a homogenized layer of uniform thickness on the substrate 1, while also ensuring reliable contact between the homogenized layer and the substrate 1.

[0054] In step S2 above, as Figure 5 As shown, the process of imprinting the adhesive layer using a V-groove mold includes:

[0055] The uniform adhesive layer is directly imprinted using a V-groove mold with a depth of 250–900 μm and an in-groove angle of 30–40 degrees.

[0056] Specifically, the V-groove-coated layer 2 prepared by using the V-groove mold with the above-mentioned depth and groove angle can ensure that the V-groove on the coating layer can fully accommodate the fiber optic sensor 5. At the same time, the V-groove at the above-mentioned depth and groove angle can also ensure that the fiber optic sensor 5 is not easily displaced in the groove, and the inner wall of the V-groove will not exert great pressure on the fiber optic sensor 5, thereby effectively avoiding the coating layer from causing great loss to the fiber optic sensor 5.

[0057] Furthermore, the uniform adhesive layer is directly imprinted using a V-groove mold with multiple V-grooves to obtain a uniform adhesive layer with multiple V-grooves. In the subsequent cutting step, each V-groove is cut and then thermosetting is performed to achieve mass production of the buffer structure.

[0058] In step S2 above, as Figure 4 As shown, the process of performing segmented heat treatment until the adhesive layer is completely cured includes:

[0059] The uniform adhesive layer forming the V-grooves is raised from room temperature to 60 degrees Celsius at a temperature gradient of 3-5 degrees Celsius per minute. After being held at 60 degrees Celsius for 0.5-1 hour, the temperature is raised to 110 degrees Celsius at a temperature gradient of 3-5 degrees Celsius per minute. The uniform adhesive layer forming the V-grooves is then cured at 110 degrees Celsius for 2-2.5 hours until the uniform adhesive layer forming the V-grooves is completely cured.

[0060] Specifically, a temperature gradient is used to slowly partially cure the spin coat at 60 degrees Celsius, which helps to form a uniformly cured network structure with low internal stress. Above 60 degrees Celsius, a temperature gradient is used to gradually cure the spin coat completely, resulting in a fully cured spin coat with good mechanical properties and heat resistance.

[0061] In step S3 above, when cutting the composite containment layer to production dimensions, the following is included:

[0062] The composite accumulator layer is diced using a diamond dicing machine or a laser dicing machine to obtain a composite accumulator layer with a width of 3-6 mm and a length of 10-20 mm.

[0063] Specifically, the composite housing layer of the above dimensions can not only accommodate the fiber optic sensor 5 well and provide sufficient protection for the fiber optic sensor 5, but also will not occupy too much installation space.

[0064] In step S3 above, such as Figure 4 and Figure 5 As shown, when obtaining the curved composite accommodating layer 3 with a corresponding bending radius, it includes:

[0065] After the composite accommodating layer is attached to the bending mold, it is heated and bent at 75-85 degrees Celsius to obtain a bending composite accommodating layer 3 with a bending radius of 5-30 mm.

[0066] Specifically, thermosetting at the above temperature ensures complete curing of the composite containment layer without causing thermal defects in the material. The bending composite containment layer 3 within this bending radius range can basically meet the installation bending radius range required for testing the fiber optic sensor 5 in different fields, and this bending radius range can ensure that the fiber optic sensor 5 will not experience large losses or breakage.

[0067] In step S4 above, as Figure 4 As shown, providing a cover plate and obtaining the bent cover plate 4 includes:

[0068] A cover plate with a thickness of 1-2 mm, a width of 3-6 mm, and a length of 10-20 mm is provided. After the cover plate is attached to the bending mold, it is heated and bent at 75-85 degrees Celsius to obtain the bent cover plate 4.

[0069] The length and width of the cover plate are consistent with the length and width of the cut composite containment layer.

[0070] Specifically, using a cover plate of the aforementioned thickness can effectively protect the fiber optic sensor 5 while ensuring that the cover plate is not too thick, thus preventing the buffer structure from occupying too much installation space when used to protect the fiber optic sensor 5.

[0071] The buffer structure for the fiber optic sensor 5 provided by this invention, such as Figure 3 and Figure 4 As shown, the composite material prepared by the above preparation method includes a curved composite accommodating layer 3 and a curved cover plate 4. The curved composite accommodating layer 3 includes a substrate 1 and a uniform adhesive layer 2 with a V-groove. The substrate 1 is made of a polymer material with an elastic modulus of 1500-4000 MPa.

[0072] Furthermore, the material used for substrate 1 is polyvinyl chloride or polymethyl methacrylate.

[0073] Furthermore, the polymer material used in the spin coat layer 2 with V-grooves is polydimethylsiloxane or polyimide.

[0074] Furthermore, the material used for the curved cover plate 4 is polyvinyl chloride or polymethyl methacrylate.

[0075] The following embodiments are further illustrations of the present invention, but the scope of the present invention is not limited thereto.

[0076] The specific parameters of the buffer structure used for fiber optic sensor 5 are as follows:

[0077] Substrate 1: The material is polyvinyl chloride, with a thickness of 1mm;

[0078] 2. Spread coating layer with V-groove: The material is polydimethylsiloxane, and the thickness is 1mm;

[0079] Curved cover plate 4: The material is polyvinyl chloride with a thickness of 1mm;

[0080] Based on the above specific parameters, a buffer structure with a bending radius of 2cm is obtained. The actual installation diagram of this buffer structure is shown below. Figure 1 As shown. For Figure 1 The installed buffer structure was subjected to optical loss testing, specifically as follows: Figure 2 As shown.

[0081] Depend on Figure 2 As can be seen from the spectrum, the input broadband spectrum and the output broadband spectrum basically overlap, indicating that the buffer structure provided by this invention buffers the fiber optic sensor 5 so that the loss of the fiber optic sensor 5 is almost zero when it is bent.

[0082] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0083] (1) The buffer structure provided by the present invention is based on the difference in Young's modulus between the optical fiber sensor and the bending composite accommodating layer. The flexibility of the bending composite accommodating layer effectively reduces the probability of the optical fiber sensor breaking and suffering large losses under bending conditions, thereby effectively protecting the optical fiber sensor.

[0084] (2) The buffer structure provided by the present invention limits the bending radius of the fiber optic sensor during installation to the bending radius of the buffer structure itself, thereby effectively preventing the fiber optic sensor from suffering large losses or breaking due to large bending.

[0085] (3) The buffer structure provided by the present invention prevents large bending during the installation of the fiber optic sensor, thereby greatly reducing the installation difficulty of the fiber optic sensor and improving the applicability of the fiber optic sensor in industrial applications.

[0086] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A method for fabricating a buffer structure for an optical fiber sensor, characterized in that, Includes the following steps: A substrate is provided, a polymer colloidal material is coated on the substrate, and the polymer colloidal material is homogenized to form a homogenized layer; The adhesive layer is imprinted using a V-groove mold to form a V-groove on the adhesive layer. After the adhesive layer is completely cured by segmented heat treatment, the V-groove mold is removed, and an adhesive layer with a V-groove is formed on the substrate to obtain a composite containment layer. After the composite accommodating layer is cut to the production size, it is heated and bent into shape using a bending die to obtain a bent composite accommodating layer with a corresponding bending radius. A cover plate is provided, and the cover plate is heat-formed and bent using a bending die to obtain a bent cover plate with the same bending radius as the bent composite accommodating layer, thus completing the preparation of the buffer structure; The fiber optic sensor is placed in the V-groove of the curved composite receiving layer, and the curved cover plate is aligned with the curved composite receiving layer and fixed to complete the buffering of the fiber optic sensor.

2. The method for fabricating a buffer structure for an optical fiber sensor according to claim 1, characterized in that, When forming a homogenized layer, the process includes homogenizing the polymer colloidal material at a rotation speed of 500 to 1500 rpm until a homogenized layer with a thickness of 1 to 2 mm is formed.

3. The method for fabricating a buffer structure for an optical fiber sensor according to claim 1, characterized in that, When imprinting the uniform adhesive layer using a V-groove mold, the process includes: directly imprinting the uniform adhesive layer using a V-groove mold with a depth of 250–900 μm and an in-groove angle of 30–40 degrees.

4. The method for fabricating a buffer structure for an optical fiber sensor according to claim 1, characterized in that, The process of performing segmented heat treatment until the spin coat is completely cured includes: raising the spin coat forming the V-groove from room temperature to 60 degrees Celsius at a temperature gradient of 3 to 5 degrees Celsius per minute, holding it at 60 degrees Celsius for 0.5 to 1 hour, then raising the temperature to 110 degrees Celsius at a temperature gradient of 3 to 5 degrees Celsius per minute, and curing it at 110 degrees Celsius for 2 to 2.5 hours until the spin coat forming the V-groove is completely cured.

5. The method for fabricating a buffer structure for an optical fiber sensor according to claim 1, characterized in that, When cutting the composite accommodating layer to production size, the process includes: using a diamond dicing machine or a laser dicing machine to dice the composite accommodating layer to obtain a composite accommodating layer with a width of 3-6 mm and a length of 10-20 mm.

6. The method for fabricating a buffer structure for an optical fiber sensor according to claim 1, characterized in that, When obtaining a bending composite accommodating layer with a corresponding bending radius, the process includes: attaching the composite accommodating layer to the bending mold, and then heating and bending it at 75 to 85 degrees Celsius to obtain a bending composite accommodating layer with a bending radius of 5 to 30 mm.

7. The method for fabricating a buffer structure for an optical fiber sensor according to claim 1, characterized in that, The process of providing a cover plate and obtaining a bent cover plate includes: providing a cover plate with a thickness of 1-2 mm, a width of 3-6 mm, and a length of 10-20 mm; attaching the cover plate to the bending mold; and then heating and bending it at 75-85 degrees Celsius to obtain the bent cover plate; wherein the length and width of the cover plate are consistent with the length and width of the cut composite accommodating layer.

Images