One-to-two server water-cooling plate cooling system

Abstract

The application relates to a one-to-two server water-cooling plate cooling system, and belongs to the technical field of server part cooling, which comprises a main water-cooling plate attached to CPUs and DIMMs of a mainboard, the main water-cooling plate is provided with a water inlet and a water outlet, the inside of the main water-cooling plate is provided with transversely and longitudinally intersecting transverse partitions and longitudinal partitions, the upper and lower ends of the main water-cooling plate are respectively provided with two CPU water-cooling plates and three groups of DIMM water-cooling plates which are in communication with the inside space of the main water-cooling plate, the CPU water-cooling plates and the main water-cooling plate are in communication through two communication ports, and two shunt ports are formed in the transverse partitions. The application adopts a sandwich stacked form of a cold plate type liquid-cooled server computing module, fully utilizes a heat dissipation space, adapts to a high-density and high-power-consumption server application scene, meets the heat dissipation demand of a high-power-density cabinet, and through the setting of the shunt ports and return ports, the consistency of the temperatures of four CPUs of high-power-consumption components can be controlled, and the situation that the temperatures of the CPUs flowing through the later stage in the full series connection process are too high can be avoided.

Description

Technical Field

[0001] This invention relates to a water-cooled plate cooling system for a dual-server architecture, belonging to the field of server component cooling technology. Background Technology

[0002] To promote energy conservation and carbon reduction in data centers, addressing the cooling system—which accounts for a significant portion of the electricity consumption of IT equipment—is crucial. In recent years, the wattage of heat generated per unit space in data centers has been steadily increasing, along with power density, severely restricting the further application and promotion of traditional cooling methods and technologies. Traditional air-cooled data centers can typically handle rack cooling up to 12kW, but as server power consumption increases, the power of servers that can be accommodated in a standard server rack of the original size often exceeds 15kW, reaching the limit of air convection cooling capacity. Liquid cooling, as an advanced cooling technology that can support higher power densities, has become an important choice for new data centers.

[0003] In a cold-plate liquid cooling system, heat-generating components do not directly contact the liquid. Instead, they dissipate heat through direct contact with a cold plate containing liquid, or by heat-conducting components transferring heat to the cold plate, where it is then carried away by the circulating liquid. Because server chips and other heat-generating components do not directly contact the liquid, cold-plate liquid cooling requires minimal modifications to existing server chip components and accessories, offering greater operability and making it the most mature and widely used liquid cooling solution currently available.

[0004] Current technical solutions primarily employ single-phase, single-sided cold plate liquid cooling. One cold plate system is paired with one server host. Single-phase cold plate liquid cooling uses a pump to drive coolant through channels on the back of the chip. Within these channels, the coolant exchanges heat with the chip through the plate walls, carrying away its heat. The cooled coolant then dissipates heat within a heat exchange module. However, because the cold plate only concentrates cooling on core heat-generating components such as the CPU, integrated circuits, and random access memory (RAM), other electrical components of the server still require air cooling. This outdated cooling architecture cannot meet the application requirements of high-density data center servers with higher space requirements and greater integration.

[0005] Against this backdrop, based on the most widely used typical server single-board system architecture, a sandwich stacking architecture is proposed, which sandwiches a cold plate between two server motherboards. Summary of the Invention

[0006] The purpose of this invention is to address the aforementioned problems by providing a one-to-two server water-cooled plate cooling system that fully utilizes heat dissipation space to adapt to high-density, high-power server application scenarios, meets the heat dissipation requirements of high-power-density server racks, and improves the efficiency of liquid-cooled plates in data centers.

[0007] This invention is achieved through the following technical solution:

[0008] This refers to a dual-server water-cooled plate cooling system, comprising a main water-cooled plate attached to the CPU and DIMM on the motherboard. The main water-cooled plate has an inlet and an outlet. The main water-cooled plate has intersecting horizontal and vertical partitions inside. The upper and lower ends of the main water-cooled plate are respectively provided with two CPU water-cooled plates and three sets of DIMM water-cooled plates that communicate with the internal space of the main water-cooled plate. The CPU water-cooled plates are connected to the main water-cooled plate through two connecting ports. Two diversion ports are opened on the horizontal partitions. In the horizontal direction, the two diversion ports are located between the CPU and the adjacent DIMM water-cooled plates. A return port is also opened at the end of the horizontal partition.

[0009] This invention employs a sandwich-stacked cold-plate liquid-cooled server computing module. The module utilizes a staggered stacking structure of motherboard-cold plate-motherboard, supporting two data center server PCB motherboards. The cold plate in the middle is covered by both motherboards. Besides covering high-heat-generating components like the CPU and DDR, the cold plate can also cover hard drives, network cards, GPU cards, and other components, achieving integrated cooling. This fully utilizes the heat dissipation space to adapt to high-density, high-power server applications, meeting the heat dissipation requirements of high-power-density server racks and improving the efficiency of liquid-cooled cold plates in data centers. Through the design of shunt and return ports, the temperature consistency of the four CPUs (high-power components) can be controlled, preventing overheating of CPUs in the later stages of the cascaded cooling process.

[0010] A further improvement of the present invention is that the CPU water cooling plate includes CPU water cooling plate one, CPU water cooling plate two, CPU water cooling plate three, and CPU water cooling plate four, each CPU water cooling plate being in close contact with one CPU. Each CPU water cooling plate is responsible for cooling one CPU, and the CPU water cooling plate is in close contact with the CPU, resulting in high cooling efficiency.

[0011] A further improvement of the present invention is that the DIMM water-cooled plate includes DIMM water-cooled plate one, DIMM water-cooled plate two, DIMM water-cooled plate three, DIMM water-cooled plate four, DIMM water-cooled plate five, and DIMM water-cooled plate six, with each group of DIMM water-cooled plates comprising multiple plates, and each DIMM having DIMM water-cooled plates tightly attached to both sides. Each DIMM has two DIMM water-cooled plates tightly attached to both sides, resulting in high cooling efficiency.

[0012] A further improvement of the present invention is that the transverse partition includes a first diversion port and a second diversion port. In the transverse direction, the first diversion port is located between the first CPU water cooling plate and the adjacent DIMM that is far away from the inlet side, and the second diversion port is located between the second CPU water cooling plate and the adjacent DIMM that is far away from the inlet side.

[0013] A further improvement of the present invention is that a guide plate is provided at the water inlet end of the diversion port, and the guide plate is inclined in the opposite direction of the water flow. The guide plate plays a guiding role, allowing the coolant to pass through the diversion port more smoothly.

[0014] A further improvement of this invention is that the two main boards on the upper and lower layers, as well as the main water-cooling plate in the middle layer, are connected by bolts. This mounting structure makes the two main boards and the water-cooling plate a single unit, ensuring its reliability.

[0015] A further improvement of the present invention is that the water inlet and the water outlet are located on the same side of the main water-cooling plate, and the water inlet and the water outlet are arranged diagonally.

[0016] A further improvement of the present invention is that a thermal pad or gel is provided between the CPU and the CPU water-cooling plate. This helps to further enhance the heat dissipation effect.

[0017] A further improvement of the present invention is that the internal space of the CPU water cooling plate is provided with a microchannel or a serpentine channel, and the two ends of the microchannel or serpentine channel are connected to two connecting ports.

[0018] A further improvement of the present invention is that the connection port between the CPU water-cooling plate one and the main water-cooling plate is called connection port one; the connection port between the CPU water-cooling plate two and the main water-cooling plate is called connection port two; the connection port between the CPU water-cooling plate three and the main water-cooling plate is called connection port three; and the connection port between the CPU water-cooling plate four and the main water-cooling plate is called connection port four. A baffle plate one is provided on the outlet end of connection port one near the inlet, and a baffle plate two is provided on the outlet end of connection port one near the inlet of the two connection ports two. Baffle plates one and two are in contact with the bottom surface of the transverse partition. The baffle plates act to block the coolant, allowing the coolant to completely and smoothly enter the two CPU water-cooling plates below the main water-cooling plate.

[0019] Compared with the prior art, the beneficial effects of this invention are:

[0020] This invention employs a sandwich-stacked cold-plate liquid-cooled server computing module. The module utilizes a staggered stacking structure of motherboard-cold plate-motherboard, supporting two data center server PCB motherboards. The cold plate in the middle is covered by both motherboards. Besides covering high-heat-generating components like the CPU and DDR, the cold plate can also cover hard drives, network cards, GPU cards, and other components, achieving integrated cooling. This fully utilizes the heat dissipation space to adapt to high-density, high-power server applications, meeting the heat dissipation requirements of high-power-density server racks and improving the efficiency of liquid-cooled cold plates in data centers. Through the design of shunt and return ports, the temperature consistency of the four CPUs (high-power components) can be controlled, preventing overheating of CPUs in the later stages of the cascaded cooling process. Attached Figure Description

[0021] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a structural schematic diagram of a specific embodiment of the present invention.

[0023] Figure 2 yes Figure 1 A schematic diagram of the left-side view structure.

[0024] Figure 3 This is a top view schematic diagram of the main water-cooling plate, DIMM water-cooling plate, and CPU water-cooling plate according to a specific embodiment of the present invention.

[0025] In the diagram: 1. Motherboard; 2. CPU; 3. DIMM; 4. Main water-cooling plate; 5. Horizontal baffle; 6. Vertical baffle; 7. DIMM water-cooling plate one; 8. DIMM water-cooling plate two; 9. DIMM water-cooling plate three; 10. DIMM water-cooling plate four; 11. DIMM water-cooling plate five; 12. DIMM water-cooling plate six; 13. CPU water-cooling plate one; 14. CPU water-cooling plate two; 15. CPU water-cooling plate three; 16. CPU water-cooling plate four; 17. Connecting port one; 18. Baffle plate one; 19. Connecting port two; 20. Baffle plate two; 21. Diverting port one; 22. Diverting port two; 23. Connecting port three; 24. Connecting port four; 25. Inlet; 26. Outlet; 27. Return port; 28. Flow guide plate; 29. ​​Bolt connector. Detailed Implementation

[0026] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0027] like Figures 1 to 3 The illustrated dual-server water-cooled plate cooling system includes a main water-cooled plate 4 attached to a CPU 2 and a DIMM 3 on a motherboard 1. The main water-cooled plate 4 has an inlet 25 and an outlet 26. The main water-cooled plate 4 has intersecting horizontal partitions 5 and vertical partitions 6 inside. The upper and lower ends of the main water-cooled plate 4 are respectively provided with two CPU water-cooled plates and three sets of DIMM water-cooled plates that communicate with the internal space of the main water-cooled plate 4. The CPU water-cooled plates are connected to the main water-cooled plate 4 through two connecting ports. Two diversion ports are opened on the horizontal partitions 5. In the horizontal direction, the two diversion ports are located between the CPU 2 and the adjacent DIMM water-cooled plates. A return port 27 is also opened at the end of the horizontal partition 5.

[0028] This cold-plate liquid-cooled server computing module adopts a sandwich-stacked configuration, with an alternating stacking structure of motherboard 1-cold plate-motherboard 1. It can support two data center server PCB motherboards 1, with the cold plate in the middle covered by the two motherboards 1. Besides covering the CPU2 and DDR high-heat-generating components, the cold plate can also cover hard drives, network cards, GPU cards, and other components, achieving an integrated cooling effect. It fully utilizes the heat dissipation space to adapt to high-density, high-power server applications, meeting the heat dissipation requirements of high-power-density racks and improving the efficiency of the liquid-cooled cold plate in data centers. Through the configuration of the distribution port and return port 27, it can control the temperature consistency of the four CPU2 components, preventing overheating of the CPU2 components that flow through the later stages of the fully cascaded process.

[0029] The CPU water cooling system includes CPU water cooling plate 13, CPU water cooling plate 2 14, CPU water cooling plate 3 15, and CPU water cooling plate 4 16, each of which is in close contact with one CPU 2. Each CPU water cooling plate is responsible for cooling one CPU 2, and because the CPU water cooling plate is in close contact with the CPU 2, the cooling efficiency is high.

[0030] The connection port between CPU water cooling plate 13 and main water cooling plate 4 is connection port 17; the connection port between CPU water cooling plate 24 and main water cooling plate 4 is connection port 29; the connection port between CPU water cooling plate 35 and main water cooling plate 4 is connection port 323; and the connection port between CPU water cooling plate 46 and main water cooling plate 4 is connection port 424. A baffle plate 18 is installed on the outlet end of connection port 17, which is closer to the inlet 25. A baffle plate 20 is installed on the outlet end of connection port 29, which is closer to the inlet 25. Baffle plates 18 and 20 are in contact with the bottom surface of the transverse partition 5. The baffle plates act as barriers to block the coolant, allowing the coolant to completely and smoothly enter the two CPU water cooling plates below the main water cooling plate 4.

[0031] The DIMM water-cooled plate includes DIMM water-cooled plate 1 (7), DIMM water-cooled plate 2 (8), DIMM water-cooled plate 3 (9), DIMM water-cooled plate 4 (10), DIMM water-cooled plate 5 (11), and DIMM water-cooled plate 6 (12). Each group of DIMM water-cooled plates includes multiple plates, and each DIMM 3 has two DIMM water-cooled plates tightly attached to both sides, resulting in high cooling efficiency.

[0032] The diaphragm 5 includes a first branch port 21 and a second branch port 22. In the lateral direction, the first branch port 21 is located between the CPU water cooling plate 13 and the adjacent DIMM 3 which is far away from the inlet 25, and the second branch port 22 is located between the CPU water cooling plate 14 and the adjacent DIMM 3 which is far away from the inlet 25.

[0033] The inlet of the distributor is equipped with a guide plate 28, which is inclined in the opposite direction of the water flow. The guide plate 28 serves to guide the flow, allowing the coolant to pass through the distributor more smoothly.

[0034] The two main boards 1 on the upper and lower layers and the main water-cooling plate 4 in the middle layer are connected by bolts 29. This installation structure makes the two main boards 1 and the water-cooling plate a whole, ensuring its reliability.

[0035] The inlet 25 and outlet 26 are located on the same side of the main water-cooled plate 4, and the inlet 25 and outlet 26 are diagonally arranged.

[0036] A thermal pad or gel is placed between CPU2 and the CPU water cooling plate to further enhance heat dissipation.

[0037] The CPU water cooling plate has microchannels or serpentine channels inside, and the two ends of the microchannels or serpentine channels are connected to two connecting ports.

[0038] Working principle:

[0039] This invention employs a sandwich-stacked cold-plate liquid-cooled server computing module. The staggered stacking structure of motherboard 1-cold plate-motherboard 1 supports two data center server PCB motherboards 1. The cold plate in the middle is covered by the two motherboards 1. Besides covering the CPU 2 and DDR high-heat-generating components, the cold plate can also cover hard drives, network cards, GPU cards, and other components, achieving an integrated cooling effect. This fully utilizes the heat dissipation space to adapt to high-density, high-power server application scenarios, meet the heat dissipation requirements of high-power-density server racks, and improve the efficiency of liquid-cooled cold plates in data centers.

[0040] After the coolant flows in through inlet 25, it first passes through DIMM water cooling plate 7. Due to the cross-sectional baffles inside the main water cooling plate 4, the fluid flows out of DIMM water cooling plate 7 and enters CPU water cooling plate 13. The coolant flowing out of CPU water cooling plate 13 mainly flows into DIMM water cooling plate 28, and a small portion directly enters CPU water cooling plate 46 at branch outlet 21. All the coolant flowing out of DIMM water cooling plate 28 enters CPU water cooling plate 24. A small portion of the fluid coming out of CPU water cooling plate 21 directly enters CPU water cooling plate 35 at branch outlet 22, and most of it enters DIMM water cooling plate 39. Then, it flows into DIMM water cooling plate 40 through return outlet 27. The coolant coming out of DIMM water cooling plate 410 flows through CPU water cooling plate 315, DIMM water cooling plate 511, CPU water cooling plate 416, and DIMM water cooling plate 612 in sequence, and finally flows out from outlet 26. By setting up the shunt port and return port 27, the temperature consistency of the four CPU2 components of the high-power components can be controlled, avoiding the situation where the CPU2 flowing through in the later stage of the fully serial process becomes too hot.

[0041] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0042] The terms "upper," "lower," "outer," "inner," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish relative positional relationships and are not necessarily qualitative. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0043] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A dual-server water-cooled plate cooling system, comprising a main water-cooled plate (4) attached to a CPU (2) and a DIMM (3) on a motherboard (1), the main water-cooled plate (4) having an inlet (25) and an outlet (26), characterized in that, The main water-cooled plate (4) is provided with cross-sectional partitions (5) and longitudinal partitions (6). The upper and lower ends of the main water-cooled plate (4) are respectively provided with two CPU water-cooled plates and three sets of DIMM water-cooled plates that communicate with the internal space of the main water-cooled plate (4). The CPU water-cooled plates are connected to the main water-cooled plate (4) through two connecting ports. Two diversion ports are opened on the cross partition (5). In the horizontal direction, the two diversion ports are located between the CPU (2) and the adjacent DIMM water-cooled plate. A return port (27) is also opened on the end of the cross partition (5).

2. The water-cooled plate cooling system for a dual-server configuration according to claim 1, characterized in that, The CPU water cooling plate includes CPU water cooling plate one (13), CPU water cooling plate two (14), CPU water cooling plate three (15), and CPU water cooling plate four (16). Each CPU water cooling plate is in close contact with a CPU (2), and the upper and lower motherboards (1) are connected to the middle main water cooling plate (4).

3. The water-cooled plate cooling system for a dual-server configuration according to claim 1, characterized in that, The DIMM water-cooled plate includes DIMM water-cooled plate one (7), DIMM water-cooled plate two (8), DIMM water-cooled plate three (9), DIMM water-cooled plate four (10), DIMM water-cooled plate five (11), and DIMM water-cooled plate six (12). Each group of DIMM water-cooled plates includes multiple DIMM water-cooled plates, and each DIMM (3) has DIMM water-cooled plates attached to both sides.

4. The water-cooled plate cooling system for a dual-server configuration according to claim 2, characterized in that, The diaphragm (5) includes a first branch port (21) and a second branch port (22). In the lateral direction, the first branch port (21) is located between the first CPU water cooling plate (13) and the adjacent DIMM (3) that is far away from the inlet (25). The second branch port (22) is located between the second CPU water cooling plate (14) and the adjacent DIMM (3) that is far away from the inlet (25).

5. A water-cooled plate cooling system for a dual-server configuration according to claim 1 or 4, characterized in that, A guide plate (28) is provided at the inlet end of the diversion port, and the guide plate (28) is inclined in the opposite direction of the water flow.

6. The water-cooled plate cooling system for a dual-server configuration according to claim 1, characterized in that, The two main boards (1) on the upper and lower layers and the main water-cooling plate (4) in the middle layer are connected by bolt connectors (29).

7. The water-cooled plate cooling system for a dual-server configuration according to claim 1, characterized in that, The inlet (25) and outlet (26) are located on the same side of the main water-cooled plate (4), and the inlet (25) and outlet (26) are diagonally opposite each other.

8. The water-cooled plate cooling system for a dual-server configuration according to claim 1, characterized in that, A thermal pad or gel is provided between the CPU (2) and the CPU water cooling plate.

9. A water-cooled plate cooling system for a dual-server configuration according to claim 1, characterized in that, The CPU water-cooling plate has a microchannel or serpentine channel inside its internal space, and the two ends of the microchannel or serpentine channel are connected to two connecting ports.

10. A water-cooled plate cooling system for a dual-server configuration according to claim 2, characterized in that, The connection port between CPU water cooling plate 1 (13) and main water cooling plate (4) is called connection port 1 (17), the connection port between CPU water cooling plate 2 (14) and main water cooling plate (4) is called connection port 2 (19), the connection port between CPU water cooling plate 3 (15) and main water cooling plate (4) is called connection port 3 (23), the connection port between CPU water cooling plate 4 (16) and main water cooling plate (4) is called connection port 4 (24), the water outlet end of the connection port 1 (17) near the water inlet (25) is provided with baffle plate 1 (18), the water outlet end of the connection port 1 (17) near the water inlet (25) is provided with baffle plate 2 (20), baffle plate 1 (18) and baffle plate 2 (20) are in contact with the bottom surface of the transverse partition (5).

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