A vertical power distribution architecture for clustered chip systems

CN115912309BActive Publication Date: 2026-06-23INST OF MICROELECTRONICS CHINESE ACAD OF SCI LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
INST OF MICROELECTRONICS CHINESE ACAD OF SCI LTD
Filing Date
2023-01-10
Publication Date
2026-06-23

AI Technical Summary

Technical Problem

Traditional power supply and distribution architectures in clustered chip systems suffer from problems such as difficulty in placing power supply and distribution modules close together, high power distribution impedance, voltage overshoot, and IR drop, which are particularly difficult to solve effectively in high computing density and high current power supply and distribution scenarios.

Method used

The vertical power supply and distribution architecture of the clustered chip system is adopted. The load chip and the power supply and distribution module are stacked vertically. Short-distance power supply is achieved through the vertical power distribution path. Taking advantage of the low impedance characteristics of the vertical power distribution path, the power ports of the load chip and the power supply and distribution module are vertically interconnected. The conversion layer and the vertical interface layer perform voltage regulation and current conduction.

Benefits of technology

It achieves high integration density and short-distance power supply and distribution, reduces circuit board area, and improves power supply efficiency and distribution stability. It is suitable for electronic systems such as high-performance computing, T/R components and optical sensing systems.

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Abstract

The application discloses a vertical power supply and distribution frame of a cluster chip system, belongs to the technical field of microelectronic packaging, and solves the layout problem that the power supply and distribution module of the cluster chip system is difficult to be placed in close proximity or the problem that the cluster chip system cannot realize short-distance power supply and distribution. In the frame, the load chip and the power supply and distribution module are stacked in the direction perpendicular to the circuit board; the power supply and distribution module comprises an external input layer, a conversion layer and a vertical interface layer which are stacked and connected from bottom to top; the number of the power supply and distribution module and the load chip is multiple, the number of the circuit board is one, the circuit board is used as the bearing and interconnection substrate of the multiple load chips, the internal metal layer of the circuit board is used for realizing the signal interconnection between the multiple load chips; and the power supply port of the load chip is interconnected with the vertical interface layer of the power supply and distribution module through the vertical power distribution hole in the circuit board. The application can be used for the vertical power supply and distribution of the cluster chip system.
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