Mold box of ultra-wide multi-row sigma structure
By designing through grooves and Σ-shaped side baffles for positioning on the mold insert base, the problems of high processing difficulty and low packaging quality of existing molds are solved, achieving the convenience and precision of high-density packaging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TONGLING SANJIA YAMADA TECH
- Filing Date
- 2022-11-25
- Publication Date
- 2026-06-09
AI Technical Summary
Existing mold insert bases are difficult to process to meet packaging standards, resulting in reduced packaging quality. Furthermore, the processing is difficult and costly, failing to meet the requirements for high-density packaging.
The mold box design adopts an ultra-wide multi-row Σ structure. Through grooves are opened in the planar lower insert seat and upper insert seat, and Σ-shaped side baffles are used to limit and position the inserts, which improves the convenience and accuracy of processing and installation.
It improves the ease of processing and installation of mold inserts, enhances the precision of fine-tuning, avoids packaging misalignment, and improves packaging quality and production efficiency.
Smart Images

Figure CN115966493B_ABST