Gold finger plating method and gold finger circuit board

Abstract

The embodiment of the application discloses a gold finger plating method and a gold finger circuit board. The gold finger plating method comprises the following steps: providing a circuit board to be plated with gold, the circuit board comprising a gold finger unit, a solder pad and a ground layer, the gold finger unit and the solder pad being located on the same conductive layer and being arranged in different layers from the ground layer; the gold finger unit comprising a signal finger and a ground finger, the tail end of the signal finger being electrically connected with the first end of the solder pad, and the ground finger being electrically connected with the ground layer; the second end of the solder pad is electrically connected with the ground layer, so that the signal finger, the ground finger, the solder pad and the ground layer form a ground network; and power is supplied to the ground network to plate the gold finger unit to be plated with gold. By using the above method, the gold finger unit to be plated with gold and the ground layer form a ground network, so that the gold layer can be plated on the gold finger unit to be plated with gold, the four-side gold plating process of the gold finger is realized, and the uneven defects and oxidation corrosion of the plug end of the gold finger are avoided.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and more particularly to a gold plating method for gold fingers and a gold finger circuit board. Background Technology

[0002] The main function of the gold finger circuit board is to achieve flexible interconnection with the main circuit board, while ensuring performance requirements and easy disassembly and replacement. This is achieved by designing pads arranged like fingers on the gold finger circuit board, and plating a layer of nickel and a layer of gold on the surface of the pads to enhance the wear resistance and conductivity of the pad surface. Therefore, it is usually called a gold finger. Each gold finger can be divided into five sides according to its visual appearance: the plug end, the left side end, the right side end, the top end, and the tail end.

[0003] The conventional method for gold-plating gold fingers involves designing gold-plated leads at the connector end and then removing them by etching after plating. However, etching the gold-plated leads exposes the copper layer at the connector end. Furthermore, the etched leads on the connector end of the gold fingers result in unevenness, and the connector end of the gold fingers does not have a nickel and gold layer covering the copper layer. This makes the connector end of the gold fingers prone to oxidation and corrosion, which further exacerbates the unevenness and affects the connection between the gold finger circuit board and the main circuit board. Summary of the Invention

[0004] This invention provides a method for gold plating gold fingers and a gold finger circuit board to achieve a four-sided gold plating process for gold fingers, avoiding unevenness and oxidation corrosion at the plug end of the gold fingers.

[0005] In a first aspect, embodiments of the present invention provide a method for gold plating a gold finger, comprising:

[0006] A circuit board to be gold-plated is provided. The circuit board includes gold finger units, pads, and a ground layer. The gold finger units and the pads are located on the same conductive layer and are disposed on a different layer from the ground layer. The gold finger units include signal fingers and ground fingers. The tail end of the signal fingers is electrically connected to the first end of the pads, and the ground fingers are electrically connected to the ground layer.

[0007] The second end of the pad is electrically connected to the ground layer so that the signal finger, the ground finger, the pad and the ground layer form a grounding network;

[0008] Power is supplied to the grounding network to plate the gold-plated areas of the signal finger and the grounding finger with gold.

[0009] Optionally, the second end of the pad is electrically connected to the ground plane, so that the signal finger, the ground finger, the pad, and the ground plane form a grounding network, including:

[0010] A metallized via is made at a preset distance from the pad. The signal finger is electrically connected to the ground layer through the pad and the metallized via in sequence, so that the signal finger, the ground finger, the pad and the ground layer form a grounding network.

[0011] Optionally, a metallized via is formed at a preset distance from the pad, and the signal finger is electrically connected to the ground layer sequentially through the pad and the metallized via, including:

[0012] An outer layer pattern is etched at the metallized hole to form a metallized ring and gold-plated leads. The pads are electrically connected to the ground layer in sequence through the gold-plated leads, the metallized ring, and the metallized hole.

[0013] Optionally, the metallized ring and the metallized hole are concentrically arranged in a one-to-one correspondence, the diameter of the metallized hole is D1, and the outer ring diameter of the metallized ring is D2, wherein D2 > D1.

[0014] Optionally, the distance between the outer ring of the metallization ring and the pad is L, where L ≥ 3mil.

[0015] Optionally, after energizing the grounding network and gold-plating the gold-plated areas of the signal finger and the grounding finger, the method further includes:

[0016] The metallized hole is back-drilled to form a back-drilled hole, thereby disconnecting the signal finger from the ground layer.

[0017] Optionally, the back drill hole and the metallized hole are one-to-one and concentrically arranged, the diameter of the metallized hole is D1, and the diameter of the back drill hole is D3, wherein D3 > D1.

[0018] Optionally, the back drill hole corresponds one-to-one with the metallized ring and is concentrically arranged, the outer ring diameter of the metallized ring is D2, and the diameter of the back drill hole is D3, wherein D3 > D2.

[0019] Optionally, the distance between the outer ring of the metallization ring and the pad is L, the diameter of the outer ring of the metallization ring is D2, and the diameter of the back drill hole is D3, wherein D3 < D2 + 2L.

[0020] Secondly, embodiments of the present invention also provide a gold finger circuit board, which is prepared by the gold plating method of the gold finger as described in any one of the first aspects.

[0021] This invention provides a method for gold plating gold fingers and a gold finger circuit board. The gold plating method includes: providing a circuit board to be gold-plated, the circuit board including gold finger units, pads, and a ground layer, the gold finger units and pads being located on the same conductive layer and disposed on a different layer from the ground layer; the gold finger unit including a signal finger and a ground finger, the tail end of the signal finger being electrically connected to a first end of the pad, and the ground finger being electrically connected to the ground layer; electrically connecting the second end of the pad to the ground layer, so that the signal finger, ground finger, pad, and ground layer form a grounding network; and energizing the grounding network to gold-plat the gold-plating areas of the signal finger and ground finger. Using the above method, the gold finger units to be gold-plated form a grounding network with the ground layer, ensuring that the gold finger units to be gold-plated can be plated with a gold layer, achieving a four-sided gold-plating process for the gold fingers, and avoiding unevenness defects and oxidation corrosion at the plug ends of the gold fingers. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a flowchart illustrating a gold plating method for gold fingers provided in an embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the structure of a gold finger unit provided in an embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure of a circuit board to be gold-plated according to an embodiment of the present invention;

[0026] Figure 4 This is a flowchart illustrating another gold plating method for gold fingers provided in an embodiment of the present invention;

[0027] Figure 5 yes Figure 3 The diagram shows an enlarged view of region A.

[0028] Figure 6 yes Figure 3 The diagram shows the cross-sectional structure of region A.

[0029] Figure 7 This is a schematic diagram of the structure of a gold finger circuit board provided in an embodiment of the present invention. Detailed Implementation

[0030] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0031] The terminology used in the embodiments of this invention is for the purpose of describing specific embodiments only and is not intended to limit the invention. It should be noted that directional terms such as "upper," "lower," "left," and "right" described in the embodiments of this invention are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of this invention. Furthermore, in the context, it should be understood that when referring to an element being formed "on" or "below" another element, it can be formed not only directly on or below the other element, but also indirectly on or below it through intermediate elements. The terms "first," "second," etc., are used for descriptive purposes only and do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0032] The term "comprising" and its variations as used in this invention are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment".

[0033] It should be noted that the concepts of "first" and "second" mentioned in this invention are only used to distinguish the corresponding contents and are not used to limit the order or interdependence.

[0034] It should be noted that the terms "a" and "a plurality of" used in this invention are illustrative rather than restrictive. Those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0035] Figure 1 This is a schematic flowchart of a gold plating method for gold fingers provided in an embodiment of the present invention. Figure 2 This is a schematic diagram of the structure of a gold finger unit provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of the structure of a circuit board to be gold-plated according to an embodiment of the present invention, as shown below. Figure 1 , Figure 2 and Figure 3 As shown, the gold plating method for this gold finger includes:

[0036] S110. Provide a circuit board to be gold plated. The circuit board includes gold finger units, pads and a ground layer. The gold finger units and pads are located on the same conductive layer and are disposed on a different layer from the ground layer. The gold finger units include signal fingers and ground fingers. The tail end of the signal fingers is electrically connected to the first end of the pads, and the ground fingers are electrically connected to the ground layer.

[0037] Specifically, please refer to Figure 2 and Figure 3 The circuit board to be gold-plated includes gold finger units and pads 21, which are located on the same conductive layer. Exemplarily, the gold finger units and pads 21 may be located on the outermost layer of the circuit board. The circuit board also includes a ground layer, which is located on a different conductive layer than the ground layer. Exemplarily, the ground layer may be located on the next outermost layer of the circuit board. Furthermore, the circuit board may include multiple gold finger units and multiple pads 21, depending on the actual gold plating requirements of the gold fingers or the actual operational needs of the circuit board. This is merely an example and not a limitation.

[0038] Figure 2 The gold finger unit shown is the smallest unit of the gold finger circuit board. This unit includes two signal fingers 11 and two ground fingers 12. The gold finger unit is visually defined, with each gold finger including a plug end 13, a first side end 14, a second side end 15, a front end 16, and a tail end 17. The plug end 13 connects the gold finger circuit board to the motherboard, and the tail end 17 connects the gold finger to the solder pads 21 on the circuit board to be gold-plated. The two signal fingers 11 are electrically connected to the first end of their respective solder pads 21 via the tail end 17 to establish a connection between the signal fingers 11 and the solder pads 21. The two ground fingers 12 are electrically connected to the ground plane and can be shorted together via the ground plane.

[0039] S120. Connect the second end of the pad to the ground plane so that the signal finger, ground finger, pad and ground plane form a grounding network.

[0040] Specifically, please refer to Figure 2 and Figure 3 The two ground fingers 12 are electrically connected to the ground plane, and the two signal fingers 11 are electrically connected to the first end of the corresponding pad 21 through the tail end 17. By connecting the second end of the pad 21 to the ground plane, the two signal fingers 11 can be electrically connected to the ground plane through the pad 21. In this way, the two signal fingers 11 and the two ground fingers 12 in the gold finger unit are all electrically connected to the ground plane, and a grounding network is formed between the signal fingers 11, the ground fingers 12, the pad 21 and the ground plane.

[0041] S130. Power is supplied to the grounding network to gold-plat the gold-plated areas of the signal finger and the grounding finger.

[0042] Specifically, please refer to Figure 2 and Figure 3 A grounding network is formed between the signal finger 11, the ground finger 12, the pad 21, and the ground layer. The ground layer connects the individual gold fingers in the gold finger unit and also connects multiple gold finger units on the circuit board to be gold-plated. Power is supplied to the grounding network to gold-plat the gold-plated areas of the signal finger 11 and the ground finger 12. For example, the pad 21 can be connected to a power source to energize the grounding network, thereby gold-plating the gold-plated areas of the signal finger 11 and the ground finger 12, completing the gold-plating process for all gold finger units on the circuit board to be gold-plated. Furthermore, using the technical solution in this embodiment, nickel plating can also be performed on the nickel-plated areas of the signal finger 11 and the ground finger 12 by supplying power to the ground network. It should be noted that performing nickel plating and gold plating processes sequentially on the signal finger 11 and the ground finger 12 can enhance the wear resistance and conductivity of the gold finger unit surface, facilitating better connection between the gold finger circuit board and the motherboard.

[0043] The technical solution in this embodiment of the invention first provides a circuit board to be gold-plated. The circuit board includes gold finger units, pads, and a ground layer. The gold finger units and pads are located on the same conductive layer and are disposed on a different layer from the ground layer. The gold finger unit includes a signal finger and a ground finger. The tail end of the signal finger is electrically connected to the first end of the pad, and the ground finger is electrically connected to the ground layer. Then, the second end of the pad is electrically connected to the ground layer, so that the signal finger, ground finger, pad, and ground layer form a grounding network. Finally, power is applied to the grounding network to gold-plated areas of the signal finger and ground finger. Using the above method, the gold finger units to be gold-plated and the ground layer form a grounding network, ensuring that the gold finger units to be gold-plated can be plated with a gold layer, realizing a four-sided gold-plating process for the gold fingers, and avoiding unevenness and oxidation corrosion at the plug ends of the gold fingers.

[0044] Figure 4 This is a schematic flowchart of another gold plating method for gold fingers provided in an embodiment of the present invention. Figure 5 yes Figure 3 The enlarged structural diagram of region A shown is an optimization of the above embodiment. Optionally, the second end of the pad is electrically connected to the ground plane so that the signal finger, ground finger, pad, and ground plane form a grounding network, including:

[0045] Metallized vias are made at a predetermined distance from the pads. Signal fingers are electrically connected to the ground plane via the pads and metallized vias in sequence, forming a ground network consisting of the signal fingers, ground fingers, pads, and the ground plane. Further, after energizing the ground network and gold-plating the gold-plated areas of the signal fingers and ground fingers, the process includes:

[0046] Back-drill the metallized hole to create a back-drilled hole, thereby disconnecting the signal finger from the ground plane.

[0047] For details not covered in this embodiment, please refer to the above embodiments. Figure 4 and Figure 5 As shown, the gold plating method for this gold finger includes:

[0048] S210. Provide a circuit board to be gold plated. The circuit board includes gold finger units, pads, and a ground layer. The gold finger units and pads are located on the same conductive layer and are disposed on a different layer from the ground layer. The gold finger units include signal fingers and ground fingers. The tail end of the signal fingers is electrically connected to the first end of the pads, and the ground fingers are electrically connected to the ground layer.

[0049] S220. A metallized hole is opened at a preset distance from the pad. The signal finger is electrically connected to the ground plane through the pad and the metallized hole in sequence, so that the signal finger, the ground finger, the pad and the ground plane form a grounding network.

[0050] Optionally, continue to refer to Figure 3 and Figure 5 A metallized via 31 is formed at a preset distance from the pad 21. The signal finger 11 is electrically connected to the ground plane through the pad 21 and the metallized via 31 in sequence. This includes etching an outer layer pattern at the metallized via 31 to form a metallized ring 32 and a gold-plated lead 33. The pad 21 is electrically connected to the ground plane through the gold-plated lead 33, the metallized ring 32, and the metallized via 31 in sequence. Specifically, the metallized via 31 is formed at a preset distance from the pad 21. For example, the metallized via 31 can be a through hole or a blind hole. The metallized via 31 is electrically connected to the ground plane. A drilling process can be performed at a preset distance from the pad 21 to obtain a through hole or a blind hole. Then, the through hole or blind hole is metallized to obtain the metallized via 31. The metallized via 31 can connect and conduct the conductive patterns of the inner and outer layers of the circuit board. By using an etching process to pattern the outer layer, a metallized ring 32 and a gold-plated lead 33 can be formed at the metallized hole 31. The metallized ring 32 can electrically connect the metallized hole 31 and the gold-plated lead 33, and the gold-plated lead 33 can electrically connect the metallized ring 32 and the pad 21. Thus, the signal finger 11 can be electrically connected to the ground layer in sequence through the pad 21, the gold-plated lead 33, the metallized ring 32, and the metallized hole 31, thereby making the signal finger 11 and the ground layer in the same grounding network.

[0051] Optionally, continue to refer to Figure 3 and Figure 5 The metallized ring 32 corresponds one-to-one with the metallized hole 31 and is concentrically arranged. The diameter of the metallized hole 31 is D1, and the outer ring diameter of the metallized ring 32 is D2, where D2 > D1. Specifically, the metallized ring 32 corresponds one-to-one with the metallized hole 31 and is concentrically arranged. The pattern structure of the metallized ring 32 is concentrically etched at the metallized hole 31, and the outer ring diameter D2 of the metallized ring 32 should be greater than the diameter D1 of the metallized hole 31, presenting a structure in which the metallized ring 32 surrounds the metallized hole 31. The gold-plated lead 33 cannot be directly electrically connected to the metallized hole 31, but can be electrically connected to the metallized hole 31 through the metallized ring 32. For example, the relationship between D2 and D1 can be D2 = D1 + 4mil. If the outer ring diameter D2 of the metallized ring 32 is less than or equal to the diameter D1 of the metallized hole 31, the structure of the metallized ring 32 cannot be etched, or the etched structure of the metallized ring 32 will fall out through the through-hole structure of the metallized hole 31.

[0052] Optionally, continue to refer to Figure 3 and Figure 5 The distance between the outer ring of the metallized ring 32 and the pad 21 is L, where L ≥ 3 mil. Specifically, the distance between the outer ring of the metallized ring 32 and the pad 21 is L. A certain distance should be maintained between the outer ring of the metallized ring 32 and the pad 21. On the one hand, this can prevent the etched structure of the metallized ring 32 from sticking to the pad 21. The distance L between the outer ring of the metallized ring 32 and the pad 21 cannot be too small. On the other hand, the metallized ring 32 and the pad 21 are connected by gold-plated leads 33. The distance L between the outer ring of the metallized ring 32 and the pad 21 cannot be too large to prevent the gold-plated leads 33 from being too long and affecting signal transmission. For example, the distance L between the outer ring of the metallized ring 32 and the pad 21 can be greater than or equal to 3 mil. The maximum range of the distance L between the outer ring of the metallized ring 32 and the pad 21 can be determined according to the area of ​​the circuit board to be gold-plated and the layout of the pad 21 and the gold finger unit, etc.

[0053] S230. Power is supplied to the grounding network to gold-plat the gold-plated areas of the signal finger and the grounding finger.

[0054] S240. Back-drill the metallized hole to form a back-drilled hole, thereby disconnecting the signal finger from the ground plane.

[0055] Specifically, Figure 6 yes Figure 3 The schematic diagram of the cross-sectional structure of region A shown is as follows: Figure 6As shown, after the gold plating process is completed on the circuit board, the metallized hole 31 needs to be back-drilled to disconnect the electrical connection between the signal finger 11 and the ground layer 41, thereby disconnecting the grounding network formed between the signal finger 11, the ground finger 12, the pad 21 and the ground layer 41. At the same time, the metallized ring 32 is back-drilled to disconnect the electrical connection between the gold plating lead 33 and the metallized hole 31, so as to avoid the phenomenon of short circuit of the gold finger circuit board due to incomplete removal of the gold plating lead 33, and restore the circuit board to be gold-plated to the initial unplated state.

[0056] Optionally, continue to refer to Figure 5 and Figure 6The back-drilled holes and metallized holes 31 are concentrically arranged and correspond one-to-one. The diameter of the metallized hole 31 is D1, and the diameter of the back-drilled hole is D3, where D3 > D1. Further, the back-drilled holes and metallized rings 32 are concentrically arranged and correspond one-to-one. The outer ring diameter of the metallized ring 32 is D2, and the diameter of the back-drilled hole is D3, where D3 > D2. Still further, the distance between the outer ring of the metallized ring 32 and the pad 21 is L, the outer ring diameter of the metallized ring 32 is D2, and the diameter of the back-drilled hole is D3, where D3 < D2 + 2L. Specifically, the back-drilled hole formed by back drilling should completely disconnect the electrical connection between the metallized hole 31 and the ground layer 41. Then, the diameter D3 of the back-drilled hole is larger than the diameter D1 of the metallized hole 31. For example, the relationship between D3 and D1 can be D3 = D1 + 8mil. In addition, the back-drilled hole and the metallized hole 31 are one-to-one and concentrically set, which can simplify the positioning operation of the back drilling process. Alternatively, as long as the electrical connection between the metallized hole 31 and the ground layer 41 can be disconnected, the back-drilled hole and the metallized hole 31 do not have to be concentrically set. Furthermore, the back-drilled hole formed by back drilling should completely disconnect the electrical connection between the gold-plated lead 33 and the metallized hole 31. Then, the diameter D3 of the back-drilled hole is larger than the outer ring diameter D2 of the metallized ring 32. For example, the relationship between D3 and D2 can be D3 = D2 + 4mil. In addition, the back-drilled hole and the metallized ring 32 correspond one-to-one and are concentrically set, which can simplify the positioning operation of the back drilling process. Alternatively, as long as the electrical connection between the gold-plated lead 33 and the metallized hole 31 can be disconnected, the back-drilled hole and the metallized ring 32 do not have to be concentrically set. Furthermore, the distance between the outer ring of the metallized ring 32 and the pad 21 is L. The back-drilled hole formed by back drilling should completely disconnect the electrical connection between the gold-plated lead 33 and the metallized hole 31. However, the back-drilled hole cannot touch the pad 21. Since the gold-plated lead 33 is only located on the side of the metallized hole 31 closest to the pad 21, the radius D3 / 2 of the back-drilled hole should be less than the sum of the outer ring radius D2 / 2 of the metallized ring 32 and the distance L between the outer ring of the metallized ring 32 and the pad 21. That is, the diameter D3 of the back-drilled hole should be less than the sum of the outer ring diameter D2 of the metallized ring 32 and the distance L between the outer ring of the metallized ring 32 and the pad 21. For example, the relationship between D3, D2, and L can be D3 < D2 + 2L, where L ≥ 3mil, then D3 = D2 + 8mil.

[0057] The technical solution in this embodiment of the invention first provides a circuit board to be gold-plated. The circuit board includes a gold finger unit, a pad, and a ground layer. The gold finger unit and the pad are located on the same conductive layer and are disposed on a different layer from the ground layer. The gold finger unit includes a signal finger and a ground finger. The tail end of the signal finger is electrically connected to the first end of the pad, and the ground finger is electrically connected to the ground layer. Then, a metallized hole is opened at a preset distance from the pad. The signal finger is electrically connected to the ground layer through the pad and the metallized hole in sequence, so that the signal finger, the ground finger, the pad, and the ground layer form a ground network. Then, power is applied to the ground network to gold-plated areas of the signal finger and the ground finger. Finally, the metallized hole is back-drilled to form a back-drilled hole to disconnect the connection between the signal finger and the ground layer. Using the above method, a gold-plated lead layout and removal method are provided, which can realize the four-sided gold plating process of gold fingers. Compared with the existing technology of using dry film etching to etch gold-plated leads, the embodiments of the present invention can solve the problem of the dry film not adhering firmly to the lead, and the problem that the pads connected to the gold-plated leads are easily eroded and reduced in size by the etching solution during the etching process. Alternatively, compared with the existing technology of using wet film and dry film etching to etch gold-plated leads, the embodiments of the present invention can solve the problem that the wet film stays on the circuit board for too long and is easy to stick to the board and is difficult to remove cleanly after passing through the high temperature environment of various production lines.

[0058] Based on the same inventive concept, embodiments of the present invention also provide a gold finger circuit board. Figure 7 This is a schematic diagram of the structure of a gold finger circuit board provided in an embodiment of the present invention, as shown below. Figure 7 As shown, the gold finger circuit board 10 is manufactured using the gold plating method for gold fingers provided in any of the above embodiments. Therefore, the gold finger circuit board 10 provided in this embodiment of the invention possesses the corresponding beneficial effects of the gold plating method for gold fingers provided in this embodiment of the invention, which will not be elaborated here. It should be noted that the gold finger circuit board 10 provided in this embodiment of the invention is only an example and is not limited here. The gold finger circuit board 10 may include multiple gold finger units that have been gold-plated, and may also include components such as solder pads that are subsequently connected to the motherboard.

[0059] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A method for gold plating gold fingers, characterized in that, include: A circuit board to be gold-plated is provided. The circuit board includes gold finger units, pads, and a ground layer. The gold finger units and the pads are located on the same conductive layer and are disposed on a different layer from the ground layer. The gold finger units include signal fingers and ground fingers. The tail end of the signal fingers is electrically connected to the first end of the pads, and the ground fingers are electrically connected to the ground layer. The second end of the pad is electrically connected to the ground plane, thereby connecting the signal finger to the ground plane through the pad, so that the signal finger, the ground finger, the pad and the ground plane form a grounding network; Power is supplied to the grounding network to plate the gold-plated areas of the signal finger and the grounding finger with gold.

2. The gold plating method for gold fingers according to claim 1, characterized in that, The second end of the pad is electrically connected to the ground plane, so that the signal finger, the ground finger, the pad, and the ground plane form a grounding network, including: A metallized via is made at a preset distance from the pad. The signal finger is electrically connected to the ground layer through the pad and the metallized via in sequence, so that the signal finger, the ground finger, the pad and the ground layer form a grounding network.

3. The gold plating method for gold fingers according to claim 2, characterized in that, A metallized via is formed at a predetermined distance from the pad, and the signal finger is electrically connected to the ground plane sequentially through the pad and the metallized via, including: An outer layer pattern is etched at the metallized hole to form a metallized ring and gold-plated leads. The pads are electrically connected to the ground layer in sequence through the gold-plated leads, the metallized ring, and the metallized hole.

4. The gold plating method for gold fingers according to claim 3, characterized in that, The metallized ring and the metallized hole are concentrically arranged in a one-to-one correspondence. The diameter of the metallized hole is D1, and the outer diameter of the metallized ring is D2, wherein D2 > D1.

5. The gold plating method for gold fingers according to claim 3, characterized in that, The distance between the outer ring of the metallization ring and the pad is L, where L ≥ 3mil.

6. The gold plating method for gold fingers according to claim 3, characterized in that, After energizing the grounding network and gold-plating the gold-plated areas of the signal finger and the grounding finger, the process further includes: The metallized hole is back-drilled to form a back-drilled hole, thereby disconnecting the signal finger from the ground layer.

7. The gold plating method for gold fingers according to claim 6, characterized in that, The back drill hole and the metallized hole are one-to-one and concentrically arranged. The diameter of the metallized hole is D1 and the diameter of the back drill hole is D3, wherein D3 > D1.

8. The gold plating method for gold fingers according to claim 7, characterized in that, The back drill hole corresponds one-to-one with the metallized ring and is concentrically arranged. The outer ring diameter of the metallized ring is D2, and the diameter of the back drill hole is D3, wherein D3 > D2.

9. The gold plating method for gold fingers according to claim 8, characterized in that, The distance between the outer ring of the metallized ring and the pad is L, the diameter of the outer ring of the metallized ring is D2, and the diameter of the back drill hole is D3, wherein D3 < D2 + 2L.

10. A gold finger circuit board, characterized in that, It is prepared by the gold plating method of any one of claims 1-9.

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