Electronic devices and electronic device housing structures

Abstract

The various embodiments disclosed in this document relate to an electronic device, specifically, to an electronic device including a housing formed by an anodizing process, and to an electronic device housing structure. According to one embodiment disclosed in this document, an electronic device can be provided comprising a housing including: a front panel; a rear panel facing away from the front panel; a side member surrounding a space between the front panel and the rear panel; and a support member disposed in the space, wherein a main body portion of the housing is formed of a conductive material, the main body portion is divided into a first portion and a second portion electrically isolated from the first portion, the first portion being colored with a first color, and the second portion being colored with a second color different from the first color. Various other embodiments may be employed.

Description

Technical Field

[0001] The various disclosures disclosed herein relate to an electronic device and an electronic device housing structure. Background Technology

[0002] With the development of information / communication technology and semiconductor technology, a wide variety of electronic devices have become widely used. In particular, recent electronic devices have been developed for portability and communication. Furthermore, electronic devices can output stored information as sound or images. With the high integration of electronic devices and the widespread use of ultra-fast, high-capacity wireless communication, it has recently become possible to equip a single electronic device (e.g., a mobile communication terminal) with various functions. For example, not only communication functions but also entertainment functions (e.g., games), multimedia functions (e.g., music / video playback), communication and security functions for mobile banking, scheduling functions, and e-wallet functions can be integrated into a single electronic device. Such electronic devices have become compact, making them convenient for users to carry.

[0003] Research has been ongoing on using metal materials to create the outer casing of electronic devices, which would protect various circuit components from the external environment and give the electronic devices an aesthetically pleasing appearance. Summary of the Invention

[0004] Technical issues

[0005] Aluminum is used as an external material for portable electronic devices. Typical processing techniques, such as machining, injection molding, and surface treatment, can be performed to use aluminum as an external material for electronic devices. For example, in machining, the metal external material is shaped into the desired form using a cutting machine (e.g., CNC machining, diamond cutting, polishing). In injection molding, synthetic resin molten at high temperature is injected into a metal external material component prepared in a mold, thus bonding the resin and metal. For example, in surface treatment, anodizing can be used. During anodizing, the metal is electrically connected to the anode and simultaneously oxidized with oxygen, thereby treating the metal surface with the resulting alumina film. Anodizing is widely used because the surface is hard and corrosion-resistant, and because the film can be easily colored.

[0006] In order to improve the aesthetics of electronic devices, there is an increasing demand for designs related to housings that can achieve various shapes or colors.

[0007] Under conventional external material processing techniques, it is difficult to achieve two or more colors on a single electronic device, and even if it were achieved, it would likely require numerous complex processes. For example, when achieving two colors on a single electronic device, a first color can be achieved by forming a film through primary anodizing, a coloring process can be performed on the first color, and a sealing process can be performed on the first color. To achieve the second color, the portion to be colored with a different color can be cut or polished to remove the primary anodized film, another film can be formed through secondary anodizing, and a coloring process can be performed on the second color. As another example, after partially fabricating the electronic device, primary anodizing, coloring, and sealing can be performed. After removing the mask, an oxide film can be formed through secondary anodizing, and secondary coloring can be performed.

[0008] According to the embodiments mentioned above, the primary film with the first color may be damaged during the cutting or polishing process, thereby affecting product quality and durability, and the process may be complex and may take a long time. Another potential problem is that manufacturing costs may increase due to the masking and demasking processes, and the defect rate may depend on the precision of the mask.

[0009] Various embodiments of this disclosure can provide an electronic device and an electronic device housing structure, wherein multiple colors can be achieved on the housing because the housing can be colored with different colors by a secondary anodizing process performed successively after a primary anodizing process.

[0010] The problems to be solved by this disclosure are not limited to those mentioned above, and can be extended in different ways without departing from the spirit and scope of this disclosure.

[0011] Technical solution

[0012] According to various embodiments disclosed in the document, an electronic device may include: a housing comprising: a front panel; a rear panel facing in a direction opposite to the front panel; a side member configured to surround a space between the front panel and the rear panel; and a support member disposed in the space, wherein a main body portion of the housing is constructed of a conductive material, and the main body portion is divided into a first portion and a second portion electrically isolated from the first portion, and the first portion is colored with a first color, and the second portion is colored with a second color different from the first color.

[0013] According to various embodiments disclosed in the document, a shell manufacturing method may include: a process for processing a shell comprising a metal component; a primary anodizing process for forming a predetermined oxide film on a first portion of the metal component; a process for coloring and treating the oxide film formed on the first portion using a coloring material having a first color; a secondary anodizing process for forming a predetermined oxide film on a second portion of the metal component; and a process for coloring and treating the oxide film formed on the second portion using a coloring material having a second color.

[0014] According to various embodiments disclosed in the document, an electronic device may include: a housing comprising: a front panel; a rear panel facing in a direction opposite to the front panel; a side member configured to surround a space between the front panel and the rear panel; and a support member disposed in the space, wherein at least a portion of the housing is divided into a first portion constructed of a conductive material and a second portion constructed of a conductive material and electrically isolated from the first portion, the first portion comprising a first outer wall and a first inner wall facing in a direction opposite to the first outer wall, the first outer wall being colored with a first color of a first color family and facing outwards from the housing, and the second portion comprising a second outer wall and a second inner wall facing in a direction opposite to the second outer wall, the second outer wall being colored with a first color of a second color family and facing outwards from the housing.

[0015] Beneficial effects

[0016] The electronic device according to the various embodiments disclosed herein is advantageous because the outer and inner walls of the electronic device can be colored in a variety of colors, thereby enabling differentiated external designs.

[0017] The various embodiments disclosed herein can provide a method for continuously performing anodizing without performing complex processes such as additional machining, polishing, or rolling, thereby reducing costs and increasing productivity.

[0018] The various embodiments disclosed herein can provide a method for a continuous anodizing process applicable not only to the outer frame of portable electronic devices, but also to various product groups having metallic outer materials. Attached Figure Description

[0019] Figure 1 It is a block diagram of an electronic device in a network environment according to various embodiments disclosed in the document.

[0020] Figure 2 This is a front perspective view of an electronic device according to various embodiments disclosed in the document.

[0021] Figure 3 This is a perspective view of the back of an electronic device according to various embodiments disclosed in the document.

[0022] Figure 4 This is an exploded perspective view of an electronic device according to various embodiments disclosed in the document.

[0023] Figure 5 This is a view showing the front, side, and rear surfaces of an electronic device according to various embodiments disclosed in the document.

[0024] Figure 6a This is a perspective view showing the front and rear surfaces of an electronic device according to another embodiment disclosed in the document.

[0025] Figure 6b This is a perspective view showing the rear surface of an electronic device according to various embodiments disclosed in the document.

[0026] Figure 7a This is a view showing the form of applying a first color to a side member, including a portion separated by a slit, according to an embodiment.

[0027] Figure 7b This is a view showing, according to an embodiment, a first color and a second color applied to a side member comprising a portion separated by a slit.

[0028] Figure 8 This is a detailed view of a housing with partitioned portions according to various embodiments disclosed in the document.

[0029] Figure 9a This is a flowchart illustrating a shell structure manufacturing method including an anodizing method according to some embodiments.

[0030] Figure 9b This is a flowchart illustrating a shell structure manufacturing method including an anodizing method according to various embodiments of the present disclosure.

[0031] Figure 10 This is a view showing a fixture for performing anodizing processes according to various embodiments of the present disclosure.

[0032] Figure 11a This is a view showing the form in which a clamp according to various embodiments of the present disclosure is mounted to a housing.

[0033] Figure 11b This is a view illustrating aspects of the use of fixtures for performing anodizing processes according to various embodiments of the present disclosure.

[0034] Figure 12 This is a view illustrating examples of implementations of a continuous anodizing process according to various embodiments of the present disclosure.

[0035] Figure 13 This is a view illustrating application examples of a continuous anodizing process according to various embodiments of the present disclosure.

[0036] Figure 14 This is a perspective view of a wearable electronic device with a housing, the exterior of which is colored with various colors in a continuous anodizing process.

[0037] Figure 15 This is a front view showing a wearable electronic device that achieves various colors on the exterior of the housing using a continuous anodizing method. Detailed Implementation

[0038] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0039] Reference Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In various embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (e.g., display module 160).

[0040] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) coupled to electronic device 101, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 can be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 can be implemented separately from the main processor 121, or as part of the main processor 121.

[0041] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) can be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) can include hardware architectures dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed by electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm can include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple layers of artificial neural networks. The artificial neural network can be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model can include software structures in addition to hardware structures.

[0042] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0043] The program 140 can be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0044] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by another component of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0045] The audio output module 155 can output audio signals to the outside of the electronic device 101. The audio output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to embodiments, the receiver can be implemented separately from the speaker, or as part of the speaker.

[0046] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0047] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or an external electronic device (e.g., electronic device 102 (e.g., a speaker or headphones)) that is directly (e.g., wired) coupled to the electronic device 101 or wirelessly coupled to it.

[0048] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0049] Interface 177 may support one or more specific protocols used to directly or wirelessly couple electronic device 101 to external electronic device (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0050] Connection end 178 may include a connector, through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0051] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0052] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0053] The power management module 188 can manage the power supply to the electronic device 101. According to an embodiment, the power management module 188 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0054] Battery 189 can power at least one component of electronic device 101. According to embodiments, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0055] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). A corresponding one of these communication modules can communicate via a first network 198 (e.g., a short-range communication network, such as Bluetooth). TM The wireless communication module 192 can communicate with external electronic devices via a Wi-Fi Direct or Infrared Data Association (IrDA) network or a second network 199 (e.g., a long-range communication network, such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components (e.g., multiple chips) that are separate from each other. The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as a first network 198 or a second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0056] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communications (mMTC), or ultra-reliable low-latency communications (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0057] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., external electronic device). According to an embodiment, the antenna module may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190. Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0058] According to various embodiments, antenna module 197 can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top or side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0059] At least some of the aforementioned components can be coupled to each other and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0060] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 coupled to the second network 199. Each of external electronic device 102 or external electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. The one or more external electronic devices receiving the request may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0061] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0062] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the singular form of a noun corresponding to an item may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether or not the terms “operably” or “communically” are used, if an element (e.g., a first element) is referred to as “coupled to another element (e.g., a second element),” “coupled to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) coupled to the other element, wirelessly connected to the other element, or coupled to the other element via a third element.

[0063] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0064] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components or operations may be omitted, or one or more other components or operations may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be run in a different order or omitted, or one or more other operations may be added.

[0065] Figure 2 This is a front perspective view of an electronic device according to various embodiments of the present disclosure. Figure 3 This is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0066] Reference Figure 2 and Figure 3 The electronic device 101 according to an embodiment may include a housing 310, which includes: a front surface 310A; a rear surface 310B; and a side surface 310C for surrounding the space between the front surface 310A and the rear surface 310B. In another embodiment (not shown), the housing 310 may also be referred to as forming Figure 2 The front surface 310A and Figure 3 The structure comprises a portion of the rear surface 310B and the side surface 310C. According to an embodiment, the front surface 310A may be formed of a front panel 302 (e.g., a glass plate comprising various coatings, or a polymer plate), at least a portion of which is substantially transparent. The rear surface 310B may be formed of a rear panel 311. For example, the rear panel 311 may be formed of glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface 310C may be coupled to the front panel 302 and the rear panel 311, and may be formed of a side frame structure (or “side member”) 318 comprising metal and / or polymer. In some embodiments, the rear panel 311 and the side frame structure 318 may be integrally formed and may comprise the same material (e.g., glass, a metallic material such as aluminum, or ceramic).

[0067] In the illustrated embodiment, the front panel 302 may include two first edge regions 310D that curve seamlessly from the front surface 310A toward the rear panel 311 and are located at opposite long side ends of the front panel 302. In the illustrated embodiment (see...) Figure 3 In this embodiment, the rear panel 311 may include two second edge regions 310E, which curve seamlessly from the rear surface 310B toward the front panel 302 and are located at opposite long side ends of the rear panel 311. In some embodiments, the front panel 302 (or the rear panel 311) may include only one of the first edge region 310D (or the second edge region 310E). In another embodiment, it may not include a portion of the first edge region 310D or the second edge region 310E. In an embodiment, when viewed from the side surface of the electronic device 101, the side frame structure 318 may have a first thickness (or width) on the side surface excluding the first edge region 310D or the second edge region 310E, and a second thickness thinner than the first thickness on the side surface including the first edge region 310D or the second edge region 310E.

[0068] According to an embodiment, electronic device 101 may include at least one of the following: display 301, audio module 303, 307, and 314 (e.g., Figure 1 The audio module 170 and the sensor module (e.g., Figure 1 Sensor module 176), camera modules 305, 312 and 313 (e.g., Figure 1 The camera module 180 and key input device 317 (e.g., in the camera module 180) are included. Figure 1 Input module 150), and connector holes 308 and 309 (e.g., Figure 1 (Connection end 178 in the middle). In some embodiments, at least one of these elements (e.g., connector hole 309) may be omitted from the electronic device 101, and other components may be additionally included therein.

[0069] According to embodiments, for example, the display 301 can be visible through the main body portion of the front panel 302. In some embodiments, at least a portion of the display 301 can be exposed through the front surface 310A and the front panel 302 forming the first edge region 310D. In some embodiments, the corners of the display 301 can be formed to have a shape substantially the same as the shape of the outer periphery of the front panel 302 adjacent to it. In another embodiment (not shown), in order to expand the area where the display 301 is exposed, there may be no gap between the outer periphery of the display 301 and the outer periphery of the front panel 302.

[0070] According to an embodiment, the surface of the housing 310 (or the front panel 302) may include a screen display area formed when the display 301 is visibly exposed. As an example, the screen display area may include a front surface 310A and a first edge region 310D.

[0071] In another embodiment (not shown), a recess or opening may be formed in a portion of the screen display area of ​​the display 301 (e.g., the front surface 310A or the first edge region 310D), and at least one of an audio module 314, a sensor module (not shown), a light-emitting element (not shown), and a camera module 305 aligned with the recess or opening may be included. In another embodiment (not shown), at least one of the audio module 314, the sensor module (not shown), the camera module 305, the fingerprint sensor (not shown), and the light-emitting element (not shown) may be included on the rear surface of the screen display area of ​​the display 301.

[0072] In another embodiment (not shown), the display 301 may be coupled to or adjacent to the following: a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field stylus.

[0073] In some embodiments, at least a portion of the key input device 317 may be disposed in the first edge region 310D and / or the second edge region 310E.

[0074] According to embodiments, audio modules 303, 307, or 314 may include a microphone hole 303 and speaker holes 307 and 314. A microphone for receiving external sound may be disposed in the microphone hole 303, and in some embodiments, multiple microphones may be arranged to detect the direction of sound. Speaker holes 307 and 314 may include an external speaker hole 307 and a receiver hole 314 for telephone calls. In some embodiments, speaker holes 307 and 314 and microphone hole 303 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be included without speaker holes 307 and 314. Audio modules 303, 307, and 314 are not limited to the described structure, and their structure may be changed depending on the structure of the electronic device 101 when only some audio modules are installed or when new audio modules are added.

[0075] According to embodiments, for example, a sensor module (not shown) may generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the electronic device 101. For example, the sensor module (not shown) may include: a first sensor module (not shown) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the front surface 310A of the housing 310, and / or a third sensor module (not shown) (e.g., an HRM sensor) and / or a fourth sensor module (not shown) (e.g., a fingerprint sensor) disposed on the rear surface 310B of the housing 310. In some embodiments (not shown), the fingerprint sensor may be disposed on both the rear surface 310B and the front surface 310A (e.g., the display 301) of the housing 310. The electronic device 101 may also include sensor modules not shown, such as at least one of the following: a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (not shown). The sensor module (not shown) is not limited to the structure described above, and its structure can be changed depending on the structure of the electronic device 101 when only some sensor modules are installed or when new sensor modules are added.

[0076] According to embodiments, camera modules 305, 312, and 313 may include a front-facing camera module 305 disposed on the front surface 310A of the electronic device 101, and a rear-facing camera module 312 and / or a flash 313 disposed on the rear surface 310B. Camera modules 305 and 312 may each include one or more lenses, an image sensor, and / or an image signal processor. For example, the flash 313 may include a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle lens, and telephoto lens) and an image sensor may be arranged on one surface of the electronic device 101. Camera modules 305, 312, and 313 are not limited to the described structure and their structures may be modified depending on the structure of the electronic device 101 when only some camera modules are installed or when a new camera module is added.

[0077] According to embodiments, electronic device 101 may include multiple camera modules (e.g., dual-camera or triple-camera) with different attributes (e.g., viewing angles) or functions. For example, camera modules 305 or 312, including lenses with different viewing angles, may be configured to have multiple camera modules, and electronic device 101 may be controlled to change the viewing angles of camera modules 305 and 312 based on user selection, which is performed within electronic device 101. For example, at least one of the multiple camera modules 305 and 312 may be a wide-angle camera, while at least another of them may be a telephoto camera. Similarly, at least one of the multiple camera modules 305 and 312 may be a front-facing camera, while at least another of them may be a rear-facing camera. Additionally, the multiple camera modules 305 and 312 may include at least one of the following: a wide-angle camera, a telephoto camera, or an infrared (IR) camera (e.g., a time-of-flight (TOF) camera or a structured light camera). According to embodiments, an IR camera may also operate as at least part of a sensor module. For example, a TOF camera may also operate as at least part of a sensor module (not shown) to detect the distance to a subject.

[0078] According to an embodiment, the key input device 317 may be disposed on the side surface 310C of the housing 310. In another embodiment, the electronic device 101 may not include some or all of the aforementioned key input device 317, and the key input device 317 not included therein may be implemented on the display 301 as a different type such as a soft key. In some embodiments, the key input device may include a sensor module (not shown) disposed on the rear surface 310B of the housing 310.

[0079] According to an embodiment, for example, a light-emitting element (not shown) may be disposed on the front surface 310A of the housing 310. For example, the light-emitting element (not shown) may provide status information of the electronic device 101 in the form of light. In another embodiment, for example, the light-emitting element (not shown) may provide a light source that operates in association with the operation of the front-facing camera module 305. For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0080] According to embodiments, connector holes 308 and 309 may include: a first connector hole 308 capable of accommodating a connector (e.g., a USB connector) for transmitting power and / or data to or receiving power and / or data from an external electronic device; and / or a second connector hole 309 (e.g., a headphone jack) capable of accommodating a connector for transmitting audio signals to or receiving audio signals from an external electronic device. Connector holes 308 and 309 are not limited to the described structure and their structure may be modified depending on the structure of the electronic device 101 when only some connector holes are installed or when new connector holes are added.

[0081] According to an embodiment, the camera module 305 and / or sensor module (not shown) may be configured to contact the external environment within the internal space of the electronic device 101 via a designated area of ​​the display 301 and the front panel 302. For example, the designated area may be an area of ​​the display 301 without pixels. As another example, the designated area may be an area of ​​the display 301 with pixels. When viewed from above the display 301, at least a portion of the designated area may overlap with the camera module 305 and / or sensor module. As another example, some sensor modules may also be arranged to perform their functions without being visually exposed within the internal space of the electronic device via the front panel 302.

[0082] Figure 4 This is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0083] Reference Figure 4 Electronic device 101 (e.g., Figure 2 and Figure 3 The electronic device 101 in the middle may include: a front panel 320 (e.g., Figure 2 Front panel 302), display 330 (e.g., Figure 2 The display 301, first support member 332 (e.g., bracket), main printed circuit board 340 (e.g., PCB, flexible PCB (FPCB) or rigid-flex PCB (RFPCB)), battery 350, second support member 360 (e.g., back cover), antenna 370 and rear plate 380 (e.g., Figure 3 (Rear plate 311 in the middle). In some embodiments, at least one of these elements (e.g., the first support member 332 or the second support member 360) may be omitted from the electronic device 101, or other elements may be additionally included therein. At least one element of the electronic device 101 may be with Figure 2 or Figure 3 At least one element of the electronic device 101 is the same or similar, and overlapping descriptions will be omitted below.

[0084] According to an embodiment, the first support member 332 may be disposed inside the electronic device 101 to connect to the side bezel structure 331 or to be integrally formed with the side bezel structure 331. For example, the first support member 332 may be formed of a metallic material and / or a non-metallic (e.g., polymer) material. The display 330 may have a surface to which the first support member 332 is coupled, and another surface to which the printed circuit board 340 is coupled. The printed circuit board 340 may have a processor, memory, and / or interface mounted thereon. For example, the processor may include one or more of the following: a central processing unit, an application processor, a graphics processing device, an image signal processor, a sensor hub processor, or a communication processor. According to an embodiment, the printed circuit board 340 may include a radio frequency cable (FRC) of the flexible printed circuit board type. For example, the printed circuit board 340 may be disposed on at least a portion of the first support member 332, and an antenna module (e.g., Figure 1 Antenna module 197) and communication module (e.g., Figure 1 The communication module 190 in the middle can be electrically connected.

[0085] According to embodiments, for example, the memory may include volatile memory or non-volatile memory.

[0086] According to embodiments, the interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface can electrically or physically connect electronic device 101 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0087] According to an embodiment, battery 350 may be a means for supplying power to at least one component of electronic device 101, and may include, for example, a non-rechargeable primary battery, a rechargeable accumulator, or a fuel cell. For example, at least a portion of battery 350 may be disposed on a plane substantially the same as printed circuit board 340. Battery 350 may also be integrally disposed within electronic device 101, or may be configured to be detachable / attachable to electronic device 101.

[0088] According to an embodiment, a second support member 360 (e.g., a rear cover) may also be disposed between the printed circuit board 340 and the antenna 370. For example, the second support member 360 may also include a surface to which at least one of the printed circuit board 340 or the battery 350 is attached, and another surface to which the antenna 370 is attached.

[0089] According to an embodiment, antenna 370 may also be disposed between rear panel 380 and battery 350. For example, antenna 370 may include a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. For example, antenna 370 may perform short-range communication with external devices, or may wirelessly send or receive power required for charging. For example, antenna 370 may include a coil for wireless charging. In another embodiment, the antenna structure may be formed by a portion of side frame structure 331 and / or a first support member 332, or a combination thereof.

[0090] According to various embodiments, the rear plate 380 may form the rear surface of the electronic device 101 (e.g., Figure 3 At least a portion of the rear surface 310B in the middle.

[0091] although Figures 2 to 4 The electronic device 101 shown has a strip-shaped or plate-shaped exterior, but this disclosure is not limited thereto. For example, the illustrated electronic device may be part of a rollable or foldable electronic device. "Rollable electronic device" may mean an electronic device in which a display (e.g., Figure 4 The display 330 in the display can be bent and deformed such that at least a portion of it is wound (or curled) or housed in a housing (e.g., Figure 2 The rollable electronic device may have a display that can be unfolded or has a larger area exposed to the outside, depending on the user's needs, in order to expand and utilize the screen display area. "Foldable electronic device" can mean an electronic device in which two different areas of the display can be folded to face each other or be oriented in opposite directions. Typically, in a carrying state, the display of a foldable electronic device can be configured such that its two different areas are folded in a state facing each other or in opposite directions, while in a practical use state, the display can be unfolded by the user so that its two different areas form a substantially flat shape. In some embodiments, the electronic device 101 according to the various embodiments disclosed in the document may be interpreted to include the meaning of various other electronic devices, such as notebook computers or home appliances other than portable electronic devices such as smartphones.

[0092] Figure 5 This is a view showing the front surface 410a, side surface 410c, and rear surface 410b of an electronic device 400 according to various embodiments disclosed in the document. Figure 6a This illustrates an electronic device according to another embodiment disclosed in the document (e.g., Figure 5 A perspective view of the front surface 410a and the rear surface 410b of (400). Figure 6bThis illustrates electronic devices according to various embodiments disclosed in the document (e.g., Figure 5 A three-dimensional view of the rear surface (410b' and 410b") of 400).

[0093] Reference Figure 5 An electronic device 400 (e.g., electronic device 101 or 300) according to various embodiments disclosed in the document may include: a housing 410 including: a front panel 402 (e.g., front panel 302 or 320); a rear panel 411 (e.g., rear panel 311 or 380) oriented in a direction opposite to that of the front panel 402; a side member 418 (e.g., side frame structure 318 or 310) surrounding the space between the front panel 402 and the rear panel 411; and a display 401 (e.g., display 301 or 330) visible through the front panel 402.

[0094] According to various embodiments disclosed in the document, the housing 410 may include a first surface 410a (or front surface) formed by the front plate 402, a second surface 410b (or rear surface) formed by the rear plate 411, and a third surface 410c (or side surface) formed by the side member 418. According to embodiments, the first surface 410a and the second surface 410b may be oriented in different directions, while the third surface 410c may be perpendicular to each of the first surface 410a and the second surface 410b.

[0095] According to various embodiments disclosed in the document, the third surface 410c formed by the side member 418 may have four surfaces corresponding to the shape of the edge of the rear plate 411, and these four surfaces may be oriented in different directions from each other.

[0096] According to various embodiments, at least one of the first surface 410a, the second surface 410b, and the third surface 410c may be configured to include a curved surface.

[0097] According to various embodiments, at least one slit 420 may be formed in the side member 418. The at least one slit 420 formed in the side member 418 may be used to utilize at least a portion of the side member 418 as an antenna. In embodiments, the slit 420 may be formed to isolate and separate at least a portion of the side member 418 from other portions of the side member 418. The number or shape of the slits 420 is not limited to any specified embodiment. Furthermore, the slit 420 may not be used to utilize at least a portion of the side member 418 as an antenna, but may simply be used to divide the side member 418 into multiple portions.

[0098] In the various embodiments disclosed in the document, at least one slit 420 may be formed on at least one of the plurality of third surfaces 410c of the side member 418. According to an embodiment, two slits 420 may be formed on any one of the plurality of third surfaces 410c of the side member 418. For example, Figure 5 Two slits 420a and 420b are shown formed on the upper side surface of a plurality of third surfaces 410c of the side member 418. According to another embodiment, unlike the illustrated embodiment, a slit 420 may be formed on one of the plurality of third surfaces 410c of the side member 418 (e.g., the upper surface), while a slit 420 may be formed on another adjacent surface (e.g., the right side surface) of the plurality of third surfaces 410c of the side member 418 (see below). Figure 7b (An embodiment of the embodiment). According to another embodiment, three or more slits 420 may also be formed on any one of the plurality of third surfaces 410c of the side member 418.

[0099] According to various embodiments, when two slits 420a and 420b are formed on one of the plurality of third surfaces 410c (e.g., the upper surface), the two slits 420a and 420b can be spaced apart from each other. According to embodiments, the two slits 420a and 420b can also be formed symmetrically to each other based on dashed lines drawn along the height direction at the center of any one of the plurality of third surfaces 410c (e.g., the upper surface). However, it is not necessarily limited to this, and according to embodiments, the locations where the slits are formed and the gaps between them can be diverse.

[0100] According to various embodiments, the slit 420 may be disposed in multiple regions within an electronic device 400. For example, as Figure 5 and Figure 6a As shown, not only are slits 420a and 420b formed on the upper side surface of one of the multiple surfaces serving as side member 418, but slits 420d and 420e can also be formed on the lower side surface of another of the multiple surfaces serving as side member 418. Although Figures 5 to 6b Two slits are shown disposed on each of the upper and lower surfaces of the electronic device, but this is not a limitation. Slits 420 according to various embodiments of the present disclosure may also be implemented in the same form or in variations on other surfaces (not mentioned) of the plurality of third surfaces 410c of the side member 418. For example, as will be described later... Figure 7b and Figure 8In the embodiments shown, at least one slit 420 may be formed on each of the upper, lower, left, and right side surfaces of the side member 418. According to the various embodiments disclosed in the document, it should be noted that at least one slit may also be additionally or alternatively located at the position of a third surface 410c, not shown in the drawings. According to various embodiments, the slit 420 may be constructed differently depending on the omission or addition of at least one of the following elements: display (e.g., 201), audio module (e.g., 203, 207, and 214), sensor module (e.g., 204 and 219), camera module (e.g., 205, 212, and 213), key input device (e.g., 215, 216, and 217), indicator (e.g., 206), or connector hole (208 and 209), and various arrangements of the elements.

[0101] Refer again Figure 5 and Figure 6a According to various embodiments disclosed in the document, slits 420a and 420b or 420d and 420e formed in the side member 418 can be formed to be separate and spaced apart from each other. In contrast, a portion of slit 420 can also be formed in the rear plate 411. See reference... Figure 6b According to various embodiments disclosed in the document, slits 420c' and 420c” or 420f' and 420f” formed in the rear plate 411 can be formed as a non-discrete slit 420, and slits 420d' and 420e' or 420d” and 420e” formed in the side member 418 can be formed as a non-discrete slit 420. That is, according to various embodiments, slits 420 can also be formed above the side member 418 and the rear plate 411, and can also have a partially curved shape.

[0102] Reference Figure 6b According to various embodiments, at least one slit 420c', 420f', 420c”, or 420f” may be formed in the rear plate 411. According to various embodiments, at least a portion of the slit 420c', 420f', 420c”, or 420f” formed in the rear plate 411 may also have a predetermined width and may extend from one portion of the rear plate 411 to another. For example, as... Figure 6b As shown, at least a portion of slits 420c' or 420f' or 420c” or 420f” can be formed to extend in a direction parallel to the horizontal side of the rear plate 411 disclosed in the document (e.g., a direction parallel to the X-axis of the spatial coordinate system). According to various embodiments, slits 420c' and 420f' or 420c” and 420f” formed in the rear plate 411 can also have a continuous shape, but unlike this, a portion of them can have a discrete shape. For example, although... Figure 6bThe slits 420c' and 420f' or 420c” and 420f” shown have a continuous shape, but are not necessarily limited thereto. According to various embodiments, the slits 420c' and 420f' or 420c” and 420f” may also have separate shapes on the rear plate 411, or may be formed such that they are wholly or at least partially not exposed to the outside of the housing. For example, if at least a portion of the rear plate 411 is formed of a material such as glass or synthetic resin, the slits 420c' and 420f' or 420c” and 420f” may have separate shapes, or may be formed such that they are wholly or at least partially not exposed to the outside of the housing.

[0103] According to various embodiments, at least a portion of the housing 410 may include a conductive material (e.g., a metal). A housing including a conductive material (e.g., a metal) may be configured to adjust its shape or size (e.g., length, height, or area) to differently form the exterior of an electronic device.

[0104] According to various embodiments, at least a portion of the housing 410, made of a conductive material (e.g., metal), can be insulated by slits 420. For example, if at least a portion of the third surface 410c of the side member 418 is formed of a metallic material, slits 420a and 420b are formed on the corresponding surfaces to electrically isolate a portion of the side member 418 from other portions.

[0105] According to various embodiments, insulating material (e.g., injection-molded product) may be formed in the partition between one portion and another portion of the side member 518 formed by the slit 420. Hereinafter, embodiments of coloring the side member 518 with at least a portion of the insulating material formed in the partition will be described in detail.

[0106] Figure 7a This is a view showing the form of applying a first color to a side member 518, which includes a portion separated by a slit, according to an embodiment. Figure 7b This is a view showing, according to an embodiment, a first color and a second color applied to a side member 518, which includes a portion separated by a slit.

[0107] According to various embodiments, slits 520a, 520b, 520d, 520e, 520g, and 520h are formed on the third surface of the side member 518 (e.g., Figure 5 The slits 420a and 420b in the middle can divide the side member 518 into two or more main parts. For example, if the side member 518 is constructed of a conductive material (e.g., metal), the side member 518 can be divided into a first part constructed of a conductive material and a second part constructed of a conductive material and electrically isolated from the first part.

[0108] According to various embodiments disclosed in the document, the housing 500 may include for filling the side members 518 and / or the rear plate (e.g., Figure 6a or Figure 6b The insulating materials 530 and 530' are multiple slits on the rear panel 411. The insulating materials 530 and 530' can be used to restrict the flow of current between some components of the electronic device and some other components. For example, if the housing 500 of the electronic device is made of a conductive material (e.g., metal), the insulating materials 530 and 530' can cause an electrical disconnect between some components of the housing and other components.

[0109] Reference Figure 7a The side member 518 can be divided into portions indicated by reference numeral 518a on its left and right surfaces as a first part, and portions indicated by reference numeral 518b on its upper and lower surfaces as a second part. Here, since the arrangement and shape of the first and second parts indicated by reference numerals are merely examples, it should be noted that the arrangement and shape of the first and second parts can be varied. According to an embodiment, the first part 518a and the second part 518b can be spaced apart by slits 520a, 520b, 520d, and 520e, and an insulating material (e.g., for injection-molded products) 530 can be disposed in the space between the spaced-apart first parts 518a and second parts 518b to electrically insulate the first parts 518a and second parts 518b.

[0110] Figure 7a An embodiment is shown in which a first color is applied to a first portion 518a. According to various embodiments of this disclosure, the first portion 518a may include a plurality of first portions 518a physically spaced apart from each other (e.g., in...). Figure 7a The first portion 518a) is respectively arranged on the left and right surfaces of the side member 518, and can be colored simultaneously by an anodizing process. The second portion (or these second portions) can be electrically insulated from the first portion by an insulating material 530, so that they can be left uncolored during the anodizing process used to color the first portion.

[0111] according to Figure 7bThe side member 518 of the embodiment shown can be divided into a first part indicated by reference numeral 518a at its upper left, upper right, and lower ends, and a second part indicated by reference numeral 518b at its lower left, lower right, and upper ends. Here, the first part 518a and the second part 518b can be spaced apart by slits 520a, 520b, 520d, 520e, 520g, and 520h, and insulating materials (e.g., injection-molded products) 530 and 530' can be arranged in the space between the spaced-apart first part 518a and second part 518b to electrically insulate the first part 518a and the second part 518b. Figure 7a and Figure 7b The arrangement and shape of the insulating materials 530 and 530' shown are not limited to any particular embodiment. Figure 7b In addition to the embodiments shown, slits may also be formed on a third surface of the side member 518, so that the side member 518 may have a greater number of partitions.

[0112] Figure 7b An embodiment is shown in which a first color is applied to a first portion 518a and a second color is applied to a second portion 518b. The first portion 518a may comprise a plurality of first portions 518a physically spaced apart from each other (e.g., in...). Figure 7b The first portion 518a is respectively arranged at the upper left end, upper right end, and lower end of the side member 518, and can be colored simultaneously by an anodizing process. Additionally, the second portion 518b may include a plurality of second portions 518b physically spaced apart from each other (e.g., in...). Figure 7b The second portion 518b is respectively arranged at the upper end, lower right end, and lower left end of the side member 518, and can be colored simultaneously by an anodizing process. According to various embodiments of the present disclosure, the anodizing process for the first portion and the anodizing process for the second portion can be performed consecutively, and since the first and second portions are electrically insulated, there is an advantage in omitting steps such as processing or cleaning performed between consecutive anodizing processes. This will be described in detail later.

[0113] Figure 8 This is a view showing a housing 500 with multiple partitions according to various embodiments disclosed in the document.

[0114] Only side member 518 is colored Figure 7a and Figure 7b The embodiments shown are different. Figure 8 An embodiment is shown where the side member 518 and the support member 511 are colored with a specified color. Additionally, with... Figure 7a and Figure 7b The embodiments shown are different. Figure 8 An embodiment is shown in which not only the outer wall 518a-1 or 518b-1 of the side member 518, but also the inner wall 518a-2 or 518b-2 of the side member 518 is colored with a specified color.

[0115] According to various embodiments of this disclosure, the housing 500 may include not only the above-described... Figure 5 The front panel described in the text (e.g., Figure 5 Front panel 402), rear panel (e.g., Figure 5 The rear plate 411 and side members (e.g., Figure 5 The side member 418 in the middle, and may also include, for example Figure 8 The support member 511 shown is disposed in the internal space of the housing (e.g., Figure 4 The structure of the supporting components 332 and 360 in the middle.

[0116] The housing 500 may include a conductive material and may be divided into two or more main body portions, each of which includes a conductive material. According to an embodiment, as in... Figure 5 and Figure 6a In the embodiments previously described, the side member 518 included in the housing 500 can be divided into two or more main body parts. Alternatively, as in Figure 6b In the embodiments previously described, the combined structure including the side member 518 and the rear plate 411 in the housing 500 can be divided into two or more main parts. Alternatively, the combined structure including the side member 518 and the support member plate 511 in the housing 500 can be divided into two or more main parts.

[0117] According to various embodiments, although the side member 518 and / or rear panel 411 included in the housing 500 are described as part of the electronic device, they are not limited thereto, and the side member and / or rear panel can be implemented as a structure that can be attached to or detached from the housing 500 of the electronic device. For example, the side member 518 and / or rear panel 411 can be coupled to the electronic device to protect it from external impacts or foreign objects. According to various embodiments, the housing 500 can be referred to by various terms such as “cover,” “shell,” “enclosure,” “outer shell,” “accessory shell,” or “outer casing.” According to various embodiments, the side member 518 and / or rear panel 411 included in the housing 500 are not limited to the embodiments mentioned in the document, and can be shaped in various ways depending on the shape of the electronic device.

[0118] Figure 8An embodiment is shown in which the combination of a side member 518 and a support member plate 511 included in a housing 500 is divided into two or more main parts. The side member 518 and the support member 511 may be constructed of a conductive material (e.g., metal). For example, the combined construction of the side member 518 and the support member 511 may include a first part constructed of a conductive material and a second part constructed of a conductive material and electrically isolated from the first part. That is, in Figure 8 In one embodiment, the housing 500 may include a first part and a second part as two main body parts.

[0119] according to Figure 8 In the embodiment shown, the first portion may include a portion of the side member 518 indicated by reference numeral 518a and the support member 511. The second portion may include a portion of the side member 518 indicated by reference numeral 518b. Here, the first portion may be included in the area indicated by dashed lines in the housing, while the second portion may be included in the area indicated by alternating long and short dashed lines in the housing. In a housing 500, the first portion and the second portion may each include a plurality of first portions and a plurality of second portions. Here, the first portions 518a and 511 and the second portion 518b may be spaced apart from each other by slits 520a, 520b, 520d, 520e, 520g and 520h, and insulating materials (e.g., injection-molded products) 530 and 530' may be formed in the space formed by the space between them to electrically insulate the first portions 518a and 511 from the second portion 518b. However, the above examples are merely embodiments and are not necessarily limited thereto. The second part can also be constructed to include a portion of the side member 518 and at least one portion of the support member 511.

[0120] according to Figure 8 In the embodiment shown, the main body portion of the housing 500 can be divided into first portions 518a and 511 and a second portion 518b, and at least some of the first portions 518a and 511 and the second portion 518b can include an outer wall facing the outside of the housing and an inner wall oriented in the opposite direction to the outer wall. For example, a side member 518 can include a first portion 518a and a second portion 518b, the first portion 518a including a first outer wall 518a-1 and a first inner wall 518a-2, and the second portion 518b including a second outer wall 518b-1 and a second inner wall 518b-2. As one example, some of the first portions 518a and 511 can include a first outer wall 518a-1 and a first inner wall 518a-2, but others of the first portions 518a and 511 can also include a third outer wall 518-3 and a support member 511. Here, the support member 511 can be configured to include an inner wall oriented in the opposite direction to the third outer wall 518-3.

[0121] The main body of housing 500 may include multiple regions that serve as electrically isolated areas. In this case, each region can be colored differently. However, when performing "anodization," a surface treatment method to be described later, current can flow between the outer and inner walls of the same separating region (e.g., the first or second part), so the outer and inner walls of the same separating region (e.g., the first or second part) can be colored with the same color scheme. For example, the first outer wall 518a-1 and the first inner wall 518a-2 of the first parts 518a and 511 can also be formed with the same first color scheme, the third outer wall 518-3 and the support member 511 can also be formed with the same first color scheme, and the second outer wall 518b-1 and the second inner wall 518b-2 of the second part 518b can also be formed with the same second color scheme. More specifically, if the first outer wall 518a-1 in the first part 518a is colored "red", the first inner wall 518a-2, which is in the same dividing area, can also be colored "red". Similarly, if the second outer wall 518b-1 in the second part 518b is colored "blue", the second inner wall 518b-2, which is in the same dividing area, can also be colored "blue", thus allowing for multiple colors. However, this may only be an example, and the color implementation is not necessarily limited to this. That is, since the outer wall of the housing can be implemented with multiple colors, the inner wall of the housing can also have the characteristic of being divided into multiple colors. According to embodiments, the outer and inner walls of the same dividing area (e.g., the first part or the second part) can have color differences depending on the surface condition (e.g., roughness or gloss) or post-processing of each area. For example, in the first parts 518a and 511, the first outer wall 518a-1 may include "dark red", and the first inner wall 518a-2, which is in the same dividing area, may include "light red", thus allowing for different colors within the same color family. For example, in the first parts 518a and 511, wall 518a-3 may include "dark red", and support member 511, which is in the same dividing area, may include "light red", thus allowing different colors within the same color family to be included. For example, in the second part 518b, second outer wall 518b-1 may include "dark blue", and second inner wall 518b-2, which is in the same dividing area, may include "light blue", thus allowing different colors within the same color family to be included.In various embodiments of this disclosure, the first outer wall 518a-1, wall 518a-3, second inner wall 518a-2, third inner wall 518a-3, and support member 511 of the first portions 518a and 511 can be colored with the same color scheme by a primary anodizing process, and the second outer wall 518b-1 and second inner wall 518b-2 of the second portion 518b can be colored with the same color scheme by a secondary anodizing process performed consecutively after the primary anodizing process. According to various embodiments of this disclosure, the outer wall can be colored with various colors to enhance its external aesthetics; furthermore, the inner wall can also be colored with various colors.

[0122] In summary, in various embodiments of this disclosure, the outer walls of the first portions 518a and 511 (e.g., the first outer wall 518a-1 and the third outer wall 518a-3) can be formed with a first (1-1) color, the inner walls of the first portions 518a and 511 (e.g., the first inner wall 518a-2 and / or the support member 511) can be formed with a first (1-2) color, the outer wall of the second portion 518b (e.g., the second outer wall 518b-1) can be formed with a first (2-1) color, and the inner wall of the second portion 518b (e.g., the second inner wall 518b-2) can be formed with a second (2-2) color. According to embodiments, the first (1-1) color and the second (1-2) color can be a first color of the same color family, while the second (2-1) color and the second (2-2) color can also be a second color of the same color family. According to embodiments, colors (1-1) and (1-2) can be formed as a first color of the same color family through a primary anodizing process, and colors (2-1) and (2-2) can be formed as a second color of the same color family through a secondary anodizing process. However, the various embodiments of this disclosure are not limited thereto. Depending on the surface condition (e.g., roughness or gloss) of each region or the post-processing, colors (1-1), (1-2), (2-1), and (2-2) can also be different colors. For example, colors (1-1), (1-2), (2-1), and (2-2) can be four different colors formed by a total of four anodizing processes. Furthermore, various other embodiments can be applied.

[0123] The following will refer to Figures 9a to 13 A detailed description of the shell structure manufacturing method, including the anodizing method.

[0124] Figure 9a This is a flowchart illustrating a shell structure manufacturing method including an anodizing method according to some embodiments. Figure 9b This is a flowchart illustrating a shell structure manufacturing method including an anodizing method according to various embodiments of the present disclosure.

[0125] First, in operation S901, a design is performed to determine the appearance and shape of the product to be produced. After determining the external design to be achieved, the number of colors to be expressed on the exterior, and the specific colors and locations where the colors will be arranged, the parts in which synthetic resin (e.g., resin) and conductive materials (e.g., metal) (hereinafter referred to as "metal components") will be arranged can be selected.

[0126] Next, in operation S903, raw materials for the housing, including metal components, can be provided. For example, aluminum sheet material, used as an external or internal material for electronic devices, can be used as the raw material for the housing. For example, in addition to pure aluminum, aluminum sheet material can also include alloys from the 2xxx series to the 6xxx series, and / or 7xxx series alloys with high strength. For example, aluminum alloy material can include aluminum as its main component and can include copper, magnesium, manganese, silicon, tin, or zinc as its main alloying elements. Next, in operation S903, machining and joining processes can be performed on the raw materials for the housing, including metal components. The housing can be manufactured into the desired shape by machining. The components that have undergone machining undergo joining processes, and here, joining processes can refer to all chemical and physical treatment processes that bond the metal and the molten resin injected in the injection process to each other. Because metals that have not undergone joining treatment may break or separate due to insufficient bonding properties with the injection resin, joining processes may have to be performed before the injection process.

[0127] Next, in operation S904, molten resin can be injected into the metal component through an injection process to bond the resin and the metal.

[0128] In operation S905, the component that has undergone injection molding can be machined into the desired final shape through a processing technology. Here, in addition to simple cutting processes, the processing technology can also include both polishing (wet polishing and dry polishing) processes and Dia-Cut processes that may be involved in the final appearance of the outer material. According to an embodiment, a polishing process can be performed to achieve a high gloss on the surface of a metal component to be applied to an electronic device, and the polishing process can include physical polishing (dry / wet polishing) and / or electropolishing processes. In the polishing process, an electropolishing process can be performed after a physical polishing process. As another example, a physical polishing process can be performed after an electropolishing process. As another example, physical polishing and electropolishing processes can be performed selectively. For example, physical polishing can be performed by bringing a rotary polishing apparatus into contact with the surface of the metal component. Physical polishing processes can be selectively used in wet polishing, where the surface of the metal component is polished in a wet state, and dry polishing, where the surface of the metal component is polished in a dry state. The electropolishing process can use the anodic dissolution phenomenon to smooth and / or polish the surface of the metal component. According to various embodiments, a surface profile forming process can be performed after a polishing process (e.g., physical polishing and / or electropolishing). The surface profile forming process can be performed after a physical polishing process or after an electropolishing process. As another example, the surface profile forming process can also be performed after sequentially performing a physical polishing process and an electrolytic process, or it can be performed without performing a polishing process. According to various embodiments, a surface profile forming process can be performed to achieve a profile (e.g., roughness) on the surface of a metal component to be applied to an electronic device, and can include methods of applying force physically, such as sandblasting, and / or methods of applying force chemically, such as chemical etching. Additionally, the processing technology can include all processes involved in its appearance, such as barrel polishing, sandblasting, and hairline texturing.

[0129] In operations S906 and S909, an anodizing process can be performed. Specifically, the anodizing process may include a pretreatment step (cleaning), an anodized film formation step (or anodizing step), a staining step, and / or a post-treatment step (or sealing step). The pretreatment step may include a degreasing process, a chemical polishing process, and a decontamination process. In this case, during the degreasing process, an acidic or neutral degreasing solution may be selectively applied depending on the process environment and the target material. A chemical polishing process may be performed to flatten the uneven surface of the material that has been unevenly treated, thereby reducing diffuse reflection and improving its surface gloss. A decontamination process may be performed to remove dirt and foreign matter that has already been generated on the surface of the material during the degreasing and chemical polishing processes. Next, the surface of the metal exterior material can be anodized. The anodizing film formation step can be performed by placing a housing comprising a metal component in a container that receives at least one of the following electrolytes, or a container that receives all of the following electrolytes: sulfuric acid, oxalic acid, phosphoric acid, chromic acid, organic acids (citric acid, acetic acid, propionic acid, tartaric acid), or boric acid; and applying a predetermined voltage and temperature thereon. In the anodizing film formation step, the metal component reacts with oxygen due to the applied voltage, resulting in the formation of an oxide film with high density. For example, an operating voltage in the range of approximately 5-20V may be suitable, and the process time may take approximately 10 minutes to 3 hours. A process temperature in the overall range of approximately 5-30°C may be suitable. After the anodizing step, a dyeing process can be performed. The dyeing process can be a process that expresses color on the anodized film. For example, types of dyeing processes include impregnation, electrolytic dyeing, or oil-based dyeing. The immersion method involves immersing the product in a solution containing dissolved dye, allowing the dye to diffuse and adsorb onto the product to achieve color. Electrolytic dyeing, on the other hand, involves applying an electric current to a metal salt electrolyte or similar solution to express color. The oil-based method involves photosensitizing and drying an oxide film, then coloring it with an oil-based dye using a brush. Here, the dyes used in the immersion method can include both organic and inorganic dyes, and because the dyes used in the immersion method are primarily soluble in water, it can also be called the aqueous solution method. Next, in the post-treatment steps, membrane sealing and post-sealing treatments can be performed. Sealing treatments can include methods using metal salts and methods using non-metallic salts made from organic matter. Hydration sealing treatments, including those using water and steam, can be included. Post-sealing treatments can include elution processes for removing metal salts or hot water cleaning processes for cleaning foreign matter. Post-treatment steps can be performed to ensure the external stability and reliability of the anodized and colored materials.

[0130] according to Figure 9aIn the embodiment shown, a processing step S907 and a cleaning step S908 can be performed between two anodizing processes according to operation S906 and operation S909. The processing step S907 can be a step of cutting and machining portions requiring different color coloring when the color from the anodizing process according to operation S906 is applied thereon, or polishing the oxide film produced in the anodizing step to remove the primary anodized film. The cleaning step S908 can be a step of removing processing byproducts (e.g., cutting oil, burrs, and other foreign matter) produced in the processing step S907 to clean the surface to which the secondary anodizing process S907 will be performed.

[0131] according to Figure 9b In various embodiments of the present disclosure shown, processing steps S907 and cleaning steps S908 can be omitted between two anodizing processes according to operations S906 and S909. That is, the primary anodizing process S906 and the secondary anodizing process S909 can be performed continuously without intermediate processing and cleaning steps. Therefore, multiple coloring processes with a reduced number of steps are possible, resulting in cost savings and increased productivity. According to various embodiments of the present disclosure, a continuous anodizing process can be a process in which anodizing processes are performed continuously as many times as the number of colors to be achieved. A continuous anodizing process can include not only primary and secondary anodizing but also tertiary or more anodizing processes.

[0132] Figure 10 This is a view showing a fixture for performing anodizing processes according to various embodiments of the present disclosure. Figure 11a This is a view showing a fixture, according to various embodiments of the present disclosure, mounted onto a housing 500. Figure 11b This is a view illustrating aspects of the use of fixtures for performing anodizing processes according to various embodiments of the present disclosure.

[0133] A fixture 600 can be provided to allow current to flow through the metal component, thereby forming an oxide film on the surface of the metal component. In the case of anodizing, the oxide film can be formed only on the surface of the metal component to which the fixture 600 is connected and thus through which current flows, and not on the metal component separated by insulating material. In the dyeing step following oxide film formation, only the surface of the metal component to which the fixture 600 is connected can be dyed.

[0134] The fixture 600 used herein may include a fixture made of a metallic material that allows current to flow and having a shape that allows the fixture 600 to be stably mounted to the product during the anodizing process. For example, Figure 10A clamp 600 is shown, comprising a shaft 620, a connecting member 610 disposed at one end of the shaft 620, and a plurality of branches 630a, 630b, and 630c formed at the other end of the shaft 620. Although the figures show a clamp with three branches, the invention is not limited thereto. According to embodiments, the type of clamp can be varied. The clamp can also be a clamp that can be inserted into a through hole formed in the housing, a clamp that is in close contact with the surface of the housing to press the housing, or a clamp that is clamped and fixed to a concave / convex portion formed on the housing.

[0135] Reference Figure 11a In cases where different colors are applied to achieve multiple colors, the fixture can be attached to the unanodized surface of the metal component by changing the position where the fixture 600 is installed (i.e., the position where the fixture 600 is supported by the housing 500), thus allowing additional anodizing and coloring processes to be performed.

[0136] Reference Figure 11b The fixture 600 can perform a series of anodizing processes together with another fixture 600 using connecting members 610. For example, the connecting members 610 of each fixture 600 can be connected and mounted to the rod portion 611 to transport the fixture 600 in one direction or the other. According to various embodiments, the connecting members 610 can also be integrally formed with the rod portion 611. The anodizing methods of this disclosure can be applied to multiple housings 500 by means of the fixtures 600.

[0137] Figure 12 a to Figure 12 e is a view illustrating examples of implementations of a continuous anodizing process according to various embodiments of the present disclosure.

[0138] According to various embodiments of this disclosure, branches of the clamp 600 may selectively connect only to designated conductive material portions within regions divided into conductive and insulating materials, such that the designated conductive material portions are anodized and colored. For example, as Figure 12 a to Figure 12 As shown in Figure c, in the primary anodizing process, fixture 600 can be connected to the first portions 518a and 511 of side members 518. As a result of the primary anodizing process, only the surfaces of the metal members to which fixture 600 is connected can be colored with a specified color. To perform additional coloring, such as... Figure 12 d to Figure 12As shown in figure e, fixture 600 can be connected to the unanodized second portion 518b to perform secondary anodizing and coloring processes. In this way, the desired color can be achieved differently for each portion through a continuously executed anodizing process. In this way, multi-layered colors can be achieved by repeating the anodizing process as many times as the desired color.

[0139] Reference Figure 12 The image shows three branches of the clamp 600 connected to the first portions 518a and 511 and the second portion 518b of the side members 518. However, it is not necessarily limited to this. For example, in the case where the support member 511 in the first portions 518a and 511 and the first portion 518a in the first portions 518a and 511, located at the lower end of the housing 510, are connected to a conductive material (not shown) (e.g., aluminum) included in the injection-molded product and form a single electrical conductor, the clamp 600, including two branches, can be used to perform anodizing and coloring processes.

[0140] Figure 13 This is a view illustrating application examples of a continuous anodizing process according to various embodiments of the present disclosure.

[0141] According to various embodiments, a continuous anodizing process allows for the desired design of the colors of divided metal components (e.g., a first portion and a second portion), and various textures and colors can be achieved for each portion separated by slits. For example, barrel polishing, wet / dry polishing, sandblasting, or hairline texturing processes involved in its appearance can be performed between consecutive anodizing processes, resulting in different textures for the separated portions of the metal components. Even when the same process is applied to a product, different textures can be achieved for the separated portions of the metal components because the effects achieved on the anodized surface and the unanodized surface are different.

[0142] Figure 14 This is a perspective view of a wearable electronic device 700 with a housing, the exterior of which is colored with various colors by a continuous anodizing process. Figure 15 This is a front view showing a wearable electronic device that achieves various colors on the exterior of the housing using a continuous anodizing method.

[0143] The housing and housing manufacturing method according to various embodiments of this disclosure can be applied to, except... Figures 2 to 13 The product group shown here includes all products that use metal as their external material, except for the outer frame of the portable terminal.

[0144] For example, such as Figure 14As shown, the wearable electronic device 700 can be formed with insulating material at a dividing portion located between one part and another of the side member and formed by at least one slit 720. At least one slit 720 can divide the housing (e.g., the side member) into two or more main body parts. For example, in the case where the housing of the wearable electronic device is made of a conductive material (e.g., metal), insulating material can be used to cause an electrical disconnect between some components of the housing and other components. The two or more electrically insulating main body parts can be implemented with various colors by using a continuous anodizing method.

[0145] For example, according to Figure 14 and Figure 15 In the embodiment shown, the housing 710 (e.g., a side member) can be divided into four main parts: a first part 710a, a second part 720b, a third part 720c, and a fourth part 720d. According to the embodiment, the first part 710a, the second part 720b, the third part 720c, and the fourth part 720d can be implemented with different colors, and to realize the housing 710, the above-mentioned [materials / techniques] can be applied to it. Figure 13 and Figure 14 The shell structure manufacturing method described in the anodizing method.

[0146] The housing structure of the electronic device is not limited to the above embodiments and drawings, and it will be apparent to those skilled in the art to which this disclosure pertains that various substitutions, modifications and alterations are possible within the scope of the art.

Claims

1. An electronic device, the electronic device comprising: A housing, the housing comprising: a front plate; a rear plate facing in a direction opposite to the front plate; side members surrounding a space between the front plate and the rear plate; and a support member disposed in the space. The side member of the housing is formed of a conductive material and is divided into a first part and a second part electrically isolated from the first part. The first portion and the second portion are separated by a slit formed in the side member, and the housing includes an insulating material filling the slit. The first portion is colored with a first color according to a primary anodizing process including primary anodizing and primary coloring, and the second portion is colored with a second color different from the first color according to a secondary anodizing process including secondary anodizing and secondary coloring and performed after the primary anodizing process. Specifically, during the primary anodizing process in which the first portion is colored, the second portion is not colored, and during the secondary anodizing process in which the second portion is colored, the first portion is not colored. Each of the first and second portions includes an outer wall facing the outside of the housing and an inner wall facing in the opposite direction to the outer wall. The outer and inner walls of the first portion are colored in the same color scheme according to the primary anodizing process, and the outer and inner walls of the second portion are colored in the same color scheme according to the secondary anodizing process performed successively after the primary anodizing process.

2. The electronic device according to claim 1, wherein, The side member of the housing forms the side surface of the housing.

3. The electronic device according to claim 2, wherein, The side member of the housing is disposed between the front plate and the rear plate.

4. The electronic device according to claim 2, wherein, The side members of the housing are disposed around the support member.

5. The electronic device according to claim 1, wherein, The outer wall of the first part has a first color of a first color system, the inner wall of the first part has a second color of the first color system, the outer wall of the second part has a first color of a second color system, and the inner wall of the second part has a second color of the second color system.

6. The electronic device according to claim 1, wherein, The first part comprises a plurality of first parts that are physically spaced apart from each other.

7. The electronic device according to claim 1, wherein, The second part comprises a plurality of second parts that are physically spaced apart from each other.

8. A method for manufacturing a housing, the method comprising: The shell, including the side members, is machined; Primary anodizing is performed to form a predetermined oxide film on the first portion of the side member; The oxide film formed on the first portion is initially colored using a colorant having a first color; Secondary anodizing is performed to form a predetermined oxide film on the second portion of the side member; as well as The oxide film formed on the second portion is secondary-colored using a colorant with a second color. The first portion and the second portion are separated by a slit formed in the side member, and the housing includes an insulating material filling the slit, such that the first portion and the second portion are electrically isolated. The primary anodizing process involves using a colorant of a first color to perform the primary coloring on the oxide film formed on the first portion to form the primary anodizing process. The secondary anodizing process involves using a colorant with a second color to color the oxide film formed on the second portion. The secondary anodizing process is performed consecutively after the primary anodizing process, and During the primary coloring of the oxide film formed on the first portion, the second portion is not colored, and during the secondary coloring of the oxide film formed on the second portion, the first portion is not colored. Each of the first and second portions includes an outer wall facing the outside of the housing and an inner wall facing in the opposite direction to the outer wall. The outer and inner walls of the first portion are colored in the same color scheme according to the primary anodizing process, and the outer and inner walls of the second portion are colored in the same color scheme according to the secondary anodizing process performed successively after the primary anodizing process.

9. The shell manufacturing method according to claim 8, further comprising: Prior to the primary anodizing, the surface of the side member is pretreated to have a predetermined gloss and flatness.

10. The shell manufacturing method according to claim 8, further comprising: Sealing is performed after the primary anodizing and the secondary anodizing to maintain the performance and properties of the colorant on the colored oxide film.

11. The shell manufacturing method according to claim 8, wherein, The side member comprises an aluminum alloy.

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