Drive components and camera modules

Abstract

Disclosed are a driving assembly and a camera module, wherein the driving assembly uses an elastic member group of a circuit board as a reset and limit element of an SMA driver, and reduces the overall height of a chip anti-shake portion by reusing components. In addition, there is a height difference between the inner circuit board and the outer circuit of the circuit board so that the elastic member group is in a stretched state, and the elastic member group in the stretched state provides a pressing force that causes the ball assembly to abut against the chip anti-shake fixing portion, so as to avoid the ball assembly and the chip anti-shake fixing portion from being separated and generating noise.

Description

Technical Field

[0001] The present application relates to the field of camera modules, and in particular to a driving component and a camera module, wherein the driving component uses an elastic component group of a circuit board as a reset and limit element of an SMA driver to reduce the overall height size of a chip anti-shake part by reusing components. Background Art

[0002] With the popularization of mobile electronic devices, the relevant technologies of camera modules used in mobile electronic devices to help users obtain images (for example, videos or images) have been rapidly developed and improved, and in recent years, camera modules have been widely used in many fields such as medical treatment, security, industrial production, etc.

[0003] Currently, consumers in the market have increasingly higher and more diverse requirements for the functions of camera modules configured in mobile electronic devices. For example, they require camera modules of mobile electronic devices to have an anti-shake function. It should be understood that when using mobile electronic devices to take pictures, the human body normally has a certain frequency of physiological tremors and shaking caused by movement, which will lead to poor camera effects. Therefore, it is expected that mobile electronic devices are equipped with anti-shake devices to drive the optical lens or photosensitive chip to move to achieve optical anti-shake.

[0004] Currently, a variety of solutions have been applied to solve the anti-shake problem of camera modules. One of the major technical difficulties is that the anti-shake structure will increase the size of the camera module, which is contrary to the development trend of mobile electronic devices towards lightweight and thin.

[0005] Therefore, an optimized anti-shake structure for camera modules is expected to meet the dual technical requirements of anti-shake and structural design. Summary of the invention

[0006] One advantage of the present application is that it provides a driving component and a camera module, wherein the driving component reduces the overall height size of the chip anti-shake part by reusing the reset and limit elements of the SMA driver of the elastic member group of the circuit board.

[0007] Another advantage of the present application is that it provides a driving assembly and a camera module, wherein there is a height difference between the inner circuit board and the outer circuit of the circuit board so that the elastic member group is in a stretched state. The elastic member group in the stretched state provides a clamping force for the ball assembly to press against the chip anti-shake fixing part to avoid the ball assembly and the chip anti-shake fixing part from detaching and generating noise.

[0008] Another advantage of the present application is to provide a driving assembly and a camera module, wherein at least three balls of the ball assembly form a horizontal mounting surface so that the inner circuit board moves on the horizontal plane, thereby improving the stability of anti-shake.

[0009] Other advantages and features of the present application will become apparent from the following description, and may be achieved by the means and combinations particularly pointed out in the claims.

[0010] To achieve at least one of the above advantages, the present application provides a driving assembly, comprising:

[0011] A chip anti-shake fixing part having a receiving cavity, wherein the chip anti-shake fixing part includes at least one driving element fixing part located in the receiving cavity;

[0012] A chip anti-shake movable part located in the receiving cavity, wherein the chip anti-shake movable part comprises a movable carrier and at least one driving element movable part which can be linkedly connected to the movable carrier;

[0013] A circuit board suspended and fixed in the receiving cavity, wherein the circuit board comprises an inner circuit board, an outer circuit board and an elastic member group extending between the inner circuit board and the outer circuit board, the inner circuit board is suspended and arranged in the outer circuit board by the elastic member group, wherein the inner circuit board is suitable for mounting a photosensitive chip, and the inner circuit board is fixed to a movable carrier of the chip anti-shake movable part;

[0014] A drive element comprising at least one SMA wire extending between the at least one drive element fixed portion and the at least one drive element movable portion; and

[0015] A ball assembly is movably clamped between the movable carrier and the chip anti-shake fixing part, wherein there is a height difference between the inner circuit board and the outer circuit board so that the elastic member group is in a stretched state, and the elastic member group in the stretched state provides a clamping force that makes the ball assembly press against the chip anti-shake fixing part.

[0016] In the driving assembly according to the present application, the anti-shake fixing part includes a base and an upper cover buckled with the base, and the receiving cavity is formed between the upper cover and the base.

[0017] In the driving assembly according to the present application, the ball assembly and the at least one SMA wire are located between the upper cover and the movable carrier.

[0018] In the driving assembly according to the present application, the ball assembly and the at least one SMA wire are located between the base and the movable carrier.

[0019] In the driving assembly according to the present application, the inner circuit board is higher than the outer circuit board.

[0020] In the driving assembly according to the present application, a height difference between the inner circuit board and the outer circuit board is between 0.05 mm and 0.1 mm.

[0021] In the drive assembly according to the present application, the magnitude of the pressing force is between 20 mN and 50 mN.

[0022] In the driving assembly according to the present application, the ball assembly includes at least three balls rollingly clamped between the base and the movable carrier, and the top ends of the at least three balls form a plane parallel to the inner circuit board.

[0023] In the driving assembly according to the present application, the top surface of the inner circuit board has a photosensitive chip mounting area and a peripheral area formed outside the photosensitive chip mounting area, wherein the at least three balls correspond to the peripheral area.

[0024] In the driving assembly according to the present application, the at least three balls are fixed to the movable carrier, or the at least three balls are fixed to the base.

[0025] In the driving component according to the present application, the at least one driving element movable part includes a first driving element movable part and a second driving element movable part that are arranged opposite to each other, the at least one driving element fixed part includes a first driving element fixed part and a second driving element fixed part that are arranged opposite to each other, and the first driving element fixed part, the second driving element fixed part, the first driving element movable part and the second driving element movable part are located at the four corners of the accommodating cavity; wherein the at least one SMA wire includes a first SMA wire extending between the first driving element fixed part and the first driving element movable part, a second SMA wire extending between the first driving element movable part and the second driving element fixed part, a third SMA wire extending between the second driving element fixed part and the second driving element movable part, and a fourth SMA wire extending between the second driving element movable part and the first driving element fixed part.

[0026] In the driving component according to the present application, the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire are located in the same plane, and the plane where the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire are located is parallel to the plane where the inner circuit board is located, wherein the first SMA wire is parallel to the third SMA wire, and the first SMA wire is perpendicular to the second SMA wire, and the first SMA wire is perpendicular to the fourth SMA wire, wherein the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire have the same length.

[0027] In the driving assembly according to the present application, in the Z-axis direction set by the driving assembly, there is a gap between the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire and the elastic member group, and the gap is greater than or equal to 0.1 mm.

[0028] In the driving assembly according to the present application, the first SMA wire, the second SMA wire, the third SMA wire, and the fourth SMA wire are located outside the inner circuit board.

[0029] In the driving component according to the present application, the chip anti-shake fixed part also includes a fixed carrier stacked on the base, the fixed carrier includes a fixed carrier body and a first fixed carrier branch and a second fixed carrier branch respectively extending outward from the fixed carrier, wherein the first driving element fixing part and the second driving element fixing part are respectively installed on the first fixed carrier branch and the second fixed carrier branch, wherein the movable carrier includes a movable carrier body and a first movable carrier branch and a second movable carrier branch respectively extending downward and outward from the movable carrier body, wherein the first driving element movable part and the second driving element movable part are respectively installed on the first movable carrier branch and the second movable carrier branch.

[0030] In the drive assembly according to the present application, the fixed carrier body has at least three ball grooves for accommodating the at least three balls.

[0031] In the driving assembly according to the present application, the chip anti-shake fixing part further includes a support member disposed on the base, and a top surface of the support member abuts against the external circuit board.

[0032] In the driving assembly according to the present application, there is a gap between the elastic member group of the circuit board and the upper cover, and the chip anti-shake movable part further includes an anti-collision assembly fixed to the top surface of the inner circuit board.

[0033] In the driving assembly according to the present application, the elastic member group includes a first elastic member, a second elastic member, a third elastic member and a fourth elastic member, and the first elastic member, the second elastic member, the third elastic member and the fourth elastic member are arranged in a rotationally symmetrical manner relative to the center set by the inner circuit board, wherein the first elastic member, the second elastic member, the third elastic member and the fourth elastic member are respectively distributed around the four corners of the inner circuit board, and the first elastic member, the second elastic member, the third elastic member and the fourth elastic member are respectively connected to one of the inner side surfaces of the vertically distributed outer circuit board and one of the outer side surfaces of the inner circuit board.

[0034] According to another aspect of the present application, a camera module is also provided, comprising:

[0035] Optical lens;

[0036] Photosensitive chip; and

[0037] The driving component as described above, wherein the photosensitive chip is mounted on the inner circuit board.

[0038] Further objectives and advantages of the present application will be fully reflected through understanding of the following description and drawings.

[0039] These and other objects, features and advantages of the present application are fully reflected in the following detailed description, drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0041] Figure 1 The figure shows a stereoscopic schematic diagram of a camera module according to an embodiment of the present application.

[0042] Figure 2 A schematic diagram of the photosensitive component and the driving component of the camera module according to an embodiment of the present application is illustrated.

[0043] Figure 3 The figure shows a three-dimensional exploded schematic diagram of the photosensitive component and the driving component according to an embodiment of the present application.

[0044] Figure 4A A schematic diagram of a circuit board of the photosensitive component according to an embodiment of the present application is illustrated.

[0045] Figure 4B The figure shows a partial enlarged schematic diagram of the circuit board according to an embodiment of the present application.

[0046] Figure 5A A cross-sectional schematic diagram of the driving component and the photosensitive component according to an embodiment of the present application is illustrated.

[0047] Figure 5B The figure illustrates a cross-sectional schematic diagram of a modified embodiment of the driving component and the photosensitive component according to an embodiment of the present application.

[0048] Figure 6 A schematic diagram of a movable carrier and a fixed carrier of the driving assembly according to an embodiment of the present application is illustrated.

[0049] Figure 7 The figure shows a top view of the movable carrier and the fixed carrier according to an embodiment of the present application.

[0050] Figure 8 The figure shows a bottom view of the driving assembly according to an embodiment of the present application after the base is removed.

[0051] Fig. 9 The figure shows a three-dimensional schematic diagram of the base, ball assembly and chip anti-shake fixing part of the driving assembly according to an embodiment of the present application. DETAILED DESCRIPTION

[0052] Below, the exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited to the exemplary embodiments described here.

[0053] Exemplary camera module

[0054] like Figures 1 to 9 As shown, a camera module 1 according to an embodiment of the present application is illustrated, which includes a photosensitive component 30, an optical lens 10 held on the photosensitive path of the photosensitive component 30, and a driving component 20 for driving the optical lens 10 and / or the photosensitive component 30 to move to achieve optical performance adjustment, for example, optical image stabilization, optical focus, etc.

[0055] Accordingly, the optical lens 10 includes a lens barrel 11 and a lens group 12 installed in the lens barrel 11, the lens group 12 includes at least one optical lens, and the number of the at least one optical lens can be one or more, and is not limited. The photosensitive component 30 includes a circuit board 31 and a photosensitive chip 321 electrically connected to the circuit board 31, an electronic component 322 and a connector, and the photosensitive chip 321 is used to receive the external light image collected by the optical lens 10 and electrically connect to an external mobile electronic device through the circuit board 31 and the connector.

[0056] The photosensitive chip 321 includes a photosensitive area and a non-photosensitive area. The photosensitive chip 321 is electrically connected to the circuit board 31 through a photosensitive chip pad located in the non-photosensitive area. For example, the photosensitive chip 321 can be electrically connected to the circuit board 31 by wire bonding (gold wire), welding, FC process (chip flip) or RDL (rewiring layer technology). The photosensitive chip 321 is suitable for being fixed to the upper surface of the circuit board 31 through an adhesive medium (here, in the embodiment of the present application, the surface of the circuit board 31 facing the lens is defined as the upper surface). In some examples of the present application, in order to reduce the overall height dimension of the camera module 1, the photosensitive chip 321 is arranged in the circuit board through hole of the circuit board 31, thereby reducing the influence of the thickness of the circuit board 31 on the thickness of the photosensitive component 30, thereby reducing the height of the camera module 1.

[0057] The photosensitive component 30 further includes a filter element 324, which is maintained on the photosensitive path of the photosensitive chip 321 and is used to filter the imaging light entering the photosensitive chip 321. In a specific example, the filter element 324 is installed on the base 323 of the photosensitive component 30 and corresponds to at least the photosensitive area of ​​the photosensitive chip 321. The base 323 is implemented as a separately molded plastic bracket, which is attached to the surface of the circuit board 31 through an adhesive medium and is used to support other components, or the base 323 is implemented as a molded base, which is integrally formed at a preset position of the circuit board 31 through a molding process, which is not limited to this application. It is worth mentioning that in other examples of the present application, the filter element 324 can also be installed at other positions of the camera module, for example, the filter element 324 is formed in the optical lens 10 (for example, as a layer of filter film attached to the surface of a certain optical lens of the optical lens 10).

[0058] The driving component 20 includes a chip driving part 201, and the chip driving part 201 may include a chip anti-shake unit 21, and the chip anti-shake unit 21 is suitable for driving the photosensitive chip 321 of the photosensitive component 30 to translate in the X-axis direction and the Y-axis direction and / or rotate around the Z-axis direction, so as to achieve translation anti-shake and / or rotation anti-shake of the photosensitive component 30; or, the chip anti-shake unit 21 is suitable for driving the photosensitive chip 321 of the photosensitive component 30 to rotate around the X-axis direction and around the Y-axis direction, so as to achieve tilt anti-shake of the photosensitive component 30. In the present application, the X-axis direction and the Y-axis direction are perpendicular to each other, and the Z-axis direction is perpendicular to the plane where the X-axis direction and the Y-axis direction are located. In other words, the X-axis, the Y-axis and the Z-axis constitute a three-dimensional coordinate system.

[0059] In some examples of the present application, the chip driving part 201 also includes a chip focusing part, that is, the chip driving part 201 can also drive the photosensitive chip 321 of the photosensitive component 30 to move along the optical axis (ie, the Z-axis direction) to realize the chip focusing function.

[0060] In an embodiment of the present application, the chip anti-shake unit 21 and the chip focus unit can be drive motors of the type of voice coil motor, piezoelectric motor, SMA (Shape Memory Alloy) motor, etc. Shape memory alloy is an alloy material that can completely eliminate its deformation at a lower temperature and restore its original shape before deformation after heating. For example, when a shape memory alloy is subjected to a limited plastic deformation at a temperature below the phase transition temperature, it can be restored to its original shape before deformation by heating, wherein the SMA wire can be heated by energizing the SMA wire.

[0061] In some specific examples of the present application, the driving component 20 may also include a lens driving part 202, wherein the lens driving part 202 includes a lens driving fixed part, a lens driving movable part, a lens hanging part connecting the lens driving fixed part and the lens driving movable part, and a driving element, and the optical lens 10 is installed on the lens driving movable part of the lens driving part 202, and the driving element drives the lens driving fixed part and the optical lens 10 to move to realize the lens anti-shake or lens focusing function.

[0062] Specifically, in one embodiment of the present application, the lens driving part 202 includes a lens focusing unit, and the lens focusing unit is suitable for driving the optical lens 10 to move along the optical axis to realize the lens focusing function; in another embodiment of the present application, the lens driving part 202 includes a lens focusing unit and a lens anti-shake unit, so that the lens driving part 202 is suitable for realizing the lens focusing function and the lens anti-shake function at the same time; in another embodiment of the present application, the lens driving part 202 only includes a lens anti-shake unit, so that the lens anti-shake unit drives the optical lens 10 to move to realize the lens anti-shake function. It is worth mentioning that when the lens driving part 202 and the chip driving part 201 both have the anti-shake function, the camera module is suitable for realizing the lens anti-shake and chip anti-shake functions at the same time, realizing the "dual OIS" function, thereby improving the anti-shake effect of the camera module.

[0063] In the embodiment of the present application, the lens focusing unit and the lens anti-shake unit can be driving motors of the type of voice coil motor, piezoelectric motor, SMA (Shape Memory Alloy) motor, etc. When the lens anti-shake unit is a voice coil motor, the driving element is a coil-magnet pair; when the lens anti-shake unit is a piezoelectric motor, the driving element is a piezoelectric element; when the lens anti-shake unit is an SMA motor, the driving element is an SMA wire.

[0064] like Figures 2 to 9 As shown, the chip anti-shake part of the driving component according to the embodiment of the present application is explained, wherein, Figure 2 is a schematic diagram of a photosensitive component and a driving component of the camera module according to an embodiment of the present application, Figure 3 is a three-dimensional exploded schematic diagram of the photosensitive component and the driving component according to an embodiment of the present application, Figure 4A is a schematic diagram of a circuit board of the photosensitive component according to an embodiment of the present application, Figure 4B is a partially enlarged schematic diagram of the circuit board according to an embodiment of the present application, Figure 5A is a cross-sectional schematic diagram of the driving component and the photosensitive component according to an embodiment of the present application, Figure 5B is a cross-sectional schematic diagram of a modified embodiment of the driving assembly and the photosensitive assembly according to an embodiment of the present application, Figure 6 is a schematic diagram of a movable carrier and a fixed carrier of the driving assembly according to an embodiment of the present application, Figure 7 is a top view of the movable carrier and the fixed carrier according to an embodiment of the present application, Figure 8 is a bottom view of the driving assembly according to an embodiment of the present application after the base is removed, and, Fig. 9 It is a three-dimensional schematic diagram of the base, ball assembly and chip anti-shake fixing part of the driving assembly according to an embodiment of the present application.

[0065] like Figure 2 and Figure 3 As shown, in the embodiment of the present application, the photosensitive component 30 includes a circuit board 31 and a mounting member 32 and a connector mounted on the circuit board 31. The circuit board 31 includes a circuit board body 311, a connecting belt and a connector part (the connecting belt, the connector part and the connector are not shown in the figure), the connector is installed at the end of the connector part, the connecting belt connects the circuit board body 311 and the connector part and realizes electrical conduction between the circuit board body 311 and the connector part.

[0066] like Figure 4A As shown in FIG5 , the circuit board body 311 includes an outer circuit board 3113, an inner circuit board 3111, and an elastic member group 3112 connecting the outer circuit board 3113 and the inner circuit board 3111. The mounting member 32 is suitable for being mounted on the upper surface of the inner circuit board 3111. The mounting member 32 includes a photosensitive chip 321 electrically connected to the inner circuit board 3111, an electronic component 322, a base 323 fixedly mounted on the inner circuit board 3111, and a filter element 324 mounted on the base 323. In one embodiment of the present application, a groove or a through hole (circuit board through hole 31115) may be provided on the inner circuit board 3111, and the photosensitive chip 321 is fixedly mounted in the groove of the inner circuit board 3111 or the circuit board through hole 31115 to reduce the height of the camera module.

[0067] That is, in the embodiment of the present application, the upper surface of the inner circuit board 3111 has a photosensitive chip mounting area and a peripheral area surrounding the photosensitive chip mounting, wherein the photosensitive chip 321 is mounted on the photosensitive chip mounting area, and the electronic component 322 and the base 323 are installed in the peripheral area. In addition, in the embodiment of the present application, when the upper surface of the inner circuit board 3111 is partially recessed to form a groove or a through hole, the photosensitive chip mounting area is the groove or the through hole.

[0068] like Figure 4AAs shown, in the embodiment of the present application, the outer circuit board 3113 is arranged around the inner circuit board 3111, and the outer circuit board 3113 and the inner circuit board 3111 are connected via the elastic member group 3112, wherein the inner circuit board 3111 is suspended on the inner side of the outer circuit board 3113 via the elastic member group 3112 to form an elastic circuit board, so that the inner circuit board 3111 can move relative to the outer circuit board 3113 under the action of an external force (for example, making the inner circuit board 3111 translate, rotate or tilt relative to the outer circuit board 3113), and when the external force disappears, the inner circuit board 3111 can return to its initial position by relying on the elasticity of the elastic member group 3112. That is, in the embodiment of the present application, the circuit board 311 has at least the following characteristics compared to a conventional circuit board: (1) the inner circuit board 3111 and the outer circuit board 3113 of the circuit board 311 are relatively movable; (2) after the inner circuit board 3111 moves relative to the outer circuit board 3113, the elastic member group 3112 can restore the inner circuit board 3111 to its original position; (3) due to the presence of the elastic member group 3112, the functions of the circuit board 311 can be reused (which will be explained in detail in the subsequent description).

[0069] Further, in the embodiment of the present application, the elastic member group 3112 is also suitable for electrically connecting the inner circuit board 3111 and the outer circuit board 3113, so that the photosensitive chip 321 mounted on the inner circuit board 3111 can be electrically connected to the outer circuit board 3113 through the inner circuit board 3111 and the elastic member group 3112. That is, in the embodiment of the present application, the elastic member group 3112 not only connects the inner circuit board 3111 and the outer circuit board 3113 in structure, but also electrically connects the inner circuit board 3111 and the outer circuit board 3113.

[0070] In the embodiment of the present application, the elastic member group 3112 includes a plurality of elastic members, preferably, the plurality of elastic members have the same shape and are made of the same material, so that each of the plurality of elastic members provides the same elastic force to the inner circuit board 3111. In one embodiment of the present application, the elastic member group 3112 is rotationally symmetrical relative to the center set by the inner circuit board 3111, that is, the elastic member group 3112 is suitable for coinciding with the original shape after rotating a certain angle around its center, so that the inner circuit board 3111 can be translated relative to the outer circuit board 3113 and rotated in the plane where the inner circuit board 3111 is located by external force. In another embodiment of the present application, the elastic member group 3112 is axisymmetric relative to the center set by the inner circuit board 3111, so that the inner circuit board 3111 can be driven by external force to translate and tilt relative to the outer circuit board 3113. The structure of the elastic member group 3112 can also be other irregular shapes, and the present application is not limited thereto.

[0071] In such Figure 4A and Figure 4B In the illustrated example, the outer circuit board 3113 is a rectangular structure with a rectangular through hole on its inner side, the inner circuit board 3111 is a rectangular structure and is located on the inner side of the rectangular through hole of the outer circuit board 3113, and the four inner side surfaces of the outer circuit board 3113 are respectively parallel to the four outer side surfaces of the inner circuit board 3111. The elastic member group 3112 includes four elastic members, which are respectively distributed around the four corners of the inner circuit board 3111 and connect one of the inner side surfaces of the outer circuit board 3113 and one of the outer side surfaces of the inner circuit board 3111 which are vertically distributed, that is, the inner side surface of the outer circuit board 3113 and the outer side surface of the inner circuit board 3111 to which the elastic members are connected and fixed are perpendicular to each other.

[0072] More specifically, in the embodiment of the present application, each of the elastic members includes at least one elastic arm 31120, and the at least one elastic arm 31120 extends from the outer side surface of the inner circuit board 3111 in a direction perpendicular to the outer side surface in a direction away from the inner circuit board 3111, then bends and extends in a direction parallel to the outer side surface of the inner circuit board 3111, then bends and extends in a direction parallel to another outer side surface adjacent to the outer side surface, and finally extends in a direction perpendicular to the other outer side surface in a direction away from the inner circuit board 3111 and then connects to the inner side surface of the outer circuit board 3113. In other words, the at least one elastic arm 31120 extends outward from the outer side surface of the inner circuit board 3111 through three 90° (right angle) bends to connect to the inner side surface of the outer circuit board 3113. In the present application, when there are multiple elastic arms 31120, the gaps between the multiple elastic arms 31120 may be equal or unequal, depending on the requirements of the outer circuit board 3113 suspending the inner circuit board 3111 and the photosensitive chip 321 for electrical conduction. The elastic arm 31120 is provided with at least one electrical conduction circuit for providing electrical connection between the inner circuit board 3111 and the outer circuit board 3113. The elastic member is provided with at least one electrical conduction circuit for providing electrical connection between the inner circuit board 3111 and the outer circuit board 3113.

[0073] like Figure 4B As shown, in the embodiment of the present application, each of the elastic arm 31120 includes a first elastic arm component 31120a, a second elastic arm component 31120b, a third elastic arm component 31120c and a fourth elastic arm component 31120d, and the first elastic arm component 31120a, the second elastic arm component 31120b, the third elastic arm component 31120c and the fourth elastic arm component 31120d are interconnected (for example, they can be connected to each other by integral molding or by bonding). The first elastic arm part 31120a extends in a direction perpendicular to the outer side of the inner circuit board 3111 toward a side away from the inner circuit board 3111, the second elastic arm part 31120b is vertically arranged and connected to the first elastic arm part 31120a, the third elastic arm part 31120c is vertically arranged and connected to the second elastic arm part 31120b, the fourth elastic arm part 31120d is vertically arranged and connected to the third elastic arm part 31120c, and the fourth elastic arm part 31120d is further connected to the outer circuit board 3113 to form the elastic arm 31120, and then one or more elastic arms 31120 form an elastic member. The outer side of the inner circuit board 3111 and the inner side of the outer circuit board 3113 connected by the elastic arm 31120 are adjacent and perpendicular to each other.

[0074] In an example of the present application, the four elastic members of the elastic member group 3112 are respectively the first elastic member 31121, the second elastic member 31122, the third elastic member 31123 and the fourth elastic member 31124. The four adjacent inner side surfaces of the outer circuit board 3113 are respectively the first inner side surface 31131, the second inner side surface 31132, the third inner side surface 31133 and the fourth inner side surface 31134 in counterclockwise order, and the adjacent inner side surfaces are perpendicular to each other; the four adjacent outer side surfaces of the inner circuit board 3111 are respectively the first outer side surface 31111, the second outer side surface 31112, the third outer side surface 31113 and the fourth outer side surface 31114 in counterclockwise order, and the adjacent outer side surfaces are perpendicular to each other. The first inner side surface 31131 is parallel to the first outer side surface 31111 , the second inner side surface 31132 is parallel to the second outer side surface 31112 , the third inner side surface 31133 is parallel to the third outer side surface 31113 , and the fourth inner side surface 31134 is parallel to the fourth outer side surface 31114 .

[0075] The first elastic member 31121 extends from the first outer side surface 31111 of the inner circuit board 3111 to the second inner side surface 31132 of the outer circuit board 3113, and connects the inner circuit board 3111 and the outer circuit board 3113; the second elastic member 31122 extends from the second outer side surface 31112 of the inner circuit board 3111 to the third inner side surface 31133 of the outer circuit board 3113, and connects the inner circuit board 3111 and the outer circuit board 3113; the third outer side surface 31113 of the inner circuit board 3111 extends to the fourth inner side surface 31134 of the outer circuit board 3113, and connects the inner circuit board 3111 and the outer circuit board 3113; the fourth outer side surface 31114 of the inner circuit board 3111 extends to the first inner side surface 31131 of the outer circuit board 3113, and connects the inner circuit board 3111 and the outer circuit board 3113.

[0076] Furthermore, a method for manufacturing the circuit board 31 (first elastic member 31121, second elastic member 31122, third elastic member 31123 and fourth elastic member 31124) having the elastic member group 3112 is described. First, a base layer is provided, and the base layer includes a PI layer (polyimide layer); then, a metal layer is formed on one side of the PI layer of the base layer, and the material of the metal layer can be titanium copper or other alloys. For example, copper material is deposited on one side of the PI layer of the base layer to form an electrical conduction circuit; then, the base layer is divided by laser cutting, mechanical cutting, etching, etc., and unnecessary parts of the base layer are removed to form at least one elastic arm 31120, thereby constituting elastic members (first elastic member 31121, second elastic member 31122, third elastic member 31123 and fourth elastic member 31124). The base layer has a certain elasticity, so the elastic arm 31120 formed is suitable for providing elastic force for the inner circuit board 3111 to recover. In other embodiments, the metal layer may not be provided. As an alternative, the base layer may include multiple PI layers and realize the conduction of multi-layer circuits. Accordingly, in the embodiment of the present application, the elastic member may also include an insulating layer wrapping the metal layer to prevent short circuit problems between the multiple elastic arms 31120 in the elastic member.

[0077] In the above embodiment, the base layer including the PI layer is a component of a common rigid-flex board, and the rigid-flex board is a circuit board formed by combining a flexible circuit board and a rigid circuit board through processes such as lamination, and has the characteristics of a flexible circuit board and a rigid circuit board. In other words, the elastic member of the circuit board 31 described in the present application can be formed by part of the circuit board 31, for example, the circuit board 31 described in the present application can be a rigid-flex board including the outer circuit board 3113, the inner circuit board 3111, and a flexible circuit board located between the outer circuit board 3113 and the inner circuit board 3111 and electrically connecting the outer circuit board 3113 and the inner circuit board 3111, and the flexible circuit board of the circuit board 31 is divided by laser cutting, mechanical cutting, etching, etc. to form at least one elastic arm 31120 to form an elastic member. In this embodiment, four groups of the elastic members are formed by removing an unnecessary part of the flexible circuit board to form a rotationally symmetrical elastic member group 3112. Furthermore, the flexible circuit board of the circuit board 31 may be provided with other components such as a metal layer made of titanium copper or other alloys to enhance the elasticity (K value) of the elastic member.

[0078] Further, in the embodiments of the present application, Figures 2 to 9As shown, the chip anti-shake part 21 includes a chip anti-shake fixed part 211, a chip anti-shake movable part 212, a driving element for driving the chip anti-shake movable part 212 to move relative to the chip anti-shake fixed part 211, and a chip anti-shake electrical connection part (not shown in the figure), wherein the driving element is respectively connected to the chip anti-shake movable part 212 and the chip anti-shake fixed part 211, and the chip anti-shake electrical connection part is electrically connected to the circuit board 31 and provides a driving power supply for the chip anti-shake part 21. Specifically, in the embodiment of the present application, the chip anti-shake fixed part 211 has a receiving cavity, and the circuit board 311 is suspended and fixed in the receiving cavity, that is, the outer circuit board 3113 of the circuit board 311 is fixed in the receiving cavity and the inner circuit board 3111 of the circuit board can be movable relative to the outer circuit board 3111. Furthermore, the chip anti-shake movable part 212 and the inner circuit board 3111 can be linked. For example, the chip anti-shake movable part 212 is installed and fixed on the inner circuit board 3111 of the circuit board 31, so that when the driving element drives the chip anti-shake movable part 212 to move relative to the chip anti-shake fixed part 211, the inner circuit board 3111 of the circuit board 311 moves relative to the outer circuit board 3113, thereby driving the photosensitive chip 321 installed on the inner circuit board 3111 to move, thereby realizing the chip anti-shake function.

[0079] It should be noted that in the embodiment of the present application, the elastic member group 3112 of the circuit board 31 forms a suspension system for the chip anti-shake part 21, and the chip anti-shake movable part 212 is suspended in the chip anti-shake fixed part 211 through the elastic member group 3112. Specifically, the chip anti-shake movable part 212 is connected to the elastic member group 3112 through the inner circuit board 3111, and the chip anti-shake fixed part 211 is connected to the elastic member group 3112 through the outer circuit board 3113, so that the elastic member group 3112 serves as a suspension system to suspend the chip anti-shake movable part 212 in the chip anti-shake fixed part 211.

[0080] Figure 3 and Figure 5AThe specific structure of the chip anti-shake part 21 is shown. The chip anti-shake fixed part 211 includes a base 2111 and an upper cover 2112. The upper cover 2112 has a rectangular through hole for providing the light aperture of the photosensitive chip 321 to obtain the imaging light converged by the optical lens 10. The base 2111 is fixedly connected to the upper cover 2112 to form a shell and form a receiving cavity to accommodate and protect the chip anti-shake movable part 212, the driving element, and the photosensitive component 30 and other camera module components. In the embodiment of the present application, the outer circuit board 3113 of the circuit board 311 is clamped between the upper cover 2111 and the base 2112. In this way, the circuit board 311 is suspended and fixed in the receiving cavity of the chip anti-shake fixed part 211. That is, in the embodiment of the present application, the outer circuit board 3113 of the circuit board 311 is clamped between the upper cover 2112 and the base 2111, so that the outer circuit board 3111 remains stationary relative to the chip anti-shake fixing part 211, that is, the circuit board 311 is suspended and fixed in the accommodating cavity of the chip anti-shake fixing part 211.

[0081] The anti-shake fixing part also includes a fixing carrier 2113 and two driving element fixing parts (for the convenience of explanation, defined as a first driving element fixing part 2114 and a second driving element fixing part 2115), the fixing carrier 2113 is fixed to the base 2111 by bonding or integral molding, the fixing carrier 2113 includes a fixing carrier body 21131 and two fixing carrier branches (a first fixing carrier branch 21132 and a second fixing carrier branch 21133) located at opposite corners of the fixing carrier body 21131, and the two fixing carrier branches are connected to the fixing carrier body 21131 by bonding or integral molding. The first driving element fixing part 2114 is fixed to the first fixing carrier branch 21132 by bonding or integral molding, and the second driving element fixing part 2115 is fixed to the second fixing carrier branch 21133 by bonding or integral molding, so that the fixing carrier 2113 is fixed to the driving element through the two driving element fixing parts.

[0082] The chip anti-shake movable part 212 includes a movable carrier 2121 and two driving element movable parts (for the sake of convenience, defined as the first driving element movable part 2122 and the second driving element movable part 2123), the movable carrier 2121 includes a movable carrier main body 21211 for fixing to the inner circuit board 3111 and two movable carrier branches (the first movable carrier branch 21212 and the second movable carrier branch 21213) located at the diagonals of the movable carrier main body 21211, and the movable carrier branches are connected to the movable carrier main body 21211 by bonding or integral molding. The movable carrier 2121 is bonded and fixed to the bottom surface of the inner circuit board 3111 of the circuit board 31 through the movable carrier body 21211 (the side of the circuit board bonded with the photosensitive chip is the front side, and the opposite side is the bottom side). In other embodiments, the movable carrier 2121 can be integrally formed on the bottom surface of the inner circuit board 3111 through a process such as molding, or the movable carrier 2121 can also be a part of the inner circuit board 3111. The first driving element movable part 2122 is fixed to the first movable carrier branch 21212 by bonding or integral molding, and the second driving element movable part 2123 is fixed to the second movable carrier branch 21213 by bonding or integral molding, so that the movable carrier 2121 is fixed to the driving element through the two driving element movable parts.

[0083] The two fixed carrier branches are distributed at opposite diagonals of the inner circuit board 3111, and the two movable carrier branches are distributed at another opposite diagonal of the inner circuit board 3111, so that the two fixed carrier branches and the two movable carrier branches are distributed at the four corners of the inner circuit board 3111, so that the two driving element fixed parts and the two driving element movable parts are located at the four corners of the inner circuit board 3111 at intervals.

[0084] The driving element of the chip anti-shake part 21 includes four SMA (shape memory alloy) wires 213 (a first SMA wire 2131, a second SMA wire 2132, a third SMA wire 2133 and a fourth SMA wire 2134) respectively fixed between the fixed carrier branch and the movable carrier branch, wherein the two ends of the first SMA wire 2131 are respectively fixed to the first driving element fixed part 2114 and the first driving element movable part 2122, the two ends of the second SMA wire 2132 are respectively fixed to the first driving element movable part 2122 and the second driving element fixed part 2115, the two ends of the third SMA wire 2133 are respectively fixed to the second driving element fixed part 2115 and the second driving element movable part 2123, and the two ends of the fourth SMA wire 2134 are respectively fixed to the second driving element movable part 2123 and the first driving element fixed part 2114. The first SMA wire 2131 , the second SMA wire 2132 , the third SMA wire 2133 , and the fourth SMA wire 2134 are adjacently arranged counterclockwise.

[0085] Specifically, each of the driving element fixing parts also includes two driving element fixed ends, the first driving element fixing part 2114 includes a first driving element fixed end 2114a and a second driving element fixed end 2114b, and the second driving element fixing part 2115 includes a third driving element fixed end 2115c and a fourth driving element fixed end 2115d; each of the driving element movable parts also includes two driving element movable ends, the first driving element movable part 2122 includes a first driving element movable end 2122a and a second driving element movable end 2122b, and the second driving element movable part 2123 includes a third driving element movable end 2123c and a fourth driving element movable end 2123d. The two ends of the first SMA wire 2131 are respectively fixed to the second driving element fixed end 2114b and the first driving element movable end 2122a, the two ends of the second SMA wire 2132 are respectively fixed to the second driving element movable end 2122b and the third driving element fixed end 2115c, the two ends of the third SMA wire 2133 are respectively fixed to the fourth driving element fixed end 2115d and the third driving element movable end 2123c, and the two ends of the fourth SMA wire 2134 are respectively fixed to the fourth driving element movable end 2123d and the first driving element fixed end 2114a.

[0086] Among them, the first driving element fixed end 2114a and the second driving element fixed end 2114b of the first driving element fixing part 2114 can be electrically connected or not; the third driving element fixed end 2115c and the fourth driving element fixed end 2115d of the second driving element fixing part 2115 can be electrically connected or not; the first driving element movable end 2122a and the second driving element movable end 2122b of the first driving element movable part 2122 can be electrically connected or not; the third driving element movable end 2123c and the fourth driving element movable end 2123d of the second driving element movable part 2123 can be electrically connected or not, and the present application is not limited to this.

[0087] In one embodiment of the present application, there is a gap between the four SMA wires 213 and the elastic member group 3112 to avoid interference between the four SMA wires 213 and the elastic member group 3112. In the Z-axis direction, the gap between the four SMA wires 213 and the elastic member group 3112 is greater than 0.1 mm.

[0088] In one embodiment of the present application, the first SMA wire 2131, the second SMA wire 2132, the third SMA wire 2133 and the fourth SMA wire 2134 are located in the same plane, and the plane is parallel to the plane where the inner circuit board 3111 is located, so that the driving element is suitable for driving the inner circuit board 3111 to move within the plane where the inner circuit board 3111 is located by driving the four SMA wires 213 to deform.

[0089] It is worth mentioning that, although in the embodiment of the present application, the chip anti-shake fixed part 211 includes two driving element fixed parts 2114, 2115, the chip anti-shake movable part 212 includes two driving element movable parts 2122, 2123, the two driving element fixed parts 2114, 2115 and the two driving element movable parts 2122, 2123 are located at the four corners of the accommodating cavity of the chip anti-shake fixed part 211, and include four SMA wires 2131, 2132, 2133, 2134 extending between the two driving element fixed parts and the two driving element movable parts, it should be understood that in the embodiment of the present application, the chip anti-shake fixed part 211 includes at least one driving element fixed part, the chip anti-shake movable part 212 includes at least one driving element movable part, and includes at least one SMA wire 213 extending between the at least one driving element fixed part and the at least one driving element movable part.

[0090] For example, in a specific example of the present application, the at least one driving element movable part includes a first driving element movable part 2122 and a second driving element movable part 2123 which are relatively arranged on opposite sides of the movable carrier 2121, and the at least one driving element fixed part includes only one driving element fixed part, wherein the driving element fixed part is located on the perpendicular bisector of the connection set by the first driving element movable part 2122 and the second driving element movable part 2123, and the at least one SMA wire 213 includes a first SMA wire 2131 extending between the first driving element movable part 2122 and the driving element fixed part, and a second SMA wire 2132 extending between the second driving element movable part 2123 and the driving element fixed part.

[0091] Of course, in the embodiment of the present application, when the number of the movable part of the driving element and the fixed part of the driving element is determined (for example, including Figure 7 and Figure 8 In the case of the first driving element movable part 2122, the second driving element movable part 2123, the first driving element fixed part 2114 and the second driving element fixed part 2115 as shown in the figure, a greater number or a lesser number of the SMA wires 213 are set. For example, two first SMA wires 2131 may be set between the first driving element fixed part 2114 and the first driving element movable part 2122, or two SMA wires 2132 may be set between the first driving element movable part 2122 and the second driving element fixed part 2115, or two third SMA wires 2133 may be set between the second driving element fixed part 2115 and the second driving element movable part 2123, or two fourth SMA wires 2134 may be set between the second driving element movable part 2123 and the first driving element fixed part 2114, but this application is not limited to this.

[0092] Furthermore, if Figure 6 As shown, in the embodiment of the present application, by making the first movable carrier branch 21212 and the second movable carrier branch 21213 inclined relative to the movable carrier body 21211 toward the side of the fixed carrier 2113 (that is, the movable carrier 2121 includes the movable carrier body 21211 and the first movable carrier branch 21212 and the second movable carrier branch 21213 extending downward and outward from the movable carrier body 21211 respectively), the movable end of the driving element fixed to the first movable carrier branch 21212 and the second movable carrier branch 21213 is at the same height as the fixed end of the driving element fixed to the first fixed carrier branch 21132 and the second fixed carrier branch 21133.

[0093] For example, in a specific example of the present application, the movable carrier 2121 is implemented as a metal sheet, the first movable carrier branch 21212 and the second movable carrier branch 21213 are integrally formed with the movable carrier body 21211, and the first movable carrier branch 21212 and the second movable carrier branch 21213 are bent so that the first movable carrier branch 21212 and the second movable carrier branch 21213 extend obliquely relative to the movable carrier body 21211, thereby adjusting the height of the movable end of the driving element.

[0094] In particular, in one embodiment of the present application, the four SMA wires 213 (the first SMA wire 2131, the second SMA wire 2132, the third SMA wire 2133 and the fourth SMA wire 2134) are located on one side of the bottom surface of the inner circuit board 3111, and the four SMA wires 213 are lower than the bottom surface of the inner circuit board 3111. Specifically, Figure 7 and Figure 8 As shown, the four SMA wires 213 are located outside the inner circuit board 3111, and the first SMA wire 2131 is perpendicular to the second SMA wire 2132 and the fourth SMA wire 2134 and parallel to the third SMA wire 2133. In another embodiment of the present application, the first SMA wire 2131, the second SMA wire 2132, the third SMA wire 2133 and the fourth SMA wire 2134 are of equal length, so that it is suitable to drive the inner circuit board 3111 to translate in the plane where the inner circuit board 3111 is located by driving the four SMA wires 213 to deform.

[0095] Figure 8 FIG. 2 shows a bottom view of the chip anti-shake unit 21 after removing the base 2111 and the upper cover 2112. Figure 8 As shown, the fixed carrier 2113, the movable carrier 2121 and the four SMA wires 213 are installed on one side of the bottom surface of the circuit board 31, and the four SMA wires 213 are located on the outside of the elastic member group 3112, reducing the risk of interference between the SMA wires 213 and the elastic member group 3112.

[0096] Furthermore, the inner circuit board 3111 is fixed to the movable carrier 2121 in such a way that the inner circuit board 3111 is fixed to the chip anti-shake movable part 212, and the outer circuit board 3113 is clamped and fixed to the chip anti-shake fixed part 211 by the base 2111 and the upper cover 2112, and there is a gap between the elastic member group 3112 of the circuit board 31 and the upper cover 2112, so as to avoid deformation of the elastic member group 3112 due to impact that affects the performance of the elastic member group 3112. In some examples of the present application, the chip anti-shake fixed part 211 also includes a support member 2116, which is fixed to the base 2111 by bonding or integral molding, and the top surface of the support member 2116 has a plane to provide support for the outer circuit board 3113, thereby increasing the stability of the outer circuit board 3113 fixed between the base 2111 and the upper cover 2112.

[0097] In order to make the movement of the movable carrier 2121 smoother, in the embodiment of the present application, the chip anti-shake part 21 also includes a ball assembly 214 arranged between the chip anti-shake fixed part 211 and the chip anti-shake movable part 212. The ball assembly 214 includes at least three balls 2141, and the at least three balls 2141 are used to reduce the friction resistance when the chip anti-shake movable part 212 moves relative to the chip anti-shake fixed part 211. Specifically, the at least three balls 2141 are suitable for being arranged between the movable carrier 2121 and the base 2111, and the at least three balls 2141 are used to provide support for the movable carrier 2121 and reduce the friction resistance encountered by the movable carrier 2121 when it translates relative to the base 2111. That is, in the embodiment of the present application, the ball assembly 214 and the at least one SMA wire 213 are located between the base 2111 and the movable carrier 2121.

[0098] like FIG. 5A to FIG. 9 As shown, in the embodiment of the present application, four balls 2141 are arranged between the movable carrier 2121 and the base 2111. When the movable carrier 2121 is driven by the driving element, the movable carrier 2121 translates relative to the base 2111 via the four balls 2141. The fixed carrier body 21131 of the fixed carrier 2113 has four ball grooves 211311, and the four balls 2141 are respectively accommodated in the four ball grooves 211311. The balls 2141 protrude from the fixed carrier body 21131, so that the moving space of the four balls 2141 is limited to the four ball grooves 211311, and the balls 2141 are not easy to fall off.

[0099] In the above embodiment, the ball groove 211311 is a through groove or a through hole, so that the ball 2141 is suitable for directly contacting the base 2111. In other embodiments, the ball groove 211311 is a groove, and the ball 2141 indirectly contacts the base 2111 through the bottom of the ball groove 211311.

[0100] It should be particularly noted that in the embodiment of the present application, the inner circuit board 3111 and the outer circuit board 3113 are not on the same plane, that is, there is a height difference between the plane where the inner circuit board 3111 is located and the plane where the outer circuit board 3113 is located so that the elastic member group 3112 is in a stretched state, and the elastic member group 3112 in the stretched state provides a clamping force that makes the ball assembly 214 press against the chip anti-shake fixing part 211. That is, the elastic member group 3112 of the circuit board 311 enables the at least three balls 2141 to be clamped between the movable carrier 2121 of the chip anti-shake movable part 212 and the chip anti-shake fixed part 211, so that the at least three balls 2141 are subjected to forces in two directions, and when the movable carrier 2121 is stationary relative to the chip anti-shake fixed part 211, the positions of the at least three balls 2141 are relatively stationary. In other words, the at least three balls 2141 are not prone to collision and noise due to the shaking of the camera module.

[0101] More specifically, in one embodiment of the present application, there is a height difference between the plane where the inner circuit board 3111 is located and the plane where the outer circuit board 3113 is located. The force generated by the elastic member group 3112 along the Z-axis (perpendicular to the direction of the inner circuit board 3111) causes the inner circuit board 3111 to press at least three balls 2141 in the ball assembly 214 through the movable carrier 2121. The at least three balls 2141 are subjected to a pressure of 20mN-50mN (millinewtons) from the movable carrier 2121. When the pressure is greater than 20mN, the at least three balls 2141 are not easy to fall off; when the pressure is less than 50mN, the friction force between the at least three balls 2141 and the movable carrier 2121 is small, and the friction force between the at least three balls 2141 and the base 2111 is small. When the movable carrier 2121 moves relative to the base 2111, the friction resistance encountered by the movable carrier 2121 is small, thereby reducing the requirement for the driving force of the driving element (SMA wire).

[0102] The magnitude of the force generated by the elastic member group 3112 along the Z-axis direction is affected by the height difference between the inner circuit board 3111 and the outer circuit board 3113, and the height difference between the inner circuit board 3111 and the outer circuit board 3113 is between 0.05mm and 0.1mm. When the height difference is less than 0.05mm, the elastic force generated by the elastic member group 3112 along the Z-axis direction is insufficient to prevent the at least three balls 2141 from falling off; when the height difference is greater than 0.1mm, the elasticity of the elastic member group 3112 on the plane perpendicular to the Z-axis direction (XY plane) will be affected.

[0103] Further references Figure 5A , the inner circuit board 3111 is higher than the outer circuit board 3113, and the elastic member group 3112 connects the inner circuit board 3111 and the outer circuit board 3113 obliquely upward, so that the inner circuit board 3111 generates a downward force (i.e., toward the direction of the ball 2141) through the elastic member group 3112. The distance between the inner circuit board 3111 and the base 2111 is greater than the distance between the outer circuit board 3113 and the base 2111. The inner circuit board 3111 presses the four balls 2141 on the base 2111 through the movable carrier 2121 fixed to the bottom surface of the inner circuit board 3111 to prevent the balls 2141 from falling off. The four balls 2141 support the movable carrier 2121, and the movable carrier 2121 slides on the four balls 2141.

[0104] In some embodiments of the present application, the four balls 2141 have the same size, so that the four balls 2141 provide the movable carrier 2121 with a plane parallel to the plane where the base 2111 is located, so that the movable carrier 2121 moves (translates and / or rotates) on a plane parallel to the base 2111, and then the inner circuit board 3111 fixed to the movable carrier 2121 moves (translates and / or rotates) along with the movable carrier 2121 on a plane parallel to the base 2111. The flatness of the base 2111 and the dimensional accuracy of the balls 2141 can greatly affect the moving accuracy of the movable carrier 2121.

[0105] In one embodiment of the present application, the at least three balls 2141 are fixed to the base 2111 and / or the fixed carrier 2113 to prevent the at least three balls 2141 (ball assembly 214) from falling off. The top surfaces of the at least three balls 2141 form a plane parallel to the inner circuit board 3111, so that the inner circuit board 3111 can translate in the plane where the inner circuit board is located. For example, the at least three balls 2141 are fixed to the base 2111 in the ball groove 211311 by bonding, and the material of the balls 2141 is suitable for plastic, metal or other materials; or, the at least three balls 2141 are fixed to the fixed carrier body 21131 of the fixed carrier 2113 by bonding, and the material of the balls 2141 is suitable for plastic, metal or other materials; or, the at least three balls 2141 are fixed to the base 2111 in the ball groove 211311 by welding, and the material of the balls 2141 is suitable for metal material, and the material of the base 2111 is also metal material; or, the at least three balls 2141 are fixed to the fixed carrier body 21131 of the fixed carrier 2113 by welding, and the material of the balls 2141 is suitable for metal material, and the material of the fixed carrier 2113 is also metal material.

[0106] In one embodiment of the present application, the at least three balls 2141 are fixed to the movable carrier 2121 to prevent the at least three balls 2141 (ball assembly 214) from falling off. The bottom surface of the at least three balls 2141 forms a plane parallel to the inner circuit board 3111, so that the inner circuit board 3111 can translate in the plane where the inner circuit board is located. For example, the at least three balls 2141 are fixed to the movable carrier body 21211 of the movable carrier 2121 by bonding, and the material of the balls 2141 is suitable for plastic, metal or other materials; or, the at least three balls 2141 are fixed to the movable carrier body 21211 of the movable carrier 2121 by welding, and the material of the balls 2141 is suitable for metal material, and the material of the movable carrier 2121 is also metal material.

[0107] In one embodiment of the present application, the ball bearing assembly 214 can also be replaced by a slider assembly, which includes at least three sliders. The at least three sliders are integrally formed with the base, the at least three sliders protrude from the ball bearing groove, and the top surfaces of the at least three sliders constitute a plane parallel to the inner circuit board 3111, so that the inner circuit board 3111 can translate in the plane where the inner circuit board is located; or, the at least three sliders are integrally formed with the fixed carrier body 21131 of the fixed carrier 2113, and the top surfaces of the at least three sliders constitute a plane parallel to the inner circuit board 3111, so that the inner circuit board 3111 can translate in the plane where the inner circuit board is located; or, the at least three sliders are integrally formed with the movable carrier body 21211 of the movable carrier 2121, and the bottom surfaces of the at least three sliders constitute a plane parallel to the inner circuit board 3111, so that the inner circuit board 3111 can translate in the plane where the inner circuit board is located.

[0108] Figure 5B Another embodiment of the present application is shown. Figure 5A The difference of the embodiment shown is that the inner circuit board 3111 has a through hole (circuit board through hole 31115) in the middle, and the photosensitive chip 321 is accommodated in the through hole and directly bonded and fixed to the movable carrier 2121, thereby reducing the height of the module. When the movable carrier 2121 moves, the photosensitive chip 321 fixed on the movable carrier 2121 moves with the movable carrier 2121.

[0109] Reference Figure 5A and Figure 5B In one embodiment of the present application, the ball assembly 214 is located below the inner circuit board 3111, but not directly below the photosensitive chip 321, so as to avoid the deformation of the movable carrier 2121 caused by the ball assembly 214 when the ball assembly 214 is under pressure, and directly or indirectly deforming the photosensitive chip 321 through the deformation of the inner circuit board 3111, so that the imaging quality of the camera module is reduced, for example, causing the imaging field curvature problem. Specifically, along the direction perpendicular to the photosensitive chip 321, the projection of the photosensitive chip 321 on the substrate 2111 does not overlap with the projection of the four balls 2141 of the ball assembly 214 on the substrate 2111. That is, in the embodiment of the present application, the inner circuit board 3111 has a photosensitive chip mounting area and a peripheral area surrounding the photosensitive chip mounting area, wherein the four balls 2141 correspond to the peripheral area, and such a position setting ensures that the four balls 2141 are not directly below the photosensitive chip 321.

[0110] In one embodiment of the present application, the four ball grooves 211311 are respectively located on the diagonal lines of the photosensitive chip 321 and are respectively located outside the four corners of the photosensitive chip 321.

[0111] It is worth mentioning that in Figures 1 to 9 In the illustrated example, the ball assembly 214 and the at least one SMA wire 213 are located between the base 2111 and the movable carrier 2121 . It should be understood that in other examples of the present application, the ball assembly 214 and the at least one SMA wire 213 can also be arranged between the movable carrier 2121 and the chip anti-shake fixing part 211 in other ways, for example, the ball assembly 214 and the at least one SMA wire 213 are located between the upper cover 2112 and the movable carrier 2121, or, the ball assembly 214 is arranged between the base 2111 and the movable carrier 2121 and the at least one SMA wire is arranged between the upper cover 2112 and the movable carrier 2121, or, the ball assembly 214 is arranged between the upper cover 2112 and the movable carrier 2121 and the at least one SMA wire is arranged between the base 2111 and the movable carrier 2121, which is not limited to the present application.

[0112] Furthermore, in some examples of the present application, the chip anti-shake movable part 212 also includes an anti-collision component 2124, and the anti-collision component 2124 is a frame-type structure. The anti-collision component 2124 is fixed to the inner circuit board 3111 and corresponds to the upper cover 2112 of the chip anti-shake fixed part 211, and the projection of the anti-collision component 2124 in the Z-axis direction overlaps with the projection of the upper cover 2112 in the Z-axis direction. When the chip anti-shake part 21 is impacted, when the chip anti-shake movable part 212 moves along the Z-axis direction, the moving distance of the chip anti-shake movable part 212 in the Z-axis direction is limited, so that the chip anti-shake movable part 212 is not easy to fall off, and the ball assembly 214 is not easy to detach from the ball groove 211311.

[0113] In one embodiment of the present application, the chip anti-shake fixing part 211 of the chip anti-shake part 21 is integrally formed with the lens driving fixing part of the lens driving part 202, that is, the chip anti-shake fixing part 211 and the lens driving part 202 can share the same structural parts, thereby reducing the tolerance during the assembly of the driving component 20. In a specific example of the present application, the upper cover 2112 of the chip anti-shake fixing part 211 is integrally formed with the lens driving fixing part.

[0114] In summary, the camera module based on the embodiment of the present application is explained, wherein the driving component 20 of the camera module 1 uses the elastic part group 3112 of the circuit board 311 as the reset and limiting element of the SMA driver, and reduces the overall height dimension of the chip anti-shake part 21 by component reuse. In this way, the anti-shake requirements and size requirements of the camera module are met.

[0115] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A drive assembly, It is characterized in that include: A chip anti-shake fixing part having a receiving cavity, wherein the chip anti-shake fixing part includes at least one driving element fixing part located in the receiving cavity; A chip anti-shake movable part located in the receiving cavity, wherein the chip anti-shake movable part comprises a movable carrier and at least one driving element movable part which can be linkedly connected to the movable carrier; A circuit board suspended and fixed in the receiving cavity, wherein the circuit board comprises an inner circuit board, an outer circuit board and an elastic member group extending between the inner circuit board and the outer circuit board, the inner circuit board is suspended and arranged in the outer circuit board by the elastic member group, wherein the inner circuit board is suitable for mounting a photosensitive chip, and the inner circuit board is fixed to a movable carrier of the chip anti-shake movable part; A drive element comprising at least one SMA wire extending between the at least one drive element fixed portion and the at least one drive element movable portion; and A ball assembly is movably clamped between the movable carrier and the chip anti-shake fixing part, wherein there is a height difference between the inner circuit board and the outer circuit board so that the elastic member group is in a stretched state, and the elastic member group in the stretched state provides a clamping force that makes the ball assembly press against the chip anti-shake fixing part.

2. The drive assembly according to claim 1, in, The anti-shake fixing part comprises a base and an upper cover buckled with the base, and the receiving cavity is formed between the upper cover and the base.

3. The drive assembly according to claim 2, in, The ball assembly and the at least one SMA wire are located between the upper cover and the movable carrier.

4. The drive assembly according to claim 2, in, The ball assembly and the at least one SMA wire are located between the base and the movable carrier.

5. The drive assembly according to claim 4, in, The height difference between the inner circuit board and the outer circuit board is between 0.05 mm and 0.1 mm.

6. The drive assembly according to claim 5, in, The magnitude of the pressing force is between 20 mN and 50 mN.

7. The drive assembly according to claim 6, in, The ball assembly includes at least three balls rollingly clamped between the base and the movable carrier, and top ends of the at least three balls form a plane parallel to the inner circuit board.

8. The drive assembly according to claim 7, in, The top surface of the inner circuit board has a photosensitive chip mounting area and a peripheral area formed outside the photosensitive chip mounting area, wherein the at least three balls correspond to the peripheral area.

9. The drive assembly according to claim 7, in, The at least three balls are fixed to the movable carrier, or the at least three balls are fixed to the base.

10. The drive assembly according to claim 7, in, The at least one driving element movable part includes a first driving element movable part and a second driving element movable part that are arranged opposite to each other, and the at least one driving element fixed part includes a first driving element fixed part and a second driving element fixed part that are arranged opposite to each other, and the first driving element fixed part, the second driving element fixed part, the first driving element movable part and the second driving element movable part are located at the four corners of the accommodating cavity; wherein the at least one SMA wire includes a first SMA wire extending between the first driving element fixed part and the first driving element movable part, a second SMA wire extending between the first driving element movable part and the second driving element fixed part, a third SMA wire extending between the second driving element fixed part and the second driving element movable part, and a fourth SMA wire extending between the second driving element movable part and the first driving element fixed part.

11. The drive assembly according to claim 10, in, The first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire are located in the same plane, and the plane where the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire are located is parallel to the plane where the inner circuit board is located, wherein the first SMA wire is parallel to the third SMA wire, and the first SMA wire is perpendicular to the second SMA wire, and the first SMA wire is perpendicular to the fourth SMA wire, wherein the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire have the same length.

12. The drive assembly according to claim 11, in, In the Z-axis direction set by the driving assembly, there is a gap between the first SMA wire, the second SMA wire, the third SMA wire, and the fourth SMA wire and the elastic member group, and the gap is greater than or equal to 0.1 mm.

13. The drive assembly according to claim 11, in, The first SMA wire, the second SMA wire, the third SMA wire, and the fourth SMA wire are located outside the inner circuit board.

14. The drive assembly according to claim 10, in, The chip anti-shake fixed part also includes a fixed carrier stacked on the base, the fixed carrier includes a fixed carrier body and a first fixed carrier branch and a second fixed carrier branch respectively extending outward from the fixed carrier, wherein the first driving element fixing part and the second driving element fixing part are respectively installed on the first fixed carrier branch and the second fixed carrier branch, wherein the movable carrier includes a movable carrier body and a first movable carrier branch and a second movable carrier branch respectively extending downward and outward from the movable carrier body, wherein the first driving element movable part and the second driving element movable part are respectively installed on the first movable carrier branch and the second movable carrier branch.

15. The drive assembly according to claim 14, in, The fixed carrier body has at least three ball grooves for accommodating the at least three balls.

16. The drive assembly according to claim 14, in, The chip anti-shake fixing part further includes a support member arranged on the base, and a top surface of the support member contacts the external circuit board.

17. The drive assembly according to claim 7, in, There is a gap between the elastic member group of the circuit board and the upper cover, and the chip anti-shake movable part further includes an anti-collision component fixed to the top surface of the inner circuit board.

18. The drive assembly according to claim 1, in, The elastic member group includes a first elastic member, a second elastic member, a third elastic member and a fourth elastic member, and the first elastic member, the second elastic member, the third elastic member and the fourth elastic member are arranged in a rotationally symmetrical manner relative to a center set by the inner circuit board, wherein the first elastic member, the second elastic member, the third elastic member and the fourth elastic member are respectively distributed around four corners of the inner circuit board, and the first elastic member, the second elastic member, the third elastic member and the fourth elastic member are respectively connected to one of the inner side surfaces of the outer circuit board and one of the outer side surfaces of the inner circuit board which are vertically distributed.

19. A camera module, It is characterized in that include: Optical lens; Photosensitive chip; as well as A driving assembly as described in any one of claims 1 to 18, wherein the photosensitive chip is mounted on the inner circuit board.

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