Optical path control member and display device including the same
By forming holes in the second substrate and setting electrode connections within the holes, the problem of increased bezel area in the display device caused by the switchable light-shielding film is solved, thereby achieving a reduction in the overall size and an extension of the lifespan of the display.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- LG INNOTEK CO LTD
- Filing Date
- 2021-06-28
- Publication Date
- 2026-07-03
AI Technical Summary
When existing switchable light-shielding films are applied to display devices, the increased border area of the electrode connection region leads to a reduction in the display area.
A hole is formed in the second substrate, and an electrode connection portion is disposed in the hole and directly connected to the side surface of the second electrode. This reduces the protrusions in some areas of the second substrate and the second electrode, forming an auxiliary connection electrode to replace the traditional protruding area.
The reduced bezel area of the display provides extra space for other components, improves the lifespan of the optical path control components, and reduces the overall size.
Smart Images

Figure CN116018554B_ABST
Abstract
Description
Technical Field
[0001] The embodiments relate to an optical path control component and a display device including the optical path control component. Background Technology
[0002] A light-shielding film blocks the transmission of light from a light source and is attached to the front surface of the display panel. This allows the light-shielding film to adjust the angle of light according to the incident angle of the light, thereby displaying a clear image quality at the user's desired viewing angle when the display transmits the image. The display panel is used in display devices such as mobile phones, laptops, tablets, vehicle navigation devices, and vehicle touch screens.
[0003] In addition, shading film can be used on windows of vehicles, buildings, etc., to partially block external light to prevent glare or to prevent the interior from being seen from the outside.
[0004] In other words, the light-shielding film can be a light path control component that controls the movement path of light to block light in a specific direction and transmit light in a specific direction. Therefore, the user's viewing angle can be controlled by adjusting the light transmission angle through the light-shielding film.
[0005] Meanwhile, such light-blocking films can be divided into light-blocking films that can always control the viewing angle regardless of the surrounding environment or the user's environment, and switchable light-blocking films that allow users to open / close the viewing angle control according to the surrounding environment or the user's environment.
[0006] Such a switchable light-blocking film can be achieved by filling the interior of the patterned section with particles that can move when a voltage is applied, as well as a dispersion liquid for dispersing the particles, and by dispersing and aggregating the particles, thereby converting the patterned section into a light-transmitting section and a light-blocking section.
[0007] The voltage of the switchable light-shielding film is formed at the connection electrode area of the lower electrode and the upper electrode, which is connected to the external circuit board, and the voltage can be applied to the switchable light-shielding film through the connection electrode area.
[0008] The connecting electrode area is located in an area outside the light conversion area, that is, in the frame area. Since the size of the switchable light-shielding film is increased in the frame area, there is a problem that the display area for displaying the image is reduced when the switchable light-shielding film is applied to the display device.
[0009] Therefore, in order to solve the above problems, there is a need for an optical path control component with a new structure that can prevent the border area from increasing due to the connection electrode area. Summary of the Invention
[0010] Technical issues
[0011] The embodiments relate to an optical path control component capable of reducing the size of the border area.
[0012] Technical solution
[0013] The optical path control component according to an embodiment includes: a first substrate; a first electrode disposed on the first substrate; a second substrate disposed on the first substrate; a second electrode disposed below the second substrate; and an optical conversion unit disposed between the first electrode and the second electrode, wherein the second substrate includes at least one hole penetrating the second substrate and the second electrode, and an electrode connection portion connected to the side surface of the second electrode is disposed inside the hole.
[0014] Beneficial effects
[0015] According to an embodiment, the optical path control component may include an electrode connection portion disposed within a hole formed in a second substrate.
[0016] The electrode connection portion can directly contact the side surface of the second electrode, therefore, the electrode connection portion can be electrically connected to the second electrode.
[0017] Therefore, the electrode connection portion exposed through the hole can become the connection electrode of the second electrode and can be connected to an external circuit board.
[0018] Therefore, a portion of the second substrate and the second electrode used to form the connecting electrode of the second electrode can be removed.
[0019] In other words, in the optical path control member according to the first embodiment, in order to form the connecting electrode of the second electrode, it is not necessary to form a protruding area on the second substrate as on the first substrate, or the protrusion can be formed only in a portion of the second substrate, thereby reducing the bezel area of the display including the optical path control member.
[0020] Therefore, when the protrusion is formed only in a portion of the second substrate, space can be formed in the area where the protrusion is not formed to accommodate other components necessary for the display, such as hinge units, camera units, sensor units such as infrared sensors, and speakers in the case of a laptop, thereby reducing the overall bezel area of the display.
[0021] Therefore, the bezel area of the display including the optical path control component according to the first embodiment can be reduced, thereby reducing the overall size of the display.
[0022] Furthermore, in the optical path control component according to the embodiment, an opening region is formed on the second substrate in order to form a connecting electrode for the second electrode, and an electrode connection portion is provided on a protrusion formed by the opening region to form the second connecting electrode. The first connecting electrode is formed in at least a portion of the region corresponding to the opening region in the first substrate. Therefore, the protruding region for forming the connecting electrode on the first substrate and the second substrate can be reduced. As a result, space can be formed in the region where no protrusion is formed, which allows for the placement of other components required for the display, thereby reducing the overall bezel area of the display.
[0023] Therefore, a display including the optical path control component according to the embodiment can reduce the bezel area of the display, thereby reducing the overall size of the display.
[0024] Furthermore, according to the embodiment, the optical path control member additionally forms an auxiliary connection electrode portion on at least one protrusion formed in the opening region, so that when the main electrode connection portion is damaged, it can be connected to the circuit board through the auxiliary connection electrode portion, thereby improving the lifespan of the optical path control member. Attached Figure Description
[0025] Figure 1 This is a perspective view of the optical path control component according to the first embodiment.
[0026] Figure 2 and Figure 3 These are perspective views of the first substrate and the first electrode of the optical path control component according to the embodiment, and perspective views of the second substrate and the second electrode.
[0027] Figure 4 and Figure 5 It is along Figure 1 The sectional view taken by line A-A' in the middle.
[0028] Figures 6 to 8 It is along Figure 1 The sectional view taken by line B-B' in the figure.
[0029] Figure 9 and Figure 10 This is a perspective view of the optical path control component according to the second embodiment.
[0030] Figure 11 It is along Figure 9 The sectional view taken by line C-C' in the figure.
[0031] Figure 12 It is along Figure 10 The sectional view taken by line D-D' in the middle.
[0032] Figure 13 This is a perspective view of the optical path control component according to the third embodiment.
[0033] Figure 14 It is along Figure 13 The sectional view taken by line E-E' in the middle.
[0034] Figure 15 It is along Figure 13 The sectional view taken by line F-F' in the middle.
[0035] Figure 16 and Figure 17 It is along Figure 13 The sectional view taken by line G-G' in the middle.
[0036] Figure 18 It is along Figure 13 The sectional view taken by line H-H' in the middle.
[0037] Figure 19 and Figure 20 This is a cross-sectional view of a display device that applies a light path control component according to an embodiment.
[0038] Figures 21 to 23 This is a view illustrating one embodiment of a display device that applies an optical path control component according to an embodiment. Detailed Implementation
[0039] In the following, embodiments of the invention will be described in detail with reference to the accompanying drawings. However, the spirit and scope of the invention are not limited to the portion of the described embodiments, and it may be implemented in various other forms. Furthermore, one or more elements of the embodiments may be selectively combined and substituted within the spirit and scope of the invention.
[0040] Furthermore, unless otherwise explicitly defined and described, the terms (including technical and scientific terms) used in the embodiments of this invention may be interpreted as having the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains, and terms, such as those defined in a general dictionary, may be interpreted as having the same meaning as their meaning in the context of the relevant art.
[0041] Furthermore, the terminology used in the embodiments of the present invention is for describing the embodiments and not for limiting the invention. In this specification, unless specifically stated in the phrase, the singular form may also include the plural form, and when described as “at least one (or more) of A (and), B and C”, it may include at least one of all combinations that can be combined with A, B and C.
[0042] Furthermore, when describing the elements of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish elements from other elements, and the terms are not limited to the nature, order, or sequence of the elements.
[0043] Furthermore, when an element is described as being “connected” or “combined” to another element, it can include not only cases where the element is directly “connected” or “combined” to another element, but also cases where the element is “connected” or “combined” through another element between itself and other elements.
[0044] Furthermore, when described as being formed or set "above" or "below" in each element, "above" or "below" can include not only cases where two elements are directly connected to each other, but also cases where one or more other elements are formed or set between the two elements.
[0045] Furthermore, when expressed as "above" or "below", it can include not only the upward direction based on an element but also the downward direction.
[0046] In the following description, an optical path control component according to an embodiment will be described with reference to the accompanying drawings. The optical path control component described below relates to a switchable optical path control component driven in various modes according to electrophoretic particles that move by the application of voltage.
[0047] First, refer to Figures 1 to 8 The optical path control component according to the first embodiment is described.
[0048] Reference Figures 1 to 3 According to the first embodiment, the optical path control component 1000 may include a first substrate 110, a second substrate 120, a first electrode 210, a second electrode 220, and an optical conversion unit 300.
[0049] The first substrate 110 can support the first electrode 210. The first substrate 110 can be rigid or flexible.
[0050] Furthermore, the first substrate 110 may be transparent. For example, the first substrate 110 may include a transparent substrate capable of transmitting light.
[0051] The first substrate 110 may include glass, plastic, or a flexible polymer film. For example, the flexible polymer film may be made of any of the following: polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone (PES), cyclic olefin copolymer (COC), triacetyl cellulose (TAC) film, polyvinyl alcohol (PVA) film, polyimide (PI) film, and polystyrene (PS). This is only an example, but the embodiments are not limited thereto.
[0052] In addition, the first substrate 110 can be a flexible substrate with flexible properties.
[0053] Furthermore, the first substrate 110 can be a bent or folded substrate. That is, the optical path control member including the first substrate 110 can also be formed to have flexible, bent, or folded characteristics. Therefore, the optical path control member according to the embodiment can be modified into various designs.
[0054] The first substrate 110 may extend along a first direction 1A, a second direction 2A and a third direction 3A.
[0055] In detail, the first substrate 110 may include: a first direction 1A corresponding to the length or width direction of the first substrate 110; a second direction 2A extending in a direction different from the first direction 1A and corresponding to the length or width direction of the first substrate 110; and a third direction 3A extending in a direction different from the first direction 1A and the second direction 2A and corresponding to the thickness direction of the first substrate 110.
[0056] For example, the first direction 1A can be defined as the length direction of the first substrate 110, the second direction 2A can be defined as the width direction of the first substrate 110 perpendicular to the first direction 1A, and the third direction 3A can be defined as the thickness direction of the first substrate 110. Alternatively, the first direction 1A can be defined as the width direction of the first substrate 110, the second direction 2A can be defined as the length direction of the first substrate 110 perpendicular to the first direction 1A, and the third direction 3A can be defined as the thickness direction of the first substrate 110.
[0057] In the following text, for ease of description, the first direction 1A is described as the length direction of the first substrate 110, the second direction 2A is described as the width direction of the first substrate 110, and the third direction 3A is described as the thickness direction of the first substrate 110.
[0058] The first electrode 210 can be disposed on one surface of the first substrate 110. Specifically, the first electrode 210 can be disposed on the upper surface of the first substrate 110. That is, the first electrode 210 can be disposed between the first substrate 110 and the second substrate 120.
[0059] The first electrode 210 may include a transparent conductive material. For example, the first electrode 210 may include a conductive material having a light transmittance of about 80% or more. For example, the first electrode 210 may include metal oxides such as indium tin oxide, indium zinc oxide, copper oxide, tin oxide, zinc oxide, titanium oxide, etc.
[0060] The first electrode 210 can have a thickness of 10 nm to 300 nm.
[0061] Alternatively, the first electrode 210 may comprise various metals to achieve low resistance. For example, the first electrode 210 may comprise at least one metal selected from chromium (Cr), nickel (Ni), copper (Cu), aluminum (Al), silver (Ag), molybdenum (Mo), gold (Au), titanium (Ti), and alloys thereof.
[0062] Reference Figure 2 The first electrode 210 can be disposed on the entire surface of one surface of the first substrate 110. Specifically, the first electrode 210 can be disposed as a surface electrode on one surface of the first substrate 110. That is, the area of the first electrode 210 can be the same as the area of the first substrate 110. Therefore, since the first electrode 210 can be formed on the first substrate 110 and manufactured without patterning the first electrode, the manufacturing process can be effectively reduced.
[0063] However, the embodiments are not limited thereto, and the first electrode 210 may be formed of a plurality of patterned electrodes having a uniform pattern such as a mesh or stripe.
[0064] For example, the first electrode 210 may include multiple conductive patterns. Specifically, the first electrode 210 may include multiple intersecting mesh lines and multiple mesh openings formed by the mesh lines.
[0065] Therefore, even though the first electrode 210 comprises metal, it cannot be visually identified from the outside, thereby improving visibility. Furthermore, the increased light transmittance through the opening enhances the brightness of the optical path control component according to the embodiment.
[0066] Meanwhile, when the first electrode 210 is formed of metal, its thickness can be relatively large to improve conductivity and reduce resistance. Specifically, when the first electrode 210 is formed of metal, its thickness can be from 1 μm to 5 μm. More specifically, its thickness can be from 1 μm to 4 μm. Even more specifically, its thickness can be from 1.5 μm to 2.5 μm.
[0067] The second substrate 120 may be disposed on the first substrate 110. More specifically, the second substrate 120 may be disposed on the first electrode 210 on the first substrate 110.
[0068] The second substrate 120 may include a material capable of transmitting light. The second substrate 120 may include a transparent material. The second substrate 120 may include a material that is the same as or similar to the first substrate 110 described above.
[0069] For example, the second substrate 120 may include glass, plastic, or a flexible polymer film. For instance, the flexible polymer film may be made of any of the following: polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone (PES), cyclic olefin copolymer (COC), triacetyl cellulose (TAC) film, polyvinyl alcohol (PVA) film, polyimide (PI) film, and polystyrene (PS). This is merely an example, and the embodiments are not limited thereto.
[0070] In addition, the second substrate 120 can be a flexible substrate with flexible properties.
[0071] Furthermore, the second substrate 120 can be a bent or folded substrate. That is, the optical path control member including the second substrate 120 can also be formed to have flexible, bent, or folded characteristics. Therefore, the optical path control member according to the first embodiment can be modified into various designs.
[0072] The second substrate 120 may also extend in the first direction 1A, the second direction 2A and the third direction 3A in the same manner as the first substrate 110 described above.
[0073] In detail, the second substrate 120 may include: a first direction 1A corresponding to the length or width direction of the second substrate 120; a second direction 2A extending in a direction different from the first direction 1A and corresponding to the length or width direction of the second substrate 120; and a third direction 3A extending in a direction different from the first direction 1A and the second direction 2A and corresponding to the thickness direction of the second substrate 120.
[0074] For example, the first direction 1A can be defined as the length direction of the second substrate 120, the second direction 2A can be defined as the width direction of the second substrate 120 perpendicular to the first direction 1A, and the third direction 3A can be defined as the thickness direction of the second substrate 120.
[0075] Alternatively, the first direction 1A can be defined as the width direction of the second substrate 120, the second direction 2A can be defined as the length direction of the second substrate 120 perpendicular to the first direction 1A, and the third direction 3A can be defined as the thickness direction of the second substrate 120.
[0076] In the following text, for ease of description, the first direction 1A is described as the length direction of the second substrate 120, the second direction 2A is described as the width direction of the second substrate 120, and the third direction 3A is described as the thickness direction of the second substrate 120.
[0077] A hole h can be formed in the second substrate 120. Specifically, at least one hole h can be formed in the second substrate 120.
[0078] Hole h1 can pass through the second substrate 120. That is, the depth of the hole can extend along the third direction 3A, and hole h1 can pass through the second substrate 120.
[0079] In addition, the hole h can pass through the second electrode 220 on the second substrate 120.
[0080] In addition, the hole h can pass through the buffer layer 420 on the second electrode 220.
[0081] In addition, the aperture h can pass through the base of the light conversion unit 300 on the buffer layer 420.
[0082] Furthermore, the aperture h can pass through part or all of the partition wall 310 of the light conversion unit 300.
[0083] When the aperture h is formed to pass through the entire partition wall portion 310 of the light conversion unit 300, the aperture h can be formed in one process, thereby effectively reducing the number of manufacturing processes.
[0084] The length h of the hole can be less than the length of the receiving part 320, and the width of the hole h can be greater than the width of the receiving part 320.
[0085] The hole h can be configured to be spaced apart from both ends on the first direction 1A and the second direction 2A of the second substrate 120. That is, the hole h can be disposed inside the second substrate 120.
[0086] The conductive material can be disposed inside the hole h, that is, the electrode connection portion 700, which includes the conductive material connected to the second electrode 220, can be disposed inside the hole h.
[0087] In other words, an electrode connection portion including conductive material is disposed inside the hole h, and the electrode connection portion can be used as a second connection electrode CA2 of the second substrate 120.
[0088] The conductive material disposed inside the hole h will be described in detail below.
[0089] The second electrode 220 can be disposed on one surface of the second substrate 120. Specifically, the second electrode 220 can be disposed on the lower surface of the second substrate 120. That is, the second electrode 220 can be disposed on one surface of the second substrate 120 where the second substrate 120 and the first substrate 110 face each other. In other words, the second electrode 220 can be disposed facing the first electrode 210 on the first substrate 110. In other words, the second electrode 220 can be disposed between the first electrode 210 and the second substrate 120.
[0090] The second electrode 220 may include the same or similar material as the first substrate 110 described above.
[0091] The second electrode 220 may include a transparent conductive material. For example, the second electrode 220 may include a conductive material having a light transmittance of about 80% or more. As an example, the second electrode 220 may include a metal oxide, such as indium tin oxide, indium zinc oxide, copper oxide, tin oxide, zinc oxide, titanium oxide, etc.
[0092] The second electrode 220 may have a thickness of about 10 nm to about 300 nm.
[0093] Alternatively, the second electrode 220 may comprise various metals to achieve low resistance. For example, the second electrode 220 may comprise at least one metal selected from chromium (Cr), nickel (Ni), copper (Cu), aluminum (Al), silver (Ag), molybdenum (Mo), gold (Au), titanium (Ti), and alloys thereof.
[0094] Reference Figure 3 The second electrode 220 can be disposed on the entire surface of one surface of the second substrate 120. Specifically, the second electrode 220 can be disposed as a surface electrode on one surface of the second substrate 120 excluding the hole region. However, the first embodiment is not limited thereto, and the second electrode 220 can be formed of a plurality of patterned electrodes having a uniform pattern such as a mesh or stripe shape.
[0095] For example, the second electrode 220 may include multiple conductive patterns. Specifically, the second electrode 220 may include multiple intersecting mesh lines and multiple mesh openings formed by the mesh lines.
[0096] Therefore, even though the second electrode 220 includes metal, it cannot be visually identified from the outside, thereby improving visibility. Furthermore, the increased light transmittance through the opening enhances the brightness of the optical path control member according to the first embodiment.
[0097] Meanwhile, when the second electrode 220 is formed of metal, its thickness can be relatively large to improve conductivity and reduce resistance. Specifically, when the second electrode 220 is formed of metal, its thickness can be from 1 μm to 5 μm. More specifically, its thickness can be from 1 μm to 4 μm. Even more specifically, its thickness can be from 1.5 μm to 2.5 μm.
[0098] The hole h described above can be formed to penetrate the second electrode 220. That is, the hole h can pass through the second substrate 120 and the second electrode 220 in a third direction.
[0099] The first substrate 110 and the second substrate 120 may correspond to each other or have different dimensions.
[0100] Specifically, the first length extending along the first direction 1A of the first substrate 110 may be different from the second length extending along the first direction 1A of the second substrate 120. For example, the second length of the second substrate 120 extending along the first direction 1A may be less than the first length of the first substrate 110 extending along the first direction 1A.
[0101] For example, the first length and the second length can have dimensions of 300mm to 400mm.
[0102] Furthermore, the first width of the first substrate 110 extending in the second direction 2A may have the same or similar dimensions as the second width of the second substrate 120 extending in the second direction.
[0103] For example, the first width and the second width can have dimensions ranging from 150mm to 200mm.
[0104] Furthermore, the first thickness of the first substrate 110 extending in the third direction 3A may have the same or similar dimensions as the second thickness of the second substrate 120 extending in the third direction upward.
[0105] For example, the first thickness and the second thickness can have dimensions of less than 1 mm.
[0106] Reference Figure 1 The first substrate 110 and the second substrate 120 may be configured to have different sizes.
[0107] Specifically, the second length of the second substrate 120 extending in the first direction 1A may be less than the first length of the first substrate 110 extending in the first direction 1A.
[0108] Therefore, the first substrate 110 can be configured to protrude in one direction of the first direction 1A.
[0109] That is, the first substrate 110 may include a protrusion that protrudes in one direction of the first direction 1A.
[0110] Therefore, the optical path control component 1000 may include the area of the first electrode 210 exposed on the first substrate 110.
[0111] In other words, the first electrode 210 disposed on the first substrate 110 can be partially exposed at the protrusion.
[0112] The first electrode 210 exposed from the protrusion can be used as a first connecting electrode CA1, and the pad portion can be disposed on the first connecting electrode CA1 to connect to an external printed circuit board.
[0113] For example, the pad portion may include a conductive adhesive comprising at least one of anisotropic conductive film (ACF) and anisotropic conductive paste (ACP).
[0114] In other words, the pad portion can be disposed on the first connecting electrode CA1 of the first electrode 210, and the pad portion and the printed circuit board can be bonded together by a conductive adhesive containing at least one of anisotropic conductive film (ACF) and anisotropic conductive paste (ACP). Alternatively, the first connecting electrode CA1 of the first electrode 210 and the printed circuit board can be directly bonded together by a conductive adhesive containing at least one of anisotropic conductive film (ACF) and anisotropic conductive paste (ACP) without the need for an additional pad portion.
[0115] The light conversion unit 300 can be disposed between the first substrate 110 and the second substrate 120. More specifically, the light conversion unit 300 can be disposed between the first electrode 210 and the second electrode 220.
[0116] An adhesive layer or a buffer layer may be disposed between the light conversion unit 300 and the first substrate 110 or between the light conversion unit 300 and the second substrate 120, and the first substrate 110, the second substrate 120 and the light conversion unit 300 may be adhered to each other by the adhesive layer and / or the buffer layer.
[0117] For example, an adhesive layer 410 can be disposed between the first electrode 210 and the light conversion unit 300, thereby bonding the first substrate 110 and the light conversion unit 300 together. Specifically, the first electrode 210 on the first substrate 110 and the light conversion unit 300 can be bonded together via the adhesive layer 410.
[0118] In addition, a buffer layer 420 can be disposed between the second electrode 220 and the light conversion unit 300, thereby improving the adhesion between the second electrode 220, which includes different materials, and the light conversion unit 300.
[0119] The aforementioned hole can be formed to pass through the buffer layer 420 and the light conversion unit 300. That is, the hole can sequentially pass through the second substrate 120, the second electrode 220, the buffer layer 420, and the light conversion unit 300 in a third direction.
[0120] The light conversion unit 300 may include multiple partition walls and a receiving portion. A light conversion material 330, including light conversion particles that move upon the application of voltage and a dispersion liquid for dispersing the light conversion particles, may be disposed in the receiving portion 320, and the light transmission characteristics of the light path control member may be altered by the light conversion particles.
[0121] Figure 4 It is along Figure 1 The sectional view taken by line A-A' in the middle.
[0122] Reference Figure 4 and Figure 5 The light conversion unit 300 may include a partition wall portion 310 and a receiving portion 320.
[0123] The partition wall portion 310 can be defined as a partition wall portion that divides the receiving portions. That is, the partition wall portion 310 can transmit light as a barrier area that divides multiple receiving portions. In other words, light emitted in the direction of the first substrate 110 or the second substrate 120 can pass through the partition wall portion.
[0124] The partition wall portion 310 and the receiving portion 320 may be configured to extend in a second direction 2A of the first substrate 110 and the second substrate 120. That is, the partition wall portion 310 and the receiving portion 320 may be configured to extend in the width direction or the length direction of the first substrate 110 and the second substrate 120.
[0125] Alternatively, the partition wall portion 310 and the receiving portion 320 may extend to have a predetermined tilt angle relative to the second direction 2A of the first substrate 110 and the second substrate 120. For example, the partition wall portion 310 and the receiving portion 320 may extend to have a tilt angle in the range of approximately 1 degree to approximately 20 degrees relative to the second direction 2A of the first substrate 110 and the second substrate 120. That is, the partition wall portion 310 and the receiving portion 320 may extend to have a tilt angle in the range of approximately 1 degree to approximately 20 degrees relative to the width direction or length direction of the first substrate 110 and the second substrate 120. The partition wall portion 310 and the receiving portion 320 may be provided with different widths. For example, the width of the partition wall portion 310 may be greater than the width of the receiving portion 320.
[0126] The partition wall portion 310 and the receiving portion 320 can be arranged alternately. In detail, the partition wall portion 310 and the receiving portion 320 can be arranged alternately. That is, each partition wall portion 310 can be arranged between adjacent receiving portions 320, and each receiving portion 320 can be arranged between adjacent partition wall portions 310.
[0127] The partition wall 310 may include a transparent material. The partition wall 310 may also include a light-transmitting material.
[0128] The partition wall portion 310 may include a resin material. For example, the partition wall portion 310 may include a UV-curable resin material. As an example, the partition wall portion 310 may include a UV resin or a transparent photoresist resin. Alternatively, the partition wall portion 310 may include a polyurethane resin or an acrylic resin.
[0129] The receiving portion 320 can be formed to partially transmit light conversion unit 300. Therefore, the receiving portion 320 can be configured to contact the adhesive layer 410 and can be configured to be spaced apart from the buffer layer 420. Therefore, a base portion 350 can be formed between the receiving portion 320 and the buffer layer 420.
[0130] A light conversion material 330, including light conversion particles 330a and a dispersion 330b in which the light conversion particles 330a are dispersed, can be disposed in the receiving portion 320.
[0131] Dispersion 330b may be a material used to disperse light-converting particles 330a. Dispersion 330b may include a transparent material. Dispersion 330b may include a nonpolar solvent. Furthermore, dispersion 330b may include a material capable of transmitting light. For example, dispersion 330b may include at least one of halogenated hydrocarbon oils, paraffinic oils, and isopropanol.
[0132] The light-converting particles 330a can be configured to be dispersed in the dispersion 330b. Specifically, the plurality of light-converting particles 330a can be configured to be spaced apart from each other in the dispersion 330b.
[0133] The light-converting particle 330a may include a material capable of absorbing light. That is, the light-converting particle 330a may be a light-absorbing particle. The light-converting particle 330a may have a color. For example, the light-converting particle 330a may have a color based on black. As an example, the light-converting particle 330a may include carbon black.
[0134] The light-converting particle 330a can become polar by charging its surface. For example, the surface of the light-converting particle 330a can carry a negative (-) charge. Therefore, depending on the applied voltage, the light-converting particle 330a can move toward the first electrode 210 or the second electrode 220.
[0135] The light transmittance of the container 320 can be changed by the light conversion particles 330a. Specifically, the light transmittance is changed by the movement of the light conversion particles 330a, thereby converting the container 320 into a light-blocking part and a light-transmitting part. That is, the light transmittance passing through the container 320 can be changed by the dispersion and aggregation of the light conversion particles 330a disposed inside the dispersion liquid 330b.
[0136] For example, the optical path control component according to the first embodiment can switch from a first mode to a second mode or from a second mode to a first mode by applying a voltage to the first electrode 210 and the second electrode 220.
[0137] In detail, in the optical path control member according to the first embodiment, the receiving portion 320 becomes a light-shielding portion in the first mode, and light at a specific angle can be blocked by the receiving portion 320. That is, the user's viewing angle from the outside is narrowed, allowing the optical path control member to be driven in a privacy mode.
[0138] Furthermore, in the optical path control member according to the first embodiment, the receiving portion 320 becomes a light-transmitting portion in the second mode, and in the optical path control member according to the first embodiment, light can be transmitted through both the partition wall portion 310 and the receiving portion 320. That is, the user's viewing angle from the outside can be widened, allowing the optical path control member to be driven in an exposed mode.
[0139] The switching from the first mode to the second mode, that is, the conversion of the receiving portion 320 from a light-blocking portion to a light-transmitting portion, can be achieved by moving the light-converting particles 330a in the receiving portion 320. In other words, the light-converting particles 330a may have an electric charge on their surface and may move towards the first electrode or the second electrode based on the applied voltage according to their charge characteristics. That is, the light-converting particles 330a may be electrophoretic particles.
[0140] For example, when no voltage is applied to the optical path control member from the outside, the light conversion particles 330a of the accommodating portion 320 are uniformly dispersed in the dispersion liquid 330b, and the accommodating portion 320 can block light through the light conversion particles. Therefore, in the first mode, the accommodating portion 320 can be driven as a light-shielding portion.
[0141] Furthermore, when a voltage is applied to the optical path control member from the outside, the light conversion particle 330a can move. For example, the light conversion particle 330a can be moved toward one end or the other end of the receiving portion 320 by the voltage transmitted by the first electrode 210 and the second electrode 220. That is, the light conversion particle 330a can move from the receiving portion 320 toward the first electrode 210 or the second electrode 220.
[0142] For example, when a voltage is applied to the first electrode 210 and / or the second electrode 220, an electric field is formed between the first electrode 210 and the second electrode 220, and the negatively charged light conversion particles 330a can move toward the positive electrodes of the first electrode 210 and the second electrode 220 using the dispersion liquid 330b as a medium.
[0143] As an example, in the initial mode or when no voltage is applied to the first electrode 210 and / or the second electrode 220, such as Figure 4 As shown, the light-converting particles 330a can be uniformly dispersed in the dispersion liquid 330b, and the receiving part 320 can be driven as a light-shielding part.
[0144] Furthermore, when a voltage is applied to the first electrode 210 and / or the second electrode 220, such as Figure 5 As shown, the light-converting particles 330a can move toward the second electrode 220 in the dispersion liquid 330b, that is, the light-converting particles 330a move in one direction, and the receiving portion 320 can be driven by the light-transmitting portion.
[0145] Therefore, the optical path control member according to the first embodiment can be driven in two modes depending on the user's surrounding environment. That is, when the user only requires light transmission at a specific viewing angle, the receiving part is driven as a light-blocking part, or in an environment where the user requires high brightness, a voltage can be applied to drive the receiving part as a light-transmitting part.
[0146] Therefore, since the optical path control component according to the first embodiment can be implemented in two modes according to the user's requirements, the optical path control component can be applied regardless of the user's environment.
[0147] Figures 6 to 8 It is along Figure 1 The sectional view taken by line B-B' in the diagram. That is, Figures 6 to 8 It is a cross-sectional view taken along one end and the other end of the hole formed in the second substrate 120.
[0148] Reference Figures 6 to 8 The aperture h can be formed to pass through the second substrate 120, the second electrode 220, the buffer layer 420, and the light conversion unit 300. That is, the aperture h can pass through the second substrate 120, the second electrode 220, and the buffer layer 420, and can be formed by removing the base 350 and the partition wall portion 310 of the light conversion unit 300.
[0149] For example, refer to Figure 6 The hole h can pass through the second substrate 120, the second electrode 220, the buffer layer 420 and the base 350 and can be formed to partially pass through the partition wall portion 310.
[0150] In addition, refer to Figure 7 and Figure 8 The hole h can be formed to pass through the entire second substrate 120, second electrode 220, buffer layer 420, base 350 and partition wall portion 310.
[0151] Therefore, the adhesive layer 410 can be exposed through the pore h. That is, in Figure 7 and Figure 8 In this case, the adhesive layer 410 can be exposed through the bottom surface of the hole h.
[0152] An electrode connection portion 700 formed of a conductive material can be disposed inside a hole formed in the second substrate 120.
[0153] The electrode connection portion 700 may include a material different from that of at least one of the first electrode 210 and the second electrode 220. Furthermore, the light transmittance of the electrode connection portion 700 may be less than that of at least one of the first electrode 210 and the second electrode 220.
[0154] For example, the electrode connection portion 700 may include metal. More specifically, the electrode connection portion 700 may include a metal paste in which metal particles are dispersed in a binder.
[0155] The electrode connection portion 700 may be configured to contact the side surface of the second substrate 120. Furthermore, the electrode connection portion 700 may be configured to contact the side surface of the second electrode 220. Furthermore, the electrode connection portion 700 may be configured to contact the side surface of the buffer layer 420. Furthermore, the electrode connection portion 700 may be configured to contact the side surface of the base portion 350. Furthermore, the electrode connection portion 700 may be configured to contact the side surface of the partition wall portion 310.
[0156] In other words, the electrode connection portion 700 can be configured to contact at least one of the side surfaces of the second substrate 120, the second electrode 220, the buffer layer 420, the base 350, and the partition wall portion 310. Furthermore, referring to… Figure 7 The electrode connection portion 700 can be configured to directly contact the adhesive layer 410.
[0157] Alternatively, refer to Figure 6 and Figure 8 The electrode connection portion 700 can be configured to be spaced apart from the adhesive layer 410. Specifically, the partition wall portion 310 can be as follows: Figure 6 As shown, it is disposed between the electrode connection portion 700 and the adhesive layer 410, or as... Figure 8 The insulating layer 750 is provided as shown, so the electrode connection portion 700 can be spaced apart from the adhesive layer 410.
[0158] When the electrode connection portion 700 and the adhesive layer 410 are spaced apart from each other, the electrical connection between the electrode connection portion 700 and the first electrode 210 may be prevented due to the dielectric constant of the adhesive layer 410. Therefore, the limitations on the selection of the adhesive layer 410 material can be reduced, and electrical short circuits based on the dielectric constant of the adhesive layer 410 can be prevented.
[0159] The upper surface of the electrode connection portion 700 may be disposed on the same plane as the upper surface of the second substrate 120 or may be lower. For example, as Figure 6 and Figure 8 As shown, the upper surface of the electrode connection portion 700 and the upper surface of the second substrate 120 can be disposed on the same plane, or, as... Figure 7 As shown, the upper surface of the electrode connection portion 700 can be configured to be lower than the upper surface of the second substrate 120.
[0160] Therefore, the upper surface of the electrode connection portion 700 and the upper surface of the second substrate 120 can be formed on the same plane without steps, or the upper surface of the electrode connection portion 700 can be provided with steps in such a way that its upper surface is low.
[0161] Therefore, it is possible to prevent the total thickness of the optical path control component from increasing due to the height of the electrode connection portion 700, thereby reducing the total thickness of the optical path control component.
[0162] The electrode connection portion 700 can be electrically connected to the second electrode 220 and can be exposed to the outside of the second substrate 120. Therefore, the electrode connection portion 700 can be used as a second connection electrode CA2 of the second electrode 220 connected to an external circuit board.
[0163] In other words, the upper surface of the electrode connection portion 700 exposed on the upper surface of the second substrate 120 can become the second connection electrode CA2 of the second electrode 220, and the pad portion and / or conductive adhesive can be disposed on the second connection electrode CA2 to connect to an external circuit board.
[0164] Furthermore, the pad portion and / or conductive adhesive are disposed on the first connection electrode CA1 of the first electrode exposed by removing the adhesive layer 410 from the upper surface of the first substrate 110, and can be connected to the same external circuit board.
[0165] Therefore, the first electrode 210 and the second electrode 220 can be connected to the same circuit board to be electrically connected to each other.
[0166] However, the embodiments are not limited to this, and the circuit board can be separately partitioned for electrical connection to the first electrode and the second electrode. That is, the first electrode 210 can be connected to the first circuit board, and the second electrode can be connected to a second circuit board different from the first circuit board.
[0167] The optical path control component according to the first embodiment may include an electrode connection portion disposed inside a hole formed in the second substrate.
[0168] The electrode connection portion can directly contact the side surface of the second electrode, therefore, the electrode connection portion can be electrically connected to the second electrode.
[0169] Therefore, the electrode connection portion exposed on the upper surface of the second substrate can become the second connection electrode of the second electrode and can be connected to an external circuit board.
[0170] Therefore, the region of the second substrate used to form the second connecting electrode of the second electrode can be removed.
[0171] In other words, in the optical path control member according to the first embodiment, in order to form the connection electrode of the second electrode, it is not necessary to form a protruding area on the second substrate as in the first substrate, so that the bezel area of the display including the optical path control member can be reduced.
[0172] Therefore, in the overall size of the optical path control component according to the first embodiment, the overall size can be reduced by reducing the border area.
[0173] In the following text, reference will be made to Figures 9 to 12 The optical path control component according to the second embodiment is described. In the description of the optical path control component according to the second embodiment, descriptions that are the same as or similar to those of the optical path control component according to the first embodiment described above will be omitted, and the same reference numerals will be assigned to the same components.
[0174] Reference Figure 9 and Figure 10 The first substrate 110 and the second substrate 120 may have different sizes.
[0175] Specifically, the second substrate 120 may include an opening region OA of the second substrate 120. Furthermore, the first substrate 110 may be disposed within a portion of the opening region OA. Figure 9 ) or the whole ( Figure 10 That is, the dimensions of the first substrate 110 and the second substrate 120 may differ due to the size of the first substrate 110 disposed in the opening region OA.
[0176] The second substrate 120 may have a protrusion that protrudes in a second direction 2A through the opening region OA.
[0177] Reference Figure 9 and Figure 10 At least one hole can be formed in the second substrate 120. For details, refer to... Figure 9 One or more holes h can be formed in the second substrate 120. Specifically, one hole h can be formed in the second protrusion PA2 of the second substrate 120. In addition, the first connecting electrode CA1 can be exposed from the first protrusion PA1 of the first substrate 110.
[0178] In addition, refer to Figure 10 Multiple holes can be formed in the second substrate 120. Specifically, the first hole h1 and the second hole h2 can be formed in the protrusions PA2-1 and PA2-2 of the second substrate 120, respectively.
[0179] The first hole h1 and the second hole h2 can be separated from each other through the opening region OA.
[0180] Figure 11 It is along Figure 9The sectional view taken by line C-C' in the figure. (Refer to...) Figure 11 The hole h can be formed to pass through the second substrate 120, the second electrode 220, the buffer layer 420, the base 350 and the partition wall portion 310.
[0181] An electrode connection portion 700 formed of a conductive material may be disposed inside a hole h formed in the second substrate 120.
[0182] The electrode connection portion 700 may include a material different from at least one of the first electrode 210 and the second electrode 220. Furthermore, the light transmittance of the electrode connection portion 700 may be less than the light transmittance of at least one of the first electrode 210 and the second electrode 220.
[0183] For example, the electrode connection portion 700 may include metal. More specifically, the electrode connection portion 700 may include a metal paste in which metal particles are dispersed in a binder.
[0184] The electrode connection portion 700 can contact the side surface of the second electrode 220. Therefore, the electrode connection portion 700 can be electrically connected to the second electrode 220 and exposed to the outside of the second substrate 120. Therefore, the electrode connection portion 700 can be used as a second connection electrode CA2 of the second electrode 220 connected to an external circuit board.
[0185] Since the electrode connection portion 700 is configured to contact the side surface of the second electrode 220, the bezel area of the optical path control component and the display device including the optical path control component can be reduced, thereby providing a wider display area for the user.
[0186] In other words, the areas where the first electrode 210 and the second electrode 220 are connected to the external printed circuit board can be located within the frame v, which is not shown in the optical path control component. In this case, in order to connect the printed circuit board to the first electrode 210 and the second electrode 220, an additional frame area with protrusions as described above is required, thus causing the frame area to increase. The optical path control component according to the embodiment can reduce the size of the frame area, such as the size of the protrusions. That is, the protrusions on which the first electrode 210 and the second electrode 220 connected to the printed circuit board are provided are not formed by extending the surface of the first substrate 110 and the second substrate 120 in the first direction 1A or the second direction 2A of the first substrate 110 and the second substrate 120 as a whole, but are formed by partially extending the surface of the first substrate 110 and the second substrate 120 in the first direction 1A or the second direction 2A of the second substrate 120, thus reducing the overall frame area.
[0187] In other words, the upper surface of the electrode connection portion 700 can become the upper surface of the second connection electrode CA2 of the second electrode 220, and the pad portion and / or conductive adhesive can be disposed on the second connection electrode CA2 to connect to an external circuit board.
[0188] Furthermore, the first connecting electrode CA1 exposed by removing the adhesive layer 410 can be formed on the upper surface of the first substrate 110. The first connecting electrode CA1 can be disposed in a region corresponding to the opening region OA of the second substrate 120. That is, the first connecting electrode CA1 can be perpendicularly overlapped with the opening region OA.
[0189] The pad portion can also be located on the first connecting electrode CA1 and can be connected to the same external circuit board as the second connecting electrode.
[0190] For example, the pad portion may include a conductive adhesive comprising at least one of anisotropic conductive film (ACF) and anisotropic conductive paste (ACP).
[0191] In other words, the pad portion can be disposed on the first electrode 210 and the second electrode 220, and the pad portion and the printed circuit board can be bonded by a conductive adhesive containing at least one of anisotropic conductive film (ACF) and anisotropic conductive paste (ACP), or the first electrode 210 and the second electrode 220 can be adhered to the printed circuit board by a conductive adhesive containing at least one of anisotropic conductive film (ACF) and anisotropic conductive paste (ACP), without the need for an additional pad portion.
[0192] Figure 12 It is along Figure 10 The cross-sectional view taken by line D-D' in the diagram. (Refer to...) Figure 12 The first hole h1 and the second hole h2 can be formed to pass through the second substrate 120, the second electrode 220, the buffer layer 420 and the base 350, and can be formed to partially pass through the partition wall portion.
[0193] The depths of the first hole h1 and the second hole h2 can be the same or different. Specifically, the first hole h1 and the second hole h2 can be formed as... Figure 12 The holes may be formed to the same depth as shown, or may not be limited to this, and the first hole h1 and the second hole h2 may be formed to have different depths.
[0194] Electrode connection portions 700 formed of conductive material can be respectively disposed inside the first hole h1 and the second hole h2 formed in the second substrate 120. That is, the first electrode connection portion 710 can be disposed in the first hole h1, and the second electrode connection portion 720 can be disposed in the second hole h2.
[0195] At least one of the first electrode connection portion 710 and the second electrode connection portion 720 may include a material different from at least one of the first electrode 210 and the second electrode 220. Furthermore, the light transmittance of at least one of the first electrode connection portion 710 and the second electrode connection portion 720 may be less than the light transmittance of at least one of the first electrode 210 and the second electrode 220.
[0196] For example, at least one of the first electrode connection portion 710 and the second electrode connection portion 720 may include metal. More specifically, at least one of the first electrode connection portion 710 and the second electrode connection portion 720 may include metal paste, in which metal particles are dispersed in a binder.
[0197] At least one of the first electrode connection portion 710 and the second electrode connection portion 720 can be in direct contact with the side surface of the second electrode 220. Therefore, at least one of the first electrode connection portion 710 and the second electrode connection portion 720 can be electrically connected to the second electrode 220 and exposed to the outside of the second substrate 120. Therefore, at least one of the first electrode connection portion 710 and the second electrode connection portion 720 can be used as second connection electrodes CA2-1 and CA2-2 connected to the second electrode 220 on an external circuit board. That is, the first electrode connection portion 710 can become the second connection electrode CA2-1 of the second electrode and / or the second electrode connection portion 720 can become the second connection electrode CA2-2 of the second electrode.
[0198] In other words, multiple electrode connection portions can be disposed on the second substrate 120 and multiple connection electrodes can be formed on the second substrate 120. For example, the second substrate 120 may include both a first electrode connection portion and a second electrode connection portion disposed in each hole.
[0199] In other words, the upper surface of the first electrode connection portion 710 exposed on the upper surface of the second substrate 120 can become the second connection electrode CA2-1 of the second electrode 220, and the upper surface of the second electrode connection portion 720 can become the second connection electrode CA2-2 of the second electrode 220, and the pad portion and / or conductive adhesive can be disposed on the second connection electrodes CA2-1 and CA2-2 to connect to an external circuit board.
[0200] Figure 10 and Figure 12 The optical path control component according to the second embodiment shown can form two electrode connection portions serving as the second connection electrode. Therefore, one electrode connection portion serves as the main connection electrode, and the other electrode connection portion serves as the auxiliary connection electrode, so that even if a contact failure occurs between the main electrode connection portion and the second electrode, it is possible to connect to the circuit board through the auxiliary connection electrode portion.
[0201] Furthermore, the first connecting electrode CA1 exposed by removing the adhesive layer 410 can be formed on the upper surface of the first substrate 110. The first connecting electrode CA1 can be disposed in a region corresponding to the opening region OA of the second substrate 120. That is, the first connecting electrode CA1 can be perpendicularly overlapped with the opening region OA.
[0202] The pad portion and / or conductive adhesive can also be provided on the first connecting electrode CA1 and can be connected to the same external circuit board.
[0203] According to the second embodiment, the optical path control component may include an electrode connection portion disposed within a hole formed in the second substrate.
[0204] The electrode connection portion can directly contact the side surface of the second electrode, and therefore, the electrode connection portion can be electrically connected to the second electrode.
[0205] Therefore, the electrode connection portion exposed on the upper surface of the second substrate can become the second connection electrode of the second electrode and can be connected to an external circuit board.
[0206] Therefore, the area of the second substrate used to form the second connecting electrode of the second electrode can be reduced.
[0207] In other words, in the optical path control member according to the second embodiment, in order to form the connection electrode of the second electrode, the second connection electrode can be formed by forming an opening region in the second substrate and placing the connection electrode on the protrusion formed by the opening region of the second electrode, and the first connection electrode can be formed in the region corresponding to the opening region in the first substrate. Therefore, in the second substrate, since the size of the hole forming region only needs to form the second connection electrode connected to the printed circuit board, it is not necessary to enlarge the surface of the first direction 1A or the surface of the second direction 2A of the second substrate 120 as a whole. Furthermore, since the first connection electrode is only provided in the opening region of the first substrate, the size of the protruding region of the first substrate for providing the first connection electrode can be reduced. Therefore, the entire bezel area of the display including the optical path control member according to the embodiment can be reduced.
[0208] Since it is not necessary to form protruding areas for forming connection electrodes on the first and second substrates, the frame area of the optical path control component can be reduced.
[0209] Therefore, the overall size of the optical path control component according to the second embodiment can be reduced by reducing the border area.
[0210] Furthermore, according to the second embodiment, the optical path control member additionally forms auxiliary connection electrode portions on a plurality of protrusions formed in the opening region, so that when the main electrode connection portion is damaged, it can be connected to the circuit board through the auxiliary connection electrode portions, thereby improving the lifespan of the optical path control member.
[0211] In the following text, reference will be made to Figures 13 to 18 The optical path control component according to the third embodiment is described. In the description of the optical path control component according to the third embodiment, descriptions that are the same as or similar to those of the optical path control components according to the first and second embodiments described above will be omitted, and the same reference numerals will be assigned to the same components.
[0212] Reference Figure 13 The first substrate 110 and the second substrate 120 may have different sizes.
[0213] Specifically, the second substrate 120 may include an opening region OA that opens the second substrate 120. Furthermore, the first substrate 110 may be disposed within a portion of the opening region OA. That is, the dimensions of the first substrate 110 and the second substrate 120 may differ depending on the size of the first substrate 110 disposed within the opening region OA.
[0214] The second substrate 120 may have a protrusion PA2 that protrudes in a second direction 2A through the opening region OA. In addition, the first connecting electrode CA1 may be exposed from the first protrusion PA1 of the first substrate 110.
[0215] Multiple holes may be formed in the second substrate 120. Specifically, the second substrate 120 may include a first hole h1 formed in a protruding region of the second substrate 120 and second holes h2-1 and h2-2 formed in regions other than the protruding region.
[0216] The electrode connection unit 700 can be disposed in the first hole h1 as described above, similar to the optical path control member according to the second embodiment.
[0217] In the following text, we will refer to... Figures 14 to 18 The configuration of the first hole h1 and the second holes h2-1 and h2-2 is described in detail, as well as the light conversion material 330, the sealing part 500 and the dam part 600 disposed in the receiving part 320.
[0218] Figure 14 It is along Figure 13 The sectional view taken by line E-E' in the diagram. That is, Figure 14 It is a cross-sectional view taken between the second holes h2-1 and h2-2 formed in the second substrate 120 and one end or the other end of the second substrate 120 in the second direction 2A.
[0219] Reference Figure 14The resin material can be filled into the receiving portion 320, and the dam portion 600 can be disposed therein. That is, the dam portion 600 can be disposed in the receiving portion 320 between the second hole h2-1 formed in the second substrate 120 and one end of the second substrate 120 in the second direction 2A, and between the second hole h2-2 formed in the second substrate 120 and the other end of the second substrate 120 in the second direction 2A. In other words, the dam portion 600 can be disposed in the outer region of the second holes h2-1 and h2-2.
[0220] However, the embodiments are not limited to this, and at least one of the second holes h2-1 and h2-2 may be formed, or multiple second holes h2-1 and multiple second holes h2-2 may be formed, or multiple second holes h2-1 and one second hole h2-2 may be formed.
[0221] The dam portion 600 can be configured to completely or partially fill the interior of the receiving portion 320. For example, the dam portion 600 can be configured to partially fill the interior of the receiving portion 320. Therefore, the adhesive layer 410 can be configured to partially fill the interior of the receiving portion 320. That is, the dam portion 600 can be provided only in the receiving portion 320 or the dam portion 600 can be provided together with the adhesive layer 410.
[0222] When the light conversion material 330, which includes a dispersion of light conversion particles, is filled in the receiving portion 320, the dam portion 600 can prevent the light conversion material from moving in one direction between the holes formed in the second substrate 120 and one end of the second direction 2A of the second substrate. Therefore, the light conversion material 330 can be injected only into the region between the holes through the dam portion.
[0223] Figure 15 It is along Figure 13 The sectional view taken by line F-F' in the diagram. That is, Figure 15 It is a cross-sectional view taken along one end and the other end of the second holes h2-1 and h2-2 formed in the second substrate 120.
[0224] Reference Figure 15 The second holes h2-1 and h2-2 can be formed to pass through the second substrate 120, the second electrode 220, the buffer layer 420, and the light conversion unit 300. That is, the second holes h2-1 and h2-2 can pass through the second substrate 120, the second electrode 220, and the buffer layer 420, and can be formed by removing both the base 350 and the partition wall portion 310 of the light conversion unit 300.
[0225] Therefore, the adhesive layer 410 can be exposed through the second holes h2-1 and h2-2. That is, the adhesive layer 410 can be exposed through the bottom surfaces of the second holes h2-1 and h2-2.
[0226] A sealing portion 500 formed of a sealing material can be disposed inside the second holes h2-1 and h2-2 formed in the second substrate 120. That is, the sealing portion 500, comprising a sealing material such as epoxy resin, can be disposed inside the second holes h2-1 and h2-2 formed through the second substrate 120, the second electrode 220, the buffer layer 420, and the light conversion unit 300. For example, the sealing material can include a material different from the material forming the partition wall portion 310 and the base portion 350. As an example, the sealing material can include epoxy resin.
[0227] Therefore, the sealing portion 500 can be configured to contact the side surface of the second substrate 120. Furthermore, the sealing portion 500 can be configured to contact the side surface of the second electrode 220. Furthermore, the sealing portion 500 can be configured to contact the side surface of the buffer layer 420. Furthermore, the sealing portion 500 can be configured to contact the side surface of the base portion 350. Furthermore, the sealing portion 500 can be configured to contact the side surface of the partition wall portion 310. Furthermore, the sealing portion 500 can be configured to directly contact the adhesive layer 410.
[0228] The thickness T of the sealing portion 500 can be equal to or less than the sum of the thicknesses of the partition wall portion 310, the base portion 350, the buffer layer 420, the second electrode 220, and the second substrate 120.
[0229] In other words, the upper surface of the sealing portion 500 can be disposed on the same plane as the upper surface of the second substrate 120 or can be lower. Therefore, the upper surface of the sealing portion 500 can be formed without steps on the same plane as the upper surface of the second substrate 120, or the upper surface of the sealing portion 500 can be provided with steps in such a way that its upper surface is formed.
[0230] Therefore, the total thickness of the optical path control component can be reduced by preventing the total thickness of the optical path control component from increasing due to the height of the sealing part 500.
[0231] The sealing part 500 can be used to seal the light conversion material filled in the receiving part 320 between the second holes h2-1 and h2-2. That is, after the light conversion material is supplied to the second hole h2-1, the light conversion material can be injected into the receiving part 320 between the second hole h2-1 and the second hole h2-2 by moving from the second hole h2-1 to the second hole h2-2 through a capillary method.
[0232] Then, in order to seal both ends of the light conversion material in the injection receiving portion 320, the sealing material can be filled into the hole to form the sealing portion 500, and the light conversion material in the injection receiving portion 320 can be sealed by filling the second hole h2-1 and the second hole h2-2.
[0233] The aperture, defined as the injection section of the light conversion material, is formed by removing all the partition walls. Therefore, the movement path of the light conversion material in the injection section can be increased, and correspondingly, the injection speed of the light conversion material can be improved.
[0234] Furthermore, since all the partition walls are removed from the holes, when the sealing material is placed inside the holes after the light conversion material is injected, the area where the sealing material is placed can be increased, thereby improving the sealing properties of the light conversion material.
[0235] Furthermore, the embodiments are not limited to this, and in order to minimize the border area of the optical path control member, in at least one of the second holes h2-1 and h2-2, by removing at least one outer surface of the hole and part or all of the outer surface from the outer surface of the hole to the outer surface of the substrate, a portion of the hole can become the outermost surface of the optical path control member. For example, since the opening region is formed by removing the outer surface of the hole from the outer surface of the substrate except for the portion between the electrode portion and the hole, the portion of the hole, i.e., the sealing portion, at the outermost part of the optical path control member in the opening region can become the outermost surface of the optical path control member.
[0236] Figure 16 It is along Figure 13 The cross-sectional view taken by line G-G' in the diagram. That is, Figure 16 It is a cross-sectional view of one end and the other end of any one of the multiple accommodating parts of the light conversion unit in the second direction.
[0237] Figure 16 The figure shows that the electrode connection portion 700 is disposed inside the receiving portion, but the embodiment is not limited to this, and the electrode connection portion 700 can be formed by removing the partition wall portion from the partition wall portion region, and the electrode connection portion 700 disposed inside the receiving portion will be mainly described below.
[0238] Reference Figure 16 The light conversion material 330, the sealing portion 500, the dam portion 600, and the electrode connection portion 700 can be disposed in the receiving portion 320. That is, the light conversion material 330 can be disposed between the sealing portions 500, and the dam portion 600 can be disposed between the sealing portion 500 and the electrode connection portion 700 or outside the second substrate 120. In this case, the electrode connection portion 700 can be disposed outside the dam portion 600.
[0239] In other words, the light conversion material 330, the sealing part 500, the dam part 600 and the electrode connection part 700 can be arranged sequentially while extending from the central region of the receiving part 320 toward one end.
[0240] The light conversion material 330, the sealing part 500, the dam part 600, and the electrode connection part 700 are disposed inside the receiving part 320 in contact with each other. That is, the light conversion material 330 can be disposed in direct contact with the sealing part 500, the sealing part 500 can be disposed in direct contact with the light conversion material 330 and the dam part 600, and the dam part 600 can be disposed in direct contact with the sealing part 500 and the electrode connection part 700.
[0241] In the optical path control component according to the third embodiment, by providing a dam and a light conversion material inside the receiving portion and providing a sealing portion between the dam and the light conversion material, the frame area can be reduced and the sealing characteristics can be improved.
[0242] In detail, the dam 600 can be disposed inside the receiving portion to block the movement of the light conversion material, so that the light conversion material can be disposed only between the dams. In addition, the height of the base 350, buffer layer 420, second electrode 220 and second substrate 120 disposed above the dam 600 can prevent the light conversion material 330 filled in the receiving portion 320 from overflowing outside the dam 600.
[0243] Therefore, since the dam section 600 is only provided inside the receiving section 320 and not in the partition wall section 310, the height of the dam section 600 can be reduced, and the total thickness of the optical path control component can be prevented from increasing due to the increase in the height of the dam section.
[0244] Furthermore, since the sealing portion 500 is disposed inside the hole passing through the second substrate 120, the second electrode 220, the buffer layer 420 and the light conversion unit 300, the sealing characteristics of the light conversion material can be improved by increasing the area where the sealing portion 500 is disposed.
[0245] Alternatively, refer to Figure 17 A mixing region 800 can be formed inside the receiving portion 320. Specifically, a first mixing region 810 formed by mixing sealing material and dam material can be formed between the sealing portion 500 and the dam portion 600, and a second mixing region 820 formed by mixing sealing material and light conversion material can be formed between the sealing portion 500 and the light conversion material 330.
[0246] This can be achieved by adjusting the materials and curing time of the sealing material and light conversion material in the sealing part, and even if the light path control component changes mode multiple times through the mixing area, it can prevent air from being generated inside the sealing part, and prevent the sealing material from penetrating deep into the receiving part or the light conversion material of the receiving part from penetrating into the sealing part.
[0247] Figure 18 It is along Figure 13 The cross-sectional view taken by line H-H' in the diagram. That is, Figure 18 It is a cross-sectional view taken from one end and the other end of one of the partition walls of the light conversion unit.
[0248] Reference Figure 18 The partition wall 310 can be removed in the area where the sealing part 500 is provided. That is, the sealing part 500 can also be provided in the area where the partition wall is provided. Therefore, the area of the sealing part 500 can increase the size of the partition wall that can be removed.
[0249] Therefore, the arrangement area of the sealing part 500 can be increased without increasing the thickness of the sealing part 500.
[0250] Therefore, the sealing characteristics of the light conversion material based on the sealing part 500 can be improved.
[0251] In the following text, refer to Figures 19 to 23 This section describes a display device that applies an optical path control component according to an embodiment.
[0252] Reference Figure 19 and Figure 20 According to the embodiment, the optical path control component 1000 can be disposed above or below the display panel 2000.
[0253] The display panel 2000 and the optical path control component 1000 can be configured to adhere to each other. For example, the display panel 2000 and the optical path control component 1000 can be adhered to each other via an adhesive layer 1500. The adhesive layer 1500 can be transparent. For example, the adhesive layer 1500 can include an adhesive or adhesive layer containing an optically transparent adhesive material.
[0254] The adhesive layer 1500 may include a release film. Specifically, when the optical path control component and the display panel are adhered, the optical path control component and the display panel can be adhered after the release film has been removed.
[0255] The display panel 2000 may include a first substrate 2100 and a second substrate 2200. When the display panel 2000 is a liquid crystal display panel, the light path control member may be formed on the lower part of the liquid crystal panel. That is, when the surface observed by the user in the liquid crystal panel is defined as the upper part of the liquid crystal panel, the light path control member may be disposed on the lower part of the liquid crystal panel. The display panel 2000 may be formed in a structure in which the first substrate 2100, including thin-film transistors (TFTs) and pixel electrodes, and the second substrate 2200, including a color filter layer, are bonded together by a liquid crystal layer interposed between them.
[0256] Furthermore, the display panel 2000 can be a liquid crystal display panel with a color filter on transistor (COT) structure, wherein thin-film transistors, color filters, and a black electrolyte are formed on a first' substrate 2100, and a second' substrate 2200 is bonded to the first' substrate 2100 with a liquid crystal layer interposed between the first' substrate 2100 and the second' substrate 2200. That is, thin-film transistors can be formed on the first' substrate 2100, a protective film can be formed on the thin-film transistors, and a color filter layer can be formed on the protective film. Additionally, pixel electrodes that contact the thin-film transistors can be formed on the first' substrate 2100. In this respect, to improve the aperture ratio and simplify the mask process, the black electrolyte can be omitted, and a common electrode can be formed, functioning as the black electrolyte.
[0257] Furthermore, when the display panel 2000 is a liquid crystal display panel, the display device may further include a backlight unit 3000 that provides light from the back of the display panel 2000.
[0258] In other words, such as Figure 19 As shown, the light path control component can be disposed on the lower part of the liquid crystal panel and on the backlight unit 3000, and the light path control component can be disposed between the backlight unit 3000 and the display panel 2000.
[0259] Alternatively, such as Figure 20 As shown, when the display panel 2000 is an organic light-emitting diode (OLED) panel, a light path control component can be formed on the OLED display panel. That is, when the surface observed by the user in the OLED display panel is defined as the upper part of the OLED display panel, the light path control component can be disposed on the OLED display panel. The display panel 2000 may include self-emissive elements that do not require a separate light source. In the display panel 2000, thin-film transistors can be formed on the first substrate 2100, and organic light-emitting elements in contact with the thin-film transistors can be formed. The organic light-emitting element may include an anode, a cathode, and an organic light-emitting layer formed between the anode and the cathode. Furthermore, the organic light-emitting element may further include a second substrate 2200 configured to function as a packaging substrate for encapsulation.
[0260] Furthermore, although not shown in the accompanying drawings, a polarizing plate may be further disposed between the optical path control member 1000 and the display panel 2000. The polarizing plate may be a linear polarizing plate or a polarizing plate that prevents external light reflection. For example, when the display panel 2000 is a liquid crystal display panel, the polarizing plate may be a linear polarizing plate. Alternatively, when the display panel 2000 is an organic electroluminescent display panel, the polarizing plate may be a polarizing plate that prevents external light reflection.
[0261] Furthermore, additional functional layers 1300, such as anti-reflective layers and anti-glare layers, can be further provided on the optical path control member 1000. Specifically, the functional layer 1300 can be adhered to one surface of the first substrate 110 of the optical path control member. Although not shown in the figures, the functional layer 1300 can be adhered to the first substrate 110 of the optical path control member via an adhesive layer. Furthermore, a release film for protecting the functional layer can be further provided on the functional layer 1300.
[0262] In addition, a touch panel can be further installed between the display panel and the optical path control components.
[0263] The accompanying drawings show that the light path control component is disposed on the upper part of the display panel, but the embodiment is not limited to this, and the light path control component can be disposed in various positions, such as an adjustable position, i.e., the lower part of the display panel, or between the second substrate and the first substrate of the display panel, etc.
[0264] Furthermore, the accompanying drawings show that the light conversion unit of the light path control member according to the embodiment is in a direction parallel or perpendicular to the outer surface of the second substrate, but the light conversion unit is formed to be tilted at a predetermined angle from the outer surface of the second substrate. This reduces moiré patterns occurring between the display panel and the light path control member.
[0265] Reference Figures 21 to 23 The optical path control component according to the embodiment can be applied to various display devices.
[0266] Reference Figures 21 to 22 The optical path control component according to the embodiment can be applied to a display device for a display.
[0267] For example, such as Figure 21 As shown, when power is applied to the light path control component, the receiving portion functions as a light-transmitting portion, allowing the display device to be driven in an open mode, and as... Figure 22 As shown, when no power is applied to the light path control component, the housing acts as a light-shielding part, allowing the display device to be driven in a light-shielding mode.
[0268] Therefore, users can easily drive the display device in either privacy or normal mode depending on the amount of power applied.
[0269] Light emitted from the backlight unit or the self-emissive element can move from the first substrate toward the second substrate. Alternatively, light emitted from the backlight unit or the self-emissive element can also move from the second substrate toward the first substrate.
[0270] In addition, refer to Figure 23 The display device that uses the optical path control component according to the embodiment can also be applied to the interior of a vehicle.
[0271] For example, a display device including the optical path control component according to an embodiment can display video confirmation information of the vehicle and the vehicle's movement route. The display device can be disposed between the driver's seat and the passenger seat of the vehicle.
[0272] Furthermore, the optical path control component according to the embodiment can be applied to a dashboard that displays vehicle speed, engine, alarm signals, etc.
[0273] Furthermore, the optical path control component according to the embodiment can be applied to the front windshield (FG) or the right and left windows of a vehicle.
[0274] The features, structures, effects, etc., described in the above embodiments are included in at least one embodiment of the present invention, but are not limited to only one embodiment. Furthermore, the features, structures, and effects described in the various embodiments can be combined or modified by those skilled in the art for other embodiments. Therefore, it is to be understood that such combinations and modifications are included within the scope of the present invention.
[0275] Furthermore, while the foregoing has primarily described embodiments, these embodiments are merely examples and do not limit the invention. Those skilled in the art will understand that various modifications and applications not mentioned above can be made without departing from the essential characteristics of the embodiments. For example, each component specifically represented in the embodiments may vary. Moreover, it should be understood that differences relating to such modifications and applications are included within the scope of the invention as defined by the appended claims.
Claims
1. An optical path control component, comprising: First substrate; The first electrode is disposed above the first substrate; The second substrate is disposed above the first substrate; The second electrode is disposed below the second substrate; A light conversion unit is disposed between the first electrode and the second electrode; as well as An adhesive layer is disposed between the first electrode and the light conversion unit. The second substrate includes at least one hole passing through the second substrate and the second electrode. An electrode connection portion that connects to the side surface of the second electrode is provided inside the hole. The second substrate includes an opening region formed by removing at least a portion of the second substrate in the thickness direction from one side of the second substrate, and a protrusion protruding from one side of the second substrate through the opening region. The hole is provided on the protrusion of the second substrate, and The first electrode is exposed by removing the adhesive layer from a region on the first substrate corresponding to the opening region.
2. The optical path control component according to claim 1 further includes a buffer layer disposed between the second electrode and the optical conversion unit. wherein The light conversion unit includes a partition wall, a receiving portion, and a base, and The hole passes through the buffer layer and the base.
3. The optical path control member according to claim 2, wherein The electrode connection component is configured to contact the side surface of the second substrate, the side surface of the buffer layer, and the side surface of the base.
4. The optical path control component according to claim 1, wherein The electrode connection portion is configured to be in direct contact with the adhesive layer.
5. The optical path control component according to claim 1, wherein, The electrode connection portion contains a material different from the material of at least one of the first electrode and the second electrode.
6. The optical path control member according to claim 5, wherein The electrode connection portion contains metal paste.
7. The optical path control member according to claim 1, wherein The transmittance of the electrode connection is less than that of at least one of the first electrode and the second electrode.
8. The optical path control component according to claim 1, wherein The electrode connection portion is configured to be spaced apart from the adhesive layer.
9. The optical path control component according to claim 1, wherein, An insulating layer is provided between the electrode connection portion and the adhesive layer.
10. The optical path control member according to claim 1, wherein The upper surface of the electrode connection portion is disposed on the same plane as the upper surface of the second substrate or is disposed below the upper surface of the second substrate.
11. The optical path control member according to claim 1, wherein The second substrate includes a plurality of holes disposed in a plurality of protrusions, and The second substrate includes a first electrode connection portion and a second electrode connection portion disposed in the plurality of holes.
12. The optical path control member according to claim 11, wherein The second substrate includes a first hole disposed in the first protrusion and a second hole disposed in the second protrusion. The first electrode connection portion is disposed in the first hole. The second electrode connection portion is disposed in the second hole, and The depth of the first hole and the depth of the second hole are either equal to or different from each other.
13. The optical path control member according to claim 12, wherein The first hole and the second hole are spaced apart from each other through the opening region.
14. The optical path control member according to claim 12, wherein The first electrode, exposed by removing the adhesive layer, is disposed between the first electrode connection portion and the second electrode connection portion.
15. The optical path control member according to claim 1, wherein The first substrate is disposed in a region corresponding to a portion or all of the opening region.
16. The optical path control member according to claim 1, wherein The upper surface of the electrode connection portion and the upper surface of the second substrate form a step.
17. The optical path control member according to claim 1, wherein The light conversion unit includes a dispersion and light conversion particles dispersed in the dispersion and moved by the application of voltage.
18. A display device, comprising: The panel includes at least one of a display panel and a touch panel; as well as The optical path control component according to claim 1, wherein the optical path control component is disposed above or below the panel.
19. The display device of claim 18, wherein, The panel includes a backlight unit and a liquid crystal display panel. The optical path control component is disposed between the backlight unit and the liquid crystal display panel, and The light emitted from the backlight unit moves from the first substrate to the second substrate.
20. The display device of claim 18, wherein, The panel includes an organic electroluminescent display panel. The optical path control component is disposed above the organic electroluminescent display panel, and The light emitted from the panel moves from the first substrate toward the second substrate.