Cushioning materials, packaging materials and packaging products

Abstract

The present invention relates to a cushioning material, a packaging material and a packaged product. A cushioning material is contained in a packaging box capable of containing an electronic device and cushions external forces applied to the electronic device, and comprises: a holding material having a first plate having a first opening and facing the electronic device and a second plate having a second opening and facing the inner wall surface of the packaging box; and a first cushioning block held between the first plate and the second plate by the holding material, the first cushioning block comprising: a first cushioning portion protruding from the first opening in a first direction from the first plate toward the electronic device and capable of contacting the electronic device; a second cushioning portion protruding from the second opening in a second direction from the second plate toward the inner wall surface and capable of contacting the inner wall surface; and a first connecting portion, disposed between the first plate and the second plate and connecting the first cushioning portion and the second cushioning portion, which is longer than the first opening and the second opening in a first holding direction intersecting the first direction and the second direction.

Description

Technical Field

[0001] The invention relates to a cushioning material, a packaging material and a packaging product. Background Art

[0002] A cushioning material is known that is stored in a packaging box capable of storing an electronic device and is used to cushion external forces applied to the electronic device. For example, Patent Document 1 discloses a technique for holding a corner of a lower end portion of an electronic device using a cushioning material formed by fitting two cushioning members.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2015-209229 Summary of the invention

[0004] However, in the prior art, when an external force is applied to the cushioning material, the two cushioning components constituting the cushioning material may separate. Furthermore, when the two cushioning components constituting the cushioning material separate and cause the cushioning material to decompose, the possibility that the electronic device can no longer be protected by the cushioning material increases.

[0005] In order to solve the above technical problems, the present disclosure relates to a buffer material, characterized in that it is stored in a packaging box capable of storing an electronic device and buffers the external force applied to the electronic device stored in the packaging box, the buffer material comprising: a retaining material, having a first plate and a second plate, the first plate forming a first opening, when the buffer material and the electronic device are stored in the packaging box, the first plate is opposite to the electronic device, the second plate forming a second opening, when the buffer material and the electronic device are stored in the packaging box, the second plate is opposite to the inner wall surface of the packaging box; and a first buffer block, which is retained between the first plate and the second plate by the retaining material, the first buffer block comprising: a first buffer portion, which protrudes from the first opening to a first direction from the first plate toward the electronic device and can contact the electronic device; a second buffer portion, which protrudes from the second opening to a second direction from the second plate toward the inner wall surface of the packaging box and can contact the inner wall surface of the packaging box; and a first connecting portion, which is arranged between the first plate and the second plate and connects the first buffer portion and the second buffer portion, the first connecting portion being longer than the first opening and the second opening in a first retaining direction intersecting the first direction and the second direction.

[0006] In addition, the present disclosure relates to a packaging material, characterized in that it comprises: a packaging box capable of storing an electronic device; and a cushioning material for cushioning an external force applied to the electronic device stored in the packaging box, the cushioning material comprising: a holding material comprising a first plate and a second plate, the first plate having a first opening formed therein, and when the cushioning material and the electronic device are stored in the packaging box, the first plate is opposite to the electronic device, and the second plate having a second opening formed therein, and when the cushioning material and the electronic device are stored in the packaging box, the second plate is opposite to the inner wall surface of the packaging box; and a first buffer block held between the first plate and the second plate by the holding material, the first buffer block having: a first buffer portion protruding from the first opening in a first direction from the first plate toward the electronic device and capable of contacting the electronic device; a second buffer portion protruding from the second opening in a second direction from the second plate toward the inner wall surface of the packaging box and capable of contacting the inner wall surface of the packaging box; and a first connecting portion provided between the first plate and the second plate and connecting the first buffer portion and the second buffer portion, the first connecting portion being longer than the first opening and the second opening in a first holding direction intersecting with the first direction and the second direction.

[0007] In addition, the present disclosure relates to a packaged product, characterized in that it includes: an electronic device; a packaging box capable of storing the electronic device; and a cushioning material for cushioning an external force applied to the electronic device stored in the packaging box, the cushioning material having: a holding material including a first plate and a second plate, the first plate having a first opening formed therein, and when the cushioning material and the electronic device are stored in the packaging box, the first plate is opposite to the electronic device, and the second plate having a second opening formed therein, and when the cushioning material and the electronic device are stored in the packaging box, the second plate is opposite to an inner wall surface of the packaging box; and a first buffer block held between the first plate and the second plate by the holding material, the first buffer block having: a first buffer portion protruding from the first opening in a first direction from the first plate toward the electronic device and capable of contacting the electronic device; a second buffer portion protruding from the second opening in a second direction from the second plate toward the inner wall surface of the packaging box and capable of contacting the inner wall surface of the packaging box; and a first connecting portion provided between the first plate and the second plate and connecting the first buffer portion and the second buffer portion, the first connecting portion being longer than the first opening and the second opening in a first holding direction intersecting the first direction and the second direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1It is an exploded perspective view showing an example of the structure of the packaging material 1 according to the first embodiment of the present disclosure.

[0009] Figure 2 It is a perspective view showing an example of the structure of the cushioning material S.

[0010] Figure 3 It is a cross-sectional view showing an example of the structure of the cushioning material S.

[0011] Figure 4 It is a plan view showing an example of the shape of the plate member HH.

[0012] Figure 5 It is a cross-sectional view showing an example of the structure of the cushioning material SV according to Reference Example 1.

[0013] Figure 6 It is a perspective view showing an example of the structure of the cushioning material SJ according to the second embodiment of the present disclosure.

[0014] Figure 7 It is a cross-sectional view showing an example of the structure of the cushioning material SJ.

[0015] Figure 8 It is a perspective view showing an example of the structure of the cushioning material SW according to Reference Example 2.

[0016] Fig. 9 It is a cross-sectional view showing an example of the structure of the buffer material SW. DETAILED DESCRIPTION

[0017] The following is an explanation of the method for implementing the present disclosure with reference to the accompanying drawings. However, in each figure, the size and scale of each part are appropriately different from the actual one. In addition, the embodiments described below are preferred specific examples of the present disclosure, so various preferred limitations are added technically. However, as long as there is no special record of the intention to limit the present disclosure in the following description, the scope of the present disclosure is not limited to these methods.

[0018] 1. First Implementation

[0019] A first embodiment of the present disclosure will be described below.

[0020] 1.1.Overall overview of packaging products

[0021] The following reference Figure 1 An example of the configuration of the packaging material 1 according to the present embodiment will be described.

[0022] Figure 1 It is an exploded perspective view showing an example of the structure of the packaging material 1.

[0023] like Figure 1As shown, the packaging material 1 stores the electronic device 100. Specifically, the packaging material 1 includes a packaging box 2 capable of storing the electronic device 100 and a plurality of buffer materials S for buffering external forces applied to the electronic device 100 stored in the packaging box 2.

[0024] Here, the electronic device 100 is, for example, a printing device such as an inkjet printer, but in this embodiment, devices other than the printing device such as a television, a refrigerator, a washing machine, a microwave oven, or a personal computer may be used as the electronic device 100 .

[0025] In addition, below, the packaging material 1 and the electronic device 100 housed in the packaging material 1 may be referred to as a “packaged product”.

[0026] like Figure 1 As shown, in this embodiment, it is assumed that the packaging material 1 has four cushioning materials S-1 to S-4. In this embodiment, the electronic device 100 and the four cushioning materials S-1 to S-4 are inserted into the packaging box 2 through the opening 20 of the packaging box 2 and stored in the packaging box 2.

[0027] In the following, for the sake of convenience, a package box coordinate system ΣW fixed to the package box 2 is introduced. The package box coordinate system ΣW is a three-axis coordinate system having a Zw axis extending in the direction from the bottom surface of the package box 2 toward the opening 20, that is, in the +Zw direction, an Xw axis extending in the +Xw direction orthogonal to the +Zw direction, and a Yw axis extending in the +Yw direction orthogonal to the +Zw direction and the +Xw direction. In the following, the opposite direction of the +Xw direction is referred to as the -Xw direction, the opposite direction of the +Yw direction is referred to as the -Yw direction, and the opposite direction of the +Zw direction is referred to as the -Zw direction.

[0028] In addition, hereinafter, a cushioning material coordinate system ΣS fixed to the cushioning material S is introduced. The cushioning material coordinate system ΣS is a three-axis coordinate system having a Zs axis extending in the +Zs direction, an Xs axis extending in the +Xs direction orthogonal to the +Zs direction, and a Ys axis extending in the +Ys direction orthogonal to the +Zs direction and the +Xs direction. hereinafter, the direction opposite to the +Xs direction is referred to as the -Xs direction, the direction opposite to the +Ys direction is referred to as the -Ys direction, and the direction opposite to the +Zs direction is referred to as the -Zs direction.

[0029] like Figure 1As shown, when the electronic device 100 and four cushioning materials S-1 to S-4 are stored in the packaging box 2, the cushioning material S-1 is the cushioning material S that holds the lower end of the electronic device 100 in the -Zw direction of the electronic device 100 and the -Xw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-1 fixed to the cushioning material S-1 is set so that the +Zs direction coincides with the +Zw direction, the +Xs direction coincides with the +Yw direction, and the +Ys direction coincides with the -Xw direction.

[0030] In addition, when the electronic device 100 and the four cushioning materials S-1 to S-4 are stored in the packaging box 2, the cushioning material S-2 is the cushioning material S that holds the lower end of the electronic device 100 in the -Zw direction of the electronic device 100 and the +Xw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-2 fixed to the cushioning material S-2 is set so that the +Zs direction coincides with the +Zw direction, the +Xs direction coincides with the -Yw direction, and the +Ys direction coincides with the +Xw direction.

[0031] In addition, when the electronic device 100 and the four cushioning materials S-1 to S-4 are stored in the packaging box 2, the cushioning material S-3 is the cushioning material S that holds the lower end of the electronic device 100 in the +Zw direction of the electronic device 100 and in the -Xw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-3 fixed to the cushioning material S-3 is set so that the +Zs direction coincides with the -Zw direction, the +Xs direction coincides with the -Yw direction, and the +Ys direction coincides with the -Xw direction.

[0032] In addition, when the electronic device 100 and the four cushioning materials S-1 to S-4 are stored in the packaging box 2, the cushioning material S-4 is a cushioning material S that holds the lower end of the electronic device 100 in the +Zw direction of the electronic device 100 and in the +Xw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-4 fixed to the cushioning material S-4 is set so that the +Zs direction coincides with the -Zw direction, the +Xs direction coincides with the +Yw direction, and the +Ys direction coincides with the -Xw direction.

[0033] 1.2. Overview of cushioning materials

[0034] The following reference Figure 2 and Figure 3 An example of the structure of the cushioning material S according to the present embodiment will be described.

[0035] Figure 2 It is a perspective view showing an example of the structure of the cushioning material S.

[0036] like Figure 2As shown, the buffer material S includes a plurality of buffer blocks R for buffering external force applied to the electronic device 100 and a holding material H for holding the buffer blocks R.

[0037] Among them, the retaining material H has a plate-like portion P1 constituting the side surface of the -Xs side of the buffer material S, a plate-like portion P2 constituting the side surface of the buffer material S, a plate-like portion Pd constituting the back surface of the buffer material S, and a plate-like portion Ph constituting the bottom surface of the buffer material S. More specifically, the plate-like portion P1 is a side surface portion of the buffer material S located at an end portion in the -Xs direction and having the +Xs direction as a normal direction. In addition, the plate-like portion P2 is a side surface portion of the buffer material S located at an end portion in the +Xs direction and having the +Xs direction as a normal direction. In addition, the plate-like portion Pd is a back surface portion of the buffer material S located at an end portion in the +Ys direction and having the +Ys direction as a normal direction. In addition, the plate-like portion Ph is a bottom surface portion of the buffer material S located at an end portion in the -Zs direction and having the +Zs direction as a normal direction. Hereinafter, the plate-shaped portion P1 , the plate-shaped portion P2 , the plate-shaped portion Pd, and the plate-shaped portion Ph are collectively referred to as the plate-shaped portion P in some cases.

[0038] In addition, in this embodiment, the case where the plurality of plate-shaped portions P constituting the holding material H are all made of corrugated paper is assumed as an example.

[0039] like Figure 2 As shown, in this embodiment, it is assumed that the buffer material S has six buffer blocks R, namely, buffer block R1 held by plate-shaped portion P1, buffer block R2 held by plate-shaped portion P2, buffer block R3 and buffer block R4 held by plate-shaped portion Pd, and buffer block Rh1 and buffer block Rh2 held by plate-shaped portion Ph. Here, buffer block R4 is a buffer block R located on the +Xs side of buffer block R3. In addition, buffer block Rh2 is a buffer block R located on the +Xs side of buffer block Rh1.

[0040] It should be noted that in the present embodiment, it is assumed that the buffer block R is formed of a material having lower elasticity than expanded polystyrene.

[0041] In addition, in the present embodiment, it is assumed that, as an example, an object such as paper or clothing containing various fibers such as animal fibers, plant fibers, or chemical fibers is decomposed to obtain fibers contained in the object, and the obtained fibers are processed to form the buffer block R. More specifically, in the present embodiment, it is assumed that the buffer block R is formed by decomposing paper to obtain fibers contained in the paper, and solidifying the obtained fibers.

[0042] As can be seen from the above, in the present embodiment, the cushion block R is formed by obtaining fibers from an object containing fibers such as paper or clothing. That is, in the present embodiment, when an object containing fibers such as paper or clothing is discarded, the object can be reused to form the cushion block R. Therefore, according to the present embodiment, the environmental load involved in the manufacture and disposal of the cushion block R can be suppressed to a small level.

[0043] Figure 3 To show the Figure 2 2 is a cross-sectional view of an example of a cross section of the cushioning material S when the cushioning material S is cut along the line Ee in FIG.

[0044] like Figure 3 As shown, the end portion of the cushioning material S in the -Xs direction, that is, the plate-shaped portion P1 includes a plate member P1-A, a plate member P1-B, and a plate member P1-C.

[0045] The plate member P1-A is a flat plate-shaped member located at the end of the plate-shaped portion P1 in the +Xs direction and having the +Xs direction as the normal direction, and is opposite to the electronic device 100 when the cushioning material S and the electronic device 100 are stored in the packaging box 2. An opening K1-A is formed in the plate member P1-A. It should be noted that in the present embodiment, the plate member P1-A is an example of a "first plate" and the opening K1-A is an example of a "first opening".

[0046] In addition, the plate member P1-B is a flat plate-shaped member located at the end of the plate-shaped portion P1 in the -Xs direction and having the +Xs direction as the normal direction, and is opposite to the packaging box 2 when the cushioning material S and the electronic device 100 are stored in the packaging box 2. An opening K1-B is formed in the plate member P1-B. It should be noted that in the present embodiment, the plate member P1-B is an example of a "second plate", and the opening K1-B is an example of a "second opening".

[0047] The plate member P1-C is a flat plate portion located at the end of the plate-like portion P1 in the +Zs direction and having a normal direction in the +Zs direction, and connects the plate members P1-A and P1-B. In this embodiment, the plate member P1-C is an example of a "first connecting plate".

[0048] like Figure 3As shown, the buffer block R1 is held between the plate member P1-A and the plate member P1-B by the plate-shaped portion P1. Specifically, the buffer block R1 includes a buffer portion QA protruding from an opening K1-A provided in the plate member P1-A in the +Xs direction, a buffer portion QB protruding from an opening K1-B provided in the plate member P1-B in the -Xs direction, and a connecting portion QC provided between the plate member P1-A and the plate member P1-B and connecting the buffer portion QA and the buffer portion QB. It should be noted that, in the present embodiment, the buffer block R1 is an example of a "first buffer block", the buffer portion QA is an example of a "first buffer portion", the buffer portion QB is an example of a "second buffer portion", and the connecting portion QC is an example of a "first connecting portion". In addition, in the present embodiment, the +Xs direction is an example of a "first direction", the -Xs direction is an example of a "second direction", and the +Zs direction is an example of a "first holding direction".

[0049] It should be noted that, hereinafter, the length of the buffer part QA in the +Zs direction is referred to as length LQ-A, the length of the buffer part QB in the +Zs direction is referred to as length LQ-B, and the length of the connecting part QC in the +Zs direction is referred to as length LQ-C. In addition, hereinafter, the length of the opening K1-A in the +Zs direction is referred to as length LK-A, and the length of the opening K1-B in the +Zs direction is referred to as length LK-B. In addition, hereinafter, the length from the plate part P1-C to the buffer part QA in the +Zs direction is referred to as length LQ-At, and the length from the plate part P1-C to the buffer part QB in the +Zs direction is referred to as length LQ-Bt.

[0050] In this embodiment, it is assumed that the length LQ-A is substantially the same as the length LK-A. In addition, in this embodiment, it is assumed that the length LQ-B is substantially the same as the length LK-B. Here, "substantially the same" is a concept that includes not only the case of being completely the same, but also the case of having an error of less than 5% and being considered the same if the error is removed, and the case of having a manufacturing error but being the same in design.

[0051] In addition, in the present embodiment, the length LQ-C is longer than the length LK-A, and the length LQ-C is longer than the length LK-B. That is, in the present embodiment, in the +Zs direction, the connection portion QC is longer than the opening K1-A, and the connection portion QC is longer than the opening K1-B. Therefore, in the present embodiment, the buffer block R1 can be prevented from falling off from the opening K1-A in the +Xs direction, and the buffer block R1 can be prevented from falling off from the opening K1-B in the -Xs direction. It should be noted that in the present embodiment, it is assumed that the buffer block R1 is held by the plate-like portion P1 without using an adhesive. However, the present disclosure is not limited to such a method, and the buffer block R1 can also be fixed to the plate-like portion P1 by an adhesive.

[0052] In addition, hereinafter, the length of the buffer block R1 in the +Xs direction is referred to as a length LR, and the length of the plate member P1 -C in the +Xs direction is referred to as a length LP.

[0053] In this embodiment, the length LR is longer than the length LP. That is, in this embodiment, the buffer block R1 is longer than the plate member P1-C in the +Xs direction. Therefore, in this embodiment, even if an external force is applied to the packaging box 2, the buffer block R1 can buffer the external force, thereby reducing the external force transmitted to the electronic device 100.

[0054] like Figure 3 As shown, the end portion in the +Xs direction of the cushioning material S, that is, the plate-shaped portion P2 includes a plate member P2-A, a plate member P2-B, and a plate member P2-C.

[0055] Among them, the plate component P2-A is a flat plate-shaped component located at the end of the plate-shaped portion P2 in the -Xs direction and with the +Xs direction as the normal direction, and is opposite to the electronic device 100 when the cushioning material S and the electronic device 100 are stored in the packaging box 2. An opening K2-A is formed in the plate component P2-A. In addition, the plate component P2-B is a flat plate-shaped component located at the end of the plate-shaped portion P2 in the +Xs direction and with the +Xs direction as the normal direction, and is opposite to the packaging box 2 when the cushioning material S and the electronic device 100 are stored in the packaging box 2. An opening K2-B is formed in the plate component P2-B. In addition, the plate component P2-C is a flat plate-shaped portion located at the end of the plate-shaped portion P2 in the +Zs direction and with the +Zs direction as the normal direction, and connects the plate component P2-A and the plate component P2-B.

[0056] It should be noted that, in the present embodiment, the plate-like portion P2 has a shape substantially the same as that of the plate-like portion P1. That is, the plate member P2-A has a shape substantially the same as that of the plate member P1-A, the plate member P2-B has a shape substantially the same as that of the plate member P1-B, and the plate member P2-C has a shape substantially the same as that of the plate member P1-C.

[0057] like Figure 3 As shown, the buffer block R2 is held between the plate member P2-A and the plate member P2-B by the plate-shaped portion P2.

[0058] It should be noted that, in the present embodiment, the buffer block R2 is formed of the same material as the buffer block R1 and has substantially the same shape as the buffer block R1. Specifically, the buffer block R2 has a buffer portion QA protruding from an opening K2-A provided in the plate member P2-A in the -Xs direction, a buffer portion QB protruding from an opening K2-B provided in the plate member P2-B in the +Xs direction, and a connection portion QC provided between the plate member P2-A and the plate member P2-B and connecting the buffer portion QA and the buffer portion QB.

[0059] That is, in the present embodiment, in the +Zs direction, the connection portion QC of the buffer block R2 is longer than the opening K2-A, and the connection portion QC of the buffer block R2 is longer than the opening K2-B. Therefore, in the present embodiment, the buffer block R2 can be prevented from falling off from the opening K2-A in the -Xs direction, and the buffer block R2 can be prevented from falling off from the opening K2-B in the +Xs direction.

[0060] like Figure 3 As shown, the end portion in the -Zs direction of the cushioning material S, that is, the plate-shaped portion Ph, includes a plate member Ph-A and a plate member Ph-B.

[0061] The plate member Ph-A is a flat plate-shaped member located at the end of the plate-shaped portion Ph in the +Zs direction and having the +Zs direction as the normal direction, and is opposite to the electronic device 100 when the cushioning material S and the electronic device 100 are stored in the packaging box 2. An opening Kh1-A is formed in the plate member Ph-A. In addition, an opening Kh2-A is formed on the +Xs side of the opening Kh1-A in the plate member Ph-A. It should be noted that, in the present embodiment, the plate member Ph-A is an example of a "third plate" and the opening Kh1-A is an example of a "third opening".

[0062] In addition, the plate member Ph-B is a flat plate-shaped member located at the end of the plate-shaped portion P1 in the -Zs direction and having the +Zs direction as the normal direction, and is opposite to the packaging box 2 when the cushioning material S and the electronic device 100 are stored in the packaging box 2. An opening Kh1-B is formed in the plate member Ph-B. In addition, an opening Kh2-B is formed on the +Xs side of the opening Kh1-B in the plate member Ph-B. It should be noted that, in the present embodiment, the plate member Ph-B is an example of a "fourth plate" and the opening Kh1-B is an example of a "fourth opening".

[0063] like Figure 3As shown, the buffer block Rh1 is held between the plate member Ph-A and the plate member Ph-B by the plate-shaped portion Ph. Specifically, the buffer block Rh1 has a buffer portion Qh-A protruding from an opening Kh1-A provided in the plate member Ph-A in the +Zs direction, a buffer portion Qh-B protruding from an opening Kh1-B provided in the plate member Ph-B in the -Zs direction, and a connecting portion Qh-C provided between the plate member Ph-A and the plate member Ph-B and connecting the buffer portion Qh-A and the buffer portion Qh-B. It should be noted that, in the present embodiment, the buffer block Rh1 is an example of a "second buffer block", the buffer portion Qh-A is an example of a "third buffer portion", the buffer portion Qh-B is an example of a "fourth buffer portion", and the connecting portion Qh-C is an example of a "second connecting portion". In addition, in the present embodiment, the +Zs direction is an example of the “third direction”, the −Zs direction is an example of the “fourth direction”, and the +Xs direction is an example of the “second holding direction”.

[0064] It should be noted that, hereinafter, the length of the buffer part Qh-A in the +Xs direction is referred to as length HQ-A, the length of the buffer part Qh-B in the +Xs direction is referred to as length HQ-B, and the length of the connecting part Qh-C in the +Xs direction is referred to as length HQ-C. In addition, hereinafter, the length of the opening Kh1-A in the +Xs direction is referred to as length HK-A, and the length of the opening Kh1-B in the +Xs direction is referred to as length HK-B. In addition, hereinafter, the length from the end of the connecting part Qh-C in the -Xs direction to the buffer part Qh-A in the +Xs direction is referred to as length HQ-At1, and the length from the end of the connecting part Qh-C in the +Xs direction to the buffer part Qh-A in the +Xs direction is referred to as length HQ-At2. In addition, hereinafter, the length from the end of the connecting part Qh-C in the -Xs direction to the buffer part Qh-B in the +Xs direction is referred to as length HQ-Bt1, and the length from the end of the connecting part Qh-C in the +Xs direction to the buffer part Qh-B in the +Xs direction is referred to as length HQ-Bt2.

[0065] In the present embodiment, it is assumed that the length HQ-A is substantially the same as the length HK-A. In addition, in the present embodiment, it is assumed that the length HQ-B is substantially the same as the length HK-B.

[0066] In addition, in the present embodiment, it is assumed that the length HQ-C is longer than the length HK-A, and the length HQ-C is longer than the length HK-B. That is, in the present embodiment, in the +Xs direction, the connection portion Qh-C is longer than the opening Kh1-A, and the connection portion Qh-C is longer than the opening Kh1-B. Therefore, in the present embodiment, the buffer block Rh1 can be prevented from falling off from the opening Kh1-A in the +Zs direction, and the buffer block Rh1 can be prevented from falling off from the opening Kh1-B in the -Zs direction. It should be noted that in the present embodiment, it is assumed that the buffer block Rh1 is held by the plate-like portion Ph without using an adhesive. However, the present disclosure is not limited to such a method, and the buffer block Rh1 can also be fixed to the plate-like portion Ph by an adhesive.

[0067] In addition, in the present embodiment, at least one of the length HQ-At1 and the length HQ-Bt1 is longer than the length LQ-At and longer than the length LQ-Bt. In other words, in the present embodiment, at least one of the length from the end of the connection part Qh-C in the -Xs direction to the opening Kh1-A in the +Xs direction and the length from the end of the connection part Qh-C in the -Xs direction to the opening Kh1-B in the +Xs direction is longer than the length from the plate part P1-C to the opening K1-A in the +Zs direction and longer than the length from the plate part P1-C to the opening K1-B in the +Zs direction.

[0068] In addition, in the present embodiment, at least one of the length HQ-At2 and the length HQ-Bt2 is longer than the length LQ-At and longer than the length LQ-Bt. In other words, in the present embodiment, at least one of the length from the end of the connection part Qh-C in the +Xs direction to the opening Kh1-A in the +Xs direction and the length from the end of the connection part Qh-C in the +Xs direction to the opening Kh1-B in the +Xs direction is longer than the length from the plate part P1-C to the opening K1-A in the +Zs direction and longer than the length from the plate part P1-C to the opening K1-B in the +Zs direction.

[0069] Therefore, in this embodiment, it is possible to prevent the buffer block Rh1 from being mistakenly set between the plate member P1-A and the plate member P1-B by replacing the buffer block R1, and to prevent the buffer block Rh1 from being mistakenly set between the plate member P2-A and the plate member P2-B by replacing the buffer block R2. That is, in this embodiment, when manufacturing the buffer material S, it is possible to suppress the buffer block Rh1 from being mistakenly set between the buffer block R1 and the buffer block R2.

[0070] In addition, in the present embodiment, at least one of the length LQ-A and the length LQ-B is longer than the length HK-A and longer than the length HK-B. Therefore, in the present embodiment, it is possible to prevent the buffer block R1 from being mistakenly set between the plate member Ph-A and the plate member Ph-B by the buffer block Rh1 instead of the buffer block R1 and to prevent the buffer block R2 from being mistakenly set between the plate member Ph-A and the plate member Ph-B by the buffer block Rh1 instead of the buffer block R2. That is, in the present embodiment, when manufacturing the buffer material S, it is possible to suppress the buffer block Rh1 from being mistakenly set between the buffer block R1 and the buffer block Rh1 or between the buffer block R2 and the buffer block Rh1.

[0071] like Figure 3 As shown, the buffer block Rh2 is held between the plate member Ph-A and the plate member Ph-B by the plate-shaped portion Ph.

[0072] It should be noted that, in the present embodiment, the buffer block Rh2 is formed of the same material as the buffer block Rh1 and has substantially the same shape as the buffer block Rh1. In addition, in the present embodiment, the opening Kh2-A is assumed to be substantially the same shape as the opening Kh1-A, and the opening Kh2-B is assumed to be substantially the same shape as the opening Kh1-B. Furthermore, the buffer block Rh2 has a buffer portion Qh-A protruding from the opening Kh2-A provided in the plate member Ph-A in the +Zs direction, a buffer portion Qh-B protruding from the opening Kh2-B provided in the plate member Ph-B in the -Zs direction, and a connection portion Qh-C provided between the plate member Ph-A and the plate member Ph-B and connecting the buffer portion Qh-A and the buffer portion Qh-B.

[0073] Therefore, in this embodiment, the buffer block Rh2 can be prevented from falling off from the opening Kh2-A in the +Zs direction, and the buffer block Rh2 can be prevented from falling off from the opening Kh2-B in the -Zs direction. It should be noted that in this embodiment, it is assumed that the buffer block Rh2 is held by the plate-shaped portion Ph without using an adhesive. However, the present disclosure is not limited to such a method, and the buffer block Rh2 can also be fixed to the plate-shaped portion Ph by an adhesive.

[0074] In addition, in the present embodiment, at least one of the length from the end of the connection portion Qh-C in the +Xs direction to the opening Kh2-A in the +Xs direction and the length from the end of the connection portion Qh-C in the +Xs direction to the opening Kh2-B in the +Xs direction is longer than the length from the plate member P1-C to the opening K1-A in the +Zs direction, and is longer than the length from the plate member P1-C to the opening K1-B in the +Zs direction. In addition, in the present embodiment, at least one of the length from the end of the connection portion Qh-C in the -Xs direction to the opening Kh2-A in the +Xs direction and the length from the end of the connection portion Qh-C in the -Xs direction to the opening Kh2-B in the +Xs direction is longer than the length from the plate member P1-C to the opening K1-A in the +Zs direction, and is longer than the length from the plate member P1-C to the opening K1-B in the +Zs direction.

[0075] Therefore, in this embodiment, it is possible to prevent the buffer block Rh2 from being mistakenly set between the plate member P1-A and the plate member P1-B instead of the buffer block R1, and to prevent the buffer block Rh2 from being mistakenly set between the plate member P2-A and the plate member P2-B instead of the buffer block R2. That is, in this embodiment, when manufacturing the buffer material S, it is possible to suppress the buffer block Rh2 from being mistakenly set between the buffer block R1 or between the buffer block Rh2 and the buffer block R2.

[0076] In addition, as described above, in the present embodiment, at least one of the length LQ-A and the length LQ-B is longer than the length HK-A and longer than the length HK-B. Therefore, in the present embodiment, it is possible to prevent the buffer block R1 from being mistakenly set between the plate member Ph-A and the plate member Ph-B by the buffer block Rh2, and to prevent the buffer block R2 from being mistakenly set between the plate member Ph-A and the plate member Ph-B by the buffer block Rh2. That is, in the present embodiment, when manufacturing the buffer material S, it is possible to suppress the buffer block Rh2 from being mistakenly set between the plate member Ph-A and the plate member Ph-B.

[0077] 1.3. Maintain the outline of the material

[0078] Figure 4 It is a plan view showing an example of the shape of the flat plate member HH after the holding material H is unfolded.

[0079] In this embodiment, it is assumed that Figure 4 The folding lines θ11 to θ35 are shown as examples. Figure 4 The case where the holding material H is formed of the flat plate member HH is shown as an example. Note that, as described above, in the present embodiment, the case where the flat plate member HH is formed of corrugated paper is assumed as an example.

[0080] like Figure 4As shown, the flat plate component HH has Figure 3 In addition to the plate parts P1-A, P1-B, P1-C, P2-A, P2-B, P2-C, Ph-A and Ph-B described in the specification, there are also plate parts P1-D, P1-E, P2-D, P2-E, Ph-C, Pd-A, Pd-B and Pd-C. It should be noted that in Figure 4 Assume as an example a case where the cushioning material coordinate system ΣS is a coordinate system fixed to the plate member Ph-B and the flat plate member HH can be obtained by developing the holding material H in a state where the cushioning material coordinate system ΣS is fixed to the plate member Ph-B.

[0081] like Figure 4 As shown, plate component P1-D is connected to plate component P1-A via fold line θ11, plate component P1-A is connected to plate component P1-C via fold line θ12, plate component P1-C is connected to plate component P1-B via fold line θ13, and plate component P1-B is connected to plate component P1-E via fold line θ14. In addition, plate component P2-D is connected to plate component P2-A via fold line θ21, plate component P2-A is connected to plate component P2-C via fold line θ22, plate component P2-C is connected to plate component P2-B via fold line θ23, and plate component P2-B is connected to plate component P2-E via fold line θ24. In addition, plate component P1-B is connected to plate component Pd-B via fold line θ15, and plate component P2-B is connected to plate component Pd-B via fold line θ25. In addition, plate part Pd-A is connected to plate part Pd-C via fold line θ31, plate part Pd-C is connected to plate part Pd-B via fold line θ32, plate part Pd-B is connected to plate part Ph-B via fold line θ33, plate part Ph-B is connected to plate part Ph-C via fold line θ34, and plate part Ph-C is connected to plate part Ph-A via fold line θ35.

[0082] It should be noted that, in the present embodiment, the fold line θ11 and the fold line θ21 are mountain folds (the fold line faces outward), and the fold lines other than the fold line θ11 and the fold line θ21 are valley folds (the fold line faces inward). Here, the valley fold line refers to a fold line of a plate member used to bend the two ends of the fold line toward the near front side in the figure, that is, the +Zs direction, with the fold line as the center when the holding material H is formed by the flat plate member HH. In addition, the mountain fold line refers to a fold line of a plate member used to bend the two ends of the fold line toward the inner side in the figure, that is, the -Zs direction, with the fold line as the center when the holding material H is formed by the flat plate member HH.

[0083] like Figure 4As shown, an opening K1-D is formed in the plate part P1-D, an opening K1-A is formed in the plate part P1-A, an opening K1-B is formed in the plate part P1-B, and a protrusion T1-E is formed in the plate part P1-E. In addition, an opening K2-D is formed in the plate part P2-D, an opening K2-A is formed in the plate part P2-A, an opening K2-B is formed in the plate part P2-B, and a protrusion T2-E is formed in the plate part P2-E. In addition, opening K3-A, opening K4-A and opening Kd-G are formed in plate part Pd-A, opening K3-B and opening K4-B are formed in plate part Pd-B, opening Kd1-F, opening Kd2-F and opening Kh-H are formed on the boundary between plate part Pd-B and plate part Ph-B, i.e., on fold line θ33, opening Kh1-B, opening Kh2-B, opening Kh1-E and opening Kh2-E are formed in plate part Ph-B, opening Kh1-A, opening Kh2-A, protrusion Th1-D and protrusion Th2-D are formed in plate part Ph-A. In addition, plate part Pd-A has Figure 4 The protrusion Td-H protrudes in the +Ys direction, and the plate member Ph-A has Figure 4 There are protrusions Th-G, Th1-F and Th2-F protruding in the -Ys direction.

[0084] Then, the flat plate component HH is bent in a mountain fold form along the fold lines θ11 and θ21, and further, the flat plate component HH is bent in a valley fold form along the fold lines θ12 to θ15, θ22 to θ25 and θ31 to θ35, thereby embedding the protrusion Th1-D into the opening K1-D, the protrusion Th2-D into the opening K2-D, the protrusion T1-E into the opening Kh1-E, the protrusion T2-E into the opening Kh2-E, the protrusion Th1-F into the opening Kd1-F, the protrusion Th2-F into the opening Kd2-F, the protrusion Th-G into the opening Kd-G, and the protrusion Td-H into the opening Kh-H. In addition, when the flat plate member HH is bent along the folding line θ11 to θ35, the buffer block R1 is inserted into the opening K1-A and the opening K1-B to hold the buffer block R1 between the plate member P1-A and the plate member P1-B, the buffer block R2 is inserted into the opening K2-A and the opening K2-B to hold the buffer block R2 between the plate member P2-A and the plate member P2-B, and the buffer block R3 is inserted into the opening K3-A and the opening K3-B to hold the buffer block R3 between the plate member Pd-A and the plate member Pd-B. Parts Pd-B, the buffer block R4 is embedded in the opening K4-A and the opening K4-B to hold the buffer block R4 between the plate part Pd-A and the plate part Pd-B, the buffer block Rh1 is embedded in the opening Kh1-A and the opening Kh1-B to hold the buffer block Rh1 between the plate part Ph-A and the plate part Ph-B, and the buffer block Rh2 is embedded in the opening Kh2-A and the opening Kh2-B to hold the buffer block Rh2 between the plate part Ph-A and the plate part Ph-B.

[0085] It should be noted that, in the present embodiment, the buffer blocks R3 and R4 are formed of the same material as the buffer block R1. In addition, the buffer blocks R3 and R4 are formed to suppress the misplacement of the buffer blocks R3 and R4 and the buffer blocks Rh1 and Rh2 when manufacturing the buffer material S, similarly to the buffer blocks R1 and R2. It should be noted that, in the present embodiment, the buffer blocks R3 and R4 have different shapes from the buffer blocks R1 and R2, but may also have the same shape as the buffer blocks R1 and R2.

[0086] 1.4. Reference Example 1

[0087] Figure 5 This is a cross-sectional view showing an example of a cross section of the cushioning material SV according to Reference Example 1.

[0088] like Figure 5 As shown, the cushioning material SV according to Reference Example 1 is different from the cushioning material S according to the first embodiment in that it includes a holding material HV instead of the holding material H, and includes a plurality of cushioning blocks RV instead of the plurality of cushioning blocks R.

[0089] Here, the holding material HV is different from the holding material H according to the first embodiment in that it includes plate-like portions PV1, PV2, and PhV instead of plate-like portions P1, P2, and Ph. In addition, the plurality of buffer blocks RV provided in the buffer material SV include buffer blocks RV1, RV2, RhV1, and RhV2.

[0090] In Reference Example 1, the buffer pad RV is formed of the same material as the buffer pad R according to the first embodiment. In Reference Example 1, the buffer pad RV is attached to the holding material HV by an adhesive.

[0091] It can be seen that in Reference Example 1, the buffer block RV is mounted on the holding material HV by an adhesive. Therefore, in Reference Example 1, when the buffer material SV is decomposed, it is more laborious to remove the buffer block RV from the holding material HV. In addition, in Reference Example 1, when the buffer material SV is decomposed, it is difficult to completely remove the buffer block RV from the holding material HV, and even after the buffer material SV is decomposed, there is a situation where a part of the buffer block RV continues to be attached to the plate-like portion PhV. Therefore, in Reference Example 1, when the buffer block RV is formed of a material different from the holding material HV, the circulability of the buffer material SV becomes lower.

[0092] In contrast, according to the present embodiment, the buffer block R is attached to the holding material H without using an adhesive. Therefore, according to the present embodiment, when the buffer material S is decomposed, the effort of removing the buffer block R from the holding material H can be reduced compared to Reference Example 1. In addition, according to the present embodiment, when the buffer material S is decomposed, it is easy to completely remove the buffer block R from the holding material H, compared to Reference Example 1, so the recyclability of the buffer material S can be improved.

[0093] In addition, as in Reference Example 1, when the external force is buffered by the buffer material SV, the external force applied to the electronic device 100 is buffered not only by the buffer block RV but also by the retaining material HV. Therefore, in Reference Example 1, in order to achieve effective buffering of the external force by the buffer material SV, it is necessary to consider not only the buffering of the external force applied to the electronic device 100 by the buffer block RV but also the buffering of the external force applied to the electronic device 100 by the retaining material HV. That is, in Reference Example 1, it is difficult to accurately suppress the external force applied to the electronic device 100 by the buffer material SV.

[0094] In contrast, according to the present embodiment, when the external force is buffered by the buffer material S, the external force applied to the electronic device 100 is buffered only by the buffer block R. Therefore, in the present embodiment, in order to achieve effective buffering of the external force by the buffer material S, it is sufficient to consider the buffering of the external force applied to the electronic device 100 by the buffer block R, and the design of the buffer material S is easier than in Reference Example 1.

[0095] 1.5. Summary of the First Implementation

[0096] In summary, the cushioning material S involved in the present embodiment is characterized in that it is housed in a packaging box 2 capable of housing an electronic device 100 and cushions the external force applied to the electronic device 100 housed in the packaging box 2, and comprises: a retaining material H, comprising a plate member P1-A having an opening K1-A and facing the electronic device 100 when the cushioning material S and the electronic device 100 are housed in the packaging box 2, and a plate member P1-B having an opening K1-B and facing the inner wall surface of the packaging box 2 when the cushioning material S and the electronic device 100 are housed in the packaging box 2; and a cushioning block R1, which is retained by the retaining material H between the plate member P1-A and the plate member P1-B. 1-B, the buffer block R1 includes: a buffer part QA, which protrudes from the opening K1-A to the +Xs direction from the plate part P1-A toward the electronic device 100 and can contact the electronic device 100; a buffer part QB, which protrudes from the opening K1-B to the -Xs direction from the plate part P1-B toward the inner wall surface of the packaging box 2 and can contact the inner wall surface of the packaging box 2; and a connecting part QC, which is arranged between the plate part P1-A and the plate part P1-B and connects the buffer part QA and the buffer part QB, and the connecting part QC is longer than the opening K1-A and the opening K1-B in the +Zs direction intersecting the +Xs direction and the -Xs direction.

[0097] Therefore, in this embodiment, the buffer block R1 can be prevented from falling off from the opening K1-A in the +Xs direction, and the buffer block R1 can be prevented from falling off from the opening K1-B in the -Xs direction. Therefore, in this embodiment, the state in which the external force applied to the electronic device 100 can be buffered by the buffer block R1 can be maintained, and the possibility of the buffer block R1 no longer being able to protect the electronic device 100 can be suppressed. In addition, in this embodiment, the buffer block R1 can be held between the plate member P1-A and the plate member P1-B by the holding material H without using an adhesive.

[0098] In the present embodiment, the holding member H includes a plate member P1 -C connecting the plate member P1 -A and the plate member P1 -B, and the width of the buffer block R1 in the +Xs direction is larger than the width of the plate member P1 -C.

[0099] Therefore, in the present embodiment, even when an external force is applied to the packaging box 2 , the external force can be buffered by the buffer block R1 , thereby reducing the external force transmitted to the electronic device 100 .

[0100] In addition, the cushioning material S involved in the present embodiment is characterized in that it includes a cushioning block Rh1, the holding material H includes a plate member Ph-A formed with an opening Kh1-A and facing the electronic device 100 when the cushioning material S and the electronic device 100 are stored in the packaging box 2, and a plate member Ph-B formed with an opening Kh1-B and facing the inner wall surface of the packaging box 2 when the cushioning material S and the electronic device 100 are stored in the packaging box 2, and the cushioning block Rh1 includes a cushioning portion Qh-A protruding from the opening Kh1-A in the +Zs direction from the plate member Ph-A toward the electronic device 100 and capable of contacting the electronic device 100, and a cushioning portion Qh-A protruding from the opening Kh1-B in the +Zs direction from the plate member Ph-B toward the packaging box 2. The buffer part Qh-B protrudes in the -Zs direction of the inner wall surface of the packaging box 2 and can contact the inner wall surface of the packaging box 2, and the connecting part Qh-C is arranged between the plate part Ph-A and the plate part Ph-B and connects the buffer part Qh-A and the buffer part Qh-B. The connecting part Qh-C is longer than the opening Kh1-A and the opening Kh1-B in the +Xs direction intersecting the +Zs direction and the -Zs direction. At least one of the length LQ-A of the buffer part QA in the +Zs direction and the length LQ-B of the buffer part QB in the +Zs direction is longer than the length HK-A of the opening Kh1-A in the +Xs direction, and is longer than the length HK-B of the opening Kh1-B in the +Xs direction.

[0101] Therefore, in this embodiment, the buffer block R1 can be prevented from being mistakenly placed between the plate member Ph-A and the plate member Ph-B instead of the buffer block Rh1. That is, in this embodiment, when the buffer material S is manufactured, the buffer block Rh1 and the buffer block R1 can be prevented from being mistakenly placed.

[0102] In addition, the cushioning material S involved in the present embodiment is characterized in that it includes a cushioning block Rh1, the holding material H includes a plate member P1-C connecting the plate member P1-A and the plate member P1-B, a plate member Ph-A having an opening Kh1-A and facing the electronic device 100 when the cushioning material S and the electronic device 100 are accommodated in the packaging box 2, and a plate member Ph-B having an opening Kh1-B and facing the inner wall surface of the packaging box 2 when the cushioning material S and the electronic device 100 are accommodated in the packaging box 2, the cushioning block Rh1 includes a cushioning portion Qh-A protruding from the opening Kh1-A in the +Zs direction from the plate member Ph-A toward the electronic device 100 and capable of contacting the electronic device 100, and a cushioning portion Qh-A protruding from the opening Kh1-B in the -Zs direction from the plate member Ph-B toward the inner wall surface of the packaging box 2 and capable of contacting the packaging box 2 The buffer part Qh-B contacts the inner wall surface, and the connecting part Qh-C is arranged between the plate part Ph-A and the plate part Ph-B and connects the buffer part Qh-A and the buffer part Qh-B, the connecting part Qh-C is longer than the opening Kh1-A and the opening Kh1-B in the +Xs direction intersecting the +Zs direction and the -Zs direction, and at least one of the length HQ-At2 from the end of the connecting part Qh-C in the +Xs direction to the opening Kh1-A in the +Xs direction and the length HQ-Bt2 from the end of the connecting part Qh-C in the +Xs direction to the opening Kh1-B in the +Xs direction is longer than the length LQ-At from the plate part P1-C to the opening K1-A in the +Zs direction, and is longer than the length LQ-Bt from the plate part P1-C to the opening K1-B in the +Zs direction.

[0103] Therefore, in this embodiment, the buffer block Rh1 can be prevented from being mistakenly placed between the plate member P1-A and the plate member P1-B instead of the buffer block R1. That is, in this embodiment, when the buffer material S is manufactured, the buffer block Rh1 and the buffer block R1 can be prevented from being mistakenly placed between the plate member P1-A and the plate member P1-B.

[0104] 2. Second Implementation

[0105] In the following, the second embodiment of the present disclosure will be described. It should be noted that in each embodiment described below, the elements having the same effects and functions as those of the first embodiment will be assigned the same reference numerals as those used in the description of the first embodiment, and their detailed description will be omitted as appropriate.

[0106] 2.1. Overview of cushioning materials

[0107] The following reference Figure 6 and Figure 7 The cushioning material SJ according to this embodiment will be described.

[0108] Figure 62 is a perspective view showing an example of the structure of the cushioning material SJ used for the packaging material according to the second embodiment. Figure 7 To show the Figure 6 1 is a cross-sectional view of an example of a cross section of the cushioning material SJ when the cushioning material SJ is cut along the line Ee in FIG. The packaging material according to the second embodiment is the same as the packaging material 1 according to the first embodiment except that the cushioning material S is replaced with the cushioning material SJ.

[0109] like Figure 6 As shown, the difference between the buffer material S involved in the first embodiment and the buffer material SJ is that the buffer blocks R1, R2, R3 and R4 are replaced with buffer blocks RJ1, RJ2, RJ3 and RJ4. It should be noted that, hereinafter, the buffer blocks RJ1, RJ2, RJ3 and RJ4 are sometimes collectively referred to as buffer blocks RJ.

[0110] In this embodiment, it is assumed that the buffer blocks RJ1, RJ2, RJ3, and RJ4 have the same shape as an example. However, the present disclosure is not limited to such a method, and some of the buffer blocks RJ provided in the buffer material SJ may have a shape different from that of the other buffer blocks RJ. In addition, in this embodiment, it is assumed that the buffer blocks RJ are formed of the same material as the buffer blocks R in the first embodiment as an example.

[0111] Reference below Figure 6 and Figure 7 The buffer block RJ1 is exemplified to explain the buffer block RJ.

[0112] In the present embodiment, the buffer block RJ1 is different from the buffer block R1 in that it has a buffer portion QJ-A instead of the buffer portion QA, and has a buffer portion QJ-B instead of the buffer portion QB. It should be noted that the buffer block RJ1 is another example of the “first buffer block”.

[0113] The buffer portion QJ-A provided in the buffer block RJ1 contacts the electronic device 100 when the electronic device 100 and the buffer material SJ are stored in the packaging box 2. In addition, in the present embodiment, the buffer portion QJ-A provided in the buffer block RJ1 has a plurality of buffer sheets JA stacked in the +Ys direction. It should be noted that the buffer portion QJ-A provided in the buffer block RJ1 is another example of the "first buffer portion".

[0114] As described above, the +Zw direction and the -Zw direction are parallel to the +Zs direction and the -Zs direction. Furthermore, the +Ys direction intersects with the +Zs direction. Therefore, the +Ys direction is a direction intersecting with the -Zw direction, which is the direction in which the electronic device 100 and the cushioning material SJ are inserted into the packaging box 2, and is a direction intersecting with the +Zw direction, which is the direction in which the electronic device 100 and the cushioning material SJ are removed from the packaging box 2.

[0115] In the present embodiment, the buffer sheet JA has a so-called "longitudinal shape" in which the length in the +Zs direction is longer than the length in the +Xs direction and the length in the +Ys direction. In addition, the buffer sheet JA has an inclined surface SL-A. In the present embodiment, in the buffer sheet JA provided in the buffer block RJ1, the inclined surface SL-A is a plane whose normal direction is the direction between the +Xs direction and the +Zs direction.

[0116] When the electronic device 100 and the cushioning material SJ are stored in the packaging box 2, the cushioning portion QJ-B provided in the cushioning block RJ1 contacts the inner wall surface of the packaging box 2. The cushioning portion QJ-B provided in the cushioning block RJ1 is another example of the "second cushioning portion".

[0117] Moreover, in this embodiment, the buffer part QJ-B provided in the buffer block RJ1 has a plurality of buffer sheets JB stacked in the +Ys direction.

[0118] In the present embodiment, the buffer sheet JB has a so-called "longitudinal shape" in which the length in the +Zs direction is longer than the length in the +Xs direction and the length in the +Ys direction. In addition, the buffer sheet JB has an inclined surface SL-B. In the present embodiment, in the buffer sheet JB provided in the buffer block RJ1, the inclined surface SL-B is a plane whose normal direction is the direction between the -Xs direction and the +Zs direction.

[0119] It should be noted that, in the present embodiment, similar to the buffer block RJ1, the buffer block RJ2, the buffer block RJ3 and the buffer block RJ4 respectively include: a buffer portion QJ-A having a plurality of buffer sheets JA, a buffer portion QJ-B having a plurality of buffer sheets JB, and a connecting portion QC. Among them, in the buffer block RJ2, the buffer portion QJ-A is composed of a plurality of buffer sheets JA stacked in the +Ys direction, and the buffer portion QJ-B is composed of a plurality of buffer sheets JB stacked in the +Ys direction. In addition, in the buffer blocks RJ3 and the buffer blocks RJ4, the buffer portion QJ-A is composed of a plurality of buffer sheets JA stacked in the +Xs direction, and the buffer portion QJ-B is composed of a plurality of buffer sheets JB stacked in the +Xs direction. It should be noted that the +Xs direction intersects with the direction in which the electronic device 100 and the cushioning material SJ are inserted into the packaging box 2, i.e., the -Zw direction, and intersects with the direction in which the electronic device 100 and the cushioning material SJ are removed from the packaging box 2, i.e., the +Zw direction.

[0120] 2.2. Reference Example 2

[0121] The following reference Figure 8 and Fig. 9 The cushioning material SW according to Reference Example 2 will be described.

[0122] Figure 8 1 is a perspective view showing an example of the structure of the cushioning material SW used for the packaging material involved in Reference Example 2. Fig. 9 To show the Figure 8 1 is a cross-sectional view of an example of a cross section of the cushioning material SW when the cushioning material SW is cut along the line Ee in FIG. The packaging material according to Reference Example 2 is different from the packaging material according to the second embodiment in that the cushioning material SW is provided instead of the cushioning material SJ.

[0123] like Figure 8 As shown, the difference between the buffer material SW and the buffer material SJ involved in the second embodiment is that the buffer blocks RJ1, RJ2, RJ3 and RJ4 are replaced with buffer blocks RW1, RW2, RW3 and RW4. Hereinafter, the buffer blocks RW1, RW2, RW3 and RW4 are sometimes collectively referred to as buffer blocks RW. In addition, in Reference Example 2, it is assumed that the buffer blocks RW1, RW2, RW3 and RW4 have the same shape as an example.

[0124] In the following, refer to Figure 8 and Fig. 9 The buffer block RW1 is exemplified to explain the buffer block RW.

[0125] In the present embodiment, the buffer block RW1 is different from the buffer block RJ1 in that the buffer block RW1 has a buffer portion QW-A instead of the buffer portion QJ-A and has a buffer portion QW-B instead of the buffer portion QJ-B.

[0126] The buffer portion QW-A provided in the buffer block RW1 contacts the electronic device 100 when the electronic device 100 and the buffer material SW are stored in the packaging box 2. In addition, in the present embodiment, the buffer portion QW-A provided in the buffer block RW1 has a plurality of buffer sheets WA stacked in the +Zs direction. In the present embodiment, the buffer sheet WA provided in the buffer block RW1 has a so-called "horizontally wide shape" in which the length in the +Ys direction is longer than the length in the +Xs direction and the length in the +Zs direction.

[0127] The buffer portion QW-B provided in the buffer block RW1 contacts the inner wall surface of the packaging box 2 when the electronic device 100 and the buffer material SW are stored in the packaging box 2. In addition, in the present embodiment, the buffer portion QW-B provided in the buffer block RW1 includes a plurality of buffer sheets WB stacked in the +Zs direction. In the present embodiment, the buffer sheet WB provided in the buffer block RW1 has a so-called "horizontally wide shape" in which the length in the +Ys direction is longer than the length in the +Xs direction and the length in the +Zs direction.

[0128] It should be noted that in reference example 2, similar to buffer block RW1, buffer block RW2, buffer block RW3 and buffer block RW4 respectively include: a buffer portion QW-A having a plurality of buffer sheets WA stacked in the +Zs direction, a buffer portion QW-B having a plurality of buffer sheets WB stacked in the +Zs direction, and a connecting portion QC.

[0129] like Fig. 9 As shown, when the electronic device 100 is inserted into the packaging material involved in Reference Example 2, the electronic device 100 moving in the -Zs direction contacts the buffer portion QW-A in the buffer block RW of the buffer material SW included in the packaging material involved in Reference Example 2. As a result, Fig. 9 As shown in the area Ar1 of FIG. 1 , the electronic device 100 may stop at the end of the buffer portion QW-A on the +Zs side, making it impossible to store the electronic device 100 in the packaging material. Fig. 9As shown in the region Ar2 of FIG. 1 , the electronic device 100 moving in the -Zs direction applies a strong force to the buffer sheet WA at the end of the buffer portion QW-A in the +Zs direction, which may cause the buffer sheet WA to peel off from the buffer block RW. In addition, when the buffer material SW is inserted into the packaging box 2, a part of the plurality of buffer sheets WB constituting the buffer portion QW-B in the buffer block RW may peel off from the buffer block RW due to the friction generated between the packaging box 2 and the buffer material SW.

[0130] In contrast, according to the present embodiment, when the electronic device 100 is inserted into the packaging material, the electronic device 100 advancing in the -Zs direction contacts the buffer portion QJ-A in the buffer block RJ of the buffer material SJ included in the packaging material according to the second embodiment. In each buffer sheet JA constituting the buffer portion QJ-A, an inclined surface SL-A is provided at the end in the +Zs direction. Therefore, according to the present embodiment, compared with Reference Example 2, the possibility that the electronic device 100 advancing in the -Zs direction stops at the end on the +Zs side of the buffer portion QJ-A can be reduced. In addition, according to the present embodiment, the buffer portion QJ-A has a buffer sheet JA with the +Zs direction as the long side direction instead of the buffer sheet WA with the +Ys direction as the long side direction. Therefore, according to the present embodiment, compared with Reference Example 2, the possibility that the buffer sheet JA is peeled off from the buffer block RJ due to the influence of the electronic device 100 advancing in the -Zs direction can be reduced. Moreover, according to the present embodiment, the buffer portion QJ-B has a buffer sheet JB having a long side direction in the +Zs direction, rather than a buffer sheet WB having a long side direction in the +Ys direction. Therefore, according to the present embodiment, compared with Reference Example 2, the possibility of the buffer sheet JB being peeled off from the buffer block RJ due to the influence of the friction generated between the packaging box 2 and the buffer material SJ can be reduced.

[0131] 2.3. Summary of the Second Implementation

[0132] In summary, the packaging material involved in this embodiment is characterized in that it has: a packaging box 2, which can accommodate an electronic device 100; and a cushioning material SJ, which is accommodated in the packaging box 2 and contacts the electronic device 100 accommodated in the packaging box 2 to cushion the external force applied to the electronic device 100, and the cushioning material SJ includes a plurality of cushioning sheets JA stacked along the +Ys direction that intersects with the direction in which the electronic device 100 is inserted into the packaging box 2, that is, the -Zs direction.

[0133] Therefore, in the present embodiment, compared with a configuration in which the buffer sheet JA is stacked in the +Zs direction, the possibility of the buffer sheet JA being separated from the buffer material SJ can be reduced.

[0134] Moreover, in the packaging material according to the present embodiment, it is characterized in that the buffer sheet JA is provided with an inclined surface SL-A at an end portion in the +Zs direction opposite to the -Zs direction.

[0135] Therefore, in the present embodiment, the possibility that the electronic device 100 stops at the end of the buffer sheet JA in the +Zs direction can be reduced.

[0136] In addition, in the packaging material involved in the present embodiment, it is characterized in that the cushioning material SJ includes: a retaining material H, which includes a plate part P1-A formed with an opening K1-A and opposite to the electronic device 100 when the cushioning material SJ and the electronic device 100 are stored in the packaging box 2, and a plate part P1-B formed with an opening K1-B and opposite to the inner wall surface of the packaging box 2 when the cushioning material SJ and the electronic device 100 are stored in the packaging box 2; and a cushioning block RJ1, which is retained by the retaining material H between the plate part P1-A and the plate part P1-B, and the cushioning block RJ1 is composed of a plurality of cushioning sheets JA and has The opening K1-A includes a buffer portion QJ-A that protrudes from the plate part P1-A in the +Xs direction toward the electronic device 100 and can contact the electronic device 100, a buffer portion QJ-B that protrudes from the opening K1-B in the -Xs direction from the plate part P1-B toward the inner wall surface of the packaging box 2 and can contact the inner wall surface of the packaging box 2, and a connecting portion QC that is arranged between the plate part P1-A and the plate part P1-B and connects the buffer portion QJ-A and the buffer portion QJ-B. The connecting portion QC is longer than the opening K1-A and the opening K1-B in the +Zs direction intersecting the +Xs direction and the -Xs direction.

[0137] Therefore, in this embodiment, the buffer block RJ1 can be prevented from falling off from the opening K1-A in the +Xs direction, and the buffer block RJ1 can be prevented from falling off from the opening K1-B in the -Xs direction. In addition, in this embodiment, the buffer block RJ1 can be held between the plate member P1-A and the plate member P1-B by the holding material H without using an adhesive.

[0138] In the present embodiment, the holding member H includes a plate member P1-C connecting the plate member P1-A and the plate member P1-B, and the width of the buffer block RJ1 in the +Xs direction is larger than the width of the plate member P1-C.

[0139] Therefore, in the present embodiment, even when an external force is applied to the packaging box 2 , the external force can be buffered by the buffer block RJ1 , and the external force transmitted to the electronic device 100 can be weakened.

[0140] In addition, in the present embodiment, it is characterized in that the cushioning material SJ includes a cushioning block Rh1, the retaining material H includes a plate member Ph-A having an opening Kh1-A and facing the electronic device 100 when the cushioning material SJ and the electronic device 100 are accommodated in the packaging box 2, and a plate member Ph-B having an opening Kh1-B and facing the inner wall surface of the packaging box 2 when the cushioning material SJ and the electronic device 100 are accommodated in the packaging box 2, and the cushioning block Rh1 includes a cushioning portion Qh-A protruding from the opening Kh1-A in the +Zs direction from the plate member Ph-A toward the electronic device 100 and capable of contacting the electronic device 100, and a cushioning portion Qh-A protruding from the opening Kh1-B in the +Zs direction from the plate member Ph-B toward the packaging box 2 The buffer part Qh-B protrudes in the -Zs direction of the inner wall surface of the packaging box 2 and can contact the inner wall surface of the packaging box 2, and the connecting part Qh-C is arranged between the plate part Ph-A and the plate part Ph-B and connects the buffer part Qh-A and the buffer part Qh-B. The connecting part Qh-C is longer than the opening Kh1-A and the opening Kh1-B in the +Xs direction intersecting the +Zs direction and the -Zs direction. At least one of the length LQ-A of the buffer part QJ-A in the +Zs direction and the length LQ-B of the buffer part QJ-B in the +Zs direction is longer than the length HK-A of the opening Kh1-A in the +Xs direction, and is longer than the length HK-B of the opening Kh1-B in the +Xs direction.

[0141] Therefore, in this embodiment, the buffer block RJ1 can be prevented from being mistakenly placed between the plate member Ph-A and the plate member Ph-B instead of the buffer block Rh1. That is, in this embodiment, when manufacturing the buffer material SJ, the buffer block Rh1 and the buffer block RJ1 can be prevented from being mistakenly placed.

[0142] In addition, in the present embodiment, it is characterized in that the cushioning material SJ includes a cushioning block Rh1, the retaining material H includes a plate part P1-C connecting the plate part P1-A and the plate part P1-B, a plate part Ph-A having an opening Kh1-A and facing the electronic device 100 when the cushioning material SJ and the electronic device 100 are accommodated in the packaging box 2, and a plate part Ph-B having an opening Kh1-B and facing the inner wall surface of the packaging box 2 when the cushioning material SJ and the electronic device 100 are accommodated in the packaging box 2, the cushioning block Rh1 includes a cushioning portion Qh-A protruding from the opening Kh1-A in the +Zs direction from the plate part Ph-A toward the electronic device 100 and capable of contacting the electronic device 100, and a cushioning portion Qh-A protruding from the opening Kh1-B in the -Zs direction from the plate part Ph-B toward the inner wall surface of the packaging box 2 and capable of contacting the packaging box The buffer part Qh-B in contact with the inner wall surface of the box 2, and the connecting part Qh-C arranged between the plate part Ph-A and the plate part Ph-B and connecting the buffer part Qh-A and the buffer part Qh-B, the connecting part Qh-C is longer than the opening Kh1-A and the opening Kh1-B in the +Xs direction intersecting the +Zs direction and the -Zs direction, and at least one of the length HQ-At2 from the end of the connecting part Qh-C in the +Xs direction to the opening Kh1-A in the +Xs direction and the length HQ-Bt2 from the end of the connecting part Qh-C in the +Xs direction to the opening Kh1-B in the +Xs direction is longer than the length LQ-At from the plate part P1-C to the opening K1-A in the +Zs direction, and is longer than the length LQ-Bt from the plate part P1-C to the opening K1-B in the +Zs direction.

[0143] Therefore, in this embodiment, the buffer block Rh1 can be prevented from being mistakenly provided between the plate member P1-A and the plate member P1-B instead of the buffer block RJ1. That is, in this embodiment, when manufacturing the buffer material SJ, the buffer block Rh1 and the buffer block RJ1 can be prevented from being mistakenly provided.

[0144] 3. Modifications

[0145] The above methods can be modified in many ways. Specific modification methods are exemplified below. Two or more methods selected from the following examples can be appropriately combined within the scope of non-contradiction. It should be noted that in the modification examples exemplified below, the elements with the same effects and functions as those in the implementation methods will be transferred to the figure marks referenced in the above description and their detailed descriptions will be appropriately omitted.

[0146] 3.1. Modification 1

[0147] In the second embodiment, the buffer block RJ includes a buffer portion QJ-A formed of a plurality of buffer sheets JA, a buffer portion QJ-B formed of a plurality of buffer sheets JB, and a connecting portion QC, but the present disclosure is not limited to such a mode. That is, the buffer block RJ only needs to be a buffer block having at least the buffer portion QJ-A. For example, the buffer block RJ may have a buffer portion QB instead of the buffer portion QJ-B.

[0148] 3.2. Modification 2

[0149] In the first and second embodiments and the first modification, the Xw axis, Yw axis, and Zw axis of the package box coordinate system ΣW are orthogonal to each other, but the present disclosure is not limited to such a method. The Xw axis, Yw axis, and Zw axis of the package box coordinate system ΣW may be axes extending in different directions.

[0150] In the first and second embodiments and the first modification, the Xs axis, Ys axis, and Zs axis of the cushioning material coordinate system ΣS are orthogonal to each other, but the present disclosure is not limited to such a mode. The Xs axis, Ys axis, and Zs axis of the cushioning material coordinate system ΣS may be axes extending in different directions.

[0151] 3.3. Modification 3

[0152] In the first and second embodiments and Modifications 1 and 2, the packaging material is exemplified as having four cushioning materials S or cushioning materials SJ, but the present disclosure is not limited to such a mode. The packaging material involved in the present disclosure may be a packaging material having one or more and three or less cushioning materials S or cushioning materials SJ, or may be a packaging material having five or more cushioning materials S or cushioning materials SJ.

Claims

1. A cushioning material, characterized in that: The cushioning material is housed in a packaging box capable of housing the electronic device, and cushions external force applied to the electronic device housed in the packaging box. The buffer material has: A holding material including a first plate and a second plate, wherein the first plate is formed with a first opening, and when the cushioning material and the electronic device are stored in the packaging box, the first plate is opposite to the electronic device, and the second plate is formed with a second opening, and when the cushioning material and the electronic device are stored in the packaging box, the second plate is opposite to the inner wall surface of the packaging box; and a first buffer block, held between the first plate and the second plate by the holding material, The first buffer block comprises: a first buffer portion protruding from the first opening in a first direction from the first plate toward the electronic device and capable of contacting the electronic device; a second buffer portion, protruding from the second opening in a second direction from the second plate toward the inner wall surface of the packaging box and capable of contacting the inner wall surface of the packaging box; as well as a first connecting portion, disposed between the first plate and the second plate, and connecting the first buffer portion and the second buffer portion, The first connecting portion is longer than the first opening and the second opening in a first holding direction intersecting the first direction and the second direction, The first connecting portion is longer than both the first buffer portion and the second buffer portion in a first holding direction intersecting the first direction and the second direction.

2. The cushioning material according to claim 1, characterized in that: The holding material includes a first connecting plate connecting the first plate and the second plate. In the first direction, a width of the first buffer block is greater than a width of the first connecting plate.

3. The cushioning material according to claim 1 or 2, characterized in that: The buffer material has a second buffer block, The retaining material comprises: a third plate having a third opening formed thereon, wherein when the cushioning material and the electronic device are stored in the packaging box, the third plate is opposite to the electronic device; as well as The fourth plate is formed with a fourth opening, and when the cushioning material and the electronic device are stored in the packaging box, the fourth plate is opposite to the inner wall surface of the packaging box, The second buffer block comprises: a third buffer portion, protruding from the third opening in a third direction from the third plate toward the electronic device and capable of contacting the electronic device; a fourth buffer portion, which protrudes from the fourth opening in a fourth direction from the fourth plate toward the inner wall surface of the packaging box and is capable of contacting the inner wall surface of the packaging box; as well as a second connecting portion, disposed between the third plate and the fourth plate, and connecting the third buffer portion and the fourth buffer portion, The second connecting portion is longer than the third opening and the fourth opening in a second holding direction intersecting the third direction and the fourth direction, At least one of a length of the first buffer portion in the first holding direction and a length of the second buffer portion in the first holding direction is longer than a length of the third opening in the second holding direction and longer than a length of the fourth opening in the second holding direction.

4. The cushioning material according to claim 1 or 2, characterized in that: The buffer material has a second buffer block, The retaining material comprises: a first connecting plate, connecting the first plate and the second plate; a third plate having a third opening formed thereon, wherein when the cushioning material and the electronic device are stored in the packaging box, the third plate is opposite to the electronic device; as well as The fourth plate is formed with a fourth opening, and when the cushioning material and the electronic device are stored in the packaging box, the fourth plate is opposite to the inner wall surface of the packaging box, The second buffer block comprises: a third buffer portion, protruding from the third opening in a third direction from the third plate toward the electronic device and capable of contacting the electronic device; a fourth buffer portion, which protrudes from the fourth opening in a fourth direction from the fourth plate toward the inner wall surface of the packaging box and is capable of contacting the inner wall surface of the packaging box; as well as a second connecting portion, disposed between the third plate and the fourth plate, and connecting the third buffer portion and the fourth buffer portion, The second connecting portion is longer than the third opening and the fourth opening in a second holding direction intersecting the third direction and the fourth direction, At least one of the length from the end of the second connecting part in the second holding direction to the third opening in the second holding direction and the length from the end of the second connecting part in the second holding direction to the fourth opening in the second holding direction is longer than the length from the first connecting plate to the first opening in the first holding direction, and longer than the length from the first connecting plate to the second opening in the first holding direction.

5. A packaging material, characterized in that: have: A packaging box capable of storing electronic equipment; and a cushioning material for cushioning external force applied to the electronic device housed in the packaging box, The buffer material has: A holding material including a first plate and a second plate, wherein the first plate is formed with a first opening, and when the cushioning material and the electronic device are stored in the packaging box, the first plate is opposite to the electronic device, and the second plate is formed with a second opening, and when the cushioning material and the electronic device are stored in the packaging box, the second plate is opposite to the inner wall surface of the packaging box; and a first buffer block, held between the first plate and the second plate by the holding material, The first buffer block comprises: a first buffer portion protruding from the first opening in a first direction from the first plate toward the electronic device and capable of contacting the electronic device; a second buffer portion, protruding from the second opening in a second direction from the second plate toward the inner wall surface of the packaging box and capable of contacting the inner wall surface of the packaging box; as well as a first connecting portion, disposed between the first plate and the second plate, and connecting the first buffer portion and the second buffer portion, The first connecting portion is longer than the first opening and the second opening in a first holding direction intersecting the first direction and the second direction, The first connecting portion is longer than both the first buffer portion and the second buffer portion in a first holding direction intersecting the first direction and the second direction.

6. A packaged product, characterized in that: have: Electronic equipment; a packaging box capable of storing the electronic device; and a cushioning material for cushioning external force applied to the electronic device housed in the packaging box, The buffer material has: A holding material including a first plate and a second plate, wherein the first plate has a first opening formed therein, and when the cushioning material and the electronic device are stored in the packaging box, the first plate faces the electronic device, and the second plate has a second opening formed therein, and when the cushioning material and the electronic device are stored in the packaging box, the second plate faces the inner wall surface of the packaging box; and a first buffer block, held between the first plate and the second plate by the holding material, The first buffer block comprises: a first buffer portion protruding from the first opening in a first direction from the first plate toward the electronic device and capable of contacting the electronic device; a second buffer portion, protruding from the second opening in a second direction from the second plate toward the inner wall surface of the packaging box and capable of contacting the inner wall surface of the packaging box; as well as a first connecting portion, disposed between the first plate and the second plate, and connecting the first buffer portion and the second buffer portion, The first connecting portion is longer than the first opening and the second opening in a first holding direction intersecting the first direction and the second direction, The first connecting portion is longer than both the first buffer portion and the second buffer portion in a first holding direction intersecting the first direction and the second direction.

Images