Method and apparatus for communication

Abstract

Embodiments of the present disclosure relate to techniques for gap-based feedback measurement in new radio wireless cellular networks. Embodiments of the present disclosure provide techniques for determining a synchronization signal (SS) / physical broadcast channel (PBCH) block (SSB)-based measurement timing configuration (SMTC) of measurement objects for which a user equipment is to measure its feedback information in one or more measurement gaps. Other embodiments are also described and claimed.

Description

[0001] This application is a divisional application of the invention patent application filed on August 8, 2019, with Chinese national application number 201980053689.5 and entitled "Technology for Gap-Based Feedback Measurement in New Radio Cellular Networks". Technical Field

[0002] The embodiments of the present invention relate to the field of wireless communication technology. Background Technology

[0003] In New Radio (NR) wireless communication networks, User Equipment (UE) measures feedback information about a measurement object (e.g., a cell) and provides this feedback information to the network. Each measurement object may have a different Measurement Timing Configuration (SMTC) based on Synchronization Signal (SS) / Physical Broadcast Channel (PBCH) Block (SSB), including different SMTC periods. Furthermore, different measurement objects may or may not completely overlap with the UE's measurement intervals or associated NR frequency ranges. Attached Figure Description

[0004] The embodiments will be more readily understood through the following detailed description in conjunction with the accompanying drawings. For the sake of this description, similar reference numerals denote similar structural elements. In the figures of the accompanying drawings, embodiments are shown by way of example rather than limitation.

[0005] Figure 1 A network according to some implementation schemes is shown.

[0006] Figure 2 The operational flow / algorithm structure according to some implementation schemes is shown.

[0007] Figure 3 The operational flow / algorithm structure according to some implementation schemes is shown.

[0008] Figure 4 The operational flow / algorithm structure according to some implementation schemes is shown.

[0009] Figure 5 The operational flow / algorithm structure according to some implementation schemes is shown.

[0010] Figure 6 Examples of infrastructure equipment according to various implementation schemes are shown.

[0011] Figure 7 Exemplary components of a computer platform or device according to various implementation schemes are depicted.

[0012] Figure 8 Exemplary components of baseband circuits and radio frequency modules according to various implementation schemes are depicted.

[0013] Figure 9 This is a block diagram illustrating components capable of reading instructions from a machine-readable medium or a computer-readable medium (e.g., a non-transitory machine-readable storage medium) and performing any or more of the methods discussed herein, according to some exemplary embodiments. Detailed Implementation

[0014] The following detailed description relates to the accompanying drawings. The same reference numerals may be used in different drawings to identify the same or similar elements. In the following description, specific details, such as particular structures, architectures, interfaces, technologies, etc., are set forth for illustrative and non-limiting purposes to provide a thorough understanding of various aspects of the various embodiments. However, it will be apparent to those skilled in the art that various aspects of the various embodiments may be practiced in other examples departing from these specific details. In some cases, descriptions of well-known devices, circuits, and methods have been omitted so as not to obscure the description of the various embodiments with unnecessary detail. For the purposes of this document, the phrases “A or B” and “A / B” refer to (A), (B), or (A and B).

[0015] Figure 1 A network 100 according to some embodiments is illustrated. Generally, the components shown in network 100 may be similar to and substantially interchangeable with the components of the same name in other figures described herein. Network 100 may include UE 104 to communicate with base station 108 of radio access network (RAN) 112 using one or more radio access technologies.

[0016] Base station 108 may be referred to as a base station (“BS”), NodeB, evolved NodeB (“eNB”), next-generation NodeB (“gNB”), RAN node, roadside unit (“RSU”), etc., and may include ground stations (e.g., terrestrial access points) or satellite stations providing coverage within a geographic area (e.g., a cell). RSU may refer to any transport infrastructure entity in or implemented by a gNB / eNB / RAN node or a stationary (or relatively stationary) UE, wherein an RSU in or implemented by a UE may be referred to as a “UE-type RSU”, and an RSU in or implemented by a gNB may be referred to as a “gNB-type RSU”.

[0017] In some implementations, the RAN can be a next-generation (“NG”) radio access network (“RAN”), in which case base station 108 can be a gNB that communicates with UE 104 using new radio (“NR”) access technology. Therefore, RAN 112 can be an NR wireless cellular network.

[0018] UE 104 can be any mobile or non-mobile computing device capable of connecting to one or more cellular networks. For example, UE 104 can be a smartphone, laptop computer, desktop computer, in-vehicle computer, smart sensor, etc. In some embodiments, UE 104 can be an Internet of Things (“IoT”) UE, which may include a network access layer designed to utilize low-power IoT applications with ephemeral UE connectivity. IoT UEs can exchange data with MTC servers or devices via technologies such as machine-to-machine (“M2M”) or machine-type communication (“MTC”), via a public terrestrial mobile network (“PLMN”), proximity-based service (“ProSe”), or device-to-device (“D2D”) communication, sensor networks, or IoT networks. M2M or MTC data exchange can be machine-initiated data exchange. An IoT network describes interconnected IoT UEs, which may include uniquely identifiable embedded computing devices (within the Internet infrastructure) with ephemeral connectivity. IoT UEs may execute background applications (e.g., keeping track of activity messages, status updates, etc.) to facilitate connectivity within the IoT network.

[0019] According to some implementations, UE 104 can be configured to communicate with base station 108 on a multi-carrier communication channel using orthogonal frequency division multiplexing (“OFDM”) communication signals according to various communication technologies, such as, but not limited to, orthogonal frequency division multiple access (“OFDMA”) communication technology (e.g., for downlink communication) or single-carrier frequency division multiple access (“SC-FDMA”) communication technology (e.g., for uplink or sidelink communication), but the scope of the implementation is not limited in this respect. The OFDM signal may include multiple orthogonal subcarriers.

[0020] In some implementations, the downlink resource grid can be used for downlink transmission from base station 108 to UE 104, while uplink transmission can utilize similar techniques. The grid can be a time-frequency grid, referred to as a resource grid or time-frequency resource grid, which represents the physical resources in the downlink within each time slot. This time-frequency plane representation is common practice for OFDM systems, making radio resource allocation intuitive. Each column and row of the resource grid corresponds to an OFDM symbol and an OFDM subcarrier, respectively. The duration of the resource grid in the time domain corresponds to a time slot in a radio frame. The smallest time-frequency unit in the resource grid is represented as a resource element. Each resource grid comprises multiple resource blocks, which describe the mapping of certain physical channels to resource elements. Each resource block comprises a set of resource elements. In the frequency domain, this can represent the minimum amount of resources currently available for allocation. Such resource blocks are used to transmit several different physical channels.

[0021] In various implementations, UE 104 may be configured with measurement gaps. During these gaps, UE 104 may not be expected to transmit or receive signals from gNB 108 on the serving cell. Instead, UE 104 may measure feedback information about one or more measurement objects (e.g., other cells) during the measurement gaps. In some implementations, the feedback information may include one or more of Received Signal Received Power (RSRP), Received Signal Received Quality (RSRQ), or Signal-to-Interference-plus-Noise Ratio (SINR). Feedback information may also be measured about one or more reference signals transmitted by the respective measurement object. For example, in some implementations, the reference signal may include a Synchronization Signal (SS) / Physical Broadcast Channel (PBCH) block (SSB). In such implementations, the feedback information may include, for example, SSB-RSRP, SSB-RSRQ, and / or SSB-SINR.

[0022] In various implementations, UE 104 can transmit feedback information to gNB 108. For example, gNB 108 can use the feedback information to determine whether to hand over UE 104 to a new serving cell.

[0023] UE 104 may receive a measurement gap configuration (e.g., from gNB 108) that indicates the time / frequency resources to be used for a measurement gap instance. For example, the measurement gap configuration may include the period and duration of the measurement gap. The measurement gap may be per UE or per frequency range (FR) (e.g., separate measurement gaps for NR frequency range 1 (FR1) and NR frequency range 2 (FR2)).

[0024] In various implementations, gNB 108 may send configuration information to UE 104 to instruct UE 104 to perform an SSB-based Measurement Timing Configuration (SMTC) for the corresponding measurement object whose feedback information it wants to measure. The SMTC may include, for example, the period and / or duration of an SSB instance (also referred to as an SMTC instance). In some implementations, the SMTC may be configured by the measObjectNR information element transmitted by gNB 108 to UE 104 (e.g., in downlink control information (DCI)).

[0025] The SMTC of the measured object can completely overlap, partially overlap, or not overlap with the measurement gap configuration. Complete overlap means that the SSB is transmitted within each measurement gap instance of the measurement gap configuration. For example, the period of the SMTC can be the same as the period of the measurement gap configuration. Partial overlap means that some, but not all, of the SSBs transmitted according to the SMTC occur within the measurement gap instances of the measurement gap configuration. Complete non-overlap means that none of the SSBs transmitted according to the SMTC occur within the measurement gap instances of the measurement gap configuration.

[0026] In various implementations, gNB 108 may restrict the relationship between the SMTC and the measurement gap configuration of the objects for which UE 104 wants to measure feedback information. For example, in a first scenario, all measurement objects for which UE 104 wants to measure feedback information may have SMTCs that completely overlap with the measurement gap configuration (e.g., all measurement objects may have the same SMTC). In some such implementations, gNB 108 may further configure additional measurement objects with SMTCs that do not overlap with the measurement gap configuration. Therefore, if UE 104 wants to measure feedback information about these additional measurement objects, UE 104 must do so outside the measurement gap.

[0027] Alternatively, in a second scenario, gNB 108 may define one or more measurement objects in two groups / groups, where the measurement objects in each group have the same SMTC. For example, the first group of measurement objects may have a first SMTC that fully (or partially) overlaps with the measurement gap configuration, and the second group of measurement objects may have a second SMTC that partially overlaps with the measurement gap configuration. The second SMTC may be different from the first SMTC. The first and second measurement objects may be combined to include all measurement objects for which the UE needs to provide its feedback information based on the measurement gap configuration.

[0028] In the third scenario, all measurement objects can be grouped by SMTC, such that measurement objects within a group have the same SMTC. For a given group, at most one measurement object from another group is allowed to have an SMTC that partially overlaps with the SMTC of the given group.

[0029] As discussed above, in some implementations, a per-FR measurement gap configuration can be used (e.g., a first measurement gap configuration for FR1 frequency carriers and a second measurement gap configuration for FR2 frequency carriers). In these implementations, the above-described techniques can be applied individually to each frequency range.

[0030] In various implementations, the restrictions on the SMTC described herein can facilitate the UE's implementation of feedback mechanisms while also allowing for some flexibility in the network's SMTC determination. In addition, or alternatively, restrictions on the SMTC can facilitate the determination of expected delays (e.g., delay budgets used to provide feedback information).

[0031] For example, gNB 108 and / or UE 104 may determine the expected delay (e.g., delay budget) for providing feedback information about the measured object. For example, the expected delay may correspond to the time period between when feedback information is triggered and when gNB 108 receives feedback information (or when UE 104 transmits feedback information). For example, the expected delay may be determined based on the type of SMTC restriction at the appropriate location (as described herein), the SMTC used, the measurement gap configuration, the amount of the measured object, and / or whether the measurement gap configuration is per UE or per FR.

[0032] For example, gNB 108 can use the determined expected delay to make handover decisions for UE 104 and / or determine the values ​​of one or more timers used for handover decisions. For example, UE 104 can use the determined expected delay to determine resource coordination strategies (e.g., timing / sequence of measurements for different measurement objects).

[0033] In some implementations, the expected delay may include an identification delay for identifying the corresponding measurement object and a measurement delay for measuring feedback information of the corresponding measurement object. Exemplary formulas are provided below for determining the expected delay (e.g., identification delay and / or measurement delay) in various scenarios described above and elsewhere herein. It will be apparent that these formulas may be modified without departing from the scope of this disclosure.

[0034] For example, in the first scenario described above (e.g., all measured objects completely overlap with the measurement gap configuration) and regarding the overlap of measurement gaps per UE, the identification delay can be determined according to the following formula:

[0035]

[0036] in:

[0037] It's a recognition delay;

[0038] K inter-freq,GS It is the scaling factor;

[0039] SMTC i This refers to the SMTC cycle of the measurement objects in this group;

[0040] MGRP is the measurement gap repetition period for this measurement gap configuration;

[0041] N FR1,i It is the number of new radio (NR) frequency range 1 (FR1) carriers among the multiple measurement objects;

[0042] N FR2 It is the number of NR frequency range 2 (FR2) carriers among the multiple measurement objects;

[0043] It is the number of SMTC opportunities used to identify cells on one of the FR1 inter-frequency carriers;

[0044] It is the number of SSBs used to identify the cell on one of the FR2 inter-frequency carriers.

[0045] Alternatively, the measurement delay can be determined according to the following formula:

[0046]

[0047] in:

[0048] It is the measurement delay;

[0049] M measurement_Inter-freq,FR1 It is used to measure the number of SMTC opportunities for cells on one of the FR1 inter-frequency carriers; and

[0050] M measurement_Inter-freq,FR2 It is used to measure the number of SSBs of a cell on one of the FR2 frequency inter-carriers.

[0051] For the first scenario, if the measurement interval per FR is used, the recognition delay of the measured object in FR1 can be determined according to the following formula:

[0052]

[0053] Similarly, the recognition delay of the measured object in FR2 can be determined according to the following formula:

[0054]

[0055] As discussed above, in the second exemplary scenario, the first group of measurement objects may be configured with a first SMTC and the second group of measurement objects may be configured with a second SMTC. The first SMTC may fully or partially overlap with the measurement gap configuration, and the second SMTC may partially overlap with the measurement gap configuration. For each UE measurement gap configuration, the expected delay of feedback information for the individual first group or second group of measurement objects can be determined according to the following formula:

[0056]

[0057] in:

[0058] This is the expected recognition delay;

[0059] This is the expected measurement delay;

[0060] K Inter-freq,GSIt is the scaling factor;

[0061] SMTC i It is the SMTC cycle of the measurement object in the corresponding group;

[0062] MGRP is the measurement gap repetition period of the measurement gap configuration;

[0063] N FR1,i It is the number of new radio (NR) frequency range 1 (FR1) carriers in the frequency range of this group of measurement objects;

[0064] N FR2 It is the number of NR frequency range 2 (FR2) carriers in this group of measurement objects;

[0065] It is the number of SMTC opportunities used to identify cells on one of the FR1 inter-frequency carriers;

[0066] It is the number of SSBs used to identify cells on one of the FR2 inter-frequency carriers;

[0067] M measurement_Inter-freq,FR1 It is used to measure the number of SMTC opportunities for cells on one of the FR1 inter-frequency carriers; and

[0068] M measurement_Inter-freq,FR2 It is used to measure the number of SSBs of a cell on one of the FR2 frequency inter-carriers.

[0069] For the per-FR measurement gap configuration in the second scenario, the expected delay of the measurement object of FR1 can be determined according to the following formula:

[0070]

[0071] Similarly, the expected delay of the object being measured for FR2 can be determined according to the following formula:

[0072]

[0073] As discussed above, the third scenario may include grouping all measurement objects by SMTC, such that measurement objects within a group have the same SMTC. For a given group, it is permissible for measurement objects in at most one other group to have an SMTC that partially overlaps with the SMTC of the given group. In some implementations, for a first group (e.g., group i) in a third scenario using per-UE measurement intervals, where a second group (e.g., group j) partially overlaps, the expected delay can be determined according to the following formula:

[0074]

[0075] in:

[0076] This is the expected identification delay of the first group of measurement objects;

[0077] K Inter-freq,GS It is the scaling factor;

[0078] SMTC i This is the first SMTC cycle;

[0079] SMTC i,partial This is the SMTC cycle of the second SMTC;

[0080] N FR1,i It is the number of inter-frequency NR FR1 carriers in the first group of measurement objects;

[0081] N FR2,i It is the number of inter-frequency NR FR2 carriers in the second set of measurement objects;

[0082] N FR1,i,partial It is the number of inter-frequency NR FR1 carriers in the second set of measurement objects;

[0083] N FR2,i,partial It is the number of inter-frequency NR FR2 carriers in the second set of measurement objects;

[0084] M Identify_Inter-freq,FR1 It is the number of SMTC opportunities used to identify cells on FR1 inter-frequency carriers; and

[0085] M Identify_Inter-freq,FR2 It is used to identify the number of SSBs of cells on the FR2 inter-frequency carrier.

[0086] For each FR measurement gap configuration, the expected delay of the measured object in FR1 can be determined according to the following formula:

[0087]

[0088] Similarly, the expected delay of the measured object in FR2 can be determined according to the following formula:

[0089]

[0090] Figure 2 An operational flow / algorithm structure 200 according to some embodiments is illustrated. The operational flow / algorithm structure 200 may be executed partially or entirely by the base station 108 or its components. For example, in some embodiments, the operational flow / algorithm structure 200 may be executed by baseband circuitry implemented in the base station 108.

[0091] The operation flow / algorithm structure 200 may include, at 204, determining the measurement gap configuration to be used by the UE. In some embodiments, the base station 108 may encode the configuration information for transmission to the UE to indicate the measurement gap configuration.

[0092] The operation flow / algorithm structure 200 may also include at 208, determining an SMTC that completely overlaps with the measurement gap configuration for multiple measurement objects, wherein the multiple measurement objects are all the measurement objects that the UE will use the measurement gap configuration to measure its feedback information.

[0093] The operation flow / algorithm structure 200 may also include, at 212, encoding configuration information to indicate multiple measurement objects' SMTCs for transmission to the UE. For example, the configuration information may be included in the MeasObjectNR information element transmitted to the UE by the base station in control information.

[0094] In some implementations, the base station may receive feedback information from multiple measurement objects and / or determine an estimated delay in receiving the feedback information, as described herein.

[0095] Figure 3 An operational flow / algorithm structure 300 according to some embodiments is illustrated. The operational flow / algorithm structure 300 may be executed partially or entirely by the base station 108 or its components. For example, in some embodiments, the operational flow / algorithm structure 300 may be executed by baseband circuitry implemented in the base station 108.

[0096] The operation flow / algorithm structure 300 may be included at 304, which determines the measurement gap configuration to be used by the UE.

[0097] The operation process / algorithm structure 300 may also include, at 308, determining a first SMTC that partially or completely overlaps with the measurement gap configuration for one or more measurement objects in the first group.

[0098] The operation flow / algorithm structure 300 may also include, at 312, determining a second SMTC that overlaps with the measurement gap configuration portion for one or more measurement objects of the second group, wherein the second SMTC is different from the first SMTC, and wherein the first group and the second group are combined to include all measurement objects for which the UE will use the measurement gap configuration to measure its feedback information.

[0099] The operation flow / algorithm structure 300 may also include at 316, encoding configuration information for transmission to the UE to indicate the first SMTC of the first group and the second SMTC of the second group.

[0100] The operation process / algorithm structure 300 may also include at 320 decoding the feedback information of the first set of measurement objects and the second set of measurement objects received from the UE.

[0101] In some implementations, the base station may receive feedback information from multiple measurement objects and / or determine an estimated delay in receiving the feedback information, as described herein.

[0102] Figure 4 An operational flow / algorithm structure 400 according to some embodiments is illustrated. The operational flow / algorithm structure 400 may be executed partially or entirely by the UE 104 or its components. For example, in some embodiments, the operational flow / algorithm structure 400 may be executed by baseband circuitry implemented in the UE 104.

[0103] The operation process / algorithm structure 400 may include at 404, which determines the measurement gap configuration that the UE will use to measure feedback information in the NR wireless cellular network.

[0104] The operation flow / algorithm structure 400 may also include, at 408, receiving configuration information from the next-generation node B (gNB) to indicate an SMTC that completely overlaps with the measurement gap configuration for multiple measurement objects, wherein the multiple measurement objects are all the measurement objects for which the UE will use the measurement gap configuration to measure its feedback information.

[0105] The operation process / algorithm structure 400 may also include at 412, determining feedback information for multiple measurement objects based on SMTC and measurement gap configuration.

[0106] The operation process / algorithm structure 400 may also include, at 416, encoding the feedback information for transmission to the gNB.

[0107] Figure 5 Another operational flow / algorithm structure 500 according to some embodiments is shown. The operational flow / algorithm structure 500 may be executed partially or entirely by the UE 104 or its components. For example, in some embodiments, the operational flow / algorithm structure 500 may be executed by baseband circuitry implemented in the UE 104.

[0108] The operation flow / algorithm structure 500 may include at 504, which determines the measurement gap configuration that the UE will use to measure feedback information in the NR wireless cellular network.

[0109] The operation process / algorithm structure 500 may also include, at 508, receiving configuration information from the gNB to indicate a first SMTC that completely overlaps with the measurement gap configuration for one or more measurement objects in the first group.

[0110] The operation flow / algorithm structure 500 may also include, at 512, receiving configuration information from the gNB to indicate a second SMTC overlapping with the measurement gap configuration portion for one or more measurement objects of the second group, wherein the first group and the second group are combined to include all measurement objects for which the UE wants to use the measurement gap configuration to measure its feedback information.

[0111] The operation process / algorithm structure 500 may also include, at 516, determining the feedback information of the first group of measurement objects and the second group of measurement objects based on the configuration of the first SMTC and the second SMTC and the measurement gap.

[0112] The operation flow / algorithm structure 500 may also include, at 520, encoding the feedback information for transmission to the gNB.

[0113] Figure 6 Examples of infrastructure equipment 600 according to various embodiments are shown. Infrastructure equipment 600 (or “system 600”) may be implemented as a base station, radio head, RAN node, etc., such as the base station 108 previously shown and described. System 600 may include one or more of the following: application circuitry 605, baseband circuitry 610, one or more radio front-end modules 615, memory circuitry 620, power management integrated circuit (PMIC) 625, power tee circuitry 630, network controller circuitry 635, network interface connector 640, satellite positioning circuitry 645, and user interface 650. In some embodiments, equipment 600 may include additional elements such as, for example, memory / storage devices, displays, cameras, sensors, or input / output (I / O) interfaces. In other embodiments, the components described below may be included in more than one device (e.g., the circuitry may be individually included in more than one device for CRAN, vBBU, or other similar specific implementations).

[0114] As used herein, the term "circuit" may refer to, be part of, or include the following: hardware components such as electronic circuits, logic circuits, processors (shared, dedicated, or grouped) and / or memories (shared, dedicated, or grouped), application-specific integrated circuits (ASICs), field-programmable devices (FPDs) (e.g., field-programmable gate arrays (FPGAs), programmable logic devices (PLDs), complex PLDs (CPLDs), high-capacity PLDs (HCPLDs), structured ASICs or programmable system-on-chips (SoCs)), digital signal processors (DSPs), etc.

[0115] In some implementations, the circuit may execute one or more software or firmware programs to provide at least some of the said functions. Furthermore, the term "circuit" may also refer to a combination of one or more hardware elements and program code for performing the functions (or a combination of circuits used in electrical or electronic systems). In these implementations, the combination of hardware elements and program code may be referred to as a specific type of circuit.

[0116] The terms “application circuit” and / or “baseband circuit” may be considered synonymous with “processor circuit” and may be referred to as “processor circuit”. As used herein, the term “processor circuit” may refer to, be part of, or include: a circuit capable of sequentially and automatically performing a series of arithmetic or logical operations or recording, storing, and / or transmitting digital data. The term “processor circuit” may refer to one or more application processors, one or more baseband processors, a physical central processing unit (CPU), a single-core processor, a dual-core processor, a triple-core processor, a quad-core processor, and / or any other device capable of executing or otherwise operating computer-executable instructions (such as program code, software modules, and / or functional procedures).

[0117] Application circuitry 605 may include one or more central processing unit (CPU) cores and one or more of the following: cache memory, low-dropout regulator (LDO), interrupt controller, serial interface such as SPI, I2C, or Universal Programmable Serial Interface module, real-time clock (RTC), timer-counter including interval timer and watchdog timer, general-purpose input / output (I / O or IO), memory card controller such as Secure Digital (SD) Multimedia Card (MMC) or similar, Universal Serial Bus (USB) interface, Mobile Industry Processor Interface (MIPI) interface, and Joint Test Access Group (JTAG) test access port. As an example, application circuitry 605 may include one or more Intel... or Processor; Advanced Micro Devices (AMD) Processor, Accelerated Processing Unit (APU) or Processor; etc. In some implementations, system 600 may not utilize application circuitry 605 and may instead include a dedicated processor / controller to process, for example, IP data received from EPC or 5GC.

[0118] In addition to or alternatively, application circuit 605 may include circuitry such as, but not limited to, one or more field-programmable devices (FPDs) such as field-programmable gate arrays (FPGAs); programmable logic devices (PLDs) such as complex PLDs (CPLDs), high-capacity PLDs (HCPLDs); ASICs such as structured ASICs; programmable SoCs (PSoCs); and so on. In such embodiments, the circuitry of application circuit 605 may include logic blocks or logic architectures, and other interconnect resources that can be programmed to perform various functions such as processes, methods, functions, etc., as discussed in the various embodiments herein. In such embodiments, the circuitry of application circuit 605 may include memory cells (e.g., erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), flash memory, static memory (e.g., static random access memory (SRAM), fuses, etc.)) for storing logic blocks, logic architectures, data, etc., in lookup tables (LUTs).

[0119] The baseband circuit 610 may be implemented, for example, as a soldered substrate, comprising one or more integrated circuits, a single-package integrated circuit soldered to a main circuit board, or a multi-chip module comprising two or more integrated circuits. Although not shown, the baseband circuit 610 may include one or more digital baseband systems that may be coupled to a CPU subsystem, an audio subsystem, and an interface subsystem via interconnect subsystems. The digital baseband subsystems may also be coupled to a digital baseband interface and a mixed-signal baseband subsystem via another interconnect subsystem. Each of the interconnect subsystems may include a bus system, point-to-point connections, a network-on-chip (NOC) architecture, and / or some other suitable bus or interconnect technology, such as those discussed herein. The audio subsystem may include digital signal processing circuitry, buffer memory, program memory, voice processing accelerator circuitry, data converter circuitry such as analog-to-digital converter circuitry and digital-to-analog converter circuitry, analog circuitry including one or more amplifiers and filters, and / or other similar components. In one aspect of this disclosure, the baseband circuit 610 may include protocol processing circuitry having one or more instances of control circuitry (not shown) to provide control functions for the digital baseband circuitry and / or radio frequency circuitry (e.g., radio front-end module 615).

[0120] User interface circuitry 650 may include one or more user interfaces designed to enable a user to interact with system 600 or peripheral component interfaces, which are designed to enable peripheral components to interact with system 600. User interfaces may include, but are not limited to, one or more physical or virtual buttons (e.g., a reset button), one or more indicators (e.g., light-emitting diodes (LEDs)), a physical keyboard or keypad, a mouse, a touchpad, a touchscreen, a speaker or other audio transmitter, a microphone, a printer, a scanner, headphones, a display screen or display device, etc. Peripheral component interfaces may include, but are not limited to, non-volatile memory ports, universal serial bus (USB) ports, audio jacks, power interfaces, etc.

[0121] The radio front-end module (RFEM) 615 may include a millimeter-wave RFEM and one or more sub-millimeter-wave radio frequency integrated circuits (RFICs). In some embodiments, the one or more sub-millimeter-wave RFICs may be physically separated from the millimeter-wave RFEM. The RFIC may include connectors to one or more antennas or antenna arrays, and the RFEM may be connected to multiple antennas. In another embodiment, both millimeter-wave and sub-millimeter-wave radio functions may be implemented in the same physical radio front-end module 615. The RFEM 615 may combine both a millimeter-wave antenna and a sub-millimeter-wave antenna.

[0122] The memory circuitry 620 may include one or more of the following: volatile memory including dynamic random access memory (DRAM) and / or synchronous dynamic random access memory (SDRAM); non-volatile memory (NVM) including electrically erasable memory (often referred to as "flash memory"); phase-change random access memory (PRAM); magnetoresistive random access memory (MRAM); and may be combined with... and A three-dimensional (3D) XPOINT memory. The memory circuit 620 can be implemented as one or more of the following: a solder-in packaged integrated circuit, a socket memory module, and an insertable memory card.

[0123] The PMIC 625 may include a voltage regulator, surge protector, power alarm detection circuitry, and one or more backup power sources, such as batteries or capacitors. The power alarm detection circuitry can detect one or more of a power outage (undervoltage) and a power surge (overvoltage) condition. The power tee circuit 630 can provide power drawn from the network cable to provide both power and data connectivity to the infrastructure equipment 600 using a single cable.

[0124] Network controller circuitry 635 can provide connectivity to a network using standard network interface protocols such as Ethernet, GRE-tunneled Ethernet, Multiprotocol Label Switching (MPLS)-based Ethernet, or some other suitable protocol. Network connectivity can be provided to / from infrastructure equipment 600 via a physical connection via network interface connector 640; this physical connection can be an electrical connection (typically referred to as a "copper interconnect"), an optical connection, or a wireless connection. Network controller circuitry 635 may include one or more dedicated processors and / or FPGAs for communicating using one or more of the aforementioned protocols. In some implementations, network controller circuitry 635 may include multiple controllers for providing connectivity to other networks using the same or different protocols.

[0125] Positioning circuit 645 may include circuitry for receiving and decoding signals transmitted by one or more navigation satellite constellations of a Global Navigation Satellite System (GNSS). Examples of navigation satellite constellations (or GNSS) may include the U.S. Global Positioning System (GPS), Russia's GLONASS, the European Union's Galileo system, China's BeiDou Navigation Satellite System, regional navigation systems, or GNSS augmentation systems (e.g., using the Indian constellation NAVIC, Japan's Quasi-Zenith Satellite System (QZSS), France's Doppler orbit chart and satellite integrated radio positioning (DORIS) for navigation). Positioning circuit 645 may include various hardware components (e.g., hardware devices such as switches, filters, amplifiers, antenna elements, etc., to facilitate OTA communication) to communicate with components of the positioning network, such as navigation satellite constellation nodes.

[0126] Nodes or satellites of a navigation satellite constellation (“GNSS nodes”) provide positioning services by continuously transmitting or broadcasting GNSS signals along the line of sight. GNSS receivers (e.g., positioning circuitry 645 and / or positioning circuitry implemented by UE 104, etc.) can use this positioning service to determine their GNSS positions. GNSS signals may include pseudo-random codes (e.g., sequences of ones and zeros) known to the GNSS receiver and a message including the time of transmission (ToT) of the code period (e.g., a defined point in the pseudo-random code sequence) and the GNSS node position at the ToT. GNSS receivers can monitor / measure GNSS signals transmitted / broadcast by multiple GNSS nodes (e.g., four or more satellites) and solve various formulas to determine the corresponding GNSS positions (e.g., spatial coordinates). GNSS receivers also implement clocks that are typically less stable and accurate than the atomic clocks of GNSS nodes, and can use the measured GNSS signals to determine the deviation of the GNSS receiver's time from the real time (e.g., the offset of the GNSS receiver clock relative to the GNSS node time). In some implementations, the positioning circuit 645 may include a microtechnology (micro PNT) integrated circuit (IC) for positioning, navigation, and timing, which uses a master timing clock to perform position tracking / estimation in the absence of GNSS assistance.

[0127] A GNSS receiver can measure the time of arrival (ToA) of GNSS signals from multiple GNSS nodes based on its own clock. The GNSS receiver can determine the time of flight (ToF) value for each received GNSS signal based on the ToA and ToT, and then determine the three-dimensional (3D) position and clock offset based on the ToF. This 3D position can then be converted to latitude, longitude, and altitude. Positioning circuitry 645 can provide data to application circuitry 605, which may include one or more of position data or time data. Application circuitry 605 can use the time data to synchronize the operation of other radio base stations (e.g., base station 108, etc.).

[0128] Figure 6The components shown can communicate with each other using interface circuitry. As used herein, the term "interface circuitry" can refer to, be part of, or include circuitry that provides information exchange between two or more components or devices. The term "interface circuitry" can refer to one or more hardware interfaces, such as buses, input / output (I / O) interfaces, peripheral component interfaces, network interface cards, etc. Any suitable bus technology can be used in a variety of specific implementations, and it can include any number of technologies, including Industry Standard Architecture (ISA), Extended ISA (EISA), Peripheral Component Interconnect (PCI), Peripheral Component Interconnect Extensions (PCIx), PCI Express (PCIe), or any number of other technologies. The bus can be a proprietary bus, for example, used in SoC-based systems. Other bus systems can be included, such as I2C interfaces, SPI interfaces, point-to-point interfaces, and power buses, etc.

[0129] Figure 7 Examples of platform 700 (or “device 700”) according to various embodiments are shown. In embodiments, computer platform 700 may be adapted to function as UE 104, base station 108, or any other element / device discussed herein. Platform 700 may include any combination of the components shown in the examples. Components of platform 700 may be implemented as integrated circuits (ICs), portions thereof, discrete electronic devices, or other modules, logic, hardware, software, firmware, or combinations thereof suitable for computer platform 700, or may be implemented as components otherwise integrated within the chassis of a larger system. Figure 7 The block diagram is intended to show a high-level view of the components of the computer platform 700. However, some of the components shown may be omitted, additional components may be present, and different arrangements of the components shown may occur in other specific embodiments.

[0130] Application circuitry 705 may include circuitry such as, but not limited to, a single-core or multi-core processor and one or more of the following: cache memory, low-dropout regulator (LDO), interrupt controller, serial interface such as Serial Peripheral Interface (SPI), Internal Integrated Circuit (I2C) or Universal Programmable Serial Interface (UPNIST) circuitry, real-time clock (RTC), timer-counter including interval timers and watchdog timers, general-purpose input / output (I / O), memory card controller such as Secure Digital / Multimedia Card (SD / MMC) or similar, Universal Serial Bus (USB) interface, Mobile Industry Processor Interface (MIPI) interface, and Joint Test Access Group (JTAG) test access port. The processor may include any combination of general-purpose processors and / or dedicated processors (e.g., graphics processors, application processors, etc.). The processor (or core) may be coupled to or may include a memory / storage device and may be configured to execute instructions stored in the memory / storage device to enable various applications or operating systems to run on platform 700. In some embodiments, the processor of application circuitry 605 / 705 may process IP data packets received from EPC or 5GC.

[0131] Application circuitry 705 may be or include a microprocessor, multi-core processor, multi-threaded processor, ultra-low voltage processor, embedded processor, or other known processing element. In one example, application circuitry 705 may include a microprocessor based on… Architecture Core TM processors, such as Quark TM Atom TM i3, i5, i7, or MCU-level processors, or available from Santa Clara, CA. company( Another processor of this type from [Company Name]. The processor of application circuit 705 can also be one or more of the following: Advanced Micro Devices (AMD). Processor or Accelerated Processing Unit (APU); from Inc.'s A5-A9 processors, from Snapdragon by Technologies, Inc. TM Processor, Texas Instruments OpenMultimedia Applications Platform(OMAP) TMProcessors; MIPS-based designs from MIPS Technologies, Inc.; ARM-based designs from ARM Holdings, Ltd.; etc. In some specific implementations, the application circuitry 705 may be part of a system-on-a-chip (SoC), where the application circuitry 705 and other components are formed as a single integrated circuit or a single package, such as... company( Edison Corporation TM Or Galileo TM SoC board.

[0132] In addition to or alternatively, application circuitry 705 may include circuitry such as, but not limited to, one or more field-programmable devices (FPDs) such as FPGAs; programmable logic devices (PLDs) such as complex PLDs (CPLDs), high-capacity PLDs (HCPLDs); ASICs such as structured ASICs; programmable SoCs (PSoCs); and so on. In such embodiments, the circuitry of application circuitry 705 may include logic blocks or logic architectures, and other interconnect resources that can be programmed to perform various functions such as processes, methods, functions, etc., as discussed in the various embodiments herein. In such embodiments, the circuitry of application circuitry 705 may include memory cells (e.g., erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), flash memory, static memory (e.g., static random access memory (SRAM), fuses, etc.)) for storing logic blocks, logic architectures, data, etc., in lookup tables (LUTs).

[0133] The baseband circuit 710 may be implemented, for example, as a soldered substrate, comprising one or more integrated circuits, a single-package integrated circuit soldered to a main circuit board, or a multi-chip module comprising two or more integrated circuits. Although not shown, the baseband circuit 710 may include one or more digital baseband systems that may be coupled to a CPU subsystem, an audio subsystem, and an interface subsystem via interconnect subsystems. The digital baseband subsystems may also be coupled to a digital baseband interface and a mixed-signal baseband subsystem via another interconnect subsystem. Each of the interconnect subsystems may include a bus system, point-to-point connections, a network-on-chip (NOC) architecture, and / or some other suitable bus or interconnect technology, such as those discussed herein. The audio subsystem may include digital signal processing circuitry, buffer memory, program memory, voice processing accelerator circuitry, data converter circuitry such as analog-to-digital converter circuitry and digital-to-analog converter circuitry, analog circuitry including one or more amplifiers and filters, and / or other similar components. In one aspect of this disclosure, the baseband circuit 710 may include protocol processing circuitry having one or more instances of control circuitry (not shown) to provide control functions for the digital baseband circuitry and / or radio frequency circuitry (e.g., radio front-end module 715).

[0134] The radio front-end module (RFEM) 715 may include a millimeter-wave RFEM and one or more sub-millimeter-wave radio frequency integrated circuits (RFICs). In some embodiments, the one or more sub-millimeter-wave RFICs may be physically separated from the millimeter-wave RFEM. The RFIC may include connectors to one or more antennas or antenna arrays, and the RFEM may be connected to multiple antennas. In another embodiment, both millimeter-wave and sub-millimeter-wave radio functions may be implemented in the same physical radio front-end module 715. The RFEM 715 may combine both a millimeter-wave antenna and a sub-millimeter-wave antenna.

[0135] Memory circuitry 720 may include any number and type of memory devices for providing a fixed amount of system memory. For example, memory circuitry 720 may include one or more of the following: volatile memory, including random access memory (RAM), dynamic RAM (DRAM), and / or synchronous dynamic RAM (SDRAM); and non-volatile memory, including high-speed electrically erasable memory (commonly referred to as flash memory), phase-change random access memory (PRAM), magnetoresistive random access memory (MRAM), etc. Memory circuitry 720 may be developed according to the Joint Electronic Equipment Committee (JEDEC) design based on low-power double data rate (LPDDR), such as LPDDR2, LPDDR3, LPDDR4, etc. Memory circuitry 720 may be implemented as one or more of the following: solder-in packaged integrated circuits, single-die package (SDP), dual-die package (DDP), or quad-die package (Q17P), socket memory modules, dual in-line memory modules (DIMMs) including micro DIMMs or mini DIMMs, and / or soldered to a motherboard via a ball grid array (BGA). In a low-power implementation, memory circuitry 720 may be an on-chip memory or register associated with application circuitry 705. To provide persistent storage for information such as data, applications, operating systems, etc., memory circuitry 720 may include one or more mass storage devices, which may include, in particular, solid-state drives (SSDDs), hard disk drives (HDDs), miniature HDDs, resistance-changing memories, phase-change memories, holographic memories, or chemical memories, etc. For example, computer platform 700 may be combined with... and 3D XPOINT memory.

[0136] The removable memory circuitry 723 may include devices, circuitry, enclosures / housings, ports, or sockets for coupling portable data storage devices to platform 700. These portable data storage devices may be used for mass storage and may include, for example, flash memory cards (e.g., Secure Digital (SD) cards, Micro SD cards, xD picture cards, etc.), as well as USB flash drives, optical discs, external HDDs, etc.

[0137] Platform 700 may also include interface circuitry (not shown) for connecting external devices to platform 700. External devices connected to platform 700 via the interface circuitry may include sensors 721, such as accelerometers, level sensors, flow sensors, temperature sensors, pressure sensors, barometric pressure sensors, etc. The interface circuitry can be used to connect platform 700 to electromechanical components (EMC) 722, which may allow platform 700 to change its state, position, and / or orientation, or move or control mechanisms or systems. EMC 722 may include one or more power switches, relays (including electromechanical relays (EMRs) and / or solid-state relays (SSRs)), actuators (e.g., valve actuators), audible generators, visual warning devices, motors (e.g., DC motors, stepper motors, etc.), wheels, propellers, pawls, clamps, hooks, and / or other similar electromechanical components. In embodiments, platform 700 may be configured to operate one or more EMCs 722 based on one or more captured events and / or commands or control signals received from a service provider and / or various clients.

[0138] In some specific implementations, the interface circuit can connect the platform 700 to the positioning circuit 745, which can be connected to a reference... Figure 6 The positioning circuit 645 discussed is the same as or similar to that discussed.

[0139] In some implementations, the interface circuitry can connect the platform 700 to a near-field communication (NFC) circuitry 740, which may include an NFC controller coupled to antenna elements and processing devices. The NFC circuitry 740 can be configured to read electronic tags and / or connect to another NFC-enabled device.

[0140] The drive circuit 746 may include software and hardware elements for controlling specific devices embedded in, attached to, or otherwise communicatively coupled to the platform 700. The drive circuit 746 may include various drivers that allow other components of the platform 700 to interact with or control various input / output (I / O) devices that may exist within or be connected to the platform. For example, the drive circuit 746 may include: a display driver for controlling and allowing access to a display device; a touchscreen driver for controlling and allowing access to a touchscreen interface of the platform 700; a sensor driver for acquiring sensor readings of sensor 721 and controlling and allowing access to sensor 721; an EMC driver for acquiring actuator position of EMC 722 and / or controlling and allowing access to EMC 722; a camera driver for controlling and allowing access to an embedded image capture device; and an audio driver for controlling and allowing access to one or more audio devices.

[0141] A power management integrated circuit (PMIC) 725 (also referred to as "power management circuit 725") manages the power supplied to various components of platform 700. Specifically, relative to baseband circuit 710, PMIC 725 controls power selection, voltage scaling, battery charging, or DC-DC conversion. PMIC 725 is typically included when platform 700 can be powered by battery 730, for example, when the device is included in UE 104.

[0142] In some implementations, the PMIC 725 can be controlled or otherwise integrated into various power-saving mechanisms of the platform 700. For example, if the platform 700 is in the RRC_Connected state, where the device is still connected to the RAN node as it expects to receive traffic immediately, it can enter a state called Discontinuous Receive Mode (DRX) after a period of inactivity. During this state, the platform 700 can be powered down for short time intervals to save power. If there is no data traffic activity for an extended period, the platform 700 can transition to the RRC_Idle state, where the device is disconnected from the network and does not perform operations such as channel quality feedback, handover, etc. The platform 700 enters a very low-power state and performs paging, where the device periodically wakes up again to listen to the network and then powers down again. The platform 700 may not receive data in this state; to receive data, it must transition back to the RRC Connected state. Additional power-saving modes can make the device unable to use the network for longer than the paging interval (ranging from a few seconds to several hours). During this period, the device is completely unable to connect to the network and can be completely powered down. Any data sent during this period will cause significant delays, and it is assumed that the delays are acceptable.

[0143] Battery 730 can power platform 700, but in some examples, platform 700 may be mounted in a fixed location and may have a power source coupled to the grid. Battery 730 may be a lithium-ion battery, a metal-air battery such as a zinc-air battery, an aluminum-air battery, a lithium-air battery, etc. In some specific implementations, such as in V2X applications, battery 730 may be a typical lead-acid automotive battery.

[0144] In some implementations, battery 730 may be a "smart battery," which includes or is coupled to a battery management system (BMS) or battery monitoring integrated circuit. The BMS may be included in platform 700 to track the state of charge (SoCh) of battery 730. The BMS can be used to monitor other parameters of battery 730, such as state of health (SoH) and state of function (SoF) to provide fault prediction. The BMS can transmit information about battery 730 to application circuitry 705 or other components of platform 700. The BMS may also include an analog-to-digital converter (ADC) that allows application circuitry 705 to directly monitor the voltage of battery 730 or the current from battery 730. Battery parameters can be used to determine actions that platform 700 can perform, such as transmission frequency, network operation, sensing frequency, etc.

[0145] A power block coupled to the grid or other power source can be coupled to the BMS to charge the battery 730. In some examples, the power block can be replaced by a wireless power receiver to wirelessly acquire power, for example, via a loop antenna in the computer platform 700. In these examples, wireless battery charging circuitry can be included in the BMS. The specific charging circuitry chosen may depend on the size of the battery 730 and therefore on the required current. Charging can be performed using aviation fuel standards published by the Aviation Fuel Alliance, the Qi wireless charging standard published by the Radio Power Alliance, or the Rezence charging standard published by the Radio Power Alliance, etc.

[0146] User interface circuitry 750 includes various input / output (I / O) devices present within or connected to platform 700, and includes one or more user interfaces designed to enable interaction between a user and platform 700 and / or peripheral component interfaces designed to enable interaction between peripheral components and platform 700. User interface circuitry 750 includes input device circuitry and output device circuitry. Input device circuitry includes any physical or virtual device for accepting input, particularly including one or more physical or virtual buttons (e.g., a reset button), a physical keyboard, a keypad, a mouse, a touchpad, a touchscreen, a microphone, a scanner, a headset, etc. Output device circuitry includes any physical or virtual device for displaying information or otherwise transmitting information (such as sensor readings, actuator positions, or other similar information). The output device circuitry may include any number and / or combination of audio or visual displays, particularly including one or more simple visual outputs / indicators (e.g., binary status indicators (e.g., light-emitting diodes (LEDs)) and multi-character visual outputs, or more complex outputs such as display devices or touchscreens (e.g., liquid crystal displays (LCDs), LED displays, quantum dot displays, projectors, etc.), wherein the operation of platform 700 generates or produces the output of characters, graphics, multimedia objects, etc. The output device circuitry may also include speakers or other audio transmitting devices, printers, etc. In some embodiments, sensor circuitry 721 may be used as input device circuitry (e.g., image capture devices, motion capture devices, etc.) and one or more EMCs may be used as output device circuitry (e.g., actuators for providing haptic feedback, etc.). In another example, NFC circuitry may be included with an NFC controller coupled to antenna elements and processing devices to read electronic tags and / or connect to another NFC-enabled device. Peripheral component interfaces may include, but are not limited to, non-volatile memory ports, universal serial bus (USB) ports, audio jacks, power interfaces, etc.

[0147] Although not shown, components of Platform 700 may communicate with each other using a suitable bus technology, which may include any number of technologies, including Industry Standard Architecture (ISA), Extended ISA (EISA), Peripheral Component Interconnect (PCI), Peripheral Component Interconnect Extended (PCIx), PCI Express (PCIe), Time Triggered Protocol (TTP) systems, FlexRay systems, or any other technologies. The bus may be a proprietary bus, for example, used in SoC-based systems. Other bus systems may be included, such as I2C interfaces, SPI interfaces, point-to-point interfaces, and power buses, etc.

[0148] Figure 8Exemplary components of a baseband circuit 610 / 710 and a radio front-end module (RFEM) 615 / 715 according to various embodiments are shown. As shown, the RFEM 615 / 715 may include a radio frequency (RF) circuit 806, a front-end module (FEM) circuit 808, and at least one or more antennas 820 coupled together as shown.

[0149] Baseband circuitry 610 / 710 may include circuitry such as, but not limited to, one or more single-core or multi-core processors. Baseband circuitry 610 / 710 may include one or more baseband processors or control logic components to process baseband signals received from the receive signal path of RF circuitry 806 and to generate baseband signals for the transmit signal path of RF circuitry 806. Baseband processing circuitry 610 / 710 may interact with application circuitry 605 / 705 to generate and process baseband signals and control the operation of RF circuitry 806. For example, in some embodiments, baseband circuitry 610 / 710 may include a third-generation (3G) baseband processor 804A, a 4G baseband processor 804B, a 5G baseband processor 804C, or other existing, under development, or future generations of baseband processors 804D (e.g., second-generation (2G), sixth-generation (6G), etc.). The baseband circuits 610 / 710 (e.g., one or more of baseband processors 804A-804D) can handle various radio control functions capable of communicating with one or more radio networks via RF circuitry 806. In other embodiments, some or all of the functions of the baseband processors 804A-804D may be included in modules stored in memory 804G and executed via a central processing unit (CPU) 804E. Radio control functions may include, but are not limited to, signal modulation / demodulation, encoding / decoding, RF shifting, etc. In some embodiments, the modulation / demodulation circuitry of the baseband circuits 610 / 710 may include Fast Fourier Transform (FFT), precoding, or constellation mapping / demapping functions. In some embodiments, the encoding / decoding circuitry of the baseband circuits 610 / 710 may include convolution, tail-biting convolution, turbo, Viterbi, or low-density parity-check (LDPC) encoder / decoder functions. Implementations of the modulation / demodulation and encoder / decoder functions are not limited to these examples, and other suitable functions may be included in other embodiments.

[0150] In some embodiments, the baseband circuitry 610 / 710 may include one or more audio digital signal processors (DSPs) 804F. The audio DSP 804F may include elements for compression / decompression and echo cancellation, and in other embodiments may include other suitable processing elements. In some embodiments, components of the baseband circuitry may be suitably combined in a single chip or a single chipset, or disposed on the same circuit board. In some embodiments, some or all components of the baseband circuitry 610 / 710 and the application circuitry 605 / 705 may be implemented together, such as, for example, on a system-on-a-chip (SoC).

[0151] In some implementations, baseband circuits 610 / 710 can provide communication compatible with one or more radio technologies. For example, in some implementations, baseband circuits 610 / 710 can support communication with E-UTRAN or other WMAN, WLAN, WPAN. Implementations in which baseband circuits 610 / 710 are configured to support radio communication with more than one wireless protocol may be referred to as multi-mode baseband circuits.

[0152] RF circuit 806 can communicate with a wireless network using modulated electromagnetic radiation over a non-solid medium. In various embodiments, RF circuit 806 may include switches, filters, amplifiers, etc., to facilitate communication with the wireless network. RF circuit 806 may include a receive signal path that includes circuitry for down-converting the RF signal received from FEM circuit 808 and providing a baseband signal to baseband circuits 610 / 710. RF circuit 806 may also include a transmit signal path that includes circuitry for up-converting the baseband signal provided by baseband circuits 610 / 710 and providing an RF output signal for transmission to FEM circuit 808.

[0153] In some embodiments, the receive signal path of RF circuit 806 may include mixer circuit 806a, amplifier circuit 806b, and filter circuit 806c. In some embodiments, the transmit signal path of RF circuit 806 may include filter circuit 806c and mixer circuit 806a. RF circuit 806 may also include synthesizer circuit 806d for synthesizing the frequency used by mixer circuit 806a in both the receive and transmit signal paths. In some embodiments, mixer circuit 806a in the receive signal path may be configured to down-convert the RF signal received from FEM circuit 808 based on the synthesized frequency provided by synthesizer circuit 806d. Amplifier circuit 806b may be configured to amplify the down-converted signal, and filter circuit 806c may be a low-pass filter (LPF) or band-pass filter (BPF) configured to remove unwanted signals from the down-converted signal to generate an output baseband signal. The output baseband signal may be provided to baseband circuits 610 / 710 for further processing. In some implementations, although not required, the output baseband signal may be a zero-frequency baseband signal. In some implementations, the mixer circuit 806a of the receiving signal path may include a passive mixer, but the scope of the implementations is not limited in this respect.

[0154] In some implementations, the mixer circuit 806a of the transmit signal path can be configured to up-convert the input baseband signal based on the synthesized frequency provided by the synthesizer circuit 806d to generate an RF output signal for the FEM circuit 808. The baseband signal can be provided by the baseband circuits 610 / 710 and can be filtered by the filter circuit 806c.

[0155] In some embodiments, the mixer circuit 806a for the receive signal path and the mixer circuit 806a for the transmit signal path may include two or more mixers and may be arranged for quadrature downconversion and upconversion, respectively. In some embodiments, the mixer circuit 806a for the receive signal path and the mixer circuit 806a for the transmit signal path may include two or more mixers and may be arranged for image suppression (e.g., Hartley image suppression). In some embodiments, the mixer circuit 806a for the receive signal path and the mixer circuit 806a for the transmit signal path may be arranged for direct downconversion and direct upconversion, respectively. In some embodiments, the mixer circuit 806a for the receive signal path and the mixer circuit 806a for the transmit signal path may be configured for superheterodyne operation.

[0156] In some embodiments, the output baseband signal and the input baseband signal may be analog baseband signals, although the scope of the embodiments is not limited in this respect. In some alternative embodiments, the output baseband signal and the input baseband signal may be digital baseband signals. In these alternative embodiments, RF circuit 806 may include analog-to-digital converter (ADC) and digital-to-analog converter (DAC) circuitry, and baseband circuitry 610 / 710 may include a digital baseband interface for communicating with RF circuitry 806.

[0157] In some dual-mode implementations, separate radio IC circuits can be provided to process signals for each spectrum, but the scope of the implementation is not limited in this respect.

[0158] In some implementations, synthesizer circuit 806d may be a fractional N synthesizer or a fractional N / N+1 synthesizer, but the scope of implementations is not limited in this respect, as other types of frequency synthesizers may also be suitable. For example, synthesizer circuit 806d may be a Δ-Σ synthesizer, a frequency multiplier, or a synthesizer including a phase-locked loop with a frequency divider.

[0159] The synthesizer circuit 806d can be configured to synthesize an output frequency based on the frequency input and the divider control input for use by the mixer circuit 806a of the RF circuit 806. In some embodiments, the synthesizer circuit 806d can be a fractional N / N+1 synthesizer.

[0160] In some implementations, the frequency input may be provided by a voltage-controlled oscillator (VCO), although this is not mandatory. The divider control input may be provided by the baseband circuitry 610 / 710 or the application circuitry 605 / 705 according to the desired output frequency. In some implementations, the divider control input (e.g., N) may be determined from a lookup table based on the channel indicated by the application circuitry 605 / 705.

[0161] The synthesizer circuit 806d of the RF circuit 806 may include a frequency divider, a delay-locked loop (DLL), a multiplexer, and a phase accumulator. In some embodiments, the frequency divider may be a dual-mode divider (DMD), and the phase accumulator may be a digital phase accumulator (DPA). In some embodiments, the DMD may be configured to divide the input signal by N or N+1 (e.g., based on carry) to provide a fractional division ratio. In some example embodiments, the DLL may include a cascaded, tunable delay element, a phase detector, a charge pump, and a set of D-type flip-flops. In these embodiments, the delay elements may be configured to divide the VCO cycle into Nd equal phase groups, where Nd is the number of delay elements in the delay line. Thus, the DLL provides negative feedback to help ensure that the total delay through the delay line is one VCO cycle.

[0162] In some embodiments, synthesizer circuitry 806d may be configured to generate a carrier frequency as the output frequency, while in other embodiments, the output frequency may be a multiple of the carrier frequency (e.g., twice the carrier frequency, four times the carrier frequency) and used in conjunction with quadrature generator and frequency divider circuitry to generate multiple signals having multiple different phases relative to each other at the carrier frequency. In some embodiments, the output frequency may be the LO frequency (fLO). In some embodiments, RF circuitry 806 may include an IQ / polarity converter.

[0163] FEM circuit 808 may include a receive signal path, which may include circuitry configured to operate on RF signals received from one or more antennas 820, amplify the received signals, and provide an amplified version of the received signals to RF circuit 806 for further processing. FEM circuit 808 may also include a transmit signal path, which may include circuitry configured to amplify transmit signals provided by RF circuit 806 for transmission through one or more of the one or more antennas 820. In various embodiments, amplification via the transmit or receive signal path may be performed only in RF circuit 806, only in FEM circuit 808, or in both RF circuit 806 and FEM circuit 808.

[0164] In some embodiments, FEM circuit 808 may include a TX / RX switch to switch between transmit and receive mode operation. FEM circuit 808 may include a receive signal path and a transmit signal path. The receive signal path of FEM circuit 808 may include an LNA to amplify the received RF signal and provide the amplified received RF signal as an output (e.g., to RF circuit 806). The transmit signal path of FEM circuit 808 may include a power amplifier (PA) to amplify (e.g., provided by RF circuit 806) the input RF signal; and one or more filters to generate an RF signal for subsequent transmission (e.g., through one or more antennas in one or more antennas 820).

[0165] The processors of application circuitry 605 / 705 and baseband circuitry 610 / 710 are elements that can be used to execute one or more instances of the protocol stack. For example, the processors of baseband circuitry 610 / 710 can be used individually or in combination to execute layer 3, layer 2, or layer 1 functions, while the processors of application circuitry 605 / 705 can utilize data received from these layers (e.g., packet data) and further execute layer 4 functions (e.g., TCP and UDP layers). As mentioned herein, layer 3 may include the RRC layer, which will be described in further detail below. As mentioned herein, layer 2 may include the MAC layer, RLC layer, and PDCP layer, which will be described in further detail below. As mentioned herein, layer 1 may include the PHY layer of the UE / RAN node, which will be described in further detail below.

[0166] Figure 9 This is a block diagram illustrating components capable of reading instructions from a machine-readable or computer-readable medium (e.g., a non-transitory machine-readable storage medium) and executing any or more methods discussed herein, according to some exemplary embodiments. Specifically, Figure 9 A schematic diagram of hardware resources 900 is shown, including one or more processors (or processor cores) 910, one or more memory / storage devices 920, and one or more communication resources 930, each of which can be communicatively coupled via bus 940. As used herein, the terms "computing resources," "hardware resources," etc., can refer to physical or virtual devices, physical or virtual components within a computing environment, and / or physical or virtual components within a specific device, such as computer equipment, mechanical equipment, memory space, processor / CPU time and / or processor / CPU utilization, processor and accelerator load, hardware time or utilization, electrical power, input / output operations, port or network sockets, channel / link allocation, throughput, memory utilization, storage, network, database, and applications, etc. For implementations utilizing node virtualization (e.g., NFV), an executable hypervisor 902 can provide an execution environment for one or more network slices / subslices to utilize hardware resources 900. "Virtualized resources" can refer to the computing, storage, and / or networking resources provided by virtualization infrastructure to applications, devices, systems, etc.

[0167] Processor 910 (e.g., a central processing unit (CPU), a reduced instruction set computing (RISC) processor, a complex instruction set computing (CISC) processor, a graphics processing unit (GPU), a digital signal processor (DSP) (such as a baseband processor), an application-specific integrated circuit (ASIC), a radio frequency integrated circuit (RFIC), another processor, or any suitable combination thereof) may include, for example, processor 1012 and processor 914.

[0168] The memory / storage device 920 may include main memory, disk storage devices, or any suitable combination thereof. The memory / storage device 920 may include, but is not limited to, any type of volatile or non-volatile memory, such as dynamic random access memory (DRAM), static random access memory (SRAM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), flash memory, solid-state storage devices, etc.

[0169] Communication resource 930 may include interconnection devices or network interface components or other suitable devices for communicating with one or more peripheral devices 904 or one or more databases 906 via network 908. For example, communication resource 1030 may include wired communication components (e.g., for coupling via Universal Serial Bus (USB), cellular communication components, NFC components, etc. Components (e.g.) (low power consumption) Components and other communication components. As used herein, the terms "network resource" or "communication resource" can refer to computing resources that can be accessed by computer devices via a communication network. The term "system resource" can refer to any kind of shared entity that provides services and may include computing resources and / or network resources. System resources can be considered as a coherent set of functions, network data objects, or services that can be accessed through a server, wherein such system resources reside on a single host or multiple hosts and are clearly identifiable.

[0170] Instructions 950 may include software, programs, applications, applets, or other executable code for causing at least any one of the processors 910 to perform any or more of the methods discussed herein. Instructions 950 may reside wholly or partially within at least one of the processors 910 (e.g., within the processor's cache memory), memory / storage device 920, or any suitable combination thereof. Furthermore, any portion of instructions 950 may be transferred from any combination of peripheral device 904 or database 906 to hardware resource 900. Therefore, the memory of processor 910, memory / storage device 920, peripheral device 904, and database 906 are examples of computer-readable and machine-readable media.

[0171] For one or more embodiments, at least one of the components shown in one or more of the foregoing figures may be configured to perform one or more operations, techniques, processes, and / or methods as described in the Examples section below. For example, the baseband circuitry described above in conjunction with one or more of the foregoing figures may be configured to operate according to one or more of the embodiments described below. As another example, circuitry associated with the UE, base station, network element, etc., described above in conjunction with one or more of the foregoing figures may be configured to operate according to one or more of the embodiments shown in the Embodiments section below.

[0172] The following provides some non-limiting examples of various implementation schemes.

[0173] Example 1 is one or more transient or non-transitory computer-readable media storing instructions thereon that, when executed by one or more processors, cause a next-generation node B (gNB) to perform the following operations: determine a measurement gap configuration to be used by a user equipment (UE); determine a measurement timing configuration (SMTC) based on a synchronization signal (SS) / physical broadcast channel (PBCH) block (SSB) that completely overlaps with the measurement gap configuration for a plurality of measurement objects, wherein the plurality of measurement objects are all the measurement objects that the UE will use the measurement gap configuration to measure its feedback information; and encode the configuration information to indicate the plurality of measurement objects for transmission to the UE.

[0174] Example 2 is based on one or more media as described in Example 1, wherein when the instruction is executed, it also causes the gNB to decode the feedback information of the plurality of measurement objects received from the UE.

[0175] Example 3 is based on one or more media according to Example 2, wherein the feedback information includes one or more of SSB received signal power (RSRP), SSB received signal quality (RSRQ), or SSB signal to interference plus noise ratio (SINR).

[0176] Example 4 is based on one or more media according to Example 2, wherein when the instruction is executed, it also causes the gNB to determine the expected delay in receiving the feedback information based on the amount of the measured object, the SMTC, and the measurement gap configuration.

[0177] Example 5 is one or more media according to Example 4, wherein the expected delay includes an identification delay for identifying the corresponding measurement object and a measurement delay for measuring the feedback information of the corresponding measurement object.

[0178] Example 6 is based on one or more media as described in Example 5, wherein the recognition delay is determined according to the following formula:

[0179]

[0180] in: It is the recognition delay; K Inter-freq,GS It is the scaling factor; SMTC i The SMTC cycle of the measurement objects in this group is SMTC; MGRP is the measurement gap repetition cycle of this measurement gap configuration; N FR1,i It is the number of new radio (NR) frequency range 1 (FR1) carriers among the multiple measurement objects; N FR2 It is the number of NR frequency range 2 (FR2) carriers among the multiple measurement objects; It is the number of SMTC opportunities used to identify cells on one of the inter-frequency carriers of this FR1 frequency; It is the number of SSBs used to identify the cell on one of the inter-frequency carriers of the FR2 frequency.

[0181] Example 7 uses one or more media according to Example 6, wherein the measurement delay is determined according to the following formula:

[0182]

[0183] in: It is the measurement delay, M measurement_Inter-freq,FR1 This is the number of SMTC opportunities used to measure the cell on one of the inter-frequency carriers of FR1; and M measurement_Inter-freq, FR2 It is used to measure the number of SSBs of a cell on one of the inter-frequency carriers of the FR2 frequency.

[0184] Example 8 is one or more media according to any one of Examples 1 to 5, wherein the measurement gap configuration is a first measurement gap configuration specified for measurement objects in a new radio (NR) frequency range 1 (FR1), wherein the plurality of measurement objects are in the FR1 and are a first group of measurement objects, wherein the SMTC is a first SMTC, and wherein the instruction, when executed, also causes the gNB to: determine a second measurement gap configuration specified for measurement objects in an NR frequency range 2 (FR2); determine a second SMTC that completely overlaps with the second measurement gap configuration for a second group of measurement objects in the FR2, wherein the second group of measurement objects includes all measurement objects for which the UE will use the second measurement gap configuration to measure its feedback information; and encode the configuration information to indicate the second SMTC for the second group of measurement objects for transmission to the UE.

[0185] Example 9 is based on one or more media according to Example 8, wherein when the instruction is executed, the gNB further causes the gNB to: determine a first expected delay in receiving the feedback information of the first group of measurement objects based on the quantity of the measurement objects in the first group, the first SMTC and the first measurement gap configuration; and determine a second expected delay in receiving the feedback information of the second group of measurement objects based on the quantity of the measurement objects in the second group, the second SMTC and the second measurement gap configuration.

[0186] Example 10 is one or more media according to any one of Examples 1 to 9, wherein the SMTC is a first SMTC, and wherein the instruction, when executed, also causes the gNB to determine a second SMTC for one or more additional measurement objects, wherein the second SMTC does not overlap with the measurement gap configuration at all.

[0187] Example 11 is one or more transient or non-transitory computer-readable media storing instructions thereon that, when executed by one or more processors, cause a next-generation node B (gNB) to perform the following operations: determine a measurement gap configuration to be used by a user equipment (UE); determine a first measurement timing configuration (SMTC) based on a synchronization signal (SS) / physical broadcast channel (PBCH) block (SSB) that partially or completely overlaps with the measurement gap configuration for one or more measurement objects in a first group; determine a second SMTC that partially overlaps with the measurement gap configuration for one or more measurement objects in a second group, wherein the second SMTC is different from the first SMTC, and wherein the first group and the second group are combined to include all measurement objects for which the UE will use the measurement gap configuration to measure its feedback information; encode the configuration information to indicate the first SMTC of the first group and the second SMTC of the second group for transmission to the UE; and decode the feedback information received from the UE for the first group of measurement objects and the second group of measurement objects.

[0188] Example 12 is one or more media according to Example 11, wherein the first SMTC completely overlaps with the measurement gap configuration.

[0189] Example 13 is one or more media according to Example 11 or 12, wherein when the instruction is executed, it also causes the gNB to determine the expected delay in receiving the feedback information of the corresponding first or second group based on the amount of the measured object in the corresponding first or second group, the corresponding first SMTC or second SMTC, and the measurement gap configuration.

[0190] Example 14 is one or more media according to any one of Examples 11 to 13, wherein when the instruction is executed, it also causes the gNB to determine the expected delay in receiving the feedback information, wherein the expected delay is determined according to the following formula:

[0191] as well as

[0192] in: This is the expected recognition delay; It is the expected measurement delay, K Inter-freq,GS It is the scaling factor; SMTC i It is the SMTC cycle of the corresponding first or second group of measurement objects; MGRP is the measurement gap repetition cycle of the measurement gap configuration; N FR1,i It is the number of new radio (NR) frequency range 1 (FR1) carriers in the corresponding first or second set of measurement objects; N FR2 It is the number of frequency-inter-frequency NR frequency range 2 (FR2) carriers in the corresponding first or second group of measurement objects; It is the number of SMTC opportunities used to identify cells on one of the inter-frequency carriers of this FR1 frequency; It is the number of SSBs used to identify the cells on one of the FR2 inter-frequency carriers; M measurement_Inter-freq,FR1 It is the number of SMTC opportunities used to measure the cell on one of the inter-frequency carriers of FR1; and M measurement_Inter-freq,FR2 It is used to measure the number of SSBs of a cell on one of the inter-frequency carriers of the FR2 frequency.

[0193] Example 15 is one or more media according to any one of Examples 11 to 14, wherein the measurement gap configuration is a first measurement gap configuration specified for measurement objects in a new radio (NR) frequency range 1 (FR1), and wherein the instruction, when executed, also causes the gNB to: determine a second measurement gap configuration specified for measurement objects in an NR frequency range 2 (FR2); determine a third SMTC that fully or partially overlaps with the second measurement gap configuration for a third group of measurement objects in the FR2; encode configuration information to indicate the third SMTC for the third group of measurement objects for transmission to the UE; determine a first expected delay for receiving the feedback information of the first group of measurement objects and the second group of measurement objects; and determine a second expected delay for receiving the feedback information of the third group of measurement objects.

[0194] Example 16 is one or more media according to Example 15, wherein the first expected delay is determined according to the following formula:

[0195] as well as

[0196]

[0197] in: This is the expected recognition delay; It is the expected measurement delay, K Inter-freq,FR1,GS It is the scaling factor; SMTC i N is the SMTC cycle of the measurement object in this group; MGRP is the measurement gap repetition cycle of this measurement gap configuration; FR1,i It is the number of new radio (NR) frequency range 1 (FR1) carriers in the group of measurement objects; N FR2 It is the number of frequency-inter-frequency NR frequency range 2 (FR2) carriers in the measurement objects of this group; It is the number of SMTC opportunities used to identify cells on one of the inter-frequency carriers of this FR1 frequency; It is the number of SSBs used to identify the cells on one of the FR2 inter-frequency carriers; M measurement_Inter-freq,FR1 It is the number of SMTC opportunities used to measure the cell on one of the inter-frequency carriers of FR1; and M measurement_Inter-freq,FR2 It is used to measure the number of SSBs of a cell on one of the inter-frequency carriers of the FR2 frequency.

[0198] Example 17 is one or more media according to any one of Examples 11 to 13, wherein when the instruction is executed, it also causes the gNB to determine the expected delay in receiving the feedback information of the first set of measurement objects according to the following formula:

[0199]

[0200] in: This is the expected identification delay of the measured object in the first group; K Inter-freq,GS It is the scaling factor; SMTC i This is the first SMTC cycle; SMTC i,partial This is the SMTC cycle of the second SMTC; N FR1,i It is the number of inter-frequency NR FR1 carriers in the first group of measurement objects; N FR2,i This refers to the number of inter-frequency NRFR2 carriers in the second set of measurement objects; N FR1,i,partial This refers to the number of inter-frequency NR FR1 carriers in the second set of measurement objects; N FR2,i,partial It is the number of inter-frequency NR FR2 carriers in the second set of measurement objects; M Identify_Inter-freq,FR1 This is the number of SMTC opportunities used to identify cells on FR1 inter-frequency carriers; and M Identify_Inter-freq, FR2It is used to identify the number of SSBs of cells on the FR2 inter-frequency carrier.

[0201] Example 18 is one or more transient or non-transitory computer-readable media storing instructions thereon that, when executed by one or more processors, cause a user equipment (UE) to perform the following operations: determine a measurement gap configuration that the UE will use to measure feedback information in a New Radio (NR) wireless cellular network; receive configuration information from a next-generation node B (gNB) to indicate a measurement timing configuration (SMTC) based on a synchronization signal (SS) / physical broadcast channel (PBCH) block (SSB) that completely overlaps with the measurement gap configuration for a plurality of measurement objects, wherein the plurality of measurement objects are all the measurement objects that the UE will use the measurement gap configuration to measure their feedback information; determine feedback information for the plurality of measurement objects based on the SMTC and the measurement gap configuration; and encode the feedback information for transmission to the gNB.

[0202] Example 19 is one or more media according to Example 18, wherein when the instruction is executed, it also causes the UE to determine the expected delay in providing the feedback information to the gNB based on the amount of the measured object, the SMTC, and the measurement gap configuration.

[0203] Example 20 is one or more media according to Example 19, wherein the expected delay is determined based on the following formula:

[0204]

[0205] in: It is the recognition delay, K Inter-freq,GS It is the scaling factor; SMTC i The SMTC cycle of the measurement objects in this group is SMTC; MGRP is the measurement gap repetition cycle of this measurement gap configuration; N FR1,i It is the number of new radio (NR) frequency range 1 (FR1) carriers among the multiple measurement objects; N FR2 It is the number of NR frequency range 2 (FR2) carriers among the multiple measurement objects; It is the number of SMTC opportunities used to identify cells on one of the inter-frequency carriers of this FR1 frequency; It is the number of SSBs used to identify the cell on one of the inter-frequency carriers of the FR2 frequency.

[0206] Example 21 is based on one or more media according to Example 20, wherein the measurement delay is further determined according to the following formula:

[0207]

[0208] in: It is the measurement delay; M measurement_Inter-freq,FR1 It is the number of SMTC opportunities used to measure the cell on one of the inter-frequency carriers of FR1; and M measurement_Inter-freq,FR2 It is used to measure the number of SSBs of a cell on one of the inter-frequency carriers of the FR2 frequency.

[0209] Example 22 is one or more non-transitory computer-readable media storing instructions thereon that, when executed by one or more processors, cause a user equipment (UE) to perform the following operations: determine a measurement gap configuration that the UE will use to measure feedback information in a New Radio (NR) wireless cellular network; receive configuration information from a next-generation node B (gNB) to indicate a first measurement timing configuration (SMTC) based on a synchronization signal (SS) / physical broadcast channel (PBCH) block (SSB) that fully overlaps with the measurement gap configuration for one or more measurement objects in a first group; receive configuration information from the gNB to indicate a second SMTC that partially overlaps with the measurement gap configuration for one or more measurement objects in a second group, wherein the first group and the second group are combined to include all measurement objects that the UE will use the measurement gap configuration to measure its feedback information; determine feedback information for the first group of measurement objects and the second group of measurement objects based on the first SMTC and the second SMTC and the measurement gap configuration; and encode the feedback information for transmission to the gNB.

[0210] Example 23 is one or more media according to Example 22, wherein when the instruction is executed, it also causes the UE to determine the expected delay in providing the feedback information of the corresponding first or second group within the corresponding first or second group based on the amount of the measurement object in the corresponding first or second group, the corresponding first SMTC or second SMTC, and the measurement gap configuration.

[0211] Example 24 is one or more media according to Example 23, wherein the expected delay is determined according to the following formula:

[0212] as well as

[0213]

[0214] Wherein: T Indectify_Inter_perUEgap This is the expected recognition delay; It is the expected measurement delay, K Inter-freq,GS It is the scaling factor; SMTC i It is the SMTC cycle of the corresponding first or second group of measurement objects; MGRP is the measurement gap repetition cycle of the measurement gap configuration; N FR1,iIt is the number of new radio (NR) frequency range 1 (FR1) carriers in the corresponding first or second set of measurement objects; N FR2 It is the number of frequency-inter-frequency NR frequency range 2 (FR2) carriers in the corresponding first or second group of measurement objects; It is the number of SMTC opportunities used to identify cells on one of the inter-frequency carriers of this FR1 frequency; It is the number of SSBs used to identify the cells on one of the FR2 inter-frequency carriers; M measurement_Inter-freq,FR1 It is the number of SMTC opportunities used to measure the cell on one of the inter-frequency carriers of FR1; and M measurement_Inter-freq,FR2 It is used to measure the number of SSBs of a cell on one of the inter-frequency carriers of the FR2 frequency.

[0215] Example 25 is based on one or more media according to Example 22 or 23, which, when executed, also causes the UE to determine an expected delay in providing the feedback information of the first set of measurements therein, wherein the expected delay is determined according to the following formula:

[0216]

[0217] in: This is the expected identification delay of the measured object in the first group; K Inter-freq,GS It is the scaling factor; SMTC i This is the first SMTC cycle; SMTC i,partial This is the SMTC cycle of the second SMTC; N FR1,i It is the number of inter-frequency NR FR1 carriers in the first group of measurement objects; N FR2,i It is the number of frequency-inter-frequency NR FR2 carriers in the second set of measurement objects; N FR1,i,partial This refers to the number of inter-frequency NR FR1 carriers in the second set of measurement objects; N FR2,i,partial It is the number of inter-frequency NR FR2 carriers in the second set of measurement objects; M Identify_Inter-freq,FR1 This is the number of SMTC opportunities used to identify cells on FR1 inter-frequency carriers; and M Identify_Inter-freq, FR2 It is used to identify the number of SSBs of cells on the FR2 inter-frequency carrier.

[0218] Unless otherwise expressly stated, any of the embodiments described above may be combined with any other embodiment (or combination of embodiments). The foregoing description of one or more specific embodiments provides illustration and description, but is not intended to be exhaustive or to limit the scope of the embodiments to the precise forms disclosed. In view of the teachings above, modifications and variations are possible, or modifications and variations may be obtained from the practice of various embodiments.

Claims

1. A non-transitory computer-readable medium storing instructions thereon, the instructions causing a user equipment (UE) to perform an operation when executed by one or more processors, the operation comprising: Determine the measurement gap configuration that the UE will use to measure feedback information in the wireless network; The system receives configuration information from the base station, which indicates a measurement timing configuration (SMTC) based on the synchronization signal SS / physical broadcast channel PBCH block SSB that overlaps with the measurement gap configuration for multiple measurement objects. The feedback information of the plurality of measurement objects is determined based on the SMTC and the measurement gap configuration; The identification delay for identifying the measurement object among the plurality of measurement objects is determined based at least on the number of new radio NR frequency range 1 FR1 carriers among the plurality of measurement objects; The expected delay for the base station to receive the feedback information is determined based on the quantity of the measured object, the SMTC, and the measurement gap configuration, wherein the expected delay includes the identification delay and the measurement delay for measuring the feedback information of the measured object; and The feedback information is sent to the base station based on the identification delay.

2. The non-transitory computer-readable medium of claim 1, wherein the identification delay is at least based on the measurement gap repetition period (MGRP) configured in the measurement gap configuration.

3. The non-transitory computer-readable medium according to claim 2, wherein the recognition delay is determined according to the following formula: in: It is the recognition delay; It is the scaling factor; SMTC i It is the SMTC cycle of the multiple measurement objects; MGRP is the measurement gap repetition period of the measurement gap configuration; N FR1,i It is the number of NR FR1 carriers between frequencies among the multiple measurement objects; N FR2,i It is the number of NR frequency range 2 FR2 carriers among the multiple measurement objects; It is the number of SMTC opportunities used to identify cells on one of the inter-frequency NR FR1 carriers; and It is the number of SSBs used to identify the cell on one of the NR FR2 carriers in the frequency range.

4. The non-transitory computer-readable medium of claim 1, wherein the measurement delay is based at least on the number of inter-frequency NR frequency range 2 FR2 carriers among the plurality of measurement objects.

5. The non-transitory computer-readable medium of claim 4, wherein the measurement delay is determined according to the following formula: in: It is the measurement delay; K Inter-freq,GS It is the scaling factor; MGRP is the measurement gap repetition period of the measurement gap configuration; N FR1,i It is the number of NR FR1 carriers between frequencies among the multiple measurement objects; N FR2,i It is the number of NR FR2 carriers between frequencies among the multiple measurement objects; M measurement_Inter-freq,FR1 It is the number of SMTC opportunities used to measure the cells on one of the inter-frequency NR FR1 carriers; and M measurement_Inter-freq,FR2 It is used to measure the number of SSBs of a cell on one of the FR2 frequency inter-carriers.

6. A method for a user equipment (UE), comprising: Determine the measurement gap configuration that the UE will use to measure feedback information in the wireless network; The system receives configuration information from the base station, which indicates a measurement timing configuration (SMTC) based on the synchronization signal SS / physical broadcast channel PBCH block SSB that overlaps with the measurement gap configuration for multiple measurement objects. The feedback information of the plurality of measurement objects is determined based on the SMTC and the measurement gap configuration; The identification delay for identifying the measurement object among the plurality of measurement objects is determined based at least on the number of new radio NR frequency range 1 FR1 carriers among the plurality of measurement objects; The expected delay for the base station to receive the feedback information is determined based on the quantity of the measured object, the SMTC, and the measurement gap configuration, wherein the expected delay includes the identification delay and the measurement delay for measuring the feedback information of the measured object; and The feedback information is sent to the base station based on the identification delay.

7. The method of claim 6, wherein the recognition delay is determined according to the following formula: in: It is the recognition delay; K Inter-freq,GS It is the scaling factor; SMTC FR1 It is the SMTC cycle of the multiple measurement objects; N FR1 It is the number of NR FR1 carriers between frequencies among the plurality of measurement objects; and It is the number of SMTC opportunities used to identify a cell on one of the NR FR1 carriers in the frequency range.

8. The method of claim 6, wherein the measurement delay is at least based on the number of inter-frequency NR frequency range 2 FR2 carriers among the plurality of measurement objects.

9. The method of claim 6, wherein the identification delay is at least based on the measurement gap repetition period (MGRP) configured in the measurement gap configuration.

10. The method of claim 9, wherein the recognition delay is determined according to the following formula: in: It is the recognition delay; K Inter-freq,GS It is the scaling factor; SMTC i It is the SMTC cycle of the multiple measurement objects; MGRP is the measurement gap repetition period of the measurement gap configuration; N FR1,i It is the number of NR FR1 carriers between frequencies among the multiple measurement objects; N FR2,i It is the number of NR frequency range 2 FR2 carriers among the multiple measurement objects; It is the number of SMTC opportunities used to identify cells on one of the inter-frequency NR FR1 carriers; and It is the number of SSBs used to identify the cell on one of the NR FR2 carriers in the frequency range.

11. A user equipment (UE), comprising: transceiver; as well as A processor, communicatively coupled to the transceiver, is configured to: Determine the measurement gap configuration that the UE will use to measure feedback information in the wireless network; The system receives configuration information from the base station, which indicates a measurement timing configuration (SMTC) based on the synchronization signal SS / physical broadcast channel PBCH block SSB that overlaps with the measurement gap configuration for multiple measurement objects. The feedback information of the plurality of measurement objects is determined based on the SMTC and the measurement gap configuration; The identification delay for identifying the measurement object among the plurality of measurement objects is determined based at least on the number of new radio NR frequency range 2 FR2 carriers among the plurality of measurement objects; The expected delay for the base station to receive the feedback information is determined based on the quantity of the measured object, the SMTC, and the measurement gap configuration, wherein the expected delay includes the identification delay and the measurement delay for measuring the feedback information of the measured object; and The feedback information is sent to the base station based on the identification delay.

12. The UE of claim 11, wherein the measurement delay is based at least on the number of inter-frequency NR frequency range 2 FR2 carriers among the plurality of measurement objects.

13. The UE of claim 11, wherein the identification delay is determined based on the following formula: in: It is the recognition delay; K Inter-freq,GS It is the scaling factor; SMTC FR2 It is the SMTC cycle of the multiple measurement objects; N FR2 It is the number of frequency-inter-frequency NR FR2 carriers among the plurality of measurement objects; and It is the number of SMTC opportunities used to identify a cell on one of the frequency-inter-frequency NR FR2 carriers.

14. The UE of claim 11, wherein the identification delay is at least based on the measurement gap repetition period (MGRP) configured in the measurement gap configuration.

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