Display panels and spliced ​​display modules

Abstract

The present invention provides a display panel and a spliced ​​display module. The display panel includes an LED substrate and a driver substrate arranged in pairs. The LED substrate includes a PCB, multiple LED signal lines, and multiple LED chips, and the light-emitting area includes a clearance area at the edge. The driver substrate includes a base, a pixel driver circuit, and a peripheral control circuit. The pixel driver circuit and the LED chips are electrically connected via the LED signal lines, and the orthographic projection of the peripheral control circuit on the PCB is located within the clearance area. The present invention rearranges the LED signal lines to make them more densely arranged than in the prior art, so that the clearance area corresponds to the peripheral control circuit. This can produce a borderless display panel and a seamless spliced ​​display module, which is beneficial for improving the manufacturing yield of the driver substrate and splicing reliability.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a spliced ​​display module. Background Art

[0002] Sub-millimeter light emitting diode (Minilight emitting diode, MiniLED) and microlight emitting diode (Microlight emitting diode, MicroLED) display technology is developing rapidly. In order to save the number of driver chips, related technologies generally adopt TFT driving solutions. Simply put, multiple LED chips are transferred to a printed circuit board (Printed Circuit Board, PCB) to form an LED substrate, and the LED substrate is paired with a thin film transistor (Thin film transistor, TFT) driver substrate. The TFT driver substrate uses an active matrix active driving architecture to drive the LED chip to emit light. However, the edge of the glass substrate of the TFT driver substrate is provided with a peripheral control circuit. The related technology guides the peripheral control circuit to the back of the glass substrate by side routing or punching holes in the glass substrate to achieve a narrow frame. However, this method will result in a low yield of the TFT driver substrate and a high production cost; moreover, the TFT driver substrate has poor mechanical properties and is easy to break during splicing.

[0003] Therefore, there is an urgent need to provide a display panel and a spliced ​​display module to solve the above technical problems. Summary of the Invention

[0004] The present invention provides an organic light emitting display panel and a display device to solve the technical problems of low yield of TFT driving substrates in existing display panels and spliced ​​display modules, high production costs, and easy breakage during splicing.

[0005] To solve the above problems, the present invention provides the following technical solutions:

[0006] The present invention provides a display panel, comprising an LED substrate and a driving substrate arranged in a pair;

[0007] The LED substrate includes a PCB board, a plurality of LED signal lines and a plurality of LED chips. The entire surface of the PCB board is a light-emitting area, and the light-emitting area includes a clearance area at the edge. The plurality of LED chips are arranged on a side of the PCB board away from the driving substrate and are located in the light-emitting area.

[0008] The driving substrate includes a base and a pixel driving circuit and a peripheral control circuit arranged on a side of the base close to the LED base, wherein the peripheral control circuit is located on one side of the pixel driving circuit and at an edge of the base;

[0009] The pixel driving circuit and the LED chip are electrically connected via the LED signal line, and the orthographic projection of the peripheral control circuit on the PCB is located within the clearance area.

[0010] According to the display panel provided by the present invention, the display panel also includes a plurality of connection structures located between the LED substrate and the driving substrate, each of the connection structures electrically connecting the pixel driving circuit and one end of the LED signal line, and the other end of the LED signal line is electrically connected to the LED chip.

[0011] According to the display panel provided by the present invention, the connection structure is located on a side of the PCB board close to the driving substrate, or the connection structure is located on a side of the driving substrate close to the LED substrate.

[0012] According to the display panel provided by the present invention, each of the LED chips includes a chip body and an electrode provided on a side of the chip body close to the PCB board;

[0013] Wherein, in the top view direction, the LED substrate covers the driving substrate, and the unit density of the connection structure is greater than the unit density of the electrode.

[0014] According to the display panel provided by the present invention, the orthographic projection of the connection structure on the driving substrate is located on a side of the orthographic projection of the electrode electrically connected thereto on the driving substrate away from the external driving circuit.

[0015] According to the display panel provided by the present invention, the driving substrate further includes a flexible circuit board, one end of the flexible circuit board is electrically connected to the peripheral control circuit, and the other end of the flexible circuit board is wrapped around from the side of the driving substrate to the side of the base away from the flexible circuit board.

[0016] According to the display panel provided by the present invention, the orthographic projections of the peripheral control circuit and the flexible circuit board on the PCB are located within the clearance area.

[0017] According to the display panel provided by the present invention, the PCB board includes any one of a single-layer printed substrate, a multi-layer printed substrate and a double-sided wiring printed substrate.

[0018] According to the display panel provided by the present invention, the LED signal line is arranged inside the PCB board, and one end of the LED signal line is led out of the PCB board.

[0019] The present invention provides a spliced ​​display module, which is formed by splicing at least two of the above-mentioned display panels.

[0020] According to the spliced ​​display module provided by the present invention, the distance between two adjacent LED chips in two adjacent display panels is d1, and the distance between two adjacent LED chips in each display panel is d2; wherein d1 is equal to d2.

[0021] The beneficial effects of the present invention are as follows: the display panel and spliced ​​display module provided by the present invention include a pair of LED substrates and a driver substrate, and the spliced ​​display module is formed by splicing at least one display panel. The present invention rearranges the LED signal lines of the pixel driving circuit for electrically connecting the LED chip and the driver substrate so that the arrangement is denser than that of the prior art, thereby leaving a clearance area on the edge of the PCB board of the LED substrate, which is also provided with the LED chip, and the positive projection of the peripheral control circuit of the driver substrate on the PCB board is located in the clearance area, that is, the clearance area is arranged corresponding to the peripheral control circuit, thereby obtaining a borderless display panel and a seamless spliced ​​display module; at the same time, a small-area driver substrate can be used to drive a large-area LED substrate, which can greatly improve the utilization rate of the driver substrate and is conducive to improving the production yield of the driver substrate; in addition, it can avoid collision between adjacent driver substrates during splicing, which is conducive to improving the reliability of splicing. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 is a schematic cross-sectional structural diagram of a first display panel provided by an embodiment of the present invention;

[0024] Figure 2 It is a schematic cross-sectional structural diagram of a spliced ​​display module provided by an embodiment of the present invention.

[0025] Description of reference numerals:

[0026] 100. Display panel; 10. LED substrate; 11. PCB board; 111. First printed substrate; 112. Second printed substrate; 11a. Light-emitting area; 11b. Clearance area; 12. LED chip; 121. Chip body; 122. Electrode; 1221. First electrode; 1222. Second electrode; 13. LED signal line; 131. First LED signal line; 132. Second LED signal line; 20. Drive substrate; 21. Base; 22. Pixel drive circuit; 23. Peripheral control circuit; 30. Connection structure; 40. Flexible circuit board. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. In the present invention, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0028] See also Figure 1 An embodiment of the present invention provides a display panel 100 , which includes an LED substrate and a driving substrate 20 arranged in a pair.

[0029] The LED substrate includes a PCB board 11, multiple LED signal lines 13 and multiple LED chips 12. The entire surface of the PCB board 11 is a light-emitting area 11a, and the light-emitting area 11a includes a clearance area 11b located at the edge. The multiple LED chips 12 are arranged on the side of the PCB board 11 away from the driving substrate 20 and are located in the light-emitting area 11a.

[0030] The driver substrate 20 includes a base 21, a pixel driver circuit 22, and a peripheral control circuit 23 disposed on a side of the base 21 near the LED substrate. The peripheral control circuit 23 is located on one side of the pixel driver circuit 22 and at an edge of the base 21. The pixel driver circuit 22 and the LED chip 12 are electrically connected via the LED signal line 13, and the orthographic projection of the peripheral control circuit 23 on the PCB board 11 is located within the clearance area 11b.

[0031] It can be understood that in the embodiment of the present invention, the LED signal lines 13 of the pixel driving circuit 22 for electrically connecting the LED chip 12 and the driving substrate 20 are rearranged to be denser than the prior art, so that a clearance area 11b which is also provided with the LED chip 12 is left at the edge of the PCB board 11 of the LED substrate, and the positive projection of the peripheral control circuit 23 of the driving substrate 20 on the PCB board 11 is located within the clearance area 11b, that is, the clearance area 11b is arranged corresponding to the peripheral control circuit 23, so that a borderless display panel 100 and a seamless splicing display module can be obtained; at the same time, a small-area driving substrate 20 can be used to drive a large-area LED substrate, which can greatly improve the utilization rate of the driving substrate 20 and is beneficial to improving the production yield of the driving substrate 20; in addition, it can avoid collision between adjacent driving substrates 20 during splicing, which is beneficial to improving the reliability of splicing.

[0032] It should be noted that the clearance area 11 b refers to an area on the PCB board 11 , which does not correspond to the connection structure 30 .

[0033] The LED substrate is based on the PCB board 11, the LED chip 12 is disposed on the PCB board 11, and the LED signal line 13 is provided inside the PCB board 11. One end of the LED signal line 13 is electrically connected to the LED chip 12, and the other end passes through the PCB board 11 and is led out from the PCB board 11. It should be noted that the arrangement shape of the LED signal line 13 may include a fold line, a curve, or a combination of a fold line and a curve. The embodiments of the present invention do not limit the arrangement shape of the LED signal line 13, as long as it can electrically connect the LED chip 12 to the connection structure 30.

[0034] In this embodiment, a mass transfer process can be used to transfer the LED chips 12 to the PCB board 11. Specifically, the LED chips 12 include Mini LEDs or Micro LEDs. The plurality of LED chips 12 can include LED chips 12 of different colors. For example, the plurality of LED chips 12 can each be an LED that emits white light. Alternatively, the plurality of LED chips 12 can be configured to include a combination of LED chips 12 that emit red, green, and blue light, or another combination of LED chips 12 that emit white, red, green, and blue light.

[0035] Specifically, the substrate 21 can be a transparent glass substrate 21 or other types of substrates 21, but is not limited thereto. The driving substrate 20 includes any one of a silicon-based driving substrate 20, a glass-based LTPS substrate, a glass-based IGZO substrate, and a glass-based a-Si substrate, but is not limited thereto. Specifically, the driving substrate 20 is a thin film transistor driving substrate 20, and the driving substrate 20 includes a thin film transistor array layer arranged on the side of the substrate 21 close to the LED substrate, and the thin film transistor array layer includes a plurality of pixel driving circuits 22, and the pixel driving circuit 22 is an active matrix active drive. For example, each of the pixel driving circuits 22 includes two thin film transistors and a capacitor to adjust the brightness of the LED chip 12. The embodiment of the present invention adopts a thin film transistor driving substrate 20. Compared with the method of using an IC (Integrated Circuit Chip) chip to drive the LED chip 12 to emit light in the prior art, there is no need to set a large number of IC chips, which is conducive to cost saving.

[0036] Specifically, each pixel driving circuit 22 includes multiple driving signal lines, which may include multiple data lines, multiple scan lines, and multiple power lines. Each LED chip 12 is driven by a corresponding pixel driving circuit 22, and each pixel driving circuit 22 drives at least one LED chip 12. It should be noted that, to clearly illustrate the technical solution provided by the present invention, this embodiment uses the example of each pixel driving circuit 22 driving one LED chip 12.

[0037] In this embodiment, the display panel 100 further includes a plurality of connection structures 30 located between the LED substrate and the driver substrate 20. Each of the connection structures 30 is electrically connected to the pixel driver circuit 22 and one end of the LED signal line 13. The other end of the LED signal line 13 is electrically connected to the LED chip 12. It is understood that the process of driving the LED chip 12 to emit light is as follows: the peripheral control circuit 23 provides a drive signal to the corresponding drive signal line. The drive signal line transmits the drive signal to the pixel driver circuit 22. The pixel driver circuit 22 transmits the drive signal to the LED chip 12 in turn through the connection structure 30 and the LED signal line 13. The LED chip 12 emits light according to the transmitted drive signal.

[0038] In one embodiment, the connection structure 30 is located on a side of the PCB 11 near the driver substrate 20. The connection structure 30 can be provided on the same layer as the pixel electrode layer of the driver substrate 20. The connection structure 30 and the pixel electrode layer can be electrically connected by bonding. When the LED substrate and the driver substrate 20 are paired, the end of the LED signal line 13 away from the LED chip 12 is electrically connected to the connection structure 30.

[0039] In another embodiment, the connection structure 30 may also be located on a side of the driving substrate 20 close to the LED substrate. When the LED substrate and the driving substrate 20 are paired, the connection structure 30 is electrically connected to the pixel electrode layer.

[0040] Optionally, the material of the connection structure 30 includes but is not limited to metals, alloys, conductive adhesives and other conductive materials, for example, indium, tin, solder paste, various conductive alloys, conductive adhesives and the like.

[0041] In this embodiment, each LED chip 12 includes a chip body and an electrode 122 disposed on a side of the chip body near the PCB board 11. Specifically, each LED chip 12 includes a chip body and two electrodes 122. The chip body serves as a light-emitting layer 121 for emitting light. The electrodes 122 are solder pads for transmitting electrical signals. The electrodes 122 include a first electrode 1221 and a second electrode 1222. One of the first electrode 1221 and the second electrode 1222 serves as the cathode of the LED chip 12, and the other of the first electrode 1221 and the second electrode 1222 serves as the anode of the LED chip 12. Accordingly, the LED signal lines 13 include a first LED signal line 131 and a second LED signal line 132. One of the first LED signal lines 131 is electrically connected to the first electrode 1221, and the other of the second LED signal lines 132 is electrically connected to the second electrode 1222. Of course, the LED substrate may also include other traces, but this is not the focus of the present invention and will not be described in detail here.

[0042] In this embodiment, the shape of the chip body can be a cuboid. In other embodiments, the shape of the chip body can also be any one of a cylinder, a triangular cube and a hexagonal cube, but the present invention is not limited thereto.

[0043] In this embodiment, the LED signal line 13 may be a metal wire, and the metal wire may be a gold wire, an aluminum wire, or a copper wire.

[0044] In this embodiment, in a top view, the LED substrate covers the driver substrate 20, and the unit density of the connection structure 30 is greater than the unit density of the electrodes 122. It will be appreciated that in the prior art, the sizes of the LED substrate and the driver substrate 20 arranged in a pair are generally set to be equal. However, in this embodiment of the present invention, the size of the LED substrate is larger than that of the driver substrate 20. Specifically, the area of ​​the LED substrate is larger than that of the driver substrate 20. Furthermore, the area of ​​the PCB board 11 is larger than that of the base 21.

[0045] Specifically, the technical solution of the present invention can be understood with reference to the following two embodiments: In one embodiment, the size of the LED substrate remains unchanged, and the distance between two adjacent connection structures 30 on the driving substrate 20 is reduced, thereby reducing the size of the entire driving substrate 20. In another embodiment, the size of the driving substrate 20 remains unchanged, and the distance between two adjacent connection structures 30 on the driving substrate 20 is reduced. In this way, a larger number of connection structures 30 can be provided on the driving substrate 20, that is, a larger number of pixel driving circuits 22 can be provided on the driving substrate 20. Furthermore, if the distance between two adjacent LED chips 12 on the LED substrate remains unchanged, a larger number of LED chips 12 can be accommodated on the LED substrate, thereby improving the display effect of the display panel 100.

[0046] It is understandable that, in combination with the above two embodiments, the embodiment of the present invention can use a smaller-area driver substrate 20 to drive a larger-area LED substrate, thereby significantly improving the utilization rate of the driver substrate 20 and facilitating an improvement in the manufacturing yield of the driver substrate 20. In addition, when the display panels 100 are spliced ​​together to form a spliced ​​display module, due to the large area of ​​the LED substrates, when the LED substrates of two adjacent display panels 100 are connected, a gap will still exist between the driver substrates 20 of the two adjacent display panels 100, thereby preventing collisions between the adjacent driver substrates 20 during splicing, thereby improving the reliability of the splicing.

[0047] In this embodiment, the orthographic projection of the connecting structure 30 on the driving substrate 20 is located on the side of the orthographic projection of the electrode 122 electrically connected thereto on the driving substrate 20 away from the external driving circuit, so that the clearance area 11b corresponds to the peripheral control circuit 23. Since the clearance area 11b is also provided with the LED chip 12, and the LED chip 12 is driven by the pixel driving circuit 22, the LED chip 12 in the clearance area 11b can emit light, that is, the LED chip 12 above the peripheral control circuit 23 can emit light, and therefore, the display panel 100 can be borderless.

[0048] In this embodiment, the driving substrate 20 further includes a flexible printed circuit (FPC) 40 , one end of which is electrically connected to the peripheral control circuit 23 , and the other end of the flexible printed circuit 40 is wound around from the side of the base 21 to a side of the driving substrate 20 away from the flexible printed circuit 40 , so as to further reduce the frame of the display panel 100 .

[0049] Furthermore, the orthographic projections of the peripheral control circuit 23 and the flexible circuit board 40 on the PCB board 11 are located within the clearance area 11b. The reason for this arrangement is that, since the flexible circuit board 40 has a certain thickness on the side of the driving substrate 20, the LED chip 12 in the prior art is generally arranged opposite to the connecting structure 30, while the LED chip 12 in the present invention is staggered with the connecting structure 30, so that the clearance area 11b corresponds to the flexible circuit board 40 and the peripheral control circuit 23, thereby further reducing the frame of the display panel 100.

[0050] Specifically, the flexible circuit board 40 may be connected to the peripheral control circuit 23 via anisotropic conductive film (ACF).

[0051] In this embodiment, the PCB board 11 includes any one of a single-layer printed circuit board, a multi-layer printed circuit board, and a double-sided printed circuit board, but the embodiment of the present invention is not limited thereto. Figure 1The PCB board 11 is a two-layer printed substrate, and the PCB board 11 includes a first printed substrate 111 and a second printed substrate 112 stacked together. The second printed substrate 112 is arranged on a side of the first printed substrate 111 away from the driving substrate 20, and the LED chip 12 is located on a side of the second printed substrate 112 away from the driving substrate 20. The LED lead is led out from a side of the first printed substrate 111 close to the driving substrate 20 and is electrically connected to the connection structure 30.

[0052] Of course, the PCB board 11 can also be a multi-layer printed circuit board. It is understood that, compared to using a printed circuit board with different layers, using two or more layers of printed circuit boards can increase the arrangement space of the LED signal lines 13, which helps to avoid short circuits caused by crossing between multiple LED signal lines 13. Furthermore, a multi-layer arrangement can extend the length of the LED signal lines 13, which helps to reduce resistance.

[0053] See also Figure 2 The present invention also provides a spliced ​​display module, which is formed by splicing at least two of the display panels 100 in the above embodiment. Since the display panels 100 are frameless display panels 100, the spliced ​​display module formed by splicing the display panels 100 is a seamless display module.

[0054] In this embodiment, the distance between two adjacent LED chips 12 in two adjacent display panels 100 is d1, and the distance between two adjacent LED chips 12 in each display panel 100 is d2; wherein, d1 is equal to d2, so as to improve the luminous consistency of the LED chip 12 located at the joint of the two adjacent display panels 100 and the LED chip 12 located at the non-joint joint, which is beneficial to improving the display effect of the entire spliced ​​display module.

[0055] Specifically, the spliced ​​display module can be a computer, a television, an in-vehicle display device, or other display device having a display function, and the present invention does not impose any specific restrictions on this. The spliced ​​display module provided in the embodiment of the present invention has the beneficial effects of the display panel 100 provided in the embodiment of the present invention. For details, please refer to the detailed description of the spliced ​​display module in the above embodiment, and this embodiment will not be repeated here.

[0056] Beneficial effects: The display panel and spliced ​​display module provided by the present invention include a pair of LED substrates and a driver substrate, and the spliced ​​display module is formed by splicing at least one display panel. The present invention rearranges the LED signal lines of the pixel driving circuit for electrically connecting the LED chip and the driver substrate so that the arrangement is denser than that of the prior art, thereby leaving a clearance area on the edge of the PCB board of the LED substrate, which is also provided with the LED chip, and the positive projection of the peripheral control circuit of the driver substrate on the PCB board is located in the clearance area, that is, the clearance area is arranged corresponding to the peripheral control circuit, thereby obtaining a borderless display panel and a seamless spliced ​​display module; at the same time, a small-area driver substrate can be used to drive a large-area LED substrate, which can greatly improve the utilization rate of the driver substrate and is conducive to improving the production yield of the driver substrate; in addition, it can avoid collision between adjacent driver substrates during splicing, which is conducive to improving the reliability of splicing.

[0057] The embodiments of the present invention are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core ideas. At the same time, for those skilled in the art, according to the ideas of the present invention, there may be changes in the specific implementation methods and application scopes. In summary, the contents of this specification should not be understood as limiting the present invention.

Claims

1. A display panel, characterized in that: including an LED substrate and a driver substrate arranged in a group; The LED substrate includes a PCB, a plurality of LED signal lines, and a plurality of LED chips. The entire surface of the PCB is a light-emitting area, and the light-emitting area includes a clearance area at the edge. The plurality of LED chips are arranged on a side of the PCB away from the driving substrate and located in the light-emitting area, and the LED chips are arranged in the clearance area. The driving substrate includes a base and a pixel driving circuit and a peripheral control circuit arranged on a side of the base close to the LED base, wherein the peripheral control circuit is located on one side of the pixel driving circuit and at an edge of the base; The pixel driving circuit and the LED chip are electrically connected via the LED signal line, the orthographic projection of the peripheral control circuit on the PCB is located within the clearance area, and the display panel further comprises a plurality of connection structures located between the LED substrate and the driver substrate, each of the connection structures being electrically connected between the pixel driving circuit and one end of the LED signal line, and the other end of the LED signal line being electrically connected to the LED chip; Each of the LED chips includes a chip body and an electrode arranged on a side of the chip body close to the PCB board, wherein, in the top view direction, the LED substrate covers the driving substrate, and the unit density of the connection structure is greater than the unit density of the electrode.

2. The display panel according to claim 1, wherein: The connection structure is located on a side of the PCB board close to the driving substrate, or the connection structure is located on a side of the driving substrate close to the LED substrate.

3. The display panel according to claim 1, wherein: The orthographic projection of the connection structure on the driving substrate is located on a side of the orthographic projection of the electrode electrically connected thereto on the driving substrate away from the peripheral control circuit.

4. The display panel according to claim 1, wherein: The driving substrate further includes a flexible circuit board, one end of which is electrically connected to the peripheral control circuit, and the other end of which is wound from a side of the driving substrate to a side of the base away from the flexible circuit board.

5. The display panel according to claim 4, wherein: The orthographic projections of the peripheral control circuit and the flexible circuit board on the PCB are located within the clearance area.

6. The display panel according to claim 1, wherein: The PCB board includes any one of a single-layer printed circuit board, a multi-layer printed circuit board and a double-sided wiring printed circuit board.

7. The display panel according to claim 1, wherein: The LED signal line is passed through the interior of the PCB board, and one end of the LED signal line is led out of the PCB board.

8. A splicing display module, characterized in that: It is formed by splicing at least two of the display panels according to any one of claims 1 to 7.

9. The splicing display module according to claim 8, characterized in that: The distance between two adjacent LED chips in two adjacent display panels is d1, and the distance between two adjacent LED chips in each display panel is d2; wherein d1 is equal to d2.

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