Earphone box and earphone system

Abstract

The embodiment of the application provides an earphone box and an earphone system, and belongs to the technical field of earphones. The earphone box comprises a box body and a box cover, the box body is movably connected with the box cover, the box body has a containing cavity, the containing cavity is used for containing earphones, and the box cover is used for covering the containing cavity; a semiconductor temperature adjusting assembly is arranged in the box body, the semiconductor temperature adjusting assembly is used for cooling the containing cavity in a case where the semiconductor temperature adjusting assembly is in a first working state, and the semiconductor temperature adjusting assembly is used for heating the containing cavity in a case where the semiconductor temperature adjusting assembly is in a second working state.

Description

Technical Field

[0001] This application relates to the field of headphone technology, specifically to a headphone case and headphone system. Background Technology

[0002] With the development of technology, electronic devices are becoming increasingly widespread. Typically, electronic devices come with headphones, which connect wirelessly to the device, allowing users to listen to its audio. In these devices, the headphones are usually placed in a charging case, which has a housing and a cavity where the headphones are placed. However, the temperature of the headphones inside the case changes with ambient temperature. For example, in a high-temperature environment, the headphones are also warmer, and in a low-temperature environment, they are cooler. This means the charging case doesn't regulate the headphone temperature, resulting in a poor user experience when removing the headphones from the case.

[0003] Application content

[0004] This application provides an earphone case and earphone system to solve the problem in the related art where the earphone case does not regulate the temperature of the earphones, resulting in a poor user experience when the user takes the earphones out of the earphone case to wear them.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application provide an earphone case, the earphone case comprising: a case body and a case lid, the case body and the case lid being movably connected, the case body having a receiving cavity for receiving earphones, and the case lid for covering the receiving cavity;

[0007] The housing is provided with a semiconductor temperature regulating component. When the semiconductor temperature regulating component is in the first working state, the semiconductor temperature regulating component is used to cool the receiving cavity.

[0008] When the semiconductor temperature regulating component is in the second operating state, the semiconductor temperature regulating component is used to heat the cavity.

[0009] In a second aspect, embodiments of this application provide an earphone system, the earphone system including earphones and the earphone case described in the first aspect above;

[0010] When the semiconductor temperature regulating component is in the first working state, the semiconductor temperature regulating component cools the headphones.

[0011] When the semiconductor temperature regulating component is in the second operating state, the semiconductor temperature regulating component heats up the headphones.

[0012] In this embodiment, the headphone case includes a body and a lid, which are movably connected. The body has a receiving cavity, allowing the headphones to be accommodated. The lid covers the receiving cavity, thus protecting the headphones and facilitating their portability. Because the body contains a semiconductor temperature regulating component, the temperature of the receiving cavity can be adjusted after the headphones are placed inside, ensuring a comfortable temperature for the headphones. Specifically, in a first operating state, the semiconductor temperature regulating component cools the receiving cavity, thus cooling the headphones inside. In a second operating state, the semiconductor temperature regulating component heats the receiving cavity, thus warming the headphones inside, ensuring a comfortable temperature for the user when wearing them. In other words, by setting a semiconductor temperature regulation component in the case, the temperature in the housing cavity of the case can be regulated. Thus, after the earphones are placed in the housing cavity, the temperature of the earphones can be regulated so that when the user takes the earphones out of the earphone case and wears them, the earphones are at a suitable temperature, thereby improving the user's earphone experience. Attached Figure Description

[0013] Figure 1 This is a schematic diagram illustrating an earphone case provided in an embodiment of this application;

[0014] Figure 2 This diagram illustrates an embodiment of a headphone system provided in this application.

[0015] Figure 3 This is a schematic diagram showing the internal structure of a box provided in an embodiment of this application;

[0016] Figure 4 This diagram illustrates a first semiconductor temperature regulation component provided in an embodiment of this application.

[0017] Figure 5 This diagram illustrates a semiconductor temperature regulation component provided in an embodiment of this application.

[0018] Figure 6 This diagram illustrates a second heat-conducting component provided in an embodiment of this application.

[0019] Figure 7 This is a schematic diagram illustrating a second heat-conducting component connecting a heat storage component according to an embodiment of this application;

[0020] Figure 8 This is a schematic diagram illustrating a second heat-conducting element connecting a heat exchanger according to an embodiment of this application.

[0021] Figure label:

[0022] 10: Earphone case; 20: Earphone; 30: Semiconductor temperature control component; 40: Second heat conduction component; 50: Heat storage component; 60: Heat exchange component; 11: Case body; 12: Case lid; 31: First semiconductor temperature control component; 32: Second semiconductor temperature control component; 33: First heat conduction component; 34: Third temperature control component; 35: Fourth temperature control component; 41: First heat conduction part; 42: Second heat conduction part; 43: Connecting part; 111: First sub-cavity; 112: Second sub-cavity. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0025] like Figures 1 to 8 As shown, the earphone case includes: an earphone case 10 comprising a case body 11 and a case lid 12, the case body 11 and the case lid 12 being movably connected; the case body 11 having a receiving cavity for receiving earphones 20; and the case lid 12 for covering the receiving cavity. A semiconductor temperature regulating component 30 is disposed within the case body 11. In a first operating state, the semiconductor temperature regulating component 30 is used to cool the receiving cavity; in a second operating state, the semiconductor temperature regulating component 30 is used to heat the receiving cavity.

[0026] In this embodiment, the headphone case 10 includes a body 11 and a lid 12, which are movably connected. The body 11 has a receiving cavity, which can accommodate the headphones 20. The lid 12 covers the receiving cavity, thus protecting the headphones 20 and making it easy to carry. Since a semiconductor temperature regulating component 30 is provided in the body 11, after placing the headphones 20 in the receiving cavity, the temperature of the receiving cavity can be adjusted by the semiconductor temperature regulating component 30 to ensure the headphones 20 are at a suitable temperature. Specifically, when the semiconductor temperature regulating component 30 is in a first operating state, it cools the receiving cavity, thus cooling the headphones 20 inside. When the semiconductor temperature regulating component 30 is in a second operating state, it heats the receiving cavity, thus warming the headphones 20 inside, ensuring the temperature of the headphones 20 is comfortable for the user when wearing them. In other words, by setting a semiconductor temperature regulation component 30 in the housing 11, the temperature in the housing cavity of the housing 11 can be regulated by the semiconductor temperature regulation component 30. Thus, after the earphone 20 is placed in the housing cavity, the temperature of the earphone 20 can be regulated so that when the user takes the earphone 20 out of the earphone case 10 and wears it, the temperature of the earphone 20 is suitable, thereby making the user experience of using the earphone 20 better.

[0027] It should be noted that, in this embodiment of the application, the box body 11 and the box lid 12 can be movably connected by a pivot, or the box body 11 and the box lid 12 can be movably connected by a hinge. The specific connection method between the box body 11 and the box lid 12 is not limited in this embodiment of the application.

[0028] In addition, in this embodiment, the semiconductor temperature regulating component 30 is disposed around the receiving cavity, with the side of the semiconductor temperature regulating component 30 closer to the receiving cavity being the inner side and the side of the semiconductor temperature regulating component 30 away from the receiving cavity being the outer side. When the semiconductor temperature regulating component 30 is in a first operating state, the inner side cools and the outer side dissipates heat; when the semiconductor temperature regulating component 30 is in a second operating state, the inner side dissipates heat and the outer side cools.

[0029] Since the semiconductor temperature regulating component 30 is arranged around the receiving cavity, it has a side close to the receiving cavity and a side away from the receiving cavity, i.e., it has an inner side and an outer side. When the semiconductor temperature regulating component 30 is in the first operating state, the inner side cools and the outer side dissipates heat, thereby lowering the temperature of the receiving cavity and thus lowering the temperature of the earphone 20 inside the receiving cavity. When the semiconductor temperature regulating component 30 is in the second operating state, the inner side dissipates heat and the outer side cools, thereby raising the temperature of the receiving cavity and thus raising the temperature of the earphone 20 inside the receiving cavity.

[0030] In addition, in this embodiment, a controller can be provided in the housing 11, and the controller is electrically connected to the semiconductor temperature regulating component 30. The controller can control the current flow direction in the semiconductor temperature regulating component 30, thereby causing different operating states of the semiconductor temperature regulating component 30. Specifically, the controller controls the current flow direction of the semiconductor temperature regulating component 30 to be a first direction, making the inner side of the semiconductor temperature regulating component 30 a cold end and the outer side a hot end, thereby lowering the temperature in the receiving cavity and thus lowering the temperature of the earphone 20 in the receiving cavity; the controller controls the current flow direction of the semiconductor temperature regulating component 30 to be a second direction, making the inner side of the semiconductor temperature regulating component 30 a hot end and the outer side a cold end, thereby raising the temperature in the receiving cavity and thus raising the temperature of the earphone 20 in the receiving cavity.

[0031] In some embodiments, the receiving cavity may include a first sub-cavity 111 and a second sub-cavity 112, both of which are used to receive the earphone 20. The semiconductor temperature regulation assembly 30 may include a first semiconductor temperature regulation assembly 31, a second semiconductor temperature regulation assembly 32, and a first heat-conducting element 33. The first semiconductor temperature regulation assembly 31 is disposed around the first sub-cavity 111, and the second semiconductor temperature regulation assembly 32 is disposed around the second sub-cavity 112. A first end of the first heat-conducting element 33 is connected to the inner side of the first semiconductor temperature regulation assembly 31 near the receiving cavity, and a second end of the first heat-conducting element 33 is connected to the inner side of the second semiconductor temperature regulation assembly 32 near the receiving cavity.

[0032] Since the receiving cavity includes a first sub-cavity 111 and a second sub-cavity 112, and the semiconductor temperature regulation component 30 includes a first semiconductor temperature regulation component 31 and a second semiconductor temperature regulation component 32, the first semiconductor temperature regulation component 31 can be arranged around the first sub-cavity 111, and the second semiconductor temperature regulation component 32 can be arranged around the second sub-cavity 112. Thus, the first semiconductor temperature regulation component 31 can regulate the temperature in the first sub-cavity 111, and the second semiconductor temperature regulation component 32 can regulate the temperature in the second sub-cavity 112. Therefore, when the earphone 20 is placed in the first sub-cavity 111 and the second sub-cavity 112, the earphone 20 in both sub-cavities can be adjusted, improving the user experience when using the earphone 20. In other words, by respectively arranging the first semiconductor temperature regulation component 31 and the second semiconductor temperature regulation component 32 in the first sub-cavity 111 and the second sub-cavity 112, the user experience of using the earphone 20 can be improved.

[0033] Furthermore, when the first end of the first heat-conducting element 33 is connected to the inner side of the first semiconductor temperature regulating component 31 near the receiving cavity, and the second end of the first heat-conducting element 33 is connected to the inner side of the second semiconductor temperature regulating component 32 near the receiving cavity, the heat inside the first semiconductor temperature regulating component 31 and the heat inside the second semiconductor temperature regulating component 32 can be transferred to each other through the first heat-conducting element 33. This balances the heat inside the first semiconductor temperature regulating component 31 and the heat inside the second semiconductor temperature regulating component 32, thereby making the temperature of the first sub-cavity 111 regulated by the first semiconductor temperature regulating component 31 equal to the temperature of the second sub-cavity 112 regulated by the second semiconductor temperature regulating component 32. Ultimately, the temperatures in the first sub-cavity 111 and the second sub-cavity 112 are equal, making the temperature of the earphone 20 in the first sub-cavity 111 equal to the temperature of the earphone 20 in the second sub-cavity 112. As a result, after the user removes the earphone 20 from the housing 11, the user will feel that the two earphones 20 have the same temperature, preventing the user from perceiving a temperature difference between the two earphones 20 and improving the user experience. That is, by setting the first heat-conducting element 33, with the first end of the first heat-conducting element 33 connected to the inner side of the first semiconductor temperature regulating component 31 and the second end of the first heat-conducting element 33 connected to the inner side of the second semiconductor temperature regulating component 32, the temperature of the earphone 20 in the first sub-cavity 111 can be equal to the temperature of the earphone 20 in the second sub-cavity 112. As a result, after the user takes the earphone 20 out of the housing 11, the user will feel that the two earphones 20 are at the same temperature, thus improving the user experience.

[0034] It should be noted that the first semiconductor temperature regulating component 31 can be disposed on the cavity wall of the first sub-cavity 111, and the second semiconductor temperature regulating component 32 can be disposed on the cavity wall of the second sub-cavity 112, so that when the earphone 20 is placed in the first sub-cavity 111 and the second sub-cavity 112 respectively, the earphone 20 contacts the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 respectively. Of course, the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 can also be configured in other ways. For example, the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 can also be disposed in the housing 11, with multiple first through holes on the cavity wall of the first sub-cavity 111 and multiple second through holes on the cavity wall of the second sub-cavity 112. The first semiconductor temperature regulating component 31 is in contact with the cavity wall of the first sub-cavity 111, and the first semiconductor temperature regulating component 31 is connected to the receiving space of the first sub-cavity 111 through the first through holes, and the second semiconductor temperature regulating component 32 is connected to the receiving space of the second sub-cavity 112 through the second through holes. Thus, when the earphone 20 is placed in the first sub-cavity 111 and the second sub-cavity 112, the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 can respectively regulate the temperature in the first sub-cavity 111 and the temperature in the second semiconductor temperature regulating component 32, thereby regulating the temperature of the earphone 20. The configuration of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 is not limited in this embodiment.

[0035] In addition, in this embodiment, the first heat-conducting element 33 can be formed of a material with high thermal conductivity. For example, the first heat-conducting element 33 can be formed of graphene with high thermal conductivity, or, for example, the first heat-conducting element 33 can be formed of copper sheet. The specific material of the first heat-conducting element 33 is not limited in this embodiment.

[0036] Additionally, in some embodiments, the earphone case may also include a bendable second heat-conducting element 40. The second heat-conducting element 40 is connected to the outer side of the semiconductor temperature regulating assembly 30 away from the receiving cavity, and extends to the case cover 12. When the case cover 12 is movable relative to the case body 11, the second heat-conducting element 40 bends with the case cover 12.

[0037] Since the second heat-conducting element 40 is connected to the outer side of the semiconductor temperature regulating assembly 30 away from the receiving cavity, and the second heat-conducting element 40 extends to the cover 12, the second heat-conducting element 40 can bend along with the cover 12 when the cover 12 moves relative to the housing 11. In addition, when the outer side of the semiconductor temperature regulating assembly 30 dissipates heat, the heat can also be transferred to the cover 12 through the second heat-conducting element 40, which is equivalent to increasing the heat dissipation path of the semiconductor temperature regulating assembly 30, which is beneficial to improving the regulation efficiency of the semiconductor temperature regulating assembly 30.

[0038] In some embodiments, the receiving cavity may include a first sub-cavity 111 and a second sub-cavity 112. The earphone case may include a first semiconductor temperature regulating assembly 31 and a second semiconductor temperature regulating assembly 32. The first semiconductor temperature regulating assembly 31 is disposed around the first sub-cavity 111, and the second semiconductor temperature regulating assembly 32 is disposed around the second sub-cavity 112. The second heat-conducting member 40 includes a first heat-conducting part 41, a second heat-conducting part 42, and a connecting part 43. The first heat-conducting part 41 is connected to the outside of the first semiconductor temperature regulating assembly 31, the second heat-conducting part 42 is connected to the outside of the second semiconductor temperature regulating assembly 32, and the connecting part 43 connects the first heat-conducting part 41 and the second heat-conducting part 42, extending to the case cover 12.

[0039] Since the first heat-conducting part 41 is connected to the outside of the first semiconductor temperature regulating component 31, and the second heat-conducting part 42 is connected to the outside of the second semiconductor temperature regulating component 32, and the connecting part 43 connects the first heat-conducting part 41 and the second heat-conducting part 42, and extends to the cover 12, when the cover 12 is closed or opened relative to the housing 11, the cover 12 can drive the connecting part 43 to move, so that the connecting part 43 moves relative to the second heat-conducting part 42 and the first heat-conducting part 41. Furthermore, when the earphone 20 is charging in the housing 11, the temperature of the earphone 20 will rise, and the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 will lower the temperature of the first sub-cavity 111 and the second... The temperature of the cavity 112 is adjusted so that the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 will transfer the generated heat to the first heat-conducting part 41 and the second heat-conducting part 42, respectively. Since the cover 12 does not house the earphone 20, it is essentially devoid of a heating element, resulting in a lower temperature for the cover 12 compared to the cavity. The first heat-conducting part 41 and the second heat-conducting part 42 transfer heat to the connecting part 43, effectively providing a dissipation path for the heat in both parts. This facilitates the adjustment of the earphone 20 temperature by the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32. In other words, by providing the second heat-conducting component 40, the adjustment efficiency of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 can be improved.

[0040] Furthermore, in this embodiment, when the temperature of the external space of the housing 11 is greater than or equal to a first preset temperature threshold, the controller controls the current flow direction of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 to a first flow direction, such that the ends of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 located in the receiving cavity or facing the receiving cavity are cold ends, that is, the inner sides of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 are cold ends, and the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 are located outside the receiving cavity or away from the receiving cavity. The outer ends of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 are the hot ends. The first heat-conducting part 41 and the second semiconductor temperature regulating component 32 are connected to the hot ends, thereby reducing the temperature in the receiving cavity and thus lowering the temperature of the earphone 20 in the receiving cavity. The heat from the hot ends of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 is transferred to the connecting part 43 through the first heat-conducting part 41 and the second heat-conducting part 42, respectively. That is, when the temperature of the external space of the housing 11 is greater than or equal to the first preset temperature threshold, the controller controls the first semiconductor temperature regulating component 31 to lower the temperature in the receiving cavity. The current flow direction of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 is such that the end of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 closer to the earphone 20 is the cold end, and the end away from the earphone 20 is the hot end, thereby cooling the earphone 20; when the temperature of the external space of the housing 11 is less than or equal to the second preset temperature threshold, the controller controls the current flow direction of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 to the second flow direction, so that the end of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 located in the receiving cavity or facing the receiving cavity is the hot end. The end located outside or away from the receiving cavity is the cold end, thereby raising the temperature inside the receiving cavity by the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32, which in turn raises the temperature of the earphone 20 inside the receiving cavity. Specifically, when the temperature of the external space of the housing 11 is less than or equal to a second preset temperature threshold, the controller controls the current flow of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32, making the end of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 closer to the earphone 20 the hot end and the end away from the earphone 20 the cold end, thus heating the earphone 20. The first preset temperature threshold is greater than or equal to the second preset temperature threshold.

[0041] Additionally, in some embodiments, the headphone case may also include a heat storage element 50. The heat storage element 50 is located within the case body 11, and the second heat-conducting element 40 is connected to the heat storage element 50 for heat exchange.

[0042] Since the second heat-conducting element 40 is connected to the heat storage element 50, after the second heat-conducting element 40 transfers heat to the heat storage element 50, the heat storage element 50 can store the heat and prevent heat loss. When it is necessary to transfer heat to the second heat-conducting element 42, the heat storage element 50 transfers the stored heat to the second heat-conducting element 40. That is, by providing the heat storage element 50, heat can be stored or released, facilitating the heat conduction by the second heat-conducting element 40.

[0043] It should be noted that when the second heat-conducting component 40 includes a first heat-conducting part 41, a second heat-conducting part 42, and a connecting part 43, the first heat-conducting part 41 and the second heat-conducting part 42 are connected to the heat storage component 50.

[0044] Furthermore, in this embodiment, when the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 respectively lower the temperature in the first sub-cavity 111 and the second sub-cavity 112, that is, when the semiconductor temperature regulating component 30 lowers the temperature in the receiving cavity, the heat from the second heat-conducting part 42 can be transferred to the heat storage component 50, thereby storing heat in the heat storage component 50. Due to the presence of the heat storage component 50, the heat from the second heat-conducting part 42 can be transferred not only to the first heat-conducting part 41 but also to the heat storage component 50, effectively providing an additional heat transfer path for the second heat-conducting part 42. This allows for rapid heat transfer from the second heat-conducting part 42, thereby improving the regulating efficiency of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32. When the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 respectively raise the temperature in the first sub-cavity 111 and the second sub-cavity 112, that is, when the semiconductor temperature regulating component 30 raises the temperature in the receiving cavity, the heat storage component 50 can transfer heat to the second heat-conducting part 42, thereby releasing heat from the heat storage component 50.

[0045] In some embodiments, the second heat-conducting element 40 includes a first heat-conducting portion 41, a second heat-conducting portion 42, and a connecting portion 43. The first heat-conducting portion 41 is connected to the outside of the first semiconductor temperature regulating component 31, the second heat-conducting portion 42 is connected to the outside of the second semiconductor temperature regulating component 32, and the connecting portion 43 connects the first heat-conducting portion 41 and the second heat-conducting portion 42, extending to the cover 12. The first heat-conducting portion 41 extends in the housing 11 to form a first bend, and the second heat-conducting portion 42 extends in the housing 11 to form a second bend. Both the first bend and the second bend are connected to the heat storage element 50.

[0046] Since the first heat-conducting part 41 extends into the housing 11 to form a first bend, and the second heat-conducting part 42 extends into the housing 11 to form a second bend, when the heat storage component 50 is connected to the first heat-conducting part 41 and the second heat-conducting part 42, the first bend and the second bend can be directly connected to the heat storage component 50, thereby facilitating the connection between the heat storage component 50 and the first heat-conducting part 41 and the second heat-conducting part 42.

[0047] Additionally, in some embodiments, the headphone case may also include a heat exchanger 60. The heat exchanger 60 is connected to the first bend and the second bend respectively, and the heat exchanger 60 is located in the heat storage element 50. The heat exchanger 60 is used to increase the heat exchange efficiency between the first bend and the second bend and the heat storage element 50.

[0048] When the heat exchanger 60 is connected to the first bend and the second bend respectively, and the heat exchanger 60 is located in the heat storage component 50, the heat from the first bend and the second bend can be transferred to the heat exchanger 60. The heat exchanger 60 can then exchange heat with the heat storage component 50, and the heat can be quickly transferred to the heat storage component 50 for storage. When the heat storage component 50 needs to release heat, it can transfer the heat to the heat exchanger 60, so that the heat exchanger 60 can transfer the heat to the first bend and the second bend.

[0049] It should be noted that the number of heat exchanger elements 60 can be set according to actual needs. For example, the number of heat exchanger elements 60 can be 1, 3, or 5. The specific number of heat exchanger elements 60 is not limited in this embodiment. Furthermore, when there are multiple heat exchanger elements 60, it is equivalent to increasing the heat exchange area between the first and second bends and the heat storage element 50, thereby improving the heat exchange efficiency between the first and second bends and the heat storage element 50.

[0050] Furthermore, in this embodiment, the heat exchanger 60 can be a rod-shaped structure. Of course, the heat exchanger 60 can also be other types of structures, such as a cylindrical structure. The specific structure of the heat exchanger 60 is not limited in this embodiment.

[0051] In addition, in the embodiments of this application, the heat exchanger 60 can be formed of a material with high heat exchange performance. For example, the heat exchanger 60 can be formed of graphene, or for another example, the heat exchanger 60 can be formed of copper.

[0052] In addition, in some embodiments, a cooling structure is provided in the housing 11, which is connected to the second heat-conducting element 40. The cooling structure is used to increase the heat conduction efficiency of the second heat-conducting element 40.

[0053] Since the cooling structure is connected to the second heat-conducting element 40 and is located in the box 11, the cooling structure can cool the second heat-conducting element 40 when it conducts heat into the cavity. As a result, the heat on the second heat-conducting element 40 can be quickly dissipated due to the cooling of the cooling structure, thereby improving the heat conduction efficiency of the second heat-conducting element 40.

[0054] It should be noted that the cooling structure can be electrically connected to the controller in the housing. When the controller controls the heat dissipation of the outer side of the semiconductor temperature regulating component 30, the controller controls the cooling structure to cool. The cooling structure can be a semiconductor cooling element, and the cold end of the semiconductor cooling element is connected to the second heat-conducting element 40.

[0055] In addition, in this embodiment, the cooling structure can be connected to the end of the second heat-conducting element 40, or it can be connected to the middle of the second heat-conducting element 40. This embodiment does not limit the specific connection.

[0056] In some embodiments, a temperature detection component is provided on the housing 11. The temperature detection component is used to detect the temperature value of the external space of the housing 11. When the temperature value of the external space of the housing 11 is greater than or equal to a first preset temperature threshold, the semiconductor temperature regulation component 30 is in a first operating state; when the temperature value of the external space of the housing 11 is less than or equal to a second preset temperature threshold, the semiconductor temperature regulation component 30 is in a second operating state; wherein, the first preset temperature threshold is greater than the second temperature threshold.

[0057] When a temperature regulation component is installed on the housing 11, the temperature of the external space of the housing 11 can be detected by the temperature regulation component. The controller can then obtain the temperature of the external space, and the state of the semiconductor temperature regulation component 30 changes according to the temperature of the external space. Specifically, when the temperature of the external space of the housing 11 is greater than or equal to a first preset temperature threshold, the semiconductor temperature regulation component 30 is in a first working state; when the temperature of the external space of the housing 11 is less than or equal to a second preset temperature threshold, the semiconductor temperature regulation component 30 is in a second working state.

[0058] In addition, in this embodiment of the application, a controller may be provided in the housing 11, the temperature detection component is electrically connected to the controller, the controller is electrically connected to the semiconductor temperature regulation component 30, and the controller controls the state changes of the semiconductor temperature regulation component 30.

[0059] In addition, in this embodiment, the temperature regulating component can also detect the temperature value in the receiving cavity and send the temperature value to the controller. The controller is used to control the semiconductor temperature regulating component 30 based on the temperature value so that the semiconductor temperature regulating component 30 regulates the temperature in the receiving cavity.

[0060] It should be noted that in this embodiment, the controller can be a control chip, that is, the control chip can be integrated in the housing 11, so that the control chip is electrically connected to the temperature detection component and the semiconductor temperature regulation component 30 respectively.

[0061] Furthermore, when the semiconductor temperature regulating component 30 includes a first semiconductor temperature regulating component 31 and a second semiconductor temperature regulating component 32, both the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 are electrically connected to the controller. Both the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 can be electrically connected to the controller via conductive wires.

[0062] In addition, in some embodiments, when the temperature value of the external space of the housing 11 is greater than or equal to a first preset temperature threshold, the controller controls the semiconductor temperature regulating component 30 to adjust the temperature of the receiving cavity to reduce the temperature in the receiving cavity so that the temperature value in the receiving cavity is less than the first preset temperature threshold; when the temperature value of the external space of the housing 11 is less than or equal to a second preset temperature threshold, the controller controls the semiconductor temperature regulating component 30 to adjust the temperature of the receiving cavity to increase the temperature of the receiving cavity so that the temperature value in the receiving cavity is greater than the second preset temperature threshold; wherein, the first preset temperature threshold is greater than the second preset temperature threshold.

[0063] When the temperature of the external space of the housing 11 is greater than or equal to the first preset temperature threshold, the controller can control the semiconductor temperature regulating component 30 to adjust the temperature of the receiving cavity. That is, the controller controls the semiconductor temperature regulating component 30 to operate, and the semiconductor temperature regulating component 30 adjusts the temperature of the receiving cavity, thereby reducing the temperature in the receiving cavity to less than the first preset temperature threshold. As a result, the temperature of the earphone 20 in the receiving cavity will be less than the first preset temperature threshold. When the user takes the earphone 20 out of the housing 11 and wears it, the earphone 20 is at a lower temperature, giving the user a cool feeling, thus improving the user's experience of using the earphone 20. When the temperature of the external space of the housing 11 is less than or equal to the second preset temperature threshold, the controller can control the semiconductor temperature regulating component 30 to regulate the temperature of the receiving cavity. That is, the controller controls the semiconductor temperature regulating component 30 to operate, and the semiconductor temperature regulating component 30 regulates the temperature of the receiving cavity, causing the temperature in the receiving cavity to rise and exceed the second preset temperature threshold. As a result, the temperature of the earphone 20 in the receiving cavity will be greater than the second preset temperature threshold. When the user takes the earphone 20 out of the housing 11 and wears it, the earphone 20 is warm, giving the user a warm feeling, thereby improving the user's experience of using the earphone 20.

[0064] It should be noted that both the first and second preset temperature thresholds can be set according to actual needs. For example, the first preset temperature threshold can be 30 degrees Celsius, and the second preset temperature threshold can be 5 degrees Celsius. Another example is a first preset temperature threshold of 33 degrees Celsius and a second preset temperature threshold of 3 degrees Celsius. Yet another example is a first preset temperature threshold of 35 degrees Celsius and a second preset temperature threshold of 4 degrees Celsius. The specific values ​​of the first and second preset temperature thresholds are not limited in this embodiment.

[0065] In addition, in this embodiment, when the temperature of the external space of the housing 11 is greater than or equal to the first preset temperature threshold, it indicates that the temperature of the external space of the housing 11 is high, thus requiring cooling of the cavity in the housing 11, thereby cooling the earphone 20 in the housing 11, so that when the user takes the earphone 20 out of the housing 11 and wears it, the earphone 20 is at a lower temperature, making the user feel cool; when the temperature of the external space of the housing 11 is less than or equal to the second preset temperature threshold, it indicates that the temperature of the external space of the housing 11 is low, thus requiring heating of the cavity in the housing 11, thereby heating the earphone 20 in the housing 11, so that when the user takes the earphone 20 out of the housing 11 and wears it, the earphone 20 is at a higher temperature, making the user feel warm.

[0066] Furthermore, when the semiconductor temperature regulating component 30 includes a first semiconductor temperature regulating component 31 and a second semiconductor temperature regulating component 32, when the temperature of the external space of the housing 11 is greater than or equal to a first preset temperature threshold, the controller controls the current flow direction of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 to a first flow direction, so that the end of the TEC located in or facing the housing cavity is the cold end, and the end located outside or away from the housing cavity is the hot end. This lowers the temperature in the housing cavity, thereby reducing the temperature of the earphone 20 within the housing cavity. In other words, when the temperature of the external space of the housing 11 is greater than or equal to the first preset temperature threshold, the controller controls the current flow direction of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32, so that the end of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 closest to the earphone 20 is the cold end, and the end away from the earphone 20 is the hot end. This cools down the earphone 20. When the temperature of the external space of the housing 11 is less than or equal to the second preset temperature threshold, the controller controls the current flow direction of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 to the second flow direction, so that the end of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 located in the cavity or facing the cavity is the hot end, and the end located outside the cavity or away from the cavity is the cold end. This raises the temperature of the cavity, thereby increasing the temperature of the earphone 20 in the cavity. In other words, when the temperature of the external space of the housing 11 is less than or equal to the second preset temperature threshold, the controller controls the current flow direction of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32, so that the end of the first semiconductor temperature regulating component 31 and the second semiconductor temperature regulating component 32 close to the earphone 20 is the hot end, and the end away from the earphone 20 is the cold end, thereby raising the temperature of the earphone 20.

[0067] In some embodiments, the temperature detection assembly may include a first temperature sensor and a second temperature sensor. The first temperature sensor is disposed on the outer wall of the housing 11, and the second temperature sensor is disposed inside the housing 11. Both the first and second temperature sensors are electrically connected to the controller. The first temperature sensor is used to detect the temperature value of the external space of the housing 11, and the second temperature sensor is used to detect the temperature value inside the receiving cavity.

[0068] Since both the first and second temperature sensors are electrically connected to the controller, and the first temperature sensor is located on the outer wall of the housing 11 while the second temperature sensor is located inside the housing 11, the temperature value of the external space of the housing 11 can be detected by the first temperature sensor, and the temperature value of the cavity can be detected by the second temperature sensor. Thus, the first temperature sensor transmits the detected temperature value to the controller, and the second temperature sensor transmits the detected temperature value to the controller. The controller can then control the semiconductor temperature regulation component 30 based on the received temperature value.

[0069] The housing contains charging contacts. When the earphone 20 is placed in the housing 11 and the charging contacts charge the earphone 20, the controller can control the second temperature sensor to operate. The second temperature sensor detects the temperature of the housing, which is equivalent to detecting the temperature of the earphone 20, and sends the detected temperature value to the controller. After receiving the temperature value from the second temperature sensor, if the controller finds that the temperature value is greater than a first temperature value, it controls the semiconductor temperature regulation component 30 to lower the temperature of the housing, which is equivalent to lowering the temperature of the earphone 20. This ensures that the earphone 20 is at a lower temperature after the user removes it from the housing 11, making it more comfortable for the user to wear. When the charging contacts are not charging the earphones 20, the controller can control the first temperature sensor to operate. The first temperature sensor detects the temperature of the external space of the housing 11 and sends the detected temperature value to the controller. Upon receiving the temperature value from the first temperature sensor, if the temperature value is less than or equal to a second temperature threshold, the controller controls the semiconductor temperature regulation component 30 to raise the temperature of the housing cavity, which is equivalent to raising the temperature of the earphones 20. This ensures that the earphones 20 are warm when the user removes them from the housing 11, providing a warm feeling and improving the user experience. Conversely, if the temperature of the external space of the housing 11 detected by the first temperature sensor is greater than or equal to the first temperature threshold, the controller controls the semiconductor temperature regulation component 30 to lower the temperature of the housing cavity, which is equivalent to lowering the temperature of the earphones 20. This ensures that the earphones 20 are cool when the user removes them from the housing 11, providing a cool feeling and improving the user experience.

[0070] In this embodiment, the headphone case 10 includes a body 11 and a lid 12, which are movably connected. The body 11 has a receiving cavity, which can accommodate the headphones 20. The lid 12 covers the receiving cavity, thus protecting the headphones 20 and making it easy to carry. Since a semiconductor temperature regulating component 30 is provided in the body 11, after placing the headphones 20 in the receiving cavity, the temperature of the receiving cavity can be adjusted by the semiconductor temperature regulating component 30 to ensure the headphones 20 are at a suitable temperature. Specifically, when the semiconductor temperature regulating component 30 is in a first operating state, it cools the receiving cavity, thus cooling the headphones 20 inside. When the semiconductor temperature regulating component 30 is in a second operating state, it heats the receiving cavity, thus warming the headphones 20 inside, ensuring the temperature of the headphones 20 is comfortable for the user when wearing them. In other words, by setting a semiconductor temperature regulation component 30 in the housing 11, the temperature in the housing cavity of the housing 11 can be regulated by the semiconductor temperature regulation component 30. Thus, after the earphone 20 is placed in the housing cavity, the temperature of the earphone 20 can be regulated so that when the user takes the earphone 20 out of the earphone case 10 and wears it, the temperature of the earphone 20 is suitable, thereby making the user experience of using the earphone 20 better.

[0071] This application provides an earphone system, which includes an earphone 20 and an earphone case as described in any of the above embodiments. When the semiconductor temperature regulating component 30 is in a first operating state, it cools the earphone; when it is in a second operating state, it heats the earphone.

[0072] In this embodiment, the headphone case 10 includes a body 11 and a lid 12, which are movably connected. The body 11 has a receiving cavity, which can accommodate the headphones 20. The lid 12 covers the receiving cavity, thus protecting the headphones 20 and making it easy to carry. Since a semiconductor temperature regulating component 30 is provided in the body 11, after placing the headphones 20 in the receiving cavity, the temperature of the receiving cavity can be adjusted by the semiconductor temperature regulating component 30 to ensure the headphones 20 are at a suitable temperature. Specifically, when the semiconductor temperature regulating component 30 is in a first operating state, it cools the receiving cavity, thus cooling the headphones 20 inside. When the semiconductor temperature regulating component 30 is in a second operating state, it heats the receiving cavity, thus warming the headphones 20 inside, ensuring the temperature of the headphones 20 is comfortable for the user when wearing them. In other words, by setting a semiconductor temperature regulation component 30 in the housing 11, the temperature in the housing cavity of the housing 11 can be regulated by the semiconductor temperature regulation component 30. Thus, after the earphone 20 is placed in the housing cavity, the temperature of the earphone 20 can be regulated so that when the user takes the earphone 20 out of the earphone case 10 and wears it, the temperature of the earphone 20 is suitable, thereby making the user experience of using the earphone 20 better.

[0073] In some embodiments, the earphone 20 includes an earpiece and a stem, and the receiving cavity includes a first sub-cavity 111 and a second sub-cavity 112. The semiconductor temperature regulation assembly 30 includes a first semiconductor temperature regulation assembly 31, a second semiconductor temperature regulation assembly 32, and a first heat-conducting element 33. The first semiconductor temperature regulation assembly 31 is disposed around the first sub-cavity 111, and the second semiconductor temperature regulation assembly 32 is disposed around the second sub-cavity 112. A first end of the first heat-conducting element 33 is connected to the inner side of the first semiconductor temperature regulation assembly 31 near the receiving cavity, and a second end of the first heat-conducting element 33 is connected to the inner side of the second semiconductor temperature regulation assembly 32 near the receiving cavity. When the earphone 20 is located within the first sub-cavity 111, the stem is located within the first sub-cavity, and the earpiece is opposite to the first end of the first heat-conducting element 33; when the earphone 20 is located within the second sub-cavity 111, the stem is located within the second sub-cavity, and the earpiece is opposite to the second end of the first heat-conducting element 33.

[0074] When the earphone 20 is located in the first sub-cavity 111, the stem is located in the first sub-cavity, and the earpiece is opposite to the first end of the first heat-conducting element 33; when the earphone 20 is located in the second sub-cavity 111, the stem is located in the second sub-cavity, and the earpiece is opposite to the second end of the first heat-conducting element 33. Therefore, when the earphone 20 is located in the receiving cavity, the stem of the earphone 20 is located in the receiving cavity, and the earpieces of the earphone 20 are opposite to the two ends of the first heat-conducting element 33. Thus, the first heat-conducting element 33 can conduct heat between the two earphones 20, making the temperature of the two earphones 20 equal, which is beneficial to improving the user experience when the user wears the earphones 20.

[0075] It should be noted that the earpiece of the earphone 20 is opposite to the first end of the first heat-conducting element 33, wherein the earpiece of the earphone 20 may contact the first end of the first heat-conducting element 33, or the earpiece of the earphone 20 is directly opposite the first end of the first heat-conducting element 33. The earpiece of the earphone 20 is opposite to the second end of the first heat-conducting element 33, wherein the earpiece of the earphone 20 may contact the second end of the first heat-conducting element 33, or the earpiece of the earphone 20 is directly opposite the second end of the first heat-conducting element 33.

[0076] In some embodiments, the earphone 20 includes an in-ear portion and a stem portion, and the receiving cavity includes a first sub-cavity 111 and a second sub-cavity 112. The semiconductor temperature regulation assembly 30 includes a first semiconductor temperature regulation assembly 31, a second semiconductor temperature regulation assembly 32, a third semiconductor temperature regulation assembly 34, and a fourth semiconductor temperature regulation assembly 35. The first semiconductor temperature regulation assembly 31 is disposed around the first sub-cavity 111, and the second semiconductor temperature regulation assembly 32 is disposed around the second sub-cavity 112. When the earphone 20 is located within the first sub-cavity 111, the first semiconductor temperature regulation assembly 31 surrounds the stem portion, and the third semiconductor temperature regulation assembly 34 is opposite to the in-ear portion. When the earphone 20 is located within the second sub-cavity 112, the second semiconductor temperature regulation assembly 32 surrounds the stem portion, and the fourth semiconductor temperature regulation assembly 35 is opposite to the in-ear portion.

[0077] When the earphone 20 is located in the first sub-cavity 111, the first semiconductor temperature regulating component 31 surrounds the stem, and the third semiconductor temperature regulating component 34 is opposite to the earpiece. When the earphone 20 is located in the second sub-cavity 112, the second semiconductor temperature regulating component 32 surrounds the stem, and the fourth semiconductor temperature regulating component 35 is opposite to the earpiece. Therefore, when the earphone 20 is located in the receiving cavity, the stem of the earphone 20 is located in the receiving cavity, and the earpiece of the earphone 20 is opposite to the third semiconductor temperature regulating component 34 and the fourth semiconductor temperature regulating component 35, respectively. Thus, the third temperature regulating component 34 and the fourth temperature regulating component 35 can regulate the temperature of the earpiece of the earphone 20. In other words, by setting the third temperature regulating component 34 and the fourth temperature regulating component 35, the temperature of the earpiece of the earphone 20 can also be regulated. Therefore, after the user removes the earphone 20 from the housing 11, the user can feel that the temperature of the earphone 20 is suitable, thus improving the user experience.

[0078] In addition, when the temperature of the external space of the housing 11 is greater than or equal to the first preset temperature threshold, the third temperature adjustment component 34 and the fourth temperature adjustment component 35 lower the temperature of the earphone 20 entering the ear. When the temperature of the external space of the housing 11 is less than or equal to the second preset temperature threshold, the third temperature adjustment component 34 and the fourth temperature adjustment component 35 raise the temperature of the earphone 20 entering the ear.

[0079] In addition, in this embodiment, the third semiconductor temperature regulating component 34 may be disposed at the first end of the first heat conductor 33, and the fourth semiconductor temperature regulating component 35 may be disposed at the second end of the first heat conductor 34.

[0080] In addition, in some embodiments, the earphone 20 includes an earphone shell with a heat insulation layer therein for heat preservation of the earphone 20.

[0081] When the earphone shell of the earphone 20 has a heat-insulating layer, the temperature of the heat-insulating layer itself changes more slowly, thus slowing down the temperature change of the earphone shell. Consequently, after the earphone 20 is removed from the housing 11, the external temperature of the earphone shell on the housing 11 changes more slowly, allowing the earphone shell to maintain a temperature approximately the same as when it was in the housing for a longer period. Therefore, when the user wears the earphone 20, the temperature feels comfortable, improving the user experience. In other words, by incorporating a heat-insulating layer into the earphone shell, the user experience of using the earphone 20 is improved.

[0082] It should be noted that the insulation layer can be made of a material with a high specific heat capacity, specifically, the specific heat capacity of the insulation layer material can be greater than 4000 J / (kg℃). When the insulation layer is made of a material with a high specific heat capacity, the temperature change of the insulation layer is slower. Therefore, after the earphone 20 is removed from the housing 11, the temperature change of the earphone shell is slower, resulting in a more comfortable temperature for the user when wearing the earphone 20, thus improving the user experience.

[0083] In some embodiments, the insulation layer may be disposed on the inner wall of the earphone shell.

[0084] When the insulation layer is located on the inner wall of the earphone shell, its temperature changes slowly. Even when the earphone 20 is removed from the housing 11, the insulation layer, being in contact with the inner wall of the earphone shell, allows heat from the external space of the housing 11 to be transferred to the earphone shell. Due to the insulation layer, the earphone shell's temperature also changes slowly, allowing it to maintain a relatively constant temperature for a longer period. This means the earphone shell's temperature remains close to the temperature of the housing cavity for an extended time. Consequently, when the user wears the earphone 20, the earphone shell's temperature provides a comfortable feel, improving the user experience. In other words, placing the insulation layer on the inner wall of the earphone shell enhances the user experience of using the earphone 20.

[0085] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0086] Although optional embodiments of the present application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the optional embodiments as well as all changes and modifications falling within the scope of the embodiments of the present application.

[0087] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used merely to distinguish one entity from another, and do not necessarily require or imply any such actual relationship or order between these entities. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or terminal device that includes that element.

[0088] The technical solutions provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the principles and implementation methods of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. An earphone case, characterized in that, The device includes a housing and a lid, the housing and the lid being movably connected. The housing has a receiving cavity for receiving earphones, and the lid is used to cover the receiving cavity. The receiving cavity includes a first sub-cavity and a second sub-cavity for receiving earphones. The housing is provided with a semiconductor temperature regulating component, which includes a first semiconductor temperature regulating component, a second semiconductor temperature regulating component, and a first heat-conducting element; the first semiconductor temperature regulating component is arranged around the first sub-cavity, and the second semiconductor temperature regulating component is arranged around the second sub-cavity. When the earphone is located in the first sub-cavity, the earphone stem is located in the first sub-cavity, the first semiconductor temperature regulating component surrounds the stem, and the earphone in-ear portion is opposite to the first end of the first heat-conducting component; when the earphone is located in the second sub-cavity, the earphone stem is located in the second sub-cavity, the second semiconductor temperature regulating component surrounds the stem, and the earphone in-ear portion is opposite to the second end of the first heat-conducting component. When the semiconductor temperature regulating component is in the first working state, the semiconductor temperature regulating component is used to cool the receiving cavity; When the semiconductor temperature regulating component is in the second working state, the semiconductor temperature regulating component is used to heat the receiving cavity; The semiconductor temperature regulating component is arranged around the receiving cavity, with the side of the semiconductor temperature regulating component closer to the receiving cavity being the inner side and the side of the semiconductor temperature regulating component away from the receiving cavity being the outer side. When the semiconductor temperature regulation component is in its first operating state, the inner side is cooled and the outer side is cooled. When the semiconductor temperature regulation component is in the second working state, the inner side dissipates heat and the outer side cools. It also includes a bendable second heat-conducting component; The second thermal conductive element is connected to the outside of the semiconductor temperature regulating assembly opposite to the receiving cavity, and the second thermal conductive element extends to the lid; When the lid moves relative to the box body, the second heat-conducting element bends along with the lid.

2. The earphone case according to claim 1, characterized in that, The first end of the first heat-conducting element is connected to the inner side of the first semiconductor temperature regulating component near the cavity, and the second end of the first heat-conducting element is connected to the inner side of the second semiconductor temperature regulating component near the cavity.

3. The earphone case according to claim 1, characterized in that, The second heat-conducting component includes a first heat-conducting part, a second heat-conducting part, and a connecting part. The first heat-conducting part is connected to the outside of the first semiconductor temperature regulating component, the second heat-conducting part is connected to the outside of the second semiconductor temperature regulating component, and the connecting part connects the first heat-conducting part and the second heat-conducting part, and the connecting part extends to the cover.

4. The earphone case according to claim 1, characterized in that, It also includes heat storage components; The heat storage element is located in the box, and the second heat-conducting element is connected to the heat storage element for heat exchange.

5. The earphone case according to claim 4, characterized in that, The second heat-conducting component includes a first heat-conducting part, a second heat-conducting part, and a connecting part. The first heat-conducting part is connected to the outside of the first semiconductor temperature regulating component, the second heat-conducting part is connected to the outside of the second semiconductor temperature regulating component, and the connecting part connects the first heat-conducting part and the second heat-conducting part, and the connecting part extends to the cover. The first heat-conducting part extends into the box body to form a first bend, and the second heat-conducting part extends into the box body to form a second bend. Both the first bend and the second bend are connected to the heat storage component.

6. The earphone case according to claim 5, characterized in that, The earphone case also includes a heat exchanger; The heat exchanger is connected to the first bend and the second bend respectively, and the heat exchanger is located in the heat storage element. The heat exchanger is used to increase the heat exchange efficiency between the first bend and the second bend and the heat storage element.

7. The earphone case according to claim 1, characterized in that, The box is equipped with a cooling structure, which is connected to the second heat-conducting component. The cooling structure is used to increase the heat conduction efficiency of the second heat-conducting component.

8. The earphone case according to any one of claims 1-7, characterized in that, The box is equipped with a temperature detection component, which is used to detect the temperature value of the external space of the box. When the temperature value of the external space of the box is greater than or equal to the first preset temperature threshold, the semiconductor temperature regulation component is in the first working state; When the temperature value of the external space of the box is less than or equal to the second preset temperature threshold, the semiconductor temperature regulation component is in the second working state; Wherein, the first preset temperature threshold is greater than the second preset temperature threshold.

9. A headphone system, characterized in that, The headphone system includes headphones and a headphone case as described in any one of claims 1 to 8; When the semiconductor temperature regulating component is in the first working state, the semiconductor temperature regulating component cools the headphones. When the semiconductor temperature regulating component is in the second operating state, the semiconductor temperature regulating component heats up the headphones.

10. The headphone system according to claim 9, characterized in that, The first end of the first heat-conducting element is connected to the inner side of the first semiconductor temperature regulating component near the cavity, and the second end of the first heat-conducting element is connected to the inner side of the second semiconductor temperature regulating component near the cavity.

11. The headphone system according to claim 10, characterized in that, The semiconductor temperature regulating component further includes a third semiconductor temperature regulating component and a fourth semiconductor temperature regulating component; With the earphone located within the first sub-cavity, the third semiconductor temperature regulation component is opposite to the ear inlet portion; When the earphone is located within the second sub-cavity, the fourth semiconductor temperature regulation component is opposite to the ear inlet portion.

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