Perovskite solar cell module and packaging method thereof

Abstract

The application provides a perovskite solar cell module and a packaging method thereof. The packaging method comprises the following steps: coating a liquid protective coating on the surface of the back electrode of the perovskite cell to form a protective coating, and the protective coating is filled into the gap of the laser line at the same time; heating the back glass coated with the packaging adhesive film and the sealing adhesive to obtain heated back glass; combining the heated back glass with the perovskite cell and performing first lamination to obtain the perovskite solar cell module. The application reduces the decomposition of the perovskite cell by reducing the heating time of the perovskite cell during the first lamination, prevents the water vapor in the air from adhering by filling the protective coating on the back electrode of the perovskite cell, and reduces the damage to the laser line position of the perovskite cell, so that the efficiency of the perovskite module is reduced or even not attenuated after the first lamination.

Description

Technical Field

[0001] This invention relates to the field of solar cell encapsulation technology, and in particular to a perovskite solar cell module and its encapsulation method. Background Technology

[0002] Thin-film solar cells, as a new generation of solar cells, are finding increasingly wider applications. However, solar cells typically operate outdoors, thus requiring encapsulation.

[0003] In the thin-film solar cell industry, the current encapsulation and lamination process for thin-film cells on glass substrates uses EVA / POE / PVB type adhesive films to directly encapsulate and laminate with the backsheet glass. The specific steps involve placing the module in a heated laminator for vacuum degassing, and after the adhesive film melts, pressure is applied to bond the backsheet glass and the cell together through the encapsulation film. However, this encapsulation and lamination method leads to a significant decrease in the efficiency of perovskite modules after encapsulation and lamination, and easily causes back electrode delamination and film removal.

[0004] Therefore, it is necessary to develop new encapsulation technologies for thin-film solar cells to overcome the problems of efficiency reduction and film delamination caused by existing encapsulation techniques. Summary of the Invention

[0005] In view of the problems existing in the prior art, the present invention provides a perovskite solar cell module and its encapsulation method, which can effectively reduce the heating time of perovskite thin film cells and reduce the impact of long-term high temperature on the efficiency of perovskite cells; after adding a protective coating, the efficiency of perovskite modules after encapsulation lamination can be effectively improved, and the delamination phenomenon of perovskite modules can be reduced.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] In a first aspect, the present invention provides a method for encapsulating a perovskite solar cell module, the encapsulation method comprising:

[0008] A liquid protective coating is applied to the surface of the back electrode of the perovskite solar cell to form a protective coating, which simultaneously fills the gaps in the laser lines.

[0009] The back glass coated with encapsulating film and sealant is heated to obtain heated back glass.

[0010] The heated back glass is laminated with the perovskite cell and then first laminated to obtain a perovskite solar cell module.

[0011] The encapsulation method for perovskite solar cell modules provided by this invention uses liquid protective coating to form a protective coating that can fill the laser lines, thereby avoiding edge defects caused by pressure. At the same time, it can protect the back electrode of the perovskite cell from the influence of moisture in the air for a longer period of time and reduce the probability of the back electrode of the perovskite cell delaminating after the first lamination. Moreover, the encapsulation method of this invention applies the encapsulating film and sealant to the back glass, and heats the back glass before lamination and first lamination, which greatly shortens the total heating time of the perovskite cell, thereby improving the performance of the perovskite cell.

[0012] In traditional processes, during the first lamination, the encapsulating film gradually softens during the vacuuming and heating phase. While it retains some fluidity under pressure, its relatively poor fluidity causes film collapse on both sides of the laser line, leading to reduced efficiency. Furthermore, thermal expansion and contraction during cooling can cause delamination and peeling of the edge electrodes. This invention avoids these issues by adding a protective coating and improving the first lamination process. Firstly, the poor fluidity of the encapsulating film prevents it from affecting the quality of the film at the laser line, thus preventing unnecessary defects. Secondly, the protective coating fills the laser line and then cures, protecting the module from affecting the film quality at the laser line during the first lamination, reducing the impact of perovskite thermal instability and delamination, and ultimately improving the overall efficiency of the perovskite module.

[0013] Preferably, the thickness of the protective coating is 20 to 100 μm, for example, it can be 20 μm, 25 μm, 35 μm, 45 μm, 55 μm, 65 μm, 75 μm, 80 μm, 90 μm or 100 μm, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0014] The protective coating of this invention is preferably 20-100 μm thick, which can ensure its protective function while avoiding the increase in cost and the reduction of the encapsulation effect caused by an excessively thick protective coating.

[0015] Preferably, the viscosity of the protective coating is <1000 mPa·s, for example, it can be 990 mPa·s, 980 mPa·s, 970 mPa·s, 950 mPa·s, 920 mPa·s, 900 mPa·s, 800 mPa·s or 700 mPa·s, etc.

[0016] The present invention preferably protects the coating with a viscosity within the above-mentioned range, which has better fluidity and can be filled into the laser line by scraping or spraying, thus protecting the laser line and improving the efficiency of the perovskite solar cell after lamination.

[0017] Preferably, the curing temperature of the protective coating is 50-60℃, for example, it can be 50℃, 51℃, 52℃, 53℃, 54℃, 55℃, 56℃, 57℃, 58℃, 59℃ or 60℃, etc.

[0018] Preferably, the protective coating material includes any one or a combination of at least two of liquid amorphous fluoropolymer, liquid silicone resin, or liquid acrylic resin, wherein typical but non-limiting combinations are combinations of liquid amorphous fluoropolymer film and liquid silicone resin, combinations of liquid acrylic resin and liquid silicone resin, combinations of liquid amorphous fluoropolymer film and liquid acrylic resin, and preferably liquid amorphous fluoropolymer.

[0019] The present invention further prefers liquid amorphous fluoropolymer, which has the advantages of good fluidity, fast curing and no water or oxygen content that reacts with the back electrode, and can be used as a good protective coating.

[0020] Preferably, the coating method includes scraping or spraying.

[0021] Preferably, the scraping process includes: dripping liquid protective coating onto a scraper and scraping it.

[0022] Preferably, the scraping speed is 100-2000 mm / min, for example, it can be 100 mm / min, 310 mm / min, 520 mm / min, 730 mm / min, 940 mm / min, 1150 mm / min, 1360 mm / min, 1500 mm / min, 1700 mm / min or 2000 mm / min, etc., but is not limited to the listed values, and other unlisted values ​​within this range are also applicable.

[0023] Preferably, the encapsulation method further includes a curing process following coating.

[0024] Preferably, the curing method includes hot air curing or ultraviolet curing.

[0025] Preferably, the curing temperature is 30 to 60°C, for example, it can be 30°C, 34°C, 37°C, 40°C, 44°C, 47°C, 50°C, 54°C, 57°C or 60°C, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0026] Preferably, the curing time is 1 to 3 minutes, for example, it can be 1 minute, 1.3 minutes, 1.5 minutes, 1.7 minutes, 1.9 minutes, 2.0 minutes, 2.4 minutes, 2.6 minutes, 2.8 minutes or 3 minutes, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0027] Preferably, the heating temperature is 120 to 180°C, for example, it can be 120°C, 125°C, 135°C, 140°C, 145°C, 155°C, 160°C, 165°C, 170°C or 180°C, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0028] Preferably, the heating time is 3 to 8 minutes, for example, 3 minutes, 4 minutes, 5 minutes, 6 minutes, 7 minutes or 8 minutes, but not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0029] Preferably, the temperature of the first lamination is 100 to 130°C, for example, it can be 100°C, 104°C, 107°C, 110°C, 114°C, 117°C, 120°C, 124°C, 127°C or 130°C, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0030] Preferably, the first lamination time is 1 to 5 minutes, for example, it can be 1 minute, 2 minutes, 3 minutes, 4 minutes or 5 minutes, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0031] Preferably, the vacuuming time in the first lamination is 1 to 3 minutes, for example, it can be 1 minute, 1.3 minutes, 1.5 minutes, 1.7 minutes, 1.9 minutes, 2.0 minutes, 2.4 minutes, 2.6 minutes, 2.8 minutes or 3 minutes, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0032] Preferably, the vacuum degree of the first lamination is 40 to 100 kPa, for example, it can be 40 kPa, 47 kPa, 54 kPa, 60 kPa, 67 kPa, 74 kPa, 80 kPa, 87 kPa, 94 kPa or 100 kPa, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0033] Preferably, the preparation of the back glass with encapsulating film and sealant includes: applying encapsulating film to the surface of the back glass, performing a second lamination, and then applying sealant to the edge of the back glass to obtain the back glass with encapsulating film and sealant.

[0034] This invention does not impose any special limitations on the sealant; any sealant known to those skilled in the art for sealing purposes can be used. Similarly, this invention does not impose any special limitations on the material of the encapsulating film; any encapsulating film known to those skilled in the art for encapsulation purposes can be used.

[0035] Preferably, the edge of the encapsulating film is 10-13 mm away from the edge of the back glass, for example, it can be 10 mm, 10.4 mm, 10.7 mm, 11 mm, 11.4 mm, 11.7 mm, 12 mm, 12.4 mm, 12.7 mm or 13 mm, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0036] Preferably, the temperature of the second lamination is lower than the temperature of the first lamination.

[0037] Preferably, the temperature of the second lamination is 70 to 100°C, for example, it can be 70°C, 74°C, 77°C, 80°C, 84°C, 87°C, 90°C, 94°C, 97°C or 100°C, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0038] Preferably, the vacuuming time for the second lamination is 3 to 5 minutes, for example, it can be 3 minutes, 3.3 minutes, 3.5 minutes, 3.7 minutes, 3.9 minutes, 4.2 minutes, 4.4 minutes, 4.6 minutes, 4.8 minutes or 5 minutes, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0039] Preferably, the pressurization time of the second lamination is 2 to 4 minutes, for example, it can be 2 minutes, 2.3 minutes, 2.5 minutes, 2.7 minutes, 2.9 minutes, 3.2 minutes, 3.4 minutes, 3.6 minutes, 3.8 minutes or 4 minutes, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0040] Preferably, the vacuum degree of the second lamination is 10 to 30 kPa, for example, it can be 10 kPa, 13 kPa, 15 kPa, 17 kPa, 19 kPa, 22 kPa, 24 kPa, 26 kPa, 28 kPa or 30 kPa, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0041] Preferably, the thickness of the sealant is 0.1 to 0.3 mm thicker than the thickness of the encapsulating film. For example, it can be 0.1 mm, 0.13 mm, 0.15 mm, 0.17 mm, 0.19 mm, 0.22 mm, 0.24 mm, 0.26 mm, 0.28 mm, or 0.3 mm, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0042] In a second aspect, the present invention provides a perovskite solar cell module, wherein the perovskite solar cell module is encapsulated using the encapsulation method for perovskite solar cell modules described in the first aspect.

[0043] The perovskite solar cell obtained by the encapsulation method of the first aspect of the present invention has high efficiency and is not easy to delaminate, exhibiting excellent performance.

[0044] Preferably, the perovskite solar cell module is a perovskite thin-film solar cell.

[0045] Preferably, the thickness of the perovskite thin-film solar cell is 2.2–3.2 mm, for example, it can be 2.2 mm, 2.5 mm, 3.0 mm, or 3.2 mm. The thickness of the perovskite thin-film solar cell described in this invention refers to the thickness including the glass.

[0046] Compared with the prior art, the present invention has at least the following beneficial effects:

[0047] (1) The encapsulation method of the perovskite solar cell module provided by the present invention uses liquid protective coating as a protective coating to fill the laser lines, thereby avoiding edge defects of the battery module due to pressure, and can protect the back electrode of the perovskite battery from the influence of water vapor in the air for a long time, reducing the probability of the back electrode of the perovskite battery delamination after lamination.

[0048] (2) The encapsulation method of the perovskite solar cell module provided by the present invention can avoid the long-term heating of the perovskite cell and improve the performance of the perovskite cell. For the perovskite cell with a power of 9.0 to 9.5W before lamination, the power of the cell after lamination is preferably between 10.6 and 12.0W. Attached Figure Description

[0049] Figure 1 This is a flowchart illustrating the steps of a perovskite solar cell module encapsulation method provided in a specific embodiment of the present invention.

[0050] Figure 2 This is a schematic diagram of the coating process in the encapsulation method of the perovskite solar cell module provided in Embodiment 1 of the present invention.

[0051] Figure 3 This is a schematic diagram of the encapsulation structure of the perovskite solar cell module provided in Embodiment 1 of the present invention.

[0052] Figure 4 This is a schematic cross-sectional view of the perovskite solar cell module after lamination according to Embodiment 1 of the present invention.

[0053] In the figure: 1-glass substrate; 100-perovskite solar cell; 2-conductive layer; 3-electron transport layer; 4-perovskite absorber layer; 5-hole transport layer; 6-back electrode; 7-protective coating; 8-encapsulating film; 9-back glass; 10-laser etched lines; 11-scraper; 12-sealant; 13-conductive tape and tinned copper tape. Detailed Implementation

[0054] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0055] It should be understood that in the description of this invention, the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0056] It should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0057] As a specific embodiment of the present invention, a method for encapsulating a perovskite solar cell module is provided, such as... Figure 1 As shown, the encapsulation method includes the following steps:

[0058] A liquid protective coating is applied to the surface of the back electrode of the perovskite solar cell. The protective coating is simultaneously filled into the gaps of the laser lines and cured to form a protective coating with a thickness of 20 to 100 μm.

[0059] An encapsulating film is applied to the surface of the back glass, with the edge of the encapsulating film 10-13 mm away from the edge of the back glass. The film is then subjected to a second lamination at 70-100°C. The vacuuming time for the second lamination is 3-5 min, the pressurization time is 2-4 min, and the vacuum degree is 10-30 kPa.

[0060] Next, sealant is applied to the edge of the back glass, and the thickness of the sealant is 0.1-0.3 mm thicker than the thickness of the encapsulation film, to obtain a back glass with encapsulation film and sealant. The back glass with encapsulation film and sealant is heated at 120-180°C for 3-8 minutes to obtain a heated back glass. The heated back glass is then laminated with a perovskite solar cell and subjected to a first lamination. The temperature of the first lamination is 100-130°C, the time is 1-5 minutes, the vacuum time is 1-3 minutes, and the vacuum degree is 40-100 kPa, to obtain a perovskite solar cell module.

[0061] The present invention will now be described in further detail. However, the examples described below are merely simplified examples of the present invention and do not represent or limit the scope of protection of the present invention. The scope of protection of the present invention is determined by the claims.

[0062] Example 1

[0063] This embodiment provides a method for encapsulating a perovskite solar cell module, the encapsulation method comprising the following steps:

[0064] Conductive tape is attached to the perovskite solar cell, and tin-plated copper strip is soldered to extract the current from the perovskite solar cell. A liquid protective coating (amorphous fluoropolymer Teflon AF1600) is applied to the surface of the back electrode 6 of the perovskite solar cell 100. Figure 2 As shown, liquid protective coating is dripped onto a scraper and scraped at a speed of 1000 mm / min. The protective coating simultaneously fills the gaps in the laser lines and is cured with hot air at 45°C for 1 minute to form a protective coating 7 with a thickness of 50 μm.

[0065] The back glass 9 is cleaned and dried with a hot air knife. The thermoplastic polyolefin encapsulating film (Dow Chemical Enlight) 8 is cut and placed flat in the center on the back glass. The encapsulating film 8 is applied to the surface of the back glass 9, with the edge of the encapsulating film 8 11 mm away from the edge of the back glass 9. The film is then subjected to a second lamination at 80°C. The vacuuming time for the second lamination is 3 min, the pressurization time is 4 min, and the vacuum degree is 15 kPa.

[0066] like Figure 3 As shown, a ring of sealant 12 (sealant JC-1011) is then applied to the edge of the back glass 9. The thickness of the sealant 12 is 0.15 mm thicker than the thickness of the encapsulating film 8, resulting in a back glass 9 with both encapsulating film and sealant applied. Figure 3 As shown, the back glass coated with encapsulating film and sealant is heated to 150°C for 5 minutes to obtain heated back glass; then the heated back glass is aligned with the four edges and laminated with the perovskite solar cell 100, and then subjected to the first lamination in the first laminator. The temperature of the first lamination is 100°C, the time is 1 minute, the vacuum time is 1 minute, and the vacuum degree is 50 kPa to obtain the perovskite solar cell module.

[0067] The cross-sectional view of the first lamination of the perovskite solar cell module is shown below. Figure 4 As shown, the perovskite solar cell module includes a glass substrate 1, a conductive layer 2, an electron transport layer 3, a perovskite absorber layer 4, a hole transport layer 5, a back electrode 6, a protective coating 7, an encapsulating film 8, and a back glass 9 stacked sequentially.

[0068] Example 2

[0069] This embodiment provides a method for encapsulating a perovskite solar cell module, the encapsulation method comprising the following steps:

[0070] Conductive tape is attached to the perovskite solar cell, and tin-plated copper strips are soldered to extract the current from the perovskite solar cell. A liquid protective coating (amorphous fluoropolymer Teflon AF2400) is applied to the surface of the back electrode of the perovskite solar cell by scraping. The liquid protective coating is dripped onto a scraper and scraped at a speed of 2000 mm / min. The protective coating is simultaneously filled into the gaps of the laser lines. The coating is cured with hot air at 60°C for 3 minutes to form a protective coating with a thickness of 20 μm.

[0071] The back glass is cleaned and dried with a hot air knife. The thermoplastic polyolefin encapsulating film (Dow Chemical Enlight) is cut and placed flat in the center on the back glass. The encapsulating film is applied to the surface of the back glass with the edge of the encapsulating film 10mm away from the edge of the back glass. It is then subjected to a second lamination at 70°C. The vacuuming time for the second lamination is 5 minutes, the pressurization time is 2 minutes, and the vacuum degree is 30kPa.

[0072] A ring of sealant (sealant JC-1011) is then applied to the edge of the back glass. The thickness of the sealant is 0.15 mm thicker than the thickness of the encapsulation film, resulting in a back glass with both encapsulation film and sealant. The back glass with encapsulation film and sealant is then heated at 120°C for 8 minutes to obtain a heated back glass. The heated back glass is then aligned with the four edges and laminated with the perovskite solar cell. The lamination is then performed using a first laminator at a temperature of 130°C for 1 minute, with a vacuum period of 1.5 minutes and a vacuum degree of 40 kPa, resulting in a perovskite solar cell module.

[0073] Example 3

[0074] This embodiment provides a method for encapsulating a perovskite solar cell module, the encapsulation method comprising the following steps:

[0075] Conductive tape is attached to the perovskite solar cell, and tin-plated copper strip is soldered to extract the current from the perovskite solar cell. A liquid protective coating (amorphous fluoropolymer Teflon AF1600) is scraped onto the surface of the back electrode of the perovskite solar cell. The liquid protective coating is dripped onto a scraper and scraped at a speed of 100 mm / min. The protective coating is simultaneously filled into the gaps of the laser lines. It is then cured under ultraviolet light at 30°C for 2 min to form a protective coating with a thickness of 100 μm.

[0076] The back glass is cleaned and dried with a hot air knife. The thermoplastic polyolefin encapsulating film (Dow Chemical Enlight) is cut and placed flat in the center on the back glass. The encapsulating film is applied to the surface of the back glass with the edge of the encapsulating film 13mm away from the edge of the back glass. It is then subjected to a second lamination at 100°C. The vacuuming time for the second lamination is 3 minutes, the pressurization time is 4 minutes, and the vacuum degree is 10kPa.

[0077] A ring of sealant (sealant JC-1011) is then applied to the edge of the back glass. The thickness of the sealant is 0.2 mm thicker than the thickness of the encapsulation film, resulting in a back glass with both encapsulation film and sealant. The back glass with encapsulation film and sealant is then heated to 180°C for 3 minutes to obtain a heated back glass. The heated back glass is then aligned with the four edges and laminated with the perovskite solar cell. The first lamination is performed using a first laminator at a temperature of 100°C for 2 minutes, with a vacuum period of 2 minutes and a vacuum degree of 100 kPa, resulting in a perovskite solar cell module.

[0078] Example 4

[0079] This embodiment provides a method for encapsulating a perovskite solar cell module. Except for the protective coating thickness being 10 μm, the encapsulation method is the same as in Embodiment 1.

[0080] Example 5

[0081] This embodiment provides a method for encapsulating a perovskite solar cell module. Except for the protective coating thickness being 150 μm, the encapsulation method is the same as in Embodiment 1.

[0082] Example 6

[0083] This embodiment provides a method for encapsulating a perovskite solar cell module. The encapsulation method is the same as in Embodiment 1, except that the material of the protective coating is replaced with polyurethane (Yuhong SPU101).

[0084] Example 7

[0085] This embodiment provides a method for encapsulating a perovskite solar cell module. The encapsulation method is the same as in Embodiment 1, except that the material of the protective coating is replaced with AB potting compound (SYLGARD160).

[0086] Comparative Example 1

[0087] This comparative example provides a method for encapsulating a perovskite solar cell module. The encapsulation method is the same as that in Example 1, except that no protective coating is applied.

[0088] Comparative Example 2

[0089] This comparative example provides a method for encapsulating a perovskite solar cell module. The encapsulation method is identical to that of Example 1, except that the encapsulating film and sealant are applied to the protective coating of the perovskite cell. The specific steps include:

[0090] Conductive tape is attached to the perovskite solar cell, and tin-plated copper strips are soldered to extract the current from the perovskite solar cell. A liquid protective coating (amorphous fluoropolymer Teflon AF1600) is applied to the surface of the back electrode of the perovskite solar cell by scraping. The liquid protective coating is dripped onto a scraper and scraped at a speed of 1000 mm / min. The protective coating is simultaneously filled into the gaps of the laser lines. The coating is cured with hot air at 45°C for 1 minute to form a protective coating with a thickness of 50 μm.

[0091] After cutting the thermoplastic encapsulating film, place it flat in the center on the perovskite cell. Apply the encapsulating film (Dow Chemical Enlight) to the surface of the protective coating. The edge of the encapsulating film is 11 mm away from the edge of the back glass.

[0092] Next, a ring of sealant (sealant JC-1011) is applied to the edge of the protective coating. The thickness of the sealant is 0.15 mm thicker than the thickness of the encapsulation film, resulting in a perovskite solar cell with an encapsulation film and sealant. After heating the back glass to 150°C for 5 minutes, it is aligned with the four edges and then laminated with the perovskite solar cell. The first lamination is performed using a first laminator. The first lamination temperature is 100°C, the time is 1 minute, the vacuum time is 1 minute, and the vacuum degree is 50 kPa, resulting in a perovskite solar cell module.

[0093] Comparative Example 3

[0094] This comparative example provides a method for encapsulating a perovskite solar cell module. The encapsulation method is identical to that of Example 1, except that the back glass is first laminated with the perovskite solar cell before heating. The details are as follows:

[0095] After aligning the back glass coated with encapsulating film and sealant around the edges, it is laminated with the perovskite solar cell. After heating at 150°C for 5 minutes, it is then laminated in a first laminator at 100°C for 1 minute, with a vacuum time of 1 minute and a vacuum degree of 50 kPa, to obtain the perovskite solar cell module.

[0096] Comparative Example 4

[0097] This comparative example provides a method for encapsulating a perovskite solar cell module. The encapsulation method is identical to that of Example 1, except that heating is not performed before assembling the back glass sheet coated with encapsulating film and sealant. Details are as follows:

[0098] After aligning the back glass coated with encapsulating film and sealant around its edges, it is laminated with the perovskite solar cell and then subjected to a first lamination process using a first laminator. The first lamination process is carried out at a temperature of 100°C for 1 minute, with a vacuuming time of 1 minute and a vacuum degree of 50 kPa, to obtain the perovskite solar cell module.

[0099] The perovskite solar thin-film battery was encapsulated using the methods described in the above embodiments and comparative examples. Specifically, the structure of the perovskite solar thin-film battery includes a glass substrate, a conductive layer, an electron transport layer, a perovskite absorber layer, a hole transport layer, and a back electrode stacked sequentially. Optionally, a protective coating and a back glass are disposed on the back electrode, with an encapsulating film disposed between the protective coating and the back glass. The glass substrate has a thickness of 3.2 mm and is made of ultra-white glass; the conductive layer has a thickness of 300 nm and is made of ITO; the electron transport layer has a thickness of 100 nm and is made of tin oxide; the perovskite absorber layer has a thickness of 300 nm and is made of perovskite; the hole transport layer has a thickness of 100 nm and is made of nickel oxide; and the back electrode has a thickness of 80 nm and is made of copper.

[0100] Test method: The power of the encapsulated perovskite solar cells was tested using a steady-state AAA-level solar simulator. Four samples were tested repeatedly, and the average value was taken. The perovskite solar thin film cells after lamination were observed to see if they were prone to delamination. The comparative experimental results of Example 1 and Comparative Example 1 are shown in Table 1, and the summary results of other examples and comparative examples are shown in Table 2.

[0101] Table 1

[0102]

[0103] Table 2

[0104]

[0105] In Tables 1 and 2, "delamination" refers to the phenomenon of the back electrode falling off, and "√" indicates that the back electrode has not fallen off.

[0106] The following points can be observed from Tables 1 and 2:

[0107] (1) As can be seen from the comprehensive examples 1 to 3, the encapsulation method of the perovskite solar cell module provided by the present invention improves the power after lamination and is less prone to delamination. For the perovskite cell with a power of 9.0 to 9.5W before lamination, the power of the cell after lamination is between 10.6 and 12.0W, which improves the performance of the perovskite cell.

[0108] (2) As can be seen from the combined examples of Example 1 and Comparative Example 1, in Comparative Example 1, without a protective coating, the power after lamination is reduced to below 4.2W and the film is prone to peeling. This shows that the present invention improves the battery efficiency after encapsulation by setting a protective coating.

[0109] (3) As can be seen from the combined examples 1 and 2-4, in Example 1, the encapsulating film and sealant are applied to the back glass and the back glass is preheated in advance. Compared with Comparative Example 2, where the encapsulating film and sealant are applied to the protective coating, Comparative Example 3, where the back glass is laminated and then heated, and Comparative Example 4, where the back glass is not heated directly, the average power after lamination in Example 1 is 11.825W, while the power after lamination in Comparative Examples 2-4 is only 2.3W, 3.1W, and 2.5W, respectively. This shows that by applying the encapsulating film and sealant to the back glass and preheating the back glass in advance, the present invention reduces the heating time of the perovskite solar cell and reduces the efficiency decay after lamination.

[0110] (4) As can be seen from the combined examples 1 and 4-5, the thickness of the protective coating in example 1 is 50 μm. Compared with the thicknesses of 10 μm and 150 μm in examples 4-5, the power after lamination in examples 4-5 is reduced to 7.5 W and 5.9 W, respectively. This shows that the present invention improves the efficiency of the perovskite solar cell after lamination by controlling the thickness of the protective coating within a specific range.

[0111] (5) As can be seen from the combined examples 1 and 6-7, in example 1, amorphous fluorine resin was used as the protective coating. Compared with polyurethane in example 6 and AB potting compound in example 7, the average power after lamination in example 1 was 11.825W and no delamination occurred. In contrast, the power after lamination in example 6 was only 7.3W and in example 7 it was only 6.7W. This is because the polyurethane in example 6 is brittle after curing, which can easily affect the performance of the perovskite battery. The AB potting compound in example 7 has poor water release performance, which can easily reduce the performance of the perovskite battery. This shows that the present invention preferably uses amorphous fluorine resin as the protective coating, which significantly improves the efficiency of the perovskite battery after lamination.

[0112] The present invention has been illustrated with the above embodiments to illustrate its detailed structural features. However, the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must rely on the above detailed structural features to be implemented. Those skilled in the art should understand that any improvements to the present invention, equivalent substitutions for the components used in the present invention, additions of auxiliary components, and selection of specific methods, etc., all fall within the protection scope and disclosure scope of the present invention.

Claims

1. A method for encapsulating a perovskite solar cell module, characterized in that, The encapsulation method includes: A liquid protective coating is applied to the surface of the back electrode of the perovskite solar cell and cured to form a protective coating. The protective coating is simultaneously filled into the gaps of the laser lines. The back glass coated with encapsulating film and sealant is heated to obtain heated back glass. The heated back glass is laminated with the perovskite cell and then first laminated to obtain a perovskite solar cell module. The curing temperature is 30~60℃; The protective coating material includes any one or a combination of at least two of the following: liquid amorphous fluoropolymer, liquid silicone resin, or liquid acrylic resin.

2. The packaging method according to claim 1, characterized in that, The thickness of the protective coating is 20~100μm.

3. The packaging method according to claim 1, characterized in that, The viscosity of the protective coating is <1000 mPa·s.

4. The packaging method according to claim 1, characterized in that, The curing temperature of the protective coating is 50~60℃.

5. The packaging method according to claim 1, characterized in that, The protective coating is made of liquid amorphous fluoropolymer.

6. The packaging method according to claim 1, characterized in that, The coating method includes scraping or spraying.

7. The packaging method according to claim 6, characterized in that, The coating process includes: dripping liquid protective coating onto a scraper and then applying it by scraping.

8. The packaging method according to claim 7, characterized in that, The scraping speed is 100~2000 mm / min.

9. The packaging method according to claim 1, characterized in that, The curing method includes hot air curing or ultraviolet curing.

10. The packaging method according to claim 1, characterized in that, The curing time is 1 to 3 minutes.

11. The packaging method according to claim 1, characterized in that, The heating temperature is 120~180℃.

12. The packaging method according to claim 1, characterized in that, The heating time is 3 to 8 minutes.

13. The packaging method according to claim 1, characterized in that, The temperature of the first lamination is 100~130℃.

14. The packaging method according to claim 1, characterized in that, The first lamination time is 1~5 minutes.

15. The packaging method according to claim 1, characterized in that, The vacuuming time in the first lamination is 1~3 minutes.

16. The packaging method according to claim 1, characterized in that, The vacuum degree of the first lamination is 40~100kPa.

17. The packaging method according to claim 1, characterized in that, The preparation of the back glass with encapsulating film and sealant includes: applying encapsulating film to the surface of the back glass, performing a second lamination, and then applying sealant to the edge of the back glass to obtain a back glass with encapsulating film and sealant.

18. The packaging method according to claim 17, characterized in that, The edge of the encapsulating film is 10-13 mm away from the edge of the back glass.

19. The packaging method according to claim 17, characterized in that, The thickness of the sealant is 0.1 to 0.3 mm thicker than the thickness of the encapsulating film.

20. The packaging method according to claim 17, characterized in that, The temperature of the second lamination is lower than that of the first lamination.

21. The packaging method according to claim 17, characterized in that, The temperature of the second lamination is 70~100℃.

22. The packaging method according to claim 17, characterized in that, The vacuuming time for the second lamination is 3-5 minutes.

23. The packaging method according to claim 17, characterized in that, The pressurization time for the second lamination is 2 to 4 minutes.

24. The packaging method according to claim 17, characterized in that, The vacuum degree of the second lamination is 10~30kPa.

25. A perovskite solar cell module, characterized in that, The perovskite solar cell module is encapsulated using the encapsulation method for perovskite solar cell modules according to any one of claims 1 to 24.

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