A method, apparatus, device and storage medium for device movement
By adjusting the height and speed of the cutting tool and the stage in the wafer dicing apparatus, the problems of low efficiency and safety caused by cutting tool wear were solved, and efficient and safe wafer dicing was achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU MEGAROBO TECH CO LTD
- Filing Date
- 2022-12-20
- Publication Date
- 2026-07-10
AI Technical Summary
Existing wafer dicing equipment does not take into account the wear and tear of the dicing tool when measuring the distance between the dicing tool and the stage, resulting in low dicing efficiency or equipment damage.
By measuring the total height between the cutting tool and the stage, and adjusting the first and second heights according to the wear value of the cutting tool, and moving at different speeds, the safe contact between the cutting tool and the stage and efficient cutting are ensured.
It improves the efficiency of wafer dicing, reduces the risk of equipment damage, and ensures safe contact between the dicing tool and the stage.
Smart Images
Figure CN116079926B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of wafer dicing technology, and in particular to a method, apparatus, device, and storage medium for moving equipment. Background Technology
[0002] In a wafer dicing apparatus, there is generally a dicing tool and a stage. The dicing tool is placed above the stage. Before dicing the wafer, the dicing tool needs to be lowered until it contacts the stage. Therefore, it is necessary to measure the distance between the dicing tool and the stage.
[0003] The preparation work before wafer dicing mainly consists of two stages: the first stage involves the blade rapidly descending a certain distance; the second stage involves the blade slowly descending until it contacts the stage. Existing equipment movement methods primarily employ the principle of "one-time measurement, permanent use," meaning that the distance between the dicing tool and the stage is initially measured and the result is used continuously thereafter. However, because the dicing tool experiences wear and tear during wafer dicing, and current measurement techniques do not account for this wear, it becomes difficult to set the initial distance. If the initial distance is set too small, wafer dicing efficiency will be low; if it is set too large, there will be insufficient distance for the blade to descend slowly, potentially damaging the blade or the stage. Summary of the Invention
[0004] In view of the above problems, this application provides a method, apparatus, device and storage medium for moving equipment, thereby improving the efficiency of moving equipment.
[0005] The embodiments of this application disclose the following technical solutions:
[0006] In a first aspect, this application provides a method for moving a device, the method comprising:
[0007] The total height between the cutting tool and the stage decreases by a first distance at a first speed to a first height, which is determined based on the total height and the wear value of the cutting tool.
[0008] The first height between the cutting tool and the stage is reduced at a second speed until the cutting tool contacts the stage, wherein the first speed and the second speed are different. Optionally, the first speed is greater than the second speed.
[0009] Optionally, the first speed is greater than the second speed.
[0010] Optionally, after the cutting tool contacts the stage, the method further includes:
[0011] The cutting tool and the platform are moved away from each other at a third speed until the cutting tool and the platform are at a second height apart;
[0012] The second height between the cutting tool and the stage is reduced at a fourth speed until the cutting tool contacts the stage.
[0013] By moving the cutting tool and the stage away from each other to a second height and then moving them toward each other at a fourth speed, the process of moving at the first speed is omitted, thereby effectively improving the efficiency of wafer cutting.
[0014] Optionally, the second speed is the same as the fourth speed.
[0015] Optionally, the second height is determined based on the second speed and the time from the first height until the cutting tool contacts the stage.
[0016] Optionally, the wear value of the cutting tool is 0.1 mm.
[0017] Secondly, this application provides a device for moving equipment, the device comprising: a first moving module and a second moving module;
[0018] The first moving module is used to reduce the total height between the cutting tool and the platform by a first distance to a first height at a first speed, wherein the first height is determined based on the total height and the wear value of the cutting tool;
[0019] The second moving module is used to reduce the first height between the cutting tool and the stage at a second speed until the cutting tool contacts the stage, wherein the first speed and the second speed are different.
[0020] Optionally, the first speed is greater than the second speed.
[0021] Optionally, a third moving module;
[0022] The third moving module is used to move the cutting tool and the platform away from each other at a third speed until the cutting tool and the platform are at a second height apart;
[0023] The second height between the cutting tool and the stage is reduced at a fourth speed until the cutting tool contacts the stage.
[0024] Optionally, the second speed is the same as the fourth speed.
[0025] Optionally, the second height is determined based on the second speed and the time from the first height until the cutting tool contacts the stage.
[0026] Optionally, the wear value of the cutting tool is 0.1 mm.
[0027] Thirdly, this application provides an electronic device, the device comprising: a memory and a processor;
[0028] The memory is used to store computer programs;
[0029] The processor is configured to implement the steps of the method of moving a device as described in any of the first aspects when executing the computer program.
[0030] Fourthly, this application provides a computer-readable storage medium, characterized in that the computer-readable storage medium stores a computer program, which, when executed by a processor, implements the steps of the method for moving a device as described in any of the first aspects.
[0031] This application provides a method for moving a device. First, the total height between a cutting tool and a platform is reduced by a first distance to a first height at a first speed. The first height is determined based on the total height and the wear value of the cutting tool. Then, the first height between the cutting tool and the platform is reduced by a second speed until the cutting tool contacts the platform. The first speed and the second speed are different.
[0032] The above method, by determining the first height based on the total height and the wear value of the cutting tool, has the following beneficial effects: First, it minimizes the distance traveled at the second speed (slow speed), reducing the time consumed in the second stage and thus improving the efficiency of wafer cutting; Second, by subtracting the wear value of the cutting tool from the total height, the distance traveled at the second speed is fixed, thereby ensuring the safety of the device, i.e., the cutting tool and the stage contact each other at the second speed (slow speed). Attached Figure Description
[0033] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0034] Figure 1 A flowchart illustrating a method for moving a device, as provided in an embodiment of this application;
[0035] Figure 2a This is a schematic diagram corresponding to a method for moving a device provided in an embodiment of this application;
[0036] Figure 2bThis is a schematic diagram corresponding to a method for moving a device provided in an embodiment of this application;
[0037] Figure 3 This is a schematic diagram of a device for moving equipment, provided in an embodiment of this application. Detailed Implementation
[0038] The terms "first," "second," and "third," etc., used in this application specification, claims, and drawings are used to distinguish different objects, not to limit a specific order.
[0039] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.
[0040] As described earlier, existing equipment movement methods primarily employ the "one-time measurement, permanent use" principle, meaning an initial measurement of the distance between the cutting tool and the stage is used repeatedly. However, during wafer dicing, the cutting tool experiences wear and tear, which current measurement techniques do not account for. This leads to difficulties in setting the initial distance. Setting the initial distance too small results in low wafer dicing efficiency; setting it too large leaves insufficient space for the blade to descend slowly, potentially damaging the blade or stage. Research has shown that subtracting the cutting tool's wear from the total height minimizes the distance traveled at slow speeds, reducing the time spent on slow movement and thus improving wafer dicing efficiency. Furthermore, by subtracting the cutting tool's wear from the total height, the distance traveled at the second speed is fixed, ensuring device safety—the cutting tool and stage make contact at a slow pace.
[0041] In view of this, this application provides a method for moving a device. First, the total height between the cutting tool and the platform is reduced by a first distance to a first height at a first speed. The first height is determined based on the total height and the wear value of the cutting tool. Then, the first height between the cutting tool and the platform is reduced by a second speed until the cutting tool contacts the platform. The first speed and the second speed are different.
[0042] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.
[0043] See Figure 1 The figure is a flowchart of a device moving method provided in an embodiment of this application.
[0044] like Figure 1 As shown, the method includes:
[0045] S101: The total height between the cutting tool and the stage is reduced by a first distance at a first speed to a first height, the first height being determined based on the total height and the wear value of the cutting tool.
[0046] As an example, the cutting tool could be a blade or other device with cutting capabilities.
[0047] As an example, the total height can be the distance between the center of the cutting tool and the stage. The reference point can be the stage or the center of the cutting tool, depending on the actual situation.
[0048] As an example, the movement of the cutting tool or the stage is accomplished by a motor. That is, the movement of the cutting tool or the stage is controlled by a controller issuing corresponding commands. This application does not impose any limitations on the motor or the controller.
[0049] As an example, the wear value of the cutting tool can be 0.1mm. This wear value is an estimate based on a large amount of data statistics, that is, it is estimated that the wear value of the cutting tool is 0.1mm for each cutting action.
[0050] As one possible implementation, such as Figure 2a As shown, the cutting tool can move while the stage remains fixed. Specifically, the cutting tool moves a first distance towards the stage at a first speed to reach a first height, which is determined based on the total height and the wear value of the cutting tool. At this point, the reference point is the stage.
[0051] As one possible implementation, such as Figure 2b As shown, the stage can move while the cutting tool remains stationary. Specifically, the stage moves a first distance towards the cutting tool at a first speed to reach a first height, which is determined based on the total height and the wear value of the cutting tool. At this point, the reference point is the center of the cutting tool.
[0052] The two possible implementation methods described above involve either the platform or the cutting tool moving. Therefore, during equipment installation, the appropriate method can be selected based on the actual site conditions, effectively improving the flexibility of equipment installation.
[0053] It's important to note that wafer dicing is a cyclical process, meaning that each time the dicing equipment is started, multiple cuts need to be completed. Therefore, the total height is a constantly changing value; that is, the current total height is the relative height between the center of the dicing tool and the stage after the last cut.
[0054] S102: Reduce the first height between the cutting tool and the stage at a second speed until the cutting tool contacts the stage, wherein the first speed and the second speed are different.
[0055] One possible implementation is that the stage moves while the cutting tool remains stationary. Specifically, the stage moves toward the cutting tool at a second speed until the stage contacts the cutting tool.
[0056] One possible implementation is that the cutting tool moves while the stage remains fixed. Specifically, the cutting tool moves toward the stage at a second speed until the stage contacts the cutting tool.
[0057] Optionally, the first speed is greater than the second speed.
[0058] This application provides a method for moving a device. First, the total height between a cutting tool and a platform is reduced by a first distance to a first height at a first speed. The first height is determined based on the total height and the wear value of the cutting tool. Then, the first height between the cutting tool and the platform is reduced by a second speed until the cutting tool contacts the platform. The first speed and the second speed are different.
[0059] The above method, by determining the first height based on the total height and the wear value of the cutting tool, has the following beneficial effects: First, it minimizes the distance traveled at the second speed (slow speed), reducing the time consumed in the second stage and thus improving the efficiency of wafer cutting; Second, by subtracting the wear value of the cutting tool from the total height, the distance traveled at the second speed is fixed, thereby ensuring the safety of the device, i.e., the cutting tool and the stage contact each other at the second speed (slow speed).
[0060] In addition to the above, the methods provided in this application also include:
[0061] After the cutting is completed, the cutting tool and the platform are moved away from each other at a third speed until the cutting tool and the platform are at a second height apart.
[0062] The second height between the cutting tool and the stage is reduced at the fourth speed until the cutting tool contacts the stage.
[0063] In one possible implementation, the cutting tool moves while the stage remains stationary. Specifically, the cutting tool moves away from the stage at a third velocity until the distance between the cutting tool and the stage reaches a second height, and then moves towards the stage at a fourth velocity until the cutting tool contacts the stage.
[0064] In one possible implementation, the stage moves while the cutting tool remains stationary. Specifically, the stage moves away from the cutting tool at a third velocity until the distance between the stage and the cutting tool reaches a second height, and then moves towards the cutting tool at a fourth velocity until the stage contacts the cutting tool.
[0065] As an example, the second speed is equal to the fourth speed.
[0066] As an example, the second height can be determined based on the second speed and the time from the first height until the cutting tool contacts the stage. For example, if the time from the first height to the second speed until the cutting tool contacts the stage is t1, and the second speed is v2, then the second height = t1 * v2.
[0067] By moving the cutting tool and the stage away from each other to a second height and then moving them toward each other at a fourth speed, the process of moving at the first speed is omitted, thereby effectively improving the efficiency of wafer cutting.
[0068] See Figure 3 The figure is a schematic diagram of the structure of a device moving device provided in an embodiment of this application.
[0069] like Figure 3 As shown, the device includes: a first moving module 301 and a second moving module 302;
[0070] The first moving module 301 is used to reduce the total height between the cutting tool and the platform by a first distance to a first height at a first speed. The first height is determined based on the total height and the wear value of the cutting tool.
[0071] The second moving module 302 is used to reduce the first height between the cutting tool and the stage at a second speed until the cutting tool contacts the stage, wherein the first speed and the second speed are different.
[0072] Optionally, the device further includes: a third moving module;
[0073] The third moving module is used to move the cutting tool and the stage away from each other at a third speed until the cutting tool and the stage are a second height apart; and to reduce the second height between the cutting tool and the stage at a fourth speed until the cutting tool contacts the stage.
[0074] Optionally, the second speed is the same as the fourth speed.
[0075] Optionally, the second height is determined based on the second speed and the time from the first height until the cutting tool contacts the stage.
[0076] Optionally, the cutting tool wear value is 0.1 mm.
[0077] This application provides a device for moving equipment, comprising a first moving module and a second moving module. The first moving module is used to reduce the total height between a cutting tool and a platform by a first distance to a first height at a first speed, the first height being determined based on the total height and the wear value of the cutting tool. The second moving module is used to reduce the first height between the cutting tool and the platform at a second speed until the cutting tool contacts the platform, wherein the first speed and the second speed are different.
[0078] The above-mentioned device has the following beneficial effects: First, it compresses the distance traveled at the second speed (slow speed) to the maximum extent, reduces the time consumed in the second stage, and thus improves the efficiency of wafer dicing; Second, by subtracting the wear value of the dicing tool from the total height, the distance traveled at the second speed is fixed, thus ensuring the safety of the device, that is, the dicing tool and the stage come into contact at the second speed (slow speed).
[0079] This application provides a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the device movement method described in this application.
[0080] In practical applications, the computer-readable storage medium can be any combination of one or more computer-readable media. The computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. For example, a computer-readable storage medium can be, but is not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of computer-readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this embodiment, the computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.
[0081] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. Computer-readable signal media may also be any computer-readable medium other than computer-readable storage media, capable of sending, propagating, or transmitting programs for use by or in connection with an instruction execution system, apparatus, or device.
[0082] Program code contained on a computer-readable medium may be transmitted using any suitable medium, including but not limited to wireless, wire, optical fiber, RF, etc., or any suitable combination thereof.
[0083] Computer program code for performing the operations of this invention can be written in one or more programming languages or a combination thereof, including object-oriented programming languages such as Java, Smalltalk, and C++, as well as conventional procedural programming languages such as "C" or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).
[0084] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, for the device embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the description of the method embodiments. The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separate. The components indicated as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment solution according to actual needs. Those skilled in the art can understand and implement this without creative effort.
[0085] The above description is merely one specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A method for moving equipment, characterized in that, The method includes: The total height between the cutting tool and the stage decreases by a first distance at a first speed to a first height, which is determined based on the total height and the wear value of the cutting tool. The first height between the cutting tool and the stage is reduced at a second speed until the cutting tool contacts the stage, wherein the first speed and the second speed are different.
2. The method as described in claim 1, characterized in that, The first speed is greater than the second speed.
3. The method as described in claim 1, characterized in that, After the cutting tool contacts the stage, the method further includes: The cutting tool and the platform are moved away from each other at a third speed until the cutting tool and the platform are at a second height apart; The second height between the cutting tool and the stage is reduced at a fourth speed until the cutting tool contacts the stage.
4. The method as described in claim 3, characterized in that, The second speed is the same as the fourth speed.
5. The method as described in claim 4, characterized in that, The second height is determined based on the second speed and the time from the first height until the cutting tool contacts the stage.
6. The method as described in claim 1, characterized in that, The wear value of the cutting tool is 0.1 mm.
7. A device for moving equipment, characterized in that, The device includes: a first moving module and a second moving module; The first moving module is used to reduce the total height between the cutting tool and the platform by a first distance to a first height at a first speed, wherein the first height is determined based on the total height and a preset value; The second moving module is used to reduce the first height between the cutting tool and the stage at a second speed until the cutting tool contacts the stage, wherein the first speed and the second speed are different.
8. The apparatus as claimed in claim 7, characterized in that, The device further includes: a third moving module; The third moving module is used to move the cutting tool and the platform away from each other at a third speed until the cutting tool and the platform are at a second height apart; The second height between the cutting tool and the stage is reduced at a fourth speed until the cutting tool contacts the stage.
9. An electronic device, characterized in that, include: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the computer program, implements the method of moving the device as described in any one of claims 1 to 6.
10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores instructions that, when executed on a terminal device, cause the terminal device to perform the device movement method as described in any one of claims 1 to 6.