Power distributor and device

Abstract

Embodiments of the present invention disclose a power divider and device, wherein the divider includes: a local oscillator signal input layer; a local oscillator signal layer located on one side of the local oscillator signal input layer; a second local oscillator signal layer located on a side of the local oscillator signal layer away from the local oscillator signal input layer; a first tunnel hole extending through the local oscillator signal input layer and the local oscillator signal layer; a second tunnel hole and a third tunnel hole extending through the local oscillator signal input layer; and a fourth tunnel hole extending through the second local oscillator signal layer. The solution described in this application utilizes a multilayer board structure to achieve layered signal transmission, and the resistors of the Wilkinson power divider are soldered using a low-cost slotting method.

Description

Technical Field

[0001] The present invention relates to the field of radar technology, and more specifically, to a low-cost, miniaturized plate-shaped power divider and device. Background Art

[0002] With increasing military demands and advancements in circuit design and manufacturing technology, modern radar is developing towards high integration, miniaturization, and broadband performance. As a crucial component of microwave circuits, power distribution networks often utilize high-performance, thin-film substrates and embedded resistors to meet the requirements of modern radar, achieving high-frequency, broadband miniaturization. However, this approach suffers from high process precision requirements, significant performance impacts of assembly, and high costs, resulting in low cost-performance and reliability. Summary of the Invention

[0003] The object of the present invention is to provide a power divider and device to solve the problems of insufficient performance and high cost of existing devices.

[0004] In order to achieve the above objectives, this scheme adopts the following technical solutions:

[0005] In a first aspect, the present invention provides a power distributor, comprising:

[0006] Local oscillator signal input layer;

[0007] A local oscillator signal layer located on one side of the local oscillator signal input layer;

[0008] A second local oscillator signal layer located on a side of the local oscillator signal layer away from the local oscillator signal input layer;

[0009] a first tunnel hole passing through the local oscillator signal input layer and the local oscillator signal layer;

[0010] A second tunnel hole and a third tunnel hole passing through the local oscillator signal input layer;

[0011] A fourth tunnel hole passes through the two local oscillation signal layers.

[0012] In a preferred embodiment, a microwave board is provided in at least one of the local oscillator signal input layer, the local oscillator signal layer and the second local oscillator signal layer.

[0013] In a preferred embodiment, the thickness of the microwave board is 20 mil.

[0014] In a preferred embodiment, the local oscillator signal layer is welded to the resistor of the power divider through the first tunnel hole.

[0015] In a preferred embodiment, the second local oscillation signal layer is welded to the resistor of the power divider through the fourth tunnel hole.

[0016] In a preferred embodiment, the diameter of at least one of the first tunnel hole, the second tunnel hole, the third tunnel hole and the fourth tunnel hole is 3.5 mm.

[0017] In a preferred embodiment, a coplanar waveguide is provided on a side of the local oscillator signal input layer away from the local oscillator signal layer.

[0018] In a preferred embodiment, the isolation between the layers is greater than or equal to 28 dB.

[0019] In a preferred embodiment, the distance between the coplanar waveguide and the local oscillator signal layer is not less than 0.275 mm; and / or,

[0020] The parallel trace length between the coplanar waveguide and the local oscillator signal layer is no more than 3mm

[0021] In a first aspect, the present solution provides a power distribution device, wherein the power divider described above is cascaded together through ports, structures and coplanar waveguides to form a power distribution network.

[0022] The beneficial effects of the present invention are as follows:

[0023] The solution described in this application adopts a multi-layer board structure to achieve layered transmission of signals, and the resistors of the Wilkinson power divider are welded by a low-cost slotting method. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 A schematic diagram of the miniaturized power splitter network stack design of the present application is shown.

[0026] Figure 2 The HFSS simulation model of the power divider of this application is shown.

[0027] Figure 3 The simulation results of the single-section one-to-two stripline Wilkinson power divider of the present application are shown.

[0028] Figure 4 The SMP RF connector and GCPW-stripline simulation model of the present application are shown, (a) SMP RF connector, (b) GCPW-stripline transition structure.

[0029] Figure 5The simulation results of the SMP RF connector of this application are shown.

[0030] Figure 6 The simulation results of the GCPW-stripline transition structure of the present application are shown.

[0031] Figure 7 The spacing between the top GCPW and the stripline SL and the parallel running length of the present application are shown.

[0032] Figure 8 The GCPW and SL isolation of this application are shown in Figure 1. (a) shows different spacings, and (b) shows different parallel trace lengths.

[0033] Figure 9 The cascade simulation results of the one-to-eight stripline Wilkinson power splitter network of the present application are shown.

[0034] Figure 10 The test results of the one-to-eight stripline Wilkinson power splitter network of the present application are shown, (a) shows the standing wave characteristics, (b) shows the transmission loss, and (c) shows the transmission phase characteristics.

[0035] Figure 11 The isolation characteristics of each branch port of the one-to-eight stripline Wilkinson power splitter network of the present application are shown.

[0036] Figure 12 It shows the isolation characteristics between one and two local oscillator signals of the present application. DETAILED DESCRIPTION

[0037] To make the present invention, technical solutions, and advantages more clear, embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present application, and are not exhaustive of all embodiments. It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other unless there is a conflict.

[0038] The power is divided into 8 layers, the layers are as follows Figure 1 As shown in the figure, the first local oscillator signal is transmitted from the coaxial connector through a through-hole from the surface GCPW into the stripline. The Wilkinson power divider achieves a 1:8 power split. The stripline Wilkinson power divider resistor is soldered through the non-metalized blind cavity on the top surface. The second local oscillator signal is similarly soldered through the non-metalized blind cavity on the bottom surface. To meet current soldering requirements, the non-metalized hole diameter is 3.5mm.

[0039] The commonly used stripline Wilkinson power divider uses CLTE-XT buried resistor board. The present invention adopts Rogers 4350B microwave board with a thickness of 20 mil, a dielectric constant of 3.48, and a loss tangent of 0.0037. The surface mount resistor is welded to the stripline signal layer by opening a non-metallized hole. In order to meet the actual processing and welding requirements of the process, the hole size is expanded to a diameter of 3.5 mm. Considering that the difference between the simulation model and the actual object may cause a large difference between the measured results and the simulation results, affecting the practical application of the project, the metal electrode structure and pad size of the packaged surface mount resistor are added to the simulation model during the simulation. Taking the local oscillation power divider as an example, the specific modeling is as follows Figure 2 shown.

[0040] The simulation results of a single-section one-to-two stripline Wilkinson power divider are as follows: Figure 3 As shown in the figure, the transmission losses S(2,1) and S(3,1) of the two-way power splitter are both less than 3.5dB in the 4.78-5.78GHz operating frequency band. Due to the poor isolation of the open cavity structure, the isolation S(2,3) between the two ports is greater than 18.5dB, the voltage standing wave VSWR(1) of the combined port is less than 1.2, and the standing wave VSWR(2) and VSWR(3) of the branch ports are less than 1.18.

[0041] To achieve miniaturization, microwave signals are transmitted through the SMP connector to the surface GCPW, and then transmitted to the signal layer through the GCPW. The transition structure is simulated in sections using simulation software. Through modeling and simulation, the transition part of the connector and GCPW connection is optimized. The simulation results show that the transmission loss (2,1) of the connector and GCPW connection is less than 0.3dB, and the port standing wave VSWR (1) and VSWR (2) are less than 1.2. The specific simulation model and performance simulation results are as follows: Figure 4 (a) and Figure 5 The GCPW-stripline transition structure simulation model is shown in Figure 4 (b) shows the simulation results. Figure 6 The port standing waves at both ends of the transition structure are less than 1.2, and the loss is less than 0.2dB.

[0042] For miniaturized stacked structures, proper isolation of signals in different frequency bands is particularly important. High isolation can often be achieved through layering and controlling the orientation of the non-metallized vias (PTHs) used to solder isolation resistors. However, to control stack height or reduce costs, the number of layers should be minimized.

[0043] The power splitter network of the present invention uses an 8-layer board. By etching away the copper layer on two new boards, two sets of strip lines are formed. The GCPW on the top layer has a common ground relationship with the first set of strip lines. Figure 1For miniaturized power splitter networks, to ensure signal isolation, the spacing between the top GCPW and the stripline SL, as well as the length of the parallel traces, must be strictly controlled.

[0044] by Figure 7 Taking the model as an example, it is necessary to control the spacing between the top GCPW and the first layer of strip lines and the length of the parallel lines. The simulation results are as follows Figure 9 shown. Figure 8 (a) shows the simulation results of the isolation between the top GCPW and SL at different spacings. The isolation increases with the spacing. When the line-to-sideband spacing reaches 0.275 mm, the isolation is greater than 28 dB. Figure 8 (b) shows the simulation results of the isolation between the top-layer GCPW and SL under different parallel trace lengths. The isolation decreases with the increase of the parallel trace length, and reaches 28dB when the parallel trace length is less than 3mm.

[0045] The one-to-eight power splitter network needs to ensure the consistency of the loss and phase from the main port to each branch port, and ensure the consistency of the routing length. The one-to-two power splitter, connector, and GCPW transition structure are cascaded for simulation, and the simulation results obtained by segmentation are cascaded using ADS. Due to the poor isolation of the open cavity structure, the isolation characteristics between the ports are improved by adding 3dB attenuation to the 8 branch ports. Only the local oscillator power splitter network is taken as an example. The performance simulation results of the one-to-eight power splitter are as follows Figure 9 As shown in the results, the transmission loss S(2,1) of the 1-to-8 power splitter is less than 15dB within the operating frequency band of 4.78-5.78GHz, the isolation between two adjacent branch ports S(3,4) and S(4,5) is greater than 25dB, the voltage standing wave (VSWR) of the combined port is less than 1.4, and the standing wave of each branch port is less than 1.2.

[0046] This power splitter network consists of an SMP RF connector, surface-mount resistors, and a printed circuit board. Isolation resistors are soldered into non-metallized vias. A vector network analyzer (VNA) was used to test the transmission performance of the power splitter network, and the test results were exported as an .s2p file for analysis.

[0047] Its port characteristics are as follows Figure 10 The standing wave characteristics are as shown in Figure 10 As shown in (a), the standing wave of the branch port is less than 1.3, and the standing wave of the total port is less than 2 in the range of 4.5-5.5GHz.

[0048] like Figure 10 As shown in (b) and (c), the differential loss of each port within the operating frequency band is less than 16dB, and the in-band flatness is ±0.6dB; each port has good consistency, with amplitude consistency less than 0.5dB and phase consistency less than 5°. Figure 11The power division network of the present invention has good isolation characteristics, and the isolation of each sub-port within the working frequency band is greater than 30dB.

[0049] The isolation between different frequency bands in the power division network is also very important. Figure 12 The isolation characteristic measured at the second local oscillator power splitter network when the main port of the local oscillator power splitter network is input. The attenuation of the local oscillator power splitter network is less than 16dB. After testing, the isolation characteristic between the first and second local oscillators of the power splitter network designed in the present invention is greater than 37dB.

[0050] The present invention designs a miniaturized power splitter network using isolation resistors welded through non-metallized holes to achieve power distribution for the primary and secondary local oscillator signals. Test results demonstrate good consistency across the channels of the power splitter network, with amplitude consistency less than 0.5dB, phase consistency less than 5°, and isolation greater than 30dB between each branch port. High isolation is also achieved between the primary and secondary local oscillator power splitter networks, with isolation greater than 37dB. The present invention validates the practicality of the power splitter board through simulation and physical testing.

[0051] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the scope of protection of the present invention.

Claims

1. A power distributor, characterized in that: The dispenser includes: Local oscillator signal input layer; A local oscillator signal layer located on one side of the local oscillator signal input layer; A second local oscillator signal layer located on a side of the local oscillator signal layer away from the local oscillator signal input layer; a first tunnel hole penetrating the local oscillator signal input layer and the local oscillator signal layer, wherein the local oscillator signal layer is welded with a resistor of a power divider through the first tunnel hole; A second tunnel hole and a third tunnel hole passing through the local oscillator signal input layer; a fourth tunnel hole penetrating the second local oscillation signal layer, wherein the second local oscillation signal layer is welded with a resistor of a power divider through the fourth tunnel hole; A coplanar waveguide is provided on a side of the local oscillator signal input layer away from the local oscillator signal layer; The isolation between each layer is greater than or equal to 28dB; The distance between the coplanar waveguide and the local oscillation signal layer is not less than 0.275 mm; and / or, The length of the parallel trace between the coplanar waveguide and the local oscillator signal layer shall not exceed 3 mm.

2. The power divider according to claim 1, characterized in that A microwave board is provided in at least one of the local oscillation signal input layer, the local oscillation signal layer and the second local oscillation signal layer.

3. The power divider according to claim 2, characterized in that The thickness of the microwave plate is 20 mil.

4. The power divider according to claim 1, characterized in that A diameter of at least one of the first tunnel hole, the second tunnel hole, the third tunnel hole, and the fourth tunnel hole is 3.5 mm.

5. A power distribution device, characterized in that: The power divider as claimed in claim 1 is cascaded together by ports, structures and coplanar waveguides to form a power distribution network.

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