Display module and display device

Abstract

The display module and the display device provided by the embodiments of the present disclosure have the following beneficial effects. The display module provided by the embodiments of the present disclosure is provided with a heat dissipation layer on the non-display side of the display panel, and the heat dissipation layer is provided with at least one heat dissipation channel. The heat dissipation channel is not limited by the material and can continuously dissipate heat, and the heat dissipation effect is more uniform and more stable. The phenomenon that the electronic devices arranged on the driving circuit board fail and the local area of the display panel overheats due to the temperature rise of the driving circuit board, thereby causing display abnormalities, is avoided, and the display effect and product yield of the display module are improved.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, specifically to a display module and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) devices are electroluminescent devices based on organic semiconductor materials, characterized by high light conversion efficiency and very low power consumption. With the development of OLED display technology, small-sized OLED display panels are now ubiquitous, while large-sized OLED display panels are gradually being developed for applications such as automotive and airborne displays.

[0003] However, for large-size OLED display panels, as their size increases, the number of electronic components on the driver circuit board also increases, resulting in higher temperatures on the driver circuit board during operation, which can easily damage the electronic components; in addition, the temperature of the corresponding position on the display panel where the driver circuit board is placed is high, causing local pixel failure and affecting the display effect. Summary of the Invention

[0004] This disclosure provides a display module and a display device.

[0005] In a first aspect, embodiments of this disclosure provide a display module, including:

[0006] Display panel;

[0007] A driving circuit board is located on the non-display side of the display panel and is connected to the display panel via a flexible circuit board;

[0008] A heat dissipation layer is located between the display panel and the driving circuit board. At least one heat dissipation channel is formed on the heat dissipation layer. The heat dissipation channel extends along a first direction and penetrates the heat dissipation layer in the first direction. The first direction is parallel to the plane where the driving circuit board is located.

[0009] In some embodiments, at least one groove is formed on one side surface of the heat dissipation layer facing the display panel, the groove extending along the first direction and penetrating the heat dissipation layer in the first direction;

[0010] The groove and the side surface of the drive circuit board facing the heat dissipation layer form the heat dissipation channel.

[0011] In some embodiments, the thickness a of the heat dissipation layer, the width b of the groove, and the depth c of the groove respectively satisfy:

[0012] c<a<1mm, 0<b<0.2mm, 0<c<0.2mm.

[0013] In some embodiments, the heat dissipation channel is arranged in a straight line, a square wave line, or a wavy line.

[0014] In some embodiments, the material of the heat dissipation layer includes stainless steel.

[0015] In some embodiments, the display module further includes a fan device, the fan device including a first vent, a fan and a second vent, the fan being located between the first vent and the second vent;

[0016] The fan device is located on the non-display side of the display panel. The first air vent of the fan device is connected to an opening of the heat dissipation channel. The fan device is configured to generate airflow in the heat dissipation channel when the fan is started.

[0017] In some embodiments, the fan assembly further includes a drying structure located between the first vent and the fan.

[0018] In some embodiments, the drying structure includes a receiving portion and a desiccant located within the receiving portion.

[0019] In some embodiments, the drying structure further includes: a heat-conducting portion;

[0020] The receiving portion includes: a metal mesh;

[0021] The metal mesh is connected to the heat dissipation layer via a heat-conducting part.

[0022] Secondly, embodiments of this disclosure provide a display device, including the display module provided in the first aspect.

[0023] In the display module provided in this embodiment, a heat dissipation layer 2 is provided on the non-display side of the display panel, and at least one heat dissipation channel is formed on the heat dissipation layer. Compared with the structure of providing a graphite heat sink on the back side of the display panel in the related art, the heat dissipation channel can continuously dissipate heat and achieve a more uniform and stable heat dissipation effect. This avoids the failure and short circuit of electronic devices on the drive circuit board due to the overheating of the drive circuit board, as well as the overheating of the area of ​​the display panel corresponding to the drive circuit board, which can cause pixel damage and failure to display normally. This improves the display effect and product yield of the display module. Attached Figure Description

[0024] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings:

[0025] Figure 1This is a schematic diagram of the structure of a display module on the non-display side, provided in an embodiment of this disclosure.

[0026] Figure 2 This is a side view of a display module provided in an embodiment of the present disclosure.

[0027] Figures 3a-3c This is a schematic diagram of the structure of the heat dissipation layer provided in an embodiment of this disclosure.

[0028] Figure 4 This is a schematic diagram of the non-display side of another display module provided in an embodiment of this disclosure.

[0029] Explanation of reference numerals in the attached figures:

[0030] Display panel D, driver circuit board 1, heat dissipation layer 2, flexible circuit board FPC, adhesive layer 3, cover plate 4;

[0031] Groove 2a, heat dissipation channel 20, first direction X;

[0032] 5. Fan device; 6. Drying structure; 61. Container; 610. Metal mesh; 62. Heat conduction part. Detailed Implementation

[0033] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0035] Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0036] Organic light-emitting diode (OLED) devices are electroluminescent devices based on organic semiconductor materials, characterized by high light conversion efficiency and very low power consumption. With the development of OLED display technology, small-sized OLED display panels are now ubiquitous, while large-sized OLED display panels are gradually being developed for applications such as automotive and airborne displays.

[0037] For large-size OLED display panels, the increased size leads to more complex circuitry for driving them, and also demands higher integration requirements for electronic components. Consequently, the driver circuit board integrates more electronic components, such as the power management circuit PM-IC, buck converter, timing control circuit T-CON, display driver circuit EL-IC, and flash memory chips. This integration can easily lead to heat buildup, causing localized overheating on the display panel, resulting in pixel failure, affecting display quality, and reducing the panel's lifespan.

[0038] In related technologies, a graphite heat sink is placed between the driver circuit board and the display panel to transfer the heat generated on the driver circuit board. However, the graphite heat sink cannot achieve uniform heat dissipation and has low heat dissipation efficiency, which cannot meet the heat dissipation requirements of large-size display panels.

[0039] To address at least one of the aforementioned technical problems, this disclosure provides a display module. By providing a heat dissipation layer with heat dissipation channels on the non-display side of the display panel in the display module, the display panel avoids pixel abnormalities caused by localized high temperatures, thereby improving the display effect and lifespan of the display panel.

[0040] Figure 1 This is a schematic diagram of the non-display side of a display module provided in an embodiment of this disclosure. Figure 2 This is a side view of a display module provided in an embodiment of the present disclosure, as shown below. Figure 1 , Figure 2 As shown, the display module includes a display panel D, a driver circuit board 1, and a heat dissipation layer 2.

[0041] The driving circuit board 1 is located on the non-display side of the display panel D and is connected to the display panel via a flexible circuit board. The heat dissipation layer 2 is located between the display panel and the driving circuit board 1. At least one heat dissipation channel 20 is formed on the heat dissipation layer 2. The heat dissipation channel 20 extends along a first direction X and penetrates the heat dissipation layer 2 in the first direction X. The first direction X is parallel to the plane where the driving circuit board 1 is located.

[0042] In the display module provided in this embodiment, a heat dissipation layer 2 is provided on the non-display side of the display panel, and at least one heat dissipation channel 20 is formed on the heat dissipation layer 2. Compared with the structure of providing a graphite heat sink on the back side of the display panel in the related art, the heat dissipation channel 20 is not limited by materials, can continuously dissipate heat, and achieve a more uniform and stable heat dissipation effect. This avoids the phenomenon that electronic devices on the drive circuit board 1 fail or short-circuit due to the temperature rise of the drive circuit board 1, and that the area of ​​the display panel corresponding to the placement area of ​​the drive circuit board 1 overheats, causing pixel damage and failure to display normally, thereby improving the display effect and product yield of the display module.

[0043] It should be understood that, in the embodiments of this disclosure, the heat dissipation layer 2 can be attached to the surface of the non-display side of the display panel by the adhesive layer 3. The adhesive layer 3 can be a high-temperature resistant adhesive material, such as optical adhesive, conductive adhesive, etc., and the embodiments of this disclosure do not limit it.

[0044] like Figure 1 As shown, the driving circuit board 1 can be electrically connected to the display panel via a flexible printed circuit board (FPC). Specifically, the display panel has a display area and a peripheral area located on one side of the display area. Multiple bonding terminals are provided on the peripheral area. The flexible printed circuit board (FPC) can be bonded to these bonding terminals via a flip-chip film and then bent to the non-display side of the display panel. Furthermore, the other end of the flexible printed circuit board (FPC) is connected to the driving circuit board 1. Multiple control circuits can be provided on the driving circuit board 1 to send control signals to the display panel and control its operation. Additionally, Figure 2 The flexible printed circuit board (FPC) is not shown in the image.

[0045] In this embodiment, the driving circuit board 1 can be a printed circuit board assembly (PCBA), where various electronic components are assembled onto the printed circuit board using surface mount technology to form a PCBA. Specifically, the driving circuit board 1 may include a printed circuit board 11 and an electronic component group 12 soldered onto the printed circuit board 11, with the printed circuit board located on the side of the electronic components closer to the display panel. The aforementioned electronic component group 12 may include at least one of a power management circuit PM-IC, a buck converter circuit, a timing control circuit T-CON, a display driver circuit EL-IC, and a flash memory chip, which is not limited in this embodiment.

[0046] The aforementioned "first direction X is parallel to the plane where the drive circuit board 1 is located" refers to the direction that is parallel to the plane where the printed circuit board 11 on the drive circuit board 1 is located.

[0047] In one example, such as Figure 1 As shown, the first direction X can be parallel to the extension direction of the printed circuit board 11.

[0048] It should also be noted that, such as Figure 1 As shown, a cover plate 4 is also provided on the non-display side of the display panel. The cover plate 4 is located on the side of the drive circuit board 1 away from the display panel to avoid physical damage to the drive circuit board 1 and to protect it. However, the formation of the cover plate 4 is not conducive to heat dissipation of the drive circuit board 1.

[0049] In this embodiment, the cover plate 4 only covers the driving circuit board 1 in the thickness direction of the display panel, but forms a first opening with the non-display side surface of the display panel, and the first opening exposes the opening of the heat dissipation channel 20, so as to avoid blocking the airflow and affecting the heat dissipation effect.

[0050] In one example, the material of the cover plate 4 can be a hard material with high temperature resistance, such as metal or glass, and this disclosure does not limit this.

[0051] In some embodiments, at least one groove 2a is formed on the side surface of the heat dissipation layer 2 facing the display panel. The groove 2a extends along the first direction X and penetrates the heat dissipation layer 2 in the first direction X. The groove 2a and the side surface of the drive circuit board 1 facing the heat dissipation layer 2 form a heat dissipation channel 20. That is, the heat dissipation channel 20 penetrates the heat dissipation layer 2 in the first direction X so that air convection can be formed in the heat dissipation channel 20, thereby transferring the heat generated by the drive circuit board 1 during operation, enhancing the heat dissipation effect, and avoiding display defects caused by local high temperature of the display panel.

[0052] In some embodiments, such as Figure 2As shown, the thickness a of the heat dissipation layer 2, the width b of the groove 2a, and the depth c of the groove 2a satisfy the following conditions: c < a < 1 mm, 0 < b < 0.2 mm, and 0 < c < 0.2 mm, respectively.

[0053] For example, the thickness 'a' of the heat dissipation layer 2 can be 0.9mm, 0.8mm, 0.7mm, 0.6mm, 0.5mm, 0.4mm, etc., and this embodiment does not limit it.

[0054] Figures 3a-3c This is a schematic diagram of the structure of the heat dissipation layer 2 provided in an embodiment of this disclosure, as shown below. Figure 3a As shown, the heat dissipation channel 20 is arranged in a straight line. The direct-out heat dissipation channel 20 facilitates the fabrication of the heat dissipation layer 2 and simplifies the manufacturing process; or, as... Figure 3b As shown, the heat dissipation channel 20 is arranged in a square wave shape. This structure allows for a longer airflow path per unit volume, resulting in more heat transfer and improved heat dissipation efficiency; or, as... Figure 3c As shown, the heat dissipation channel 20 is arranged in a wavy line. This structure of heat dissipation channel 20 will not form wind resistance, has high heat dissipation efficiency and helps to reduce energy loss.

[0055] like Figures 3a-3c As shown, for ease of manufacturing, the multiple heat dissipation channels 20 in the heat dissipation layer 2 adopt the same arrangement. In other examples, the multiple heat dissipation channels 20 may also adopt different arrangements. For example, some of the multiple heat dissipation channels 20 in the heat dissipation layer 2 may adopt a square wave linear arrangement and some may adopt a straight line arrangement; or, some of the heat dissipation channels 20 may adopt a square wave linear arrangement and some may adopt a wavy linear arrangement; or, the multiple heat dissipation channels 20 on the same heat dissipation layer 2 may include the above three arrangements, that is, some may adopt a square wave linear arrangement, some may adopt a straight line arrangement, and some may adopt a wavy line arrangement. The embodiments of this disclosure do not limit this.

[0056] In some embodiments, the material of the heat dissipation layer 2 includes a rigid material. Further, the material of the heat dissipation layer 2 includes stainless steel, which has good thermal conductivity and hardness. Of course, the material of the heat dissipation layer 2 can be other rigid materials with good thermal conductivity, and this is not limited in the embodiments of this disclosure.

[0057] In some embodiments, the orthographic projection of the heat dissipation layer 2 on the display panel at least partially overlaps with the orthographic projection of the driving circuit board 1 on the display panel. Preferably, the orthographic projection of the heat dissipation layer 2 on the display panel coincides with the orthographic projection of the driving circuit board 1 on the display panel.

[0058] In this embodiment, the driving circuit board 1 is made of composite material, with its main body being a circuit board formed of resin and copper. It has good plasticity, but is prone to warping at high temperatures. Furthermore, the heat dissipation layer 2 is located between the driving circuit board 1 and the display panel, meaning that the heat dissipation layer 2 is in direct contact with the side of the driving circuit board 1 facing the display panel. Since the heat dissipation layer 2 is made of high-hardness stainless steel, and its orthographic projection on the display panel coincides with the orthographic projection of the driving circuit board 1 on the display panel, the heat dissipation layer 2 effectively adds a rigid structure to the surface of the driving circuit board 1, thus effectively suppressing warping of the driving circuit board 1. Simultaneously, the heat dissipation layer 2 has good heat dissipation performance, preventing the display panel from experiencing localized overheating due to increased temperature during operation of the driving circuit board 1, thereby improving the bonding yield of the driving circuit board 1 and extending the lifespan of both the display panel and the driving circuit board 1.

[0059] Figure 4 This is a schematic diagram of the non-display side of another display module provided in an embodiment of this disclosure. In some embodiments, such as... Figure 4 As shown, the display module also includes a fan device 5, which is configured to generate airflow within the heat dissipation channel 20 when the fan is started. This airflow can be either suction or forced airflow, as long as it enables air convection within the heat dissipation channel 20 and achieves heat transfer; this embodiment does not limit this.

[0060] Specifically, the fan device 5 includes: a first vent (not shown in the figure), a fan, and a second vent (not shown in the figure), with the fan located between the first vent and the second vent; the fan device 5 is located on the non-display side of the display panel, and the first vent of the fan device 5 is connected to an opening of the heat dissipation channel 20.

[0061] It should be noted that the connection between the first vent of the fan device 5 and an opening of the heat dissipation channel 20 means that the fan device 5 can be installed on the extension line of the heat dissipation channel 20, i.e. Figure 4 As shown, the fan device 5 is located on one side of the heat dissipation layer 2 in the first direction X, and the fan device 5 is capable of generating airflow in the first direction X.

[0062] In other examples, the fan device 5 can be located on one side of the heat dissipation layer 2 in the second direction and connected to the opening of the heat dissipation channel 20 through a connecting channel so that the first vent is connected to the opening of the heat dissipation channel 20. The second direction is the direction that intersects with the first direction X. That is to say, the specific position of the fan device 5 on the non-display side of the display panel is not limited, as long as it can ensure that airflow is formed in the heat dissipation channel 20 when the fan device 5 is started.

[0063] In some embodiments, such as Figure 4 As shown, the fan assembly 5 also includes a drying structure 6, which is located between the first vent and the fan. The drying structure 6 includes a receiving portion 61 and a desiccant (not shown) located within the receiving portion 61.

[0064] In the initial stage of display module operation, on the one hand, the heat emitted by the drive circuit board 1 does not begin to accumulate in a short period of time; on the other hand, under the operation of the fan device 5, the heat dissipation channel 20 in the heat dissipation layer 2 forms airflow, resulting in a lower temperature for the drive circuit board 1. At this time, the airflow introduced by the fan device 5 may condense into water vapor. Therefore, a drying structure 6 is set between the first vent and the fan. The desiccant in the drying structure 6 absorbs the water vapor to avoid water vapor corrosion of the drive circuit board 1.

[0065] like Figure 4 As shown, the drying structure 6 also includes a heat-conducting part 62 and a receiving part 61, which is a metal mesh 610. The heat-conducting part 62 is configured to connect the metal mesh 610 and the heat dissipation layer 2 to transfer heat between the two.

[0066] Specifically, after the display module has been running for a period of time, on the one hand, the desiccant absorbs moisture in the early stage of the display module's operation and is in a state of high humidity; on the other hand, a lot of heat is generated on the drive circuit board 1. The heat dissipation layer 2 located on one side of the drive circuit board 1 is made of stainless steel, which has thermal conductivity. The metal mesh 610 is connected to the heat dissipation layer 2 through the heat conduction part 62 so that the heat is transferred from the heat dissipation layer 2 to the metal mesh 610, thereby baking the desiccant loaded in the metal mesh 610 and causing the moisture adsorbed in the desiccant to evaporate.

[0067] When the drive circuit board 1 is in a low-temperature, high-humidity environment, the desiccant material in the drying structure 6 adsorbs moisture, preventing moisture corrosion of the drive circuit board 1. When the drive circuit board 1 is in a high-temperature environment, on the one hand, the fan device 5 and the heat dissipation channel 20 combine to form a strong airflow, which has a good heat dissipation effect. On the other hand, the heat conduction part 62 transfers the heat on the heat dissipation layer 2 to the metal mesh 610, causing the moisture in the drying material in the metal mesh 610 to evaporate, thus forming a virtuous cycle. This prevents the high-temperature environment from damaging the electronic components on the drive circuit board 1 and from causing local pixel failure on the display panel to affect the display effect, thereby improving the product yield of the display module.

[0068] In one example, the desiccant may include a physical desiccant, which achieves the drying effect by physically adsorbing moisture and can be reused multiple times. Its material may be silica gel, alumina, etc., and this disclosure does not limit this.

[0069] In one example, the heat-conducting part 62 can be a metal material with good thermal conductivity, such as copper or a copper alloy.

[0070] In some embodiments, the fan device 5 can be fixedly connected to the non-display side of the display panel through the first fixing part. The first fixing part can be an adhesive material with high temperature resistance, such as pressure-sensitive adhesive PSA, polyacrylate double-sided foam tape VHB, etc. The embodiments disclosed herein do not limit this.

[0071] In some embodiments, the drying structure 6 can be fixedly connected to the non-display side of the display panel by the second fixing part, and / or fixedly connected to the heat dissipation layer 2 by the heat-conducting part 62 of the metal material. The second fixing part is an adhesive material with high temperature resistance. It can be the same as or different from the material of the first fixing part. This disclosure does not limit this aspect.

[0072] This disclosure also provides a display device including the above-described display module.

[0073] The aforementioned display device can be any product or component with display function, such as electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator, and this disclosure does not limit it.

[0074] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.

Claims

1. A display module, characterized in that, include: Display panel; A driving circuit board is located on the non-display side of the display panel and is connected to the display panel via a flexible circuit board; A heat dissipation layer is located between the display panel and the driving circuit board and is in direct contact with the driving circuit board. At least one heat dissipation channel is formed on the heat dissipation layer. The heat dissipation channel extends along a first direction and penetrates the heat dissipation layer in the first direction. The first direction is parallel to the plane where the driving circuit board is located. At least one groove is formed on the side surface of the heat dissipation layer facing the driving circuit board. The groove extends along the first direction and penetrates the heat dissipation layer in the first direction. The groove and the side surface of the drive circuit board facing the heat dissipation layer form the heat dissipation channel; The display module further includes a fan device, which is configured to generate airflow in the heat dissipation channel when the fan is started; The fan device includes: a drying structure located on the airflow path between the heat dissipation channel and the fan; the drying structure includes a metal mesh, a heat-conducting part connecting the metal mesh and the heat dissipation layer, and a desiccant loaded on the metal mesh, the desiccant being used to absorb water vapor condensed on the drive circuit board.

2. The display module according to claim 1, characterized in that, The thickness a of the heat dissipation layer, the width b of the groove, and the depth c of the groove respectively satisfy: c<a<1mm, 0<b<0.2mm, 0<c<0.2mm.

3. The display module according to claim 1, characterized in that, The heat dissipation channels are arranged in a straight line, a square wave shape, or a wavy shape.

4. The display module according to claim 1, characterized in that, The heat dissipation layer is made of stainless steel.

5. The display module according to any one of claims 1 to 4, characterized in that... The fan device includes: a first vent, a fan, and a second vent, wherein the fan is located between the first vent and the second vent; The fan device is located on the non-display side of the display panel, and the first vent of the fan device is connected to an opening of the heat dissipation channel.

6. The display module according to claim 5, characterized in that, The drying structure is located between the first vent and the fan.

7. A display device, characterized in that, include: The display module as described in any of claims 1-6 above.

Images