A pad repair device and method with a milling cutter repair function

Abstract

This invention belongs to the technical field of circuit repair and pad repair equipment, specifically disclosing a circuit repair and pad repair device with milling cutter repair function. It includes a worktable and a frame. A support platform is mounted on the worktable, and a substrate with multiple pads is placed on the support platform. The device also includes a controller and a scanning unit. A pad repair unit is mounted on the frame. When the support platform moves, it can move the substrate below the pad repair unit to repair the pads on the substrate. A milling cutter repair unit is also connected to the frame. The milling cutter repair unit includes a milling cutter, a cutter holder, and a power unit that drives the cutter holder to rotate and feed vertically. The power unit is electrically connected to the controller, which controls the power unit to drive the milling cutter to mill pad grooves on the pads. This invention can improve the cleaning and tidying effect of pads and increase the repair yield of pads.

Description

Technical Field

[0001] This invention relates to the technical field of pad repair equipment and circuit repair equipment, specifically to a pad repair and circuit repair equipment and method with milling cutter repair function. Background Technology

[0002] Currently, as Mini & Micro LED and LCD products develop towards high definition, the density of circuits and the number of LEDs and ICs required are increasing. Consequently, the number of circuits and pins is also increasing, as are the number of pads before and after die bonding. Consequently, the number of circuit and pad-related defects is also increasing. Ultimately, circuit and pad-related defects can easily become a major factor affecting the yield of LCD circuits and Mini & Micro LED products, seriously impacting the improvement of LCD and Mini & Micro LED yields. This is especially true for products with complex film structures and a large number of components, where pad cleaning and maintenance are particularly difficult.

[0003] In existing technologies, laser cleaning and removal methods are commonly used to clean and remove defective solder pads. However, laser cleaning has limitations. The cleaning effect on solder pads varies depending on the absorption of different laser wavelengths by different materials. Therefore, the cleaning effect of laser is different for different materials, resulting in poor final cleaning results.

[0004] Currently, when repairing circuits and solder pads, the equipment used for circuit repair has to deal with cleaning foreign objects and impurities of different compositions, such as copper rust, various oxides, copper, nickel, gold, resin, solder paste, flux, rosin, PVX, etc., which can easily lead to poor cleaning and tidying results. Summary of the Invention

[0005] This invention provides a pad repair device with milling cutter repair function, which aims to improve the cleaning and tidying effect of pads.

[0006] The present invention is achieved through the following technical solution: a pad repair device with milling cutter repair function, including a worktable and a frame, a support platform that can move along the X-axis and Y-axis of the worktable is installed on the worktable, a substrate is placed on the support platform, the substrate has multiple pads, and a drive unit that drives the support platform to move along the X-axis and Y-axis of the worktable is provided on the worktable.

[0007] It also includes a controller and a scanning unit. A pad repair unit is installed on the frame. Both the pad repair unit and the scanning unit are located above the worktable and are electrically connected to the controller. When the support platform moves, it can move the substrate to the bottom of the pad repair unit to repair the pads on the substrate.

[0008] The frame is also connected to a milling cutter repair unit, which includes a milling cutter, a cutter holder, and a power unit that drives the cutter holder to rotate and feed vertically. The power unit is electrically connected to the controller, which can control the power unit to drive the milling cutter to mill a groove on the pad.

[0009] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0010] In this invention, by setting up a milling cutter repair unit, defective solder pads can be milled and cleaned. This invention changes the cleaning of solder pads or circuits from the laser method in the prior art to the milling method of a milling cutter. Since the milling of the milling cutter is a physical cleaning, it can adapt to the cleaning of products with different components (foreign matter, impurities, such as copper rust, various oxides, copper, nickel, gold, resin, solder paste, flux, rosin, PVX), so the cleaning effect is better.

[0011] In addition, this solution is characterized by the ability to pre-groove defective pads with a milling cutter before filling and repairing the film structure. This increases the adhesion of the repair electrode, thereby increasing the thrust of the repaired pads and significantly improving the stability of the film structure of the product pads, thus improving the repair success rate and the reliability of the repaired pads.

[0012] Furthermore, the milling cutter repair unit also includes a dust collection tube, the milling cutter is located inside the dust collection tube, and the dust collection tube has a through hole, the milling cutter passes through the through hole and can rotate and move vertically within the through hole, and one end of the dust collection tube is connected to a dust suction unit.

[0013] Beneficial effects: The dust collection pipe can collect impurities generated by the milling cutter during the milling process, preventing impurities from splashing everywhere and further enhancing the cleaning effect on the solder pads. At the same time, because the dust collection pipe has through holes, it can collect the impurities generated during milling without affecting the rotation of the milling cutter.

[0014] Furthermore, a dust collection hood is connected to the bottom of the dust collection pipe, and the dust collection hood is funnel-shaped.

[0015] Beneficial effects: In this solution, when the milling cutter is performing milling operations, the trumpet-shaped dust collection hood can completely surround the milling cutter and guide the chips and foreign objects. The milled chips and metal foreign objects can be collected smoothly, preventing chips and other objects from splashing onto other pads. During the milling process, circumferential tangential foreign objects and chips splashed will be collected into the trumpet-shaped dust collection hood and enter the dust collection pipe.

[0016] Furthermore, the rack is also connected to an alignment camera unit, which includes an alignment camera and a data acquisition module. The alignment camera unit is electrically connected to the controller. The substrate has alignment marks. After the alignment camera unit recognizes the alignment marks on the substrate, the controller will control the drive unit to drive the carrier stage to move below the scanning unit.

[0017] Beneficial effect: The alignment camera unit can ensure the precise position of the substrate, thereby ensuring the accuracy of subsequent data analysis.

[0018] Furthermore, the pad repair unit includes an insulating layer repair unit and a conductive layer repair unit. Both the insulating layer repair unit and the conductive layer repair unit include a coating head and a curing laser. The coating head and the curing laser are connected to the frame. The frame is provided with a moving unit that drives the coating head and the curing laser to move vertically.

[0019] Beneficial effects: In this solution, the coating head is used to apply the filling and repair material, while the curing laser can cure the coated material.

[0020] A method for repairing solder pads with milling cutter repair function, using the solder pad repair equipment with milling cutter repair function as described in any one of claims 1-5, includes the following steps:

[0021] S1, Alignment: An alignment camera unit is installed on the frame. The alignment camera unit aligns the substrate. The controller controls the drive unit to drive the carrier stage to move below the scanning unit.

[0022] S2, Locate the defective pads on the substrate, and use 3D scanning to collect the depth and shape data of the defective parts in the target pads;

[0023] S3, Data Analysis: By comparing and analyzing the depth data of the defect with the layer structure parameters of the target pad, the damaged film layer of the defect is determined.

[0024] S4 preprocesses the defective pads. After analyzing the data in S3, the controller controls the output of the milling cutter repair unit to control the milling cutter to mill the defective pads and mill out the pits to form pad grooves.

[0025] S5, repairing defective pads, the controller controls the pad repair unit to apply material to the corresponding damaged film layer in the pad groove according to the planar shape, and cures the coating layer until all damaged film layers are repaired.

[0026] S6, shaping, scans the repaired circuit or pad. After analyzing the scan data, the controller controls the milling cutter in the milling cutter repair unit to shape the pad in the height direction and the surrounding direction.

[0027] Furthermore, the material coating process in S5 within the pad groove includes the following steps:

[0028] S5.1, Repair the insulating layer of the pad, apply insulating material to the pad groove to form an insulating layer, then cure the insulating layer, and finally control the milling cutter to correct the repaired insulating layer;

[0029] S5.2, Scan the repaired insulation layer for defects. If there are no defects, proceed to the next step. If there are still defects, repair it again.

[0030] S5.3, Repair the conductive layer of the pad. Apply conductive material to the insulating layer repaired in step S5.1 to form a conductive layer, then cure the conductive layer, and finally control the milling cutter to correct the repaired conductive layer.

[0031] S5.4, Scan the repaired conductive layer for defects. If there are no defects, proceed to the next step. If there are still defects, repair it again.

[0032] Furthermore, in S5, an insulating material is first coated onto the pad groove to form an insulating layer, while the pad groove is left with a certain depth. Then, a conductive material is used to fill the pad groove to form a conductive layer.

[0033] Furthermore, the repair methods for pads in S5 also include 3D printing or sputtering etching.

[0034] Furthermore, in S4, the milling cutter is controlled to create a pad groove that matches the shape of the pad and the circuit according to the shape of the circuit and the pad.

[0035] The pad repair method with milling cutter repair function of the present invention has the following advantages compared with the prior art:

[0036] The pad repair method of this invention can automatically move the product under the scanning unit after product alignment. The scanning unit scans the defective lines or pads, and the scanned data is transmitted to the controller. By analyzing the scanned pads, a repair plan is determined. After analysis, the controller outputs control to the milling cutter to pre-process the pads at the repair location. The pad groove is pre-milled into the pad to be repaired. Then, the pad repair unit is controlled to apply an insulating layer and determine the coating thickness. The milling cutter is then controlled to shape the insulating layer and leave a certain depth in the pad groove for the application of the conductive layer. After the pad repair unit applies the coating to the lines or pads, the scanning unit scans the repaired lines or pads. After scanning, the milling cutter is controlled to shape the pads in the height direction and the surrounding direction to finally complete the repair of the entire pad.

[0037] In the pad repair method of this invention, after the pad is grooved to form a pad groove, the material is first applied without filling the pre-milled pad groove through the insulating layer. Instead, a certain depth is reserved in the pad groove, and the remaining pad groove is filled with conductive material. In this way, the bonding part of the metal conductive material changes from the bottom plane to the bonding relationship of the bottom plane plus the four sides. This effectively increases the adhesion of the repair electrode, thereby increasing the thrust of the repaired pad, greatly improving the stability of the film structure of the product pad, and thus improving the repair success rate and the reliability of the repaired pad. Attached Figure Description

[0038] The accompanying drawings, which are included to provide a further understanding of embodiments of the invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0039] Figure 1 This is a front view of an embodiment of the present invention;

[0040] Figure 2 This is a partial perspective view of the cleaned-out solder pad groove in an embodiment of the present invention;

[0041] Figure 3 This is a schematic diagram of the state after filling a new conductive layer in the height direction in an embodiment of the present invention;

[0042] Figure 4 This is a schematic diagram of the state after filling a new conductive layer in the four-dimensional direction in an embodiment of the present invention.

[0043] Figure 5 This is a schematic diagram showing the state after the new conductive layer has been filled and the shaping is completed in an embodiment of the present invention.

[0044] Figure 6 This is a schematic diagram of the layer structure of the solder pads.

[0045] The attached diagram shows the markings and corresponding component names:

[0046] Insulating layer 1a, insulating layer 1b, insulating layer 1c, insulating layer 1d, conductive layer 2a, conductive layer 2b, conductive layer 2c, conductive layer 2d, worktable 1, frame 2, controller 3, alignment camera 4, 3D scanning camera 5, coating head 6, curing laser 7, milling cutter 8, tool holder 801, spindle box 802, guide rail 9, bearing platform 10, substrate 11, solder pad 12, dust collection tube 13, dust collection cover 131, solder pad groove 14. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of the present invention are only used to explain the present invention and are not intended to limit the present invention.

[0048] Example

[0049] like Figure 1 As shown, this embodiment 1 provides a pad repair device with milling cutter repair function, including a worktable 1 and a frame 2. A support platform 10, movable along the X and Y axes of the worktable 1, is mounted on the worktable 1. A substrate 11, which is a glass substrate or a PCB substrate, is placed on the support platform 10. Figure 2 As shown, the substrate 11 has multiple pads 12, such as Figure 1 As shown, the worktable 1 is equipped with a drive unit that drives the carrier platform 10 to move along the X-axis and Y-axis directions of the worktable 1.

[0050] The pad repair device with milling cutter repair function in this embodiment also includes a controller 3 and a scanning unit. The scanning unit in this embodiment is a 3D scanning camera unit, which includes a 3D scanning camera 5, an acquisition module, a storage module, and a conversion module. The 3D scanning camera unit realizes 3D scanning recognition technology, which is existing technology and will not be described in detail here.

[0051] A pad repair unit is mounted on the rack 2. Both the pad repair unit and the scanning unit are located above the worktable 1 and are electrically connected to the controller 3. In this embodiment, the pad repair unit includes an insulating layer repair unit and a conductive layer repair unit, such as... Figure 6 As shown, pad 12 is located on substrate 11. Pad 12 includes insulating layer 1a, insulating layer 1b, insulating layer 1c, insulating layer 1d, conductive layer 2a, conductive layer 2b, conductive layer 2c, and conductive layer 2d. The structure of pad 12 is a structure of conductive layer, insulating layer, and conductive layer.

[0052] When pad 12 is defective, the detached film layers are different, resulting in inconsistent detachment depths. Consequently, the required repair depth during subsequent coating will also vary. Furthermore, pad 12 has a structure consisting of a conductive layer, an insulating layer, and another conductive layer. If only the upper conductive layer is affected, simply applying a metal conductive layer will suffice for repair. If the problem lies between the upper metal conductive layer and the insulating layer, the insulating layer must be applied first, followed by the metal conductive layer, and so on. If the lower metal conductive layer is missing or damaged, the repair process requires first replacing the lower metal conductive layer, then adding an insulating layer, and finally another metal conductive layer. 3D scanning can determine the extent and depth of pad 12 damage, significantly improving the repair success rate.

[0053] When the support platform 10 moves, it can move the substrate 11 to below the pad repair unit to repair the pads 12 on the substrate 11, such as... Figure 1As shown, in this embodiment, the insulating layer repair unit and the conductive layer repair unit in the pad repair unit are located on the left and right sides of the frame 2, respectively. The insulation layer and the conductive layer are repaired by driving the support platform 10 to move from below the insulating layer repair unit to below the conductive layer repair unit.

[0054] Both the insulating layer repair unit and the conductive layer repair unit include a coating head 6 and a curing laser 7. The coating head 6 and the curing laser 7 are connected to the frame 2. The frame 2 is equipped with a moving unit that drives the coating head 6 and the curing laser 7 to move vertically. The moving unit is one of a lead screw structure, a pneumatic cylinder, or an electric cylinder. The power unit can change the height of the curing laser 7, thereby adjusting the repair height position of the solder pad 12, making the repair more flexible. In this embodiment, the coating material used by the coating head 6 in the insulating layer repair unit is an insulating material, while the coating material used by the coating head 6 in the conductive layer repair unit is a metallic conductive material.

[0055] When the drive unit drives the carrier stage 10 to move, it can move the substrate 11 to the underside of the insulation layer repair unit and the conductive layer repair unit respectively, so as to repair the insulation layer and conductive layer of the defective pad 12 on the substrate 11 respectively.

[0056] In this embodiment, the drive unit includes an X-axis drive and a Y-axis drive. Both the X-axis and Y-axis drive include a lead screw, a guide rail 9, and a motor. The motor drives the lead screw to rotate. The guide rail 9 is threadedly connected to the lead screw. The X-axis and Y-axis drive are vertically perpendicular to each other. The guide rail in the X-axis drive and the guide rail in the Y-axis drive are in sliding engagement. The support platform 10 is connected to the upper guide rail 9. That is, the drive unit in this embodiment can adopt a dual-axis linkage mechanism of a machine tool in the prior art.

[0057] The X-axis drive unit drives the guide rail 9 to move along the X-axis by rotating the lead screw driven by the motor. This causes the support platform 10 and the Y-axis drive unit to move together along the X-axis. Similarly, the Y-axis drive unit drives the guide rail 9 to move along the Y-axis. This causes the support platform 10 and the X-axis drive unit to move together along the Y-axis. This enables the support platform 10 to perform compound movements in the X-axis and Y-axis directions, which facilitates the movement of the substrate 11 placed on the support platform 10 to the set position for corresponding repair operations.

[0058] In another embodiment, a alignment camera unit is also connected to the rack 2. The alignment camera unit includes an alignment camera 4, an acquisition module, a storage module, and a conversion module. The alignment camera unit is electrically connected to the controller 3. The substrate 11 has alignment marks. After the alignment camera unit identifies the alignment marks on the substrate 11, the acquisition module acquires information and transmits it to the controller 3. The controller 3 drives the control drive unit to move the carrier stage 10 below the 3D scanning camera unit for scanning.

[0059] In this embodiment, a milling cutter repair unit is also connected to the frame 2. The milling cutter repair unit includes a milling cutter 8, a tool holder 801, and a power unit that drives the tool holder 801 to rotate and feed vertically. The power unit is electrically connected to the controller 3. The power unit includes a spindle box 802 and a feed servo system. The tool holder 801 is installed inside the spindle box 802, and the milling cutter 8 is installed on the tool holder 801. Figure 2 As shown, the controller 3 can control the power unit to drive the milling cutter 8 to mill the pad groove 14 on the pad 12.

[0060] like Figure 1 As shown, in this embodiment, the milling cutter repair unit also includes a dust collection pipe 13. The milling cutter 8 is located inside the dust collection pipe 13, and a through hole is provided at the upper part of the dust collection pipe 13. The milling cutter 8 passes through the through hole and can rotate and move vertically within the through hole. One end of the dust collection pipe 13 is connected to a dust collection unit. The dust collection unit can be a fan. The dust collection unit sucks the debris and foreign objects generated during the milling process from the dust collection pipe 13 into a special collection container.

[0061] In this embodiment, a dust collection hood 131 is connected to the bottom of the dust collection pipe 13. The dust collection hood 131 is funnel-shaped. The funnel-shaped dust collection hood 131 can guide the sucked-in debris or foreign objects, so that the debris or foreign objects can smoothly enter the dust collection pipe 13.

[0062] A method for repairing solder pads with milling cutter repair function, using the aforementioned solder pad repair equipment with milling cutter repair function, includes the following steps:

[0063] S1, Alignment: An alignment camera unit is installed on the frame 2. The alignment camera unit aligns the substrate 11. In this embodiment, a control system is required. The control system includes a 3D scanning camera 5 and a data processor. The controller 3 controls the drive unit to drive the carrier stage 10 to move below the 3D scanning camera 5 of the scanning unit.

[0064] S2, Locate the defective pads 12 on the substrate 11, and use 3D scanning method to collect the depth and shape data of the defective part in the target pad 12;

[0065] S3, Data Analysis: The data processor compares and analyzes the depth data of the defect with the layer structure parameters of the target pad 12 to determine the damaged film layer of the defect; and, based on the distribution of the damaged film layer, the shape data is segmented to obtain the planar shape of each damaged film layer; In this embodiment, the controller 3 is used to control the opening and closing operations of the 3D scanning camera 5, the data processor and the pad repair unit.

[0066] S4 preprocesses the defective solder pad 12. After analyzing the data from S3, controller 3 controls the output of the milling cutter repair unit, such as... Figure 2As shown, the milling cutter 8 is controlled to mill the defective pad 12 and mill out rectangular or square grooves to form pad groove 14; in this embodiment, the milling cutter 8 is controlled to shape the pad 12 and the pad 12 according to the shape of the circuit and the pad 12 to make the pad groove 14 consistent with the shape of the pad 12 and the circuit.

[0067] S5, the defective pads 12 are repaired. The controller 3 controls the pad repair unit to apply material to the corresponding damaged film layers in the pad groove 14 in sequence according to the planar shape, and then cures the coating layer until all damaged film layers are repaired. In this embodiment, during repair, an insulating material is first coated on the pad groove 14 to form an insulating layer, and a certain depth is reserved in the pad groove 14. Then, a conductive material (such as metal conductive paste) is used to fill the pad groove 14 to form a conductive layer.

[0068] When applying or filling material into the pad groove 14, the following steps are included:

[0069] S5.1, Repair the insulating layer of pad 12, apply insulating material to the pad groove 14 to form an insulating layer, then cure the insulating layer, and finally control the milling cutter 8 to correct the repaired insulating layer;

[0070] S5.2, Scan the repaired insulation layer for defects. If there are no defects, proceed to the next step. If there are still defects, repair it again.

[0071] S5.3, Repair the conductive layer of pad 12. Apply conductive material to the insulating layer repaired in step S5.1 to form a conductive layer, then cure the conductive layer, and finally control the milling cutter 8 to correct the repaired conductive layer.

[0072] S5.4, Scan the repaired conductive layer for defects. If there are no defects, proceed to the next step. If there are still defects, repair it again.

[0073] S6, Repair, scans the repaired circuit or pad 12, and the controller 3 analyzes the scan data and combines it with... Figure 3 and Figure 4 As shown, the milling cutter 8 in the milling cutter repair unit modifies the height and circumference of the pad 12, as follows: Figure 5 As shown, the repair of the entire pad 12 is finally completed.

[0074] In this embodiment, the chips and metal foreign objects generated during the milling process of the milling cutter 8 can be sucked in and collected from the dust collection hood 131 by the exhaust fan to prevent contamination of the product and other solder pads 12. Foreign objects and chips splashed in the circumferential tangential direction during the milling action will be collected into the dust collection pipe 13.

[0075] In this embodiment, after the pad 12 is grooved to form the pad groove 14, when coating the material, only one layer needs to be covered inside the pad groove 14. However, it is not necessary to fill the pre-milled pad groove 14 with the insulating layer. Instead, a certain depth is reserved in the pad groove 14. Then, the remaining pad groove 14 is filled with the conductive metal material to form a conductive layer. In this way, the bonding part of the conductive metal material changes from the bottom plane to the bonding relationship of the bottom plane plus the four sides. This effectively increases the adhesion of the repair electrode, thereby increasing the thrust of the repair pad 12 and greatly improving the stability of the film structure of the product pad 12, thereby improving the repair success rate and the reliability of the repair pad 12.

[0076] In this embodiment, the milling cutter 8 system is used to replace the original laser cleaning and removal method, which makes the cleaning and shaping effect better and does not have a heat-affected zone. It can effectively identify the degree and depth of damage to the circuit and the solder pad 12 after scanning by the 3D scanning camera 5.

[0077] like Figure 6 As shown, the structure of pad 12 is a multi-layered and relatively complex structure. The milling cutter 8 can cut out line trenches and pad grooves 14 that are consistent with the shape of pad 12 and line according to the shape of the circuit and pad 12. By setting the pad grooves 14, the corresponding line shape or pad 12 shape can be effectively coated, and the same trench shape can be repaired. It is also beneficial to the uniformity and stability of the coating thickness and size of the subsequent insulating layer and metal layer. It has a high auxiliary function for the standardization and reliability of repair.

[0078] For example, pad 12, regardless of... Figure 6 The details regarding which layer above the middle insulation layer 1c has detached and the size of the detached area are as shown in the attached figure. Figure 6 The shape shown in the box is pre-processed by drilling holes, so the parameters for subsequent insulation layer filling and metal conductive layer filling can be unified and standardized, which is convenient for parameter setting, simple and highly reliable, especially for defects related to pad 12.

[0079] In another embodiment, the repair method for pad 12 in S5 also includes 3D printing or sputtering etching.

[0080] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A pad repair apparatus having a function of repairing a milling cutter, comprising a work table and a frame, characterized by, The workbench is equipped with a support platform that can move along the X-axis and Y-axis of the workbench. A substrate is placed on the support platform, and the substrate has multiple pads. The workbench is provided with a drive unit that drives the support platform to move along the X-axis and Y-axis of the workbench. It also includes a controller and a scanning unit. A pad repair unit is installed on the frame. Both the pad repair unit and the scanning unit are located above the worktable and are electrically connected to the controller. When the support platform moves, it can move the substrate to the bottom of the pad repair unit to repair the pads on the substrate. The frame is also connected to a milling cutter repair unit, which includes a milling cutter, a cutter holder, and a power unit that drives the cutter holder to rotate and feed vertically. The power unit is electrically connected to the controller, which can control the power unit to drive the milling cutter to mill a pad groove on the pad. The shape of the pad groove is consistent with the shape of the pad and the circuit to be repaired. The shape of the pad groove is a rectangular or square trench. The milling cutter repair unit also includes a dust collection tube, the milling cutter is located inside the dust collection tube, and the dust collection tube has a through hole. The milling cutter passes through the through hole and can rotate and move vertically within the through hole. One end of the dust collection tube is connected to a dust suction unit.

2. The pad repair apparatus having a milling tool repair function according to claim 1, characterized by, The bottom of the dust collection pipe is connected to a dust collection hood, which is funnel-shaped.

3. The pad repair device with milling cutter repair function according to claim 1, characterized in that, The frame is also connected to an alignment camera unit, which includes an alignment camera and a data acquisition module. The alignment camera unit is electrically connected to the controller. The substrate has alignment marks. After the alignment camera unit recognizes the alignment marks on the substrate, the controller will control the drive unit to drive the carrier stage to move below the scanning unit.

4. The pad repair device with milling cutter repair function according to claim 1, characterized in that, The pad repair unit includes an insulating layer repair unit and a conductive layer repair unit. Both the insulating layer repair unit and the conductive layer repair unit include a coating head and a curing laser. The coating head and the curing laser are connected to the frame. The frame is provided with a moving unit that drives the coating head and the curing laser to move vertically.

5. A method for repairing solder pads with milling cutter repair function, using the solder pad repair equipment with milling cutter repair function as described in any one of claims 1-4, characterized in that, Includes the following steps: S1, Alignment: An alignment camera unit is installed on the frame. The alignment camera unit aligns the substrate. The controller controls the drive unit to drive the carrier stage to move below the scanning unit. S2, Locate the defective pads on the substrate, and use 3D scanning method to collect the depth and shape data of the defective part in the target pad; S3, Data Analysis: By comparing and analyzing the depth data of the defect with the layer structure parameters of the target pad, the damaged film layer of the defect is determined. S4 preprocesses the defective pads. After analyzing the data in S3, the controller controls the output of the milling cutter repair unit to control the milling cutter to mill the defective pads and mill out the pits to form pad grooves. The controller controls the milling cutter to repair the pad grooves that are consistent with the shape of the pads and circuits according to the shape of the circuit and the pads. S5, repairing defective pads, the controller controls the pad repair unit to apply material to the corresponding damaged film layer in the pad groove according to the planar shape, and cures the coating layer until all damaged film layers are repaired. S6, shaping, scans the repaired circuit or pad. After analyzing the scan data, the controller controls the milling cutter in the milling cutter repair unit to shape the pad in the height direction and the surrounding direction.

6. The pad repair method with milling cutter repair function according to claim 5, characterized in that, The material coating process in S5 within the pad groove includes the following steps: S5.1, Repair the insulating layer of the pad, apply insulating material to the pad groove to form an insulating layer, then cure the insulating layer, and finally control the milling cutter to correct the repaired insulating layer; S5.2, Scan the repaired insulation layer for defects. If there are no defects, proceed to the next step. If there are still defects, repair it again. S5.3, Repair the conductive layer of the pad. Apply conductive material to the insulating layer repaired in step S5.1 to form a conductive layer, then cure the conductive layer, and finally control the milling cutter to correct the repaired conductive layer. S5.4, Scan the repaired conductive layer for defects. If there are no defects, proceed to the next step. If there are still defects, repair it again.

7. A method for repairing solder pads with milling cutter repair function according to claim 5 or 6, characterized in that, In S5, an insulating material is first coated onto the pad groove to form an insulating layer, while leaving a certain depth in the pad groove. Then, a conductive material is used to fill the pad groove to form a conductive layer.

8. A method for repairing solder pads with milling cutter repair function according to claim 5, characterized in that, In S5, pad repair methods also include 3D printing or sputtering etching.

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