Preparation Method of a Mosaic Display Screen, a Mosaic Display Screen and a Mosaic Device

Abstract

The present application discloses a method for preparing a spliced ​​display screen, a spliced ​​display screen and a splicing device, the preparation method comprising: setting a first adhesive layer on the first surface of a spliced ​​substrate, and making the first adhesive layer at a first temperature; wherein the viscosity of the first adhesive layer is positively correlated with the temperature; setting a splicing unit on the side of the first adhesive layer away from the spliced ​​substrate, and judging whether there is an abnormal splicing unit on the current spliced ​​substrate; if so, after at least lowering the temperature of the first adhesive layer at the position of the abnormal splicing unit to a second temperature, the abnormal splicing unit is removed from the spliced ​​substrate; wherein the first temperature is greater than the second temperature. In the above manner, the present application can remove the abnormal splicing unit from the spliced ​​substrate more easily to reduce the production cost.

Description

Technical Field

[0001] This application belongs to the field of display technology, and particularly relates to a method for manufacturing a tiled display screen, a tiled display screen, and a tiling device. Background Art

[0002] The new generation of display technology pursues large-area and diverse display effects, so the tiled display technology has emerged accordingly. The display screen tiling technology requires that the tiling gap between adjacent tiling units is small and invisible to the naked eye. However, due to the influence of tiling processes, equipment accuracy, etc. in the existing tiling technology solutions, abnormal conditions such as chipping of the edges and corners, fragmentation, and position deviation of the tiling units are likely to occur during the tiling process; and currently, it is impossible to remove the abnormal tiling units from the tiling substrate, which may lead to the scrapping of the entire tiled display screen. Summary of the Invention

[0003] This application provides a method for manufacturing a tiled display screen, a tiled display screen, and a tiling device, which can easily remove abnormal tiling units from the tiling substrate to reduce production costs.

[0004] To solve the above technical problems, one technical solution adopted by this application is: to provide a method for manufacturing a tiled display screen, including: providing a first adhesive layer on a first surface of a tiling substrate and maintaining the first adhesive layer at a first temperature; wherein, the viscosity of the first adhesive layer is positively correlated with temperature; providing a tiling unit on a side of the first adhesive layer away from the tiling substrate, and determining whether there are abnormal tiling units on the current tiling substrate; if so, after at least reducing the temperature of the first adhesive layer at the position of the abnormal tiling unit to a second temperature, removing the abnormal tiling unit from the tiling substrate; wherein, the first temperature is greater than the second temperature.

[0005] To solve the above technical problems, another technical solution adopted by this application is: to provide a tiled display screen manufactured by using the manufacturing method described in any one of the above embodiments.

[0006] To solve the above technical problems, another technical solution adopted in this application is: to provide a splicing device for preparing a spliced display screen, the spliced display screen including a splicing substrate, a first adhesive layer on one side of the splicing substrate, and a plurality of splicing units on the side of the first adhesive layer away from the splicing substrate; wherein, the splicing device includes: a stage for carrying the splicing substrate provided with the first adhesive layer; a temperature control device for controlling the temperature of the first adhesive layer to control the viscosity of the first adhesive layer; wherein, the viscosity of the first adhesive layer is positively correlated with the temperature; a transfer device for transferring the splicing units; a detection device for detecting the splicing units provided on the splicing substrate to determine whether there are abnormal splicing units on the splicing substrate; wherein, when the transfer device transfers the splicing units to the splicing substrate, the temperature control device controls the first adhesive layer to be at a first temperature; when the detection device determines that there are abnormal splicing units on the splicing substrate, after the temperature control device controls at least the first adhesive layer at the position of the abnormal splicing units to be at a second temperature lower than the first temperature, the transfer device removes the abnormal splicing units from the splicing substrate.

[0007] Different from the prior art situation, the beneficial effect of this application is: in the method for preparing the spliced display screen provided in this application, a first adhesive layer with a viscosity positively correlated with the temperature is adopted, that is, the higher the temperature of the first adhesive layer, the greater the viscosity; the specific method for preparing the spliced display screen includes: setting a first adhesive layer on the first surface of the splicing substrate and heating the first adhesive layer to a first temperature; setting splicing units on the side of the first adhesive layer at the first temperature away from the splicing substrate and judging whether there are abnormal splicing units on the current splicing substrate; if so, at least reducing the temperature of the first adhesive layer at the position of the abnormal splicing units to a second temperature, at this time the viscosity of the first adhesive layer decreases, and thus it can be relatively easy to remove the abnormal splicing units from the splicing substrate. The above design method can improve the yield of the spliced display screen and can greatly reduce the production cost. Description of the Drawings

[0008] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to these drawings, where:

[0009] Figure 1 It is a schematic flowchart of an implementation manner of the method for preparing the spliced display screen of this application;

[0010] Figure 2a is Figure 1 a schematic structural diagram of an implementation manner corresponding to step S101 in

[0011] Figure 2b is Figure 1 A schematic structural diagram of an embodiment corresponding to step S102 in

[0012] Figure 2c is Figure 1 A schematic structural diagram of an embodiment corresponding to step S103 in

[0013] Figure 2d is Figure 1 Another schematic structural diagram of an embodiment corresponding to step S103 in

[0014] Figure 3 is Figure 1 A schematic flow diagram of an embodiment of the manufacturing method of the spliced display screen after step S103 in

[0015] Figure 4 is Figure 3 A schematic structural diagram of an embodiment corresponding to step S201 in

[0016] Figure 5 is Figure 1 A schematic structural diagram of an embodiment corresponding to before step S102 in

[0017] Figure 6 A schematic structural diagram of an embodiment of the first adhesive layer and the second adhesive layer

[0018] Figure 7 A schematic structural diagram of an embodiment of the spliced display screen of the present application

[0019] Figure 8 A schematic structural diagram of an embodiment of the splicing device of the present application. Specific Embodiments

[0020] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0021] Please refer to Figure 1 , Figure 1 is a schematic flow diagram of an embodiment of the manufacturing method of the spliced display screen of the present application. The manufacturing method includes:

[0022] S101: Set a first adhesive layer 12 on the first surface (not shown in the figure) of the splicing substrate 10, and make the first adhesive layer 12 at a first temperature T1; wherein, the viscosity of the first adhesive layer 12 is positively correlated with the temperature.

[0023] For details, please refer to Figure 2a , Figure 2a for Figure 1 The structural diagram of an embodiment corresponding to step S101 in FIG. The material of the spliced ​​substrate 10 can be glass, stainless steel, etc., and the flatness of the first surface of the spliced ​​substrate 10 is less than 5um; for example, the flatness of the first surface of the spliced ​​substrate 10 can be 2um, 3um, 4um, etc. This design method can make the spliced ​​display screen formed subsequently have better flatness.

[0024] The first adhesive layer 12 may be an acrylic adhesive material, etc. The first temperature T1 may be 30°C-60°C (for example, 40°C, 50°C, etc.); and the thickness of the first adhesive layer 12 may be less than or equal to 0.3mm; for example, the thickness of the first adhesive layer 12 is 0.1mm, 0.2mm, etc. Generally speaking, the material forming the first adhesive layer 12 is a viscoelastic body, and the greater the thickness of the first adhesive layer 12, the greater its deformation. The thickness selection method of the first adhesive layer 12 in the present application can reduce the deformation when the splicing unit is set on the first adhesive layer 12 while ensuring the viscosity of the first adhesive layer 12, so as to ensure the flatness of the spliced ​​display screen formed subsequently.

[0025] In some cases, before the first adhesive layer 12 is arranged on the splicing substrate 10, the two opposite surfaces of the first adhesive layer 12 can be respectively provided with release films; the process of setting the first adhesive layer 12 on the first surface of the splicing substrate 10 in the above step S101 can be: after removing the release film on the surface of one side of the first adhesive layer 12, the first adhesive layer 12 is attached to the first surface of the splicing substrate 10 by an attachment method; and the release film on the other side of the first adhesive layer 12 is removed.

[0026] In addition, generally speaking, the spliced ​​substrate 10 is disposed on a carrier, and the temperature control device can heat the carrier, and transfer the heat to the first adhesive layer 12 through the heat transfer effect of the spliced ​​substrate 10, so that the first adhesive layer 12 is at the first temperature T1.

[0027] S102 : Disposing a splicing unit 14 on the side of the first adhesive layer 12 away from the splicing substrate 10 , and determining whether there is an abnormal splicing unit among the splicing units 14 on the current splicing substrate 10 .

[0028] Specifically, see Figure 2b , Figure 2b for Figure 1 The above-mentioned splicing unit 14 can be an OLED display panel, a Micro-LED display panel, etc.

[0029] In one embodiment, the specific implementation process of the above step S102 may be: after each splicing unit 14 is disposed on the side of the first adhesive layer 12 away from the splicing substrate 10, it is determined whether there is an abnormal splicing unit among the splicing units 14 on the current splicing substrate 10. This design method can effectively reduce production costs.

[0030] Of course, in other embodiments, the implementation manner of the above step S102 may also be other; for example, after a plurality of (for example, 2, 3, etc.) splicing units 14 are continuously disposed on the side of the first adhesive layer 12 away from the splicing substrate 10, it is determined whether there is an abnormal splicing unit among the splicing units 14 on the current splicing substrate 10. This design method can improve production efficiency while reducing production costs. For example, after all the splicing units 14 are disposed on the side of the first adhesive layer 12 away from the splicing substrate 10, it can be determined whether there is an abnormal splicing unit among the splicing units 14 on the current splicing substrate 10. For another example, after a row (for example, a row or a column) of splicing units 14 are disposed on the side of the first adhesive layer 12 away from the splicing substrate 10, it can be determined whether there is an abnormal splicing unit among the splicing units 14 on the current splicing substrate 10.

[0031] In addition, when determining whether there is an abnormal splicing unit among the splicing units 14 on the current splicing substrate 10 in the above step S102, all the splicing units 14 on the splicing substrate 10 need to be determined. The specific determination process may be: using a CCD camera to take a picture from one side of the splicing unit 14 to obtain a to-be-detected image; subsequently, a processor can analyze the to-be-detected image to obtain the gap width between adjacent splicing units 14, the position information of the splicing unit 14, the appearance information of the splicing unit 14, etc.; determining whether the gap width between adjacent splicing units 14 is greater than a threshold value, whether the position of the splicing unit 14 is offset, and whether there are appearance problems such as chipping, corner breakage or fragments on the splicing unit 14; as long as any of the above conditions is met, it can be determined that the splicing unit 14 is an abnormal splicing unit.

[0032] S103: If so, at least reduce the temperature of the first adhesive layer 12 at the position of the abnormal splicing unit to the second temperature T2, and then remove the abnormal splicing unit from the splicing substrate 10; wherein, the first temperature T1 is greater than the second temperature T2.

[0033] Specifically, please refer to Figure 2c , Figure 2c For Figure 1Structural schematic diagram of an embodiment corresponding to step S103. The above-mentioned second temperature T2 can be less than 30°C. For example, the second temperature T2 can be room temperature 25°C, etc. When it is determined that there is an abnormal splicing unit in the current splicing substrate 10, the temperature of the first adhesive layer 12 at the position of the abnormal splicing unit can be controlled by a temperature control device to decrease, so as to reduce the viscosity of the first adhesive layer 12; at this time, the viscosity of the first adhesive layer 12 is very small, even 0. After the viscosity of the first adhesive layer 12 at the position of the abnormal splicing unit decreases, the abnormal splicing unit can be more easily removed from the splicing substrate 10. This design method can improve the yield of the spliced display screen and can greatly reduce the production cost.

[0034] Optionally, in this embodiment, when the splicing unit 14 is disposed on the first adhesive layer 12, or when the abnormal splicing unit is removed from the splicing substrate 10, a transfer device can be used to perform a vertical operation from above the splicing substrate 10 to reduce the influence on adjacent splicing units 14 or the first adhesive layer 12.

[0035] In one embodiment, when the first adhesive layer 12 is a thermally reactive adhesive, the temperature at which the first adhesive layer 12 is located in the above steps S101 - S103 is within a preset temperature range, and the maximum value of this preset temperature range is less than the curing temperature of the first adhesive layer 12. This design method can ensure that the viscosity of the first adhesive layer 12 can change with temperature during the entire process of bonding or removing the splicing unit 14.

[0036] In yet another embodiment, the preparation method provided in the present application further includes: in response to all the splicing units 14 being bonded to the splicing substrate 10 and there being no abnormal splicing units on the current splicing substrate 10, heating the first adhesive layer 12 to the curing temperature T3 and maintaining it for a preset time; wherein, the curing temperature T3 is greater than the first temperature T1. For example, the curing temperature T3 is greater than 60°C, and the preset time is 30s - 600s. The above process of thermal curing can make the viscosity of the first adhesive layer 12 reach the maximum and remain, so as to reduce the probability of the splicing substrate 10 and the splicing unit 14 falling off in the spliced display screen during subsequent normal use.

[0037] In yet another embodiment, when removing the abnormal splicing unit, it is possible that a part of the first adhesive layer 12 below the abnormal splicing unit will be removed together with the abnormal splicing unit. At this time, the surface of the remaining first adhesive layer 12 is uneven. If a supplementary splicing unit is set on the first adhesive layer 12 subsequently, the surface of the supplementary splicing unit may not be on the same horizontal plane as the surfaces of other splicing units; therefore, the step of removing the abnormal splicing unit from the splicing substrate 10 in the above step S102 includes: removing the abnormal splicing unit and the first adhesive layer 12 at the position of the abnormal splicing unit. At this time, reference can be made to Figure 2d , Figure 2d For Figure 1A structural diagram of another implementation method corresponding to step S103 in FIG.

[0038] In another embodiment, see Figure 3 , Figure 3 for Figure 1 Schematic diagram of a process for preparing a spliced ​​display screen after step S103 in FIG. 1. After the above step of removing the abnormal splicing unit, the preparation provided by the present application further includes:

[0039] S201: Disposing a filling glue layer 16 at the position where the abnormal splicing unit is removed.

[0040] Specifically, see Figure 4 , Figure 4 for Figure 3 Schematic diagram of the structure of an embodiment corresponding to step S201 in FIG. Optionally, in this embodiment, the viscosity of the replacement adhesive layer 16 may also be positively correlated with the temperature. For example, the material of the replacement adhesive layer 16 is the same as the material of the first adhesive layer 12, and the thickness of the replacement adhesive layer 16 is the same as the thickness of the first adhesive layer 12. When the abnormal splicing unit is removed as described above, the first adhesive layer 12 at the position of the abnormal splicing unit can be removed together, and at this time, the replacement adhesive layer 16 can directly contact the splicing substrate 10.

[0041] S202: Arrange a replacement splicing unit on the side of the replacement glue layer 16 facing away from the splicing substrate 10; wherein the surface of the replacement splicing unit facing away from the splicing substrate is flush with the surfaces of the remaining splicing units facing away from the splicing substrate.

[0042] Specifically, the structure corresponding to step S202 is Figure 2b Optionally, the structure of the replacement splicing unit can be the same as the structure of other normal splicing units.

[0043] Through the above design, the surface of the supplementary splicing unit facing away from the splicing substrate 10 can be flush with the surface of the remaining splicing units facing away from the splicing substrate 10 to ensure the flatness of the spliced ​​display screen.

[0044] In addition, when removing the first adhesive layer 12, the first adhesive layer 12 can be removed together with the abnormal splicing unit to improve production efficiency. Figure 5 , Figure 5 for Figure 1Schematic structural diagram of an embodiment corresponding to before step S102. After the step of disposing the first adhesive layer 12 on the first surface of the splicing substrate 10 in the above step S101, the method further includes: disposing a second adhesive layer 18 on a side of the first adhesive layer 12 away from the first surface; wherein, the viscosity of the second adhesive layer 18 is independent of temperature, and the second adhesive layer 18 is used for direct contact with the splicing unit 14. The step of removing the abnormal splicing unit includes: removing the abnormal splicing unit, and the first adhesive layer 12 and the second adhesive layer 18 at the position of the abnormal splicing unit together. Since the viscosity of the second adhesive layer 18 remains unchanged after cooling, the second adhesive layer 18 can closely adhere the first adhesive layer 12 and the abnormal splicing unit; and since the viscosity between the first adhesive layer 12 and the splicing substrate 10 decreases or even disappears after cooling, the abnormal splicing unit and the underlying first adhesive layer 12 and second adhesive layer 18 can be removed simultaneously by a transfer device, so as to improve production efficiency.

[0045] Optionally, the total thickness of the first adhesive layer 12 and the second adhesive layer 18 may be less than or equal to 0.3 mm, and this design can ensure the flatness of the subsequent formed splicing display screen.

[0046] Furthermore, in order to reduce the difficulty of removing the first adhesive layer 12 and the second adhesive layer 18, and reduce the influence on the adjacent first adhesive layer 12 and second adhesive layer 18 that do not need to be removed during the removal process, please refer to Figure 6 , Figure 6 Schematic structural diagram of an embodiment of the first adhesive layer and the second adhesive layer. The first adhesive layer 12 includes a plurality of first adhesive blocks 120, and the second adhesive layer 18 includes a plurality of second adhesive blocks 180; one second adhesive block 180 corresponds to one first adhesive block 120, and a first gap (not marked) is provided between adjacent first adhesive blocks 120, and a second gap (not marked) is provided between adjacent second adhesive blocks 180. Optionally, the orthographic projection of one first adhesive block 120 on the second adhesive block 180 may coincide with the second adhesive block 180; the positions of the first gap and the second gap may correspond to the splicing gaps between adjacent splicing units 14, and the present application does not limit the size relationship between the first gap and the splicing gap. In addition, the above first gap and second gap may be formed on the first adhesive layer 12 and the second adhesive layer 18 in advance before step S101.

[0047] On this basis, for the above Figure 4As for the replacement adhesive layer 16 mentioned in the text, the viscosity of the surface of the replacement adhesive layer 16 facing the splicing substrate 10 is positively correlated with the temperature. Optionally, the replacement adhesive layer 16 includes a first replacement sub-adhesive layer and a second replacement sub-adhesive layer stacked, and the material of the first replacement sub-adhesive layer is the same as the material of the first adhesive layer 12, and the material of the second replacement sub-adhesive layer is the same as the material of the second adhesive layer 18. After the replacement splicing unit is subsequently set on the replacement adhesive layer 16, if the replacement splicing unit is still an abnormal splicing unit, the replacement splicing unit can be removed by lowering the temperature of the replacement adhesive layer 16.

[0048] Also, please refer again to Figure 6 , a plurality of first hollow areas 122 are provided on the first adhesive layer 12, and the orthographic projection of the splicing unit on the first surface of the splicing substrate covers at least one first hollow area 122. Optionally, the orthographic projection of the first hollow area 122 on the first surface of the splicing substrate may be circular, elliptical, square, rectangular, etc. When the first adhesive layer 12 includes a plurality of first adhesive blocks 120, each first adhesive block 120 may be provided with at least one first hollow area. This design method can ensure that after the splicing unit is attached, some air is still retained between the bonding surface of the splicing unit and the splicing substrate, so as to reduce the difficulty of removing the splicing unit from the surface of the splicing substrate. When the second adhesive layer 18 is provided on the first adhesive layer 12, a second hollow area 182 is provided on the second adhesive layer 18 at a position corresponding to the first hollow area 122, and the orthographic projection of the second hollow area 182 on the first adhesive layer 12 coincides with the first hollow area 122 at the corresponding position. This design method can reduce the difficulty of providing a patterned first adhesive layer and a second adhesive layer, and reduce the difficulty of process preparation.

[0049] The preparation method of the spliced ​​display screen is further described below using a specific application scenario. In one application scenario, the preparation method of the spliced ​​display screen includes:

[0050] A. Arranging a first adhesive layer on the first surface of the spliced ​​substrate and making the first adhesive layer at a first temperature; wherein the viscosity of the first adhesive layer is positively correlated with the temperature; optionally, the first adhesive layer includes a plurality of first adhesive blocks arranged at intervals, and a first gap is provided between adjacent first adhesive blocks; further, each first adhesive block may be provided with at least one first hollow area.

[0051] B. A splicing unit is arranged on the side of the first adhesive layer away from the splicing substrate. Each time a splicing unit is arranged on the splicing substrate, the splicing conditions of the existing splicing units on the splicing substrate are detected; wherein one splicing unit corresponds to one first adhesive block.

[0052] C. In response to the presence of an abnormal splicing unit on the current splicing substrate, at least cool the first adhesive layer below the abnormal splicing unit to a second temperature; remove the abnormal splicing unit and the first adhesive layer below it, forming a blank area on the splicing substrate; set a compensatory adhesive layer on the blank area of the splicing substrate, raise the temperature of the first adhesive layer and the compensatory adhesive layer to the first temperature, and reset a splicing unit on the compensatory adhesive layer.

[0053] D. In response to the absence of an abnormal splicing unit on the current splicing substrate, set the next splicing unit on the first adhesive layer, and repeat the processes of steps B and C above until all the splicing units on the splicing substrate are set and there are no abnormalities.

[0054] E. Raise the temperature of the first adhesive layer to the curing temperature and maintain it for a preset time to cure the first adhesive layer.

[0055] In another application scenario, the method for preparing the above-mentioned spliced display screen includes:

[0056] A. Set a first adhesive layer on the first surface of the splicing substrate and keep the first adhesive layer at a first temperature; wherein, the viscosity of the first adhesive layer is positively correlated with the temperature.

[0057] B. After setting all the splicing units onto the splicing substrate one by one, detect the splicing conditions of the existing splicing units on the splicing substrate.

[0058] C. In response to the presence of an abnormal splicing unit on the current splicing substrate, at least cool the first adhesive layer below the abnormal splicing unit to a second temperature; remove the abnormal splicing unit and the first adhesive layer below it, forming a blank area on the splicing substrate; set a compensatory adhesive layer on the blank area of the splicing substrate, raise the temperature of the first adhesive layer and the compensatory adhesive layer to the first temperature, and reset a splicing unit on the compensatory adhesive layer.

[0059] D. In response to the absence of an abnormal splicing unit on the current splicing substrate, raise the temperature of the first adhesive layer to the curing temperature and maintain it for a preset time to cure the first adhesive layer.

[0060] Please refer to Figure 7 , Figure 7 which is a schematic structural diagram of an embodiment of the spliced display screen of the present application. The spliced display screen is formed by using the preparation method in any of the above embodiments. The spliced display screen includes a splicing substrate 10, a first adhesive layer 12 on one side of the splicing substrate 10, and a plurality of splicing units 14 on the side of the first adhesive layer 12 facing away from the splicing substrate 10. For the specific structural settings of the first adhesive layer 12, reference can be made to the above embodiments and will not be elaborated here.

[0061] Please refer to Figure 8 , Figure 8FIG. 0 is a schematic structural diagram of an embodiment of the splicing device of the present application. The splicing device is used to prepare the above-mentioned spliced display screen. The splicing device includes a stage 20, a temperature control device (not shown in the figure), a transfer device 22, and a detection device 24. Among them, the stage 20 is used to carry the spliced substrate provided with the first adhesive layer, and the flatness of the bearing surface of the stage 20 can be less than 5um. The temperature control device is used to control the temperature of the first adhesive layer to control the viscosity of the first adhesive layer. Among them, the viscosity of the first adhesive layer is positively correlated with the temperature. Optionally, the temperature control device can control the temperature of the stage 20, and then control the temperature of the first adhesive layer through the stage 20. The transfer device 22 is used to transfer the splicing unit. Optionally, the transfer device 22 includes a transfer head, and the transfer head can adsorb the splicing unit through vacuum adsorption and other effects, and then drive the splicing unit to move. The detection device 24 is used to detect the splicing units arranged on the spliced substrate to determine whether there are abnormal splicing units on the spliced substrate.

[0062] When the transfer device 22 transfers the splicing unit to the spliced substrate, the temperature control device controls the first adhesive layer to be at the first temperature. When the detection device 24 determines that there is an abnormal splicing unit on the spliced substrate, after the temperature control device controls at least the first adhesive layer at the abnormal splicing unit position to be at the second temperature lower than the first temperature, the transfer device 22 removes the abnormal splicing unit from the spliced substrate. Further, when the transfer device 22 fits all the splicing units onto the spliced substrate and the detection device 24 determines that there is no abnormal splicing unit on the spliced substrate, the temperature control device controls the first adhesive layer to be at the curing temperature to cure the first adhesive layer. Among them, the curing temperature is greater than the first temperature.

[0063] In one embodiment, the above-mentioned temperature control device may include a heating component, and the heating component may include a heating element and a power supply electrically connected to the heating element. The above-mentioned heating element may be a resistance wire or the like, and it may be integrated inside the stage 20. Of course, in the embodiment, the temperature control device may further include a cooling component, and the cooling component includes a blower and a power supply electrically connected to the blower, etc. The blower can cool the first adhesive layer from the side of the splicing unit facing away from the spliced substrate. When it is necessary to increase the temperature of the first adhesive layer, the cooling component stops working and the heating component starts to work. When it is necessary to lower the temperature of the first adhesive layer, the cooling component starts to work and the heating component stops working.

[0064] In another embodiment, the above-mentioned detection device 24 includes a CCD camera 240 and a processor 242 coupled to the CCD camera 240. The CCD camera 240 can obtain a detection image by photographing from the side of the spliced substrate where the splicing unit is provided, and transmit it to the processor 242. After receiving the detection image, the processor 242 analyzes the detection image to locate the position of the abnormal splicing unit.

[0065] In another embodiment, after the transfer device 22 removes the abnormal splicing unit from the splicing substrate, the first adhesive layer at the position of the abnormal splicing unit is removed together, and a blank area is formed on the splicing substrate; the splicing device provided in this application further includes a pasting device (not shown in the figure), which is used to paste a compensating adhesive layer in the blank area; at this time, the transfer device 22 is further used to transfer the compensating splicing unit onto the compensating adhesive layer.

[0066] In yet another embodiment, the splicing device provided in this application further includes a patterning device (not shown in the figure), which is used to perform patterning on the first adhesive layer before the first adhesive layer is disposed on the splicing substrate, so as to form a plurality of first hollowed-out areas on the first adhesive layer; and / or, the first adhesive layer is provided as a plurality of first adhesive blocks.

[0067] The above are only the embodiments of this application, and do not limit the patent scope of this application accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of this application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of this application.

Claims

1. A method for preparing a spliced display screen, characterized in that, it includes: setting a first adhesive layer on the first surface of the splicing substrate and keeping the first adhesive layer at a first temperature; wherein, the viscosity of the first adhesive layer is positively correlated with the temperature; setting a splicing unit on the side of the first adhesive layer away from the splicing substrate and determining whether there is an abnormal splicing unit among the splicing units on the current splicing substrate; if so, at least reducing the temperature of the first adhesive layer at the position of the abnormal splicing unit to a second temperature, and then removing the abnormal splicing unit from the splicing substrate; wherein, the first temperature is greater than the second temperature.

2. The preparation method according to claim 1, characterized in that, it further includes: in response to all the splicing units being attached to the splicing substrate and there being no abnormal splicing unit on the current splicing substrate, heating the first adhesive layer to a curing temperature and maintaining it for a preset time; wherein, the curing temperature is greater than the first temperature.

3. The preparation method according to claim 1, characterized in that, the step of setting a splicing unit on the side of the first adhesive layer away from the splicing substrate and determining whether there is an abnormal splicing unit among the splicing units on the current splicing substrate includes: after setting each splicing unit on the side of the first adhesive layer away from the splicing substrate, determining whether there is an abnormal splicing unit among the splicing units on the current splicing substrate; alternatively, after continuously setting a plurality of splicing units on the side of the first adhesive layer away from the splicing substrate, determining whether there is an abnormal splicing unit among the splicing units on the current splicing substrate.

4. The preparation method according to claim 3, characterized in that, after setting all the splicing units on the side of the first adhesive layer away from the splicing substrate, determining whether there is an abnormal splicing unit among the splicing units on the current splicing substrate.

5. The preparation method according to claim 1, characterized in that, the step of removing the abnormal splicing unit from the splicing substrate includes: removing the abnormal splicing unit and the first adhesive layer at the position of the abnormal splicing unit.

6. The preparation method according to claim 1, characterized in that, after the step of setting the first adhesive layer on the first surface of the splicing substrate, it further includes: setting a second adhesive layer on the side of the first adhesive layer away from the first surface; wherein, the viscosity of the second adhesive layer is independent of temperature, and the second adhesive layer is used to directly contact the splicing unit; the step of removing the abnormal splicing unit from the splicing substrate includes: removing the abnormal splicing unit, and the first adhesive layer and the second adhesive layer at the position of the abnormal splicing unit together.

7. The preparation method according to claim 6, characterized in that, the first adhesive layer includes a plurality of first adhesive blocks, and the second adhesive layer includes a plurality of second adhesive blocks; one second adhesive block corresponds to one first adhesive block, and there is a first gap between adjacent first adhesive blocks, and there is a second gap between adjacent second adhesive blocks.

8. The preparation method according to claim 1, characterized in that, After the step of removing the abnormal splicing unit from the splicing substrate, the method further includes: providing a compensating adhesive layer at the position where the abnormal splicing unit is removed; providing a compensating splicing unit on a side of the compensating adhesive layer away from the splicing substrate; wherein, a surface of the compensating splicing unit on a side away from the splicing substrate is flush with surfaces of the remaining splicing units on a side away from the splicing substrate.

9. The preparation method according to claim 8, wherein, adhesiveness of a surface of the compensating adhesive layer facing the splicing substrate is positively correlated with the temperature.

10. The preparation method according to claim 1, wherein, a plurality of hollowed-out areas are provided on the first adhesive layer, and a front projection of the splicing unit on the first surface covers at least one of the hollowed-out areas; and / or, the thickness of the first adhesive layer is less than or equal to 0.3 mm.

11. A spliced display screen, wherein, the spliced display screen is prepared by using the preparation method according to any one of claims 1-9.

12. A splicing device, wherein, for preparing a spliced display screen, the spliced display screen includes a splicing substrate, a first adhesive layer on a side of the splicing substrate, and a plurality of splicing units on a side of the first adhesive layer away from the splicing substrate; wherein, the splicing device includes: a stage for carrying the splicing substrate provided with the first adhesive layer; a temperature control device for controlling the temperature of the first adhesive layer to control the adhesiveness of the first adhesive layer; wherein, the adhesiveness of the first adhesive layer is positively correlated with the temperature; a transfer device for transferring the splicing unit; a detection device for detecting the splicing units provided on the splicing substrate to determine whether there are abnormal splicing units on the splicing substrate; wherein, when the transfer device transfers the splicing unit to the splicing substrate, the temperature control device controls the first adhesive layer to be at a first temperature; when the detection device determines that there are abnormal splicing units on the splicing substrate, after the temperature control device controls the first adhesive layer at the position of the abnormal splicing unit to be at a second temperature lower than the first temperature, the transfer device removes the abnormal splicing unit from the splicing substrate.

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